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PTH04T231WAST [TI]

6-A, 2.2-V to 5.5-V INPUT, NON-ISOLATED, WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans; 6 -A ， 2.2 V至5.5 V输入，非隔离，宽输出，可调电源采用TurboTrans模块
PTH04T231WAST
型号： PTH04T231WAST
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

6-A, 2.2-V to 5.5-V INPUT, NON-ISOLATED, WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans
6 -A ， 2.2 V至5.5 V输入，非隔离，宽输出，可调电源采用TurboTrans模块

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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
6-A, 2.2-V to 5.5-V INPUT, NON-ISOLATED,  
WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans™  
FEATURES  
•
•
•
•
•
•
Up to 6-A Output Current  
•
•
TurboTrans™ Technology  
2.2-V to 5.5-V Input Voltage  
Designed to meet Ultra-Fast Transient  
Requirements up to 300 A/µs  
Wide-Output Voltage Adjust (0.69 V to 3.6 V)  
±1.5% Total Output Voltage Variation  
Efficiencies up to 96%  
•
SmartSync Technology  
APPLICATIONS  
Output Overcurrent Protection  
(Nonlatching, Auto-Reset)  
•
•
•
Complex Multi-Voltage Systems  
Microprocessors  
Bus Drivers  
•
•
Operating Temperature: –40°C to 85°C  
Safety Agency Approvals: (Pending)  
– UL60950, CSA 22.2 950, EN60950 VDE  
Prebias Startup  
•
•
•
•
•
•
On/Off Inhibit  
Differential Output Voltage Remote Sense  
Adjustable Undervoltage Lockout  
Auto-Track™ Sequencing  
Ceramic Capacitor Version (PTH04T231W)  
DESCRIPTION  
The PTH04T230/231W is a high-performance, 6-A rated, non-isolated power module. This regulator represents  
the 2nd generation of the PTH series of power modules which include a reduced footprint and improved  
features. The PTH04T231W is optimized to be used in applications requiring all ceramic capacitors.  
Operating from an input voltage range of 2.2 V to 5.5 V, the PTH04T230/231W requires a single resistor to set  
the output voltage to any value over the range, 0.69 V to 3.6 V. The wide input voltage range makes the  
PTH04T230/231W particularly suitable for advanced computing and server applications that use a 2.5-V, 3.3-V  
or 5-V intermediate bus architecture.  
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdown  
protects against most load faults. A differential remote sense ensures tight load regulation. An adjustable  
under-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™ sequencing is a  
popular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in a  
power system.  
The PTH04T230/231W includes new patent pending technologies, TurboTrans™ and SmartSync. The  
TurboTrans feature optimizes the transient response of the regulator while simultaneously reducing the quantity  
of external output capacitors required to meet a target voltage deviation specification. Additionally, for a target  
output capacitor bank, TurboTrans can be used to significantly improve the regulators transient response by  
reducing the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiple  
modules, thus simplifying EMI noise suppression tasks and reduces input capacitor RMS current requirements.  
Double-sided surface mount construction provides a low profile and compact footprint. Package options include  
both through-hole and surface mount configurations that are lead (Pb) - free and RoHS compatible.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
TurboTrans, TMS320 are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
PTH04T230W  
SmartSync  
TurboTransE  
Track  
R
1%  
TT  
9
1
8
0.05 W  
(Optional)  
Track  
SYNC  
TT  
V
I
2
5
4
6
+Sense  
Vo  
+Sense  
V
I
PTH04T230W  
Vo  
Inhibit  
10  
INH/UVLO  
GND  
−Sense  
VoAdj  
L
O
A
D
+
3
7
C
C
+
O1  
O2  
R
1%  
0.05 W  
(Required)  
(Note A)  
SET  
100 µF  
Ceramic  
150 µF  
Non−Ceramic  
(Required)  
(Required)  
C
R
UVLO  
I
−Sense  
330 µF  
1%  
0.05 W  
(Optional)  
(Required)  
(Note B)  
GND  
GND  
UDG−06046  
A. RSET required to set the output voltage to a value higher than 0.69 V. See the Electrical Characteristics table.  
B. An additional 22-µF ceramic input capacitor is recommended to reduce RMS ripple current.  
PTH04T231W - Ceramic Capacitor Version  
SmartSync  
TurboTransE  
Track  
R
1%  
TT  
9
1
8
0.05 W  
(Optional)  
Track  
SYNC  
TT  
V
I
2
5
4
6
+Sense  
+Sense  
V
I
Vo  
PTH04T231W  
Vo  
Inhibit  
10  
INH/UVLO  
GND  
−Sense  
VoAdj  
L
O
A
D
3
7
R
1%  
0.05 W  
(Required)  
(Note A)  
SET  
C
O
300 µF  
Ceramic  
(Required)  
C
I
R
UVLO  
−Sense  
GND  
300 µF  
1%  
(Required)  
0.05 W  
(Optional)  
GND  
2
Submit Documentation Feedback  
PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
ORDERING INFORMATION  
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see  
the TI website at www.ti.com.  
DATASHEET TABLE OF CONTENTS  
DATASHEET SECTION  
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS TABLE (PTH04T230W)  
ELECTRICAL CHARACTERISTICS TABLE (PTH04T231W)  
PIN-OUT AND TERMINAL FUNCTIONS  
TYPICAL CHARACTERISTICS (VI = 5V)  
TYPICAL CHARACTERISTICS (VI = 3.3V)  
ADJUSTING THE OUTPUT VOLTAGE  
CAPACITOR RECOMMENDATIONS  
TURBOTRANS™ INFORMATION  
PAGE NUMBER  
3
4
6
8
9
10  
11  
13  
17  
22  
23  
23  
24  
24  
25  
25  
26  
28  
30  
UNDERVOLTAGE LOCKOUT (UVLO)  
SOFT-START POWER-UP  
REMOTE SENSE  
OUTPUT ON/OFF INHIBIT  
OVER-CURRENT PROTECTION  
OVER-TEMPERATURE PROTECTION  
SYCHRONIZATION (SMARTSYNC)  
AUTO-TRACK SEQUENCING  
PREBIAS START-UP  
TAPE & REEL AND TRAY DRAWINGS  
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS  
(Voltages are with respect to GND)  
UNIT  
VTrack Track pin voltage  
–0.3 to VI + 0.3  
–40 to 85  
V
TA  
Operating temperature range Over VI range  
Surface temperature of module body or pins  
(5 seconds maximum)  
Twave Wave soldering temperature  
Treflow Solder reflow temperature  
AH and AD suffix  
260  
°C  
AS suffix  
AZ suffix  
235(1)  
260(1)  
–40 to 125(2)  
500  
Surface temperature of module body or pins  
Tstg  
Storage temperature  
Mechanical shock  
Suffix AH and AD  
Suffix AS and AZ  
Suffix AH and AD  
Suffix AS and AZ  
Per Mil-STD-883D, Method 2002.3 1 msec,  
1/2 sine, mounted  
250  
G
20  
Mechanical vibration  
Mil-STD-883D, Method 2007.2 20-2000 Hz  
15  
Weight  
2.7  
grams  
Flammability  
Meets UL94V-O  
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the  
stated maximum.  
(2) The shipping tray or tape & reel cannot be used to bake parts at temperatures higher than 65°C.  
