OPT3001DNPRQ1 [TI]
具有高精密人眼响应功能的汽车数字环境光传感器 (ALS) | DNP | 6 | -40 to 105;
| 型号： | OPT3001DNPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有高精密人眼响应功能的汽车数字环境光传感器 (ALS) | DNP | 6 | -40 to 105 光电二极管 传感器 |
| 文件： | 总43页 (文件大小：1180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
OPT3001-Q1 环境光传感器 (ALS)
1 特性
3 说明
1
•
符合面向汽车应用的 器件
OPT3001-Q1 器件是一款用于测量可见光强度的光学
传感器。传感器的光谱响应与人眼的明视响应高度匹
配，并且具有很高的红外线阻隔率。
–
器件温度等级 2 级：环境工作温度范围为
–40°C 至 +105°C
–
器件温度等级 3 级：环境工作温度范围为
–40°C 至 +85°C
OPT3001-Q1 器件是一款可测量人眼可见光的强度的
单芯片照度计。OPT3001-Q1 器件具有精密的光谱响
应和较强的红外阻隔功能，因此能够准确测量人眼可见
光的强度，且不受光源影响。对于为追求美观效果而需
要将传感器安装在深色玻璃下的工业设计而言，较强的
红外阻隔功能还有助于保持高精度。OPT3001-Q1 器
件专为打造基于光线的人眼般体验的系统而设计，是人
眼匹配度和红外阻隔率较低的光电二极管、光敏电阻或
其他环境光传感器的首选理想替代产品。
•
采用精密光学滤波，以与人眼匹配：
可阻隔 99%（典型值）以上的红外线 (IR)
–
•
•
•
自动满量程设置功能可简化软件并确保配置适当
测量范围：0.01 Lux 至 83,000 Lux
23 位有效动态范围，具有
自动增益范围设定功能
•
12 种二进制加权满量程范围设置：范围间匹配度
< 0.2%（典型值）
•
•
•
•
•
•
•
•
低工作电流：1.8µA（典型值）
工作温度范围为（2 级）：–40°C 至 +105°C
工作温度范围为（3 级）：–40°C 至 +85°C
功能温度范围：-40°C 至 105°C
宽电源范围：1.6V 至 3.6V
器件信息(1)
器件型号
封装
封装尺寸（标称值）
OPT3001-Q1
USON (6)
2.00mm × 2.00mm
(1) 如需了解所有可用封装，请参阅产品说明书末尾的封装选项附
录。
可耐受 5.5V 电压的 I/O
框图
灵活的中断系统
VDD
小封装尺寸：2mm × 2mm × 0.65mm
VDD
2 应用
OPT3001
SCL
SDA
INT
I2C
Interface
Ambient
Light
•
•
•
•
•
•
•
•
•
汽车照明
ADC
Optical
Filter
ADDR
信息娱乐系统与仪表盘
显示屏背光控制
照明控制系统
个人电子产品
电子销售终端
室外交通信号灯和路灯
家居照明
GND
Copyright © 2017, Texas Instruments Incorporated
光谱响应：OPT3001-Q1 和人眼
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
OPT3001
Human Eye
摄像机
300
400
500
600
700
800
900
1000
Wavelength (nm)
D001
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBOS853
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
目录
8.5 Programming........................................................... 17
8.6 Register Maps......................................................... 20
Application and Implementation ........................ 28
9.1 Application Information............................................ 28
9.2 Typical Application .................................................. 29
9.3 Do's and Don'ts ...................................................... 32
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 （续）.............................................................. 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 6
7.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ...................................... 11
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 14
9
10 Power Supply Recommendations ..................... 33
11 Layout................................................................... 33
11.1 Layout Guidelines ................................................. 33
11.2 Layout Example .................................................... 33
12 器件和文档支持 ..................................................... 34
12.1 文档支持................................................................ 34
12.2 接收文档更新通知 ................................................. 34
12.3 社区资源................................................................ 34
12.4 商标....................................................................... 34
12.5 静电放电警告......................................................... 34
12.6 术语表 ................................................................... 34
13 机械、封装和可订购信息....................................... 34
13.1 焊接和处理建议 ..................................................... 34
13.2 DNP (S-PDSO-N6) 机械制图 ................................ 35
8
4 修订历史记录
Changes from Original (March 2017) to Revision A
Page
•
•
•
•
•
•
•
•
•
已添加 器件温度等级 2 级：环境工作温度范围为 –40°C 至 +105°C（.................................................................................. 1
已添加 器件温度等级 3 级：环境工作温度范围为 –40°C 至 +85°C........................................................................................ 1
已添加 .................................................................................................................................................................................... 1
已添加 工作温度范围为（2 级）：–40°C 至 +105°C ............................................................................................................. 1
Added Operating temperature (Grade 2) to Recommended Operating Conditions table ...................................................... 4
Added Dark Response vs Temperature (Grade 2)................................................................................................................. 8
Added Normalized Response vs Temperature (Grade 2)...................................................................................................... 8
Added Supply Current vs Temperature (Grade 2) ................................................................................................................. 9
Added Shutdown Current vs Temperature (Grade 2) ......................................................................................................... 10
2
版权 © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
5 说明 （续）
数字操作可灵活用于系统集成。测量既可连续进行也可单次触发。控制和中断系统 特性 自主操作功能，允许处理
器在传感器搜索相应唤醒事件并通过中断引脚进行报告时处于休眠状态。数字输出通过兼容 I2C 和 SMBus 的双线
制串行接口进行报告。
OPT3001-Q1 器件具有低功耗和低电源电压性能，可以提高电池供电系统的电池寿命。
凭借内置满量程设置功能，无需手动选择满量程范围即可在 0.01 Lux 至 83,000 Lux 范围内进行测量。该功能允许
在 23 位有效动态范围内进行光测量。
6 Pin Configuration and Functions
DNP Package
6-Pin USON
Top View
VDD
ADDR
GND
1
2
3
6
5
4
SDA
INT
Thermal
Pad
SCL
Not to scale
Pin Functions
PIN
DESCRIPTION
NO.
1
NAME
VDD
I/O
I
Device power. Connect to a 1.6-V to 3.6-V supply.
Address pin. This pin sets the LSBs of the I2C address.
Ground
I2C clock. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
Interrupt output, open-drain. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
I2C data. Connect with a 10-kΩ resistor to a 1.6-V to 5.5-V supply.
2
ADDR
GND
SCL
I
Power
I
3
4
5
INT
O
6
SDA
I/O
Copyright © 2017–2018, Texas Instruments Incorporated
3
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN
–0.5
–0.5
MAX
6
UNIT
V
VDD to GND
Voltage
SDA, SCL, INT, and ADDR to GND
6
V
Current into any pin
Temperature
10
mA
°C
Junction
150
150(2)
Storage, Tstg
–65
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4
±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
MIN
–40
–40
1.6
NOM
MAX
105
85
UNIT
Operating temperature (Grade 2)
Operating temperature (Grade 3)
Operating power-supply voltage
°C
°C
V
3.6
7.4 Thermal Information
OPT3001-Q1
DNP (USON)
6 PINS
71.2
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
45.7
42.2
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.4
ψJB
42.8
RθJC(bot)
17.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
4
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
7.5 Electrical Characteristics
At TA = 25°C, VDD = 3.3 V, (1), automatic full-scale range (RN[3:0] = 1100b(1)), white LED, and normal-angle incidence of light,
unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPTICAL
Peak irradiance spectral responsivity
550
nm
Lowest full-scale range, RN[3:0] = 0000b at
800 ms conversion time
0.01
(1)
Resolution (LSB)
lux
lux
Lowest full-scale range, RN[3:0] = 0000b(1) at
100 ms conversion time
0.08
Full-scale illuminance
83 865.6
3125
2812
1800
3437 ADC codes
0.64 lux per ADC code, 2620.80 lux full-scale
(RN[3:0] = 0110)(1), 2000 lux input(2)
Measurement output result
2000
2200
lux
Relative accuracy between gain
ranges(3)
Infrared response (850 nm)(2)
0.2%
0.2%
4%
Light source variation
(incandescent, halogen, fluorescent)
Bare device, no cover glass
Input illuminance > 40 lux
Input illuminance < 40 lux
2%
5%
0.01
0
Linearity
Measurement drift across temperature Input illuminance = 2000 lux
%/°C
For Conversion Time = 800 ms
Dark condition, ADC output
3
1
ADC codes
For Conversion Time = 100 ms
0
Half-power angle
50% of full-power reading
VDD at 3.6 V and 1.6 V
47
degrees
%/V(4)
PSRR
Power-supply rejection ratio
0.1
POWER SUPPLY
VDD
VI²C
Operating range
1.6
1.6
3.6
5.5
2.5
V
V
Operating range of I2C pullup resistor
I2C pullup resistor, VDD ≤ VI²C
Active, VDD = 3.6 V
1.8
0.3
3.7
0.4
0.8
µA
Shutdown (M[1:0] = 00)(1)
VDD = 3.6 V
,
Dark
0.47
µA
µA
µA
V
IQ
Quiescent current
Active, VDD = 3.6 V
Full-scale lux
TA = 25°C
Shutdown,
(M[1:0] = 00)(1)
POR
Power-on-reset threshold
DIGITAL
I/O pin capacitance
3
800
100
pF
ms
ms
(CT = 1)(1), 800-ms mode, fixed lux range
(CT = 0)(1), 100-ms mode, fixed lux range
720
90
880
110
Total integration time(5)
Low-level input voltage
(SDA, SCL, and ADDR)
VIL
VIH
IIL
0
0.3 × VDD
5.5
V
V
High-level input voltage
(SDA, SCL, and ADDR)
0.7 × VDD
Low-level input current
(SDA, SCL, and ADDR)
0.01
0.01
0.25(6)
0.32
µA
V
Low-level output voltage
(SDA and INT)
VOL
IZH
IOL= 3 mA
Pin at VDD
Output logic high, high-Z leakage
current (SDA, INT)
0.25(6)
µA
TEMPERATURE
Specified temperature range
Grade 2
Grade 3
–40
–40
105
85
°C
°C
(1) Refers to a control field within the configuration register.
