SN74AHC139DGVRG4 [TI]
AHC/VHC/H/U/V SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, GREEN, PLASTIC, TVSOP-16;
| 型号： | SN74AHC139DGVRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AHC/VHC/H/U/V SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, GREEN, PLASTIC, TVSOP-16 驱动 光电二极管 输出元件 逻辑集成电路 电视 |
| 文件： | 总22页 (文件大小：1179K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AHC139
SN54AHC139
www.ti.com
SCLS259L –DECEMBER 1995–REVISED JUNE 2013
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
Check for Samples: SN74AHC139, SN54AHC139
1
FEATURES
•
Operating Range 2-V to 5.5-V
•
ESD Protection Exceeds JESD 22
•
Designed Specifically for High-Speed Memory
Decoders and Data-Transmission Systems
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
•
•
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
1000-V Charged-Device Model (C101)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
SN54AHC139 . . . J or W PACKAGE
SN74AHC139 . . . D,DB,DGV,N,NS
OR PW PACKAGE
SN74AHC139 . . . RGY PACKAGE
(TOP VIEW)
SN54AHC139 . . . FKP ACKAGE
(TOP VIEW)
(TOP VIEW)
1
16
1G
1A
VCC
15 2G
1
2
3
4
5
6
7
8
16
3
2
1 20 19
18
2A
17 2B
1B
1Y0
NC
4
5
6
7
8
15
14
13
12
11
2
3
4
5
6
7
1A
1B
2G
2A
14
13
12
11
10
9
1B
2A
16
NC
1Y0
1Y1
1Y2
1Y3
2B
1Y0
1Y1
1Y2
1Y3
GND
2B
15
14
2Y0
2Y1
1Y1
1Y2
2Y0
2Y1
2Y2
2Y0
2Y1
2Y2
2Y3
9 10 11 12 13
10
8
9
NC − No internal connection
DESCRIPTION
The ’AHC139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
These devices are designed to be used in high-performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, these decoders can be used
to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable circuit,
the delay times of these decoders and the enable time of the memory usually are less than the typical access
time of the memory. This means that the effective system delay introduced by the decoders is negligible.
FUNCTION TABLE
(EACH GATE)
INPUTS
OUTPUT
SELECT
G
Y0 Y1 Y2 Y3
B
X
L
A
X
L
H
L
L
L
L
H
L
H
H
L
H
H
H
L
H
H
H
H
L
L
H
L
H
H
H
H
H
H
H
H
H
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2013, Texas Instruments Incorporated
SN74AHC139
SN54AHC139
SCLS259L –DECEMBER 1995–REVISED JUNE 2013
www.ti.com
LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC)
4
1Y0
1Y1
1Y2
1
1G
5
6
2
3
1A
1B
Select
Inputs
7
1Y3
Data
Outputs
12
2Y0
2Y1
2Y2
15
2G
11
10
14
13
2A
2B
Select
Inputs
9
2Y3
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
–0.5 to 7
–0.5 to 7
UNIT
V
Supply voltage range, VCC
Input voltage range, VI(2)
V
(2)
Output voltage range, VO
–0.5 to VCC + 0.5
V
Input clamp current, IIK (VI < 0)
–20
±20
mA
mA
mA
mA
Output clamp current, IOK (VO < 0 or VO > VCC
)
Continuous output current, IO (VO = 0 to VCC
)
±25
Continuous current through VCC or GND
±75
D package(3)
73
DB package(3)
DGV package(3)
N package(3)
NS package(3)
PW package(3)
RGY package(4)
82
120
67
Package thermal impedance, θJA
°C/W
°C
64
108
39
Storage temperature range, Tstg
–65 to 150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) The package thermal impedance is calculated in accordance with JESD 51-5
2
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SN54AHC139
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SCLS259L –DECEMBER 1995–REVISED JUNE 2013
RECOMMENDED OPERATING CONDITIONS(1)
SN54AHC139
SN74AHC139
UNIT
MIN
2
MAX
MIN
2
MAX
VCC
Supply voltage
5.5
5.5
V
VCC= 2 V
VCC= 3V
1.5
2.1
3.85
1.5
2.1
3.85
VIH
High-level input voltage
V
V
VCC= 5.5 V
VCC= 2 V
VCC= 3 V
VCC= 5.5 V
0.5
0.9
1.65
5.5
VCC
–50
–4
0.5
0.9
1.65
5.5
VCC
–50
–4
VIL
Low-level Input voltage
VI
Input voltage
0
0
0
0
V
V
VO
Output voltage
VCC= 2 V
IOH
High-level output current
Low-level output current
VCC= 3.3 V ± 0.3 V
