OPA330_1 [TI]
50mV VOS, 0.25mV/°C, 35mA CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series; 50mV的VOS ，长：0.25mV / A ℃， 35毫安CMOS运算放大器ZERA漂移系列
| 型号： | OPA330_1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 50mV VOS, 0.25mV/°C, 35mA CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series |
| 文件： | 总30页 (文件大小：1207K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
50mV V , 0.25mV/°C, 35mA
OS
CMOS OPERATIONAL AMPLIFIERS
Zerø-Drift Series
Check for Samples: OPA330, OPA2330, OPA4330
1
FEATURES
DESCRIPTION
23
•
UNMATCHED PRICE PERFORMANCE
LOW OFFSET VOLTAGE: 50mV (max)
ZERO DRIFT: 0.25mV/°C (max)
The OPA330 series of CMOS operational amplifiers
offer precision performance at a very competitive
price. These devices are members of the Zerø-Drift
•
•
•
•
•
•
•
•
family of amplifiers which use
a
proprietary
LOW NOISE: 1.1mVPP, 0.1Hz to 10Hz
QUIESCENT CURRENT: 35mA (max)
SUPPLY VOLTAGE: 1.8V to 5.5V
RAIL-TO-RAIL INPUT/OUTPUT
auto-calibration technique to simultaneously provide
low offset voltage (50mV max) and near-zero drift
over time and temperature at only 35mA (max) of
quiescent current. The OPA330 family features
rail-to-rail input and output in addition to near flat 1/f
noise, making this amplifier ideal for many
applications and much easier to design into a system.
These devices are optimized for low-voltage
operation as low as +1.8V (±0.9V) and up to +5.5V
(±2.75V).
INTERNAL EMI FILTERING
microSIZE PACKAGES: WCSP, SC70, QFN
APPLICATIONS
•
•
•
•
•
•
•
BATTERY-POWERED INSTRUMENTS
TEMPERATURE MEASUREMENTS
TRANSDUCER APPLICATIONS
ELECTRONIC SCALES
MEDICAL INSTRUMENTATION
HANDHELD TEST EQUIPMENT
CURRENT SENSE
The OPA330 (single version) is available in the
WCSP-5, SC70-5, SOT23-5, and SOIC-8 packages.
The OPA2330 (dual version) is offered in DFN-8
(3mm × 3mm), MSOP-8, and SOIC-8 packages. The
OPA4330 is offered in the standard SOIC-14 and
TSSOP-14 packages, as well as in the space-saving
VQFN-14 package. All versions are specified for
operation from –40°C to +125°C.
PRODUCT FAMILY PACKAGE COMPARISON
PACKAGE-LEADS
NO OF
DEVICE
OPA330
OPA2330
OPA4330
CHANNELS
WCSP
SOIC
SOT23
SC70
MSOP
QFN
–
TSSOP
1
2
4
5
–
–
8
8
5
–
–
5
–
–
–
8
–
–
–
8
14
14
14
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
NanoStar, NanoFree are trademarks of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2010, Texas Instruments Incorporated
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
PRODUCT
PACKAGE-LEAD
SOT23-5
SC70-5
PACKAGE DESIGNATOR
PACKAGE MARKING
OCFQ
DBV
DCK
D
CHL
OPA330
SOIC-8
O330A
WCSP-5
SOIC-8
YFF
D
OEH
O2330A
OCGQ
OPA2330
DFN-8
DRB
DGK
D
MSOP-8
SOIC-14
TSSOP-14
QFN-14(2)
OCGQ
O4330A
O4330A
4330A
OPA4330
OPA4330
PW
RGY
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at ti.com.
(2) Product preview device.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
OPA330, OPA2330, OPA4330
UNIT
V
Supply Voltage, VS = (V+) – (V–)
Signal Input Terminals, Voltage(2)
Signal Input Terminals, Current(2)
Output Short-Circuit(3)
+7
(V–) –0.3 to (V+) + 0.3
±10
V
mA
Continuous
–40 to +150
–65 to +150
+150
Operating Temperature
°C
°C
°C
V
Storage Temperature
Junction Temperature
Human Body Model (HBM)
4000
ESD
Ratings:
Charged Device Model (CDM)
1000
V
Machine Model (MM)
400
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
THERMAL INFORMATION
OPA330AIYFF
THERMAL METRIC(1)
YFF
5 PINS
130
54
UNITS
qJA
Junction-to-ambient thermal resistance
qJCtop
qJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
51
°C/W
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1
yJB
50
qJCbot
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.
