MSP430F5632IZCAR [TI]
MSP430F563x Mixed-Signal Microcontrollers;型号: | MSP430F5632IZCAR |
厂家: | TEXAS INSTRUMENTS |
描述: | MSP430F563x Mixed-Signal Microcontrollers 微控制器 |
文件: | 总127页 (文件大小:3489K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
MSP430F563x Mixed-Signal Microcontrollers
– USCI_A0 and USCI_A1 each support:
1 Features
•
Enhanced UART supports automatic baud-
rate detection
•
•
Low supply voltage range: 1.8 V to 3.6 V
Ultra-low power consumption
– Active mode (AM):
•
•
IrDA encoder and decoder
Synchronous SPI
All system clocks active:
270 µA/MHz at 8 MHz, 3.0 V, flash program
execution (typical)
– USCI_B0 and USCI_B1 each support:
•
•
I2C
Synchronous SPI
– Standby mode (LPM3):
•
Full-speed universal serial bus (USB)
– Integrated USB-PHY
– Integrated 3.3-V and 1.8-V USB power system
– Integrated USB-PLL
– Eight input and eight output endpoints
12-bit analog-to-digital converter (ADC) with
internal shared reference, sample-and-hold, and
autoscan feature
Dual 12-bit digital-to-analog converters (DACs)
with synchronization
Watchdog with crystal and supply supervisor
operational, full RAM retention, fast wakeup:
1.8 µA at 2.2 V, 2.1 µA at 3.0 V (typical)
– Shutdown real-time clock (RTC) mode
(LPM3.5):
Shutdown mode, active RTC with crystal:
1.1 µA at 3.0 V (typical)
– Shutdown mode (LPM4.5):
0.3 µA at 3.0 V (typical)
•
•
•
•
Wake up from standby mode in 3 µs (typical)
16-bit RISC architecture, extended memory, up to
20-MHz system clock
•
•
•
Voltage comparator
Hardware multiplier supports 32-bit operations
Serial onboard programming, no external
programming voltage needed
•
Flexible power-management system
– Fully integrated LDO with programmable
regulated core supply voltage
– Supply voltage supervision, monitoring, and
brownout
•
•
•
6-channel internal DMA
RTC module with supply voltage backup switch
Table 6-1 summarizes the available family
members
•
Unified clock system
– FLL control loop for frequency stabilization
– Low-power low-frequency internal clock source
(VLO)
– Low-frequency trimmed internal reference
source (REFO)
2 Applications
•
•
•
•
•
•
Analog and digital sensor systems
Digital motor control
Remote controls
Thermostats
Digital timers
– 32-kHz crystals (XT1)
– High-frequency crystals up to 32 MHz (XT2)
Four 16-bit timers with 3, 5, or 7 capture/compare
registers
Hand-held meters
•
•
Two universal serial communication interfaces
(USCIs)
3 Description
The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different sets of
peripherals targeted for various applications. The architecture, combined with five low-power modes, is
optimized to achieve extended battery life in portable measurement applications. The device features a powerful
16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The
digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in 3 µs
(typical).
The MSP430F563x devices are microcontrollers with a high-performance 12-bit ADC, a comparator, two USCIs,
USB 2.0, a hardware multiplier, DMA, four 16-bit timers, an RTC module with alarm capabilities, and up to 74 I/O
pins.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User's Guide.
Device Information
PART NUMBER(1)
MSP430F5638IPZ
PACKAGE
BODY SIZE(2)
14 mm × 14 mm
7 mm × 7 mm
7 mm × 7 mm
LQFP (100)
MSP430F5638IZCA
nFBGA (113)
MSP430F5638IZQW(3)
MicroStar Junior™ BGA (113)
(1) For the most current device, package, and ordering information, see the Package Option
Addendum in Section 11, or see the TI website at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 11.
(3) All orderable part numbers in the ZQW (MicroStar Junior BGA) package have been changed to a
status of Last Time Buy. Visit the Product life cycle page for details on this status.
Copyright © 2020 Texas Instruments Incorporated
2
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
www.ti.com
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
4 Functional Block Diagrams
Figure 4-1 shows the functional block diagram for the MSP430F5638, MSP430F5637, and MSP430F5636
devices.
PA
PB
PC
PD
XIN XOUT
DVCC DVSS
AVCC AVSS
RST/NMI
P1.x P2.x P3.x P4.x P5.x P6.x P7.x P8.x
P9.x
XT2IN
I/O Ports
P1, P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3, P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5, P6
2×8 I/Os
16KB
RAM
I/O Ports
P7, P8
1×6 I/Os
1×8 I/Os
ACLK
SYS
Power
Management
I/O Ports
P9
1×8 I/Os
Unified
Clock
System
USCI0,
USCI1
USB
256KB
192KB
128KB
XT2OUT
Watchdog
Full-speed
SMCLK
+2KB RAM
USB Buffer
Ax: UART,
IrDA, SPI
P2 Port
Mapping
Controller
LDO,
SVM, SVS,
Brownout
Flash
PE
1×8 I/Os
MCLK
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
Bx: SPI, I2C
+8B Backup
RAM
PD
1×14 I/Os
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
ADC12_A
DMA
TA1 and
TA2
RTC_B
DAC12_A
REF
TA0
TB0
12 bit
6 Channel
200 ksps
JTAG,
SBW
Interface
12 bit
2 channels
voltage out
Comp_B
Reference
1.5 V, 2.0 V,
2.5 V
MPY32
CRC16
2 Timer_A
each with
3 CC
Timer_A
5 CC
Registers
Timer_B
7 CC
Registers
Battery
Backup
System
16 channels
(12 ext, 4 int)
Autoscan
Registers
Port PJ
Figure 4-1. Functional Block Diagram – MSP430F5638, MSP430F5637, MSP430F5636
Figure 4-2 shows the functional block diagram for the MSP430F5635, MSP430F5634, and MSP430F5633
devices.