3
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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
ELECTRICAL CHARACTERISTICS  
PTH04T230W  
TA =25°C, VI = 5 V, VO = 3.3 V, CI = 330 µF, CO1 = 100 µF ceramic, CO2 = 150 µF non-ceramic, and IO = IO max (unless  
otherwise stated)  
PARAMETER  
TEST CONDITIONS  
PTH04T230W  
UNIT  
MIN  
TYP  
MAX  
6
IO  
VI  
Output current  
Over VO range  
Over IO range  
Over IO range  
25°C, natural convection  
0
2.2  
A
V
0.69 ≤ VO≤ 1.7  
1.7 < VO≤ 3.6  
5.5  
5.5  
Input voltage range  
VO+0.5(1)  
0.69  
Output adjust range  
Set-point voltage tolerance  
Temperature variation  
Line regulaltion  
3.6  
V
(2)  
±0.5  
±0.3  
±2  
±1.0  
%Vo  
%Vo  
mV  
–40°C < TA < 85°C  
VO  
Over VI range  
Load regulation  
Over IO range  
±2  
mV  
(2)  
Total output variation  
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C  
±1.5  
%VO  
RSET = 1.21 kΩ, VO = 3.3 V  
RSET = 2.38 kΩ, VO = 2.5 V  
RSET = 4.78 kΩ, VO = 1.8 V  
RSET = 7.09 kΩ, VO = 1.5 V  
RSET = 12.1 kΩ, VO = 1.2 V  
RSET = 20.8 kΩ, VO = 1.0 V  
RSET = 689 kΩ, VO = 0.7 V  
94%  
92%  
90%  
89%  
87%  
85%  
81%  
1
η
Efficiency  
IO = 6 A  
VO Ripple (peak-to-peak)  
Overcurrent threshold  
20-MHz bandwidth  
%VO  
A
ILIM  
Reset, followed by auto-recovery  
w/o TurboTrans  
10  
Recovery Time  
VO Overshoot  
100  
µSec  
CO1 = 100 µF, ceramic  
CO2 = 150 µF,  
non-ceramic  
100  
mV  
2.5 A/µs load step  
50% to 100% IOmax  
VI = 3.3 V  
(3)  
w/o TurboTrans  
Recovery Time  
VO Overshoot  
Recovery Time  
120  
60  
µSec  
mV  
Transient response  
CO1 = 100 µF, ceramic  
CO2 = 990 µF, Type B  
VO = 2.5 V  
with TurboTrans  
180  
µSec  
CO1 = 100 µF, ceramic  
CO2 = 990 µF, Type B  
RTT = 1.54 kΩ  
VO Overshoot  
35  
mV  
(4)  
IIL  
Track input current (pin 9)  
Pin to GND  
-130  
µA  
dVtrack/dt Track slew rate capability  
CO ≤ CO (max)  
1
V/ms  
VI increasing, RUVLO = OPEN  
VI decreasing, RUVLO = OPEN  
Hysteresis, RUVLO≤ 52.3 kΩ  
1.95  
1.5  
2.19  
Adjustable Under-voltage lockout  
UVLOADJ  
(pin 10)  
1.3  
V
0.5  
Input high voltage (VIH  
)
Open(5)  
0.6  
V
Inhibit control (pin 10)  
Input low voltage (VIL)  
-0.2  
Input low current (IIL), Pin 10 to GND  
125  
5
µA  
mA  
kHz  
kHz  
V
Iin  
Input standby current  
Inhibit (pin 10) to GND, Track (pin 9) open  
Over VI and IO ranges, SmartSync (pin 1) to GND  
f s  
Switching frequency  
300  
fSYNC  
VSYNCH  
VSYNCL  
tSYNC  
Synchronization (SYNC) frequency  
SYNC High-Level Input Voltage  
SYNC Low-Level Input Voltage  
SYNC Minimum Pulse Width  
240  
2
400  
5.5  
0.8  
V
200  
nSec  
(1) The minimum input voltage is 2.2 V or (VO + 0.5) V, whichever is greater.  
(2) The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a  
tolerance of 1% with 200 ppm/°C or better temperature stability.  
(3) Without TurboTrans, the minimum ESR limit of 7 mΩ must not be violated.  
(4) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. The  
open-circuit voltage is less than VI.  
(5) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when  
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. The open-circuit voltage is less than 3.5  
Vdc. For additional information, see the related application information section.  
4
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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
ELECTRICAL CHARACTERISTICS (continued)  
PTH04T230W  
TA =25°C, VI = 5 V, VO = 3.3 V, CI = 330 µF, CO1 = 100 µF ceramic, CO2 = 150 µF non-ceramic, and IO = IO max (unless  
otherwise stated)  
PARAMETER  
TEST CONDITIONS  
PTH04T230W  
MIN TYP  
UNIT  
MAX  
(6)  
(7)  
(7)  
CI  
External input capacitance  
330  
150  
100  
µF  
µF  
(8)  
Nonceramic  
Ceramic  
5000  
Capacitance value  
without  
TurboTrans  
500  
Equivalent series resistance (non-ceramic)  
Capacitance value  
7
mΩ  
µF  
CO  
External output capacitance  
see table  
5,000  
with  
(9)  
(10)  
Turbotrans  
Capacitance × ESR product (CO× ESR)  
1000  
5.3  
10,000 µF×mΩ  
Per Telcordia SR-332, 50% stress,  
TA = 40°C, ground benign  
106 Hr  
MTBF  
Reliability  
(6) A 330 µF input capacitor is required for proper operation. The capacitor must be rated for a minimum of 400 mA rms of ripple current.  
An additional 22-µF ceramic input capacitor is recommended to reduce rms ripple current.  
(7) 100 µF ceramic and 150 µF non-ceramic external output capacitance is required for basic operation. The minimum output capacitance  
requirement increases when TurboTrans™ (TT) technology is used. See the Application Information for more guidance.  
(8) This is the calculated maximum disregarding TurboTrans™ technology. When the TurboTrans feature is used, the minimum output  
capacitance must be increased. See the TurboTrans application notes for further guidance.  
(9) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESR  
capacitors are required for proper operation. See the TurboTrans application notes for further guidance.  
(10) This is the calaculated maximum when using the TurboTrans feature. Additionally, low ESR capacitors are required for proper operation.  
See the TurboTrans application notes for further guidance.  
5
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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
ELECTRICAL CHARACTERISTICS  
PTH04T231W (Ceramic Capacitors)  
TA = 25°C, VI = 5 V, VO = 3.3 V, CI = 300 µF ceramic, CO = 300 µF ceramic, and IO = IO max (unless otherwise stated)  
PARAMETER  
TEST CONDITIONS  
PTH04T231W  
UNIT  
MIN  
TYP  
MAX  
6
IO  
Output current  
Over VO range  
Over IO range  
Over IO range  
25°C, natural convection  
0
A
V
0.69 ≤ VO≤ 1.7  
2.2  
5.5  
5.5  
3.6  
VI  
Input voltage range  
1.7 < VO≤ 3.6 VO+0.5(1)  
VOADJ  
Output voltage adjust range  
Set-point voltage tolerance  
Temperature variation  
Line regulaltion  
0.69  
V
(2)  
±0.5  
±0.3  
±2  
±1  
%Vo  
%Vo  
mV  
–40°C < TA < 85°C  
Over VI range  
VO  
Load regulation  
Over IO range  
±2  
mV  
(2)  
Total output variation  
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C  
RSET = 1.21 kΩ, VO = 3.3 V  
±1.5  
%Vo  
94%  
92%  
90%  
89%  
87%  
85%  
81%  
1
RSET = 2.38 kΩ, VO = 2.5 V  
RSET = 4.78 kΩ, VO = 1.8 V  
η
Efficiency  
IO = 6 A  
RSET = 7.09 kΩ, VO = 1.5 V  
RSET = 12.1 kΩ, VO = 1.2 V  
RSET = 20.8 kΩ, VO = 1.0 V  
RSET = 689 kΩ, VO = 0.7 V  
VO Ripple (peak-to-peak)  
Overcurrent threshold  
20-MHz bandwidth  
%VO  
A
ILIM  
Reset, followed by auto-recovery  
10  
Recovery time  
100  
70  
µs  
w/o TurboTrans  
CO= 300 µF, Type A  
VO over/undershoot  
mV  
µs  
2.5 A/µs load step  
w/o TurboTrans  
Recovery time  
VO over/undershoot  
Recovery time  
100  
50 to 100% IOmax  
VI = 3.3 V  
VO = 2.5 V  
CO= 800 µF, Type A  
RTT = open  
Transient response  
mV  
55  
150  
35  
w/ TurboTrans  
CO= 800 µF, Type A  
RTT = 11.3 kΩ  
µs  
mV  
VO over/undershoot  
IIL  
Track input current (pin 9)  
Pin to GND  
–130(3)  
1
µA  
dVtrack/dt Track slew rate capability  
CO ≤ CO (max)  
V/ms  
VI increasing, RUVLO = OPEN  
Vi decreasing, RUVLO = OPEN  
Hysteresis, RUVLO = OPEN  
1.95  
1.5  
2.19  
Adjustable Under-voltage lockout  
UVLOADJ  
(pin 10)  
1.3  
V
0.5  
Input high voltage (VIH  
)
Open(4)  
0.8  
V
Inhibit control (pin 10)  
Input low voltage (VIL)  
-0.2  
Input low current (IIL ), Pin 10 to GND  
-235  
5
µA  
mA  
kHz  
Iin  
Input standby current  
Switching frequency  
Inhibit (pin 10) to GND, Track (pin 9) open  
Over VI and IO ranges, SmartSync (pin 1) to GND  
f s  
300  
Synchronization (SYNC)  
frequency  
fSYNC  
240  
2
400  
kHz  
VSYNCH  
VSYNCL  
tSYNC  
CI  
SYNC High-Level Input Voltage  
SYNC Low-Level Input Voltage  
SYNC Minimum Pulse Width  
External input capacitance  
5.5  
0.8  
V
V
200  
nSec  
µF  
(5)  
Ceramic  
300  
(1) The minimum input voltage is 2.2 V or (VO + 0.5) V, whichever is greater.  