OPA330, OPA2330, OPA4330
PARAMETER
TEST CONDITIONS
VS = +5V
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
VOS
dVOS/dT
PSRR
8
0.02
1
50
0.25
10
mV
mV/°C
mV/V
vs Power Supply
VS = +1.8V to +5.5V
(1)
Long-Term Stability(1)
Channel Separation, dc
INPUT BIAS CURRENT
Input Bias Current
See
0.1
mV/V
IB
IOS
en
±200
±70
±500
±300
pA
pA
pA
pA
pA
Input Bias Current: OPA330YFF, OPA4330
over Temperature
±300
±400
±140
Input Offset Current
±1000
±600
Input Offset Current: OPA330YFF, OPA4330
NOISE
Input Voltage Noise Density
Input Voltage Noise
f = 1kHz
f = 0.01Hz to 1Hz
f = 0.1Hz to 10Hz
f = 10Hz
55
0.3
1.1
100
nV/√Hz
mVPP
Input Voltage Noise
mVPP
Input Current Noise
in
fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
(V–) – 0.1
(V+) + 0.1
V
CMRR
(V–) – 0.1V < VCM < (V+) + 0.1V
100
115
115
dB
Common-Mode Rejection Ratio:
OPA330YFF, OPA4330
(V–) – 0.1V < VCM < (V+) + 0.1V, VS = 5.5V
100
dB
INPUT CAPACITANCE
Differential
2
4
pF
pF
Common-Mode
OPEN-LOOP GAIN
(V–) + 100mV < VO < (V+) – 100mV,
Open-Loop Voltage Gain
AOL
100
115
dB
RL = 10kΩ
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
CL = 100pF
G = +1
350
kHz
0.16
V/ms
OUTPUT
Voltage Output Swing from Rail
Short-Circuit Current
Capacitive Load Drive
Open-Loop Output Impedance
POWER SUPPLY
30
100
mV
ISC
CL
±5
mA
See Typical Characteristics
2
f = 350kHz, IO = 0
kΩ
Specified Voltage Range
Quiescent Current Per Amplifier
Turn-On Time
VS
1.8
5.5
35
V
IQ
IO = 0
21
mA
ms
VS = +5V
100
(1) 300-hour life test at +150°C demonstrated randomly distributed variation of approximately 1mV.
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.
OPA330, OPA2330, OPA4330
PARAMETER
TEMPERATURE RANGE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT23-5
–40
–40
–65
+125
+150
+150
°C
°C
°C
qJA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
200
150
50
MSOP-8, SOIC-8, TSSOP-14
DFN-8
SC70-5
250
130
WCSP-5
PIN CONFIGURATIONS
OPA330
SOT23-5
(TOP VIEW)
OPA330
SC70-5
(TOP VIEW)
OUT
V-
1
2
3
5
4
V+
+IN
V-
1
2
3
5
4
V+
+IN
-IN
-IN
OUT
OPA330
SOIC-8
(TOP VIEW)
OPA330
WCSP-5
(TOP VIEW)
C3
C1
NC(1)
V+
NC(1)
1
8
7
6
5
OUT
VS-
VS+
IN-
B2
-IN
+IN
V-
2
3
4
OUT
NC(1)
A3
A1
IN+
(1) NC denotes no internal connection.
4
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
PIN CONFIGURATIONS, CONTINUED
OPA2330
SOIC-8, MSOP-8
(TOP VIEW)
OPA2330
DFN-8
(TOP VIEW)
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
A
Exposed
Thermal
Die Pad
on
OUT B
-IN B
+IN B
OUT B
-IN B
+IN B
B
Underside(2)
OPA4330
SOIC-14
(TOP VIEW)
OPA4330
QFN-14
(TOP VIEW)
1
2
3
4
5
6
7
OUT A
-IN A
+IN A
V+
14
OUT D
13 -IN D
12 +IN D
11 V-
A
D
13
12
2
3
4
5
6
-IN A
+IN A
V+
-IN D
+IN D
Exposed
Thermal Die
Pad on
10
9
+IN B
-IN B
OUT B
+IN C
-IN C
OUT C
B
C
11 V-
(2)
Underside
10
9
+IN B
-IN B
+IN C
8
-IN C
OPA4330
TSSOP-14
(TOP VIEW)
OUT A
-IN A
+IN A
V+
1
2
3
4
5
6
7
14 OUT D
13 -IN D
12 +IN D
11 V-
(2) Connect thermal die pad to V–.
