SN74CBT3383DBQR [TI]
10-BIT FET BUS-EXCHANGE SWITCHES; 10位FET总线交换开关系列
| 型号： | SN74CBT3383DBQR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-BIT FET BUS-EXCHANGE SWITCHES |
| 文件： | 总14页 (文件大小：348K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢇ ꢈ ꢇ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢇꢈ ꢇ
ꢋ ꢌ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅꢑꢀ ꢍꢐꢒꢄ ꢓꢔꢁꢕ ꢐ ꢀ ꢖꢎ ꢆꢄ ꢓꢐ ꢀ
SCDS003O − NOVEMBER 1992 − REVISED JULY 2004
SN54CBT3383 . . . JT OR W PACKAGE
SN74CBT3383 . . . DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
D
D
5-Ω Switch Connection Between Two Ports
TTL-Compatible Input Levels
1
24
23
22
21
20
19
18
17
16
15
14
13
BE
1B1
1A1
1A2
1B2
2B1
2A1
2A2
2B2
3B1
3A1
GND
V
CC
description/ordering information
2
5B2
5A2
5A1
5B1
4B2
4A2
4A1
4B1
3B2
3A2
BX
3
The ’CBT3383 devices provide ten bits of
high-speed TTL-compatible bus switching or
exchanging. The low on-state resistance of the
switch allows connections to be made with
minimal propagation delay.
4
5
6
7
8
The devices operate as a 10-bit bus switch or a
5-bit bus exchanger, which provides swapping of
the A and B pairs of signals. The bus-exchange
function is selected when BX is high. The switches
are connected when BE is low.
9
10
11
12
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube
SN74CBT3383DW
SN74CBT3383DWR
SN74CBT3383DBR
SN74CBT3383DBQR
SN74CBT3383PW
SN74CBT3383PWR
SN74CBT3383DGVR
SNJ54CBT3383JT
SNJ54CBT3383W
SOIC − DW
SSOP − DB
CBT3383
Tape and reel
Tape and reel
CU383
SSOP (QSOP) − DBQ Tape and reel
Tube
CBT3383
−40°C to 85°C
TSSOP − PW
CU383
Tape and reel
TVSOP − DGV
CDIP − JT
Tape and reel
Tube
CU383
SNJ54CBT3383JT
SNJ54CBT3383W
−55°C to 125°C
CFP − W
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
INPUTS/OUTPUTS
BE
BX
L
1A1−5A1
1B1−5B1
1B2−5B2
Z
1A2−5A2
1B2−5B2
1B1−5B1
Z
L
L
H
H
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢗ
ꢗ
ꢘ
ꢙ
ꢪ
ꢚ
ꢥ
ꢡ
ꢑ
ꢄ
ꢣ
ꢆ
ꢤ
ꢮ
ꢎ
ꢞ
ꢙ
ꢜ
ꢟ
ꢁ
ꢝ
ꢚ
ꢔ
ꢆ
ꢔ
ꢛ
ꢜ
ꢦ
ꢥ
ꢝ
ꢞ
ꢤ
ꢤ
ꢟ
ꢠ
ꢡ
ꢡ
ꢜ
ꢢ
ꢢ
ꢛ
ꢛ
ꢧ
ꢞ
ꢞ
ꢟ
ꢜ
ꢜ
ꢞ
ꢛ
ꢣ
ꢣ
ꢧ
ꢣ
ꢤ
ꢥ
ꢟ
ꢟ
ꢦ
ꢦ
ꢜ
ꢢ
ꢡ
ꢠ
ꢣ
ꢣ
ꢣ
ꢜ
ꢞ
ꢝ
ꢧ
ꢥ
ꢨ
ꢣ
ꢣ
ꢩ
ꢛ
ꢤ
ꢡ
ꢣ
ꢢ
ꢛ
ꢢ
ꢯ
ꢞ
ꢟ
ꢜ
ꢥ
ꢪ
ꢡ
ꢜ
ꢪ
ꢢ
ꢢ
ꢦ
ꢣ
ꢦ
ꢫ
Copyright 2004, Texas Instruments Incorporated