PA
PB
PC
PD
XIN XOUT
DVCC DVSS
AVCC AVSS
RST/NMI
P1.x P2.x P3.x P4.x P5.x P6.x P7.x P8.x
P9.x
XT2IN
I/O Ports
P1, P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3, P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5, P6
2×8 I/Os
16KB
RAM
I/O Ports
P7, P8
1×6 I/Os
1×8 I/Os
ACLK
Power
Management
SYS
I/O Ports
P9
1×8 I/Os
Unified
Clock
System
USCI0,
USCI1
USB
256KB
192KB
128KB
XT2OUT
Watchdog
Full-speed
SMCLK
+2KB RAM
USB Buffer
Ax: UART,
IrDA, SPI
LDO,
SVM, SVS,
Brownout
P2 Port
Mapping
Controller
Flash
PE
1×8 I/Os
MCLK
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
Bx: SPI, I2C
+8B Backup
RAM
PD
1×14 I/Os
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
ADC12_A
DMA
TA1 and
TA2
RTC_B
REF
TA0
TB0
12 bit
6 Channel
200 ksps
JTAG,
SBW
Interface
Comp_B
Reference
1.5 V, 2.0 V,
2.5 V
MPY32
CRC16
2 Timer_A
each with
3 CC
Timer_A
5 CC
Registers
Timer_B
7 CC
Registers
Battery
Backup
System
16 channels
(12 ext, 4 int)
Autoscan
Registers
Port PJ
Figure 4-2. Functional Block Diagram – MSP430F5635, MSP430F5634, MSP430F5633
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
Figure 4-3 shows the functional block diagram for the MSP430F5632, MSP430F5631, and MSP430F5630
devices.
PA
PB
PC
PD
XIN XOUT
DVCC DVSS
AVCC AVSS
RST/NMI
P1.x P2.x P3.x P4.x P5.x P6.x P7.x P8.x
P9.x
XT2IN
I/O Ports
P1, P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3, P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5, P6
2×8 I/Os
16KB
RAM
I/O Ports
P7, P8
1×6 I/Os
1×8 I/Os
ACLK
Power
Management
SYS
I/O Ports
P9
1×8 I/Os
Unified
Clock
System
USCI0,
USCI1
USB
256KB
192KB
128KB
XT2OUT
Watchdog
Full-speed
SMCLK
+2KB RAM
USB Buffer
Ax: UART,
IrDA, SPI
LDO,
SVM, SVS,
Brownout
P2 Port
Mapping
Controller
Flash
PE
1×8 I/Os
MCLK
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
Bx: SPI, I2C
+8B Backup
RAM
PD
1×14 I/Os
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
DMA
TA1 and
TA2
RTC_B
TA0
TB0
REF
6 Channel
JTAG,
SBW
Interface
Timer_A
5 CC
Registers
2 Timer_A
each with
3 CC
Timer_B
7 CC
Registers
Comp_B
Reference
1.5 V, 2.0 V,
2.5 V
MPY32
CRC16
Battery
Backup
System
Registers
Port PJ
Figure 4-3. Functional Block Diagram – MSP430F5632, MSP430F5631, MSP430F5630
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
www.ti.com
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Functional Block Diagrams............................................ 3
5 Revision History.............................................................. 6
6 Device Comparison.........................................................8
6.1 Related Products........................................................ 8
7 Terminal Configuration and Functions..........................9
7.1 Pin Diagrams.............................................................. 9
7.2 Signal Descriptions................................................... 13
8 Specifications................................................................ 19
8.1 Absolute Maximum Ratings...................................... 19
8.2 ESD Ratings............................................................. 19
8.3 Recommended Operating Conditions.......................19
8.4 Active Mode Supply Current Into VCC Excluding
8.35 12-Bit ADC, Timing Parameters..............................41
8.36 12-Bit ADC, Linearity Parameters Using an
External Reference Voltage.........................................42
8.37 12-Bit ADC, Linearity Parameters Using AVCC
as Reference Voltage..................................................42
8.38 12-Bit ADC, Linearity Parameters Using the
Internal Reference Voltage..........................................42
8.39 12-Bit ADC, Temperature Sensor and Built-In
VMID ............................................................................43
8.40 REF, External Reference........................................ 44
8.41 REF, Built-In Reference.......................................... 45
8.42 12-Bit DAC, Supply Specifications..........................46
8.43 12-Bit DAC, Linearity Specifications....................... 47
8.44 12-Bit DAC, Output Specifications..........................48
8.45 12-Bit DAC, Reference Input Specifications........... 49
8.46 12-Bit DAC, Dynamic Specifications.......................49
8.47 12-Bit DAC, Dynamic Specifications (Continued)...50
8.48 Comparator_B.........................................................51
8.49 Ports PU.0 and PU.1...............................................52
8.50 USB Output Ports DP and DM................................52
8.51 USB Input Ports DP and DM...................................52
8.52 USB-PWR (USB Power System)............................53
8.53 USB-PLL (USB Phase-Locked Loop)..................... 53
8.54 Flash Memory......................................................... 54
8.55 JTAG and Spy-Bi-Wire Interface.............................54
9 Detailed Description......................................................55
9.1 Overview...................................................................55
9.2 CPU.......................................................................... 55
9.3 Instruction Set...........................................................56
9.4 Operating Modes...................................................... 57
9.5 Interrupt Vector Addresses....................................... 58
9.6 Memory.....................................................................59
9.7 Bootloader (BSL)...................................................... 60
9.8 JTAG Operation........................................................ 60
9.9 Flash Memory .......................................................... 61
9.10 RAM .......................................................................62
9.11 Backup RAM........................................................... 62
9.12 Peripherals..............................................................62
9.13 Input/Output Diagrams............................................84
9.14 Device Descriptors................................................105
10 Device and Documentation Support........................106
10.1 Getting Started and Next Steps............................ 106
10.2 Device Nomenclature............................................106
10.3 Tools and Software............................................... 108
10.4 Documentation Support........................................ 110
10.5 Related Links........................................................ 112
10.6 Support Resources............................................... 112
10.7 Trademarks........................................................... 112
10.8 Electrostatic Discharge Caution............................112
10.9 Export Control Notice............................................112
10.10 Glossary..............................................................112
11 Mechanical, Packaging, and Orderable
External Current.......................................................... 21
8.5 Low-Power Mode Supply Currents (Into VCC
)
Excluding External Current..........................................21
8.6 Thermal Resistance Characteristics......................... 22
8.7 Schmitt-Trigger Inputs – General-Purpose I/O..........23
8.8 Inputs – Ports P1, P2, P3, and P4............................ 23
8.9 Leakage Current – General-Purpose I/O..................23
8.10 Outputs – General-Purpose I/O (Full Drive
Strength)......................................................................23
8.11 Outputs – General-Purpose I/O (Reduced Drive
Strength)......................................................................24
8.12 Output Frequency – Ports P1, P2, and P3..............24
8.13 Typical Characteristics – Outputs, Reduced
Drive Strength (PxDS.y = 0)........................................25
8.14 Typical Characteristics – Outputs, Full Drive
Strength (PxDS.y = 1)................................................. 26
8.15 Crystal Oscillator, XT1, Low-Frequency Mode........27
8.16 Crystal Oscillator, XT2............................................ 28
8.17 Internal Very-Low-Power Low-Frequency
Oscillator (VLO)...........................................................29
8.18 Internal Reference, Low-Frequency Oscillator
(REFO)........................................................................29
8.19 DCO Frequency......................................................30
8.20 PMM, Brownout Reset (BOR).................................31
8.21 PMM, Core Voltage.................................................31
8.22 PMM, SVS High Side..............................................32
8.23 PMM, SVM High Side............................................. 32