10
9
+IN C
-IN C
OUT C
+IN B
-IN B
OUT B
8
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, CL = 0pF, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
OPEN-LOOP GAIN vs FREQUENCY
120
100
80
250
200
150
100
50
Phase
60
40
Gain
20
0
0
-50
-100
-20
10
100
1k
10k
100k
1M
Frequency (Hz)
Offset Voltage (mV)
Figure 1.
Figure 2.
COMMON-MODE REJECTION RATIO vs FREQUENCY
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
140
120
+PSRR
120
100
80
60
40
20
0
100
80
60
40
20
0
-PSRR
1
10
100
1k
10k
100k
1M
1
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
Figure 3.
Figure 4.
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
3
2
210
VS = ±2.75V
VS = ±0.9V
205
200
195
190
-IB
-40°C
1
+25°C
+125°C
0
+25°C
-40°C
-190
-195
-200
-205
-210
-1
-2
-3
+125°C
+25°C
+IB
-40°C
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
Output Current (mA)
Common-Mode Voltage (V)
Figure 5.
Figure 6.
6
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, CL = 0pF, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.
INPUT BIAS CURRENT vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
250
200
150
100
50
25
20
15
10
5
-IB
VS = 5.5V
-IB
VS = 1.8V
VS = 5.5V
VS = 1.8V
0
-50
-100
-150
-200
-250
+IB
+IB
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Figure 7.
Figure 8.
LARGE-SIGNAL STEP RESPONSE
SMALL-SIGNAL STEP RESPONSE
G = 1
RL = 10kW
G = +1
RL = 10kW
Time (50ms/div)
Time (5ms/div)
Figure 9.
Figure 10.
POSITIVE OVER-VOLTAGE RECOVERY
NEGATIVE OVER-VOLTAGE RECOVERY
0
Input
Input
Output
0
0
10kW
10kW
+2.5V
+2.5V
1kW
1kW
0
Output
OPA330
OPA330
-2.5V
-2.5V
Time (50ms/div)
Time (50ms/div)
Figure 11.
Figure 12.
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, CL = 0pF, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
600
500
400
300
200
100
0
40
4V Step
35
30
25
20
15
10
5
0.001%
0.01%
0
1
10
100
10
100
1000
Gain (dB)
Load Capacitance (pF)
Figure 13.
Figure 14.
CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
0.1Hz TO 10Hz NOISE
1000
100
10
1000
Continues with no 1/f (flicker) noise.
Current Noise
100
Voltage Noise
10
1
10
100
1k
10k
1s/div
Frequency (Hz)
Figure 15.
Figure 16.
INPUT BIAS CURRENT vs INPUT DIFFERENTIAL VOLTAGE
50
Normal Operating Range
40
(see the Input Differential
Voltage section in the
Applications Information)
30
20
10
0
-10
-20
-30
Over-Driven Condition
Over-Driven Condition
200 400 600 800
-40
-50
-1V -800 -600 -400 -200
0
Input Differential Voltage (mV)
Figure 17.
8
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
APPLICATIONS INFORMATION
The OPA330, OPA2330, and OPA4330 are unity-gain
stable, precision operational amplifiers free from
unexpected output and phase reversal. The use of
proprietary Zerø-Drift circuitry gives the benefit of low
input offset voltage over time and temperature, as
well as lowering the 1/f noise component. As a result
of the high PSRR, these devices work well in
applications that run directly from battery power
without regulation. The OPA330 family is optimized
for low-voltage, single-supply operation. These
miniature, high-precision, low quiescent current
amplifiers offer high-impedance inputs that have a
common-mode range 100mV beyond the supplies
and a rail-to-rail output that swings within 100mV of
the supplies under normal test conditions. The
OPA330 series are precision amplifiers for
cost-sensitive applications.
