REF3133AQDBZRQ1 [TI]
汽车类、20ppm/°C（最大值）、100µA、3 引脚 SOT-23 串联电压基准 | DBZ | 3 | -40 to 125;
| 型号： | REF3133AQDBZRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类、20ppm/°C（最大值）、100µA、3 引脚 SOT-23 串联电压基准 | DBZ | 3 | -40 to 125 光电二极管 |
| 文件： | 总27页 (文件大小：1292K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
REF31xx-Q1 15 ppm/°C Maximum, 100-µA, SOT-23 Series Voltage Reference
1 Features
3 Description
The REF31xx-Q1 is a family of precision, low power,
low dropout, series voltage references available in the
tiny 3-pin SOT-23 package.
1
•
AEC-Q100 Qualified With the Following Results:
–
–
–
Device TA Range: –40°C to 125°C
Device HBM ESD Classification Level H1C
Device CDM ESD Classification Level C4A
The REF31xx-Q1 small size and low power
consumption (100 μA typical) make it ideal for
portable and battery-powered applications. The
REF31xx-Q1 does not require a load capacitor, but is
stable with any capacitive load and can sink or
source up to 10 mA of output current.
•
•
High Accuracy: 0.2% Maximum
Excellent Specified Drift Performance:
–
20 ppm/°C (Maximum) from –40°C to +125°C
•
•
•
•
•
•
High Output Current: ±10 mA
Low Dropout: 5 mV
Unloaded, the REF31xx-Q1 can operate on supplies
down to 5 mV above the output voltage. All models
are specified for the wide temperature range of –40°C
to +125°C.
Low IQ: 115 µA Maximum
Low Noise: 17 µVp-p/V
No Output Capacitor Required
Device Information(1)
Available Voltage Options : 1.2 V, 2 V, 2.5 V, 3 V,
3.3 V, 4 V
PART NUMBER
PACKAGE
BODY SIZE (NOM)
REF3112-Q1
REF3120-Q1
REF3125-Q1
REF3130-Q1
REF3133-Q1
REF3140-Q1
•
MicroSize Package: 3-Pin SOT-23
SOT-23 (3)
2.92 mm × 1.30 mm
2 Applications
•
HEV/EV Powertrain Systems
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
–
–
–
Automotive Battery Management Systems
Inverter
Electric Power Steering Systems
•
Advanced Driver Assistance Systems (ADAS)
–
–
–
–
Radar Systems
Night Vision Systems
Dynamic Spotlight
Front Camera
•
•
Infotainment MCU Attached
Portable, Battery-Powered Equipment
SPACER
Typical Application
Quiescent Current vs Temperature
3.3V
REF3133-Q1
120
V+
5W
GND
100
80
60
40
20
0
+
1mF to
10mF
VS
ADS7822
VREF
VCC
+
1mF to 10mF
0.1mF
Microcontroller
+In
CS
DOUT
VIN
-In
GND
DCLOCK
Copyright © 2016, Texas Instruments Incorporated
-60 -40 -20
0
20
40
60
80 100 120 140
Temperature (°C)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
www.ti.com
Table of Contents
8.4 Device Functional Modes........................................ 13
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ..................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 4
7.6 Typical Characteristics.............................................. 6
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
9
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1 Device Support...................................................... 18
12.2 Related Links ........................................................ 18
12.3 Receiving Notification of Documentation Updates 18
12.4 Community Resources.......................................... 18
12.5 Trademarks........................................................... 18
12.6 Electrostatic Discharge Caution............................ 18
12.7 Glossary................................................................ 18
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
April 2017
*
Initial release
2
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
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SBVS299 –APRIL 2017
5 Device Comparison Table
PRODUCT
VOLTAGE (V)
REF3112-Q1
REF3120-Q1
REF3125-Q1
REF3130-Q1
REF3133-Q1
REF3140-Q1
1.25
2.048
2.5
3
3.3
4.096
6 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
IN
1
2
3
GND
OUT
Pin Functions
PIN
I/O
DESCRIPTION
NO.
1
NAME
IN
I
Input supply voltage
2
OUT
GND
O
—
Reference output voltage
Ground
3
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage, V+ to V–
Output short circuit
7
V
Continuous
Operating temperature
Junction temperature
Storage temperature, Tstg
–55
–65
135
150
150
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VREF + 0.05(1)
MAX
5.5
UNIT
VIN
Input voltage
V
ILOAD
TA
Load current
25
mA
°C
Operating temperature
–40
125
(1) Minimum supply voltage for the REF3112-Q1 is 1.8 V.
