OPT3007 [TI]
具有固定 I2C 地址的超薄环境光传感器 (ALS);![OPT3007](http://pdffile.icpdf.com/pdf2/p00359/img/icpdf/OPT3007YMFT_2200628_icpdf.jpg)
型号: | OPT3007 |
厂家: | ![]() |
描述: | 具有固定 I2C 地址的超薄环境光传感器 (ALS) 传感器 |
文件: | 总39页 (文件大小:1463K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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OPT3007
ZHCSGP7 –AUGUST 2017
OPT3007 超薄环境光传感器
1 特性
3 说明
1
•
采用精密光学滤波,以与人眼匹配:
可阻隔 99%(典型值)以上的红外线 (IR)
OPT3007 是一款用于测量人眼可见光强度的单芯片照
度计。OPT3007 采用超小型 PicoStar 封装,因此该器
件适用于狭小空间。OPT3007 具有固定的寻址方案,
使该器件仅在连接四个引脚的情况下即可工作。因
此,PCB 设计人员能够针对主动传感器区域设计更大
的开口。
–
•
•
•
自动满量程设置功能
测量范围:0.01 Lux 至 83,000 Lux
23 位有效动态范围,具有
自动增益范围设定功能
•
12 种二进制加权满量程范围设置:范围间匹配度
< 0.2%(典型值)
传感器的精密光谱响应与人眼的明视响应高度匹配。
OPT3007 具有强烈的红外 (IR) 阻隔作用,在所有光源
条件下均可测量人眼的可见光强度。对于需要将传感器
安装在深色玻璃下的设计而言,这种红外阻隔功能还有
助于保持高精度。OPT3007 通常与背光 IC 或照明控
制系统配合使用,能够为用户构建基于光的各项体验,
可作为光电二极管、光敏电阻或低性能环境光传感器的
理想替代产品。
•
•
•
•
•
•
•
低工作电流:1.8µA(典型值)
工作温度范围:-40°C 至 +85°C
宽电源范围:1.6V 至 3.6V
固定的 I2C 地址
可耐受 5.5V 电压的 I/O
固定的 I2C 地址
小外形尺寸:
凭借内置的满量程设置功能,无需手动选择满量程范围
即可在 0.01 lux 至 83k lux 范围内进行测量。此功能允
许在 23 位有效动态范围内进行光测量。
–
0.856mm × 0.946mm × 0.226mm PicoStar™封
装
•
OPT3007 是 OPT3001 的缩小版
数字操作可灵活用于系统集成。测量既可连续进行也可
单次触发。数字输出通过兼容 I2C 和 SMBus 的双线制
串行接口进行报告。
2 应用
•
•
•
•
•
•
•
智能手表
可穿戴电子产品
健身手环
器件信息(1)
显示屏背光控制
照明控制系统
平板电脑和笔记本电脑
摄像机
器件型号
OPT3007
封装
封装尺寸(标称值)
0.856mm × 0.946mm ×
0.226mm
PicoStar (6)
(1) 要了解所有可用封装,请参见产品说明书末尾的封装选项附
录。
光谱响应:OPT3007 和人眼
框图
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD
OPT3007
Human Eye
VDD
OPT3007
SCL
Ambient
Light
SDA
I2C
Interface
Optical
Filter
ADC
GND
Copyright © 2017, Texas Instruments Incorporated
300
400
500
600 700
Wavelength (nm)
800
900
1000
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBOS864
OPT3007
ZHCSGP7 –AUGUST 2017
www.ti.com.cn
目录
7.6 Register Maps......................................................... 15
Application and Implementation ........................ 23
8.1 Application Information............................................ 23
8.2 Typical Application .................................................. 24
8.3 Do's and Don'ts ...................................................... 27
Power-Supply Recommendations...................... 27
1
2
3
4
5
6
特性.......................................................................... 1
8
9
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 6
6.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ...................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 12
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Soldering and Handling Recommendations.......... 28
10.3 Layout Example .................................................... 30
11 器件和文档支持 ..................................................... 31
11.1 文档支持................................................................ 31
11.2 接收文档更新通知 ................................................. 31
11.3 社区资源................................................................ 31
11.4 商标....................................................................... 31
11.5 静电放电警告......................................................... 31
11.6 Glossary................................................................ 31
12 机械、封装和可订购信息....................................... 31
7
4 修订历史记录
日期
修订版本
说明
2017 年 8 月
*
初始发行版。
2
Copyright © 2017, Texas Instruments Incorporated
OPT3007
www.ti.com.cn
ZHCSGP7 –AUGUST 2017
5 Pin Configuration and Functions
YMF Package
6-Pin PicoStar
Top View
1
2
A
B
GND
SCL
Optical
Sensing
Area
NC
NC
C
VDD
SDA
Pin Functions
PIN
DESCRIPTION
NO.
A1
B1
C1
A2
B2
NAME
GND
NC(1)
VDD
TYPE
Power
—
Ground
No connection required
Device power. Connect to a 1.6-V to 3.6-V supply.
Power
SCL
NC(1)
Digital input I2C clock. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
—
No connection required
Digital
input/output
C2
SDA
I2C data. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
(1) OPT3007 device has a fixed addressing scheme (see Serial Bus Address). This enables pin B1 and B2 to remain unconnected which
enables creating a bigger opening for the sensor active area can be made wider for optimal device performance.
Copyright © 2017, Texas Instruments Incorporated
3
OPT3007
ZHCSGP7 –AUGUST 2017
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6 Specifications
6.1 Absolute Maximum Ratings(1)
MIN
–0.5
–0.5
MAX
6
UNIT
V
VDD to GND
Voltage
SDA and SCL to GND
6
V
Current into any pin
10
mA
°C
Junction
Temperature
150
150(2)
Storage, Tstg
–65
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
–40
1.6
NOM
MAX
85
UNIT
°C
Operating temperature
Operating power-supply voltage
3.6
V
6.4 Thermal Information
OPT3007
THERMAL METRIC(1)
YMF (PicoStar)
UNIT
6 PINS
122.8
1.4
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
34.9
0.8
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ψJB
35.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2017, Texas Instruments Incorporated
OPT3007
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ZHCSGP7 –AUGUST 2017
6.5 Electrical Characteristics
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1)(1), automatic full-scale range (RN[3:0] = 1100b(1)), white LED,
and normal-angle incidence of light, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPTICAL
Peak irradiance spectral responsivity
Resolution (LSB)
550
0.01
nm
lux
lux
Lowest full-scale range, RN[3:0] = 0000b(1)
Full-scale illuminance
83865.6
3125
2500
1600
3750 ADC codes
0.64 lux per ADC code, 2620.80 lux full-scale
(RN[3:0] = 0110)(1), 2000 lux input(2)
Measurement output result
2000
2400
lux
Relative accuracy between gain
ranges(3)
Infrared response (850 nm)(2)
0.2%
0.2%
4%
Light source variation
(incandescent, halogen, fluorescent)
Bare device, no cover glass
Input illuminance > 40 lux
Input illuminance < 40 lux
2%
5%
0.01
0
Linearity
Measurement drift across temperature Input illuminance = 2000 lux
%/°C
ADC codes
lux
3
Dark condition, ADC output
0.01 lux per ADC code
0
0.03
Half-power angle
50% of full-power reading
VDD at 3.6 V and 1.6 V
44
degrees
%/V(4)
PSRR
Power-supply rejection ratio
0.1
POWER SUPPLY
VDD
VI²C
Operating range
1.6
1.6
3.6
5.5
2.5
V
V
Operating range of I2C pull-up resistor I2C pullup resistor, VDD ≤ VI²C
Active, VDD = 3.6 V
Shutdown (M[1:0] = 00)(1)
VDD = 3.6 V
1.8
0.3
3.7
0.4
0.8
µA
Dark
,
0.47
µA
µA
µA
V
IQ
Quiescent current
Active, VDD = 3.6 V
Full-scale lux
TA = 25°C
Shutdown,
(M[1:0] = 00)(1)
POR
Power-on-reset threshold
DIGITAL
I/O pin capacitance
3
800
100
pF
ms
ms
(CT = 1)(1), 800-ms mode, fixed lux range
(CT = 0)(1), 100-ms mode, fixed lux range
720
90
880
110
Total integration time(5)
Low-level input voltage
(SDA and SCL)
VIL
VIH
IIL
0
0.3 × VDD
5.5
V
V
High-level input voltage
(SDA and SCL)
0.7 × VDD
Low-level input current
(SDA and SCL)
0.01
0.01
0.25(6)
0.32
µA
V
Low-level output voltage
(SDA)
VOL
IZH
IOL= 3 mA
Pin at VDD
Output logic high, high-Z leakage
current (SDA)
0.25(6)
µA
TEMPERATURE
Specified temperature range
–40
85
°C
(1) Refers to a control field within the configuration register.