(2) The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a  
tolerance of 1% with 100 ppm/°C or better temperature stability. .  
(3) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. The  
open-circuit voltage is less than VI.  
(4) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when  
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. The open-circuit voltage is less than 3.5  
Vdc. For additional information, see the related application note.  
(5) 300 µF of ceramic input capacitance is required for proper operation.  
6
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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
ELECTRICAL CHARACTERISTICS (continued)  
PTH04T231W (Ceramic Capacitors)  
TA = 25°C, VI = 5 V, VO = 3.3 V, CI = 300 µF ceramic, CO = 300 µF ceramic, and IO = IO max (unless otherwise stated)  
PARAMETER  
TEST CONDITIONS  
PTH04T231W  
MIN TYP  
UNIT  
MAX  
(6)  
(7)  
w/o TurboTrans  
w/ TurboTrans  
Capacitance Value  
Ceramic  
300  
5000  
µF  
µF  
see table  
CO  
External output capacitance  
Reliability  
Capacitance Value  
5000  
(6)  
Capacitance × ESR product (CO× ESR)  
100  
5.3  
1000 µF×mΩ  
Per Telcordia SR-332, 50% stress,  
TA = 40°C, ground benign  
106 Hr  
MTBF  
(6) 300 µF of ceramic output capacitance is required for basic operation. The minimum output capacitance requirement increases when  
TurboTrans™ (TT) technology is utilized. Additionally, low ESR capacitors are required for proper operation. See related Application  
Information for more guidance.  
(7) This is the calculated maximum disregarding TurboTrans™ technology.  
7
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PTH04T230W, PTH04T231W  
www.ti.com  
SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
PTH04T230/231W  
(TOP VIEW)  
1
2
10  
9
8
7
6
5
3
4
TERMINAL FUNCTIONS  
TERMINAL  
DESCRIPTION  
NAME  
VI  
NO.  
2
The positive input voltage power node to the module, which is referenced to common GND.  
The regulated positive power output with respect to the GND.  
VO  
4
This is the common ground connection for the VI and VO power connections. It is also the 0 Vdc reference for  
the control inputs.  
GND  
3
The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level  
ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control  
is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the  
module produces an output whenever a valid input source is applied.  
Inhibit and  
UVLO(1)  
10  
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to  
GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more  
information, see the Application Information section.  
A 0.05 W 1% resistor must be directly connected between this pin and pin 6 (– Sense) to set the output voltage  
to a value higher than 0.69 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The  
setpoint range for the output voltage is from 0.69 V to 3.6 V. If left open circuit, the output voltage defaults to its  
lowest value. For further information, on output voltage adjustment see the related application note.  
VO Adjust  
7
The specification table gives the preferred resistor values for a number of standard output voltages.  
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.  
For optimal voltage accuracy, +Sense must be connected to VO, close to the load.  
+ Sense  
– Sense  
5
6
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.  
For optimal voltage accuracy, –Sense must be connected to GND (pin 3), very close to the module (within 10  
cm).  
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes  
active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage  
from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at  
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates  
at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered  
from the same input bus. If unused, this input should be connected to VI.  
Track  
9
NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage  
during power up. For more information, see the related application note.  
This input pin adjusts the transient response of the regulator. To activate the TurboTrans feature, a 1%, 0.05 W  
resistor must be connected between this pin and pin 5 (+Sense) very close to the module. For a given value of  
output capacitance, a reduction in peak output voltage deviation is achieved by using this feature. If unused, this  
pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans resistor table in  
the Application Information section. External capacitance must never be connected to this pin unless the  
TurboTrans resistor is a short, 0Ω.  
TurboTrans™  
SmartSync  
8
1
This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSync  
feature can be used to sychronize the switching fequency of multiple PTH04T230/231W modules, aiding EMI  
noise suppression efforts. If unused, this pin should be connected to GND (pin 3). For more information, please  
review the Application Information section.  
(1) Denotes negative logic: Open = Normal operation, Ground = Function active  
8
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(1)(2)  
TYPICAL CHARACTERISTICS  
CHARACTERISTIC DATA (VI = 5 V)  
EFFICIENCY  
vs  
OUTPUT CURRENT  
OUTPUT RIPPLE  
vs  
OUTPUT CURRENT  
POWER DISSIPATION  
vs  
OUTPUT CURRENT  
100  
90  
24  
1.5  
V
= 5 V  
IN  
V
= 5 V  
V
= 5 V  
IN  
IN  
3.3 V  
V
O
3.3 V  
2.5 V  
1.8 V  
1.2 V  
1.0 V  
0.7 V  
2.5 V  
3.3 V  
V
O
3.3 V  
2.5 V  
1.8 V  
1.5 V  
1.2 V  
1.0 V  
0.7 V  
3.3 V  
1.8 V  
20  
16  
12  
1.2  
0.9  
1.5 V  
80  
1.8 V  
1.8 V  
2.5 V  
1.5 V  
1.0 V  
70  
1.0 V  
0.6  
0.3  
2.5 V  
V
O
0.7 V  
3.3 V  
2.5 V  
1.8 V  
1.5 V  
1.2 V  
1.0 V  
0.7 V  
0.7 V  
60  
50  
1.2 V  
8
4
1.2 V  
1.0 V  
0.7 V  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
I
O
− Output Current − A  
I − Output Current − A  
O
I
− Output Current − A  
O
Figure 1.  
Figure 2.  
Figure 3.  
AMBIENT TEMPERATURE  
vs  
OUTPUT CURRENT  
90  
80  
07  
Natural  
Convection  
60  
50  
40  
30  
20  
All V  
O
0
1
2
3
4
5
6
I
O
− Output Current − A  
Figure 4.  
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the  
converter. Applies to Figure 1, Figure 2, and Figure 3.  
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum  
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.  
Applies to Figure 4.  
9
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(1)(2)  
TYPICAL CHARACTERISTICS  
CHARACTERISTIC DATA (VI = 3.3 V)  
EFFICIENCY  
vs  
OUTPUT CURRENT  
OUTPUT RIPPLE  
vs  
OUTPUT CURRENT  
POWER DISSIPATION  
vs  
OUTPUT CURRENT  
100  
90  
1.1  
0.9  
0.7  
14  
12  
V
= 3.3 V  
V
= 3.3 V  
2.5 V  
IN  
IN  
V
= 3.3 V  
V
IN  
O
V
2.5 V  
O
2.5 V  
1.8 V  
1.2 V  
1.0 V  
0.7 V  
1.8 V  
1.0 V  
1.2 V and 0.7 V  
1.2 V  
1.8 V  
80  
10  
8
1.5 V  
1.8 V  
1.0 V  
1.2 V  
0.5  
0.3  
70  
1.8 V  
1.2 V and 0.7 V  
0.7 V  
V
2.5 V  
O
2.5 V  
1.8 V  
1.5 V  
1.2 V  
1.0 V  
0.7 V  
60  
50  
1.0 V  
6
4
1.0 V  
0.7 V  
2.5 V  
0.1  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
I
O
− Output Current − A  
I
O
− Output Current − A  
I
O
− Output Current − A  
Figure 5.  
Figure 6.  
Figure 7.  
AMBIENT TEMPERATURE  
vs  
OUTPUT CURRENT  
90  
80  
07  
Natural  
Convection  
60  
50  
40  
30  
20  
All V  
O
0
1
2
3
4
5
6
I
O
− Output Current − A  
Figure 8.  
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the  
converter. Applies to Figure 5, Figure 6, and Figure 7.  
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum  
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.  
Applies to Figure 8.  
10  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
APPLICATION INFORMATION  
ADJUSTING THE OUTPUT VOLTAGE  
The VO Adjust control (pin 7) sets the output voltage of the PTH04T230/231W. The adjustment range of the  
PTH04T230/231W is 0.69 V to 3.6 V. The adjustment method requires the addition of a single external resistor,  
RSET, that must be connected directly between the VO Adjust and the –Sense pins. Table 1 gives the standard  
value of the external resistor for a number of standard voltages, along with the actual output voltage that this  
resistance value provides.  
