OPA2364 [TI]
1.8V, 7MHz, 90dB CMRR, SINGLE-SUPPLY, RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER; 1.8V ， 7MHz的， 90分贝共模抑制比，单电源，轨到轨输入/输出运算放大器
| 型号： | OPA2364 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.8V, 7MHz, 90dB CMRR, SINGLE-SUPPLY, RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER |
| 文件： | 总27页 (文件大小：728K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA363
OPA2363
OPA364
OPA2364
OPA4364
O
®
P
A
4
3
6
4
O
P
A
4
3
6
4
OP
A
236
4
O
P
A
2
3
6
3
OPA
363
SBOS259B – SEPTEMBER 2002 – REVISED FEBRUARY 2003
1.8V, 7MHz, 90dB CMRR,
SINGLE-SUPPLY, RAIL-TO-RAIL I/O
OPERATIONAL AMPLIFIER
DESCRIPTION
FEATURES
The OPA363 and OPA364 families are high-performance
CMOS operational amplifiers optimized for very low voltage,
single-supply operation. These miniature, low-cost amplifiers
are designed to operate on single supplies from 1.8V (±0.9V)
to 5.5V (±2.75V). Applications include sensor amplification
and signal conditioning in battery-powered systems.
● 1.8V OPERATION
● MicroSIZE PACKAGES
● BANDWIDTH: 7MHz
● CMRR: 90dB (typical)
● SLEW RATE: 5V/µs
The OPA363 and OPA364 families offer excellent CMRR
without the crossover associated with traditional complimen-
tary input stages. This results in excellent performance for
driving Analog-to-Digital (A/D) converters without degrada-
tion of differential linearity and THD. The input common-
mode range includes both the negative and positive supplies.
The output voltage swing is within 10mV of the rails.
● LOW OFFSET: 500µV (max)
● QUIESCENT CURRENT: 750µA/Channel (max)
● SHUTDOWN MODE: < 1µA/Channel
APPLICATIONS
The OPA363 family includes a shutdown mode. Under logic
control, the amplifiers can be switched from normal operation
to a standby current that is less than 1µA.
● SIGNAL CONDITIONING
● DATA ACQUISITION
● PROCESS CONTROL
● ACTIVE FILTERS
The single version is available in the MicroSIZE SOT23-5
(SOT23-6 for shutdown) and SO-8. The dual version is
available in MSOP-8, MSOP-10, and SO-8 packages. Quad
packages are available in TSSOP-14 and SO-14 packages.
All versions are specified for operation from –40°C to +125°C.
● TEST EQUIPMENT
OPA363
OPA364 OPA2363 OPA2364 OPA4364
SOT23-5
SOT23-6
MSOP-8
MSOP-10
SO-8
x
x
x
x
x
x
x
TSSOP-14
SO-14
x
x
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2002-2003, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage ................................................................................. +5.5V
Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
Enable Input ...............................................................(V–) – 0.5V to 5.5V
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–40°C to +150°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those specified is
not implied. (2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less. (3) Short-circuit to ground one amplifier
per package.
