OPA333QDBVRQ1 [TI]
1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIER ZERO-DRIFT SERIES; 1.8 V微功耗CMOS运算放大器零漂移系列
| 型号： | OPA333QDBVRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIER ZERO-DRIFT SERIES |
| 文件： | 总18页 (文件大小：493K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA333-Q1
www.ti.com
SBOS522 –JUNE 2010
1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIER
ZERO-DRIFT SERIES
Check for Samples: OPA333-Q1
1
FEATURES
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
DBV PACKAGE
(TOP VIEW)
Low Offset Voltage: 10 mV (Max)
0.01-Hz to 10-Hz Noise: 1.1 mVPP
Quiescent Current: 17 mA
OUT
V–
V+
1
2
3
5
4
Single-Supply Operation
+IN
–IN
Supply Voltage: 1.8 V to 5.5 V
Rail-to-Rail Input/Output
MicroSize SOT23 (DBV) Package
DESCRIPTION/ORDERING INFORMATION
The OPA333 series of CMOS operational amplifiers uses a proprietary auto-calibration technique to
simultaneously provide very low offset voltage (10 mV max) and near-zero drift over time and temperature. These
miniature, high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have
a
common-mode range 100 mV beyond the rails, and rail-to-rail output that swings within 50 mV of the rails. Single
or dual supplies as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V) may be used. They are optimized for
low-voltage single-supply operation.
The OPA333 family offers excellent common-mode rejection ratio (CMRR) without the crossover associated with
traditional complementary input stages. This design results in superior performance for driving analog-to-digital
converters (ADCs) without degradation of differential linearity.
The OPA333 (single version) is available in the SOT23-5 package.
0.1Hz TO 10Hz NOISE
1s/div
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QCNQ
–40°C to 125°C
SOT23 – DBV
Reel of 2500
OPA333QDBVRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OPA333-Q1
SBOS522 –JUNE 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
7
UNIT
V
Supply voltage
Signal input terminals, voltage(2)
Output short circuit(3)
–0.3
(V+) + 0.3
Continuous
125
V
Operating temperature range
Storage temperature range
Junction temperature
–40
–65
°C
°C
°C
150(4)
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short circuit to ground, one amplifier per package
(4) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
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SBOS522 –JUNE 2010
ELECTRICAL CHARACTERISTICS: VS = 1.8 V to 5.5 V
Boldface limits apply over the specified temperature range, TA = –40°C to 125°C.
At TA = 25°C, RL = 10 kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2 (unless otherwise noted)
PARAMETER
OFFSET VOLTAGE
TEST CONDITIONS
MIN
TYP
MAX
10
UNIT
Input offset voltage
vs temperature
VOS
dVOS/dT
PSRR
VS = 5 V
VS = 5 V
2
mV
0.5
mV/°C
mV/V
vs power supply
Long-term stability(1)
Channel separation, dc
INPUT BIAS CURRENT
Input bias current
over Temperature
Input offset current
NOISE
VS = 1.8 V to 5.5 V
1
(1)
6
0.1
mV/V
IB
±70
±200
±140
±200
±400
pA
pA
pA
IOS
Input voltage noise,
f = 0.01 Hz to 1 Hz
0.3
mVPP
Input voltage noise,
f = 0.1 Hz to 10 Hz
1.1
mVPP
Input current noise, f = 10 Hz
INPUT VOLTAGE RANGE
Common mode voltage range
in
100
fA/√Hz
VCM
(V–) – 0.1
(V+) + 0.1
V
Common-Mode Rejection
Ratio
CMRR
(V–) – 0.1 V < VCM < (V+) + 0.1 V
106
130
dB
INPUT CAPACITANCE
Differential
2
4
pF
pF
Common mode
OPEN-LOOP GAIN
(V–) + 100 mV < VO < (V+) – 100 mV,
Open-loop voltage gain
AOL
106
130
dB
RL = 10 kΩ
FREQUENCY RESPONSE
Gain-bandwidth product
Slew rate
GBW
SR
CL = 100 pF
G = 1
350
kHz
0.16
V/ms
OUTPUT
Voltage output swing from rail
over temperature
Short-circuit current
Capacitive load drive
RL = 10 kΩ
RL = 10 kΩ
30
±5
50
mV
mV
mA
85
ISC
CL
(2)Open-loop output
impedance
f = 350 kHz, IO = 0
2
kΩ
POWER SUPPLY
Specified voltage range
VS
IQ
1.8
5.5
25
30
V
Quiescent current per
amplifier
IO = 0
17
mA
over temperature
mA
ms
Turn-on time
VS = 5 V
100
(1) 300-hour life test at 150°C demonstrated randomly distributed variation of approximately 1 mV.