(2) Tested with the white LED calibrated to 2k lux and an 850-nm LED.
(3) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
(4) PSRR is the percent change of the measured lux output from its current value, divided by the change in power supply voltage, as
characterized by results from 3.6-V and 1.6-V power supplies.
(5) The conversion time, from start of conversion until the data are ready to be read, is the integration time plus 3 ms.
(6) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.
Copyright © 2017, Texas Instruments Incorporated
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ZHCSGP7 –AUGUST 2017
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MAX UNIT
6.6 Timing Requirements(1)
MIN
TYP
I2C FAST MODE
fSCL
SCL operating frequency
Bus free time between stop and start
Hold time after repeated start
Setup time for repeated start
Setup time for stop
0.01
1300
600
600
600
20
0.4
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tBUF
tHDSTA
tSUSTA
tSUSTO
tHDDAT
tSUDAT
tLOW
Data hold time
900
Data setup time
100
1300
600
SCL clock low period
tHIGH
SCL clock high period
Clock rise and fall time
Data rise and fall time
tRC and tFC
tRD and tFD
300
300
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
tTIMEO
28
ms
I2C HIGH-SPEED MODE
fSCL
SCL operating frequency
0.01
160
160
160
160
20
2.6
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tBUF
Bus free time between stop and start
Hold time after repeated start
Setup time for repeated start
Setup time for stop
tHDSTA
tSUSTA
tSUSTO
tHDDAT
tSUDAT
tLOW
Data hold time
140
Data setup time
20
SCL clock low period
SCL clock high period
Clock rise and fall time
Data rise and fall time
240
60
tHIGH
tRC and tFC
tRD and tFD
40
80
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
tTIMEO
28
ms
(1) All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of final settled value.
1/fSCL
tRC
tFC
70%
30%
SCL
SDA
tLOW
tHIGH
tSUSTA
tSUSTO
tHDSTA
tHDDAT
tSUDAT
70%
30%
tBUF
Start
tRD
tFD
Stop
Start
Stop
Figure 1. I2C Detailed Timing Diagram
6
Copyright © 2017, Texas Instruments Incorporated
OPT3007
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ZHCSGP7 –AUGUST 2017
6.7 Typical Characteristics
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
300
250
200
150
100
50
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Fluorescent
Halogen
Incandescent
OPT3007
Human Eye
0
0
50
100
150
200
250
300
300
400
500
600 700
Wavelength (nm)
800
900
1000
Input Light (Lux)
D002
D001
Figure 3. Output Response vs Input Illuminance, Multiple
Light Sources (Fluorescent, Halogen, Incandescent)
Figure 2. Spectral Response vs Wavelength
100
80
60
40
20
0
16000
14000
12000
10000
8000
6000
4000
2000
0
0
2000 4000 6000 8000 10000 12000 14000 16000
Input Light (Lux)
0
20
40
60
80
100
Input Light (Lux)
D003
D004
Figure 4. Output Response vs Input Illuminance
(Higher Range = 0 Lux to 16k Lux)
Figure 5. Output Response vs Input Illuminance
(Mid Range = 0 Lux to 100 Lux)
5
4
3
2
1
1.020
1.010
1.000
0.990
0.980
1.005
1.003
1.001
1.000
1.000
1.000
0
0
1
2
3
4
5
40.95
81.9
163.8
327.6
655.2
1310.4
Input Light (Lux)
D005
D006
Full-Scale Range (Lux)
Input illuminance = 30 lux,
normalized to response of 40.95 lux full-scale
Figure 6. Output Response vs Input Illuminance
(Low Range = 0 Lux to 5 Lux)
Figure 7. Full-Scale-Range Matching (Lowest 7 Ranges)
Copyright © 2017, Texas Instruments Incorporated
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ZHCSGP7 –AUGUST 2017
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Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
0.1
1.020
0.09
0.08
1.010
0.07
0.06
1.000
1.000 1.000
0.999
0.05
0.04
0.03
0.02
0.01
0
1.000
0.990
0.980
0.998
0.997
0.997
-40
-20
0
20
40
60
80
100
1310.4 2620.8 5241.6 10483.2 20966.4 41932.8 83865.6
Full-Scale Range (Lux)
Temperature (èC)
D0016
D007
Average of 30 devices
Input illuminance = 960 lux,
normalized to response of 2560 lux full-scale
Figure 9. Dark Response vs Temperature
Figure 8. Full-Scale-Range Matching (Highest 6 Ranges)
1.02
1000
900
800
700
600
1.01
1
0.99
0.98
0.97
-40
-20
0
20
40
60
80
100
120
1.6
2
2.4
2.8
3.2
3.6
Temperature ( èC)
Power Supply (V)
D008
D017
Figure 10. Normalized Response vs Temperature
Figure 11. Conversion Time vs Power Supply
1.002
1.001
1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.999
0.998
1.6
2
2.4
2.8
3.2
3.6
-90 -75 -60 -45 -30 -15
0
15 30 45 60 75 90
Power Supply (V)
Incidence Angle (Degrees)
D009
D010
Figure 12. Normalized Response vs Power-Supply Voltage
Figure 13. Normalized Response vs Illuminance Angle
8
Copyright © 2017, Texas Instruments Incorporated
OPT3007
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ZHCSGP7 –AUGUST 2017
Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
0.5
0.45
0.4
4
3.5
3
0.35
0.3
2.5
2
1.5
0.25
0.2
1
100
1000
10000
100000
0
20000
40000
60000
80000
Input Illuminance (Lux)
Input Illuminance (Lux)
D011
D0112
M[1:0] = 10b
M[1:0] = 00b
Figure 14. Supply Current vs Input Illuminance
Figure 15. Shutdown Current vs Input Illuminance
3.5
3
1.6
1.4
1.2
1
Vdd = 3.3V
Vdd = 1.6V
Vdd = 3.3V
Vdd = 1.6V
2.5
2
0.8
0.6
0.4
0.2
1.5
1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (èC)
Temperature (èC)
D013
D014
M[1:0] = 10b
M[1:0] = 00b, input illuminance = 0 lux
Figure 17. Shutdown Current vs Temperature
Figure 16. Supply Current vs Temperature
100
Vdd = 3.3V
Vdd = 1.6V
10
1
0.1
0.01
0.1
1
10
100
1000
10000
Continuous I2C Frequency (KHz)
D015
Input illuminance = 80 lux, SCL = SDA,
continuously toggled at I2C frequency
Note: A typical application runs at a lower duty cycle and thus consumes a lower current.
Figure 18. Supply Current vs Continuous I2C Frequency
Copyright © 2017, Texas Instruments Incorporated
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7 Detailed Description
7.1 Overview
The OPT3007 measures the ambient light that illuminates the device. This device measures light with a spectral
response very closely matched to the human eye, and with very good infrared rejection.
Matching the sensor spectral response to that of the human eye response is vital because ambient light sensors
are used to measure and help create ideal human lighting experiences. Strong rejection of infrared light, which a
human does not see, is a crucial component of this matching. This matching makes the OPT3007 especially
good for operation underneath windows that are visibly dark, but infrared transmissive.
The OPT3007 is fully self-contained to measure the ambient light and report the result in lux digitally over the I2C
bus.