INPUT DIFFERENTIAL VOLTAGE
The typical input bias current of the OPA330 during
normal operation is approximately 200pA. In
over-driven conditions, the bias current can increase
significantly (see Figure 17).The most common cause
of an over-driven condition occurs when the op amp
is outside of the linear range of operation. When the
output of the op amp is driven to one of the supply
rails the feedback loop requirements cannot be
satisfied and a differential input voltage develops
across the input pins. This differential input voltage
results in activation of parasitic diodes inside the front
end input chopping switches that combine with 10kΩ
electromagnetic interference (EMI) filter resistors to
create the equivalent circuit shown in Figure 19.
Notice that the input bias current remains within
specification within the linear region.
OPERATING VOLTAGE
10kW
Clamp
The OPA330 series op amps can be used with single
+In
or dual supplies from an operating range of VS
=
CORE
+1.8V (±0.9V) up to +5.5V (±2.75V). Supply voltages
greater than +7V can permanently damage the
device. See the Absolute Maximum Ratings table.
Key parameters that vary over the supply voltage or
temperature range are shown in the Typical
Characteristics section of this data sheet.
-In
10kW
Figure 19. Equivalent Input Circuit
INTERNAL OFFSET CORRECTION
INPUT VOLTAGE
The OPA330, OPA2330, and OPA4330 op amps use
an auto-calibration technique with a time-continuous
125kHz op amp in the signal path. This amplifier is
The OPA330, OPA2330, and OPA4330 input
common-mode voltage range extends 0.1V beyond
the supply rails. The OPA330 is designed to cover
the full range without the troublesome transition
region found in some other rail-to-rail amplifiers.
zero-corrected every 8ms using
a
proprietary
technique. Upon power-up, the amplifier requires
approximately 100ms to achieve specified VOS
accuracy. This design has no aliasing or flicker noise.
Typically, input bias current is about 200pA; however,
input voltages exceeding the power supplies can
cause excessive current to flow into or out of the
input pins. Momentary voltages greater than the
power supply can be tolerated if the input current is
limited to 10mA. This limitation is easily accomplished
with an input resistor, as shown in Figure 18.
EMI SUSCEPTIBILITY AND INPUT FILTERING
Operational amplifiers vary in their susceptibility to
EMI. If conducted EMI enters the operational
amplifier, the dc offset observed at the amplifier
output may shift from its nominal value while the EMI
is present. This shift is a result of signal rectification
associated with the internal semiconductor junctions.
While all operational amplifier pin functions can be
affected by EMI, the input pins are likely to be the
most susceptible. The OPA330 operational amplifier
family incorporates an internal input low-pass filter
that reduces the amplifier response to EMI. Both
common-mode and differential mode filtering are
provided by the input filter. The filter is designed for a
cutoff frequency of approximately 8MHz (–3dB), with
a roll-off of 20dB per decade.
Current-limiting resistor
required if input voltage
exceeds supply rails by
³ 0.3V.
+5V
IOVERLOAD
10mA max
VOUT
OPA330
VIN
5kW
Figure 18. Input Current Protection
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
ACHIEVING OUTPUT SWING TO THE OP
AMP NEGATIVE RAIL
The OPA330, OPA2330, and OPA4330 have an
output stage that allows the output voltage to be
pulled to its negative supply rail, or slightly below,
using the technique previously described. This
technique only works with some types of output
stages. The OPA330, OPA2330, and OPA4330 have
been characterized to perform with this technique; the
recommended resistor value is approximately 20kΩ.
Note that this configuration will increase the current
consumption by several hundreds of microamps.
Accuracy is excellent down to 0V and as low as
–2mV. Limiting and nonlinearity occurs below –2mV,
but excellent accuracy returns as the output is again
driven above –2mV. Lowering the resistance of the
pull-down resistor will allow the op amp to swing even
further below the negative rail. Resistances as low as
10kΩ can be used to achieve excellent accuracy
down to –10mV.
Some applications require output voltage swings from
0V to a positive full-scale voltage (such as +2.5V)
with excellent accuracy. With most single-supply op
amps, problems arise when the output signal
approaches 0V, near the lower output swing limit of a
single-supply op amp. A good single-supply op amp
may swing close to single-supply ground, but will not
reach ground. The output of the OPA330, OPA2330,
and OPA4330 can be made to swing to ground, or
slightly below, on a single-supply power source. To
do so requires the use of another resistor and an
additional, more negative, power supply than the op
amp negative supply. A pull-down resistor may be
connected between the output and the additional
negative supply to pull the output down below the
value that the output would otherwise achieve, as
shown in Figure 20.