8.24 PMM, SVS Low Side...............................................33
8.25 PMM, SVM Low Side..............................................33
8.26 Wake-up Times From Low-Power Modes and
Reset...........................................................................33
8.27 Timer_A, Timers TA0, TA1, and TA2.......................34
8.28 Timer_B, Timer TB0................................................34
8.29 Battery Backup........................................................35
8.30 USCI (UART Mode)................................................ 36
8.31 USCI (SPI Master Mode)........................................ 36
8.32 USCI (SPI Slave Mode).......................................... 38
8.33 USCI (I2C Mode).....................................................40
8.34 12-Bit ADC, Power Supply and Input Range
Information.................................................................. 113
Conditions................................................................... 41
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from revision F to revision G
Changes from September 18, 2018 to September 10, 2020
Page
•
•
•
Updated the numbering for sections, tables, figures, and cross-references throughout the document..............1
Added nFBGA package (ZCA) information throughout document......................................................................1
Removed package options that are no longer available in Table 6-1, Device Comparison (MSP430F5637 and
MSP430F5631 in ZQW) .................................................................................................................................... 8
Updated the list of devices available in the 113-Pin ZQW package in the caption of Figure 7-4 .......................9
Changed the MAX value of the IERASE and IMERASE, IBANK parameters in Section 8.54, Flash Memory ......... 54
Corrected the connection of the P7SEL.x signal in Figure 9-11, Port P7 (P7.4 to P7.7) Diagram .................. 98
•
•
•
Changes from revision E to revision F
Changes from December 9, 2015 to September 17, 2018
Page
•
•
•
Added Section 6.1, Related Products ................................................................................................................8
Added typical conditions statements at the beginning of Section 8, Specifications .........................................19
Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 8.20, PMM,
Brownout Reset (BOR) ....................................................................................................................................31
Updated notes (1) and (2) and added note (3) in Section 8.26, Wake-up Times From Low-Power Modes and
Reset ............................................................................................................................................................... 33
Removed ADC12DIV from the formula for the TYP value in the second row of the tCONVERT parameter in
Section 8.35, 12-Bit ADC, Timing Parameters, because ADC12CLK is after division..................................... 41
Removed the note that started "This impedance depends on..." from the "Reference input resistance"
parameter in Section 8.45, 12-Bit DAC, Reference Input Specifications .........................................................49
Added second row for tEN_CMP with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µs in Section
8.48, Comparator_B ........................................................................................................................................ 51
Renamed FCTL4.MGR0 and MGR1 in the fMCLK,MGR parameter in Section 8.54, Flash Memory to be
consistent with header files ..............................................................................................................................54
Replaced former section Development Tools Support with Section 10.3, Tools and Software ..................... 108
•
•
•
•
•
•
Changes from revision D to revision E
Changes from August 6, 2013 to December 8, 2015
Page
•
•
•
•
•
Document format and organization changes throughout, including addition of section numbering....................1
Moved all functional block diagrams to Section 4, Functional Block Diagrams .................................................3
Added USB column to Table 6-1, Family Members ...........................................................................................8
Added Section 6, Device Comparison, and moved Table 6-1 to it......................................................................8
Added "Port U is supplied by the LDOO rail" to the PU.0 and PU.1 descriptions in Section 7.2, Signal
Descriptions .....................................................................................................................................................13
Added Section 8.2, ESD Ratings .....................................................................................................................19
Added note to CVCORE ..................................................................................................................................... 19
Added note to RPull .......................................................................................................................................... 23
Changed TYP value of CL,eff with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF.......................27
In VBAT3 parameter description, changed from "VBAT3 ≠ VBAT/3" to "VBAT3 = VBAT/3"....................................... 35
Changed from fDAC12_0OUT to fDAC12_1OUT in the first row of the Test Conditions for the "Channel-to-channel
crosstalk" parameter.........................................................................................................................................50
Changed the value of DAC12_xDAT from 7F7h to F7Fh and changed the x-axis label from fToggle to 1/fToggle in
Figure 8-22, Crosstalk Test Conditions ............................................................................................................50
•
•
•
•
•
•
•
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
•
•
•
•
•
Added note to RPUR ......................................................................................................................................... 53
Corrected the spelling of the MRG bits in the fMCLK,MRG parameter in Section 8.54, Flash Memory .............. 54
Removed RTC_B from LPM4.5 wake-up options.............................................................................................57
Throughout document, changed all instances of "bootstrap loader" to "bootloader" .......................................60
Added the paragraph that starts "Using the MSP430 RTC_B Module With Battery Backup Supply describes
how..." .............................................................................................................................................................. 64
Corrected names of interrupt events PMMSWBOR (BOR) and PMMSWPOR (POR) in Table 9-11, System
Module Interrupt Vector Registers ................................................................................................................... 65
Corrected spelling of NMIIFG (added missing "I") in Table 9-11, System Module Interrupt Vector Registers ....
65
•
•
•
•
•
•
Corrected register acronyms (added "USB" prefix as required) in Table 9-50, USB Control Registers .......... 72
Added P7SEL.2 and XT2BYPASS inputs with AND and OR gates in Figure 9-10, Port P7 (P7.3) Diagram .. 97
Changed P7SEL.3 column from X to 0 for "P7.3 (I/O)" rows............................................................................97
Added Section 10 and moved Development Tools Support, Device and Development Tool Nomenclature,
Trademarks, and Electrostatic Discharge Caution sections to it.....................................................................106
Added Section 11, Mechanical, Packaging, and Orderable Information ........................................................113
•
The following table lists the changes to this data sheet from the original release through revision D.
REVISION
COMMENTS
Signal Descriptions, Added note regarding pullup resistor to RST/NMI/SBWTDIO pin.
Added Applications, Development Tools Support, and Device and Development Tool Nomenclature
Section 9.12.1, Changed the description of the number of I/Os in each port.
Table 9-19, Added PM5CTL0 register.
SLAS650D
August 2013
Section 8.42, Fixed typo in IDD Test Conditions (changed from DAC12IOG to DAC12OG).
Section 8.51, Corrected VIL and VIH limits.
