SN74ACT1071DE4 [TI]
10-LINE DIODE BUS TERMINATION ARRAY, PDSO14, GREEN, PLASTIC, SOIC-14;
| 型号： | SN74ACT1071DE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-LINE DIODE BUS TERMINATION ARRAY, PDSO14, GREEN, PLASTIC, SOIC-14 光电二极管 接口集成电路 |
| 文件： | 总9页 (文件大小：316K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74ACT1071
10-BIT BUS-TERMINATION ARRAY
WITH BUS-HOLD FUNCTION
SCAS192 – D3994, MARCH 1992 – REVISED APRIL 1993
D PACKAGE
(TOP VIEW)
• Designed to Ensure Defined Voltage Levels
on Floating Bus Lines in CMOS Systems
• Reduces Undershoot and Overshoot
D1
D2
GND
GND
D3
1
2
3
4
5
6
7
14 D10
13 D9
Caused By Line Reflections
• Repetitive Peak Forward
12
11
10
9
D8
Current . . . I
= 100 mA
FRM
V
V
CC
CC
• Inputs Are TTL-Voltage Compatible
• Low Power Consumption (Like CMOS)
• ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model
D4
D5
D7
D6
8
(C = 200 pF, R = 0)
• Center-Pin V
and GND Configuration
Minimizes High-Speed Switching Noise
CC
description
This device is designed to terminate bus lines in CMOS systems. The integrated low-impedance diodes clamp
the voltage of undershoots and overshoots caused by line reflections and ensure signal integrity. The device
also contains a bus-hold function that consists of a CMOS-buffer stage with a high-resistance feedback path
between its output and its input. The SN74ACT1071 prevents bus lines from floating without using pullup or
pulldown resistors.
The high-impedance inputs of these internal buffers are connected to the input terminals of the device. The
feedback path on each internal buffer stage keeps a bus line tied to the bus holder at the last valid logic state
generated by an active driver before the bus switches to the high-impedance state.
The SN74ACT1071 is characterized for operation from –40°C to 85°C.
logic diagram, one of ten channels (positive logic)
1
D1
11
V
V
CC
10
CC
TG
3
4
GND
GND
Copyright 1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
4–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT1071
10-BIT BUS-TERMINATION ARRAY
WITH BUS-HOLD FUNCTION
SCAS192 – D3994, MARCH 1992 – REVISED APRIL 1993
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
I
CC
Continuous input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Positive-peak input clamp current, I (V > V ) (t < 1 µs, duty cycle < 20%) . . . . . . . . . . . . . . . . . 100 mA
Negative-peak input clamp current, I (V < 0) (t < 1 µs, duty cycle < 20%) . . . . . . . . . . . . . . . . . . –100 mA
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
IK
I
CC
w
IK
I
w
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input negative-voltage rating may be exceeded if the input clamp-current rating is observed.
recommended operating conditions
MIN
4.5
MAX
UNIT
V
V
V
V
V
Supply voltage
5.5
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
2.5
V
0.8
V
0
V
CC
85
V
T
A
Operating free-air temperature
–40
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°C
PARAMETER
TEST CONDITIONS
V = 0.8 V
MIN
MAX
UNIT
†
MIN TYP
MAX
I
I
V
V
= 4.5 to 5.5 V,
= 4.5 to 5.5 V,
0.15
–0.2
0.3
0.9
0.1
1
–1.5
–1.5
mA
mA
V
IL
CC
I
V = 2.5 V
I
–0.5
–1.4 –0.15
–1.5
IH
CC
V
IKL
I
I
= –18 mA
= 18 mA
IN
V
V
+2
4
V
CC
+2
40
1
V
IKH
‡
IN
CC
I
V
= 5.5 V,
Inputs open
µA
mA
pF
CC
CC
One input at 3.4 V,
V = V or GND
§
∆I
CC
Other inputs at V
or GND
0.9
CC
C
3
i
I
CC
†
‡
§
All typical values are at V
= 5 V.
CC
Inputs may be set high or low prior to the I
CC
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V
measurement.
.
CC
4–2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT1071
10-BIT BUS-TERMINATION ARRAY
WITH BUS-HOLD FUNCTION
SCAS192 – D3994, MARCH 1992 – REVISED APRIL 1993
TYPICAL CHARACTERISTICS
FORWARD CURRENT
vs
FORWARD CURRENT
vs
INPUT VOLTAGE
(UPPER CLAMPING DIODE)
INPUT VOLTAGE
(LOWER CLAMPING DIODE)
60
55
50
45
5
0
– 5
– 10
– 15
– 20
– 25
40
35
30
25
– 30
– 35
20
– 40
– 45
15
10
5
– 50
– 55
– 60
0
5.5
6
6.5
7
7.5
8
8.5
9
–2 –1.75 –1.5 –1.25 –1 – 0.75 – 0.5 – 0.25
0
V – Input Voltage – V
I
V – Input Voltage – V
I
Figure 1
Figure 2
INPUT CURRENT
vs
SUPPLY CURRENT
vs
INPUT VOLTAGE
INPUT VOLTAGE
1
0.8
0.6
0.4
0.2
0
5
4.5
4
3.5
3
2.5
2
– 0.2
– 0.4
1.5
– 0.6
– 0.8
–1
1
0.5
0
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
V – Input Voltage – V
I
V – Input Voltage – V
I
Figure 3
Figure 4
4–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT1071
10-BIT BUS-TERMINATION ARRAY
WITH BUS-HOLD FUNCTION
SCAS192 – D3994, MARCH 1992 – REVISED APRIL 1993
APPLICATION INFORMATION
The SN74ACT1071 terminates the output of a driving device and holds the input of the driven device at the logic level
of the driver output prior to establishment of the high-impedance state on that output (see Figure 5).
Bus
Typical Output
CMOS Input
Input
Output
D1 (external connection point)
V
CC
10 11
1
SN74ACT1071
3
4
GND
Figure 5. Bus-Hold Application
4–4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
SN74ACT1071D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ACT1071DE4
SN74ACT1071DG4
SN74ACT1071DR
SN74ACT1071DRE4
SN74ACT1071DRG4
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74ACT1071DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 14
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 33.0
SN74ACT1071DR
D
2500
Pack Materials-Page 2
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