(2) Tested with the white LED calibrated to 2k lux and an 850-nm LED.
(3) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
(4) PSRR is the percent change of the measured lux output from its current value, divided by the change in power supply voltage, as
characterized by results from 3.6-V and 1.6-V power supplies.
(5) The conversion time, from start of conversion until the data are ready to be read, is the integration time plus 3 ms.
(6) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.
Copyright © 2017–2018, Texas Instruments Incorporated
5
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
MAX UNIT
7.6 Timing Requirements(1)
MIN
TYP
I2C FAST MODE
fSCL
SCL operating frequency
Bus free time between stop and start
Hold time after repeated start
Setup time for repeated start
Setup time for stop
0.01
1300
600
600
600
20
0.4
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tBUF
tHDSTA
tSUSTA
tSUSTO
tHDDAT
tSUDAT
tLOW
Data hold time
900
Data setup time
100
1300
600
SCL clock low period
tHIGH
SCL clock high period
Clock rise and fall time
Data rise and fall time
tRC and tFC
tRD and tFD
300
300
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
tTIMEO
28
ms
I2C HIGH-SPEED MODE
fSCL
SCL operating frequency
0.01
160
160
160
160
20
2.6
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tBUF
Bus free time between stop and start
Hold time after repeated start
Setup time for repeated start
Setup time for stop
tHDSTA
tSUSTA
tSUSTO
tHDDAT
tSUDAT
tLOW
Data hold time
140
Data setup time
20
SCL clock low period
SCL clock high period
Clock rise and fall time
Data rise and fall time
240
60
tHIGH
tRC and tFC
tRD and tFD
40
80
Bus timeout period. If the SCL line is held low for this duration of time, the bus
state machine is reset.
tTIMEO
28
ms
(1) All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of final settled value.
1/fSCL
tRC
tFC
70%
30%
SCL
SDA
tLOW
tHIGH
tSUSTA
tSUSTO
tHDSTA
tHDDAT
tSUDAT
70%
30%
tBUF
Start
tRD
tFD
Stop
Start
Stop
Figure 1. I2C Detailed Timing Diagram
6
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
7.7 Typical Characteristics
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
500
450
400
350
300
250
200
150
100
50
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Fluorescent
Halogen
Incandescent
OPT3001
Human Eye
0
0
50 100 150 200 250 300 350 400 450 500
Input Illuminance (Lux)
300
400
500
600
700
800
900
1000
D002
Wavelength (nm)
D001
Figure 3. Output Response vs Input Illuminance, Multiple
Light Sources: Fluorescent, Halogen, Incandescent
Figure 2. Spectral Response vs Wavelength
100
80000
70000
60000
50000
40000
30000
20000
10000
0
800ms
100ms
800ms
100ms
80
60
40
20
0
0
20
40
60
80
100
0
10000 20000 30000 40000 50000 60000 70000 80000
Input Illuminance (Lux)
Input Illuminance (Lux)
D004
D003
Figure 5. Output Response vs Input Illuminance:
Mid Range = 0 lux to 100 lux
Figure 4. Output Response vs Input Illuminance:
Entire Range = 0 lux to 83k lux
5
4
3
2
1
1.020
800ms
100ms
1.010
1.000
0.990
0.980
1.002 1.002
1.001 1.001
1.000
0.997 0.997
0
0
40.95
81.9
163.8 327.6 655.2 1310.4 2620.8
Full-Scale Range (Lux)
1
2
3
4
5
Input Illuminance (Lux)
D006
D005
Input illuminance = 33 lux,
normalized to response of 40.95 lux full-scale
Figure 7. Full-Scale-Range Matching: Lowest 7 Ranges
Figure 6. Output Response vs Input Illuminance:
Low Range = 0 lux to 5 lux
Copyright © 2017–2018, Texas Instruments Incorporated
7
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
1000
900
800
700
600
1.020
1.010
1.000
0.990
0.980
1.004
1.003
1.002
1.002
1.000
1.000
2620.8 5241.6 10483.2 20966.4 41932.8 83865.6
Full-Scale Range (Lux)
D007
1.6
2
2.4
2.8
3.2
3.6
Power Supply (V)
Input illuminance = 2490 lux,
D017
normalized to response of 2560 lux full-scale
Figure 8. Full-Scale-Range Matching (Highest 6 Ranges)
Figure 9. Conversion Time vs Power Supply
0.1
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (èC)
D112
D0016
Average of 30 devices
Average of 30 devices
Figure 10. Dark Response vs Temperature (Grade 2)
Figure 11. Dark Response vs Temperature (Grade 3)
1.02
1.01
1
1.02
1.01
1
0.99
0.98
0.97
0.99
0.98
0.97
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Temperature [èC]
Temperature ( èC)
D108
D008
Figure 12. Normalized Response vs Temperature (Grade 2)
Figure 13. Normalized Response vs Temperature (Grade 3)
8
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
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ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
1.002
1.001
1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.999
0.998
1.6
2
2.4
2.8
3.2
3.6
-90
-70
-50
-30
-10
10
30
50
70
90
Power Supply (V)
Illuminance Angle (Degrees)
D009
D010
Figure 14. Normalized Response vs Power-Supply Voltage
Figure 15. Normalized Response vs Illuminance Angle
0.5
4
0.45
0.4
3.5
3
0.35
0.3
2.5
2
1.5
0.25
0.2
1
100
1000
10000
100000
0
20000
40000
60000
80000
Input Illuminance (Lux)
Input Illuminance (Lux)
D011
D0112
M[1:0] = 10b
M[1:0] = 00b
Figure 16. Supply Current vs Input Illuminance
Figure 17. Shutdown Current vs Input Illuminance
3.5
3.5
3
Vdd = 3.3V
Vdd = 1.6V
Vdd = 3.3V
Vdd = 1.6V
3
2.5
2
2.5
2
1.5
1.5
1
1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
120
Temperature (èC)
Temperature (°C)
D013
D110
M[1:0] = 10b
M[1:0] = 10b
Figure 19. Supply Current vs Temperature (Grade 3)
Figure 18. Supply Current vs Temperature (Grade 2)
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Typical Characteristics (continued)
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and
normal-angle incidence of light, unless otherwise specified.
1.6
1.4
1.2
1
1.6
1.4
1.2
1
Vdd = 3.3V
Vdd = 1.6V
Vdd = 3.3V
Vdd = 1.6V
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (èC)
D111
D014
M[1:0] = 00b, input illuminance = 0 lux
M[1:0] = 00b, input illuminance = 0 lux
Figure 20. Shutdown Current vs Temperature (Grade 2)
Figure 21. Shutdown Current vs Temperature (Grade 3)
100
Vdd = 3.3V
Vdd = 1.6V
10
1
0.1
0.01
0.1
1
10
100
1000
10000
Continuous I2C Frequency (KHz)
D015
Input illuminance = 80 lux, SCL = SDA,
continuously toggled at I2C frequency
Note: A typical application runs at a lower duty cycle and thus consumes a lower current.
Figure 22. Supply Current vs Continuous I2C Frequency
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8 Detailed Description
8.1 Overview
The OPT3001-Q1 device measures the ambient light that illuminates the device. This device measures light with
a spectral response very closely matched to the human eye, and with very good infrared rejection.
Matching the sensor spectral response to that of the human eye response is vital because ambient light sensors
are used to measure and help create ideal human lighting experiences. Strong rejection of infrared light, which a
human does not see, is a crucial component of this matching. This matching makes the OPT3001-Q1 device
especially good for operation underneath windows that are visibly dark, but infrared transmissive.
The OPT3001-Q1 device is fully self-contained to measure the ambient light and report the result in lux digitally
over the I2C bus. The result can also be used to alert a system and interrupt a processor with the INT pin. The
result can also be summarized with a programmable window comparison and communicated with the INT pin.
The OPT3001-Q1 device can be configured into an automatic full-scale, range-setting mode that always selects
the optimal full-scale range setting for the lighting conditions. This mode frees the user from having to program
their software for potential iterative cycles of measurement and readjustment of the full-scale range until optimal
for any given measurement. The device can be commanded to operate continuously or in single-shot
measurement modes.
The device integrates its result over either 100 ms or 800 ms, so the effects of 50-Hz and 60-Hz noise sources
from typical light bulbs are nominally reduced to a minimum.
The device starts up in a low-power shutdown state, such that the OPT3001-Q1 device only consumes active-
operation power after being programmed into an active state.
The OPT3001-Q1 optical filtering system is not excessively sensitive to non-ideal particles and micro-shadows
on the optical surface. This reduced sensitivity is a result of the relatively minor device dependency on uniform-
density optical illumination of the sensor area for infrared rejection. Proper optical surface cleanliness is always
recommended for best results on all optical devices.
8.2 Functional Block Diagram
VDD
VDD
OPT3001
SCL
SDA
INT
ADDR
I2C
Interface
Ambient
Light
ADC
Optical
Filter
GND
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8.3 Feature Description
8.3.1 Human Eye Matching
The OPT3001-Q1 spectral response closely matches that of the human eye. If the ambient light sensor
measurement is used to help create a good human experience, or create optical conditions that are optimal for a
human, the sensor must measure the same spectrum of light that a human sees.
The device also has excellent infrared light (IR) rejection. This IR rejection is especially important because many
real-world lighting sources have significant infrared content that humans do not see. If the sensor measures
infrared light that the human eye does not see, then a true human experience is not accurately represented.
