OPT8320_V01 [TI]
OPT8320 3D Time-of-Flight Sensor;
| 型号： | OPT8320_V01 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | OPT8320 3D Time-of-Flight Sensor |
| 文件： | 总12页 (文件大小：563K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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OPT8320
SBAS921 –APRIL 2018
OPT8320 3D Time-of-Flight Sensor
1 Features
2 Applications
1
•
Imaging Array:
•
Depth Sensing:
–
–
–
–
80 × 60 Array
–
–
–
–
–
–
Location and Proximity Sensing
3D Scanning
1/6” Sensor Format
Pixel Pitch: 30 µm
3D Machine Vision
Frame Rate: Scalable Up to 1000-FPS Depth
Output Rate with an Internal Raw Rate of
4000 FPS
Security and Surveillance
Gesture Controls
Augmented and Virtual Reality
•
•
Optical Properties:
–
–
–
Responsivity: 0.35 A/W at 850 nm
3 Description
The OPT8320 time-of-flight (ToF) sensor is part of
the TI 3D ToF image sensor family. The device is a
Demodulation Contrast: 70% at 50 MHz
Demodulation Frequency: 10 MHz to 100 MHz
high-performance,
highly-integrated,
complete
Output Interface:
system-on-chip (SoC) for array depth sensing,
consisting of a versatile timing generator (TG), an
optimally designed analog-to-digital converter (ADC),
a depth engine, and an illumination driver.
–
Digital Video Port (DVP): 8 Data Lanes,
HD and VD Pins, and Clock
–
Synchronous Serial Interface (SSI):
1 Data Lane, Clock, and Chip Select
The programmability of the built-in TG offers the
flexibility to optimize for various depth-sensing
performance metrics [such as power, motion
robustness, signal-to-noise ratio (SNR), and ambient
cancellation]. The built-in depth engine computes the
depth data from the digitized sensor data. In addition
to the phase data, the depth engine provides auxiliary
information consisting of amplitude, ambient, and
flags for each pixel and the full-array statistical
information in the form of a histogram.
•
•
Timing Generator:
–
–
–
–
–
Sensor Addressing Engine
Modulation Control
De-Aliasing
Master, Slave Sync Operation
High Dynamic Range Operation
Depth Engine:
–
–
–
–
Pixel Binning
De-Aliasing
Histogram
Device Information(1)
PART NUMBER
OPT8320
PACKAGE
BODY SIZE (NOM)
8.03 mm x 5.32 mm x
0.745 mm
COG (56)
Calibration
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
•
Power Supply:
–
–
–
3.3-V I/O, Analog
Application Block Diagram
1.8-V Analog, Digital, I/O
1.8-V Demodulation (Typical)
Optimized Optical Package (COG-56):
–
–
8.03 mm × 5.32 mm × 0.745 mm
Integrated Optical Band-Pass Filter
(830 nm to 867 nm)
–
Optical Fiducials for Easy Alignment
•
•
Built-In Illumination Driver for Low-Power
Applications
Operating Temperature: 0°C to 70°C
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPT8320
SBAS921 –APRIL 2018
www.ti.com
Table of Contents
5.2 Community Resources.............................................. 3
5.3 Trademarks............................................................... 3
5.4 Electrostatic Discharge Caution................................ 3
5.5 Glossary.................................................................... 3
1
2
3
4
5
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device and Documentation Support.................... 3
5.1 Documentation Support ........................................... 3
6
Mechanical, Packaging, and Orderable
Information ............................................................. 3
4 Revision History
DATE
REVISION
NOTES
April 2018
*
Initial release.
2
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: OPT8320
OPT8320
www.ti.com
SBAS921 –APRIL 2018
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
Time-of-Flight Camera – An Introduction, SLOA190
Introduction to the Time-of-Flight (ToF) System Design, SBAU219
Illumination Driving for Time-of-Flight (ToF) Camera System, SBAA209
Lenses for 3D Time-of-Flight (ToF) Image Sensors, SBAA217
3D ToF System Estimator Tool
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2018, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: OPT8320
OPT8320
SBAS921 –APRIL 2018
www.ti.com
PACKAGE OUTLINE
NBP0056A
COG - 0.745 mm max height
SCALE 2.000
CHIP ON GLASS
8.07
7.99
B
A
BALL 1 CORNER
INDEX AREA
5.36
5.28
(0.04)
0.1 0.013
(0.06)
DIE
S
C
A
1
5
.