7.4 Thermal Information
REF31xx-Q1
THERMAL METRIC(1)
DBZ (SOT-23)
3 PINS
292.9
124.4
89
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
11.4
ψJB
87.6
RθJC(bot)
—
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Electrical Characteristics
at TA = 25°C, ILOAD = 0 mA, and VIN = 5 V (unless otherwise noted)
PARAMETER
REF3312-Q1(1) — 1.25 V
Output voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1.2475
–0.2%
1.25
1.2525
0.2%
V
VOUT
Initial accuracy
f = 0.1 Hz to 10 Hz
f = 10 Hz to 10 kHz
17
24
μVPP
Output voltage noise
μVRMS
(1) Minimum supply voltage for the REF3112 is 1.8 V.
4
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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SBVS299 –APRIL 2017
Electrical Characteristics (continued)
at TA = 25°C, ILOAD = 0 mA, and VIN = 5 V (unless otherwise noted)
PARAMETER
REF3120-Q1 — 2.048 V
Output voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.0439
–0.2%
2.048
2.0521
0.2%
V
VOUT
Initial accuracy
f = 0.1 Hz to 10 Hz
f = 10 Hz to 10 kHz
27
39
μVPP
Output voltage noise
μVRMS
REF3125-Q1 — 2.5 V
Output voltage
2.495
2.5
2.505
0.2%
V
VOUT
Initial accuracy
–0.2%
f = 0.1 Hz to 10 Hz
f = 1 0Hz to 10 kHz
33
48
μVPP
Output voltage noise
μVRMS
REF3130-Q1 — 3 V
Output voltage
2.994
3
3.006
0.2%
V
VOUT
Initial accuracy
–0.2%
f = 0.1 Hz to 10 Hz
f = 10 Hz to 10 kHz
39
57
μVPP
Output voltage noise
μVRMS
REF3133-Q1 — 3.3 V
Output voltage
3.2934
–0.2%
3.3
3.3066
0.2%
V
VOUT
Initial accuracy
f = 0.1 Hz to 10 Hz
f = 10 Hz to 10 kHz
43
63
μVPP
Output voltage noise
μVRMS
REF3140-Q1 — 4.096 V
Output voltage
4.0878
–0.2%
4.096
4.1042
0.2%
V
VOUT
Initial accuracy
f = 0.1 Hz to 10 Hz
f = 10 Hz to 10 kHz
53
78
μVPP
Output voltage noise
μVRMS
REF31xx-Q1 (REF3112-Q1, REF3120-Q1, REF3125-Q1, REF3130-Q1, REF3133-Q1, REF3140-Q1)
TA = 0°C to 70°C.
5
10
70
20
10
20
100
25
5
15
20
dVOUT/dT
Output voltage temperature drift(2)
ppm/°C
TA = –40°C to +125°C .
Long-term stability
Line regulation
Sourcing
0 to 1000 hours
VREF + 0.05(1) ≤ VIN ≤ 5.5 V
0 mA < ILOAD < 10 mA, VIN = VREF + 250 mV(1)
–10 mA < ILOAD < 0 mA, VIN = VREF + 100 mV(1)
ppm
65
30
50
ppm/V
dVOUT/dILOAD Load regulation(3)
µV/mA
ppm
Sinking
First Cycle
Thermal
dT
hysteresis(4)
Additional Cycles
VIN – VOUT
ILOAD
Dropout voltage(1)
Output current
TA = –40°C to +125°C.
50
10
mV
mA
–10
Sourcing
Sinking
50
40
ISC
Short-circuit current
Turnon settling time
mA
µs
To 0.1% at VIN = +5 V with CL = 0 μF
400
POWER SUPPLY
VS
Voltage
ILOAD = 0, TA = –40°C to +125°C.
ILOAD = 0, TA = 25°C
VREF + 0.05(1)
5.5
115
135
V
100
115
IQ
Quiescent current
µA
ILOAD = 0, TA = –40°C to +125°C
(2) Box Method used to determine temperature drift.
(3) Typical value of load regulation reflects measurements using force and sense contacts; see Load Regulation.
(4) Thermal hysteresis is explained in more detail in Application and Implementation of this data sheet.