APPLICATION CIRCUITS
Figure 21 shows the basic configuration for a bridge
amplifier.
V+ = +5V
A
low-side current shunt monitor is shown in
OPA330
VOUT
Figure 22.
VIN
RP = 20kW
VEX
R1
Op Amp V- = GND
-5V
+5V
Additional
Negative
Supply
R
R
R
R
VOUT
OPA330
Figure 20. For VOUT Range to Ground
R1
VREF
Figure 21. Single Op Amp Bridge Amplifier
3V
REF3130
+5V
Load
R1
R2
4.99kW
49.9kW
R6
RN
71.5kW
V
56W
RSHUNT
ILOAD
OPA330
1W
I2C
R3
R4
48.7kW
RN
ADS1100
4.99kW
56W
R7
1.18kW
(PGA Gain = 4)
FS = 3.0V
Stray Ground-Loop Resistance
NOTE: 1% resistors provide adequate common-mode rejection at small ground-loop errors.
Figure 22. Low-Side Current Monitor
10
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
RN are operational resistors used to isolate the
ADS1100 from the noise of the digital I2C bus.
Because the ADS1100 is a 16-bit converter, a precise
reference is essential for maximum accuracy. If
absolute accuracy is not required, and the 5V power
supply is sufficiently stable, the REF3130 may be
omitted.
Following these guidelines reduces the likelihood of
junctions being at different temperatures, which can
cause thermoelectric voltages of 0.1mV/°C or higher,
depending on materials used.
OPA330 WCSP
The OPA330 YFF package is a lead- (Pb-) free,
die-level, wafer chip-scale package (WCSP). Unlike
devices that are in plastic packages, these devices
have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly
procedures, the WCSP can be mounted to a printed
circuit board (PCB) without additional underfill.
Figure 24 and Figure 25 detail the pinout and
package marking, respectively. See the NanoStar™
and NanoFree™ 300mm Solder Bump WCSP
Application Note (SBVA017) for more detailed
information on package characteristics and PCB
design.
Figure 23 shows the OPA330 in a typical thermistor
circuit.
100kW
1MW
1MW
60kW
3V
NTC
Thermistor
OPA330
Figure 23. Thermistor Measurement
YFF PACKAGE
WCSP-5
(TOP VIEW)
GENERAL LAYOUT GUIDELINES
C3
C1
OUT
VS-
VS+
IN-
Attention to good layout practice is always
recommended. Keep traces short and, when
possible, use a printed circuit board (PCB) ground
plane with surface-mount components placed as
close to the device pins as possible. Place a 0.1mF
capacitor closely across the supply pins. These
guidelines should be applied throughout the analog
circuit to improve performance and provide benefits
such as reducing the electromagnetic interference
(EMI) susceptibility.
B2
A3
A1
IN+
(Bump side down;
not to scale)
Figure 24. WCSP Pin Description
For lowest offset voltage and precision performance,
circuit layout and mechanical conditions should be
optimized. Avoid temperature gradients that create
thermoelectric (Seebeck) effects in the thermocouple
junctions formed from connecting dissimilar
conductors. These thermally-generated potentials can
be made to cancel by assuring they are equal on
both input terminals. Other layout and design
considerations include:
YFF PACKAGE
WCSP-5 Enlarged Image
(Top View)
Package Marking Code:
Actual Size:
YMD = year/month/day
TBD = indicates OPA330AIYFF
S = for engineering purposes only
Exact Size (max):
0,862 mm x 1,156 mm
•
•
•
Use low thermoelectric-coefficient conditions
(avoid dissimilar metals).
Thermally isolate components from power
supplies or other heat sources.
Shield op amp and input circuitry from air
currents, such as cooling fans.
(Bump side down)
Figure 25. YFF Package Marking
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
SBOS432D –AUGUST 2008–REVISED JUNE 2010
www.ti.com
PHOTOSENSITIVITY
The QFN and DFN package can be easily mounted
using standard PCB assembly techniques. See
Application Note QFN/SON PCB Attachment
(SLUA271) and Application Report Quad Flatpack
No-Lead Logic Packages (SCBA017), both available
for download at www.ti.com.