VCC= 5 V ± 0.5 V
VCC= 2 V
mA
mA
–8
–8
50
50
IOL
VCC= 3.3 V ± 0.3 V
VCC= 5 V ± 0.5 V
VCC= 3.3 V ± 0.3 V
VCC= 5 V ± 0.5 V
4
4
8
8
100
20
100
20
Δt/Δv
Input Transition rise or fall rate
Operating free-air temperature
ns/V
°C
TA
–55
125
–40
125
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
TA = –55°C TO
125°C
TA = –40°C TO
85°C
TA = –40°C TO
125°C
TA = 25°C
Recommended
SN74AHC139
PARAMETER
TEST CONDITIONS
VCC
UNIT
SN54AHC139
SN74AHC139
MIN
1.9
TYP
2
MAX
MIN
1.9
MAX
MIN
1.9
MAX
MIN
1.9
MAX
2 V
3 V
IOH = –50 µA
2.9
3
2.9
2.9
2.9
VOH
4.5 V
3 V
4.4
4.5
4.4
4.4
4.4
V
IOH = –4 mA
IOH = –8 mA
2.58
3.94
2.48
3.8
2.48
3.8
2.48
3.8
4.5 V
2 V
0.1
0.1
0.1
0.1
0.1
0.5
0.5
0.1
0.1
0.1
0.1
0.1
0.5
0.5
IOL = 50 µA
3 V
VOL
4.5 V
3 V
0.1
0.1
V
IOH = 4 mA
IOH = 8 mA
0.36
0.36
0.44
0.44
4.5 V
0 V to 5.5
V
II
VI = 5.5 V or GND
±0.1
±1(1)
±1
±1
40
µA
VI = VCC or
IO = 0
ICC
Ci
5.5 V
5 V
4
40
40
10
µA
pF
GND,
VI = VCC or GND
2
10
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
Copyright © 1995–2013, Texas Instruments Incorporated
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SN54AHC139
SCLS259L –DECEMBER 1995–REVISED JUNE 2013
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
TA = –40°C TO
TA = –55°C TO
125°C
TA = –40°C TO
85°C
125°C
TA = 25°C
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
Recommended
SN74AHC139
PARAMETER
UNIT
SN54AHC139
SN74AHC139
TYP
7.2(1)
7.2(1)
6.4(1)
6.4(1)
9.7
MAX
MIN
1(1)
1(1)
1(1)
1(1)
1
MAX
13(1)
MIN
MAX
13
MIN
MAX
13
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
11(1)
11(1)
9.2(1)
9.2(1)
14.5
14.5
12.7
12.7
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A or B
G
Y
Y
Y
Y
CL = 15 pF
CL = 15 pF
CL = 50 pF
CL = 50 pF
ns
ns
ns
ns
13(1)
11(1)
11(1)
16.5
16.5
14.5
14.5
13
11
13
11
11
11
16.5
16.5
14.5
14.5
16.5
16.5
14.5
14.5
A or B
G
9.7
1
8.9
1
8.9
1
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = –40°C TO
TA = –55°C TO
125°C
TA = –40°C TO
85°C
125°C
TA = 25°C
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
Recommended
SN74AHC139
PARAMETER
UNIT
SN54AHC139
SN74AHC139
TYP
5(1)
5(1)
4.4(1)
4.4(1)
6.5
MAX
MIN
1(1)
1(1)
1(1)
1(1)
1
MAX
8.5(1)
8.5(1)
7.5(1)
7.5(1)
10.5
10.5
9.5
MIN
MAX
8.5
MIN
MAX
8.5
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
7.2(1)
7.2(1)
6.3(1)
6.3(1)
9.5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A or B
G
Y
Y
Y
Y
CL = 15 pF
CL = 15 pF
CL = 50 pF
CL = 50 pF
ns
ns
ns
ns
8.5
7.5
8.5
7.5
7.5
7.5
10.5
10.5
9.5
10.5
10.5
9.5
A or B
G
6.5
9.5
1
5.9
8.3
1
5.9
8.3
1
9.5
9.5
9.5
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
OPERATING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
Power dissipation capacitance
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
pF
Cpd
13
4
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Product Folder Links: SN74AHC139 SN54AHC139
SN74AHC139
SN54AHC139
www.ti.com
SCLS259L –DECEMBER 1995–REVISED JUNE 2013
PARAMETER MEASUREMENT INFORMATION
V
CC
S1
Open
GND
R
= 1 kΩ
L
TEST
/t
S1
From Output
Under Test
Test
From Output
Under Test
Point
t
t
Open
PLH PHL
C
C
L
(see Note A)
t
/t
PLZ PZL
V
CC
L
(see Note A)
/t
PHZ PZH
GND
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
V
CC
50% V
CC
Timing Input
0 V
t
w
t
h
t
su
V
CC
V
CC
50% V
50% V
CC
Input
CC
50% V
50% V
CC
Data Input
CC
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
50% V
50% V
50% V
50% V
CC
Input
CC
CC
CC
0 V
0 V
t
t
t
t
t
PZL
PLZ
PLH
PHL
Output
V
≈V
OH
CC
Waveform 1
In-Phase
Output
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
CC
(see Note B)
V
+ 0.3 V
OL
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
V
OH
OH
Out-of-Phase
Output
V
OH
− 0.3 V
50% V
50% V
50% V
CC
CC
CC
≈0 V