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
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7.6 Typical Characteristics
At TA = 25°C, VIN = 5-V power supply, and REF3125-Q1 is used for typical characteristic measurements, unless otherwise
noted.
25
20
15
10
5
18
16
14
12
10
8
6
4
2
0
0
0
1
2
3
4
5
6
8
9
10 11 12 13 14 15 16
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Drift (ppm/°C)
Drift (ppm/°C)
0°C to 70°C
Figure 1. Temperature Drift
–40°C to +125°C
Figure 2. Temperature Drift
120
100
80
60
40
20
0
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-0.02
-0.04
-60 -40 -20
0
20
40
60
80 100 120 140
-15
-10
-5
0
5
10
15
Temperature (°C)
Load Current (mA)
Figure 3. Output Voltage vs Temperature
Figure 4. Dropout Voltage vs Load Current
120
100
80
60
40
20
0
100
10
1
0.1
0.01
-60 -40 -20
0
20
40
60
80 100 120 140
1
10
100
1k
10k
100k
1M
Temperature (°C)
Frequency (Hz)
Figure 5. Quiescent Current vs Temperature
Figure 6. Output Impedance vs Frequency
6
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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SBVS299 –APRIL 2017
Typical Characteristics (continued)
At TA = 25°C, VIN = 5-V power supply, and REF3125-Q1 is used for typical characteristic measurements, unless otherwise
noted.
90
80
70
60
50
40
30
20
10
0
2.505
2.504
2.503
2.502
2.501
2.500
2.499
2.498
+125°C
+25°C
-40°C
1
10
100
1k
10k
100k
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0 6.5
Frequency (Hz)
Supply (V)
Figure 7. PSRR vs Frequency
Figure 8. Output vs Supply
2.505
2.504
2.503
2.502
2.501
2.500
2.499
2.498
2.497
+125°C
VIN
+25°C
-40°C
VOUT
-15
-10
-5
0
5
10
15
100ms/div
Load Current (mA)
CL = 0 μF
5-V Start-Up
Figure 10. Step Response
Figure 9. Output Voltage vs Load Current
20
0
-20
-40
-60
-80
-100
-120
0
100 200 300 400 500 600 700 800 900 1000
Time (Hrs)
400ms/div
Figure 12. REF3112 Long-Term Stability
Figure 11. 0.1-Hz to 10-Hz Noise
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
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Typical Characteristics (continued)
At TA = 25°C, VIN = 5-V power supply, and REF3125-Q1 is used for typical characteristic measurements, unless otherwise
noted.
VIN
VIN
VOUT
VOUT
20ms/div
100ms/div
CL = 0 pF
CL = 10 μF
Figure 13. Line Transient
Figure 14. Line Transient
ILOAD
ILOAD
+10mA
+10mA
+10mA
+10mA
-10mA
-10mA
VOUT
VOUT
40ms/div
40ms/div
CL = 0 pF
±10-mA Output Pulse
CL = 1 µF
±10-mA Output Pulse
Figure 15. Load Transient
Figure 16. Load Transient
VIN
VIN
+1mA
+1mA
+1mA
+1mA
-1mA
-1mA
VOUT
VOUT
40ms/div
40ms/div
CL = 1 µF
±1-mA Output Pulse
CL = 0 pF
±1-mA Output Pulse
Figure 18. Load Transient
Figure 17. Load Transient
8
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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SBVS299 –APRIL 2017
Typical Characteristics (continued)
At TA = 25°C, VIN = 5-V power supply, and REF3125-Q1 is used for typical characteristic measurements, unless otherwise
noted.
300
250
200
150
100
50
6
5
4
3
2
1
0
0
0
10
20
30
40
50
60
70
80
90 100
Time (ms)
G001
Figure 19. REF3125-Q1 Start-Up
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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8 Detailed Description
8.1 Overview
The REF31xx-Q1 is a family of series, CMOS, precision bandgap voltage references. The basic bandgap
topology is shown in Functional Block Diagram. Transistors Q1 and Q2 are biased such that the current density of
Q1 is greater than that of Q2. The difference of the two base-emitter voltages, Vbe1 – Vbe2, has a positive
temperature coefficient and is forced across resistor R1. This voltage is gained up and added to the base-emitter
voltage of Q2, which has a negative temperature coefficient. The resulting output voltage is virtually independent
of temperature. The curvature of the bandgap voltage, as shown in Figure 3, is due to the slightly nonlinear
temperature coefficient of the base-emitter voltage of Q2.