(2) See Typical Characteristics
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ELECTRICAL CHARACTERISTICS: VS = 1.8 V to 5.5 V (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to 125°C.
At TA = 25°C, RL = 10 kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2 (unless otherwise noted)
PARAMETER
TEMPERATURE RANGE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Specified range
Operating range
Storage range
Thermal resistance
SOT23-5
–40
–40
–65
125
125
150
°C
°C
°C
qJA
200
°C/W
PIN CONFIGURATION
OUT
1
2
3
5
4
V+
−
V
−
IN
+IN
SOT23-5
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SBOS522 –JUNE 2010
TYPICAL CHARACTERISTICS
At TA = 25°C, VS = 5 V, and CL = 0 pF (unless otherwise noted)
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
µ
Offset Voltage ( V)
µ
_
Offset Voltage Drift ( V/ C)
OPEN−LOOP GAIN vs FREQUENCY
COMMON−MODE REJECTION RATIO vs FREQUENCY
120
100
80
60
40
20
0
250
200
150
100
50
140
120
100
80
60
0
40
−
−
50
20
−
20
100
0
10
100
1k
10k
100k
1M
1
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
POWER−SUPPLY REJECTION RANGE vs FREQUENCY
+PSRR
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
120
100
80
60
40
20
0
3
2
1
0
±
±
VS
VS
=
=
2.75V
0.9V
−
_
40 C
−
PSRR
_
+25 C
_
+125 C
_
+25 C
−
_
40 C
−
−
−
1
2
3
_
+125 C
_
+25 C
−
_
40 C
1
10
100
1k
10k
100k
1M
0
1
2
3
4
5
6
7
8
9
10
Frequency (Hz)
Output Current (mA)
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TYPICAL CHARACTERISTICS (continued)
INPUT BIAS CURRENT vs COMMON−MODE VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
100
80
60
40
20
0
200
150
100
50
VS = 5.5V
VS = 1.8V
−
IB
−
IB
−
IB
VS = 5V
0
+IB
−
−
−
−
20
40
60
80
−
50
−
−
−
100
150
200
+IB
+IB
−
100
−
−
0
1
2
3
4
5
50
25
0
25
50
75
100
125
_
Temperature ( C)
Common−Mode Voltage (V)
QUIESCENT CURRENT vs TEMPERATURE
LARGE−SIGNAL STEP RESPONSE
25
20
15
10
5
G = 1
RL = 10k
Ω
VS = 5.5V
VS = 1.8V
0
−
−
25
50
0
25
50
75
100
125
µ
Time (50 s/div)
_
Temperature ( C)
SMALL−SIGNAL STEP RESPONSE
POSITIVE OVER−VOLTAGE RECOVERY
G = +1
Ω
RL = 10k
0
Input
Output
Ω
10k
+2.5V
Ω
1k
0
OPA333
−
2.5V
µ
Time (5 s/div)
µ
Time (50 s/div)
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SBOS522 –JUNE 2010
TYPICAL CHARACTERISTICS (continued)
SETTLING TIME vs CLOSED−LOOP GAIN
NEGATIVE OVER−VOLTAGE RECOVERY
600
500
400
300
200
100
0
4V Step
Input
0
0
Ω
10k
+2.5V
Ω
1k
0.001%
0.01%
Output
OPA333
−
2.5V
1
10
100
µ
Time (50 s/div)
Gain (dB)
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE
0.1Hz TO 10Hz NOISE
40
35
30
25
20
15
10
5
0
10
100
1000
1s/div
Load Capacitance (pF)
CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
1000
100
10
1000
Continues with no 1/f (flicker) noise.