Section 8.54, Changed IERASE and IMERASE, IBANK limits.
Changed description of ACLK and PUR in Signal Descriptions.
Changed typos to Interrupt Flag names on Timer TA2 rows in Table 9-3.
Changed SYSRSTIV, System Reset offset 1Ch to Reserved in Table 9-11.
Corrected names of SVMLVLRIFG and SVMHVLRIFG bits in Table 9-11.
Corrected right-most column in Table 9-4.
SLAS650C
August 2012
Added note regarding evaluation of PUR in Section 9.7.1.
Changed notes on Section 8.41.
Changed tSENSOR(sample) MIN to 100 µs in Section 8.39.
Changed note (2) in Section 8.39.
Editorial changes throughout.
SLAS650B
August 2011
Production Data release
SLAS650A
July 2010
Updated Product Preview including electrical specifications
Product Preview release
SLAS650
May 2010
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
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6 Device Comparison
Table 6-1 summarizes the available family members.
Table 6-1. Device Comparison
USCI_A:
UART,
IrDA, SPI
FLASH SRAM
(KB)
USCI_B:
SPI, I2C
ADC12_A DAC12_A Comp_B
DEVICE(1) (2)
Timer_A(3) Timer_B(4)
USB
I/O
PACKAGE
(KB)(5)
(Ch)
(Ch)
(Ch)
100 PZ,
113 ZCA,
113 ZQW
MSP430F5638
MSP430F5637
MSP430F5636
256
192
128
16 + 2
16 + 2
16 + 2
5, 3, 3
5, 3, 3
5, 3, 3
7
7
7
2
2
2
2
2
2
12 ext, 4 int
12 ext, 4 int
12 ext, 4 int
2
2
2
12
12
12
Yes
Yes
Yes
74
74
74
100 PZ
100 PZ,
113 ZCA,
113 ZQW
100 PZ,
113 ZCA,
113 ZQW
MSP430F5635
MSP430F5634
MSP430F5633
256
192
128
16 + 2
16 + 2
16 + 2
5, 3, 3
5, 3, 3
5, 3, 3
7
7
7
2
2
2
2
2
2
12 ext, 4 int
12 ext, 4 int
12 ext, 4 int
–
–
–
12
12
12
Yes
Yes
Yes
74
74
74
100 PZ,
113 ZCA,
113 ZQW
100 PZ,
113 ZCA,
113 ZQW
100 PZ,
113 ZCA,
113 ZQW
MSP430F5632
MSP430F5631
MSP430F5630
256
192
128
16 + 2
16 + 2
16 + 2
5, 3, 3
5, 3, 3
5, 3, 3
7
7
7
2
2
2
2
2
2
–
–
–
–
–
–
12
12
12
Yes
Yes
Yes
74
74
74
100 PZ
100 PZ,
113 ZCA,
113 ZQW
(1) For the most current package and ordering information, see the Package Option Addendum in Section 11, or see the TI website at
www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/
packaging.
(3) Each number in the sequence represents an instantiation of Timer_A with its associated number of capture/compare registers and
PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output generators, respectively.
(4) Each number in the sequence represents an instantiation of Timer_B with its associated number of capture/compare registers and
PWM output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output generators, respectively.
(5) The additional 2KB of USB SRAM that is listed can be used as general-purpose SRAM when USB is not in use.
6.1 Related Products
For information about other devices in this family of products or related products, see the following links.
TI 16-bit and 32-bit microcontrollers
High-performance, low-power solutions to enable the autonomous future
Products for MSP430 ultra-low-power sensing & measurement MCUs
One platform. One ecosystem. Endless possibilities.
Companion products for MSP430F5638
Review products that are frequently purchased or used in conjunction with this product.
Reference designs
Find reference designs leveraging the best in TI technology to solve your system-level challenges
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
www.ti.com
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
7 Terminal Configuration and Functions
7.1 Pin Diagrams
Figure 7-1 shows the pinout for the MSP430F5638, MSP430F5637, and MSP430F5636 devices in the 100-pin
PZ package.
P6.4/CB4/A4
P6.5/CB5/A5
1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P9.7
2
P9.6
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
3
P9.5
4
P9.4
5
P9.3
6
P9.2
7
P9.1
8
P9.0
9
P8.7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
AVSS1
MSP430F5638
MSP430F5637
MSP430F5636
XIN
DVSS2
XOUT
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
NOTE: DNC = Do not connect
Figure 7-1. 100-Pin PZ Package (Top View) – MSP430F5638, MSP430F5637, MSP430F5636
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
Figure 7-2 shows the pinout for the MSP430F5635, MSP430F5634, and MSP430F5633 devices in the 100-pin
PZ package.
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14
P7.7/CB11/A15
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P9.7
2
P9.6
3
P9.5
4
P9.4
5
P9.3
6
P9.2
7
P9.1
8
P9.0
9
P8.7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
AVSS1
MSP430F5635
MSP430F5634
MSP430F5633
XIN
DVSS2
XOUT
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
NOTE: DNC = Do not connect
Figure 7-2. 100-Pin PZ Package (Top View) – MSP430F5635, MSP430F5634, MSP430F5633
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
www.ti.com
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Figure 7-3 shows the pinout for the MSP430F5632, MSP430F5631, and MSP430F5630 devices in the 100-pin
PZ package.
P6.4/CB4
P6.5/CB5
1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P9.7
2
P9.6
P6.6/CB6
3
P9.5
P6.7/CB7
4
P9.4
P7.4/CB8
5
P9.3
P7.5/CB9
6
P9.2
P7.6/CB10
P7.7/CB11
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
7
P9.1
8
P9.0
9
P8.7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
P8.6/UCB1SOMI/UCB1SCL
P8.5/UCB1SIMO/UCB1SDA
DVCC2
AVSS1
MSP430F5632
MSP430F5631
MSP430F5630
XIN
DVSS2
XOUT
P8.4/UCB1CLK/UCA1STE
P8.3/UCA1RXD/UCA1SOMI
P8.2/UCA1TXD/UCA1SIMO
P8.1/UCB1STE/UCA1CLK
P8.0/TB0CLK
P4.7/TB0OUTH/SVMOUT
P4.6/TB0.6
AVSS2
P5.6/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
DVCC1
P4.5/TB0.5
P4.4/TB0.4
P4.3/TB0.3
P4.2/TB0.2
P4.1/TB0.1
NOTE: DNC = Do not connect
Figure 7-3. 100-Pin PZ Package (Top View) – MSP430F5632, MSP430F5631, MSP430F5630
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
Figure 7-4 shows the pinout for all devices in the 113-pin ZCA or ZQW package. See Table 7-1 for pin
assignments and descriptions.