8.2 Functional Block Diagram
VBANDGAP
R1
+
+
Vbe1 Vbe2
-
-
Q1
I
N Q2
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8.3 Feature Description
8.3.1 Supply Voltage
The REF31xx-Q1 family of references features an extremely low dropout voltage. With the exception of the
REF3112, which has a minimum supply requirement of 1.8 V, these references can be operated with a supply of
only 5 mV above the output voltage in an unloaded condition. For loaded conditions, a typical dropout voltage
versus load is shown in Typical Characteristics.
The REF31xx-Q1 features a low quiescent current that is extremely stable over changes in both temperature and
supply. The typical room temperature quiescent current is 100 μA, and the maximum quiescent current over
temperature is just 135 μA. The quiescent current typically changes less than 2 μA over the entire supply range,
as shown in Figure 20.
QUIESCENT CURRENT vs POWER SUPPLY
100.5
100.0
99.5
99.0
98.5
98.0
1.5
2.5
3.5
4.5
5.5
Power Supply (V)
Figure 20. Supply Current vs Supply Voltage
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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SBVS299 –APRIL 2017
Feature Description (continued)
Supply voltages below the specified levels can cause the REF31xx-Q1 to momentarily draw currents greater
than the typical quiescent current. This can be prevented by using a power supply with a fast rising edge and low
output impedance.
8.3.2 Thermal Hysteresis
Thermal hysteresis for the REF31xx-Q1 is defined as the change in output voltage after operating the device at
25°C, cycling the device through the specified temperature range, and returning to 25°C. It can be expressed as:
abs|VPRE - VPOST
|
x 106 (ppm)
VHYST
=
VNOM
Where:
VHYST = Thermal hysteresis.
VPRE = Output voltage measured at 25°C pretemperature cycling.
VPOST = Output voltage measured after the device has been cycled through the specified temperature
range of –40°C to +125°C and returned to 25°C.
8.3.3 Temperature Drift
(1)
The REF31xx-Q1 is designed to exhibit minimal drift error, defined as the change in output voltage over varying
temperature. The drift is calculated using the box method, which is described in Equation 2:
æ
ç
è
ö
÷
ø
VOUTMAX - VOUTMIN
Drift =
x 106 (ppm)
VOUT x Temperature Range
(2)
The REF31xx-Q1 features a typical drift coefficient of 5 ppm from 0°C to 70°C, the primary temperature range for
many applications. For the industrial temperature range of –40°C to +125°C, the REF31xx-Q1 family drift
increases to a typical value of 10 ppm.
8.3.4 Noise Performance
Typical 0.1-Hz to 10-Hz voltage noise can be seen in Figure 21. The noise voltage of the REF31xx-Q1 increases
with output voltage and operating temperature. Additional filtering may be used to improve output noise levels,
although take care to ensure the output impedance does not degrade the AC performance.
400ms/div
Figure 21. 0.1-Hz to 10-Hz Noise
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REF3130-Q1, REF3133-Q1, REF3140-Q1
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Feature Description (continued)
8.3.5 Long-Term Stability
Long-term stability refers to the change of the output voltage of a reference over a period of months or years.
This effect lessens as time progresses, as is shown by the long-term stability curves. The typical drift value for
the REF31xx-Q1 is 70 ppm from 0 to 1000 hours. This parameter is characterized by measuring 30 units at
regular intervals for a period of 1000 hours.
20
0
-20
-40
-60
-80
-100
-120
0
100 200 300 400 500 600 700 800 900 1000
Time (Hrs)
Figure 22. REF3112 Long-Term Stability
8.3.6 Load Regulation
Load regulation is defined as the change in output voltage due to changes in load current. The load regulation of
the REF31xx-Q1 is measured using force and sense contacts as pictured in Figure 23. The force and sense lines
reduce the impact of contact and trace resistance, resulting in accurate measurement of the load regulation
contributed solely by the REF31xx-Q1. For applications requiring improved load regulation, force and sense lines
must be used.