For other output voltages, the value of the required resistor can either be calculated using the following formula,  
or simply selected from the range of values given in Table 2. Figure 9 shows the placement of the required  
resistor.  
0.69  
* 0.69  
R
+ 10 kW   
* 1.43 kW  
SET  
V
O
(1)  
Table 1. Preferred Values of RSET for Standard Output Voltages  
VO (Standard) (V)  
RSET (Standard Value) (kΩ)  
VO (Actual) (V)  
3.304  
(1)  
3.3  
1.21  
2.37  
4.75  
6.98  
12.1  
20.5  
681  
(1)  
2.5  
2.506  
(1)  
1.8  
1.807  
(1)  
1.5  
1.510  
1.2  
1.0  
0.7  
1.200  
1.004  
0.700  
(1) The minimum input voltage is 2.2 V or (VO + 0.5) V, whichever is greater.  
5
+Sense  
+Sense  
PTH04T230/231W  
4
6
V
O
V
O
−Sense  
VoAdj  
7
GND  
3
R
SET  
1%  
0.05 W  
−Sense  
GND  
UDG−06043  
(1) RSET: Use a 0.05 W resistor with a tolerance of 1% and temperature stability of 100 ppm/°C (or better). Connect the  
resistor directly between pins 7 and 6, as close to the regulator as possible, using dedicated PCB traces.  
(2) Never connect capacitors from VO Adjust to either GND, VO, or +Sense. Any capacitance added to the VO Adjust pin  
affects the stability of the regulator.  
Figure 9. VO Adjust Resistor Placement  
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Table 2. Output Voltage Set-Point Resistor Values (Standard Values)  
VO Required (V)  
0.70  
RSET (kΩ)  
681  
VO Required (V)  
1.80  
RSET (kΩ)  
4.75  
4.53  
4.22  
4.02  
3.83  
3.40  
3.09  
2.87  
2.61  
2.37  
2.15  
2.00  
1.82  
1.69  
1.54  
1.43  
1.33  
1.21  
1.13  
1.02  
0.931  
0.75  
113  
1.85  
0.80  
61.9  
41.2  
31.6  
24.9  
20.5  
17.8  
15.4  
13.7  
12.1  
10.7  
9.88  
9.09  
8.25  
7.68  
6.98  
6.49  
6.04  
5.76  
5.36  
5.11  
1.90  
0.85  
1.95  
0.90  
2.00  
0.95  
2.10  
1.00  
2.20  
1.05  
2.30  
1.10  
2.40  
1.15  
2.50  
1.20  
2.60  
1.25  
2.70  
1.30  
2.80  
1.35  
2.90  
1.40  
3.00  
1.45  
3.10  
1.50  
3.20  
1.55  
3.30  
1.60  
3.40  
1.65  
3.50  
1.70  
3.60  
1.75  
12  
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CAPACITOR RECOMMENDATIONS FOR THE PTH04T230/231W POWER MODULE  
Capacitor Technologies  
Electrolytic Capacitors  
When using electrolytic capacitors, high-quality, computer-grade electrolytic capacitors are recommended.  
Aluminum electrolytic capacitors provide adequate decoupling over the frequency range of 2 kHz to 150  
kHz, and are suitable when ambient temperatures are above -20°C. For operation below -20°C, tantalum,  
ceramic, or OS-CON type capacitors are required.  
Ceramic Capacitors  
The performance of aluminum electrolytic capacitors is less effective above 150 kHz. Multilayer ceramic  
capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can  
be used to reduce the reflected ripple current at the input as well as improve the transient response of the  
output.  
Tantalum, Polymer-Tantalum Capacitors  
Tantalum type capacitors may only used on the output bus, and are recommended for applications where  
the ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are  
suggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,  
and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are not  
recommended for power applications.  
Input Capacitor (Required)  
The PTH04T231W requires a minimum input capacitance of 300 µF of ceramic type.  
The PTH04T230W requires a minimum input capacitance of 330 µF. The ripple current rating of the electrolytic  
capacitor must be at least 400 mArms. An optional 22-µF X5R/X7R ceramic capacitor is recommended to  
reduce the RMS ripple current.  
Input Capacitor Information  
The size and value of the input capacitor is determined by the converter’s transient performance capability. This  
minimum value assumes that the converter is supplied with a responsive, low-inductance input source. This  
source should have ample capacitive decoupling, and be distributed to the converter via PCB power and ground  
planes.  
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).  
Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. This  
reduces the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripple  
current reflected back to the input source. Additional ceramic capacitors can be added to further reduce the  
RMS ripple current requirement for the electrolytic capacitor.  
Increasing the minimum input capacitance to 680-µF is recommended for high-performance applications, or  
wherever the input source performance is degraded.  
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,  
and maintaining less than 100 mΩ of equivalent series resistance (ESR).  
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended  
minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability.  
No tantalum capacitors were found to have voltage ratings sufficient to meet this requirement.  
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these  
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.  
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Output Capacitor (Required)  
The PTH04T231W requires a minimum output capacitance of 300 µF of ceramic type.  
The PTH04T230W requires a minimum 100 µF of ceramic and 150 µF of non-ceramic output capacitance.  
Additional non-ceramic, low-ESR capacitance is recommended for improved performance. See data sheet for  
maximum capacitance limits.  
The required capacitance above the minimum is determined by actual transient deviation requirements. See the  
TurboTrans Technology application section within this document for specific capacitance selection.  
Output Capacitor Information  
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.  
When using the TurboTrans feature, the capacitance X ESR product should also be considered (see the  
following section).  
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to the  
load to be effective. Ceramic capacitor values below 10 µF should not be included when calculating the total  
output capacitance value.  
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these  
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.  
TurboTrans Output Capacitance  
TurboTrans allows the designer to optimize the output capacitance according to the system transient design  
requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. When  
using TurboTrans, the capacitor's capacitance (µF) × ESR (mΩ) product determines its capacitor type; Type A,  
B, or C. These three types are defined as follows:  
Type A = (100 ≤ capacitance × ESR ≤ 1000) (e.g. ceramic)  
Type B = (1000 < capacitance × ESR ≤ 5000) (e.g. polymer-tantalum)  
Type C = (5000 < capacitance × ESR ≤ 10,000) (e.g. OS-CON)  
When using more than one type of output capacitor, select the capacitor type that makes up the majority of the  
total output capacitance. When calculating the C × ESR product, use the maximum ESR value from the  
capacitor manufacturer's data sheet.  
The PTH04T231W should be used when only Type A (ceramic) capacitors are used on the output.  
Working Examples:  
A capacitor with a capacitance of 330 µF and an ESR of 5 mΩ, has a C × ESR product of 1650 µF x mΩ  
(330 µF × 5 mΩ). This is a Type B capacitor.  
A capacitor with a capacitance of 1000 µF and an ESR of 8 mΩ, has a C × ESR product of 8000 µF x mΩ  
(1000 µF × 8 mΩ). This is a Type C capacitor.  
See the TurboTrans Technology application section within this document for specific capacitance selection.  
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.  
Non-TurboTrans Output Capacitance  
If the TurboTrans feature is not used, minimum ESR and maximum capacitor limits must be followed. System  
stability may be effected and increased output capacitance may be required without TurboTrans.  
When using the PTH04T230W without the TurboTrans feature, observe the minimum ESR of the entire output  
capacitor bank. The minimum ESR limit of the output capacitor bank is 7 mΩ. A list of preferred low-ESR type  
capacitors, are identified in Table 3.  
When using the PTH04T231W without the TurboTrans feature, the maximum amount of capacitance is 3000 µF  
of ceramic type. Large amounts of capacitance may reduce system stability.  
Utilizing the TurboTrans feature improves system stability, improves transient response, and reduces  
the amount of output capacitance required to meet system transient design requirements.  
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Designing for Fast Load Transients  
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of  
2.5 A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using  
the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a  
converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent  
limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.  
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with  
additional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100 A/µs, adding  
multiple 10-µF ceramic capacitors plus 10 × 1 µF, and numerous high frequency ceramics (≤ 0.1 µF) is all that is  
required to soften the transient higher frequency edges. The PCB location of these capacitors in relation to the  
load is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required for  
optimum performance. Low impedance buses, unbroken PCB copper planes, and components located as close  
as possible to the high frequency devices are essential for optimizing transient performance.  
Table 3. Input/Output Capacitors(1)  
Capacitor Characteristics  
Quantity  
(2)  
Max  
Max  
Output Bus  
Ripple  
Capacitor Vendor,  
Type Series (Style)  
Working  
Voltage  
(V)  
ESR  
Turbo-  
Trans  
Capacitor  
Type(3)  
Value  
(µF)  
Current  
at 85°C  
(Irms)  
(mA)  
Physical  
Size (mm)  
Input  
Bus  
No  
Turbo-  
Trans  
at 100  
kHz  
Vendor Part No.  