Although the OPA330 YFF package has a protective
backside coating that reduces the amount of light
exposure on the die, unless fully shielded, ambient
light can reach the active region of the device. Input
bias current for the package is specified in the
absence of light. Depending on the amount of light
exposure in a given application, an increase in bias
current, and possible increases in offset voltage
should be expected. Fluorescent lighting may
introduce noise or hum because of the time-varying
light output. Best layout practices include end-product
packaging that provides shielding from possible light
sources during operation.
The exposed leadframe die pad on the bottom of
the package should be connected to V–.
QFN AND DFN LAYOUT GUIDELINES
The leadframe die pad should be soldered to a
thermal pad on the PCB. A mechanical data sheet
showing an example layout is attached at the end of
this data sheet. Refinements to this layout may be
required based on assembly process requirements.
Mechanical drawings located at the end of this data
sheet list the physical dimensions for the package
and pad. The five holes in the landing pattern are
optional, and are intended for use with thermal vias
that connect the leadframe die pad to the heatsink
area on the PCB.
QFN AND DFN PACKAGES
The OPA4330 is offered in a QFN package. The
OPA2330 is available in a DFN-8 package (also
known as SON), which is a QFN package with lead
contacts on only two sides of the bottom of the
package. These leadless, near-chip-scale packages
maximize board space and enhance thermal and
electrical characteristics through an exposed pad.
QFN and DFN packages are physically small, have a
smaller routing area, improved thermal performance,
and improved electrical parasitics, with a pinout
scheme that is consistent with other commonly-used
packages, such as SOIC and MSOP. Additionally, the
absence of external leads eliminates bent-lead
issues.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low-power
dissipation, the exposed pad must be soldered to the
PCB to provide structural integrity and long-term
reliability.
12
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA330 OPA2330 OPA4330
OPA330
OPA2330
OPA4330
www.ti.com
SBOS432D –AUGUST 2008–REVISED JUNE 2010
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October 2009) to Revision D
Page
•
•
•
Added last Applications bullet ............................................................................................................................................... 1
Deleted footnote 1 from Product Family Package Comparison table ................................................................................... 1
Deleted footnote 2 and shading from all packages except QFN-14; moved WCSP-5, SOIC-14, and TSSOP-14
packages to Production Data status; and added package marking information to Package Information table ................... 2
•
•
Added OPA330YFF, OPA4330 Input Bias Current parameter to Electrical Characteristics table ....................................... 3
Added Input Voltage Range, OPA330YFF, OPA4330 Common-Mode Rejection Ratio parameter to Electrical
Characteristics table ............................................................................................................................................................. 3
•
•
Moved TSSOP-14 thermal resistance to MSOP-8, SOIC-8 thermal resistance parameter in Electrical Characteristics
table ...................................................................................................................................................................................... 4
Deleted SOIC-14 and QFN-14 rows from Temperature Range section in Electrical Characteristics table .......................... 4
Changes from Revision B (September, 2009) to Revision C
Page
•
•
•
Changed maximum quiescent current value (Features list, document title) to 35mA ........................................................... 1
Changed maximum value for Quiescent Current per Amplifier specification ....................................................................... 3