Furthermore, if the ambient light sensor is hidden underneath a dark window (such that the end-product user
cannot see the sensor) the infrared rejection of the OPT3001-Q1 device becomes significantly more important
because many dark windows attenuate visible light but transmit infrared light. This attenuation of visible light and
lack of attenuation of IR light amplifies the ratio of the infrared light to visible light that illuminates the sensor.
Results can still be well matched to the human eye under this condition because of the high infrared rejection of
the OPT3001-Q1 device.
8.3.2 Automatic Full-Scale Range Setting
The OPT3001-Q1 device has an automatic full-scale range setting feature that eliminates the need to predict and
set the optimal range for the device. In this mode, the OPT3001-Q1 device automatically selects the optimal full-
scale range for the given lighting condition. The OPT3001-Q1 device has a high degree of result matching
between the full-scale range settings. This matching eliminates the problem of varying results or the need for
range-specific, user-calibrated gain factors when different full-scale ranges are chosen. For further details, see
the Automatic Full-Scale Setting Mode section.
8.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
The device has an interrupt reporting system that allows the processor connected to the I2C bus to go to sleep,
or otherwise ignore the device results, until a user-defined event occurs that requires possible action.
Alternatively, this same mechanism can also be used with any system that can take advantage of a single digital
signal that indicates whether the light is above or below levels of interest.
The interrupt event conditions are controlled by the high-limit and low-limit registers, as well as the configuration
register latch and fault count fields. The results of comparing the result register with the high-limit register and
low-limit register are referred to as fault events. The fault count register dictates how many consecutive same-
result fault events are required to trigger an interrupt event and subsequently change the state of the interrupt
reporting mechanisms, which are the INT pin, the flag high field, and the flag low field. The latch field allows a
choice between a latched window-style comparison and a transparent hysteresis-style comparison.
The INT pin has an open-drain output, which requires the use of a pull-up resistor. This open-drain output allows
multiple devices with open-drain INT pins to be connected to the same line, thus creating a logical NOR or AND
function between the devices. The polarity of the INT pin can be controlled with the polarity of interrupt field in
the configuration register. When the POL field is set to 0, the pin operates in an active low behavior that pulls the
pin low when the INT pin becomes active. When the POL field is set to 1, the pin operates in an active high
behavior and becomes high impedance, thus allowing the pin to go high when the INT pin becomes active.
Additional details of the interrupt reporting registers are described in the Interrupt Reporting Mechanism Modes
and Internal Registers sections.
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Feature Description (continued)
8.3.4 I2C Bus Overview
The OPT3001-Q1 device offers compatibility with both I2C and SMBus interfaces. The I2C and SMBus protocols
are essentially compatible with one another. The I2C interface is used throughout this document as the primary
example with the SMBus protocol specified only when a difference between the two protocols is discussed.
The OPT3001-Q1 device is connected to the bus with two pins: an SCL clock input pin and an SDA open-drain
bidirectional data pin. The bus must be controlled by a master device that generates the serial clock (SCL),
controls the bus access, and generates start and stop conditions. To address a specific device, the master
initiates a start condition by pulling the data signal line (SDA) from a high logic level to a low logic level while
SCL is high. All slaves on the bus shift in the slave address byte on the SCL rising edge, with the last bit
indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being addressed
responds to the master by generating an acknowledge bit by pulling SDA low.
Data transfer is then initiated and eight bits of data are sent, followed by an acknowledge bit. During data
transfer, SDA must remain stable while SCL is high. Any change in SDA while SCL is high is interpreted as a
start or stop condition. When all data are transferred, the master generates a stop condition, indicated by pulling
SDA from low to high while SCL is high. The OPT3001-Q1 device includes a 28-ms timeout on the I2C interface
to prevent locking up the bus. If the SCL line is held low for this duration of time, the bus state machine is reset.
8.3.4.1 Serial Bus Address
To communicate with the OPT3001-Q1 device, the master must first initiate an I2C start command. Then, the
master must address slave devices via a slave address byte. The slave address byte consists of seven address
bits and a direction bit that indicates whether the action is to be a read or write operation.
Four I2C addresses are possible by connecting the ADDR pin to one of four pins: GND, VDD, SDA, or SCL.
Table 1 summarizes the possible addresses with the corresponding ADDR pin configuration. The state of the
ADDR pin is sampled on every bus communication and must be driven or connected to the desired level before
any activity on the interface occurs.
Table 1. Possible I2C Addresses with Corresponding ADDR Configuration
DEVICE I2C ADDRESS
ADDR PIN
GND
1000 100
1000 101
VDD
1000 110
SDA
1000 111
SCL
8.3.4.2 Serial Interface
The OPT3001-Q1 device operates as a slave device on both the I2C bus and SMBus. Connections to the bus
are made via the SCL clock input line and the SDA open-drain I/O line. The OPT3001-Q1 device supports the
transmission protocol for standard mode (up to 100 kHz), fast mode (up to 400 kHz), and high-speed mode (up
to 2.6 MHz). All data bytes are transmitted most-significant bits first.
The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of
input spikes and bus noise. See the Electrical Interface section for further details of the I2C bus noise immunity.
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8.4 Device Functional Modes
8.4.1 Automatic Full-Scale Setting Mode
The OPT3001-Q1 device has an automatic full-scale-range setting mode that eliminates the need for a user to
predict and set the optimal range for the device. This mode is entered when the configuration register range
number field (RN[3:0]) is set to 1100b.
The first measurement that the device takes in auto-range mode is a 10-ms range assessment measurement.
The device then determines the appropriate full-scale range to take its first full measurement.
For subsequent measurements, the full-scale range is set by the result of the previous measurement. If a
measurement is towards the low side of full-scale, the full-scale range is decreased by one or two settings for the
next measurement. If a measurement is towards the upper side of full-scale, the full-scale range is increased by
one setting for the next measurement.
If the measurement exceeds the full-scale range, resulting from a fast increasing optical transient event, the
current measurement is aborted. This invalid measurement is not reported. A 10-ms measurement is taken to
assess and properly reset the full-scale range. Then, a new measurement is taken with this proper full-scale
range. Therefore, during a fast increasing optical transient in this mode, a measurement can possibly take longer
to complete and report than indicated by the configuration register conversion time field (CT).
8.4.2 Interrupt Reporting Mechanism Modes
There are two major types of interrupt reporting mechanism modes: latched window-style comparison mode and
transparent hysteresis-style comparison mode. The configuration register latch field (L) (see the configuration
register, bit 4) controls which of these two modes is used. An end-of-conversion mode is also associated with
each major mode type. The end-of-conversion mode is active when the two most significant bits of the threshold
low register are set to 11b. The mechanisms report via the flag high and flag low fields, the conversion ready
field, and the INT pin.
8.4.2.1 Latched Window-Style Comparison Mode
The latched window-style comparison mode is typically selected when using the OPT3001-Q1 device to interrupt
an external processor. In this mode, a fault is recognized when the input signal is above the high-limit register or
below the low-limit register. When the consecutive fault events trigger the interrupt reporting mechanisms, these
mechanisms are latched, thus reporting whether the fault is the result of a high or low comparison. These
mechanisms remain latched until the configuration register is read, which clears the INT pin and flag high and
flag low fields. The SMBus alert response protocol, described in detail in the SMBus Alert Response section,
clears the pin but does not clear the flag high and flag low fields. The behavior of this mode, along with the
conversion ready flag, is summarized in Table 2. Note that Table 2 does not apply when the two threshold low
register MSBs (see the Transparent Hysteresis-Style Comparison Mode section for clarification on the MSBs) are
set to 11b.
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Device Functional Modes (continued)
Table 2. Latched Window-Style Comparison Mode: Flag Setting and Clearing Summary(1)(2)
FLAG HIGH
FIELD
FLAG LOW
FIELD
CONVERSION
READY FIELD
OPERATION
INT PIN(3)
The result register is above the high-limit register for fault count times.
See the Result Register and the High-Limit Register for further details.
1
X
1
Active
1
1
The result register is below the low-limit register for fault count times.
See the Result Register and the Low-Limit Register for further details.
X
Active
The conversion is complete with fault count criterion not met
Configuration register read(4)
X
0
X
0
X
Inactive
X
1
0
Configuration register write, M[1:0] = 00b (shutdown)
Configuration register write, M[1:0] > 00b (not shutdown)
SMBus alert response protocol
X
X
X
X
X
X
X
0
X
Inactive
X
(1) X = no change from the previous state.
(2) The high-limit register is assumed to be greater than the low-limit register. If this assumption is incorrect, the flag high field and flag low
field can take on different behaviors.
(3) The INT pin depends on the setting of the polarity field (POL). The INT pin is low when the pin state is active and POL = 0 (active low)
or when the pin state is inactive and POL = 1 (active high).
(4) Immediately after the configuration register is read, the device automatically resets the conversion ready field to its 0 state. Thus, if two
configuration register reads are performed immediately after a conversion completion, the first reads 1 and the second reads 0.
8.4.2.2 Transparent Hysteresis-Style Comparison Mode
The transparent hysteresis-style comparison mode is typically used when a single digital signal is desired that
indicates whether the input light is higher than or lower than a light level of interest. If the result register is higher
than the high-limit register for a consecutive number of events set by the fault count field, the INT line is set to
active, the flag high field is set to 1, and the flag low field is set to 0. If the result register is lower than the low-
limit register for a consecutive number of events set by the fault count field, the INT line is set to inactive, the flag
low field is set to 1, and the flag high field is set to 0. The INT pin and flag high and flag low fields do not change
state with configuration reads and writes. The INT pin and flag fields continually report the appropriate
comparison of the light to the low-limit and high-limit registers. The device does not respond to the SMBus alert
response protocol while in either of the two transparent comparison modes (configuration register, latch field =
0). The behavior of this mode, along with the conversion ready is summarized in Table 3. Note that Table 3 does
not apply when the two threshold low register MSBs (LE[3:2] from Table 11) are set to 11.