0
DETAIL A
(0.5)
SEE DETAIL A
0.745 MAX
C
SEATING PLANE
0.05 C
0.213
0.187
BALL TYP
TYP
2X 7.645
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
(0.19) TYP
(0.19) TYP
28
29
30
31
32
11
10
9
8
7
DIE
2X
SYMM
33
34
35
36
37
38
6
5
4.94
4
3
2
1
0.285
0.235
56
56X
55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
22X 0.4491
SYMM
34X 0.4497
4221683/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
4
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: OPT8320
OPT8320
www.ti.com
SBAS921 –APRIL 2018
EXAMPLE BOARD LAYOUT
NBP0056A
COG - 0.745 mm max height
CHIP ON GLASS
20X (3.8725)
(3.3728)
4X (3.8437)
CORNER PAD
30X (0.4497)
55
40
39
56
1
18X (0.4491)
38
2
4X (2.4913)
CORNER PAD
(2.021)
SYMM
56X ( 0.22)
32X (2.5201)
10
29
28
27
11 12
SYMM
LAND PATTERN EXAMPLE
SCALE:12X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.22)
METAL
(
0.22)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221683/A 11/2014
NOTES: (continued)
5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm.
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).
www.ti.com
Copyright © 2018, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: OPT8320
OPT8320
SBAS921 –APRIL 2018
www.ti.com
EXAMPLE STENCIL DESIGN
NBP0056A
COG - 0.745 mm max height
CHIP ON GLASS
20X (3.8725)
(3.3728)
4X (3.8437)
CORNER PAD
30X (0.4497) TYP
55
40
39
18X
(0.4491)
56
38
1
2
4X (2.4913)
CORNER
PAD
(2.021)
METAL
TYP
SYMM
32X
(2.5201)
29
10
(R0.05) TYP
28
27
12
11
SYMM
56X ( 0.25)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:15X
4221683/A 11/2014
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
6
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: OPT8320
PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
OPT8320NBP
OPT8320NBPL
ACTIVE
COG
COG
NBP
56
56
300
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
0 to 70
0 to 70
OPT8320
OPT8320
PREVIEW
NBP
3000
Green (RoHS
& no Sb/Br)
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2020
Addendum-Page 2
PACKAGE OUTLINE
NBP0056A
COG - 0.745 mm max height
SCALE 2.000
CHIP ON GLASS
8.07
7.99
B
A
BALL 1 CORNER
INDEX AREA
5.36
5.28
(0.04)
0.1 0.013
(0.06)
DIE
S
C
D
E
E
1
5
.
0
DETAIL A
(0.5)
SEE DETAIL A
0.745 MAX
C
SEATING PLANE
0.05 C
0.213
0.187
BALL TYP
TYP
2X 7.645
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
(0.19) TYP
(0.19) TYP
28
29
30
31
32
11
10
9
8
7
DIE
2X
SYMM
33
34
35
36
37
38
6
5
4.94
4
3
2
1
0.285
0.235
56
56X
55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
22X 0.4491
SYMM
34X 0.4497
4221683/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
NBP0056A
COG - 0.745 mm max height
CHIP ON GLASS
20X (3.8725)
(3.3728)
4X (3.8437)
CORNER PAD
30X (0.4497)
55
40
39
56
1
18X (0.4491)
(2.021)
38
2
4X (2.4913)
CORNER PAD
SYMM
56X ( 0.22)
32X (2.5201)
10
29
28
27
11 12
SYMM
LAND PATTERN EXAMPLE
SCALE:12X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
(
0.22)
METAL
(
0.22)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221683/A 11/2014
NOTES: (continued)
5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm.
6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).
www.ti.com
EXAMPLE STENCIL DESIGN
NBP0056A
COG - 0.745 mm max height
CHIP ON GLASS
20X (3.8725)
(3.3728)
4X (3.8437)
CORNER PAD
30X (0.4497) TYP
55
40
39
18X
(0.4491)
56
38
1
2
4X (2.4913)
CORNER
PAD
(2.021)
METAL
TYP
SYMM
32X
(2.5201)
29
10
(R0.05) TYP
28
27
12
56X ( 0.25)
11
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:15X
4221683/A 11/2014
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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