(mΩ)  
Panasonic  
SP series (UE)  
6.3  
6.3  
6.3  
220  
390  
470  
15  
3000  
555  
7,3×4,3  
8 X 11,5  
10 X 10,2  
2
1
1
1≤ 2  
≥ 1  
B ≥ 1(3)  
N/R(4)  
N/R(4)  
EEFUE0J221R  
FC (Radial )  
117  
160  
EEUFC0J391  
EEVFK0J471P  
FK (SMD)  
600  
≥ 1  
United Chemi-Con  
PTB, Poly-Tantalum(SMD)  
LXZ, Aluminum (Radial)  
PS, Poly-Alum (Radial)  
PT Poly-Tantalum (SMD)  
MVY, Aluminum SMD)  
PXA, Poly-Alum (Radial)  
Nichicon, Aluminum  
WG (SMD)  
6.3  
6.3  
6.3  
6.3  
10  
330  
680  
390  
330  
680  
330  
25  
120  
12  
2600  
555  
7,3×4,3×2,8  
8 X 12  
1
1
1
1
1
1
1≤3  
1
C ≥ 2(3)  
N/R(4)  
6PTB337MD6TER  
LXZ6.3VB681M8X12LL  
6PS390MH11  
4770  
3000  
670  
8 X 11,5  
7,3×4,3  
≤1  
1
B ≥ 2(3)  
N/R(4)  
40  
6PT337MD8TER  
150  
14  
10 × 10  
1
B ≥ 2(3)  
B ≥ 1(3)  
MVY10VC681MJ10TP  
PXA10VC331MH12  
10 V  
4420  
8 × 12,2  
1≤2  
10  
10  
470  
470  
150  
72  
670  
760  
10 × 10  
1
1
1
1
N/R(4)  
N/R(4)  
UWG1A471MNR1GS  
UHD1A471MPR  
HD (Radial)  
8 X 11,5  
Panasonic, Poly-Aluminum  
SE Series (SMD)  
2.0  
560  
5
4000  
7,3×4,3×4,2 N/R(5)  
N/R(6)  
B ≥ 2(3)  
EEFSE0J561R(VO≤ 1.6V)(7)  
(1) Capacitor Supplier Verification  
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of  
limited availability or obsolete products.  
RoHS, Lead-free and Material Details  
See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.  
Component designators or part number deviations can occur when material composition or soldering requirements are updated.  
(2) Additional output capacitance must include the required 100 µF of ceramic type.  
(3) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection  
Capacitor Types:  
•
•
•
Type A = (100 < capacitance × ESR ≤ 1000)  
Type B = (1,000 < capacitance × ESR ≤ 5,000)  
Type C = (5,000 < capacitance × ESR ≤ 10,000)  
(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher  
ESR capacitors can be used in conjunction with lower ESR capacitance.  
(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.  
(6) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.  
(7) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.  
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Table 3. Input/Output Capacitors (continued)  
Capacitor Characteristics  
Quantity  
(2)  
Max  
Ripple  
Current  
at 85°C  
(Irms)  
(mA)  
Output Bus  
Max  
ESR  
at 100  
kHz  
Capacitor Vendor,  
Type Series (Style)  
Working  
Voltage  
(V)  
Turbo-  
Trans  
Capacitor  
Type(3)  
Value  
(µF)  
Physical  
Size (mm)  
Input  
Bus  
No  
Turbo-  
Trans  
Vendor Part No.  
(mΩ)  
Sanyo  
TPE, POSCAP (SMD)  
TPE, POSCAP (SMD)  
TPD, POSCAP (SMD)  
SEP, OS-CON (Radial)  
SVPA, OS-CON (Radial)  
SVP, OS-CON (SMD)  
AVX, Tantalum  
10  
2.5  
2.5  
6.3  
6.3  
10  
330  
470  
1000  
470  
470  
330  
25  
7
3300  
4400  
6100  
4210  
4130  
3700  
7,3×4,3  
7,3×4,3  
7,3×4,3  
10 × 12  
10 × 7,9  
10 × 7,9  
1
1 ≤3  
≤1  
C ≥ 1(8)  
B ≥ 2(8)  
B ≥ 1(8)  
C ≥ 1(8)  
C ≥ 2(8)  
C ≥ 1(8)  
10TPE330MF  
N/R(9)  
2R5TPE470M7(VO≤ 1.8V)(10)  
2R5TPD1000M5(VO≤ 1.8V)(10)  
6SEP470M  
5
N/R(9)  
N/R(11)  
1 ≤ 2  
1≤2  
15  
19  
25  
1
1
1
6SVPA470M  
1 ≤3  
10SVP330MX  
TPM Multianode  
10  
10  
4
330  
330  
23  
40  
25  
3000  
1830  
2400  
7,3×4,3×4,1  
7,3×4,3×4,1  
1
1
1 ≤ 3  
1 ≤ 6  
1 ≤ 5  
C ≥ 2(8)  
N/R(12)  
N/R(12)  
TPME337M010R0035  
TPS Series III (SMD)  
TPS Series III (SMD)  
Kemet, Poly-Tantalum  
T520 (SMD)  
TPSE337M010R0040  
1000  
7,3×6,1×3.5 N/R(9)  
TPSV108K004R0035 (VO≤ 2.1V)(13)  
10  
6.3  
4
330  
330  
25  
15  
5
2600  
3800  
7300  
7300  
7,3×4,3×4,1  
7,3×4,3×4,1  
1
1
1 ≤ 3  
1≤2  
C ≥ 2(8)  
B ≥ 2(8)  
B ≥ 1(8)  
B ≥ 1(8)  
T520X337M010ASE025  
T530 (SMD)  
T530X337M010ASE015(10)  
T530 (SMD)  
680  
7,3×4,3×4,1 N/R(9)  
7,3×4,3×4,1 N/R(9)  
N/R(11)  
N/R(11)  
T530X687M004ASE005 (VO≤ 3.2V)(10)  
T530X108M2R5ASE005 (VO≤ 2.0V)(10)  
T530 (SMD)  
2.5  
1000  
5
Vishay-Sprague  
597D, Tantalum (SMD)  
94SP, OS-CON (Radial)  
94SVP OS-CON(SMD)  
Kemet, Ceramic X5R  
(SMD)  
10  
6.3  
6.3  
6.3  
6.3  
6.3  
6.3  
16  
330  
390  
470  
100  
47  
35  
16  
17  
2
2500  
3810  
3960  
–
7,3×5,7×4,1  
8 X 10,5  
8 × 12  
1
1
1
1
1
1
1
1
1
1
1
1
1
1 ≤ 5  
1 ≤2  
1≤2  
N/R(12)  
C ≥ 2(8)  
C ≥ 1(8)  
A(8)  
597D337X010E2T  
94SP397X06R3EBP  
94SVP477X06F12  
3225  
1(14)  
C1210C107M9PAC  
C1210C476K9PAC  
GRM32ER60J107M  
GRM32ER60J476ME20L  
GRM32ER61CE226KE20L  
GRM32DR61C106K  
C3225X5R0J107MT  
C3225X5R0J476MT  
C3225X5R1C106MT0  
C3225X5R1C226MT  
(14)  
2
≥2  
A(8)  
Murata, Ceramic X5R  
(SMD)  
100  
47  
2
–
3225  
3225  
≥ 1(14)  
A(8)  
(14)  
≥2  
A(8)  
22  
≥ 5(14)  
≥ 1(14)  
≥ 1(14)  
≥ 1(14)  
≥ 1(14)  
≥ 1(14)  
A(8)  
16  
10  
A(8)  
TDK, Ceramic X5R  
(SMD)  
6.3  
6.3  
16  
100  
47  
2
–
A(8)  
A(8)  
10  
A(8)  
16  
22  
A(8)  
(8) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection  
Capacitor Types:  
•
•
•
Type A = (100 < capacitance × ESR ≤ 1000)  
Type B = (1,000 < capacitance × ESR ≤ 5,000)  
Type C = (5,000 < capacitance × ESR ≤ 10,000)  
(9) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.  
(10) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.  
(11) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.  
(12) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher  
ESR capacitors can be used in conjunction with lower ESR capacitance.  
(13) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 50% of the working voltage.  
(14) Any combination of ceramic capacitor values is limited as listed in the Electrical Characteristics table.  