Table 3. Transparent Hysteresis-Style Comparison Mode: Flag Setting and Clearing Summary(1)(2)
FLAG HIGH
FIELD
FLAG LOW
FIELD
CONVERSION
READY FIELD
OPERATION
INT PIN(3)
The result register is above the high-limit register for fault count times.
See the Result Register and the High-Limit Register for further details.
1
0
0
1
Active
1
1
The result register is below the low-limit register for fault count times.
See the Result Register and the Low-Limit Register for further details.
Inactive
The conversion is complete with fault count criterion not met
Configuration register read(4)
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
0
Configuration register write, M[1:0] = 00b (shutdown)
Configuration register write, M[1:0] > 00b (not shutdown)
SMBus alert response protocol
X
0
X
(1) X = no change from the previous state.
(2) The high-limit register is assumed to be greater than the low-limit register. If this assumption is incorrect, the flag high field and flag low
field can take on different behaviors.
(3) The INT pin depends on the setting of the polarity field (POL). The INT pin is low when the pin state is active and POL = 0 (active low)
or when the pin state is inactive and POL = 1 (active high).
(4) Immediately after the configuration register is read, the device automatically resets the conversion ready field to its 0 state. Thus, if two
configuration register reads are performed immediately after a conversion completion, the first reads 1 and the second reads 0.
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8.4.2.3 End-of-Conversion Mode
An end-of-conversion indicator mode can be used when every measurement is desired to be read by the
processor, prompted by the INT pin going active on every measurement completion. This mode is entered by
setting the most significant two bits of the low-limit register (LE[3:2] from the Low-Limit Register) to 11b. This
end-of-conversion mode is typically used in conjunction with the latched window-style comparison mode. The INT
pin becomes inactive when the configuration register is read or the configuration register is written with a non-
shutdown parameter or in response to an SMBus alert response. Table 4 summarizes the interrupt reporting
mechanisms as a result of various operations.
Table 4. End-of-Conversion Mode while in Latched Window-Style Comparison Mode:
Flag Setting and Clearing Summary(1)
FLAG HIGH
FIELD
FLAG LOW
FIELD
CONVERSION
READY FIELD
OPERATION
INT PIN(2)
The result register is above the high-limit register for fault count times.
See the Result Register and the High-Limit Register for further details.
1
X
1
Active
1
1
The result register is below the low-limit register for fault count times.
See the Result Register and the Low-Limit Register for further details.
X
Active
The conversion is complete with fault count criterion not met
Configuration register read(3)
X
0
X
0
Active
Inactive
X
1
0
Configuration register write, M[1:0] = 00b (shutdown)
Configuration register write, M[1:0] > 00b (not shutdown)
SMBus alert response protocol
X
X
X
X
X
X
X
0
X
Inactive
X
(1) X = no change from the previous state.
(2) The INT pin depends on the setting of the polarity field (POL). The INT pin is low when the pin state is active and POL = 0 (active low)
or when the pin state is inactive and POL = 1 (active high).
(3) Immediately after the configuration register is read, the device automatically resets the conversion ready field to its 0 state. Thus, if two
configuration register reads are performed immediately after a conversion completion, the first reads 1 and the second reads 0.
Note that when transitioning from end-of-conversion mode to the standard comparison modes (that is,
programming LE[3:2] from 11b to 00b) while the configuration register latch field (L) is 1, a subsequent write to
the configuration register latch field (L) to 0 is necessary in order to properly clear the INT pin. The latch field can
then be set back to 1 if desired.
8.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
The combination of end-of-conversion mode and transparent hysteresis-style comparison mode can also be
programmed simultaneously. The behavior of this combination is shown in Table 5.
Table 5. End-Of-Conversion Mode while in Transparent Hysteresis-Style Comparison Mode:
Flag Setting and Clearing Summary(1)
FLAG HIGH
FIELD
FLAG LOW
FIELD
CONVERSION
READY FIELD
OPERATION
INT PIN(2)
The result register is above the high-limit register for fault count times.
See the Result Register and the High-Limit Register for further details.
1
0
0
1
Active
1
1
The result register is below the low-limit register for fault count times.
See the Result Register and the Low-Limit Register for further details.
Active
The conversion is complete with fault count criterion not met
Configuration register read(3)
X
X
X
X
X
X
X
X
X
X
Active
Inactive
X
1
0
Configuration register write, M[1:0] = 00b (shutdown)
Configuration register write, M[1:0] > 00b (not shutdown)
SMBus alert response protocol
X
0
Inactive
X
X
(1) X = no change from the previous state.
(2) The INT pin depends on the setting of the polarity field (POL). The INT pin is low when the pin state is active and POL = 0 (active low)
or when the pin state is inactive and POL = 1 (active high).
(3) Immediately after the configuration register is read, the device automatically resets the conversion ready field to its 0 state. Thus, if two
configuration register reads are performed immediately after a conversion completion, the first reads 1 and the second reads 0.
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8.5 Programming
The OPT3001-Q1 device supports the transmission protocol for standard mode (up to 100 kHz), fast mode (up to
400 kHz), and high-speed mode (up to 2.6 MHz). Fast and standard modes are described as the default
protocol, referred to as F/S. High-speed mode is described in the High-Speed I2C Mode section.
8.5.1 Writing and Reading
Accessing a specific register on the OPT3001-Q1 device is accomplished by writing the appropriate register
address during the I2C transaction sequence. Refer to Table 6 for a complete list of registers and their
corresponding register addresses. The value for the register address (as shown in Figure 23) is the first byte
transferred after the slave address byte with the R/W bit low.
1
9
1
9
SCL
SDA
RA RA RA RA RA RA RA RA
1
0
0
0
1
A1 A0 R/W
7
6
5
4
3
2
1
0
Stop by
Master
Start by
Master
ACK by
OPT3001
ACK by
OPT3001
(optional)
Frame 1: Two-Wire Slave Address Byte (1)
Frame 2: Register Address Byte
(1) The value of the slave address byte is determined by the ADDR pin setting; see Table 1.
Figure 23. Setting the I2C Register Address
Writing to a register begins with the first byte transmitted by the master. This byte is the slave address with the
R/W bit low. The OPT3001-Q1 device then acknowledges receipt of a valid address. The next byte transmitted
by the master is the address of the register that data are to be written to. The next two bytes are written to the
register addressed by the register address. The OPT3001-Q1 device acknowledges receipt of each data byte.
The master may terminate the data transfer by generating a start or stop condition.
When reading from the OPT3001-Q1 device, the last value stored in the register address by a write operation
determines which register is read during a read operation. To change the register address for a read operation, a
new partial I2C write transaction must be initiated. This partial write is accomplished by issuing a slave address
byte with the R/W bit low, followed by the register address byte and a stop command. The master then generates
a start condition and sends the slave address byte with the R/W bit high to initiate the read command. The next
byte is transmitted by the slave and is the most significant byte of the register indicated by the register address.
This byte is followed by an acknowledge from the master; then the slave transmits the least significant byte. The
master acknowledges receipt of the data byte. The master may terminate the data transfer by generating a not-
acknowledge after receiving any data byte, or by generating a start or stop condition. If repeated reads from the
same register are desired, continually sending the register address bytes is not necessary; the OPT3001-Q1
device retains the register address until that number is changed by the next write operation.
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Programming (continued)
Figure 24 and Figure 25 show the write and read operation timing diagrams, respectively. Note that register
bytes are sent most significant byte first, followed by the least significant byte.
1
9
1
9
1
9
1
9
SCL
RA RA RA RA RA RA RA RA
SDA
1
0
0
0
1
A1 A0 R/W
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
7
6
5
4
3
2
1
0
Start by
Master
ACK by
OPT3001
ACK by
OPT3001
ACK by
OPT3001
Stop by
Master
ACK by
OPT3001
Frame 1 Two-Wire Slave Address Byte (1)
Frame 2 Register Address Byte
Frame 3 Data MSByte
Frame 4 Data LSByte
(1) The value of the slave address byte is determined by the setting of the ADDR pin; see Table 1.
Figure 24. I2C Write Example
1
9
1
9
1
9
SCL
SDA
R/W
1
0
0
0
1
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
No ACK
by
Master(2)
Stop by
Master
Start by
Master
ACK by
OPT3001
From
OPT3001
ACK by
Master
From
OPT3001
Frame 1 Two-Wire Slave Address Byte (1)
Frame 2 Data MSByte
Frame 3 Data LSByte
(1) The value of the slave address byte is determined by the ADDR pin setting; see Table 1.
(2) An ACK by the master can also be sent.
Figure 25. I2C Read Example
8.5.1.1 High-Speed I2C Mode
When the bus is idle, both the SDA and SCL lines are pulled high by the pull-up resistors or active pull-up
devices. The master generates a start condition followed by a valid serial byte containing the high-speed (HS)
master code 0000 1XXXb. This transmission is made in either standard mode or fast mode (up to 400 kHz). The
OPT3001-Q1 device does not acknowledge the HS master code but does recognize the code and switches its
internal filters to support a 2.6-MHz operation.
The master then generates a repeated start condition (a repeated start condition has the same timing as the start
condition). After this repeated start condition, the protocol is the same as F/S mode, except that transmission
speeds up to 2.6 MHz are allowed. Instead of using a stop condition, use repeated start conditions to secure the
bus in HS mode. A stop condition ends the HS mode and switches all internal filters of the OPT3001-Q1 device
to support the F/S mode.