The OPT3007 can be configured into an automatic full-scale, range-setting mode that always selects the optimal
full-scale range setting for the lighting conditions. This mode frees the user from having to program their software
for potential iterative cycles of measurement and readjustment of the full-scale range until optimal for any given
measurement. The device can be commanded to operate continuously or in single-shot measurement modes.
The device integrates its result over either 100 ms or 800 ms, so the effects of 50-Hz and 60-Hz noise sources
from typical light bulbs are nominally reduced to a minimum.
The device starts up in a low-power shutdown state, such that the OPT3007 only consumes active-operation
power after being programmed into an active state.
The OPT3007 optical filtering system is not excessively sensitive to non-ideal particles and micro-shadows on
the optical surface. This reduced sensitivity is a result of the relatively minor device dependency on uniform-
density optical illumination of the sensor area for infrared rejection. Proper optical surface cleanliness is always
recommended for best results on all optical devices.
7.2 Functional Block Diagram
VDD
VDD
OPT3007
SCL
Ambient
Light
SDA
I2C
Interface
Optical
Filter
ADC
GND
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OPT3007
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ZHCSGP7 –AUGUST 2017
7.3 Feature Description
7.3.1 Human Eye Matching
The OPT3007 spectral response closely matches that of the human eye. If the ambient light sensor
measurement is used to help create a good human experience, or create optical conditions that are optimal for a
human, the sensor must measure the same spectrum of light that a human sees.
The device also has excellent infrared light (IR) rejection. This IR rejection is especially important because many
real-world lighting sources have significant infrared content that humans do not see. If the sensor measures
infrared light that the human eye does not see, then a true human experience is not accurately represented.
Furthermore, if the ambient light sensor is hidden underneath a dark window (such that the end-product user
cannot see the sensor) the infrared rejection of the OPT3007 becomes significantly more important because
many dark windows attenuate visible light but transmit infrared light. This attenuation of visible light and lack of
attenuation of IR light amplifies the ratio of the infrared light to visible light that illuminates the sensor. Results
can still be well matched to the human eye under this condition because of the high infrared rejection of the
OPT3007.
7.3.2 Automatic Full-Scale Range Setting
The OPT3007 has an automatic full-scale range setting feature that eliminates the need to predict and set the
optimal range for the device. In this mode, the OPT3007 automatically selects the optimal full-scale range for the
given lighting condition. The OPT3007 has a high degree of result matching between the full-scale range
settings. This matching eliminates the problem of varying results or the need for range-specific, user-calibrated
gain factors when different full-scale ranges are chosen. For further details, see the Automatic Full-Scale Setting
Mode section.
7.3.3 I2C Bus Overview
The OPT3007 offers compatibility with both I2C and SMBus interfaces. The I2C and SMBus protocols are
essentially compatible with one another. The I2C interface is used throughout this document as the primary
example with the SMBus protocol specified only when a difference between the two protocols is discussed.
The OPT3007 is connected to the bus with two pins: an SCL clock input pin and an SDA open-drain bidirectional
data pin. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus
access, and generates start and stop conditions. To address a specific device, the master initiates a start
condition by pulling the data signal line (SDA) from a high logic level to a low logic level while SCL is high. All
slaves on the bus shift in the slave address byte on the SCL rising edge, with the last bit indicating whether a
read or write operation is intended. During the ninth clock pulse, the slave being addressed responds to the
master by generating an acknowledge bit by pulling SDA low.
Data transfer is then initiated and eight bits of data are sent, followed by an acknowledge bit. During data
transfer, SDA must remain stable while SCL is high. Any change in SDA while SCL is high is interpreted as a
start or stop condition. When all data are transferred, the master generates a stop condition, indicated by pulling
SDA from low to high while SCL is high. The OPT3007 includes a 28-ms timeout on the I2C interface to prevent
locking up the bus. If the SCL line is held low for this duration of time, the bus state machine is reset.
7.3.3.1 Serial Bus Address
To communicate with the OPT3007, the master must first initiate an I2C start command. Then, the master must
address slave devices via a slave address byte. The slave address byte consists of a seven bit address 1000101
and a direction bit that indicates whether the action is to be a read or write operation.
7.3.3.2 Serial Interface
The OPT3007 operates as a slave device on both the I2C bus and SMBus. Connections to the bus are made via
the SCL clock input line and the SDA open-drain I/O line. The OPT3007 supports the transmission protocol for
standard mode (up to 100 kHz), fast mode (up to 400 kHz), and high-speed mode (up to 2.6 MHz). All data bytes
are transmitted most-significant bits first.
The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of
input spikes and bus noise. See the Electrical Interface section for further details of the I2C bus noise immunity.
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7.4 Device Functional Modes
7.4.1 Automatic Full-Scale Setting Mode
The OPT3007 has an automatic full-scale-range setting mode that eliminates the need for a user to predict and
set the optimal range for the device. This mode is entered when the configuration register range number field
(RN[3:0]) is set to 1100b.
The first measurement that the device takes in auto-range mode is a 10-ms range assessment measurement.
The device then determines the appropriate full-scale range to take its first full measurement.
For subsequent measurements, the full-scale range is set by the result of the previous measurement. If a
measurement is towards the low side of full-scale, the full-scale range is decreased by one or two settings for the
next measurement. If a measurement is towards the upper side of full-scale, the full-scale range is increased by
one setting for the next measurement.
If the measurement exceeds the full-scale range, resulting from a fast increasing optical transient event, the
current measurement is aborted. This invalid measurement is not reported. If the scale is not at its maximum, the
device increases the scale by one step and a new measurement is retaken with that scale. Therefore, during a
fast increasing optical transient in this mode, a measurement can possibly take longer to complete and report
than indicated by the configuration register conversion time field (CT).
7.5 Programming
The OPT3007 supports the transmission protocol for standard mode (up to 100 kHz), fast mode (up to 400 kHz),
and high-speed mode (up to 2.6 MHz). Fast and standard modes are described as the default protocol, referred
to as F/S. High-speed mode is described in the High-Speed I2C Mode section.
7.5.1 Writing and Reading
Accessing a specific register on the OPT3007 is accomplished by writing the appropriate register address during
the I2C transaction sequence. Refer to Table 1 for a complete list of registers and their corresponding register
addresses. The value for the register address (as shown in Figure 19) is the first byte transferred after the slave
address byte with the R/W bit low.
1
9
1
9
SCL
SDA
RA RA RA RA RA RA RA RA
1
0
0
0
1
0
1
R/W
7
6
5
4
3
2
1
0
Stop by
Master
Start by
Master
ACK by
Device
ACK by
Device
(optional)
Frame 1: Two-Wire Slave Address Byte (1)
Frame 2: Register Address Byte
Figure 19. Setting the I2C Register Address
Writing to a register begins with the first byte transmitted by the master. This byte is the slave address with the
R/W bit low. The OPT3007 then acknowledges receipt of a valid address. The next byte transmitted by the
master is the address of the register that data are to be written to. The next two bytes are written to the register
addressed by the register address. The OPT3007 acknowledges receipt of each data byte. The master may
terminate the data transfer by generating a start or stop condition.
When reading from the OPT3007, the last value stored in the register address by a write operation determines
which register is read during a read operation. To change the register address for a read operation, a new partial
I2C write transaction must be initiated. This partial write is accomplished by issuing a slave address byte with the
R/W bit low, followed by the register address byte and a stop command. The master then generates a start
condition and sends the slave address byte with the R/W bit high to initiate the read command. The next byte is
12
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Programming (continued)
transmitted by the slave and is the most significant byte of the register indicated by the register address. This
byte is followed by an acknowledge from the master; then the slave transmits the least significant byte. The
master acknowledges receipt of the data byte. The master may terminate the data transfer by generating a not-
acknowledge after receiving any data byte, or by generating a start or stop condition. If repeated reads from the
same register are desired, continually sending the register address bytes is not necessary; the OPT3007 retains
the register address until that number is changed by the next write operation.