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TURBOTRANS  
TurboTrans™ Technology  
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.  
TurboTrans optimizes the transient response of the regulator with added external capacitance using a single  
external resistor. Benefits of this technology include reduced output capacitance, minimized output voltage  
deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The  
amount of output capacitance required to meet a target output voltage deviation is reduced with TurboTrans  
activated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of the  
voltage deviation following a load transient is reduced. Applications requiring tight transient voltage tolerances  
and minimized capacitor footprint area benefits greatly from this technology.  
TurboTrans™ Selection  
Using TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin 5) and the TurboTrans pin  
(pin 8). The value of the resistor directly corresponds to the amount of output capacitance required. All T2  
products require a minimum value of output capacitance whether or not TurboTrans is used. For the  
PTH04T230W, the minimum required capacitance is 200 µF ceramic. When using TurboTrans, capacitors with a  
capacitance × ESR product below 10,000 µF×mΩ are required. (Multiply the capacitance (in µF) by the ESR (in  
mΩ) to determine the capacitance × ESR product.) See the Capacitor Selection section of the datasheet for a  
variety of capacitors that meet this criteria.  
Figure 10 shows the amount of output capacitance required to meet a desired transient voltage deviation with  
and without TurboTrans for several capacitor types; Type A (e.g. ceramic), Type B (e.g. polymer-tantalum), and  
Type C (e.g. OS-CON). To calculate the proper value of RTT, first determine the required transient voltage  
deviation limits and magnitude of the transient load step. Next, determine what type of output capacitors is used.  
(If more than one type of output capacitor is used, select the capacitor type that makes up the majority of the  
total output capacitance). Knowing this information, use the chart in Figure 10 that corresponds to the capacitor  
type selected. To use the chart, begin by dividing the maximum voltage deviation limit (in mV) by the magnitude  
of the load step (in Amps). This gives a mV/A value. Find this value on the Y-axis of the appropriate chart. Read  
across the graph to the 'With TurboTrans' plot. From this point, read down to the X-axis which lists the minimum  
required capacitance, CO, to meet that transient voltage deviation. The required RTT resistor value can then be  
calculated using the equation or selected from the TurboTrans table. The TurboTrans tables include both the  
required output capacitance and the corresponding RTT values to meet several values of transient voltage  
deviation for 25% (1.5 A), 50% (3 A), and 75% (4.5 A) output load steps.  
The chart can also be used to determine the achievable transient voltage deviation for a given amount of output  
capacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans'  
curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance.  
The required RTT resistor value can be calculated using the equation or selected from the TurboTrans table.  
As an example, consider a 5-V application requiring a 45 mV deviation during a 3-A, 50% load transient. A  
majority of 330 µF, 10 mΩ ouput capacitors are used. Use the Type B capacitor chart, Figure 11. Dividing 45 mV  
by 3 A gives 15 mV/A transient voltage deviation per amp of transient load step. Select 15 mV/A on the Y-axis  
and read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a minimum  
required output capacitance of approximately 820 µF. The required RTT resistor value for 820 µF can then be  
calculated or selected from Table 5. The required RTT resistor is approximately 6.19 kΩ.  
To see the benefit of TurboTrans, follow the 15 mV/A marking across to the 'Without TurboTrans' plot. Following  
that point down shows that you would need a minimum of 2700 µF of output capacitance to meet the same  
transient deviation limit. This is the benefit of TurboTrans. A typical TurboTrans schematic is shown in Figure 16.  
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PTH04T231W - Type A Ceramic Capacitors  
5-V Input  
3.3-V Input  
40  
40  
30  
30  
Without TurboTrans  
Without TurboTrans  
20  
20  
10  
9
10  
9
8
With TurboTrans  
8
With TurboTrans  
7
6
7
6
PTH04T231 Type A  
Ceramic Capacitors  
PTH04T231 Type A  
Ceramic Capacitors  
5
4
5
4
C − Capacitance − µF  
C − Capacitance − µF  
Figure 10. Capacitor Type A, 100 < C(µF) x ESR(mΩ) ≤  
Figure 11. Capacitor Type A, 100 < C(µF) x ESR(mΩ) ≤  
1000  
1000  
(e.g. Ceramic)  
(e.g. Ceramic)  
Table 4. Type A TurboTrans CO Values and Required RTT Selection Table  
Transient Voltage Deviation (mV)  
5-V Input  
3.3-V input  
CO  
RTT  
CO  
RTT  
25% load step  
(1.5 A)  
50% load step  
(3 A)  
75% load step  
(4.5 A)  
Minimum  
Required Output  
Capacitance (µF)  
Required  
TurboTrans  
Resistor (kΩ)  
Minimum  
Required Output  
Capacitance (µF)  
Required  
TurboTrans  
Resistor (kΩ)  
40  
35  
30  
25  
20  
15  
10  
80  
70  
60  
50  
40  
30  
20  
120  
105  
90  
300  
320  
open  
549  
300  
300  
350  
450  
610  
920  
2250  
open  
open  
226  
400  
93.1  
37.4  
15.8  
4.75  
short  
75  
510  
59.0  
22.6  
7.50  
short  
60  
700  
45  
1050  
3300  
30  
RTT Resistor Selection  
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:  
1 * ǒC  
Ǔ
ń1500  
O
R
+ 40   
kW  
TT  
ǒ
C
Ǔ
ń300 * 1  
O
(2)  
Where CO is the total output capacitance in µF. CO values greater than or equal to 1500 µF require RTT to  
be a short, 0 Ω.  
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The  
value of RTT must be calculated using the minimum required output capacitance determined from the  
capacitor transient response charts above.  
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PTH04T230W Type B Capacitors  
5-V Input  
3.3-V Input  
40  
30  
40  
30  
Without TurboTrans  
Without TurboTrans  
20  
20  
10  
9
10  
9
8
8
7
6
7
6
With TurboTrans  
With TurboTrans  
5
4
5
4
C − Capacitance − µF  
C − Capacitance − µF  
Figure 12. Capacitor Type B, 1000 < C(µF) x ESR(mΩ) ≤  
Figure 13. Capacitor Type B, 1000 < C(µF) x ESR(mΩ) ≤  
5000  
5000  
(e.g. Polymer-Tantalum)  
(e.g. Polymer-Tantalum)  
Table 5. Type B TurboTrans CO Values and Required RTT Selection Table  
Transient Voltage Deviation (mV)  
5-V Input  
3.3-V Input  
CO  
RTT  
CO  
RTT  
25% load step  
(1.5 A)  
50% load step  
(3 A)  
75% load step  
(4.5 A)  
Minimum  
Required Output  
Capacitance (µF)  
Required  
TurboTrans  
Resistor (kΩ)  
Minimum  
Required Output  
Capacitance (µF)  
Required  
TurboTrans  
Resistor (kΩ)  
60  
50  
40  
30  
25  
20  
15  
12  
120  
100  
80  
180  
150  
120  
90  
250  
300  
open  
165  
250  
300  
open  
165  
400  
46.4  
16.9  
9.31  
3.57  
short  
short  
400  
46.4  
16.9  
9.09  
3.24  
short  
short  
60  
570  
570  
50  
75  
710  
720  
40  
60  
940  
960  
30  
45  
1520  
3200  
1500  
3100  
24  
36  
RTT Resistor Selection  
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:  
1 * ǒC  
Ǔ
ń1250  
O
R
+ 40   
kW  
TT  
ǒ
C
Ǔ
ń250 * 1  
O
(3)  
Where CO is the total output capacitance in µF. CO values greater than or equal to 1250 µF require RTT to  
be a short, 0 Ω.  
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The  
value of RTT must be calculated using the minimum required output capacitance determined from the  
capacitor transient response charts above.  