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
DESIGNATOR(1)
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
OPA363I
SOT23-6
DBV
–40°C to +125°C
A40
OPA363IDBVT
OPA363IDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
"
"
OPA363I
SO-8
D
–40°C to +125°C
OPA363
OPA363ID
Rails, 100
"
"
"
"
"
OPA363IDR
Tape and Reel, 2500
OPA2363I
MSOP-10
DGS
–40°C to +125°C
BHK
OPA2363IDGST
OPA2363IDGSR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
OPA364I
SOT23-5
DBV
–40°C to +125°C
A41
OPA364IDBVT
OPA364IDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
"
"
OPA364I
SO-8
D
–40°C to +125°C
OPA364
OPA364ID
Rails, 100
"
"
"
"
"
OPA364IDR
Tape and Reel, 2500
OPA2364I
MSOP-8
DGK
–40°C to +125°C
BHL
OPA2364IDGKT
OPA2364IDGKR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
OPA2364I
SO-8
D
–40°C to +125°C
OPA2364
OPA2364ID
Rails, 100
"
"
"
"
"
OPA2364IDR
Tape and Reel, 2500
OPA363AI
SOT23-6
DBV
–40°C to +125°C
A40
OPA363AIDBVT
OPA363AIDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
"
"
OPA363AI
SO-8
D
–40°C to +125°C
OPA363A
OPA363AID
Rails, 100
"
"
"
"
"
OPA363AIDR
Tape and Reel, 2500
OPA2363AI
MSOP-10
DGS
–40°C to +125°C
BHK
OPA2363AIDGST
OPA2363AIDGSR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
OPA364AI
SOT23-5
DBV
–40°C to +125°C
A41
OPA364AIDBVT
OPA364AIDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
"
"
OPA364AI
SO-8
D
–40°C to +125°C
OPA364A
OPA364AID
Rails, 100
"
"
"
"
"
OPA364AIDR
Tape and Reel, 2500
OPA2364AI
SO-8
D
–40°C to +125°C
OPA2634A
OPA2364AID
Rails, 100
"
"
"
"
"
OPA2364AIDR
Tape and Reel, 2500
OPA2364AI
MSOP-8
DGK
–40°C to +125°C
BHL
OPA2364AIDGKT
OPA2364AIDGKR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
OPA4364AI
SO-14
D
–40°C to +125°C
OPA4364A
OPA4364AID
Rails, 58
"
"
"
"
"
OPA4364AIDR
Tape and Reel, 2500
OPA4364AI
TSSOP-14
PW
–40°C to +125°C
OPA4364A
OPA4364AIPWT
OPA4364AIPWR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
OPA363, 2363, 364, 2364, 4364
2
www.ti.com
SBOS259B
PIN CONFIGURATIONS
Top View
OPA363(1)
OPA364
OPA364(1)
VOUT
V–
1
2
3
6
5
4
V+
NC
–In
+In
V–
1
2
3
4
8
7
6
5
NC
V+
VOUT
V–
1
2
3
5
4
V+
Enable
–In
+In
VOUT
NC
+In
–In
SOT23-6
SOT23-5
SO-8
OPA4364
OPA2363
V
OUT A
–In A
+In A
V+
1
2
3
4
5
6
7
14 VOUT
13 –In D
12 +In D
11 V–
D
V
OUT A
–In A
+In A
–V
1
2
10 +V
9
VOUT
B
A
B
D
C
A
3
4
5
8
7
6
–In B
+In B
Enable B
B
+In B
–In B
OUT B
10 +In C
Enable A
9
8
–In C
OUT C
MSOP-10
V
V
SO-14, TSSOP-14
OPA363
OPA2364
NC
–In
+In
V–
1
2
3
4
8
7
6
5
Enable
V+
Out A
–In A
+In A
V–
1
2
3
4
8
V+
7
6
5
Out B
–In B
+In B
VOUT
NC(1)
NOTE: (1) Orient according to marking.
NC = No Internal Connection.
SO-8
MSOP-8, SO-8
OPA363, 2363, 364, 2364, 4364
SBOS259B
3
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ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, VCM = VS/2, unless otherwise noted.
OPAx363, OPAx364
TYP
PARAMETER
CONDITION
MIN
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage, OPA363I, OPA364I
OPA2363I, OPA2364I
OPA363AI, OPA364AI, OPA2363AI, OPA2364AI, OPA4364AI
VOS
VS = +5V
500
900
