SN74F373DBLE [TI]
OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS; 八路透明D类锁存器具有三态输出型号: | SN74F373DBLE |
厂家: | TEXAS INSTRUMENTS |
描述: | OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS |
文件: | 总16页 (文件大小:529K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
SN54F373 . . . J PACKAGE
SN74F373 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
• Eight Latches in a Single Package
• 3-State Bus-Driving True Outputs
• Full Parallel Access for Loading
• Buffered Control Inputs
• Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
8Q
8D
7D
7Q
6Q
6D
13 5D
12 5Q
description
These 8-bit latches feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
11
GND
LE
SN54F373 . . . FK PACKAGE
(TOP VIEW)
The eight latches of the ′F373 are transparent
D-type latches. While the latch-enable (LE) input
ishigh, theQoutputswillfollowthedata(D)inputs.
When the latch enable is taken low, the Q outputs
are latched at the logic levels set up at the D
inputs.
3
2
1
20 19
18
2D
2Q
3Q
3D
4D
4
5
6
7
8
8D
7D
7Q
6Q
6D
17
16
15
14
9 10 11 12 13
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal
logic state (high or low logic levels) or a
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without need for interface or pullup
components.
The output-enable (OE) input does not affect the internal operations of the latches. Old data can be retained
or new data can be entered while the outputs are in the high-impedance state.
The SN74F373 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F373 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74F373 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
OE
L
LE
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
Copyright 1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
†
logic symbol
logic diagram (positive logic)
1
1
OE
LE
EN
C1
OE
11
11
LE
3
2
5
1D
2D
3D
4D
5D
6D
7D
8D
1D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
4
C1
2
1Q
7
6
3
1D
1D
8
9
13
14
17
18
12
15
16
19
To Seven Other Channels
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –1.2 V to 7 V
I
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
CC
Current into any output in the low state: SN54F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
SN74F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA
Operating free-air temperature range: SN54F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
SN74F373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
recommended operating conditions
SN54F373
SN74F373
UNIT
MIN NOM
MAX
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input clamp current
0.8
–18
– 3
0.8
–18
– 3
24
V
I
I
I
mA
mA
mA
°C
IK
High-level output current
Low-level output current
Operating free-air temperature
OH
OL
20
T
A
–55
125
0
70
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54F373, SN74F373
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SDFS076A – D2932, MARCH 1987 – REVISED OCTOBER 1993
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54F373
SN74F373
PARAMETER
TEST CONDITIONS
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
V
V
V
= 4.5 V,
= 4.5 V
= 4.75 V,
= 4.5 V
I = –18 mA
–1.2
–1.2
V
IK
CC
CC
CC
CC
I
I
I
I
I
I
= – 1 mA
= – 3 mA
= – 1 mA to –3 mA
= 20 mA
2.5
2.4
3.4
3.3
2.5
2.4
2.7
3.4
3.3
OH
OH
OH
OL
OL
V
OH
V
0.3
0.5
V
OL
V
= 24 mA
0.35
0.5
50
I
I
I
I
I
I
I
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
V
= 2.7 V
50
–50
0.1
µA
µA
OZH
OZL
I
O
O
V
= 0.5 V
–50
0.1
V = 7 V
I
mA
µA
V = 2.7 V
I
20
20
IH
V = 0.5 V
I
– 0.6
–150
55
– 0.6
–150
55
mA
mA
mA
IL
‡
V
O
= 0
–60
–60
OS
See Note 2
38
38
CCZ
†
‡
All typical values are at V
= 5 V, T = 25°C.
A
CC
Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
is measured with OE at 4.5 V and all other inputs grounded.
NOTE 2:
I
CCZ
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
V
T
= 5 V,
= 25°C
CC
A
SN54F373
SN74F373
UNIT
′F373
MIN
6
MAX
MIN
6
MAX
MIN
6
MAX
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data after LE↓
ns
ns
ns
2
2
2
3
3
3
switching characteristics (see Note 3)
V
C
R
= 5 V,
V
C
R
= 4.5 V to 5.5 V,
= 50 pF,
CC
L
L
CC
L
L
= 50 pF,
= 500 Ω,
= 25°C
= 500Ω,
= MIN to MAX
FROM
(INPUT)
TO
(OUTPUT)
§
PARAMETER
UNIT
T
A
T
A
′F373
TYP
4.9
SN54F373
SN74F373
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
7
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
MIN
2.2
1.2
4.2
2.2
1.2
1.2
1.2
1.2
MAX
t
t
t
t
8.5
7
8
6
PLH
PHL
PLH
PHL
PZH
D
ns
ns
ns
ns
Q
Q
Q
Q
3.3
5
8.6
11.5
7
15
8.5
13.5
10
10
7
13
8
LE
4.8
t
4.6
11
7.5
6.5
6
12
8.5
7.5
6
OE
OE
t
5.2
PZL
PHZ
t
4.1
t
3.4
PLZ
§
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 3: Load circuits and waveforms are shown in Section 1.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-9758901Q2A
5962-9758901QRA
5962-9758901QSA
JM38510/34601B2A
JM38510/34601BRA
JM38510/34601BSA
SN54F373J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
FK
J
20
20
20
20
20
20
20
20
20
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
W
J
CDIP
SSOP
SSOP
A42 SNPB
Call TI
SN74F373DBLE
SN74F373DBR
DB
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F373DBRE4
SN74F373DBRG4
SN74F373DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
DW
DW
DW
DW
N
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74F373DWG4
SN74F373DWR
SN74F373DWRG4
SN74F373N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F373N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
SN74F373NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74F373NSR
SN74F373NSRE4
SN74F373NSRG4
ACTIVE
ACTIVE
ACTIVE
SO
SO
SO
NS
NS
NS
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54F373FK
SNJ54F373J
SNJ54F373W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
20
20
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
SN74F373DBR
SN74F373DWR
SN74F373NSR
DB
DW
NS
20
20
20
MLA
MLA
MLA
8.2
10.8
8.2
7.5
2.5
2.7
2.5
12
12
12
16
24
24
Q1
Q1
Q1
330
24
13.0
13.0
330
24
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74F373DBR
SN74F373DWR
SN74F373NSR
DB
DW
NS
20
20
20
MLA
MLA
MLA
346.0
333.2
333.2
346.0
333.2
333.2
33.0
31.75
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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