RF-HDT-DVBE-N2 [TI]
基于 Tag-it HF-I 标准芯片的 13.56MHz Overmolded 感应器 | TEC | 0 | -25 to 90;型号: | RF-HDT-DVBE-N2 |
厂家: | TEXAS INSTRUMENTS |
描述: | 基于 Tag-it HF-I 标准芯片的 13.56MHz Overmolded 感应器 | TEC | 0 | -25 to 90 电信 电信集成电路 |
文件: | 总5页 (文件大小:213K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RF-HDT-DVBE
www.ti.com
SCBS858C –FEBRUARY 2007–REVISED SEPTEMBER 2011
13.56-MHz ENCAPSULATED STANDARD TRANSPONDER
Check for Samples: RF-HDT-DVBE
1
FEATURES
APPLICATIONS
•
•
•
•
•
•
ISO/IEC 15693-2,-3; ISO/IEC 18000-3 Compliant
13.56-MHz Operating Frequency
•
Laundry
Process Automation
•
256-Bit User Memory in 8 × 32-Bit Blocks
User and Factory Lock Per Block
•
•
Product Authentication
Asset Management
Application Family Identifier (AFI)
Fast Simultaneous Identification
(Anti-Collision)
DESCRIPTION
Texas Instruments’ 13.56-MHz encapsulated standard transponder is compliant with the ISO/IEC 15693 and
ISO/IEC 18000-3 global open standards. This product offers a user accessible memory of 256 bits, organized in
8 blocks, and an optimized command set.
Designed for harsh environments, such as garment tracking in laundries, each transponder has a 64-bit factory
programmed Read Only Number, which is also laser engraved on the transponder housing. Prior to delivery,
transponders undergo complete functional and parametric testing to provide the high quality that customers have
come to expect from TI.
The 13.56-MHz encapsulated standard transponders are well suited for a variety of applications including, but
not limited to, laundry garment tracking, process automation, product authentication, and asset management.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RF-HDT-DVBE
SCBS858C –FEBRUARY 2007–REVISED SEPTEMBER 2011
www.ti.com
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
UNIT
°C
Operating temperature
Storage temperature
–25 to 90
–40 to 120 (130°C for total 50 hours, 220°C for total 30 s)
°C
Operating Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
RF-HDT-DVBE(1)
UNIT
Supported standard
ISO/IEC 15693-2,-3; ISO/IEC 18000-3
Resonance frequency (at 25°C)
13.56 MHz ± 300 kHz
Typ. required activation field strength to read (at 25°C) 112
Typ. required activation field strength to write (at 25°C) 115
dBμA/m
dBμA/m
bits
Factory programmed read only number
Memory (user programmable)
Typical programming cycles (at 25°C)
Data retention time (at 25°C)
Simultaneous identification of tags
Dimensions
64
256 bits organized in 8 × 32-bit blocks
100,000
> 10 years
Up to 50 tags per second (reader/antenna dependent)
ø 22 ± 0.2 mm × 3 ± 0.2 mm
Weight
2.1 ± 0.2
grams
Case material
PPS, black
Protection class
IP 68
Vibration
ISO/IEC 68.2.6 (10 g, 10 to 2000 Hz, 3 axis, 2.5 h)
ISO/IEC 68.2.27 (100 g, 6 ms, 6 axis, 20 times per axis)
Mechanical shock
Axial compression strength: 1000N (10 s, static)
Radial compression strength: 500N (10 s, static)
Isostatic water pressure: 45 bar (10 h)
Mechanical stability
Chemical resistance
Delivery
Typical chemicals used in laundry and dry-cleaning processes
1000 units in bulk
(1) For highest possible read-out coverage, TI recommends operating readers at a modulation depth of 20% or higher.
Supported Command Set
REQUEST MODE(1) (2)
REQUEST
NON-
ADDRESSED
OPTIONAL
FLAG
REQUEST CODE
INVENTORY
ADDRESSED
AFI
ISO 15693 Mandatory
and Optional Commands
Inventory
0x01
0x02
0x20
0x21
0x22
✓
-
-
-
✓
-
0/-
0/-
-/1
-/1
-/1
Stay Quiet
✓
✓
✓
✓
-
Read_Single_Block
Write_Single_Block
Lock_Block
-
✓
✓
✓
-
-
-
-
-
(1) ✓: Implemented
(2) -: Not applicable
2
Submit Documentation Feedback
Copyright © 2007–2011, Texas Instruments Incorporated
Product Folder Link(s): RF-HDT-DVBE
RF-HDT-DVBE
www.ti.com
SCBS858C –FEBRUARY 2007–REVISED SEPTEMBER 2011
Memory Organization
Block
32 bits
Lock Bits
Addr
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
U
U = User Lock
User data
(256 bits)
UID Number
(64 bits)
0x08
0x09
0x0A
AFI
Copyright © 2007–2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): RF-HDT-DVBE
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
RF-HDT-DVBE-N2
ACTIVE
RFIDP
TEC
0
1000
TBD
Call TI
Call TI
-25 to 90
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
相关型号:
RF-HDT-SJLE-G1
TAG-IT(TM) HF-I STANDARD TRANSPONDER CHIP (WAFER, BUMPED, INKED, GRIND, SAWN ON TAPE)
TI
©2020 ICPDF网 联系我们和版权申明