Output Pin
Contact and
Trace Resistance
+
VOUT
-
Force Line
IL
Sense Line
Load
Meter
Copyright © 2016, Texas Instruments Incorporated
Figure 23. Accurate Load Regulation of REF31xx-Q1
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
www.ti.com
SBVS299 –APRIL 2017
8.4 Device Functional Modes
8.4.1 Negative Reference Voltage
For applications requiring a negative and positive reference voltage, the REF31xx-Q1 and OPA703 can be used
to provide a dual-supply reference from a ±5-V supply. Figure 24 shows the REF3125-Q1 used to provide a
±2.5-V supply reference voltage. The low drift performance of the REF31xx-Q1 complements the low offset
voltage and low drift of the OPA703 to provide an accurate solution for split-supply applications.
+5V
+2.5V
REF3125-Q1
10kW
10kW
+5V
-2.5V
OPA703
-5V
Copyright © 2016, Texas Instruments Incorporated
Figure 24. REF3125-Q1 Combined With OPA703 to Create Positive and Negative Reference Voltages
8.4.2 Data Acquisition
Data acquisition systems often require stable voltage references to maintain accuracy. The REF31xx-Q1 family
features stability and a wide range of voltages suitable for most microcontrollers and data converters. Figure 25,
Figure 26, and Figure 27 show basic data acquisition systems.
3.3V
REF3133-Q1
V+
5W
GND
+
1mF to
10mF
VS
ADS7822
VREF
VCC
+
1mF to 10mF
0.1mF
Microcontroller
+In
CS
DOUT
VIN
-In
GND
DCLOCK
Copyright © 2016, Texas Instruments Incorporated
Figure 25. Basic Data Acquisition System 1
Copyright © 2017, Texas Instruments Incorporated
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
www.ti.com
2.5V Supply
5W
2.5V
VIN
+
1mF to 10mF
VS
ADS8324
VREF
VOUT = 1.25V
REF3112-Q1
VCC
+
0.1mF
1mF to 10mF
Microcontroller
+In
CS
DOUT
GND
0V to 1.25V
-In
GND
DCLOCK
Copyright © 2016, Texas Instruments Incorporated
Figure 26. Basic Data Acquisition System 2
5V
REF3140-Q1
0.1mF
1mF
VOUT = 4.096V
1kW
10W
22mF
+5V
1kW
VREF
VIN
10W
THS4031
ADS8381
6800pF
0.22mF
500W
-5V
Copyright © 2016, Texas Instruments Incorporated
Figure 27. REF3140-Q1 Provides an Accurate Reference for Driving the ADS8381
14
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
www.ti.com
SBVS299 –APRIL 2017
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The REF31xx-Q1 does not require a load capacitor and is stable with any capacitive load. Figure 28 shows
typical connections required for operation of the REF31xx-Q1. TI recommends a supply bypass capacitor of
0.47 μF.
VIN
1
0.47mF
3
REF31xx-Q1
VOUT
2
Copyright © 2016, Texas Instruments Incorporated
Figure 28. Typical Connections for Operating REF31xx-Q1
9.2 Typical Application
Figure 29 shows a low-power reference and conditioning circuit. This circuit attenuates and level-shifts a bipolar
input voltage within the proper input range of a single-supply, low-power, 16-bit ΔΣ ADC, such as the one inside
the MSP430™ or other similar single-supply ADCs. Precision reference circuits are used to level-shift the input
signal, provide the ADC reference voltage, and to create a well-regulated supply voltage for the low-power
analog circuitry. A low-power, zero-drift, op-amp circuit is used to attenuate and level-shift the input signal.
REF3130-Q1
3.0 V
3.3 V
IN OUT
1.25 V
R2
20 kO
R3
MSP430F2013
Launchpad
R1
100 kO
20 kO
+
3.3 V
3.0 V
VOUT
+
J1.2/A1+
OPA317
+
–
IN+
IN–
SD_16
VIN
SA-ADC
5 V
J1.3/A1–
R4
R5
–
10 kO
100 kO
REF3112-Q1
3.0 V
1.25 V
J1.5/VREF
IN OUT
R6
0.625 V
47 kO
R7
C2
47 kO
47 µF
Copyright © 2016, Texas Instruments Incorporated
Figure 29. Low-Power Reference and Bipolar Voltage Conditioning Circuit for Low-Power ADCs
Copyright © 2017, Texas Instruments Incorporated
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
www.ti.com
Typical Application (continued)
9.2.1 Design Requirements
For typical REF31xx-Q1 applications, use these parameters:
•
•
•
•
Supply voltage: 3.3 V
Maximum input voltage: ±6 V
Specified input voltage: ±5 V
ADC reference voltage: 1.25 V
The goal for this design is to accurately condition a ±5-V bipolar input voltage into a voltage suitable for
conversion by a low-voltage ADC with a 1.25-V reference voltage, VREF, and an input voltage range of VREF / 2.