A1
B1
C1
D1
E1
F1
G1
H1
J1
A2
B2
C2
D2
E2
F2
G2
H2
J2
A3
B3
C3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
A9
B9
A10
B10
A11
B11
C11
D11
E11
F11
G11
H11
J11
A12
B12
C12
D12
E12
F12
G12
H12
J12
D4
E4
F4
G4
H4
J4
D5
E5
F5
G5
H5
J5
D6
E6
D7
E7
D8
E8
F8
G8
H8
J8
D9
E9
F9
G9
H9
J9
H6
J6
H7
J7
K1
L1
K2
L2
K11
L11
M11
K12
L12
M12
L3
L4
L5
L6
L7
L8
L9
L10
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
NOTE: For terminal assignments, see Table 7-1.
Figure 7-4. 113-Pin ZCA or ZQW Package (Top View) – MSP430F5638, MSP430F5636, MSP430F5635,
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5630
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
7.2 Signal Descriptions
Table 7-1 describes the signals for all device variants and packages.
Table 7-1. Signal Descriptions
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
PZ
ZQW
General-purpose digital I/O
Comparator_B input CB4
P6.4/CB4/A4
P6.5/CB5/A5
1
A1
B2
I/O
I/O
Analog input A4 – ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB5
2
3
Analog input A5 – ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB6
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
B1
C2
I/O
I/O
Analog input A6 – ADC (not available on F5632, F5631, and F5630 devices)
DAC12.0 output (not available on F5635, F5634, F5633, F5632, F5631, and F5630
devices)
General-purpose digital I/O
Comparator_B input CB7
4
Analog input A7 – ADC (not available on F5632, F5631, and F5630 devices)
DAC12.1 output (not available on F5635, F5634, F5633, F5632, F5631, and F5630
devices)
General-purpose digital I/O
Comparator_B input CB8
P7.4/CB8/A12
P7.5/CB9/A13
5
6
C1
C3
I/O
I/O
Analog input A12 –ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB9
Analog input A13 – ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB10
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
7
8
D2
D1
I/O
I/O
Analog input A14 – ADC (not available on F5632, F5631, and F5630 devices)
DAC12.0 output (not available on F5635, F5634, F5633, F5632, F5631, and F5630
devices)
General-purpose digital I/O
Comparator_B input CB11
Analog input A15 – ADC (not available on F5632, F5631, and F5630 devices)
DAC12.1 output (not available on F5635, F5634, F5633, F5632, F5631, and F5630
devices)
General-purpose digital I/O
Output of reference voltage to the ADC
Input for an external reference voltage to the ADC
P5.0/VREF+/VeREF+
P5.1/VREF-/VeREF-
9
D4
E4
I/O
I/O
General-purpose digital I/O
10
Negative terminal for the reference voltage of the ADC for both sources, the
internal reference voltage, or an external applied reference voltage
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MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
Table 7-1. Signal Descriptions (continued)
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
ZQW
PZ
E1,
E2
AVCC1
11
Analog power supply
AVSS1
XIN
12
13
14
15
F2
F1
G1
G2
Analog ground supply
I
Input terminal for crystal oscillator XT1
Output terminal of crystal oscillator XT1
Analog ground supply
XOUT
AVSS2
O
General-purpose digital I/O
Conversion clock output ADC (not available on F5632, F5631, and F5630 devices)
DMA external trigger input
P5.6/ADC12CLK/DMAE0
16
H1
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave transmit enable; USCI_A0 clock input/output
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
17
18
19
20
21
22
23
24
G4
H2
J1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave in/master out; USCI_B0 I2C data
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave out/master in; USCI_B0 I2C clock
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave transmit enable
H4
J2
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in/master out
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART receive data; USCI_A0 slave out/master in
K1
K2
L2
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: no secondary function
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: no secondary function
DVCC1
DVSS1
VCORE(2)
P5.2
25
26
27
28
29
30
31
32
33
L1
M1
M2
L3
Digital power supply
Digital ground supply
Regulated core power supply (internal use only, no external current loading)
I/O General-purpose digital I/O
DVSS
DNC
M3
J4
Digital ground supply
Do not connect. It is strongly recommended to leave this terminal open.
I/O General-purpose digital I/O
P5.3
L4
P5.4
M4
J5
I/O General-purpose digital I/O
P5.5
I/O General-purpose digital I/O
General-purpose digital I/O with port interrupt
Timer TA0 clock signal TACLK input
P1.0/TA0CLK/ACLK
P1.1/TA0.0
34
35
L5
I/O
I/O
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
General-purpose digital I/O with port interrupt
Timer TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
M5
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 7-1. Signal Descriptions (continued)
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
ZQW
PZ
General-purpose digital I/O with port interrupt
Timer TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
P1.2/TA0.1
36
J6
I/O
General-purpose digital I/O with port interrupt
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
37
38
39
40
41
H6
M6
L6
I/O
I/O
I/O
I/O
I/O
Timer TA0 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
Timer TA0 CCR3 capture: CCI3A input compare: Out3 output
General-purpose digital I/O with port interrupt
Timer TA0 CCR4 capture: CCI4A input, compare: Out4 output
General-purpose digital I/O with port interrupt
J7
Timer TA0 CCR1 capture: CCI1B input, compare: Out1 output
General-purpose digital I/O with port interrupt
M7
Timer TA0 CCR2 capture: CCI2B input, compare: Out2 output
General-purpose digital I/O with port interrupt
Timer TA1 clock input
P3.0/TA1CLK/CBOUT
42
L7
I/O
Comparator_B output
General-purpose digital I/O with port interrupt
P3.1/TA1.0
P3.2/TA1.1
P3.3/TA1.2
43
44
45
H7
M8
L8
I/O
I/O
I/O
Timer TA1 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
General-purpose digital I/O with port interrupt
Timer TA2 clock input
P3.4/TA2CLK/SMCLK
46
J8
I/O
SMCLK output
General-purpose digital I/O with port interrupt
P3.5/TA2.0
P3.6/TA2.1
P3.7/TA2.2
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
47
48
49
50
51
52
M9
L9
I/O
I/O
Timer TA2 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
