SN74HC148DWRG4 [TI]

HC/UH SERIES, 8-BIT ENCODER, INVERTED OUTPUT, PDSO16, GREEN, PLASTIC, SOIC-16;
SN74HC148DWRG4
型号: SN74HC148DWRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

HC/UH SERIES, 8-BIT ENCODER, INVERTED OUTPUT, PDSO16, GREEN, PLASTIC, SOIC-16

编码器 光电二极管 输出元件 逻辑集成电路
文件: 总21页 (文件大小:1121K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢃꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢃꢇ  
ꢇ ꢊꢋ ꢌꢁꢍ ꢎ ꢏ ꢐ ꢊꢋ ꢌꢁꢍ ꢑꢒ ꢌꢏ ꢒꢌꢎ ꢓ ꢍꢁꢅ ꢏ ꢔꢍ ꢒ ꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
SN54HC148 . . . J OR W PACKAGE  
SN74HC148 . . . D, DW, N, OR NS PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V  
Outputs Can Drive Up To 10 LSTTL Loads  
Low Power Consumption, 80-µA Max I  
CC  
4
5
V
CC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
Typical t = 16 ns  
pd  
4-mA Output Drive at 5 V  
EO  
GS  
3
6
Low Input Current of 1 µA Max  
Encode Eight Data Lines to 3-Line Binary  
(Octal)  
7
EI  
2
A2  
A1  
GND  
1
D
Applications Include:  
− n-Bit Encoding  
− Code Converters and Generators  
0
A0  
SN54HC148 . . . FK PACKAGE  
(TOP VIEW)  
description/ordering information  
The ’HC148 devices feature priority decoding of  
the inputs to ensure that only the highest-order  
data line is encoded. These devices encode eight  
data lines to 3-line (4-2-1) binary (octal).  
Cascading circuitry (enable input EI and enable  
output EO) has been provided to allow octal  
expansion without the need for external circuitry.  
Data inputs and outputs are active at the low logic  
level.  
3
2
1
20 19  
18  
GS  
3
6
7
4
5
6
7
8
17  
16  
15  
14  
NC  
2
NC  
EI  
1
A2  
9 10 11 12 13  
NC − No internal connection  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP − N  
SOIC − D  
Tube of 25  
Tube of 40  
Reel of 2500  
Reel of 250  
Reel of 2000  
Reel of 2000  
Tube of 25  
Tube of 150  
Tube of 55  
SN74HC148N  
SN74HC148N  
SN74HC148D  
SN74HC148DR  
SN74HC148DT  
SN74HC148DWR  
SN74HC148NSR  
SNJ54HC148J  
SNJ54HC148W  
SNJ54HC148FK  
HC148  
−40°C to 85°C  
SOIC − DW  
SOP − NS  
CDIP − J  
HC148  
HC148  
SNJ54HC148J  
SNJ54HC148W  
SNJ54HC148FK  
−55°C to 125°C  
CFP − W  
LCCC − FK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2004, Texas Instruments Incorporated  
ꢏ ꢘ ꢣ ꢛ ꢚꢦ ꢡꢠ ꢞꢟ ꢠꢚ ꢜꢣ ꢥꢗ ꢝꢘ ꢞ ꢞꢚ ꢭꢌ ꢋꢊ ꢑꢒ ꢮ ꢊꢐꢇꢂ ꢐꢂꢈ ꢝꢥꢥ ꢣꢝ ꢛ ꢝ ꢜꢢ ꢞꢢꢛ ꢟ ꢝ ꢛ ꢢ ꢞꢢ ꢟꢞꢢ ꢦ  
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ  
ꢡ ꢘꢥ ꢢꢟꢟ ꢚ ꢞꢨꢢ ꢛ ꢪꢗ ꢟꢢ ꢘ ꢚꢞꢢ ꢦꢧ ꢏ ꢘ ꢝꢥ ꢥ ꢚ ꢞꢨꢢ ꢛ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢟ ꢈ ꢣꢛ ꢚ ꢦꢡꢠ ꢞꢗꢚ ꢘ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢃ ꢇ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
EI  
H
L
0
X
H
X
X
X
X
X
1
X
H
X
X
X
X
X
2
X
H
X
X
X
X
X
3
X
H
X
X
X
X
L
4
5
X
H
X
X
L
6
X
H
X
L
7
X
H
L
A2  
H
H
L
A1  
H
H
L
A0  
H
H
L
GS  
H
H
L
EO  
H
L
X
H
X
X
X
L
L
H
H
H
H
H
L
H
H
H
H
L
L
H
L
L
L
H
H
H
L
H
H
L
L
L
H
H
L
H
L
L
L
H
H
L
L
L
L
X
X
L
X
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
L
L
L
L
H
H
H
H
H
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢃꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢃꢇ  
ꢇ ꢊꢋ ꢌꢁꢍ ꢎ ꢏ ꢐ ꢊꢋ ꢌꢁꢍ ꢑꢒ ꢌꢏ ꢒꢌꢎ ꢓ ꢍꢁꢅ ꢏ ꢔꢍ ꢒ ꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
logic diagram (positive logic)  
10  
0
15  
EO  
14  
GS  
11  
1
12  
2
9
A0  
13  
3
1
4
7
A1  
2
5
3
6
4
7
6
A2  
5
EI  
Pin numbers shown are for the D, DW, J, N, NS, and W packages.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢃ ꢇ  
ꢇꢊ ꢋ ꢌ ꢁꢍ ꢎꢏ ꢐ ꢊꢋ ꢌ ꢁꢍ ꢑ ꢒꢌ ꢏ ꢒꢌ ꢎꢓ ꢍ ꢁꢅꢏ ꢔꢍ ꢒꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