2.5
µV
µV
mV
µV/°C
µV/V
µV/V
1
3
80
1
Drift
dVOS /dT
PSRR
vs Power Supply
Channel Separation, dc
VS = 1.8V to 5.5V, VCM = 0
330
INPUT BIAS CURRENT
Input Bias Current
over Temperature
Input Offset Current
IB
±1
±10
pA
pA
See Typical Characteristics
IOS
±1
±10
NOISE
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 10kHz
Input Current Noise Density, f = 10kHz
en
en
in
10
17
0.6
µVp-p
nV/√Hz
fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
CMRR
(V–) – 0.1
(V+) + 0.1
V
dB
(V–) – 0.1V < VCM < (V+) + 0.1V
74
90
INPUT CAPACITANCE
Differential
Common-Mode
2
3
pF
pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain
OPA4364AI
RL = 10kΩ, 100mV < VO < (V+) – 100mV
AOL
94
90
86
100
dB
dB
dB
over Temperature
VS = +1.8V to +5.5V
FREQUENCY RESPONSE
CL = 100pF
Gain Bandwidth Product
GBW
tS
7
5
1
MHz
V/µs
µs
µs
µs
Slew Rate
SR
G = +1
VS = +5V, 4V Step, G = +1
S = +5V, 4V Step, G = +1
Settling Time, 0.1%
0.01%
Overload Recovery Time
Total Harmonic Distortion + Noise
V
1.5
0.8
0.002
VIN • Gain > VS
S = +5V, G = +1, f = 20Hz to 20kHz
THD+N
V
%
OUTPUT
Voltage Output Swing from Rail
over Temperature
Short-Circuit Current
Capacitive Load Drive
RL = 10kΩ
10
20
20
mV
mV
mA
RL = 10kΩ
ISC
CLOAD
See Typical Characteristics
See Typical Characteristics
SHUTDOWN (for OPAx363)
tOFF
tON
1
20
µs
µs
V
V
µA
(1)
V
V
L (shutdown)
H (amplifier is active)
(V–) + 0.8
0.75 (V+)
1.8
5.5
0.9
IQSD
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
VS
IQ
5.5
V
V
µA
µA
mA
1.8 to 5.5
650
850
VS = +1.8V
VS = +3.6V
VS = +5.5V
750
1000
1.4
1.1
TEMPERATURE RANGE
Specified Range
Operating Range
–40
–40
–65
+125
+150
+150
°C
°C
°C
Storage Range
Thermal Resistance
SOT23-5, SOT23-6
MSOP-8, MSOP-10, SO-8
TSSOP-14, SO-14
θJA
200
150
100
°C/W
°C/W
°C/W
NOTE: (1) Part is considered enabled when input offset voltage returns to specified range.
OPA363, 2363, 364, 2364, 4364
4
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SBOS259B
TYPICAL CHARACTERISTICS
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
100
90
80
70
60
50
40
30
20
10
0
120
100
80
0
–30
–60
–90
–120
–150
–180
60
40
20
0
–20
10
1.5
10
100
1k
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
100M
Frequency (Hz)
Frequency (Hz)
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
QUIESCENT CURRENT vs SUPPLY VOLTAGE
Per Amplifier
100
80
60
40
20
0
1.4
1.2
1.0
0.8
0.6
0.4
1
10
100
1k
10k
100k
1M
10M
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Frequency (Hz)
Supply Voltage (V)
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
1
1
0.1
G = 10, RL = 2kΩ
S = 5V
VOUT = –10dBv
(VS = 5V, VOUT = 1Vrms)
V
G = 10, RL = 2kΩ
VS = 1.8V
0.1
0.01
G = 10, RL = 2kΩ
G = 10, RL = 10kΩ
S = 1.8V, 5V
0.01
V
G = 10, RL = 10kΩ
0.001
0.0001
G = 1,
L = 10kΩ
VS = 1.8V, 5V
0.001
0.0001
G = 1, RL = 2kΩ
VS = 1.8V
R
G = 1,
RL = 2kΩ
VS = 5V
G = 1, RL = 2kΩ
G = 1, RL = 10kΩ
100
1k
Frequency (Hz)
10k
100k
10
100
1k
Frequency (Hz)
10k
100k
OPA363, 2363, 364, 2364, 4364
SBOS259B
5
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/2, unless otherwise noted.
INPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
1000
100
10
120
100
80
60
40
20
0
+ISC
–ISC
10
100
1k
10k
100k
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Frequency (Hz)
Supply Voltage (V)
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
3
4
2
VS = ±2.5V
VS = ±1.65V
2
1
0
–2
–4
–6
–8
–10
VS = ±0.9V
VCM = +5.1V
0
–1
–2
–3
TA = –40°C
TA = +25°C
TA = +125°C
VS = ±1.65V
VCM = –0.1V
VS = ±2.5V
0
±10 ±20 ±30 ±40 ±50 ±60 ±70 ±80 ±90 ±100
–0.5
0.5
1.5
2.5
3.5
4.5
5.5
Output Current (mA)
Common-Mode Voltage (V)
INPUT OFFSET CURRENT vs TEMPERATURE
INPUT BIAS CURRENT vs TEMPERATURE
10k
1k
10k
1k
100
10
1
100
10
1
–50
–25
0
25
50
75
100
125
–50
–25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
OPA363, 2363, 364, 2364, 4364
6
www.ti.com
SBOS259B
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
SETTLING TIME vs CLOSED-LOOP GAIN
vs LOAD CAPACITANCE
60
50
40
30
20
10
0
100
10
1
0.01%
0.1%
G = +1
G = +10
0.1
100
1k
1
10
100
Load Capacitance (pF)
Closed-Loop Gain (V/V)
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
OFFSET DRIFT DISTRIBUTION
16
14
12
10
8
20
15
10
5
Typical Production
Distribution of
Packaged Units
OPA36xAI
6
4
2
0
0
–2.5
–2.0
–1.0
0
1.0
2.0
2.5
0
1
2
3
4
5
6
7
8
9
> 10
Offset Voltage (mV)
Offset Voltage Drift (µV/°C)
OUTPUT ENABLE CHARACTERISTIC
(VS = 5V, VOUT = 20kHz Sinusoid)
CHANNEL SEPARATION vs FREQUENCY
130
120
110
100
90
80
70
60
50
40
50µs/div
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
OPA363, 2363, 364, 2364, 4364
SBOS259B
7
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TCASE = +25°C, RL = 10kΩ, and connected to VS/2, VOUT = VS/2, VCM = VS/2, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
(CL = 100pF)
LARGE-SIGNAL STEP RESPONSE
(CL = 100pF)
250ns/div
1µs/div
VS
APPLICATIONS INFORMATION
Regulated
Charge Pump
OUT = VCC +1.8V
The OPA363 and OPA364 series op amps are rail-to-rail
operational amplifiers with excellent CMRR, low noise, low
V
VCC + 1.8V
offset, and wide bandwidth on supply voltages as low as
Patent Pending
Very Low Ripple
Topology
±0.9V. The OPA363 features an additional pin for shutdown/
enable function. These families do not exhibit phase reversal
and are unity-gain stable. Specified over the industrial tem-
perature range of –40°C to +125°C, the OPA363 and OPA364
families offer precision performance for a wide range of
applications.
IBIAS
IBIAS
RAIL-TO-RAIL INPUT
The OPA363 and OPA364 feature excellent rail-to-rail opera-
tion, with supply voltages as low as ±0.9V. The input com-
mon-mode voltage range of the OPA363 and OPA364 family
extends 100mV beyond supply rails. The unique input topol-
IBIAS
VOUT
VIN–
VIN+
ogy of the OPA363 and OPA364 eliminates the input offset
transition region typical of most rail-to-rail complimentary
stage operational amplifiers, allowing the OPA363 and
OPA364 to provide superior common-mode performance
over the entire common-mode input range, as seen in Figure 1.
This feature prevents degradation of the differential linearity
error and THD when driving A/D converters. A simplified
schematic of the OPA363 and OPA364 is shown in Figure 2.
IBIAS
1.0
OPA363 and OPA364
0.5
FIGURE 2. Simplified Schematic.
0
–0.5
–1.0
–1.5
OPERATING VOLTAGE
The OPA363 and OPA364 series op amp parameters are fully
specified from +1.8V to +5.5V. Single 0.1µF bypass capaci-
tors should be placed across supply pins and as close to the
part as possible. Supply voltages higher than 5.5V (absolute
maximum) may cause permanent damage to the amplifier.
Many specifications apply from –40°C to +125°C. Parameters
that vary significantly with operating voltages or temperature
are shown in the Typical Characteristics.
–2.0
Competitors
–2.5
–3.0
–3.5
–0.2
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Common-Mode Voltage (V)
FIGURE 1. OPA363 and OPA364 have Linear Offset Over
Entire Common-Mode Range.
OPA363, 2363, 364, 2364, 4364
8
www.ti.com
SBOS259B
ENABLE FUNCTION
INPUT AND ESD PROTECTION
The shutdown (enable) function of the OPA363 is referenced
to the negative supply voltage of the operational amplifier. A
logic level HIGH enables the op amp. A valid logic HIGH is
defined as voltage > 75% of the positive supply applied to the
enable pin. The valid logic HIGH signal can be as much as
5.5V above the negative supply, independent of the positive
supply voltage. A valid logic LOW is defined as < 0.8V above
the negative supply pin. If dual or split power supplies are
used, care should be taken to ensure logic input signals are
properly referred to the negative supply voltage. This pin
should be connected to a valid high or low voltage or driven,
not left open circuit.
All OPA363 and OPA364 pins are static protected with
internal ESD protection diodes tied to the supplies. These
diodes will provide overdrive protection if the current is
externally limited to 10mA, as stated in the absolute maxi-
mum ratings and shown in Figure 4.