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Programming (continued)
Figure 20 and Figure 21 show the write and read operation timing diagrams, respectively. Note that register
bytes are sent most significant byte first, followed by the least significant byte.
1
9
1
9
1
9
1
9
SCL
RA RA RA RA RA RA RA RA
SDA
1
0
0
0
1
0
1
R/W
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
7
6
5
4
3
2
1
0
Start by
Master
ACK by
Device
ACK by
Device
ACK by
Device
Stop by
Master
ACK by
Device
Frame 1 Two-Wire Slave Address Byte (1)
Frame 2 Register Address Byte
Frame 3 Data MSByte
Frame 4 Data LSByte
Figure 20. I2C Write Example
1
9
1
9
1
9
SCL
SDA
R/W
1
0
0
0
1
0
1
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
From Device
No ACK
by
Master(2)
Stop by
Master
Start by
Master
ACK by
Device
From
Device
ACK by
Master
Frame 1 Two-Wire Slave Address Byte (1)
Frame 2 Data MSByte
Frame 3 Data LSByte
(1) An ACK by the master can also be sent.
Figure 21. I2C Read Example
7.5.1.1 High-Speed I2C Mode
When the bus is idle, both the SDA and SCL lines are pulled high by the pullup resistors or active pullup devices.
The master generates a start condition followed by a valid serial byte containing the high-speed (HS) master
code 0000 1XXXb. This transmission is made in either standard mode or fast mode (up to 400 kHz). The
OPT3007 does not acknowledge the HS master code but does recognize the code and switches its internal filters
to support a 2.6-MHz operation.
The master then generates a repeated start condition (a repeated start condition has the same timing as the start
condition). After this repeated start condition, the protocol is the same as F/S mode, except that transmission
speeds up to 2.6 MHz are allowed. Instead of using a stop condition, use repeated start conditions to secure the
bus in HS mode. A stop condition ends the HS mode and switches all internal filters of the OPT3007 to support
the F/S mode.
7.5.1.2 General-Call Reset Command
The I2C general-call reset allows the host controller in one command to reset all devices on the bus that respond
to the general-call reset command. The general call is initiated by writing to the I2C address 0 (0000 0000b). The
reset command is initiated when the subsequent second address byte is 06h (0000 0110b). With this transaction,
the device issues an acknowledge bit and sets all of its registers to the power-on-reset default condition.
14
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7.6 Register Maps
7.6.1 Internal Registers
The device is operated over the I2C bus with registers that contain configuration, status, and result information. All registers are 16 bits long.
There are four main registers: result, configuration, low-limit, and high-limit. There are also two ID registers: manufacturer ID and device ID. Table 1 lists
these registers.
Table 1. Register Map
ADDRESS
REGISTER
BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
(HEX)(1)
00h
Result
Configuration
Low Limit
E3
RN3
LE3
E2
RN2
LE2
E1
RN1
LE1
E0
RN0
LE0
R11
CT
R10
M1
R9
M0
R8
OVF
TL8
TH8
ID8
R7
CRF
TL7
TH7
ID7
R6
FH
R5
FL
R4
L
R3
POL
TL3
TH3
ID3
R2
ME
R1
FC1
TL1
TH1
ID1
R0
FC0
TL0
TH0
ID0
01h
02h
TL11
TH11
ID11
DID11
TL10
TH10
ID10
DID10
TL9
TH9
ID9
TL6
TH6
ID6
TL5
TH5
ID5
TL4
TH4
ID4
DID4
TL2
TH2
ID2
High Limit
03h
HE3
ID15
DID15
HE2
ID14
DID14
HE1
ID13
DID13
HE0
ID12
DID12
Manufacturer ID
Device ID
7Eh
7Fh
DID9
DID8
DID7
DID6
DID5
DID3
DID2
DID1
DID0
(1) Register offset and register address are used interchangeably.
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7.6.1.1 Register Descriptions
NOTE
Register offset and register address are used interchangeably.
7.6.1.1.1 Result Register (Offset = 00h)
This register contains the result of the most recent light to digital conversion. This 16-bit register has two fields: a
4-bit exponent and a 12-bit mantissa.
Figure 22. Result Register (Read-Only)
15
E3
R
14
E2
R
13
E1
R
12
E0
R
11
R11
R
10
R10
R
9
R9
R
8
R8
R
7
R7
R
6
R6
R
5
R5
R
4
R4
R
3
R3
R
2
R2
R
1
R1
R
0
R0
R
LEGEND: R = Read only
Table 2. Result Register Field Descriptions
Bit
Field
Type
Reset
Description
Exponent.
15:12
E[3:0]
R
0h
These bits are the exponent bits. Table 3 provides further details.
Fractional result.
These bits are the result in straight binary coding (zero to full-scale).
11:0
R[11:0]
R
000h
Table 3. Full-Scale Range and LSB Size as a Function of Exponent Level
E3
0
0
0
0
0
0
0
0
1
1
1
1
E2
0
0
0
0
1
1
1
1
0
0
0
0
E1
0
0
1
1
0
0
1
1
0
0
1
1
E0
0
1
0
1
0
1
0
1
0
1
0
1
FULL-SCALE RANGE (lux)
40.95
LSB SIZE (lux per LSB)
0.01
0.02
0.04
0.08
0.16
0.32
0.64
1.28
2.56
5.12
10.24
20.48
81.90
163.80
327.60
655.20
1310.40
2620.80
5241.60
10483.20
20966.40
41932.80
83865.60
The formula to translate this register into lux is given in Equation 1:
lux = LSB_Size × R[11:0]
where
•
LSB_Size = 0.01 × 2E[3:0]
(1)
(2)
LSB_Size can also be taken from Table 3. The complete lux equation is shown in Equation 2:
lux = 0.01 × (2E[3:0]) × R[11:0]
A series of result register output examples with the corresponding LSB weight and resulting lux are given in
Table 4. Note that many combinations of exponents (E[3:0]) and fractional results (R[11:0]) can map onto the
same lux result, as shown in the examples of Table 4.
16
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Table 4. Examples of Decoding the Result Register into lux
FRACTIONAL
RESULT
(R[11:0], HEX)
RESULT REGISTER
(BITS 15:0, BINARY)
EXPONENT
(E[3:0], HEX)
LSB WEIGHT
(LUX, DECIMAL)
RESULTING LUX
(DECIMAL)
0000 0000 0000 0001b
0000 1111 1111 1111b
0011 0100 0101 0110b
0111 1000 1001 1010b
1000 1000 0000 0000b
1001 0100 0000 0000b
1010 0010 0000 0000b
1011 0001 0000 0000b
1011 0000 0000 0001b
1011 1111 1111 1111b
00h
00h
03h
07h
08h
09h
0Ah
0Bh
0Bh
0Bh
001h
FFFh
456h
89Ah
800h
400h
200h
100h
001h
FFFh
0.01
0.01
0.01
40.95
0.08
88.80
1.28
2818.56
5242.88
5242.88
5242.88
5242.88
20.48
2.56
5.12
10.24
20.48
20.48
20.48
83865.60
Note that the exponent field can be disabled (set to zero) by enabling the exponent mask (configuration register,
ME field = 1) and manually programming the full-scale range (configuration register, RN[3:0] < 1100b (0Ch)),
allowing for simpler operation in a manually-programmed, full-scale mode. Calculating lux from the result register
contents only requires multiplying the result register by the LSB weight (in lux) associated with the specific
programmed full-scale range (see Table 3). See the Low-Limit Register for details.
See the configuration register conversion time field (CT, bit 11) description for more information on lux resolution
as a function of conversion time.
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7.6.1.1.2 Configuration Register (Offset = 01h) [Reset = C810h]
This register controls the major operational modes of the device. This register has 11 fields, which are
documented below. If a measurement conversion is in progress when the configuration register is written, the
active measurement conversion immediately aborts. If the new configuration register directs a new conversion,
that conversion is subsequently started.