Current Noise
100
Voltage Noise
10
1
10
100
1k
10k
Frequency (Hz)
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SBOS522 –JUNE 2010
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APPLICATION INFORMATION
The OPA333 is unity-gain stable and free from unexpected output phase reversal. They use a proprietary
auto-calibration technique to provide low offset voltage and very low drift over time and temperature. For lowest
offset voltage and precision performance, circuit layout and mechanical conditions should be optimized. Avoid
temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from
connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by ensuring they
are equal on both input terminals. Other layout and design considerations include:
•
•
•
Use low thermoelectric-coefficient conditions (avoid dissimilar metals)
Thermally isolate components from power supplies or other heat sources
Shield op amp and input circuitry from air currents, such as cooling fans
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can cause
thermoelectric voltages of 0.1 mV/°C or higher, depending on materials used.
Operating Voltage
The OPA333 op amp operates over
a
power-supply range of 1.8
V
to 5.5
V
(±0.9
V
to
±2.75 V). Supply voltages higher than 7 V (absolute maximum) can permanently damage the device. Parameters
that vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet.
Input Voltage
The OPA333 input common-mode voltage range extends 0.1 V beyond the supply rails. The OPA333 is
designed to cover the full range without the troublesome transition region found in some other rail-to-rail
amplifiers.
Normally, input bias current is about 70 pA; however, input voltages exceeding the power supplies can cause
excessive current to flow into or out of the input pins. Momentary voltages greater than the power supply can be
tolerated if the input current is limited to 10 mA. This limitation is easily accomplished with an input resistor(see
Figure 1).
Current−limiting resistor
required if input voltage
exceeds supply rails by
≥
0.5V.
+5V
IOVERLOAD
10mA max
VOUT
OPA333A
VIN
Ω
5k
Figure 1. Input Current Protection
Internal Offset Correction
The OPA333 op amp uses an auto-calibration technique with a time-continuous 350-kHz op amp in the signal
path. This amplifier is zero corrected every 8 ms using a proprietary technique. Upon power up, the amplifier
requires approximately 100 ms to achieve specified VOS accuracy. This design has no aliasing or flicker noise.
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SBOS522 –JUNE 2010
Achieving Output Swing to the Op Amp Negative Rail
Some applications require output voltage swings from 0 V to a positive full-scale voltage (such as 2.5 V) with
excellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0 V,
near the lower output swing limit of a single-supply op amp. A good single-supply op amp may swing close to
single-supply ground, but will not reach ground. The output of the OPA333 can be made to swing to ground, or
slightly below, on a single-supply power source. To do so requires the use of another resistor and an additional,
more negative, power supply than the op amp negative supply. A pulldown resistor may be connected between
the output and the additional negative supply to pull the output down below the value that the output would
otherwise achieve (see Figure 2).
V+ = +5V
OPA333A
VOUT
VIN
Ω
RP = 20k
−
Op Amp V = Gnd
−
5V
Additional
Negative
Supply
Figure 2. VOUT Range to Ground
The OPA333 has an output stage that allows the output voltage to be pulled to its negative supply rail, or slightly
below, using the technique previously described. This technique only works with some types of output stages.
The OPA333 has been characterized to perform with this technique; however, the recommended resistor value is
approximately 20 kΩ. Note that this configuration will increase the current consumption by several hundreds of
microamps.
Accuracy
is
excellent
down
to
0
V
and
as
low
as
–2 mV. Limiting and nonlinearity occurs below –2 mV, but excellent accuracy returns as the output is again
driven above –2 mV. Lowering the resistance of the pulldown resistor allows the op amp to swing even further
below the negative rail. Resistances as low as 10 kΩ can be used to achieve excellent accuracy down to
–10 mV.
General Layout Guidelines
Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printed
circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.
Place a 0.1-mF capacitor closely across the supply pins. These guidelines should be applied throughout the
analog circuit to improve performance and provide benefits, such as reducing the electromagnetic interference
(EMI) susceptibility.
Operational amplifiers vary in their susceptibility to radio frequency interference (RFI). RFI can generally be
identified as a variation in offset voltage or dc signal levels with changes in the interfering RF signal. The
OPA333 has been specifically designed to minimize susceptibility to RFI and demonstrates remarkably low
sensitivity compared to previous-generation devices. Strong RF fields may still cause varying offset levels.