V+
IOVERLOAD
10mA max
VOUT
OPAx363
VIN
5kΩ
The logic input is a high-impedance CMOS input. Dual op
amps are provided separate logic inputs. For battery-oper-
ated applications, this feature may be used to greatly reduce
the average current and extend battery life. The enable time
is 20µs; disable time is 1µs. When disabled, the output
assumes a high-impedance state. This allows the OPA363 to
be operated as a “gated” amplifier, or to have its output
multiplexed onto a common analog output bus.
FIGURE 4. Input Current Protection.
ACHIEVING OUTPUT SWING TO
THE OP AMP’S NEGATIVE RAIL
Some applications require an accurate output voltage swing
from 0V to a positive full-scale voltage. A good single supply op
amp may be able to swing within a few mV of single supply
ground, but as the output is driven toward 0V, the output stage
of the amplifier will prevent the output from reaching the
negative supply rail of the amplifier.
CAPACITIVE LOAD
The OPA363 and OPA364 series op amps can drive a wide
range of capacitive loads. However, all op amps under
certain conditions may become unstable. Op amp configura-
tion, gain, and load value are just a few of the factors to
consider when determining stability. An op amp in unity-gain
configuration is the most susceptible to the effects of capaci-
tive load. The capacitive load reacts with the output resis-
tance of the op amp to create a pole in the small-signal
response, which degrades the phase margin.
The output of the OPA363 or OPA364 can be made to swing to
ground, or slightly below, on a single supply power source. To do
so requires use of another resistor and an additional, more
negative power supply than the op amp’s negative supply. A
pulldown resistor may be connected between the output and the
additional negative supply to pull the output down below the value
that the output would otherwise achieve as shown in Figure 5.
In unity gain, the OPA363 and OPA364 series op amps
perform well with a pure capacitive load up to approximately
1000pF. The ESR (Equivalent Series Resistance) of the
loading capacitor may be sufficient to allow the OPA363 and
OPA364 to directly drive very large capacitive loads (> 1µF).
Increasing gain enhances the amplifier’s ability to drive more
capacitance. See the typical characteristic “Small-Signal Over-
shoot vs Capacitive Load.”
V+ = +5V
OPA363
OPA364
VOUT
VIN
One method of improving capacitive load drive in the unity-
gain configuration is to insert a 10Ω to 20Ω resistor in series
with the output, as shown in Figure 3. This significantly
reduces ringing with large capacitive loads. However, if there
is a resistive load in parallel with the capacitive load, it
creates a voltage divider introducing a dc error at the output
and slightly reduces output swing. This error may be insignifi-
cant. For instance, with RL = 10kΩ and RS = 20Ω, there is
only about a 0.2% error at the output.
500µA
RP = 10kΩ
Op Amp’s
Negative
Supply
–V = –5V
(Additional
Negative Supply)
Grounded
FIGURE 5. OPA363 and OPA364 Swing to Ground.
This technique will not work with all op amps. The output
stage of the OPA363 and OPA364 allows the output voltage
to be pulled below that of most op amps, if approximately
500µA is maintained through the output stage. To calculate
the appropriate value load resistor and negative supply,
RL = –V/500µA. The OPA363 and OPA364 have been
characterized to perform well under the described conditions,
maintaining excellent accuracy down to 0V and as low as
–10mV. Limiting and nonlinearity occur below –10mV, with
linearity returning as the output is again driven above
–10mV.
V+
RS
OPAx363
OPAx364
VOUT
10Ω to
20Ω
VIN
CL
RL
FIGURE 3. Improving Capacitive Load Drive.
OPA363, 2363, 364, 2364, 4364
SBOS259B
9
www.ti.com
BUFFERED REFERENCE VOLTAGE
V+ = 1.8V
Many single-supply applications require a mid-supply refer-
ence voltage. The OPA363 and OPA364 offer excellent
capacitive load drive capability, and can be configured to
provide a 0.9V reference voltage, as can be seen in Figure 6.
For appropriate loading considerations, see the “Capacitive
Load” section.
V+ = 1.8V
100Ω
OPA363
OPA364
ADS8324
VIN
1nF
V+
V+
FIGURE 7. The OPA363 and OPA364 Directly Drive the
ADS8324.