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PTH04T230W Type C Capacitors  
5-V Input  
3.3-V Input  
40  
40  
30  
30  
20  
Without TurboTrans  
Without TurboTrans  
20  
10  
9
10  
9
8
8
7
6
7
6
With TurboTrans  
With TurboTrans  
5
4
5
4
C − Capacitance − µF  
C − Capacitance − µF  
Figure 14. Capacitor Type C, 5000 < C(µF) x ESR(mΩ) ≤  
Figure 15. Capacitor Type C, 5000 < C(µF) x ESR(mΩ) ≤  
10,000  
10,000  
(e.g. OS-CON)  
(e.g. OS-CON)  
Table 6. Type C TurboTrans CO Values and Required RTT Selection Table  
Transient Voltage Deviation (mV)  
5-V Input  
3.3 V Input  
CO  
RTT  
CO  
RTT  
Minimum  
Required  
TurboTrans  
Resistor (kΩ)  
Minimum  
Required Output  
Capacitance (µF)  
Required  
TurboTrans  
Resistor (kΩ)  
25% load step  
(1.5 A)  
50% load step  
(3 A)  
75% load step  
(4.5 A)  
Required Output  
Capacitance  
(µF)  
50  
40  
35  
30  
25  
20  
15  
12  
100  
80  
70  
60  
50  
40  
30  
20  
150  
120  
105  
90  
270  
360  
487  
66.5  
36.5  
21.5  
11.5  
4.53  
short  
short  
250  
350  
open  
76.8  
39.2  
21.5  
11.0  
3.83  
short  
short  
430  
420  
520  
520  
75  
660  
670  
60  
890  
920  
45  
1420  
3050  
1630  
3700  
30  
RTT Resistor Selection  
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:  
1 * ǒC  
Ǔ
ń1250  
O
R
+ 40   
kW  
TT  
ǒ
C
Ǔ
ń250 * 1  
O
(4)  
Where CO is the total output capacitance in µF. CO values greater than or equal to 1250 µF require RTT to  
be a short, 0 Ω.  
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The  
value of RTT must be calculated using the minimum required output capacitance determined from the  
capacitor transient response charts above.  
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TurboTransE  
R
TT  
0 kΩ  
(Note A)  
AutoTrack SYNC  
TT  
+Sense  
V
I
+Sense  
V
I
V
O
V
O
PTH04T230W  
INH/UVLO  
−Sense  
VoAdj  
GND  
3
L
O
A
D
7
C
C
O2  
O1  
+
1320 µF  
Type B  
200 µF  
Ceramic  
R
1%  
0.05 W  
SET  
C
I
330 µF  
(Required)  
GND  
GND  
UDG−06047  
A. The value of RTT must be calculated using the total value of output capacitance.  
Figure 16. Typical TurboTrans™ Schematic  
PTH04T230  
C
O
= 1520 µF  
Without TurboTrans  
50 mV/div  
With TurboTrans  
50 mV/div  
50% Load Step  
2.5 A/µs  
T − Time − 200 µs/div  
Figure 17. Typical TurboTrans Waveforms  
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UNDERVOLTAGE LOCKOUT (UVLO)  
The PTH04T230/231W power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature  
prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This  
enables the module to provide a clean, monotonic power-up for the load circuit, and also limits the magnitude of  
current drawn from the regulator’s input source during the power-up sequence.  
The UVLO characteristic is defined by the ON threshold (VTHD) voltage. Below the ON threshold, the Inhibit  
control is overridden, and the module does not produce an output. The hysteresis voltage, which is the  
difference between the ON and OFF threshold voltages, is set at 500 mV. The hysteresis prevents start-up  
oscillations, which can occur if the input voltage droops slightly when the module begins drawing current from  
the input source.  
The UVLO feature of the PTH04T230/231W module allows for limited adjustment of the ON threshold voltage.  
The adjustment is made via the Inhbit/UVLO Prog control pin (pin 10) using a single resistor (see figure below).  
When pin 10 is left open circuit, the ON threshold voltage is internally set to its default value, which is 1.95 volts.  
The ON threshold might need to be raised if the module is powered from a tightly regulated 5-V bus. Adjusting  
the threshold prevents the module from operating if the input bus fails to completely rise to its specified  
regulation voltage.  
Equation 5 determines the value of RUVLO required to adjust VTHD to a new value. The default value is 1.95 V,  
and it may only be adjusted to a higher value.  
68.54 * V  
THD  
R
+
kW  
UVLO  
V
* 2.07  
THD  
(5)  
Table 7 lists the standard resistor values for RUVLO for different values of the ON-threshold (VTHD) voltage.  
Table 7. Standard RUVLO Values for Various VTHD Values  
VTHD (V)  
2.5  
3.0  
3.5  
4.0  
4.5  
RUVLO (kΩ)  
154  
71.5  
53.6  
33.2  
26.7  
PTH04T230/231W  
V
I
2
V
I
10  
+
Inhibit/  
UVLO  
C
I
GND  
3
R
UVLO  
GND  
UDG−06059  
Figure 18. Undervoltage Lockout  
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Soft-Start Power Up  
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the  
Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track  
pin should be directly connected to the input voltage, VI (see Figure 19).  
9
V
I
Track  
(2 V/div)  
PTH04T230/231W  
V
I
2
V
I
+
GND  
3
C
I
V
O
(1 V/div)  
GND  
UDG−06044  
I
I
(2 A/div)  
T − Time − 4 ms/div  
Figure 20. Power-Up Waveform  
Figure 19. Defeating the Auto-Track Function  
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This  
allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is  
under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate. From the  
moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically  
2 ms–10 ms) before allowing the output voltage to rise. The output then progressively rises to the module’s  
setpoint voltage.  
Figure 20 shows the soft-start power-up characteristic of the PTH04T230/231W operating from a 5-V input bus  
and configured for a 1.8-V output. The waveforms were measured with a 6-A constant current load and the  
Auto-Track feature disabled. The initial rise in input current when the input voltage first starts to rise is the  
charge current drawn by the input capacitors. Power-up is complete within 20 ms.  
Remote Sense  
Differential remote sense improves the load regulation performance of the module by allowing it to compensate  
for any IR voltage drop between its output and the load in either the positive or return path. An IR drop is caused  
by the output current flowing through the small amount of pin and trace resistance. Connecting the +Sense (pin  
5) and –Sense (pin 6) pins to the respective positive and ground reference of the load terminals improves the  
load regulation of the output voltage at the connection points.  
With the sense pins connected at the load, the difference between the voltage measured directly between the  
VO and GND pins, and that measured at the Sense pins, is the amount of IR drop being compensated by the  
regulator. This should be limited to a maximum of 300 mV.  
If the remote sense feature is not used at the load, connect the +Sense pin to VO (pin 4) and connect the  
–Sense pin to the module GND (pin 3).  
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency  
dependent components that may be placed in series with the converter output. Examples include OR-ing  
diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense  
connection they are effectively placed inside the regulation control loop, which can adversely affect the  
stability of the regulator.  
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Output On/Off Inhibit  
For applications requiring output voltage on/off control, the PTH04T230/231W incorporates an output Inhibit  
control pin. The inhibit feature can be used wherever there is a requirement for the output voltage from the  
regulator to be turned off.  
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output  
whenever a valid source voltage is connected to VI with respect to GND.  
Figure 21 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input  
has its own internal pull-up. An external pull-up should never be connected to the inhibit pin. The input is not  
compatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended for  
control.  
PTH04T230/231W  
V
I
2
V
O
V
I
(1 V/div)  
10  
+
Inhibit/  
UVLO  
I
I
C
I
GND  
3
(2 A/div)  
1 = Inhibit  
GND  
Q1  
BSS138  
UDG−06045  
V
INH  
(2 V/div)  
T − Time − 4 ms/div  
Figure 22. Power-Up Response from Inhibit Control  
Figure 21. On/Off Inhibit Control Circuit  
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then  
turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within  
40 ms. Figure 22 shows the typical rise in both the output voltage and input current, following the turn-off of Q1.  
The turn off of Q1 corresponds to the rise in the waveform, VINH. The waveforms were measured with a 3-A  
constant current load.  
Overcurrent Protection  
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that  
exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, a  
module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of  
operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is  
removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is  
removed, the module automatically recovers and returns to normal operation.  
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Overtemperature Protection (OTP)  
A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A  
rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the  
internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns  
the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The  
recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases  
by about 10°C below the trip point.  
The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.  
Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term  
reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits  
for the worst-case conditions of ambient temperature and airflow.  
Smart Sync  
Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Driving  
the Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modules  
to the selected frequency. The synchronization frequency can be higher or lower than the nominal switching  
frequency of the modules within the range of 240 kHz to 400 kHz (see Electrical Specifications table for  
frequency limits). Synchronizing modules powered from the same bus eliminates beat frequencies reflected back  
to the input supply, and also reduces EMI filtering requirements. These are the benefits of Smart Sync. Power  
modules can also be synchronized out of phase to minimize source current loading and minimize input  
capacitance requirements. Figure 23 shows a standard circuit with two modules syncronized 180° out of phase  
using a D flip-flop.  