V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
INVERTING AND NONINVERTING OUTPUTS
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output
control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf
≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 1995–2013, Texas Instruments Incorporated
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SCLS259L –DECEMBER 1995–REVISED JUNE 2013
www.ti.com
REVISION HISTORY
Changes from Revision K (December 1995) to Revision L
Page
•
•
Changed document format from Quicksilver to DocZone. .................................................................................................... 1
Extended operating temperature range to 125°C ................................................................................................................. 3
6
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74AHC139D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHC139
SN74AHC139DBLE
SN74AHC139DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
-40 to 125
-40 to 125
2000
2000
2000
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HA139
SN74AHC139DBRE4
SN74AHC139DBRG4
SN74AHC139DE4
SN74AHC139DG4
SN74AHC139DGVR
SN74AHC139DGVRE4
SN74AHC139DGVRG4
SN74AHC139DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
TVSOP
TVSOP
TVSOP
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
HA139
Green (RoHS
& no Sb/Br)
HA139
Green (RoHS
& no Sb/Br)
AHC139
AHC139
HA139
D
40
Green (RoHS
& no Sb/Br)
DGV
DGV
DGV
D
2000
2000
2000
2500
2500
2500
25
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
HA139
Green (RoHS
& no Sb/Br)
HA139
Green (RoHS
& no Sb/Br)
AHC139
AHC139
AHC139
SN74AHC139N
SN74AHC139N
AHC139
AHC139
SN74AHC139DRE4
SN74AHC139DRG4
SN74AHC139N
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
N
Pb-Free
(RoHS)
SN74AHC139NE4
SN74AHC139NSR
SN74AHC139NSRE4
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
NS
NS
2000
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74AHC139NSRG4
SN74AHC139PW
ACTIVE
SO
NS
16
16
16
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
AHC139
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
PW
PW
PW
90
90
90
Green (RoHS
& no Sb/Br)
HA139
HA139
HA139
SN74AHC139PWE4
SN74AHC139PWG4
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74AHC139PWLE
SN74AHC139PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
16
16
TBD
Call TI
Call TI
-40 to 125
-40 to 125
2000
2000
2000
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HA139
HA139
HA139
HA139
HA139
SN74AHC139PWRE4
SN74AHC139PWRG4
SN74AHC139RGYR
SN74AHC139RGYRG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
VQFN
PW
PW
16
16
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
RGY
RGY
Green (RoHS
& no Sb/Br)
VQFN
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2013
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AHC139DBR
SN74AHC139DGVR
SN74AHC139DR
SSOP
TVSOP
SOIC
DB
DGV
D
16
16
16
16
16
16
2000
2000
2500
2000
2000
3000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
12.4
16.4
16.4
12.4
12.4
8.2
6.8
6.5
8.2
6.9
3.8
6.6
4.0
2.5
1.6
2.1
2.5
1.6
1.5
12.0
8.0
16.0
12.0
16.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
10.3
10.5
5.6
8.0
SN74AHC139NSR
SN74AHC139PWR
SN74AHC139RGYR
SO
NS
12.0
8.0
TSSOP
VQFN
PW
RGY
4.3
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHC139DBR
SN74AHC139DGVR
SN74AHC139DR
SSOP
TVSOP
SOIC
DB
DGV
D
16
16
16
16
16
16
2000
2000
2500
2000
2000
3000
367.0
367.0
333.2
367.0
367.0
367.0
367.0
367.0
345.9
367.0
367.0
367.0
38.0
35.0
28.6
38.0
35.0
35.0
SN74AHC139NSR
SN74AHC139PWR
SN74AHC139RGYR
SO
NS
TSSOP
VQFN
PW
RGY
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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