8.5.1.2 General-Call Reset Command
The I2C general-call reset allows the host controller in one command to reset all devices on the bus that respond
to the general-call reset command. The general call is initiated by writing to the I2C address 0 (0000 0000b). The
reset command is initiated when the subsequent second address byte is 06h (0000 0110b). With this transaction,
the device issues an acknowledge bit and sets all of its registers to the power-on-reset default condition.
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Programming (continued)
8.5.1.3 SMBus Alert Response
The SMBus alert response provides a quick identification for which device issued the interrupt. Without this alert
response capability, the processor does not know which device pulled the interrupt line when there are multiple
slave devices connected.
The OPT3001-Q1 device is designed to respond to the SMBus alert response address, when in the latched
window-style comparison mode (configuration register, latch field = 1). The OPT3001-Q1 device does not
respond to the SMBus alert response when in transparent mode (configuration register, latch field = 0).
The response behavior of the OPT3001-Q1 device to the SMBus alert response is shown in Figure 26. When the
interrupt line to the processor is pulled to active, the master can broadcast the alert response slave address
(0001 1001b). Following this alert response, any slave devices that generated an alert identify themselves by
acknowledging the alert response and sending their respective I2C address on the bus. The alert response can
activate several different slave devices simultaneously. If more than one slave attempts to respond, bus
arbitration rules apply. The device with the lowest address wins the arbitration. If the OPT3001-Q1 device loses
the arbitration, the device does not acknowledge the I2C transaction and its INT pin remains in an active state,
prompting the I2C master processor to issue a subsequent SMBus alert response. When the OPT3001-Q1
device wins the arbitration, the device acknowledges the transaction and sets its INT pin to inactive. The master
can issue that same command again, as many times as necessary to clear the INT pin. See the Interrupt
Reporting Mechanism Modes section for additional details of how the flags and INT pin are controlled. The
master can obtain information about the source of the OPT3001-Q1 interrupt from the address broadcast in the
above process. The flag high field (configuration register, bit 6) is sent as the final LSB of the address to provide
the master additional information about the cause of the OPT3001-Q1 interrupt. If the master requires additional
information, the result register or the configuration register can be queried. The flag high and flag low fields are
not cleared upon an SMBus alert response.
INT
1
9
1
9
SCL
SDA
FH(1)
0
0
0
1
1
0
0
R/W
1
0
0
0
1
A1
A0
Start By
Master
ACK By
Device
From
Device
NACK By Stop By
Master Master
Frame 2 Slave Address Byte(2)
Frame 1 SMBus ALERT Response Address Byte
(1) FH is the flag high field (FH) in the configuration register (see Table 10).
(2) A1 and A0 are determined by the ADDR pin; see Table 1.
Figure 26. Timing Diagram for SMBus Alert Response
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8.6 Register Maps
8.6.1 Internal Registers
The device is operated over the I2C bus with registers that contain configuration, status, and result information. All registers are 16 bits long.
There are four main registers: result, configuration, low-limit, and high-limit. There are also two ID registers: manufacturer ID and device ID. Table 6 lists
these registers.
Table 6. Register Map
ADDRESS
REGISTER
BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
(Hex)(1)
00h
Result
Configuration
Low Limit
E3
RN3
LE3
E2
RN2
LE2
E1
RN1
LE1
E0
RN0
LE0
R11
CT
R10
M1
R9
M0
R8
OVF
TL8
TH8
ID8
R7
CRF
TL7
TH7
ID7
R6
FH
R5
FL
R4
L
R3
POL
TL3
TH3
ID3
R2
ME
R1
FC1
TL1
TH1
ID1
R0
FC0
TL0
TH0
ID0
01h
02h
TL11
TH11
ID11
DID11
TL10
TH10
ID10
DID10
TL9
TH9
ID9
TL6
TH6
ID6
TL5
TH5
ID5
TL4
TH4
ID4
DID4
TL2
TH2
ID2
High Limit
03h
HE3
ID15
DID15
HE2
ID14
DID14
HE1
ID13
DID13
HE0
ID12
DID12
Manufacturer ID
Device ID
7Eh
7Fh
DID9
DID8
DID7
DID6
DID5
DID3
DID2
DID1
DID0
(1) Register offset and register address are used interchangeably.
20
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8.6.1.1 Register Descriptions
NOTE
Register offset and register address are used interchangeably.
8.6.1.1.1 Result Register (offset = 00h)
This register contains the result of the most recent light to digital conversion. This 16-bit register has two fields: a
4-bit exponent and a 12-bit mantissa.
Figure 27. Result Register (Read-Only)
15
E3
R
14
E2
R
13
E1
R
12
E0
R
11
R11
R
10
R10
R
9
R9
R
8
R8
R
7
R7
R
6
R6
R
5
R5
R
4
R4
R
3
R3
R
2
R2
R
1
R1
R
0
R0
R
LEGEND: R = Read only
Table 7. Result Register Field Descriptions
Bit
Field
Type
Reset
Description
Exponent.
15:12
E[3:0]
R
0h
These bits are the exponent bits. Table 8 provides further details.
Fractional result.
These bits are the result in straight binary coding (zero to full-scale).
11:0
R[11:0]
R
000h
Table 8. Full-Scale Range and LSB Size as a Function of Exponent Level
E3
0
0
0
0
0
0
0
0
1
1
1
1
E2
0
0
0
0
1
1
1
1
0
0
0
0
E1
0
0
1
1
0
0
1
1
0
0
1
1
E0
0
1
0
1
0
1
0
1
0
1
0
1
FULL-SCALE RANGE (lux)
40.95
LSB SIZE (lux per LSB)
0.01
0.02
0.04
0.08
0.16
0.32
0.64
1.28
2.56
5.12
10.24
20.48
81.90
163.80
327.60
655.20
1310.40
2620.80
5241.60
10483.20
20966.40
41932.80
83865.60
The formula to translate this register into lux is given in Equation 1:
lux = LSB_Size × R[11:0]
(1)
(2)
(3)
where:
LSB_Size = 0.01 × 2E[3:0]
LSB_Size can also be taken from Table 8. The complete lux equation is shown in Equation 3:
lux = 0.01 × (2E[3:0]) × R[11:0]
A series of result register output examples with the corresponding LSB weight and resulting lux are given in
Table 9. Note that many combinations of exponents (E[3:0]) and fractional results (R[11:0]) can map onto the
same lux result, as shown in the examples of Table 9.
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Table 9. Examples of Decoding the Result Register into lux
FRACTIONAL
RESULT
(R[11:0], Hex)
RESULT REGISTER
(Bits 15:0, Binary)
EXPONENT
(E[3:0], Hex)
LSB WEIGHT
(lux, Decimal)
RESULTING LUX
(Decimal)
0000 0000 0000 0001b
0000 1111 1111 1111b
0011 0100 0101 0110b
0111 1000 1001 1010b
1000 1000 0000 0000b
1001 0100 0000 0000b
1010 0010 0000 0000b
1011 0001 0000 0000b
1011 0000 0000 0001b
1011 1111 1111 1111b
00h
00h
03h
07h
08h
09h
0Ah
0Bh
0Bh
0Bh
001h
FFFh
456h
89Ah
800h
400h
200h
100h
001h
FFFh
0.01
0.01
0.01
40.95
0.08
88.80
1.28
2818.56
5242.88
5242.88
5242.88
5242.88
20.48
2.56
5.12
10.24
20.48
20.48
20.48
83865.60
Note that the exponent field can be disabled (set to zero) by enabling the exponent mask (configuration register,
ME field = 1) and manually programming the full-scale range (configuration register, RN[3:0] < 1100b (0Ch)),
allowing for simpler operation in a manually-programmed, full-scale mode. Calculating lux from the result register
contents only requires multiplying the result register by the LSB weight (in lux) associated with the specific
programmed full-scale range (see Table 8). See the Low-Limit Register for details.
See the configuration register conversion time field (CT, bit 11) description for more information on lux resolution
as a function of conversion time.
8.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
This register controls the major operational modes of the device. This register has 11 fields, which are
documented below. If a measurement conversion is in progress when the configuration register is written, the
active measurement conversion immediately aborts. If the new configuration register directs a new conversion,
that conversion is subsequently started.
Figure 28. Configuration Register
15
14
13
12
11
CT
10
M1
9
8
OVF
R
RN3
R/W
RN2
R/W
RN1
R/W
RN0
R/W
M0
R/W
R/W
R/W
7
CRF
R
6
FH
R
5
FL
R
4
L
3
2
1
0
POL
R/W
ME
R/W
FC1
R/W
FC0
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only
Table 10. Configuration Register Field Descriptions
Bit
Field
Type
Reset
Description
Range number field (read or write).
The range number field selects the full-scale lux range of the device. The format of this field is
the same as the result register exponent field (E[3:0]); see Table 8. When RN[3:0] is set to
1100b (0Ch), the device operates in automatic full-scale setting mode, as described in the
Automatic Full-Scale Setting Mode section. In this mode, the automatically chosen range is
reported in the result exponent (register 00h, E[3:0]).
15:12
RN[3:0]
R/W
1100b
The device powers up as 1100 in automatic full-scale setting mode. Codes 1101b, 1110b, and
1111b (0Dh, 0Eh, and 0Fh) are reserved for future use.
22
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Table 10. Configuration Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
Conversion time field (read or write).
The conversion time field determines the length of the light to digital conversion process. The
choices are 100 ms and 800 ms. A longer integration time allows for a lower noise
measurement.
The conversion time also relates to the effective resolution of the data conversion process. The
800-ms conversion time allows for the fully specified lux resolution. The 100-ms conversion
time with full-scale ranges above 0101b for E[3:0] in the result and configuration registers also
allows for the fully specified lux resolution. The 100-ms conversion time with full-scale ranges
below and including 0101b for E[3:0] can reduce the effective result resolution by up to three
bits, as a function of the selected full-scale range. Range 0101b reduces by one bit. Ranges
0100b, 0011b, 0010b, and 0001b reduces by two bits. Range 0000b reduces by three bits.