The circuit must function with reduced performance over a wider input range of at least ±6 V to protect from
overvoltage conditions.
9.2.2 Detailed Design Procedure
Figure 29 depicts a simplified schematic for this design showing the MSP430 ADC inputs and full input
conditioning circuitry. The ADC is configured for a bipolar measurement where final conversion result is the
differential voltage between the voltage at the positive and negative ADC inputs. The bipolar, GND-referenced
input signal must be level-shifted and attenuated by the operational amplifier so that the output is biased to
VREF/2 and has a differential voltage that is within the ±VREF/2 input range of the ADC.
9.2.3 Application Curves
1.25
1.00
0.75
0.50
0.25
0.00
0.0006
0.0005
0.0004
0.0003
0.0002
0.0001
0.0000
0
1
2
3
4
5
6
œ6 œ5 œ4 œ3 œ2 œ1
0
1
2
3
4
5
6
œ6 œ5 œ4 œ3 œ2 œ1
Input Voltage (V)
Input Voltage (V)
C001
C002
Figure 30. OPA317 Output Voltage vs Input Voltage
Figure 31. OPA317 Output Voltage Error vs Input Voltage
2000
1500
1000
500
0
œ500
œ1000
œ1500
œ2000
0
1
2
3
4
5
6
œ6 œ5 œ4 œ3 œ2 œ1
Input Voltage (V)
C003
Figure 32. Output Code Error vs Input Voltage
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
www.ti.com
SBVS299 –APRIL 2017
10 Power Supply Recommendations
The REF31xx-Q1 family of references features an extremely low dropout voltage. With the exception of the
REF3112, which has a minimum supply requirement of 1.8 V, these references can be operated with a supply of
only 5 mV above the output voltage in an unloaded condition. For loaded conditions see Figure 4. TI
recommends a supply bypass capacitor greater than 0.47 μF.
11 Layout
11.1 Layout Guidelines
Figure 33 shows an example of a printed-circuit board (PCB) layout using the REF31xx-Q1. Some key
considerations are:
•
•
•
•
Connect low-ESR, 0.1-μF ceramic bypass capacitors at VIN of the REF31xx-Q1.
Decouple other active devices in the system per the device specifications.
Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup.
Place the external components as close as possible to the device. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring.
•
•
Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise
pickup.
Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when absolutely necessary.
11.2 Layout Example
IN
OUT
To Input Power Supply
C
C
REF31xx-Q1
GND
Via to Ground Plane
Figure 33. Layout Example
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
SBVS299 –APRIL 2017
www.ti.com
12 Device and Documentation Support
12.1 Device Support
For device support, see the following:
Voltage References Forum
12.2 Related Links
Table 1 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
REF3112-Q1
REF3120-Q1
REF3125-Q1
REF3130-Q1
REF3133-Q1
REF3140-Q1
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates — go to the product folder for your device on ti.com. In the
upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information
that has changed (if any). For change details, check the revision history of any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
MSP430, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
www.ti.com
SBVS299 –APRIL 2017
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2017, Texas Instruments Incorporated
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Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
REF3112AQDBZRQ1
REF3120AQDBZRQ1
REF3125AQDBZRQ1
REF3130AQDBZRQ1
REF3133AQDBZRQ1
REF3140AQDBZRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
NIPDAUAG
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
(31AQ, R31A)
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
NIPDAUAG
31BQ
31CQ
31EQ
(31FQ, R31A)
31DQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
REF3112AQDBZRQ1
REF3120AQDBZRQ1
REF3125AQDBZRQ1
REF3130AQDBZRQ1
REF3133AQDBZRQ1
REF3140AQDBZRQ1
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000
3000
3000
3000
3000
3000
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
3.15
3.15
3.15
3.15
3.15
3.15
2.77
2.77
2.77
2.77
2.77
2.77
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
REF3112AQDBZRQ1
REF3120AQDBZRQ1
REF3125AQDBZRQ1
REF3130AQDBZRQ1
REF3133AQDBZRQ1
REF3140AQDBZRQ1
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000
3000
3000
3000
3000
3000
213.0
213.0
213.0
213.0
213.0
213.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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