SN54AHCT16374_08 [TI]
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS; 16位边沿触发的D型触发器具有三态输出
| 型号： | SN54AHCT16374_08 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS |
| 文件： | 总13页 (文件大小：378K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
SN54AHCT16374 . . . WD PACKAGE
SN74AHCT16374 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Members of the Texas Instruments
Widebus Family
EPIC (Enhanced-Performance Implanted
CMOS) Process
1OE
1Q1
1Q2
GND
1Q3
1Q4
1CLK
1
2
3
4
5
6
7
8
9
48
Inputs Are TTL-Voltage Compatible
47 1D1
46 1D2
45 GND
44 1D3
43 1D4
Distributed V
High-Speed Switching Noise
and GND Pins Minimize
CC
Flow-Through Architecture Optimizes PCB
Layout
V
42
V
CC
CC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
1Q5
1Q6
41 1D5
40 1D6
39 GND
38 1D7
37 1D8
36 2D1
35 2D2
34 GND
33 2D3
32 2D4
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
GND 10
1Q7 11
1Q8 12
2Q1 13
2Q2 14
GND 15
2Q3 16
2Q4 17
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
V
18
31
V
CC
CC
2Q5 19
2Q6 20
GND 21
2Q7 22
2Q8 23
2OE 24
30 2D5
29 2D6
28 GND
27 2D7
26 2D8
25 2CLK
description
The
’AHCT16374
devices
are
16-bit
edge-triggered D-type flip-flops with 3-state
outputs designed specifically for driving highly
capacitive or relatively low-impedance loads.
They are particularly suitable for implementing
buffer registers, I/O ports, bidirectional bus
drivers, and working registers.
These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock
(CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus
lines without need for interface or pullup components.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
The SN54AHCT16374 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74AHCT16374 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Copyright 2000, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
FUNCTION TABLE
(each 8-bit flip-flop)
INPUTS
OUTPUT
Q
CLK
D
H
L
OE
L
↑
↑
H
L
L
L
H or L
X
X
X
Q
0
H
Z
†
logic symbol
1
1OE
1CLK
2OE
1EN
C1
48
24
25
2EN
C2
2CLK
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
2
3
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
1D
1
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
1Q8
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
5
6
8
9
11
12
13
14
16
17
19
20
22
23
2D
2
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1
24
25
2OE
1OE
48
2CLK
1CLK
C1
1D
C1
2
13
2Q1
1Q1
47
36
2D1
1D1
1D
To Seven Other Channels
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
O
CC
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
IK
I
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through each V
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
O
O
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
CC
JA
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions (see Note 3)
SN54AHCT16374 SN74AHCT16374
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
5.5
0.8
5.5
V
0
0
0
0
V
I
Output voltage
V
V
V
O
CC
–8
CC
–8
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
mA
mA
ns/V
°C
OH
8
8
20
85
OL
∆t/∆v
20
T
A
–55
125
–40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
SN54AHCT16374 SN74AHCT16374
PARAMETER
TEST CONDITIONS
= –50
V
UNIT
V
CC
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
A
4.5
OH
OH
OL
OL
V
4.5 V
4.5 V
OH
OL
= –8 mA
= 50
= 8 mA
or GND
3.94
3.8
3.8
A
0.1
0.36
±0.1
0.1
0.44
±1*
0.1
0.44
±1
V
V
I
I
I
V = V
0 V to 5.5 V
5.5 V
A
A
I
I
CC
V
= V
or GND,
CC
O
I
±0.25
4
±2.5
40
±2.5
40
OZ
CC
V = V or V
IH
IL
V = V
or GND,
I = 0
O
5.5 V
A
I
CC
One input at 3.4 V,
Other inputs at V
†
5.5 V
1.35
10
1.5
1.5
10
mA
∆I
CC
or GND
CC
or GND
C
C
V = V
5 V
5 V
2.5
3.5
pF
pF
i
I
CC
= V or GND
CC
V
o
O
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or V
CC
= 0 V.