The result register format and associated LSB weight does not change as a function of the
conversion time.
11
CT
R/W
1b
0 = 100 ms
1 = 800 ms
Mode of conversion operation field (read or write).
The mode of conversion operation field controls whether the device is operating in continuous
conversion, single-shot, or low-power shutdown mode. The default is 00b (shutdown mode),
such that upon power-up, the device only consumes operational level power after appropriately
programming the device.
When single-shot mode is selected by writing 01b to this field, the field continues to read 01b
while the device is actively converting. When the single-shot conversion is complete, the mode
of conversion operation field is automatically set to 00b and the device is shut down.
When the device enters shutdown mode, either by completing a single-shot conversion or by a
manual write to the configuration register, there is no change to the state of the reporting flags
(conversion ready, flag high, flag low) or the INT pin. These signals are retained for
subsequent read operations while the device is in shutdown mode.
00 = Shutdown (default)
10:9
M[1:0]
R/W
00b
01 = Single-shot
10, 11 = Continuous conversions
Overflow flag field (read-only).
The overflow flag field indicates when an overflow condition occurs in the data conversion
process, typically because the light illuminating the device exceeds the programmed full-scale
range of the device. Under this condition OVF is set to 1, otherwise OVF remains at 0. The
field is reevaluated on every measurement.
If the full-scale range is manually set (RN[3:0] field < 1100b), the overflow flag field can be set
while the result register reports a value less than full-scale. This result occurs if the input light
has a temporary high spike level that temporarily overloads the integrating ADC converter
circuitry but returns to a level within range before the conversion is complete. Thus, the
overflow flag reports a possible error in the conversion process. This behavior is common to
integrating-style converters.
8
OVF
R
0b
If the full-scale range is automatically set (RN[3:0] field = 1100b), the only condition that sets
the overflow flag field is if the input light is beyond the full-scale level of the entire device.
When there is an overflow condition and the full-scale range is not at maximum, the OPT3001-
Q1 device aborts its current conversion, sets the full-scale range to a higher level, and starts a
new conversion. The flag is set at the end of the process. This process repeats until there is
either no overflow condition or until the full-scale range is set to its maximum range.
Conversion ready field (read-only).
The conversion ready field indicates when a conversion completes. The field is set to 1 at the
end of a conversion and is cleared (set to 0) when the configuration register is subsequently
read or written with any value except one containing the shutdown mode (mode of operation
field, M[1:0] = 00b). Writing a shutdown mode does not affect the state of this field; see the
Interrupt Reporting Mechanism Modes section for more details.
7
6
5
CRF
FH
R
R
R
0b
0b
0b
Flag high field (read-only).
The flag high field (FH) identifies that the result of a conversion is larger than a specified level
of interest. FH is set to 1 when the result is larger than the level in the high-limit register
(register address 03h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]). See the Interrupt Reporting Mechanism Modes section for more details on
clearing and other behaviors of this field.
Flag low field (read-only).
The flag low field (FL) identifies that the result of a conversion is smaller than a specified level
of interest. FL is set to 1 when the result is smaller than the level in the low-limit register
(register address 02h) for a consecutive number of measurements defined by the fault count
field (FC[1:0]). See the Interrupt Reporting Mechanism Modes section for more details on
clearing and other behaviors of this field.
FL
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Table 10. Configuration Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
Latch field (read or write).
The latch field controls the functionality of the interrupt reporting mechanisms: the INT pin, the
flag high field (FH), and flag low field (FL). This bit selects the reporting style between a
latched window-style comparison and a transparent hysteresis-style comparison.
0 = The device functions in transparent hysteresis-style comparison operation, where the three
interrupt reporting mechanisms directly reflect the comparison of the result register with the
high- and low-limit registers with no user-controlled clearing event. See the Interrupt Operation,
INT Pin, and Interrupt Reporting Mechanisms section for further details.
4
L
R/W
1b
1 = The device functions in latched window-style comparison operation, latching the interrupt
reporting mechanisms until a user-controlled clearing event.
Polarity field (read or write).
The polarity field controls the polarity or active state of the INT pin.
0 = The INT pin reports active low, pulling the pin low upon an interrupt event.
1 = Operation of the INT pin is inverted, where the INT pin reports active high, becoming high
impedance and allowing the INT pin to be pulled high upon an interrupt event.
3
2
POL
ME
R/W
R/W
0b
0b
Mask exponent field (read or write).
The mask exponent field forces the result register exponent field (register 00h, bits E[3:0]) to
0000b when the full-scale range is manually set, which can simplify the processing of the
result register when the full-scale range is manually programmed. This behavior occurs when
the mask exponent field is set to 1 and the range number field (RN[3:0]) is set to less than
1100b. Note that the masking is only performed to the result register. When using the interrupt
reporting mechanisms, the result comparison with the low-limit and high-limit registers is
unaffected by the ME field.
Fault count field (read or write).
The fault count field instructs the device as to how many consecutive fault events are required
to trigger the interrupt reporting mechanisms: the INT pin, the flag high field (FH), and flag low
field (FL). The fault events are described in the latch field (L), flag high field (FH), and flag low
1:0
FC[1:0]
R/W
00b
field (FL) descriptions.
00 = One fault count (default)
01 = Two fault counts
10 = Four fault counts
11 = Eight fault counts
24
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8.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
This register sets the lower comparison limit for the interrupt reporting mechanisms: the INT pin, the flag high
field (FH), and flag low field (FL), as described in the Interrupt Reporting Mechanism Modes section.
Figure 29. Low-Limit Register
15
14
13
12
11
10
9
8
LE3
R/W
LE2
R/W
LE1
R/W
LE0
R/W
TL11
R/W
TL10
R/W
TL9
R/W
TL8
R/W
7
6
5
4
3
2
1
0
TL7
R/W
TL6
R/W
TL5
R/W
TL4
R/W
TL3
R/W
TL2
R/W
TL1
R/W
TL0
R/W
LEGEND: R/W = Read/Write
Table 11. Low-Limit Register Field Descriptions
Bit
Field
Type
Reset
Description
Exponent.
15:12
LE[3:0]
R/W
0h
These bits are the exponent bits. Table 12 provides further details.
Result.
11:0
TL[11:0]
R/W
000h
These bits are the result in straight binary coding (zero to full-scale).
The format of this register is nearly identical to the format of the result register described in the Result Register.
The low-limit register exponent (LE[3:0]) is similar to the result register exponent (E[3:0]). The low-limit register
result (TL[11:0]) is similar to result register result (R[11:0]).
The equation to translate this register into the lux threshold is given in Equation 4, which is similar to the
equation for the result register, Equation 3.
lux = 0.01 × (2LE[3:0]) × TL[11:0]
(4)
Table 12 gives the full-scale range and LSB size as it applies to the low-limit register. The detailed discussion
and examples given in for the Result Register apply to the low-limit register as well.
Table 12. Full-Scale Range and LSB Size as a Function of Exponent Level
LE3
0
LE2
0
LE1
0
LE0
0
FULL-SCALE RANGE (lux)
40.95
LSB SIZE (lux per LSB)
0.01
0.02
0.04
0.08
0.16
0.32
0.64
1.28
2.56
5.12
10.24
20.48
0
0
0
1
81.90
0
0
1
0
163.80
0
0
1
1
327.60
0
1
0
0
655.20
0
1
0
1
1310.40
0
1
1
0
2620.80
0
1
1
1
5241.60
1
0
0
0
10483.20
20966.40
41932.80
83865.60
1
0
0
1
1
0
1
0
1
0
1
1
NOTE
The result and limit registers are all converted into lux values internally for comparison.
These registers can have different exponent fields. However, when using a manually-set
full-scale range (configuration register, RN < 0Ch, with mask enable (ME) active),
programming the manually-set full-scale range into the LE[3:0] and HE[3:0] fields can
simplify the choice of programming the register. This simplification results in the user only
having to think about the fractional result and not the exponent part of the result.
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8.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
The high-limit register sets the upper comparison limit for the interrupt reporting mechanisms: the INT pin, the
flag high field (FH), and flag low field (FL), as described in the Interrupt Operation, INT Pin, and Interrupt
Reporting Mechanisms section. The format of this register is almost identical to the format of the low-limit register
(described in the Low-Limit Register) and the result register (described in the Result Register). To explain the
similarity in more detail, the high-limit register exponent (HE[3:0]) is similar to the low-limit register exponent
(LE[3:0]) and the result register exponent (E[3:0]). The high-limit register result (TH[11:0]) is similar to the low-
limit result (TH[11:0]) and the result register result (R[11:0]). Note that the comparison of the high-limit register
with the result register is unaffected by the ME bit.
When using a manually-set, full-scale range with the mask enable (ME) active, programming the manually-set,
full-scale range into the HE[3:0] bits can simplify the choice of values required to program into this register. The
formula to translate this register into lux is similar to Equation 4. The full-scale values are similar to Table 8.
Figure 30. High-Limit Register
15
14
13
12
11
10
9
8
HE3
R/W
HE2
R/W
HE1
R/W
HE0
R/W
TH11
R/W
TH10
R/W
TH9
R/W
TH8
R/W
7
6
5
4
3
2
1
0
TH7
R/W
TH6
R/W
TH5
R/W
TH4
R/W
TH3
R/W
TH2
R/W
TH1
R/W
TH0
R/W
LEGEND: R/W = Read/Write
Table 13. High-Limit Register Field Descriptions
Bit
Field
Type
Reset
Description
Exponent.
These bits are the exponent bits.
15:12
HE[3:0]
R/W
Bh
Result.
11:0
TH[11:0]
R/W
FFFh
These bits are the result in straight binary coding (zero to full-scale).