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SBOS522 –JUNE 2010
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4.096V
R1
REF3140
+5V
+
R9
150k
µ
0.1 F
Ω
Ω
6.04k
R5
Ω
+5V
0.1 F
31.6k
D1
µ
R2
2.94k
R2
Ω
Ω
549
−
−
+
+
VO
OPA333A
R6
K−Type
Thermocouple
Ω
200
R3
R4
6.04k
Zero Adj.
µ
_
40.7 V/
C
Ω
Ω
60.4
Figure 3. Temperature Measurement
Figure 4 shows the basic configuration for a bridge amplifier.
VEX
R1
+5V
R
R
R
R
VOUT
OPA333A
R1
VREF
Figure 4. Single Op-Amp Bridge Amplifier
A low-side current shunt monitor is shown in Figure 5. RN are operational resistors used to isolate the ADS1100
from the noise of the digital I2C bus. Since the ADS1100 is a 16-bit converter, a precise reference is essential for
maximum accuracy. If absolute accuracy is not required, and the 5-V power supply is sufficiently stable, the
REF3130 may be omitted.
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SBOS522 –JUNE 2010
3V
REF3130
+5V
R2
Load
R1
Ω
Ω
Ω
4.99k
49.9k
R6
71.5k
RN
Ω
V
Ω
56
RSHUNT
ILOAD
OPA333A
Ω
1
R3
4.99k
R4
RN
I2C
ADS1100
Ω
48.7k
Ω
56
R7
1.18k
(PGA Gain = 4)
FS = 3.0V
Stray Ground−Loop Resistance
Ω
NOTE: 1% resistors provide adequate common−mode rejection at small ground−loop errors.
Figure 5. Low-Side Current Monitor
RG
zener(1)
V+
RSHUNT
(2)
R1
MOSFET rated to
Ω
OPA333A
10k
stand−off supply voltage
such as BSS84 for
up to 50V.
+5V
V+
Two zener
biasing methods
are shown.(3)
Output
RBIAS
Load
RL
(1) zener rated for op amp supply capability (that is, 5.1V for OPA333).
(2) Current−limiting resistor.
NOTES:
(3) Choose zener biasing resistor or dual NMOSFETS (FDG6301N, NTJD4001N, or Si1034)
Figure 6. High-Side Current Monitor
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V1
INA152
−
In
OPA333
2
3
5
6
100 kΩ
R2
60 kΩ
1 MΩ
VO
R1
3V
NTC
Thermistor
R2
OPA333
1 MΩ
1
OPA333
V2
+In
−
VO = (1 + 2R2/R1) (V2 V1)
Figure 7. Thermistor Measurement
Figure 8. Precision Instrumentation Amplifier
+VS
fLPF = 150Hz
C4
1.06nF
R1
100k
1/2
OPA2333
Ω
Ω
Ω
RA
R14
GTOT = 1kV/V
Ω
1M
R7
100k
+VS
Ω
Ω
+VS
GINA = 5
6
R12
R6
100k
+VS
3
2
7
Ω
5k
Ω
R2
100k
1/2
OPA2333
INA321(1)
1
VOUT
OPA333
LL
4
5
C3
GOPA = 200
µ
1 F
R13
R8
100k
Ω
318k
+VS
+VS
dc
ac
R3
100k
1/2
OPA2333
1/2
Wilson
VCENTRAL
OPA2333
LA
C1
47pF
(RA + LA + LL)/3
fHPF = 0.5Hz
(provides ac signal coupling)
1/2 VS
R5
Ω
390k
+VS
VS = +2.7V to +5.5V
BW = 0.5Hz to 150Hz
R9
+VS
Ω
20k
R4
1/2
Ω
100k
OPA2333
1/2
OPA2333
RL
Inverted
VCM
+VS
R10
NOTE: (1) Other instrumentation amplifiers can be used,
such as the INA326, which has lower noise,
but higher quiescent current.
Ω
1M
1/2 VS
R11
C2
Ω
1M
µ
0.64 F
fO = 0.5Hz
Figure 9. Single-Supply, Very-Low-Power ECG Circuit
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PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
OPA333AQDBVRQ1
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA333-Q1 :
Catalog: OPA333
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA333AQDBVRQ1
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
OPA333AQDBVRQ1
5
3000
Pack Materials-Page 2
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