Figure 23. Configuration Register
15
14
13
12
11
CT
10
M1
9
8
OVF
R
RN3
R/W
RN2
R/W
RN1
R/W
RN0
R/W
M0
R/W
R/W
R/W
7
CRF
R
6
FH
R
5
FL
R
4
L
3
2
1
0
POL
R/W
ME
R/W
FC1
R/W
FC0
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only
Table 5. Configuration Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
Range number field (read or write).
The range number field selects the full-scale lux range of the device. The format of this field is
the same as the result register exponent field (E[3:0]); see Table 3. When RN[3:0] is set to
1100b (0Ch), the device operates in automatic full-scale setting mode, as described in the
Automatic Full-Scale Setting Mode section. In this mode, the automatically chosen range is
reported in the result exponent (register 00h, E[3:0]).
15:12
RN[3:0]
R/W
1100b
The device powers up as 1100 in automatic full-scale setting mode. Codes 1101b, 1110b, and
1111b (0Dh, 0Eh, and 0Fh) are reserved for future use.
Conversion time field (read or write).
The conversion time field determines the length of the light to digital conversion process. The
choices are 100 ms and 800 ms. A longer integration time allows for a lower noise
measurement.
The conversion time also relates to the effective resolution of the data conversion process. The
800-ms conversion time allows for the fully specified lux resolution. The 100-ms conversion
time with full-scale ranges above 0101b for E[3:0] in the result and configuration registers also
allows for the fully specified lux resolution. The 100-ms conversion time with full-scale ranges
below and including 0101b for E[3:0] can reduce the effective result resolution by up to three
bits, as a function of the selected full-scale range. Range 0101b reduces by one bit. Ranges
0100b, 0011b, 0010b, and 0001b reduces by two bits. Range 0000b reduces by three bits.
The result register format and associated LSB weight does not change as a function of the
conversion time.
11
CT
R/W
1b
0 = 100 ms
1 = 800 ms
Mode of conversion operation field (read or write).
The mode of conversion operation field controls whether the device is operating in continuous
conversion, single-shot, or low-power shutdown mode. The default is 00b (shutdown mode),
such that upon power-up, the device only consumes operational level power after appropriately
programming the device.
10:9
M[1:0]
R/W
00b
When single-shot mode is selected by writing 01b to this field, the field continues to read 01b
while the device is actively converting. When the single-shot conversion is complete, the mode
of conversion operation field is automatically set to 00b and the device is shut down.
00 = Shutdown (default)
01 = Single-shot
10, 11 = Continuous conversions
18
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Table 5. Configuration Register Field Descriptions (continued)
BIT
FIELD
TYPE
RESET
DESCRIPTION
Overflow flag field (read-only).
The overflow flag field indicates when an overflow condition occurs in the data conversion
process, typically because the light illuminating the device exceeds the programmed full-scale
range of the device. Under this condition OVF is set to 1, otherwise OVF remains at 0. The
field is reevaluated on every measurement.
If the full-scale range is manually set (RN[3:0] field < 1100b), the overflow flag field can be set
while the result register reports a value less than full-scale. This result occurs if the input light
has a temporary high spike level that temporarily overloads the integrating ADC converter
circuitry but returns to a level within range before the conversion is complete. Thus, the
overflow flag reports a possible error in the conversion process. This behavior is common to
integrating-style converters.
8
OVF
R
0b
If the full-scale range is automatically set (RN[3:0] field = 1100b), the only condition that sets
the overflow flag field is if the input light is beyond the full-scale level of the entire device.
When there is an overflow condition and the full-scale range is not at maximum, the OPT3007
aborts its current conversion, sets the full-scale range to a higher level, and starts a new
conversion. The flag is set at the end of the process to indicate a scale increase and that a
new measurement is being taken. This process repeats until there is either no overflow
condition or until the full-scale range is set to its maximum range.
Conversion ready field (read-only).
The conversion ready field indicates when a conversion completes. The field is set to 1 at the
end of a conversion and is cleared (set to 0) when the configuration register is subsequently
read or written with any value except one containing the shutdown mode (mode of operation
field, M[1:0] = 00b). Writing a shutdown mode does not affect the state of this field.
7
6
CRF
FH
R
R
0b
0b
Flag high field (read-only).
The flag high field (FH) identifies that the result of a conversion is larger than a specified level
of interest. FH is set to 1 when the result is larger than the level in the high-limit register
(register address 03h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]).
Flag low field (read-only).
The flag low field (FL) identifies that the result of a conversion is smaller than a specified level
of interest. FL is set to 1 when the result is smaller than the level in the low-limit register
(register address 02h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]).
5
4
FL
L
R
R
0b
1b
Unused
Mask exponent field (read or write).
The mask exponent field forces the result register exponent field (register 00h, bits E[3:0]) to
0000b when the full-scale range is manually set, which can simplify the processing of the
result register when the full-scale range is manually programmed. This behavior occurs when
the mask exponent field is set to 1 and the range number field (RN[3:0]) is set to less than
1100b. Note that the masking is only performed to the result register.
2
ME
R/W
0b
Fault count field (read or write).
The fault count field instructs the device as to how many consecutive fault events are required
to trigger the interrupt reporting mechanisms: the flag high field (FH) and the flag low field (FL).
The fault events are described in the flag high field (FH), and flag low field (FL) descriptions.
00 = One fault count (default)
1:0
FC[1:0]
R/W
00b
01 = Two fault counts
10 = Four fault counts
11 = Eight fault counts
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7.6.1.1.3 Low-Limit Register (Offset = 02h) [Reset = C0000h]
This register sets the lower comparison limit for the interrupt reporting mechanisms: the flag high field (FH) and
the flag low field (FL).
Figure 24. Low-Limit Register
15
14
13
12
11
10
9
8
LE3
R/W
LE2
R/W
LE1
R/W
LE0
R/W
TL11
R/W
TL10
R/W
TL9
R/W
TL8
R/W
7
6
5
4
3
2
1
0
TL7
R/W
TL6
R/W
TL5
R/W
TL4
R/W
TL3
R/W
TL2
R/W
TL1
R/W
TL0
R/W
LEGEND: R/W = Read/Write
Table 6. Low-Limit Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
Exponent.
15:12
LE[3:0]
R/W
0h
These bits are the exponent bits. Table 7 provides further details.
Result.
11:0
TL[11:0]
R/W
000h
These bits are the result in straight binary coding (zero to full-scale).
The format of this register is nearly identical to the format of the result register described in the Result Register.
The low-limit register exponent (LE[3:0]) is similar to the result register exponent (E[3:0]). The low-limit register
result (TL[11:0]) is similar to result register result (R[11:0]).
The equation to translate this register into the lux threshold is given in Equation 3, which is similar to the
equation for the result register, Equation 2.
lux = 0.01 × (2LE[3:0]) × TL[11:0]
(3)
Table 7 gives the full-scale range and LSB size as it applies to the low-limit register. The detailed discussion and
examples given in for the Result Register apply to the low-limit register as well.
Table 7. Full-Scale Range and LSB Size as a Function of Exponent Level
LE3
0
LE2
0
LE1
0
LE0
0
FULL-SCALE RANGE (lux)
40.95
LSB SIZE (lux per LSB)
0.01
0.02
0.04
0.08
0.16
0.32
0.64
1.28
2.56
5.12
10.24
20.48
0
0
0
1
81.90
0
0
1
0
163.80
0
0
1
1
327.60
0
1
0
0
655.20
0
1
0
1
1310.40
0
1
1
0
2620.80
0
1
1
1
5241.60
1
0
0
0
10483.20
20966.40
41932.80
83865.60
1
0
0
1
1
0
1
0
1
0
1
1
NOTE
The result and limit registers are all converted into lux values internally for comparison.
These registers can have different exponent fields. However, when using a manually-set
full-scale range (configuration register, RN < 0Ch, with mask enable (ME) active),
programming the manually-set full-scale range into the LE[3:0] and HE[3:0] fields can
simplify the choice of programming the register. This simplification results in the user only
having to think about the fractional result and not the exponent part of the result.