26
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8.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
This register is intended to help uniquely identify the device.
Figure 31. Manufacturer ID Register
15
ID15
R
14
ID14
R
13
ID13
R
12
ID12
R
11
ID11
R
10
ID10
R
9
ID9
R
8
ID8
R
7
ID7
R
6
ID6
R
5
ID5
R
4
ID4
R
3
ID3
R
2
ID2
R
1
ID1
R
0
ID0
R
LEGEND: R = Read only
Table 14. Manufacturer ID Register Field Descriptions
Bit
Field
Type
Reset
Description
Manufacturer ID.
15:0
ID[15:0]
R
5449h
The manufacturer ID reads 5449h. In ASCII code, this register reads TI.
8.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
This register is also intended to help uniquely identify the device.
Figure 32. Device ID Register
15
DID15
R
14
DID14
R
13
DID13
R
12
DID12
R
11
DID11
R
10
DID10
R
9
DID9
R
8
DID8
R
7
DID7
R
6
DID6
R
5
DID5
R
4
DID4
R
3
DID3
R
2
DID2
R
1
DID1
R
0
DID0
R
LEGEND: R = Read only
Table 15. Device ID Register Field Descriptions
Bit
Field
Type
Reset
Description
Device ID.
The device ID reads 3001h.
15:0
DID[15:0]
R
3001h
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Ambient light sensors are used in a wide variety of applications that require control as a function of ambient light.
Because ambient light sensors nominally match the human eye spectral response, they are superior to
photodiodes when the goal is to create an experience for human beings. Very common applications include
display optical-intensity control and industrial or home lighting control.
There are two categories of interface to the OPT3001-Q1 device: electrical and optical.
9.1.1 Electrical Interface
The electrical interface is quite simple, as illustrated in Figure 33. Connect the OPT3001-Q1 I2C SDA and SCL
pins to the same pins of an applications processor, microcontroller, or other digital processor. If that digital
processor requires an interrupt resulting from an event of interest from the OPT3001-Q1 device, then connect the
INT pin to either an interrupt or general-purpose I/O pin of the processor. There are multiple uses for this
interrupt, including signaling the system to wake up from low-power mode, processing other tasks while waiting
for an ambient light event of interest, or alerting the processor that a sample is ready to be read. Connect pullup
resistors between a power supply appropriate for digital communication and the SDA and SCL pins (because
they have open-drain output structures). If the INT pin is used, connect a pullup resistor to the INT pin. A typical
value for these pullup resistors is 10 kΩ. The resistor choice can be optimized in conjunction to the bus
capacitance to balance the system speed, power, noise immunity, and other requirements.
The power supply and grounding considerations are discussed in the Power Supply Recommendations section.
Although spike suppression is integrated in the SDA and SCL pin circuits, use proper layout practices to
minimize the amount of coupling into the communication lines. One possible introduction of noise occurs from
capacitively coupling signal edges between the two communication lines themselves. Another possible noise
introduction comes from other switching noise sources present in the system, especially for long communication
lines. In noisy environments, shield communication lines to reduce the possibility of unintended noise coupling
into the digital I/O lines that could be incorrectly interpreted.
9.1.2 Optical Interface
The optical interface is physically located within the package, facing away from the PCB, as specified by the
Sensor Area in 图 41.
Physical components, such as a plastic housing and a window that allows light from outside of the design to
illuminate the sensor (see Figure 34), can help protect the OPT3001-Q1 device and neighboring circuitry.
Sometimes, a dark or opaque window is used to further enhance the visual appeal of the design by hiding the
sensor from view. This window material is typically transparent plastic or glass.
Any physical component that affects the light that illuminates the sensing area of a light sensor also affects the
performance of that light sensor. Therefore, for optimal performance, make sure to understand and control the
effect of these components. Design a window width and height to permit light from a sufficient field of view to
illuminate the sensor. For best performance, use a field of view of at least ±35°, or ideally ±45° or more.
Understanding and designing the field of view is discussed further in application report SBEA002, OPT3001:
Ambient Light Sensor Application Guide.
28
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
Application Information (continued)
The visible-spectrum transmission for dark windows typically ranges between 5% to 30%, but can be less than
1%. Specify a visible-spectrum transmission as low as, but no more than, necessary to achieve sufficient visual
appeal because decreased transmission decreases the available light for the sensor to measure. The windows
are made dark by either applying an ink to a transparent window material, or including a dye or other optical
substance within the window material itself. This attenuating transmission in the visible spectrum of the window
creates a ratio between the light on the outside of the design and the light that is measured by the OPT3001-Q1
device. To accurately measure the light outside of the design, compensate the OPT3001-Q1 measurement for
this ratio; an example is given in Dark Window Selection and Compensation.
Ambient light sensors are used to help create ideal lighting experiences for humans; therefore, the matching of
the sensor spectral response to that of the human eye response is vital. Infrared light is not visible to the human
eye, and can interfere with the measurement of visible light when sensors lack infrared rejection. Therefore, the
ratio of visible light to interfering infrared light affects the accuracy of any practical system that represents the
human eye. The strong rejection of infrared light by the OPT3001-Q1 device allows measurements consistent
with human perception under high-infrared lighting conditions, such as from incandescent, halogen, or sunlight
sources.
Although the inks and dyes of dark windows serve their primary purpose of being minimally transmissive to
visible light, some inks and dyes can also be very transmissive to infrared light. The use of these inks and dyes
further decreases the ratio of visible to infrared light, and thus decreases sensor measurement accuracy.
However, because of the excellent infrared rejection of the OPT3001-Q1 device, this effect is minimized, and
good results are achieved under a dark window with similar spectral responses to those shown in Figure 35.
For best accuracy, avoid grill-like window structures, unless the designer understands the optical effects
sufficiently. These grill-like window structures create a nonuniform illumination pattern at the sensor that make
light measurement results vary with placement tolerances and angle of incidence of the light. If a grill-like
structure is desired, the OPT3001-Q1 device is an excellent sensor choice because it is minimally sensitive to
illumination uniformity issues disrupting the measurement process.
Light pipes can appear attractive for aiding in the optomechanical design that brings light to the sensor; however,
do not use light pipes with any ambient light sensor unless the system designer fully understands the
ramifications of the optical physics of light pipes within the full context of his design and objectives.
9.2 Typical Application
Measuring the ambient light with the OPT3001-Q1 device in a product case and under a dark window is
described in this section. The schematic for this design is shown in Figure 33.
VDD
VDD
Digital Processor
OPT3001
SCL
SDA
INT
SCL
SDA
I2C
Interface
Optical
Filter
Ambient
Light
ADC
INT or GPIO
ADDR
GND
Figure 33. Measuring Ambient Light in a Product Case Behind a Dark Window
Copyright © 2017–2018, Texas Instruments Incorporated
29
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
Typical Application (continued)
9.2.1 Design Requirements
The basic requirements of this design are:
•
Sensor is hidden under dark glass so that sensor is not obviously visible. Note that this requirement is
subjective to designer preference.
•
•
Accuracy of measurement of fluorescent light is 15%
Variation in measurement between fluorescent, halogen, and incandescent bulbs (also known as light source
variation) is as small as possible.
9.2.2 Detailed Design Procedure
9.2.2.1 Optomechanical Design
After completing the electrical design, the next task is the optomechancial design. Design a product case that
includes a window to transmit the light from outside the product to the sensor, as shown in Figure 34. Design the
window width and window height to give a ±45° field of view. A rigorous design of the field of view takes into
account the location of the sensor area, as shown in 图 41. The OPT3001-Q1 active sensor area is centered
along one axis of the package top view, but has a minor offset on the other axis of the top view. Window sizing
and placement is discussed in more rigorous detail in application report SBEA002, OPT3001: Ambient Light
Sensor Application Guide.
Window Width
Window
Product Case
Field of View
Window Height
OPT3001
Side View
Active Sensor Area
PCB
Figure 34. Product Case and Window Over the OPT3001-Q1 Device
9.2.2.2 Dark Window Selection and Compensation
There are several approaches to selecting and compensating for a dark window. One of many approaches is the
method described here.
Sample several different windows with various levels of darkness. Choose a window that is dark enough to
optimize the balance between the aesthetics of the device and sensor performance. Note that the aesthetic
evaluation is the subjective opinion of the designer; therefore, it is more important to see the window on the
physical design rather than refer to window transmission specifications on paper. Make sure that the chosen
window is not darker than absolutely necessary because a darker window allows less light to illuminate the
sensor and therefore impedes sensor accuracy.
The window chosen for this application example is dark and has less than 7% transmission at 550 nm. Figure 35
shows the normalized response of the spectrum. Note that the equipment used to measure the transmission
spectrum is not capable of measuring the absolute accuracy (non-normalized) of the dark window sample, but
only the relative normalized spectrum. Also note that the window is much more transmissive to infrared
wavelengths longer than 700 nm than to visible wavelengths between 400 nm and 650 nm. This imbalance
between infrared and visible light decreases the ratio of visible light to infrared light at the sensor. Although it is
preferable to have the window decrease this ratio as little as possible (by having a window with a close ratio of
visible transmission to infrared transmission), the OPT3001-Q1 device still performs well as shown in Figure 38.
30
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
Typical Application (continued)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
400
500
600
700
800
900
1000
Wavelength (nm)
D018
Figure 35. Normalized Transmission Spectral Response of the Chosen Dark Window
After choosing the dark window, measure the attenuating effect of the dark window for later compensation. In
order to measure this attenuation, measure a fluorescent light source with a lux meter, then measure that same
light with the OPT3001-Q1 device under the dark window. To measure accurately, it is important to use a fixture
that can accommodate either the lux meter or the design containing the OPT3001-Q1 device and dark window,
with the center of each of the sensing areas being in exactly the same X, Y, Z location, as shown in Figure 36.