CC
†
.
timing requirements over recommended operating free-air temperature range, V
(unless otherwise noted) (see Figure 1)
= 5 V ± 0.5 V
CC
T
= 25°C
SN54AHCT16374 SN74AHCT16374
A
UNIT
MIN
6.5
2.5
2.5
MAX
MIN
6.5
2.5
2.5
MAX
MIN
6.5
2.5
2.5
MAX
t
w
t
su
t
h
Pulse duration, CLK high or low
Setup time, data before CLK↑
Hold time, data after CLK↑
ns
ns
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
140*
130
SN54AHCT16374 SN74AHCT16374
FROM
(INPUT)
TO
LOAD
PARAMETER
UNIT
MHz
ns
(OUTPUT) CAPACITANCE
MIN
90*
85
MAX
MIN
80*
75
1*
1*
1*
1*
1*
1*
1
MAX
MIN
110
75
1
MAX
C
C
= 15 pF
= 50 pF
L
L
f
max
t
t
t
t
t
t
t
t
t
t
t
t
t
6.5*
9.4*
9.4*
9.5*
9.5*
10.5*
10.5*
10.5*
10.5*
11*
10.5
10.5
10.5
10.5
11
PLH
PHL
PZH
PZL
PHZ
PLZ
PLH
PHL
PZH
PZL
PHZ
PLZ
sk(o)
CLK
Q
Q
Q
Q
Q
Q
C
C
C
C
C
= 15 pF
= 15 pF
= 15 pF
= 50 pF
= 50 pF
L
L
L
L
L
6.5*
1
6.5*
1
ns
OE
OE
6.5*
1
6.2* 10.2*
6.2* 10.2*
1
ns
11*
1
11
7.3
7.1
6.2
5.1
7.1
7.9
10.4
10.4
10.5
10.5
11.2
11.2
1**
11.5
11.5
11.5
11.5
12
1
11.5
11.5
11.5
11.5
12
CLK
ns
1
1
1
1
ns
OE
OE
1
1
1
1
C
C
= 50 pF
= 50 pF
ns
ns
L
L
1
12
1
12
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
** On products compliant to MIL-PRF-38535, this parameter does not apply.
noise characteristics, V
= 5 V, C = 50 pF, T = 25°C (see Note 4)
CC
L
A
SN74AHCT16374
PARAMETER
UNIT
MIN
TYP
0.36
–0.1
4.7
MAX
0.8
V
V
V
V
V
Quiet output, maximum dynamic V
V
V
V
V
V
OL(P)
OL(V)
OH(V)
IH(D)
IL(D)
OL
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage
Low-level dynamic input voltage
–0.8
OL
OH
2
0.8
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
No load, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
27
pF
pd
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT16374, SN74AHCT16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS337I – MARCH 1996 – REVISED FEBRUARY 2000
PARAMETER MEASUREMENT INFORMATION
V
CC
Open
GND
S1
R
= 1 kΩ
L
TEST
S1
From Output
Under Test
Test
Point
From Output
Under Test
t
t
/t
Open
PLH PHL
/t
C
C
L
t
V
CC
L
PLZ PZL
/t
(see Note A)
(see Note A)
GND
PHZ PZH
Open Drain
V
CC
LOAD CIRCUIT FOR
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3-STATE AND OPEN-DRAIN OUTPUTS
3 V
0 V
1.5 V
Timing Input
t
w
t
h
3 V
t
su
3 V
0 V
1.5 V
1.5 V
Input
Input
1.5 V
1.5 V
Data Input
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
0 V
t
t
t
t
t
PZL
PLZ
PLH
PHL
Output
Waveform 1
V
≈V
OH
CC
In-Phase
Output
50% V
50% V
50% V
CC
50% V
CC
CC
V
S1 at V
(see Note B)
CC
V
V
+ 0.3 V
OL
V
OL
OL
t
t
t
PHL
PLH
PZH
PHZ
Output
Waveform 2
S1 at GND
V
OH
V
OH
Out-of-Phase
Output
– 0.3 V
OH
50% V
50% V
CC
CC
CC
V
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74AHCT16374DGGRE4
74AHCT16374DGGRG4
74AHCT16374DGVRE4
74AHCT16374DGVRG4
74AHCT16374DLRG4
SN74AHCT16374DGGR
SN74AHCT16374DGVR
SN74AHCT16374DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TVSOP
TVSOP
SSOP
DGG
DGV
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TVSOP
SSOP
DGG
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AHCT16374DLG4
SN74AHCT16374DLR
SSOP
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74AHCT16374DGGR TSSOP
SN74AHCT16374DGVR TVSOP
DGG
DGV
DL
48
48
48
2000
2000
1000
330.0
330.0
330.0
24.4
24.4
32.4
8.6
6.8
15.8
10.1
16.2
1.8
1.6
3.1
12.0
12.0
16.0
24.0
24.0
32.0
Q1
Q1
Q1
SN74AHCT16374DLR
SSOP
11.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AHCT16374DGGR
SN74AHCT16374DGVR
SN74AHCT16374DLR
TSSOP
TVSOP
SSOP
DGG
DGV
DL
48
48
48
2000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
41.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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