Added Application Circuits section ..................................................................................................................................... 10
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): OPA330 OPA2330 OPA4330
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
OPA2330AID
OPA2330AIDG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
5
5
5
5
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
D
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
OPA2330AIDGKR
OPA2330AIDGKRG4
OPA2330AIDGKT
OPA2330AIDGKTG4
OPA2330AIDR
MSOP
MSOP
MSOP
MSOP
SOIC
DGK
DGK
DGK
DGK
D
2500
2500
250
Green (RoHS
& no Sb/Br)
Purchase Samples
Green (RoHS
& no Sb/Br)
Purchase Samples
Green (RoHS
& no Sb/Br)
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
250
Green (RoHS
& no Sb/Br)
2500
3000
3000
250
Green (RoHS
& no Sb/Br)
OPA2330AIDRBR
OPA2330AIDRBRG4
OPA2330AIDRBT
OPA2330AIDRBTG4
OPA2330AIDRG4
OPA330AID
SON
DRB
DRB
DRB
DRB
D
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
SON
250
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
SOIC
2500
75
Green (RoHS
& no Sb/Br)
Request Free Samples
SOIC
D
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
OPA330AIDBVR
OPA330AIDBVRG4
OPA330AIDBVT
OPA330AIDBVTG4
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
3000
3000
250
Green (RoHS
& no Sb/Br)
Purchase Samples
Green (RoHS
& no Sb/Br)
Purchase Samples
Green (RoHS
& no Sb/Br)
Request Free Samples
Request Free Samples
250
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2010
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
OPA330AIDCKR
OPA330AIDCKRG4
OPA330AIDCKT
OPA330AIDCKTG4
OPA330AIDG4
SC70
SC70
SC70
SC70
SOIC
SOIC
SOIC
DCK
DCK
DCK
DCK
D
5
5
5
5
8
8
8
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Request Free Samples
Request Free Samples
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
75
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
OPA330AIDR
D
2500
2500
Green (RoHS
& no Sb/Br)
Request Free Samples
OPA330AIDRG4
D
Green (RoHS
& no Sb/Br)
Request Free Samples
OPA330AIYFFR
OPA330AIYFFT
OPA4330AID
PREVIEW
PREVIEW
ACTIVE
DSBGA
DSBGA
SOIC
YFF
YFF
D
5
5
3000
250
50
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Samples Not Available
Samples Not Available
Purchase Samples
14
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
OPA4330AIDR
OPA4330AIPW
OPA4330AIPWR
ACTIVE
ACTIVE
ACTIVE
SOIC
D
14
14
14
2500
90
Green (RoHS
& no Sb/Br)
Request Free Samples
Purchase Samples
TSSOP
TSSOP
PW
PW
Green (RoHS
& no Sb/Br)
2000
Green (RoHS
& no Sb/Br)
Request Free Samples
OPA4330AIRGYR
OPA4330AIRGYT
PREVIEW
PREVIEW
VQFN
VQFN
RGY
RGY
14
14
3000
250
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Samples Not Available
Samples Not Available
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
22-Jul-2010
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2330AIDGKR
OPA2330AIDGKT
OPA2330AIDR
MSOP
MSOP
SOIC
DGK
DGK
D
8
8
2500
250
330.0
180.0
330.0
330.0
180.0
179.0
179.0
179.0
179.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
8.4
5.3
5.3
6.4
3.3
3.3
3.2
3.2
2.2
2.2
6.4
6.5
6.9
3.3
3.3
5.2
3.3
3.3
3.2
3.2
2.5
2.5
5.2
9.0
5.6
1.3
1.3
2.1
1.1
1.1
1.4
1.4
1.2
1.2
2.1
2.1
1.6
8.0
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q2
Q2
Q3
Q3
Q3
Q3
Q1
Q1
Q1
8
2500
3000
250
OPA2330AIDRBR
OPA2330AIDRBT
OPA330AIDBVR
OPA330AIDBVT
OPA330AIDCKR
OPA330AIDCKT
OPA330AIDR
SON
DRB
DRB
DBV
DBV
DCK
DCK
D
8
SON
8
SOT-23
SOT-23
SC70
5
3000
250
5
8.4
8.0
5
3000
250
8.4
8.0
SC70
5
8.4
8.0
SOIC
8
2500
2500
2000
12.4
16.4
12.4
12.0
16.0
12.0
OPA4330AIDR
SOIC
D
14
14
OPA4330AIPWR
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2330AIDGKR
OPA2330AIDGKT
OPA2330AIDR
MSOP
MSOP
SOIC
DGK
DGK
D
8
8
2500
250
346.0
203.0
346.0
346.0
190.5
203.0
203.0
203.0
203.0
346.0
346.0
346.0
346.0
203.0
346.0
346.0
212.7
203.0
203.0
203.0
203.0
346.0
346.0
346.0
35.0
35.0
29.0
29.0
31.8
35.0
35.0
35.0
35.0
29.0
33.0
29.0
8
2500
3000
250
OPA2330AIDRBR
OPA2330AIDRBT
OPA330AIDBVR
OPA330AIDBVT
OPA330AIDCKR
OPA330AIDCKT
OPA330AIDR
SON
DRB
DRB
DBV
DBV
DCK
DCK
D
8
SON
8
SOT-23
SOT-23
SC70
5
3000
250
5
5
3000
250
SC70
5
SOIC
8
2500
2500
2000
OPA4330AIDR
SOIC
D
14
14
OPA4330AIPWR
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明