0°  
Track  
SYNC  
TT  
+Sense  
V =5 V  
I
Vi  
V
O1  
PTH04T230W  
Vo  
Inhibit/  
UVLO  
SN74LVC2G74  
−Sense  
+
C
O1  
+
C
I1  
V
CC  
GND  
VoAdj  
PRE  
Q
CLR  
CLK  
R
SET1  
f
= 2 x f  
MODULE  
CLK  
180°  
Q
D
GND  
Track  
Sync  
TT  
Vi  
+Sense  
V
O2  
PTH04T240W  
Vo  
Inhibit/  
UVLO  
−Sense  
+
C
O2  
+
GND  
VoAdj  
C
I2  
R
SET2  
UDG−06054  
Figure 23. Typical SmartSync Circuit  
25  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
Auto-Track™ Function  
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track  
was designed to simplify the amount of circuitry required to make the output voltage from each module power up  
and power down in sequence. The sequencing of two or more supply voltages during power up is a common  
requirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSP  
family, microprocessors, and ASICs.  
How Auto-Track™ Works  
(1)  
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin  
.
This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is  
raised above the set-point voltage, the module output remains at its set-point (2). As an example, if the Track pin  
of a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the  
regulated output does not go higher than 2.5 V.  
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a  
volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow  
a common signal during power up and power down. The control signal can be an externally generated master  
ramp waveform, or the output voltage from another power supply circuit (3). For convenience, the Track input  
incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable  
rising waveform at power up.  
Typical Application  
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track  
compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the  
same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common  
Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage  
supervisor IC. See U3 in Figure 24.  
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be  
done at or before input power is applied to the modules. The ground signal should be maintained for at least  
20 ms after input power has been applied. This brief period gives the modules time to complete their internal  
soft-start initialization (4), enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,  
that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power  
up.  
Figure 24 shows how a TPS3808 supply voltage supervisor IC (U3) can be used to coordinate the sequenced  
power up of 5-V PTH modules. The output of the TPS3808 supervisor becomes active above an input voltage of  
0.8 V, enabling it to assert a ground signal to the common track control well before the input voltage has  
reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 27 ms  
after the input voltage has risen above U3's voltage threshold, which is 4.65 V. The 27-ms time period is  
controlled by the capacitor C3. The value of 4700 pF provides sufficient time delay for the modules to complete  
their internal soft-start initialization. The output voltage of each module remains at zero until the track control  
voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises.  
This causes the output voltage of each module to rise simultaneously with the other modules, until each reaches  
its respective set-point voltage.  
Figure 25 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1  
and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.  
VTRK, VO1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.  
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage  
threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,  
forcing the output of each module to follow, as shown in Figure 26. Power down is normally complete before the  
input voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the  
modules recognize that an input voltage is no longer present, their outputs can no longer follow the voltage  
applied at their track input. During a power-down sequence, the fall in the output voltage from the modules is  
limited by the Auto-Track slew rate capability.  
26  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
Notes on Use of Auto-Track™  
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module  
regulates at its adjusted set-point voltage.  
2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp  
speeds of up to 1 V/ms.  
3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.  
4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.  
This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it  
is recommended that the Track pin be held at ground potential.  
5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track  
is disabled, the output voltage rises at a quicker and more linear rate after input power has been applied.  
R
TT  
Auto Track  
TurboTrans  
+Sense  
V = 5 V  
I
Vi  
U1  
PTH05T210W  
Vo  
V
O1  
= 3.3 V  
Inhibit/  
UVLO  
6
−Sense  
VoAdj  
+
GND  
3
4
5
1
C
O1  
MR  
SENSE  
C
I1  
R
SET1  
1.62 kΩ  
C
4
0.1 µF  
U3  
TPS3808G50  
RESET  
GND  
CT  
R
TT  
Auto Track  
SmartSync  
TurboTrans  
+Sense  
2
C
3
4700 µF  
U2  
PTH04T230W  
Vi  
Vo  
V
O2  
= 1.8 V  
Inhibit/  
UVLO  
−Sense  
GND  
VoAdj  
C
O2  
+
R
SET2  
4.75 kΩ  
C
I2  
UDG−06042  
Figure 24. Sequenced Power Up and Power Down Using Auto-Track  
27  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
V
(1 V/div)  
TRK  
V
(1 V/div)  
(1 V/div)  
TRK  
V
(1 V/div)  
(1 V/div)  
01  
V
01  
V
02  
V
(1 V/div)  
02  
T − Time − 20 ms/div  
T − Time − 200 µs/div  
Figure 25. Simultaneous Power Up With Auto-Track  
Control  
Figure 26. Simultaneous Power Down With Auto-Track  
Control  
Prebias Startup Capability  
A prebias startup condition occurs as a result of an external voltage being present at the output of a power  
module prior to its output becoming active. This often occurs in complex digital systems when current from  
another power source is backfed through a dual-supply logic component, such as an FPGA or ASIC. Another  
path might be via clamp diodes as part of a dual-supply power-up sequencing arrangement. A prebias can  
cause problems with power modules that incorporate synchronous rectifiers. This is because under most  
operating conditions, these types of modules can sink as well as source output current.  
The PTH family of power modules incorporate synchronous rectifiers, but does not sink current during startup(1),  
or whenever the Inhibit pin is held low. However, to ensure satisfactory operation of this function, certain  
conditions must be maintained(2). Figure 27 shows an application demonstrating the prebias startup capability.  
The startup waveforms are shown in Figure 28. Note that the output current (IO) is negligible until the output  
voltage rises above the voltage backfed through the intrinsic diodes.  
The prebias start-up feature is not compatible with Auto-Track. When the module is under Auto-Track control, it  
sinks current if the output voltage is below that of a back-feeding source. To ensure a pre-bias hold-off one of  
two approaches must be followed when input power is applied to the module. The Auto-Track function must  
either be disabled(3), or the module’s output held off (for at least 50 ms) using the Inhibit pin. Either approach  
ensures that the Track pin voltage is above the set-point voltage at start up.  
1. Startup includes the short delay (approximately 10 ms) prior to the output voltage rising, followed by the rise  
of the output voltage under the module’s internal soft-start control. Startup is complete when the output  
voltage has risen to either the set-point voltage or the voltage at the Track pin, whichever is lowest.  
2. To ensure that the regulator does not sink current when power is first applied (even with a ground signal  
applied to the Inhibit control pin), the input voltage must always be greater than the output voltage  
throughout the power-up and power-down sequence.  
3. The Auto-Track function can be disabled at power up by immediately applying a voltage to the module’s  
Track pin that is greater than its set-point voltage. This can be easily accomplished by connecting the Track  
pin to VI.  
28  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
Track  
+Sense  
3.3 V  
V = 5 V  
I
V
O
= 2.5 V  
V
V
I
PTH04T230W  
V Adj  
O
I
O
Inhibit  
GND  
−Sense  
O
+
C
VCORE  
VCCIO  
R
C
O
SET  
I
200 µF  
330 µF  
2.37 kΩ  
ASIC  
UDG−06055  
Figure 27. Application Circuit Demonstrating Prebias Startup  
VIN (1 V/div)  
VO (1 V/div)  
IO (2 A/div)  
t - Time = 4 ms/div  
Figure 28. Prebias Startup Waveforms  
29  
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SLTS271A–SEPTEMBER 2006–REVISED OCTOBER 2006  
TAPE AND REEL & TRAY DRAWINGS  
30  
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Nov-2006  
PACKAGING INFORMATION  
Orderable Device  
PTH04T230WAD  
PTH04T230WAS  
PTH04T230WAST  
PTH04T230WAZ  
PTH04T230WAZT  
PTH04T231WAD  
PTH04T231WAS  
PTH04T231WAST  
PTH04T231WAZ  
PTH04T231WAZT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
DIP MOD  
ULE  
ECL  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
36  
Pb-Free  
(RoHS)  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
N / A for Pkg Type  
DIP MOD  
ULE  
ECM  
ECM  
BCM  
BCM  
ECL  
36  
TBD  
Level-1-235C-UNLIM  
Level-1-235C-UNLIM  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
N / A for Pkg Type  
DIP MOD  
ULE  
250  
36  
TBD  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
250  
36  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
ECM  
ECM  
BCM  
BCM  
36  
TBD  
Level-1-235C-UNLIM  
Level-1-235C-UNLIM  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
DIP MOD  
ULE  
250  
36  
TBD  
DIP MOD  
ULE  
Pb-Free  
(RoHS)  
DIP MOD  
ULE  
250  
Pb-Free  
(RoHS)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
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Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
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Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
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Digital Control  
Military  
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www.ti.com/digitalcontrol  
www.ti.com/military  
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Logic  
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Microcontrollers  
power.ti.com  
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