General-purpose digital I/O with port interrupt
M10 I/O
Timer TA2 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
General-purpose digital I/O with port interrupt
J9
I/O
I/O
I/O
Timer TB0 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
General-purpose digital I/O with port interrupt
M11
L10
Timer TB0 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
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Table 7-1. Signal Descriptions (continued)
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
ZQW
PZ
General-purpose digital I/O with port interrupt
P4.3/TB0.3
P4.4/TB0.4
P4.5/TB0.5
P4.6/TB0.6
53
M12 I/O
Timer TB0 capture CCR3: CCI3A/CCI3B input, compare: Out3 output
General-purpose digital I/O with port interrupt
54
55
56
L12
L11
K11
I/O
I/O
I/O
Timer TB0 capture CCR4: CCI4A/CCI4B input, compare: Out4 output
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR5: CCI5A/CCI5B input, compare: Out5 output
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR6: CCI6A/CCI6B input, compare: Out6 output
General-purpose digital I/O with port interrupt
Timer TB0: Switch all PWM outputs high impedance
SVM output
P4.7/TB0OUTH/SVMOUT
57
K12
I/O
General-purpose digital I/O
Timer TB0 clock input
P8.0/TB0CLK
58
59
60
J11
J12
H11
I/O
I/O
I/O
General-purpose digital I/O
P8.1/UCB1STE/UCA1CLK
P8.2/UCA1TXD/UCA1SIMO
USCI_B1 SPI slave transmit enable; USCI_A1 clock input/output
General-purpose digital I/O
USCI_A1 UART transmit data; USCI_A1 SPI slave in/master out
General-purpose digital I/O
P8.3/UCA1RXD/UCA1SOMI
P8.4/UCB1CLK/UCA1STE
61
62
H12
G11
I/O
I/O
USCI_A1 UART receive data; USCI_A1 SPI slave out/master in
General-purpose digital I/O
USCI_B1 clock input/output; USCI_A1 SPI slave transmit enable
DVSS2
DVCC2
63
64
G12
F12
Digital ground supply
Digital power supply
General-purpose digital I/O
P8.5/UCB1SIMO/UCB1SDA
P8.6/UCB1SOMI/UCB1SCL
65
66
F11
G9
I/O
I/O
USCI_B1 SPI slave in/master out; USCI_B1 I2C data
General-purpose digital I/O
USCI_B1 SPI slave out/master in; USCI_B1 I2C clock
P8.7
P9.0
P9.1
P9.2
67
68
69
70
E12
E11
F9
I/O General-purpose digital I/O
I/O General-purpose digital I/O
I/O General-purpose digital I/O
I/O General-purpose digital I/O
D12
P9.3
71
D11
I/O General-purpose digital I/O
P9.4
P9.5
P9.6
P9.7
72
73
74
75
E9
C12
C11
D9
I/O General-purpose digital I/O
I/O General-purpose digital I/O
I/O General-purpose digital I/O
I/O General-purpose digital I/O
B11,
B12
VSSU
76
USB PHY ground supply
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 7-1. Signal Descriptions (continued)
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
ZQW
PZ
General-purpose digital I/O, controlled by USB control register. Port U is supplied
by the LDOO rail.
PU.0/DP
PUR
77
A12
I/O
USB data terminal DP
USB pullup resistor pin (open drain). The voltage level at the PUR pin is used to
I/O invoke the default USB BSL. TI recommends a 1-MΩ resistor to ground. See
Section 9.7.1 for more information.
78
79
B10
A11
General-purpose digital I/O, controlled by USB control register. Port U is supplied
by the LDOO rail.
PU.1/DM
I/O
USB data terminal DM
VBUS
VUSB
V18
80
81
82
83
A10
A9
USB LDO input (connect to USB power source)
USB LDO output
B9
USB regulated power (internal use only, no external current loading)
Analog ground supply
AVSS3
A8
General-purpose digital I/O
P7.2/XT2IN
84
85
B8
B7
I/O
Input terminal for crystal oscillator XT2
General-purpose digital I/O
P7.3/XT2OUT
I/O
Output terminal of crystal oscillator XT2
Capacitor for backup subsystem. Do not load this pin externally. For capacitor
values, see CBAK in Section 8.3.
VBAK
VBAT
86
87
A7
D8
Backup or secondary supply voltage. If backup voltage is not supplied, connect to
DVCC externally.
General-purpose digital I/O
P5.7/RTCCLK
88
D7
I/O
RTCCLK output
DVCC3
DVSS3
89
90
A6
A5
Digital power supply
Digital ground supply
Test mode pin; selects digital I/O on JTAG pins
TEST/SBWTCK
PJ.0/TDO
91
92
93
94
95
B6
B5
A4
E7
D6
I
Spy-Bi-Wire input clock
General-purpose digital I/O
I/O
Test data output port
General-purpose digital I/O
PJ.1/TDI/TCLK
PJ.2/TMS
I/O
Test data input or test clock input
General-purpose digital I/O
I/O
Test mode select
General-purpose digital I/O
PJ.3/TCK
I/O
Test clock
Reset input (active low)(3)
Nonmaskable interrupt input
Spy-Bi-Wire data input/output
RST/NMI/SBWTDIO
P6.0/CB0/A0
96
97
A3
B4
I/O
I/O
General-purpose digital I/O
Comparator_B input CB0
Analog input A0 – ADC (not available on F5632, F5631, and F5630 devices)
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Table 7-1. Signal Descriptions (continued)
TERMINAL
NO.(4)
I/O(1)
DESCRIPTION
NAME
ZCA,
ZQW
PZ
General-purpose digital I/O
Comparator_B input CB1
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
98
B3
A2
D5
I/O
I/O
I/O
Analog input A1 – ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB2
99
Analog input A2 – ADC (not available on F5632, F5631, and F5630 devices)
General-purpose digital I/O
Comparator_B input CB3
100
Analog input A3 – ADC (not available on F5632, F5631, and F5630 devices)
E5,
E6,
E8,
F4,
F5,
F8,
G5,
G8,
H5,
H8,
H9
Reserved
N/A
Reserved. TI recommends connecting to ground (DVSS, AVSS).
(1) I = input, O = output, N/A = not available on this package offering
(2) VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE
.
(3) When this pin is configured as reset, the internal pullup resistor is enabled by default.
(4) See the Package Option Addendum in Section 11 to determine which devices are available in each package.
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8 Specifications
All graphs in this section are for typical conditions, unless otherwise noted.
Typical (TYP) values are specified at VCC = 3.3 V and TA = 25°C, unless otherwise noted.
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
4.1
UNIT
V
Voltage applied at VCC to VSS
–0.3
–0.3
Voltage applied to any pin (excluding VCORE, VBUS, V18)(2)
VCC + 0.3
±2
V
Diode current at any device pin
mA
°C
Maximum junction temperature, TJ
95
(3)
Storage temperature, Tstg
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
8.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD) Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as
±250 V may actually have higher performance.