IK  
I
CC  
Output clamp current, I  
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Continuous current through V  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
SN54HC148  
MIN NOM  
SN74HC148  
MIN NOM  
UNIT  
MAX  
MAX  
V
V
Supply voltage  
2
1.5  
5
6
2
1.5  
5
6
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
= 4.5 V  
= 6 V  
3.15  
4.2  
3.15  
4.2  
High-level input voltage  
V
V
IH  
= 2 V  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
= 4.5 V  
= 6 V  
V
IL  
Low-level input voltage  
V
V
Input voltage  
0
0
V
V
0
0
V
V
V
V
I
CC  
CC  
Output voltage  
O
CC  
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
1000  
500  
400  
125  
1000  
500  
400  
85  
= 4.5 V  
= 6 V  
t/v  
Input transition rise/fall time  
ns  
T
A
Operating free-air temperature  
−55  
−40  
°C  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢃꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢃꢇ  
ꢇ ꢊꢋ ꢌꢁꢍ ꢎ ꢏ ꢐ ꢊꢋ ꢌꢁꢍ ꢑꢒ ꢌꢏ ꢒꢌꢎ ꢓ ꢍꢁꢅ ꢏ ꢔꢍ ꢒ ꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54HC148  
SN74HC148  
A
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
TYP  
MAX  
MIN  
1.9  
4.4  
5.9  
3.7  
5.2  
MAX  
MIN  
1.9  
MAX  
2 V  
4.5 V  
6 V  
1.9 1.998  
4.4 4.499  
5.9 5.999  
4.4  
I
= −20 µA  
OH  
5.9  
V
V
V = V or V  
IH  
V
OH  
OL  
I
IL  
I
I
= −4 mA  
4.5 V  
6 V  
3.98  
5.48  
4.3  
5.8  
3.84  
5.34  
OH  
= −5.2 mA  
OH  
2 V  
0.002  
0.001  
0.001  
0.17  
0.15  
0.1  
0.1  
0.1  
0.1  
0.26  
0.26  
100  
8
0.1  
0.1  
0.1  
0.1  
4.5 V  
6 V  
I
= 20 µA  
OL  
0.1  
0.1  
V = V or V  
V
I
IH  
IL  
I
I
= 4 mA  
4.5 V  
6 V  
0.4  
0.33  
0.33  
1000  
80  
OL  
= 5.2 mA  
0.4  
OL  
I
I
V = V  
I
or 0  
6 V  
1000  
160  
10  
nA  
µA  
pF  
I
CC  
V = V  
I
or 0,  
I
O
= 0  
6 V  
CC  
CC  
C
2 V to 6 V  
3
10  
10  
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
T
A
= 25°C  
TYP  
69  
23  
21  
60  
20  
17  
75  
25  
21  
78  
26  
22  
57  
19  
16  
66  
22  
19  
28  
8
SN54HC148  
SN74HC148  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
V
UNIT  
CC  
MIN  
MAX  
180  
36  
MIN  
MAX  
270  
54  
MIN  
MAX  
225  
45  
2 V  
4.5 V  
6 V  
1−7  
0−7  
A0, A1, or A2  
31  
46  
38  
2 V  
150  
30  
225  
45  
190  
38  
4.5 V  
6 V  
EO  
GS  
26  
38  
33  
2 V  
190  
38  
285  
57  
240  
48  
4.5 V  
6 V  
32  
48  
41  
t
pd  
ns  
2 V  
195  
39  
295  
59  
245  
49  
4.5 V  
6 V  
A0, A1, or A2  
GS  
33  
50  
42  
2 V  
145  
29  
220  
44  
180  
36  
4.5 V  
6 V  
EI  
25  
38  
31  
2 V  
165  
33  
250  
50  
205  
41  
4.5 V  
6 V  
EO  
28  
43  
35  
2 V  
75  
110  
22  
95  
t
t
Any  
4.5 V  
6 V  
15  
19  
ns  
6
13  
19  
16  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢇꢈ ꢀꢁ ꢉ ꢃ ꢄꢅꢆ ꢃ ꢇ  
ꢇꢊ ꢋ ꢌ ꢁꢍ ꢎꢏ ꢐ ꢊꢋ ꢌ ꢁꢍ ꢑ ꢒꢌ ꢏ ꢒꢌ ꢎꢓ ꢍ ꢁꢅꢏ ꢔꢍ ꢒꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
TYP  
UNIT  
C
Power dissipation capacitance  
No load  
35  
pF  
pd  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
From Output  
Under Test  
Test  
Point  
Input  
50%  
50%  
0 V  
C
= 50 pF  
L
t
t
PLH  
PHL  
90%  
(see Note A)  
V
V
OH  
In-Phase  
Output  
90%  
t
50%  
10%  
50%  
10%  
LOAD CIRCUIT  
OL  
t
r
f
f
t
t
PLH  
PHL  
90%  
V
CC  
V
V
90%  
t
90%  
OH  
Input  
50%  
10%  
50%  
10%  
90%  
t
Out-of-Phase  
Output  
50%  
10%  
50%  
10%  
0 V  
OL  
t
r
f
t
r
VOLTAGE WAVEFORM  
INPUT RISE AND FALL TIMES  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES  
NOTES: A.  