R1
10kΩ
OPAx363
OPAx364
V+
0.9V
CL = 1µF
V+
R2
10kΩ
100Ω
OPA363
MSP430
OPA364
VIN
1nF
FIGURE 6. The OPA363 and OPA364 Provide a Stable
Reference Voltage.
DIRECTLY DRIVING THE ADS8324 AND
THE MSP430
FIGURE 8. Driving the 12-Bit A/D Converter on the MSP430.
The OPA363 and OPA364 series op amps are optimized for
driving medium speed (up to 100kHz) sampling A/D convert-
ers. However, they also offer excellent performance for
higher speed converters. The no crossover input stage of the
OPA363 and OPA364 directly drive A/D converters without
degradation of differential linearity and THD. They provide an
effective means of buffering the A/D converters input capaci-
tance and resulting charge injection while providing signal
gain. Figure 7 and Figure 8 show the OPA363 and OPA364
configured to drive the ADS8324 and the 12-bit
A/D converter on the MSP430.
AUDIO APPLICATIONS
The OPA363 and OPA364 op amp family has linear offset
voltage over the entire input common-mode range. Com-
bined with low-noise, this feature makes the OPA363 and
OPA364 suitable for audio applications. Single supply 1.8V
operation allows the OPA2363 and OPA2364 to be optimal
candidates for dual stereo-headphone drivers and micro-
phone pre-amplifiers in portable stereo equipment, see Fig-
ures 9 and 10.
20kΩ
V+
1µF
20kΩ
One of Right or Left Channel
20kΩ
10kΩ
20kΩ
1/2
OPA2363
One of Right or Left
Headphone Out
V+
V–
1/2
TPS6100
47pF
Internally
Biased
V–
V–
10kΩ
FIGURE 9. OPA2363 Configured as Half of a Dual Stereo Headphone Driver.
OPA363, 2363, 364, 2364, 4364
10
www.ti.com
SBOS259B
ACTIVE FILTERING
Low harmonic distortion and noise specifications plus high
gain and slew rate make the OPA363 and OPA364 optimal
candidates for active filtering. Figure 11 shows the OPA2363
configured as a low-distortion, 3rd-order GIC (General Immit-
tance Converter) filter. Figure 12 shows the implementation
of a Sallen-Key, 3-pole, low-pass Bessel filter.
49kΩ
Clean 3.3V Supply
3.3V
4kΩ
OPAx363
OPAx364
VOUT
5kΩ
1µF
Electret
Microphone
6kΩ
FIGURE 10. Microphone Preamplifier.
2
R1
R3
6
OPA363
VOUT
3.92kΩ
1.33kΩ
VIN
3
R11
C4
3.92kΩ
1000pF
3
2
R12
1/2
OPA2363
1
3.92kΩ
6
5
1/2
OPA2363
7
C13
1000pF
R14
3.48kΩ
C15
1000pF
FIGURE 11. The OPA2363 as a 3rd-Order, 40kHz, Low-Pass GIC Filter.
220pF
19.5kΩ
150kΩ
1.8kΩ
VIN = 1Vrms
OPA363
VOUT
3.3nF
47pF
FIGURE 12. The OPA363 or OPA364 Configured as a 3-Pole, 20kHz, Sallen-Key Filter.
OPA363, 2363, 364, 2364, 4364
SBOS259B
11
www.ti.com
PACKAGE DRAWINGS
DBV (R-PDSO-G6)
PLASTIC SMALL-OUTLINE
0,50
0,25
M
0,20
0,95
6
6X
4
0,15 NOM
1,70
1,50
3,00
2,60
1
3
Gage Plane
3,00
2,80
0,25
0 –8
0,55
0,35
Seating Plane
0,10
1,45
0,95
0,05 MIN
4073253-5/G 01/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
OPA363, 2363, 364, 2364, 4364
12
www.ti.com
SBOS259B
PACKAGE DRAWINGS (Cont.)
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
0.010 (0,25)
8
5
0.244 (6,20)
0.228 (5,80)
0.008 (0,20) NOM
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
4
0.010 (0,25)
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.069 (1,75) MAX
0.004 (0,10)
0.004 (0,10)
PINS **
8
14
16
DIM
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
A MIN
4040047/E 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
OPA363, 2363, 364, 2364, 4364
SBOS259B
13
www.ti.com
PACKAGE DRAWINGS (Cont.)