8.3 Recommended Operating Conditions
MIN
1.8
2.0
2.2
2.4
1.8
2.0
2.2
2.4
2.2
2.4
NOM
MAX UNIT
PMMCOREVx = 0
3.6
Supply voltage during program execution and flash
PMMCOREVx = 0, 1
PMMCOREVx = 0, 1, 2
PMMCOREVx = 0, 1, 2, 3
PMMCOREVx = 0
3.6
V
3.6
VCC
programming (AVCC1 = DVCC1 = DVCC2 = DVCC3 =
(1) (2)
DVCC = VCC
)
3.6
3.6
3.6
PMMCOREVx = 0, 1
PMMCOREVx = 0, 1, 2
PMMCOREVx = 0, 1, 2, 3
PMMCOREVx = 2
Supply voltage during USB operation, USB PLL disabled
(USB_EN = 1, UPLLEN = 0)
3.6
V
3.6
VCC,USB
Supply voltage during USB operation, USB PLL enabled(6)
(USB_EN = 1, UPLLEN = 1)
3.6
3.6
PMMCOREVx = 2, 3
Supply voltage (AVSS1 = AVSS2 = AVSS3 = DVSS1 =
VSS
0
V
DVSS2 = DVSS3 = VSS
)
TA = 0°C to 85°C
TA = –40°C to +85°C
TA = –40°C to +85°C
I version
1.55
1.70
1.20
–40
–40
1
3.6
V
VBAT,RTC
Backup-supply voltage with RTC operational
3.6
VBAT,MEM
TA
Backup-supply voltage with backup memory retained
Operating free-air temperature
3.6
85
85
10
V
°C
°C
nF
TJ
Operating junction temperature
I version
CBAK
Capacitance at pin VBAK
4.7
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8.3 Recommended Operating Conditions (continued)
MIN
NOM
MAX UNIT
CVCORE
CDVCC
CVCORE
Capacitor at VCORE(4)
470
nF
/
Capacitor ratio of DVCC to VCORE
10
0
PMMCOREVx = 0,
1.8 V ≤ VCC ≤ 3.6 V
(default condition)
8.0
PMMCOREVx = 1,
2 V ≤ VCC ≤ 3.6 V
Processor frequency (maximum MCLK frequency)(3) (5)
(see Figure 8-1)
0
0
12.0
MHz
fSYSTEM
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
16.0
20.0
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
fSYSTEM_USB Minimum processor frequency for USB operation
USB_wait Wait state cycles during USB operation
1.5
MHz
16
cycles
(1) TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
(2) The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the threshold parameters in Section 8.22
for the exact values and more details.
(3) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the
specified maximum frequency.
(4) A capacitor tolerance of ±20% or better is required.
(5) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
(6) USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
25
20
3
16
2, 3
2
12
8
1, 2
1, 2, 3
1
0
0, 1
0, 1, 2
0, 1, 2, 3
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
NOTE: The numbers within the fields denote the supported PMMCOREVx settings.
Figure 8-1. Frequency vs Supply Voltage
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8.4 Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted)(1) (2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK
8 MHz 12 MHz
TYP MAX
)
EXECUTION
MEMORY
PARAMETER
VCC
PMMCOREVx
1 MHz
20 MHz
UNIT
TYP
MAX
TYP
MAX
TYP
MAX
0
1
2
3
0
1
2
3
0.32
0.36
0.37
0.39
0.18
0.20
0.22
0.23
0.36
2.1
2.4
2.5
2.7
1.0
1.2
1.3
1.4
2.4
3.6
3.8
4.0
4.0
IAM, Flash
Flash
RAM
3 V
mA
6.6
0.21
1.2
1.7
2.0
2.1
1.9
IAM, RAM
3 V
mA
3.6
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external
load capacitance are chosen to closely match the required 12.5 pF.
(3) Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
8.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
TEMPERATURE (TA)
PARAMETER
VCC
PMMCOREVx
–40°C
TYP MAX
71
25°C
60°C
TYP MAX
81
85°C
UNIT
TYP MAX
TYP MAX
2.2 V
3 V
0
3
0
3
0
1
2
0
1
2
3
0
1
2
3
0
1
2
3
75
83
87
98
85
94
99
108
16
ILPM0,1MHz Low-power mode 0(3) (9)
µA
µA
78
89
2.2 V
3 V
6.3
6.7
7.0
1.8
1.9
2.0
2.1
2.1
2.2
2.2
1.2
1.2
1.3
1.3
1.1
1.1
1.2
1.2
9.9
11
9.0
11
ILPM2
Low-power mode 2(4) (9)
6.6
10
12
18
1.6
2.4
4.7
6.5
6.6
6.7
6.8
7.0
7.1
7.3
5.9
6.0
6.1
6.3
5.8
5.9
6.1
6.2
10.5
2.2 V
1.6
4.8
1.7
4.9
Low-power mode 3,
crystal mode(5) (9)
ILPM3,XT1LF
1.9
2.7
5.0
10.8
µA
µA
1.9
5.1
3 V
2.0
5.2
2.0
2.9
1.9
5.4
12.6
10.3
0.9
4.0
Low-power mode 3,
VLO mode, Watchdog
enabled(6) (9)
0.9
4.1
ILPM3,
3 V
VLO,WDT
1.0
4.2
1.0
2.2
1.8
4.3
11.3
10
0.9
3.9
0.9
4.0
ILPM4
Low-power mode 4(7) (9)
3 V
3 V
µA
µA
1.0
4.1
1.0
2.1
4.2
11
Low-power mode 3.5
(LPM3.5) current with
active RTC into primary
ILPM3.5,
0.5
0.8
1.4
RTC,VCC
(10)
supply pin DVCC
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8.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
TEMPERATURE (TA)
PARAMETER
VCC
PMMCOREVx
–40°C
25°C
60°C
85°C
UNIT
TYP MAX
TYP MAX
TYP MAX
TYP MAX
Low-power mode 3.5
(LPM3.5) current with
active RTC into backup
supply pin VBAT(11)
ILPM3.5,
3 V
0.6
1.1
0.8
1.4
µA
RTC,VBAT
Total low-power mode 3.5
(LPM3.5) current with
active RTC(12)
ILPM3.5,
3 V
3 V
1.0
0.2
1.3
0.7
1.6
0.9
2.8
1.4
µA
µA
RTC,TOT
Low-power mode 4.5
(LPM4.5)(8)
ILPM4.5
0.3
0.6
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance are chosen to closely match the required 9 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low-frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0), fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(4) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2), fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO
setting = 1 MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0).