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7.6.1.1.4 High-Limit Register (Offset = 03h) [Reset = BFFFh]
The high-limit register sets the upper comparison limit for the interrupt reporting mechanisms: the flag high field
(FH) and the flag low field (FL). The format of this register is almost identical to the format of the low-limit register
(described in the Low-Limit Register) and the result register (described in the Result Register). To explain the
similarity in more detail, the high-limit register exponent (HE[3:0]) is similar to the low-limit register exponent
(LE[3:0]) and the result register exponent (E[3:0]). The high-limit register result (TH[11:0]) is similar to the low-
limit result (TH[11:0]) and the result register result (R[11:0]). Note that the comparison of the high-limit register
with the result register is unaffected by the ME bit.
When using a manually-set, full-scale range with the mask enable (ME) active, programming the manually-set,
full-scale range into the HE[3:0] bits can simplify the choice of values required to program into this register. The
formula to translate this register into lux is similar to Equation 3. The full-scale values are similar to Table 3.
Figure 25. High-Limit Register
15
14
13
12
11
10
9
8
HE3
R/W
HE2
R/W
HE1
R/W
HE0
R/W
TH11
R/W
TH10
R/W
TH9
R/W
TH8
R/W
7
6
5
4
3
2
1
0
TH7
R/W
TH6
R/W
TH5
R/W
TH4
R/W
TH3
R/W
TH2
R/W
TH1
R/W
TH0
R/W
LEGEND: R/W = Read/Write
Table 8. High-Limit Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
Exponent.
These bits are the exponent bits.
15:12
HE[3:0]
R/W
Bh
Result.
11:0
TH[11:0]
R/W
FFFh
These bits are the result in straight binary coding (zero to full-scale).
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21
OPT3007
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7.6.1.1.5 Manufacturer ID Register (Offset = 7Eh) [Reset = 5449h]
This register is intended to help uniquely identify the device.
Figure 26. Manufacturer ID Register
15
ID15
R
14
ID14
R
13
ID13
R
12
ID12
R
11
ID11
R
10
ID10
R
9
ID9
R
8
ID8
R
7
ID7
R
6
ID6
R
5
ID5
R
4
ID4
R
3
ID3
R
2
ID2
R
1
ID1
R
0
ID0
R
LEGEND: R = Read only
Table 9. Manufacturer ID Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
Manufacturer ID.
15:0
ID[15:0]
R
5449h
The manufacturer ID reads 5449h. In ASCII code, this register reads TI.
7.6.1.1.6 Device ID Register (Offset = 7Fh) [Reset = 3001h]
This register is also intended to help uniquely identify the device.
Figure 27. Device ID Register
15
DID15
R
14
DID14
R
13
DID13
R
12
DID12
R
11
DID11
R
10
DID10
R
9
DID9
R
8
DID8
R
7
DID7
R
6
DID6
R
5
DID5
R
4
DID4
R
3
DID3
R
2
DID2
R
1
DID1
R
0
DID0
R
LEGEND: R = Read only
Table 10. Device ID Register Field Descriptions
BIT
FIELD
TYPE
RESET
DESCRIPTION
Device ID.
The device ID reads 3001h.
15:0
DID[15:0]
R
3001h
22
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
Ambient light sensors are used in a wide variety of applications that require control as a function of ambient light.
Because ambient light sensors nominally match the human eye spectral response, they are superior to
photodiodes when the goal is to create an experience for human beings. Very common applications include
display optical-intensity control and industrial or home lighting control.
There are two categories of interface to the OPT3007: electrical and optical.
8.1.1 Electrical Interface
The electrical interface is quite simple, as illustrated in Figure 28. Connect the OPT3007 I2C SDA and SCL pins
to the same pins of an applications processor, microcontroller, or other digital processor. Connect pullup resistors
between a power supply appropriate for digital communication and the SDA and SCL pins (because they have
open-drain output structures).The resistor choice can be optimized in conjunction to the bus capacitance to
balance the system speed, power, noise immunity, and other requirements.
The power supply and grounding considerations are discussed in the Power-Supply Recommendations section.
Although spike suppression is integrated in the SDA and SCL pin circuits, use proper layout practices to
minimize the amount of coupling into the communication lines. One possible introduction of noise occurs from
capacitively coupling signal edges between the two communication lines themselves. Another possible noise
introduction comes from other switching noise sources present in the system, especially for long communication
lines. In noisy environments, shield communication lines to reduce the possibility of unintended noise coupling
into the digital I/O lines that could be incorrectly interpreted.
8.1.2 Optical Interface
The optical interface is physically located on the same side of the device as the electrical interface, as shown in
the Sensing Area of the mechanical packages at the end of this data sheet. At a system level, this configuration
requires that the light that illuminates the sensor must come through the PCB or FPCB. Typically, the best
solution is to create a cutout area in the PCB. Other solutions are possible, but with associated design tradeoffs.
This cutout must be carefully designed because the dimensions and tolerances impact the net-system, optical
field-of-view performance. The design of this cutout is discussed more in the Design Requirements section.
Physical components, such as a plastic housing and a window that allows light from outside of the design to
illuminate the sensor (see Figure 29), can help protect the OPT3007 and neighboring circuitry. Sometimes, a
dark or opaque window is used to further enhance the visual appeal of the design by hiding the sensor from
view. This window material is typically transparent plastic or glass.
Any physical component that affects the light that illuminates the sensing area of a light sensor also affects the
performance of that light sensor. Therefore, for optimal performance, make sure to understand and control the
effect of these components. Design a window width and height to permit light from a sufficient field of view to
illuminate the sensor. For best performance, use a field of view of at least ±35°, or ideally ±45° or more.
Understanding and designing the field of view is discussed further in application report OPT3001: Ambient Light
Sensor Application Guide (SBEA002).
The visible-spectrum transmission for dark windows typically ranges between 5% to 30%, but can be less than
1%. Specify a visible-spectrum transmission as low as, but no more than, necessary to achieve sufficient visual
appeal because decreased transmission decreases the available light for the sensor to measure. The windows
are made dark by either applying an ink to a transparent window material, or including a dye or other optical
substance within the window material itself. This attenuating transmission in the visible spectrum of the window
creates a ratio between the light on the outside of the design and the light that is measured by the OPT3007. To
accurately measure the light outside of the design, compensate the OPT3007 measurement for this ratio.
Copyright © 2017, Texas Instruments Incorporated
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Application Information (continued)
Ambient light sensors are used to help create ideal lighting experiences for humans; therefore, the matching of
the sensor spectral response to that of the human eye response is vital. Infrared light is not visible to the human
eye, and can interfere with the measurement of visible light when sensors lack infrared rejection. Therefore, the
ratio of visible light to interfering infrared light affects the accuracy of any practical system that represents the
human eye. The strong rejection of infrared light by the OPT3007 allows measurements consistent with human
perception under high-infrared lighting conditions, such as from incandescent, halogen, or sunlight sources.
Although the inks and dyes of dark windows serve their primary purpose of being minimally transmissive to
visible light, some inks and dyes can also be very transmissive to infrared light. The use of these inks and dyes
further decreases the ratio of visible to infrared light, and thus decreases sensor measurement accuracy.
However, because of the excellent infrared rejection of the OPT3007, this effect is minimized, and good results
are achieved under a dark window with similar spectral responses to those shown in Figure 31.
For best accuracy, avoid grill-like window structures, unless the designer understands the optical effects
sufficiently. These grill-like window structures create a nonuniform illumination pattern at the sensor that make
light measurement results vary with placement tolerances and angle of incidence of the light. If a grill-like
structure is desired, the OPT3007 is an excellent sensor choice because it is minimally sensitive to illumination
uniformity issues disrupting the measurement process.
Light pipes can appear attractive for aiding in the optomechanical design that brings light to the sensor; however,
do not use light pipes with any ambient light sensor unless the system designer fully understands the
ramifications of the optical physics of light pipes within the full context of his design and objectives.
8.2 Typical Application
Measuring the ambient light with the OPT3007 mounted on a flexible printed-circuit board (FPCB) is described in
this section. The schematic for this design is shown in Figure 28.