ꢙ ꢜ ꢧ ꢟ ꢞꢪ ꢥꢤ ꢢꢣ ꢤꢞ ꢠꢧ ꢩꢛ ꢡꢜ ꢢ ꢢꢞ ꢱꢎ ꢲꢍ ꢗꢘ ꢏ ꢍꢇꢈꢂ ꢇꢂꢉ ꢡꢩꢩ ꢧꢡ ꢟ ꢡ ꢠꢦ ꢢꢦꢟ ꢣ ꢡ ꢟ ꢦ ꢢꢦ ꢣꢢꢦ ꢪ
ꢟ
ꢞ
ꢤ
ꢢ
ꢞ
ꢟ
ꢠ
ꢢ
ꢞ
ꢣ
ꢧ
ꢛ
ꢝ
ꢛ
ꢤ
ꢦ
ꢟ
ꢢ
ꢬ
ꢢ
ꢦ
ꢟ
ꢞ
ꢝ
ꢆ
ꢦ
ꢭ
ꢡ
ꢎ
ꢜ
ꢠ
ꢦ
ꢣ
ꢢ
ꢡ
ꢜ
ꢪ
ꢟ
ꢪ
ꢡ
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢰ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢫ
ꢟ
ꢡ
ꢜ
ꢢ
ꢯ
ꢫ
ꢗ
ꢟ
ꢞ
ꢪ
ꢢ
ꢛ
ꢞ
ꢤ
ꢦ
ꢣ
ꢛ
ꢜ
ꢰ
ꢪ
ꢞ
ꢦ
ꢞ
ꢢ
ꢜ
ꢦ
ꢤ
ꢦ
ꢣ
ꢡ
ꢟ
ꢛ
ꢩ
ꢛ
ꢜ
ꢤ
ꢩ
ꢥ
ꢥ ꢜꢩ ꢦꢣꢣ ꢞ ꢢꢬꢦ ꢟ ꢮꢛ ꢣꢦ ꢜ ꢞꢢꢦ ꢪꢫ ꢙ ꢜ ꢡꢩ ꢩ ꢞ ꢢꢬꢦ ꢟ ꢧꢟ ꢞ ꢪꢥꢤ ꢢꢣ ꢉ ꢧꢟ ꢞ ꢪꢥꢤ ꢢꢛꢞ ꢜ
ꢢ
ꢧ
ꢟ
ꢞ
ꢤ
ꢦ
ꢣ
ꢣ
ꢛ
ꢜ
ꢰ
ꢪ
ꢞ
ꢦ
ꢣ
ꢜ
ꢞ
ꢢ
ꢜ
ꢦ
ꢤ
ꢦ
ꢣ
ꢣ
ꢡ
ꢟ
ꢛ
ꢩꢯ
ꢛ
ꢜ
ꢤ
ꢩ
ꢥ
ꢪ
ꢦ
ꢢ
ꢦ
ꢣ
ꢛ
ꢜ
ꢰ
ꢞ
ꢝ
ꢡ
ꢩ
ꢩ
ꢧ
ꢡ
ꢟ
ꢡ
ꢠ
ꢦ
ꢢ
ꢦ
ꢟ
ꢣ
ꢫ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢇ ꢈꢇ ꢉ ꢀ ꢁꢊ ꢃ ꢄꢅꢆ ꢇ ꢇꢈ ꢇ
ꢋꢌ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅ ꢑꢀ ꢍꢐ ꢒꢄ ꢓꢔꢁ ꢕꢐ ꢀ ꢖꢎ ꢆ ꢄꢓ ꢐ ꢀ
SCDS003O − NOVEMBER 1992 − REVISED JULY 2004
logic diagram (positive logic)
3
2
5
1A1
1B1
1B2
4
1A2
21
20
23
5A1
5B1
5B2
22
5A2
1
BE
13
BX
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK I/O
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
JA
DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢇ ꢈ ꢇ ꢉ ꢀꢁ ꢊꢃ ꢄꢅ ꢆꢇ ꢇꢈ ꢇ
ꢋ ꢌ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅꢑꢀ ꢍꢐꢒꢄ ꢓꢔꢁꢕ ꢐ ꢀ ꢖꢎ ꢆꢄ ꢓꢐ ꢀ
SCDS003O − NOVEMBER 1992 − REVISED JULY 2004
recommended operating conditions (see Note 3)
SN54CBT3383 SN74CBT3383
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level control input voltage
Low-level control input voltage
Operating free-air temperature
0.8
0.8
70
V
T
A
−55
125
0
°C
NOTE 3: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54CBT3383
SN74CBT3383
PARAMETER
TEST CONDITIONS
I = −18 mA
UNIT
†
†
MIN TYP
MAX
−1.2
5
MIN TYP
MAX
−1.2
1
V
V
V
V
V
= 4.5 V,
= 5.5 V,
= 5.5 V,
V
IK
CC
CC
CC
CC
I
I
I
V = 5.5 V or GND
I
µA
µA
I
I
O
= 0,
V = V
I CC
or GND
50
50
CC
= 5.5 V, One input at 3.4 V,
or GND
‡
∆I
CC
Control inputs
2.5
2.5
mA
pF
pF
Other inputs at V
CC
V = 3 V or 0
I
3
6
C
C
Control inputs
i
V = 2.5 V
I
5
V
= 3 V or 0,
= 2.5 V,
BE = V
O
O
CC
io(OFF)
§
V
BE = V
6
CC
I = 64 mA
I
5
9.2
5
5
7
7
V = 0
I
V
CC
= 4.5 V
I = 30 mA
I
Ω
r
on
V = 2.4 V,
I
I = 15 mA
I
10
17
10
15
†
‡
§
All typical values are at V
CC
= 5 V, T = 25°C.