The Z placement of the design (distance from the light source) is the top of the window, and not the OPT3001-
Q1 device itself.
Light Source
Light Source
OPT3001
and
Window
Lux
Meter
Figure 36. Fixture With One Light Source Accommodating Either a Lux Meter or the Design (Window and
OPT3001-Q1 Device) in the Exact Same X,Y,Z Position
The fluorescent light in this location measures 1000 lux with the lux meter, and 73 lux with the OPT3001-Q1
device under the dark window within the application. Therefore, the window has an effective transmission of
7.3% for the fluorescent light. This 7.3% is the weighted average attenuation across the entire spectrum,
weighted by the spectral response of the lux meter (or photopic response).
For all subsequent OPT3001-Q1 measurements under this dark window, the following formula is applied.
Compensated Measurement = Uncompensated Measurement / (7.3%)
(5)
Copyright © 2017–2018, Texas Instruments Incorporated
31
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
Typical Application (continued)
9.2.3 Application Curves
To validate that the design example now measures correctly, create a sequential number of different light
intensities with the fluorescent light by using neutral density filters to attenuate the light. Different light intensities
can also be created by changing the distance between the light source, and the measurement devices. However,
these two methods for changing the light level have minor accuracy tradeoffs that are beyond the scope of this
discussion. Measure each intensity with both the lux meter and the OPT3001-Q1 device under the window, and
compensate using Equation 5. The results are displayed in Figure 37, and show that the application accurately
reports results very similar to the lux meter.
To validate that the design measures a variety of light sources correctly, despite the large ratio of infrared
transmission to visible light transmission of the window, measure the application with a halogen bulb and an
incandescent bulb. Use the physical location and light attenuation procedures that were used for the fluorescent
light. The results are shown in Figure 38.
The addition of the dark window changes the results as seen by comparing the results of the same measurement
with a window (Figure 38) and without a window (Figure 3). Even after the expected change, the performance is
still good. All data are both within 15% of the correct answer, and within 15% of the other bulb measurements.
Results can vary at different angles of light because the OPT3001-Q1 device does not match the lux meter at all
angles of light.
If the measurement variation between the light sources is not acceptable, choose a different window that has a
closer ratio of visible light transmission to infrared light transmission.
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
Compensated
Uncompensated
Fluorescent
Halogen
Incandescent
0
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Lux Meter (Lux)
Lux Meter (Lux)
D00119
D020
Figure 37. Uncompensated and Compensated Output of
the OPT3001-Q1 Grade 3 Device Under a Dark Window
Illuminated by Fluorescent Light Source
Figure 38. Compensated Output of the OPT3001-Q1 Grade
3 Device Under a Dark Window Illuminated by Fluorescent,
Halogen, and Incandescent Light Sources
9.3 Do's and Don'ts
As with any optical product, special care must be taken into consideration when handling the OPT3001-Q1
device. Although the OPT3001-Q1 device has low sensitivity to dust and scratches, proper optical device
handling procedures are still recommended.
The optical surface of the device must be kept clean for optimal performance in both prototyping with the device
and mass production manufacturing procedures. Tweezers with plastic or rubber contact surfaces are
recommended to avoid scratches on the optical surface. Avoid manipulation with metal tools when possible. The
optical surface must be kept clean of fingerprints, dust, and other optical-inhibiting contaminants.
If the device optical surface requires cleaning, the use of de-ionized water or isopropyl alcohol is recommended.
A few gentile brushes with a soft swab are appropriate. Avoid potentially abrasive cleaning and manipulating
tools and excessive force that can scratch the optical surface.
If the OPT3001-Q1 device performs less than optimally, inspect the optical surface for dirt, scratches, or other
optical artifacts.
32
Copyright © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
10 Power Supply Recommendations
Although the OPT3001-Q1 device has low sensitivity to power-supply issues, good practices are always
recommended. For best performance, the OPT3001-Q1 VDD pin must have a stable, low-noise power supply with
a 100-nF bypass capacitor close to the device and solid grounding. There are many options for powering the
OPT3001-Q1 device, because the device current consumption levels are very low.
11 Layout
11.1 Layout Guidelines
The PCB layout design for the OPT3001-Q1 device requires a couple of considerations. Bypass the power
supply with a capacitor placed close to the OPT3001-Q1 device. Note that optically reflective surfaces of
components also affect the performance of the design. The three-dimensional geometry of all components and
structures around the sensor must be taken into consideration to prevent unexpected results from secondary
optical reflections. Placing capacitors and components at a distance of at least twice the height of the component
is usually sufficient. The most optimal optical layout is to place all close components on the opposite side of the
PCB from the OPT3001-Q1 device. However, this approach may not be practical for the constraints of every
design.
Electrically connecting the thermal pad to ground is recommended. This connection can be created either with a
PCB trace or with vias to ground directly on the thermal pad itself. If the thermal pad contains vias, they are
recommended to be of a small diameter (< 0.2 mm) to prevent them from wicking the solder away from the
appropriate surfaces.
An example PCB layout with the OPT3001-Q1 device is shown in Figure 39.
11.2 Layout Example
Bypass Capacitor
OPT3001
To VDD
Power Supply
To
Processor
Figure 39. Example PCB Layout With the OPT3001-Q1 Device
版权 © 2017–2018, Texas Instruments Incorporated
33
OPT3001-Q1
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
www.ti.com.cn
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档
请参阅如下相关文档：
•
•
•
《OPT3001：环境光传感器应用指南》（文献编号：SBEA002）
《OPT3001EVM 用户指南》(SBOU134)
应用报告《QFN/SON PCB 连接》（文献编号：SLUA271）
12.2 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.6 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是适用于指定器件的最新数据。数据如有变更，恕不另行通知，
且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查看左侧的导航面板。
13.1 焊接和处理建议
OPT3001-Q1 器件通过 JEDEC JSTD-020 认证，适用于三种回流焊操作。
请注意：温度过高会导致器件褪色并影响光学性能。
有关焊接热概况和其他详细信息，请参阅应用报告《QFN/SON PCB 连接》(SLUA271)。如果必须从 PCB 上移除
OPT3001-Q1 器件，请丢弃此器件，不得重新连接。
与大多数光学器件一样，操作 OPT3001-Q1 器件时需要特别小心，确保光学表面保持洁净无损伤。更多详细建
议，请参见Do's and Don'ts 部分。为获得最优光学性能，完成焊接后必须清理焊剂和任何其他碎屑。
34
版权 © 2017–2018, Texas Instruments Incorporated
OPT3001-Q1
www.ti.com.cn
ZHCSG67A –MARCH 2017–REVISED DECEMBER 2018
13.2 DNP (S-PDSO-N6) 机械制图
图 40. 引脚 1 的封装方向视觉基准
（顶视图）
Top View
0.49
0.39
0.09
Side View
图 41. 显示感测区域位置的机械制图
（顶视图和侧视图）
版权 © 2017–2018, Texas Instruments Incorporated
35
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
OPT3001DNPRQ1
OPT3001IDNPRQ1
OPT3001IDNPTQ1
ACTIVE
ACTIVE
ACTIVE
USON
USON
USON
DNP
DNP
DNP
6
6
6
3000 RoHS & Green
3000 RoHS & Green
NIPDAUAG
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 105
-40 to 85
-40 to 85
ED
ED
ED
NIPDAUAG
NIPDAUAG
250
RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPT3001DNPRQ1
OPT3001IDNPRQ1
OPT3001IDNPTQ1
USON
USON
USON
DNP
DNP
DNP
6
6
6
3000
3000
250
330.0
330.0
180.0
12.4
12.4
12.4
2.3
2.3
2.3
2.3
2.3
2.3
0.9
0.9
0.9
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPT3001DNPRQ1
OPT3001IDNPRQ1
OPT3001IDNPTQ1
USON
USON
USON
DNP
DNP
DNP
6
6
6
3000
3000
250
356.0
356.0
193.0
338.0
338.0
193.0
48.0
48.0
70.0
Pack Materials-Page 2
PACKAGE OUTLINE
USON - 0.65 mm mm max height
PLASTIC SMALL OUTLINE NO-LEAD
DNP0006A
2.1
1.9
A
B
1
3
6
4
2.1
1.9
PIN 1
INDEX AREA
C
0.65
0.55
SEATING PLANE
0.08
0.05
0.00
±0.1
0.65
EXPOSED THERMAL
PAD
(0.2) TYP
3
4
2X 1.3
±0.1
1.35
4X 0.65
1
6
0.3
0.2
6X
PIN 1 ID
0.1
0.05
C A
C
B
0.35
0.25
6X
4221434/C 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Optical package with clear mold compound.
www.ti.com
EXAMPLE BOARD LAYOUT
USON - 0.65 mm mm max height
PLASTIC SMALL OUTLINE NO-LEAD
DNP0006A
SEE DETAILS
(0.65)
6X (0.5)
6X (0.25)
SYMM
℄
6
1
(1.35)
SYMM
℄
(0.8)
4X (0.65)
4
3
(Ø0.2) VIA
TYP
(1.9)
LAND PATTERN EXAMPLE
SCALE: 30X
0.07 MIN
0.07 MAX
ALL AROUND
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221434/C 01/2018
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271)
.
www.ti.com
EXAMPLE STENCIL DESIGN
USON - 0.65 mm mm max height
PLASTIC SMALL OUTLINE NO-LEAD
DNP0006A
(0.62)
6X (0.5)
SYMM
℄
6X (0.25)
6
1
SYMM
℄
(1.25)
4X (0.65)
METAL
TYP
3
4
(1.9)
SOLDER PASTE EXAMPLE
BASED ON 0.125mm THICK STENCIL
EXPOSED PAD
88% PRINTED SOLDER COVERAGE BY AREA
SCALE: 40X
4221434/C 01/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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