VDD
VDD
OPT3007
Digital Processor
SCL
SDA
SCL
SDA
Ambient
Light
I2C
Interface
Optical
Filter
ADC
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 28. Measuring Ambient Light on an FPCB
24
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OPT3007
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Typical Application (continued)
8.2.1 Design Requirements
This design focuses on the field of view, or angular response, of an OPT3007 mounted on an FPCB with an area
cut out that permits light to illuminate the sensor. As a result of the geometry of this cutout, the system field of
view (angular response) depends on the axis of rotation. One axis of rotation has a less restricted field of view,
and the other axis of rotation has a more restricted field of view. The basic requirements of this design are:
•
•
Mount the OPT3007 onto an FPCB with a cutout that allows light to illuminate the sensor.
The field of view along the axis of rotation with the less restricted field of view must match the device
performance.
•
The field of view for the more restricted axis of rotation must be minimum of ±30°.
Field of view is traditionally defined as the angle at which the angular response is 50% of the maximum value of
the system response.
8.2.2 Detailed Design Procedure
8.2.2.1 Optomechanical Design
After completing the electrical design (see Figure 28), the next task is the optomechanical design of the FPCB
cutout. Design this cutout in conjunction with the tolerance capabilities of the FPCB manufacturer. Or,
conversely, choose the FPCB manufacturer for its capabilities of optimally creating this cutout. A semi-
rectangular shape of the cutout, created with a standard FPCB laser, is presented here. There are many
alternate approaches with different cost, tolerance, and performance tradeoffs.
An image of the created FPCB with the rectangular cutout is shown in Figure 29. The long (vertical) direction of
the cutout obviously has no effect on the angular response because any shadows created from the FPCB do not
come near the sensor. The long cutout direction defines the axis of rotation with the less restricted field of view.
The narrow (horizontal) direction of the cutout, which is limited by the electrical connections to OPT3007, can
create shadows that can have a minor impact on the angular response. The narrow cutout direction defines the
axis of rotation of the more restricted view. The possibility of shadows are illustrated in Figure 30, a cross-
sectional diagram showing the OPT3007 device, with the sensing area, soldered to the FPCB with the cutout.
Figure 29. Image of FPCB With OPT3007 Mounted, Receiving Light Through the Cutout
Device
Illuminated
Sensor
Shadowed
Sensor
Copper Pillar Electrical Connection
Solder
Sensing Area
Shadow
FPCB
FPCB
Shadow Limiting
Point
Light entering from
30 degree angle
Figure 30. Cross-Sectional Diagram of OPT3007 Soldered to an FPCB With a Cutout, Including Light
Entering From an Angle
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Typical Application (continued)
To design the angular response to have greater than 50% response at 30°, the optical mechanisms must be
understood. This analysis is simplified by assuming a perfectly rectangular cutout. The concepts for this
rectangular cutout apply to nonrectangular cutouts, but require a more complex 3D analysis. The analysis
performed here is approximate because the actual cutout is not perfectly rectangular.
The net system response is the response of the device without the shadowing effect, multiplied by the
percentage of the device that is illuminated, per Equation 4:
Net System Response (%) = Device Response (%) × Device Illumination (%)
(4)
The shadow impacts the percentage of the sensor that can be illuminated, as seen in Figure 30. The percent
response of a shadowed sensor is the percent of the sensor that is illuminated.
The percent of the sensor that must be illuminated to achieve > 50% response is derived by the sequence of
Equation 5 through Equation 7.
Net System Response > 50%
(5)
(6)
(7)
Device Response × Device Illumination > 50%
Device Illumination > 50% / Device Response
The device has a 75% response at 30°, as shown in Figure 13, and is a little less than the expected cosine of
30°. The resulting device illumination is shown inEquation 8.
Device Illumination > 66%
(8)
Hence, the 3-dimensional geometry illustrated in Figure 30 must permit greater than 66% of the sensor to be
illuminated at a 30° angle of incident light. To quantify the geometry of this design, the post-SMT solder thickness
is approximately 37 µm (half the thickness of the pre-SMT solder paste thickness), the copper pillar electrical
connection is 7 µm, and the FPCB is 105 µm. Therefore, the shadow limiting point is 37 µm + 7 µm + 105 µm =
149 µm, higher than the sensing surface. The 30° angle shadow extends beyond that shadow limiting point per
Equation 9.
Shadow = Tan (Illumination_Angle) × Shadow_limiting_height = Tan (30degrees) × 149 µm = 86 µm
(9)
For this instance of the design and tolerance, the shadow limiting point of FPCB cutout is roughly even with the
sensor edge, so 86 µm of the sensor is under shadow. If the shadow limiting point was not even with the sensor
edge because of either the design or the tolerances, an extra term is added per the system geometry. Given that
the sensor width is 381 µm (per the attached mechanical drawing at the end of this data sheet), the amount of
illuminated sensor is 381 µm – 86 µm = 295 µm = 77.4%.
The net response at the 30° angle is predicted byEquation 10
Net System Response = Device Response × Device Illumination = 75% × 77.4% = 58%
(10)
There might be an additional need to put a product casing over the assembly of OPT3007 and the FPCB. The
window sizing and placement for such an assembly is discussed in more rigorous detail in application report
OPT3001: Ambient Light Sensor Application Guide (SBEA002).
26
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OPT3007
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ZHCSGP7 –AUGUST 2017
Typical Application (continued)
8.2.3 Application Curves
To validate the angular response of the design, put a light source in a fixed position, allow the device assembly
to rotate, and take device measurements at a series of angles. The resulting angular response of this design
along the less-restricted rotational axis is shown in Figure 31. The resulting angular response of the more-
restricted rotational axis is shown in Figure 32. The response of the device at a 30° angle is approximately 60%,
and is very close to the 58% predicted by Equation 10 in the preceding analysis.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -75 -60 -45 -30 -15
0
15 30 45 60 75 90
-90 -75 -60 -45 -30 -15
0
15 30 45 60 75 90
Incidence Angle (Degrees)
Incidence Angle (Degrees)
D010
D022
Figure 31. Angular Response of this FPCB Design Along
the Less-Restricted Rotational Axis
Figure 32. Angular Response of this FPCB Design Along
the More-Restricted Rotational Axis
8.3 Do's and Don'ts
As with any optical product, take special care when handling the OPT3007. The OPT3007 is a piece of active
silicon, without the mechanical protection of an epoxy-like package or other reenforcement. This design allows
the device to be as thin as possible. Take extra care to handle the device gently in order to not crack or break
the device. Use a properly-sized vacuum manipulation tool to handle the device.
The optical surface of the device must be kept clean for optimal performance, both when prototyping with the
device, and during mass production manufacturing procedures. Keep the optical surface clean of fingerprints,
dust, and other optical-inhibiting contaminants.
If the optical surface of the device requires cleaning, use a few gentle brushes with a soft swab of deionized
water or isopropyl alcohol. Avoid potentially abrasive cleaning and manipulating tools and excessive force that
can scratch the optical surface.
If the OPT3007 performs less than optimally, inspect the optical surface for dirt, scratches, or other optical
artifacts.
9 Power-Supply Recommendations
Although the OPT3007 has low sensitivity to power-supply issues, good practices are always recommended. For
best performance, the OPT3007 VDD pin must have a stable, low-noise power supply with a 100-nF bypass
capacitor close to the device and solid grounding. There are many options for powering the OPT3007 because
the device current consumption levels are very low.
Copyright © 2017, Texas Instruments Incorporated
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OPT3007
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10 Layout
10.1 Layout Guidelines
The PCB layout design for the OPT3007 requires a couple of considerations. The design of the cutout to allow
light to illuminate the sensor is a critical part of this design. See the Optomechanical Design section for a more
detailed discussion of creating this cutout.