DGS (S-PDSO-G10)
PLASTIC SMALL-OUTLINE PACKAGE
0,27
0,17
M
0,08
0,50
10
6
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
5
0,69
0,41
3,05
2,95
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073272/B 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
A. Falls within JEDEC MO-187
OPA363, 2363, 364, 2364, 4364
14
www.ti.com
SBOS259B
PACKAGE DRAWINGS (Cont.)
DBV (R-PDSO-G5)
PLASTIC SMALL-OUTLINE
0,50
0,30
M
0,20
0,95
5
4
0,15 NOM
1,70
1,50
3,00
2,60
1
3
Gage Plane
3,00
2,80
0,25
0° – 8°
0,55
0,35
Seating Plane
0,10
1,45
0,95
0,05 MIN
4073253-4/G 01/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
OPA363, 2363, 364, 2364, 4364
SBOS259B
15
www.ti.com
PACKAGE DRAWINGS (Cont.)
DGK (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
M
0,65
8
0,08
5
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
4
0,69
3,05
2,95
0,41
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073329/C 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-187
OPA363, 2363, 364, 2364, 4364
16
www.ti.com
SBOS259B
PACKAGE DRAWINGS (Cont.)
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
OPA363, 2363, 364, 2364, 4364
SBOS259B
17
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
MSOP
MSOP
MSOP
MSOP
SOIC
Drawing
DGS
DGS
DGS
DGS
D
OPA2363AIDGSR
OPA2363AIDGST
OPA2363IDGSR
OPA2363IDGST
OPA2364AID
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
10
10
10
10
8
2500
250
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
CU NIPDAU Level-3-235C-168 HR
CU NIPDAU Level-3-235C-168 HR
CU NIPDAU Level-3-235C-168 HR
CU NIPDAU Level-3-235C-168 HR
2500
250
100
Call TI
Level-3-235C-168 HR
OPA2364AIDGKR
OPA2364AIDGKT
OPA2364AIDR
OPA2364ID
MSOP
MSOP
SOIC
DGK
DGK
D
8
2500
250
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-1-220C-UNLIM
8
8
2500
100
Call TI
Call TI
Level-3-235C-168 HR
Level-1-220C-UNLIM
SOIC
D
8
OPA2364IDGKR
OPA2364IDGKT
OPA2364IDR
MSOP
MSOP
SOIC
DGK
DGK
D
8
2500
250
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-1-220C-UNLIM
8
8
2500
100
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Level-1-220C-UNLIM
Level-3-235C-168 HR
Level-3-250C-168 HR
Level-3-250C-168 HR
Level-3-235C-168 HR
Level-3-235C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-1-220C-UNLIM
Level-3-235C-168 HR
OPA363AID
SOIC
D
8
OPA363AIDBVR
OPA363AIDBVT
OPA363AIDR
OPA363ID
SOT-23
SOT-23
SOIC
DBV
DBV
D
6
3000
250
6
8
2500
100
SOIC
D
8
OPA363IDBVR
OPA363IDBVT
OPA363IDR
SOT-23
SOT-23
SOIC
DBV
DBV
D
6
3000
250
6
8
2500
100
OPA364AID
SOIC
D
8
OPA364AIDBVR
OPA364AIDBVT
OPA364AIDR
OPA364ID
SOT-23
SOT-23
SOIC
DBV
DBV
D
5
3000
250
CU NIPDAU Level-3-220C-168 HR
CU NIPDAU Level-3-220C-168 HR
5
8
2500
100
Call TI
Call TI
Level-3-235C-168 HR
Level-3-235C-168 HR
SOIC
D
8
OPA364IDBVR
OPA364IDBVT
OPA364IDR
SOT-23
SOT-23
SOIC
DBV
DBV
D
5
3000
250
CU NIPDAU Level-3-250C-168 HR
CU NIPDAU Level-3-250C-168 HR
5
8
2500
58
Call TI
Level-3-235C-168 HR
OPA4364AID
SOIC
D
14
14
14
14
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-1-220C-UNLIM
CU NIPDAU Level-3-235C-168 HR
CU NIPDAU Level-3-235C-168 HR
OPA4364AIDR
OPA4364AIPWR
OPA4364AIPWT
SOIC
D
2500
2500
250
TSSOP
TSSOP
PW
PW
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2005
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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