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following  
characteristics: PRR 1 MHz, Z = 50 , t = 6 ns, t = 6 ns.  
C includes probe and test-fixture capacitance.  
L
O
r
f
C. The outputs are measured one at a time, with one input transition per measurement.  
D. and t are the same as t  
t
.
PLH  
PHL pd  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢃꢇ ꢈ ꢀꢁꢉ ꢃꢄ ꢅꢆ ꢃꢇ  
ꢇ ꢊꢋ ꢌꢁꢍ ꢎ ꢏ ꢐ ꢊꢋ ꢌꢁꢍ ꢑꢒ ꢌꢏ ꢒꢌꢎ ꢓ ꢍꢁꢅ ꢏ ꢔꢍ ꢒ ꢀ  
SCLS109G − MARCH 1984 − REVISED APRIL 2004  
APPLICATION INFORMATION  
16-Line Data (active low)  
0
0
1
1
2
2
3
3
4
4
5
5
6
6
7
8
0
9 10 11 12 13 14 15  
Enable  
(active low)  
7 EI  
1
2
3
4
5
6
7 EI  
GS  
’HC148  
A1  
’HC148  
A1  
EO A0  
A2 GS  
EO  
A0  
A2  
’HC08  
Priority Flag  
(active low)  
0
1
2
3
Encoded Data (active low)  
16-Line Data (active low)  
0
0
1
1
2
2
3
4
5
6
6
7
8
0
9 10 11 12 13 14 15  
Enable  
(active low)  
3
4
5
7 EI  
1
2
3
4
5
6
7 EI  
GS  
’HC148  
A1  
’HC148  
A1  
EO A0  
A2 GS  
EO  
A0  
A2  
’HC00  
Priority Flag  
(active high)  
0
1
2
3
Encoded Data (active high)  
Figure 2. Priority Encoder for 16 Bits  
Because the ’HC148 devices are combinational logic circuits, wrong addresses can appear during input transients.  
Moreover, a change from high to low at EI can cause a transient low on GS when all inputs are high. This must be  
considered when strobing the outputs.  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
SN54HC148J  
SN74HC148D  
ACTIVE  
CDIP  
SOIC  
J
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
-55 to 125  
-40 to 85  
SN54HC148J  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
D
D
D
D
40  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
HC148  
HC148  
HC148  
HC148  
HC148  
HC148  
HC148  
SN74HC148DE4  
SN74HC148DG4  
SN74HC148DR  
SN74HC148DRE4  
SN74HC148DRG4  
SN74HC148DT  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
16  
16  
16  
16  
16  
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
40  
Green (RoHS  
& no Sb/Br)  
2500  
2500  
2500  
250  
Green (RoHS CU NIPDAU | CU SN  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SN74HC148DW  
SN74HC148N  
OBSOLETE  
ACTIVE  
SOIC  
PDIP  
DW  
N
16  
16  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
SN74HC148N  
SN74HC148N  
HC148  
SN74HC148NE4  
SN74HC148NSR  
SNJ54HC148FK  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
16  
16  
20  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
N / A for Pkg Type  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-55 to 125  
NS  
FK  
2000  
1
Green (RoHS  
& no Sb/Br)  
LCCC  
TBD  
SNJ54HC  
148FK  
SNJ54HC148J  
SNJ54HC148W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
16  
16  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
SNJ54HC148J  
W
SNJ54HC148W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54HC148, SN74HC148 :  
Catalog: SN74HC148  
Military: SN54HC148  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Jan-2014  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74HC148DR  
SN74HC148DR  
SN74HC148DRG4  
SOIC  
SOIC  
SOIC  
D
D
D
16  
16  
16  
2500  
2500  
2500  
330.0  
330.0  
330.0  
16.4  
16.8  
16.4  
6.5  
6.5  
6.5  
10.3  
10.3  
10.3  
2.1  
2.1  
2.1  
8.0  
8.0  
8.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
17-Jan-2014  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74HC148DR  
SN74HC148DR  
SN74HC148DRG4  
SOIC  
SOIC  
SOIC  
D
D
D
16  
16  
16  
2500  
2500  
2500  
333.2  
364.0  
333.2  
345.9  
364.0  
345.9  
28.6  
27.0  
28.6  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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