The device layout is also critical for optimal SMT assembly. Two types of land pattern pads can be used for this
package: solder mask defined pads (SMD) and non-solder mask defined pads (NSMD). SMD pads have a solder
mask opening that is smaller than the metal pads, whereas NSMD has a solder mask opening that is larger than
the metal pad.Figure 33 illustrates these types of landing-pattern pads. SMD is preferred because it provides a
more accurate soldering-pad dimension with the trace connections. For further discussion of SMT and PCB
recommendations, see the Soldering and Handling Recommendations section.
Figure 33. Soldermask Defined Pad (SMD) and Non-Soldermask Defined Pad (NSMD)
Stabilize the power supply with a capacitor placed close to the OPT3007 VDD and GND pins. Note that optically
reflective surfaces of components also affect the performance of the design. The three-dimensional geometry of
all components and structures around the sensor must be taken into consideration to prevent unexpected results
from secondary optical reflections. Placing capacitors and components at a distance of at least twice the height
of the component is usually sufficient, although further placement can still achieve good results. The most
optimal optical layout is to place all close components on the opposite side of the PCB from the OPT3007.
However, this approach may not be practical for the constraints of every design.
An example PCB layout with the OPT3007 is shown in Figure 35.
10.2 Soldering and Handling Recommendations
The OPT3007 is a very small device with special soldering and handling considerations. See Optomechanical
Design for implications of alignment between the device and the cutout area. See Layout Guidelines for
considerations of the soldering pads.
As with most optical devices, handle the OPT3007 with special care to make sure optical surfaces stay clean and
free from damage. See the Do's and Don'ts section for more detailed recommendations. For best optical
performance, clean solder flux and any other possible debris after soldering processes.
28
Copyright © 2017, Texas Instruments Incorporated
OPT3007
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ZHCSGP7 –AUGUST 2017
Soldering and Handling Recommendations (continued)
10.2.1 Solder Paste
For solder-paste deposition, use a stencil-printing process that involves the transfer of solder paste through
predefined apertures with the application of pressure. Stencil parameters, such as aperture area ratio and
fabrication process, have a significant impact on paste deposition. Cut the stencil apertures using a laser with an
electropolish-fabrication method. Taper the stencil aperture walls by 5° to facilitate paste release. Shifting the
solder-paste towards the outside of the device minimizes the possibility of solder getting into the device sensing
area. See the mechanical packages attached to the end of this data sheet.
Use solder paste selection type 4 or higher, no-clean, lead-free solder paste. If solder splatters in the reflow
process, choose a solder paste with normal- or low-flux contents, or alter the reflow profile per the Reflow Profile
section.
10.2.2 Package Placement
Use a pick-and-place nozzle with a size number larger than 0.6 mm. If the placement method is done by
programming the component thickness, add 0.04 mm to the actual component thickness so that the package sits
halfway into the solder paste. If placement is by force, then choose minimum force no larger than 3N in order to
avoid forcing out solder paste, or free falling the package, and to avoid soldering problems such as bridging and
solder balling.
10.2.3 Reflow Profile
Use the profile in Figure 34, and adjust if necessary. Use a slow solder reflow ramp rate of 1°C to 1.2°C/s to
minimize chances of solder splattering onto the sensing area.
Figure 34. Recommended Solder Reflow Temperature Profile
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ZHCSGP7 –AUGUST 2017
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Soldering and Handling Recommendations (continued)
10.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
Special flexible printed-circuit board (FPCB) design recommendations include:
•
•
Fabricate per IPC-6013.
Use material of flexible copper clad per IPC 4204/11 (Define polyimide and copper thickness per product
application).
•
•
•
Finish: All exposed copper will be electroless Ni immersion gold (ENIG) per IPC 4556.
Solder mask per IPC SM840.
Use a laser to create the cutout for light sensing for better accuracy, and to avoid affecting the soldering pad
dimension. Other options, such as punched cutouts, are possible. See the Optomechanical Design section for
further discussion ranging from the implications of the device to cutout region size and alignment. The full
design must be considered, including the tolerances.
To assist the handling of the very thin flexible circuit, design and fabricate a fixture to hold the flexible circuit
through the paste-printing, pick-and-place, and reflow processes. Contact the factory for examples of such
fixtures.
10.2.5 Rework Process
If the OPT3007 must be removed from a PCB, discard the device and do not reattach. To remove the package
from the PCB/Flexi cable, heat the solder joints above liquidus temperature. Bake the board at 125°C for 4 hours
prior to rework to remove moisture that may crack the PCB or causing delamination. Use a thermal heating
profile to remove a package that is close to the profile that mounts the package. Clean the site to remove any
excess solder and residue to prepare for installing a new package. Use a mini stencil (localized stencil) to apply
solder paste to the land pattern. In case a mini stencil cannot be used because of spacing or other reasons,
apply solder paste on the package pads directly, then mount, and reflow.
10.3 Layout Example
Db5
{/[
hꢁÇ3007
5evice
/utout
ꢀicrocontoller
/apacitor
ë55
{5!
ꢁins .1 and .2
unsoldered
The center pads are no connect
Figure 35. Example FPCB Layout With the OPT3007
30
版权 © 2017, Texas Instruments Incorporated
OPT3007
www.ti.com.cn
ZHCSGP7 –AUGUST 2017
11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
请参阅如下相关文档:
•
•
•
《OPT3001:环境光传感器应用指南》(文献编号:SBEA002)
《OPT3007EVM 用户指南》(SBOU181)
应用报告《QFN/SON PCB 连接》(文献编号:SLUA271)
11.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产品
信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.4 商标
PicoStar, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械封装、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据如有变更,恕
不另行通知和修订此文档。如欲获取此产品说明书的浏览器版本,请参阅左侧的导航。
版权 © 2017, Texas Instruments Incorporated
31
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jan-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
OPT3007YMFR
OPT3007YMFT
ACTIVE
ACTIVE
PICOSTAR
PICOSTAR
YMF
YMF
6
6
3000 RoHS & Green
250 RoHS & Green
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
7F
7F
CUNIPD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jan-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPT3007YMFR
OPT3007YMFT
PICOST
AR
YMF
YMF
6
6
3000
250
180.0
8.4
0.96
1.05
0.33
2.0
8.0
Q1
PICOST
AR
180.0
8.4
0.96
1.05
0.33
2.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2017
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPT3007YMFR
OPT3007YMFT
PICOSTAR
PICOSTAR
YMF
YMF
6
6
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YMF0006A
PicoStar TM - 0.226 mm max height
S
C
A
L
E
1
5
.
0
0
0
PicoStar
0.886
0.826
A
B
PIN A1
CORNER
0.976
0.916
C
0.226 MAX
0.0087 TYP
SEATING PLANE
0.007
OPTICAL FILTER
(0.04) TYP
ALL AROUND
(0.381)
SENSING AREA PULL BACK
C
SENSING AREA
(0.378)
PKG
B
0.7
TYP
(0.298)
D: Max = 0.976 mm, Min =0.916 mm
0.35
TYP
E: Max = 0.886 mm, Min =0.826 mm
(0.005)
OPTICAL FILTER
OFFSET OF PKG CENTER
A
0.18
6X
1
2
0.12
(0.461)
0.6
0.015
C A B
4222902/A 05/2016
PicoStar is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YMF0006A
PicoStar TM - 0.226 mm max height
PicoStar
(0.3) TYP
(
0.15) TYP
SOLDER MASK
OPENING
1
2
A
(0.35) TYP
SYMM
B
C
(
0.25)
METAL UNDER
SOLDER MASK
PCB CUTOUT
SYMM
(REFER TO THE LAYOUT GUIDELINES
SECTION OF THE DATASHEET)
LAND PATTERN EXAMPLE
SCALE: 55X
4222902/A 05/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
YMF0006A
PicoStar TM - 0.226 mm max height
PicoStar
(0.315)
TYP
(0.21)
TYP
2
1
A
B
(0.35)
TYP
SYMM
(R0.05)
TYP
C
6X ( 0.15)
SOLDER MASK
OPENING
6X METAL UNDER
SOLDER MASK
SYMM
SOLDER PASTE EXAMPLE
BASED on 0.075 mm THICK STENCIL
SCALE: 55X
4222902/A 05/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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