A
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V
or GND.
CC
Measured by the voltage drop between the input terminal and the output terminal at the indicated current through the switch. On-state resistance
is determined by the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
SN54CBT3383 SN74CBT3383
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
MIN
MAX
¶
t
t
t
t
A or B
BX
B or A
A or B
A or B
A or B
1.5
0.25
ns
ns
ns
ns
pd
pd
en
1
1
1
10.2
10.8
8.2
1
1
1
9.2
8.6
7.5
BE
BE
dis
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢇ ꢈꢇ ꢉ ꢀ ꢁꢊ ꢃ ꢄꢅꢆ ꢇ ꢇꢈ ꢇ
ꢋꢌ ꢍꢅꢎ ꢆ ꢏ ꢐꢆ ꢅ ꢑꢀ ꢍꢐ ꢒꢄ ꢓꢔꢁ ꢕꢐ ꢀ ꢖꢎ ꢆ ꢄꢓ ꢐ ꢀ
SCDS003O − NOVEMBER 1992 − REVISED JULY 2004
PARAMETER MEASUREMENT INFORMATION
7 V
TEST
S1
S1
Open
GND
500 Ω
t
Open
7 V
From Output
Under Test
pd
/t
t
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
Output
Control
1.5 V
1.5 V
LOAD CIRCUIT
t
t
PLZ
PZL
Output
Waveform 1
S1 at 7 V
3.5 V
3 V
0 V
1.5 V
Input
V
V
+ 0.3 V
1.5 V
1.5 V
OL
V
(see Note B)
OL
OH
t
t
PHZ
PZH
t
t
PHL
PLH
Output
Waveform 2
S1 at Open
(see Note B)
V
V
OH
− 0.3 V
OH
1.5 V
Output
1.5 V
1.5 V
0 V
V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
5962-9668801QKA
5962-9668801QLA
SN74CBT3383DBLE
SN74CBT3383DBQR
ACTIVE
ACTIVE
CFP
W
24
24
24
24
1
1
TBD
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CDIP
SSOP
JT
A42 SNPB
Call TI
OBSOLETE
ACTIVE
DB
SSOP/
QSOP
DBQ
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SN74CBT3383DBQRE4
SN74CBT3383DBR
SN74CBT3383DBRG4
SN74CBT3383DGVR
SN74CBT3383DGVRE4
SN74CBT3383DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP/
QSOP
DBQ
DB
24
24
24
24
24
24
24
24
24
24
24
24
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SSOP
SSOP
TVSOP
TVSOP
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGV
DGV
DW
DW
DW
DW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT3383DWE4
SN74CBT3383DWR
SN74CBT3383DWRE4
SN74CBT3383PW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT3383PWE4
SN74CBT3383PWG4
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT3383PWLE
SN74CBT3383PWR
OBSOLETE TSSOP
PW
PW
24
24
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBT3383PWRE4
SN74CBT3383PWRG4
PW
PW
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54CBT3383JT
SNJ54CBT3383W
ACTIVE
ACTIVE
CDIP
CFP
JT
W
24
24
1
1
TBD
TBD
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
24
28
DIM
13
24
1.280
(32,51) (37,08)
1.460
A MAX
1.240
(31,50) (36,58)
1.440
B
A MIN
B MAX
B MIN
0.300
(7,62)
0.291
(7,39)
1
12
0.070 (1,78)
0.030 (0,76)
0.245
(6,22)
0.285
(7,24)
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.100 (2,54) MAX
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.045 (1,14)
0.026 (0,66)
0.090 (2,29)
0.045 (1,14)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
0.360 (9,14)
0.240 (6,10)
0.019 (0,48)
0.015 (0,38)
1
24
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明