(5) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(6) Current for watchdog timer clocked by VLO included.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), fACLK = fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(7) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4), fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(8) Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5), fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
(9) Current for brownout included. Low-side supervisor (SVSL) and low-side monitor (SVML) disabled. High-side supervisor (SVSH) and
high-side monitor (SVMH) disabled. RAM retention enabled.
(10) VVBAT = VCC – 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active
(11) VVBAT = VCC – 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no
current drawn on VBAK
(12) fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no current drawn on VBAK
8.6 Thermal Resistance Characteristics
PARAMETER
VALUE
122
108
83
UNIT
LQFP (PZ)
BGA (ZQW)
LQFP (PZ)
BGA (ZQW)
LQFP (PZ)
BGA (ZQW)
RθJA
Junction-to-ambient thermal resistance, still air(1)
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance(2)
Junction-to-board thermal resistance(3)
°C/W
°C/W
72
98
RθJB
76
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board,
as specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
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8.7 Schmitt-Trigger Inputs – General-Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
1.8 V
3 V
MIN
0.80
1.50
0.45
0.75
0.3
TYP
MAX UNIT
1.40
V
2.10
VIT+
VIT–
Vhys
Positive-going input threshold voltage
1.8 V
3 V
1.00
V
1.65
Negative-going input threshold voltage
1.8 V
3 V
0.8
V
1.0
Input voltage hysteresis (VIT+ – VIT–
)
0.4
For pullup: VIN = VSS
For pulldown: VIN = VCC
RPull
CI
Pullup or pulldown resistor(2)
Input capacitance
20
35
5
50
kΩ
pF
VIN = VSS or VCC
(1) Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
(2) Also applies to RST pin when pullup or pulldown resistor is enabled.
8.8 Inputs – Ports P1, P2, P3, and P4
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Port P1, P2, P3, P4: P1.x to P4.x,
External trigger pulse duration to set interrupt flag
t(int)
External interrupt timing(2)
2.2 V, 3 V
20
ns
(1) Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
(2) An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int)
.
8.9 Leakage Current – General-Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
See (1) (2)
VCC
MIN
MAX UNIT
Ilkg(Px.x)
High-impedance leakage current
1.8 V, 3 V
±50 nA
(1) The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
8.10 Outputs – General-Purpose I/O (Full Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA(1)
VCC
MIN
VCC – 0.25
VCC – 0.60
VCC – 0.25
VCC – 0.60
MAX UNIT
VCC
1.8 V
I(OHmax) = –10 mA(2)
I(OHmax) = –5 mA(1)
I(OHmax) = –15 mA(2)
I(OLmax) = 3 mA(1)
I(OLmax) = 10 mA(2)
I(OLmax) = 5 mA(1)
I(OLmax) = 15 mA(2)
VCC
VOH
High-level output voltage
V
VCC
3 V
1.8 V
3 V
VCC
VSS VSS + 0.25
VSS VSS + 0.60
VSS VSS + 0.25
VSS VSS + 0.60
VOL
Low-level output voltage
V
(1) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage
drop specified.
(2) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
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8.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA(1)
VCC
MIN
VCC – 0.25
VCC – 0.60
VCC – 0.25
VCC – 0.60
MAX UNIT
VCC
1.8 V
I(OHmax) = –3 mA(2)
I(OHmax) = –2 mA(1)
I(OHmax) = –6 mA(2)
I(OLmax) = 1 mA(1)
I(OLmax) = 3 mA(2)
I(OLmax) = 2 mA(1)
I(OLmax) = 6 mA(2)
VCC
VOH
High-level output voltage
V
VCC
3 V
1.8 V
3 V
VCC
VSS VSS + 0.25
VSS VSS + 0.60
VSS VSS + 0.25
VSS VSS + 0.60
VOL
Low-level output voltage
V
(1) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage
drop specified.
(2) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
(3) Selecting reduced drive strength may reduce EMI.
8.12 Output Frequency – Ports P1, P2, and P3
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
VCC = 1.8 V,
PMMCOREVx = 0
8
Port output frequency
(with load)
P3.4/TA2CLK/SMCLK/S27,
fPx.y
MHz
20
CL = 20 pF, RL = 1 kΩ(1) or 3.2 kΩ(2) (3)
VCC = 3 V,
PMMCOREVx = 3
VCC = 1.8 V,
PMMCOREVx = 0
P1.0/TA0CLK/ACLK/S39,
P3.4/TA2CLK/SMCLK/S27,
P2.0/P2MAP0 (P2MAP0 = PM_MCLK ),
CL = 20 pF(3)
8
fPort_CLK
Clock output frequency
MHz
20
VCC = 3 V,
PMMCOREVx = 3
(1) Full drive strength of port: A resistive divider with 2 × 0.5 kΩ between VCC and VSS is used as load. The output is connected to the
center tap of the divider.
(2) Reduced drive strength of port: A resistive divider with 2 × 1.6 kΩ between VCC and VSS is used as load. The output is connected to
the center tap of the divider.
(3) The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
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8.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
25.0
20.0
15.0
10.0
5.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VCC = 3.0 V
P3.2
VCC = 1.8 V
P3.2
TA = 25°C
TA = 85°C
TA = 25°C
TA = 85°C
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
2.0
VOL – Low-Level Output Voltage – V
VOL – Low-Level Output Voltage – V
Figure 8-3. Typical Low-Level Output Current vs
Low-Level Output Voltage
Figure 8-2. Typical Low-Level Output Current vs
Low-Level Output Voltage
0.0
0.0
VCC = 3.0 V
P3.2
VCC = 1.8 V
P3.2
−1.0
−5.0
−2.0
−3.0
−4.0
−10.0
−15.0
TA = 85°C
−5.0
TA = 85°C
−6.0
−20.0
TA = 25°C
TA = 25°C
−7.0
−8.0
−25.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
VOH – High-Level Output Voltage – V
Figure 8-4. Typical High-Level Output Current vs
High-Level Output Voltage
Figure 8-5. Typical High-Level Output Current vs
High-Level Output Voltage
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8.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
60.0
24
VCC = 1.8 V
P3.2
VCC = 3.0 V
P3.2
TA = 25°C
TA = 85°C
55.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
TA = 25°C
TA = 85°C
20
16
12
8
4
0.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
2.0
VOL – Low-Level Output Voltage – V
VOL – Low-Level Output Voltage – V
Figure 8-6. Typical Low-Level Output Current vs
Low-Level Output Voltage
Figure 8-7. Typical Low-Level Output Current vs
Low-Level Output Voltage
0.0
0
VCC = 1.8 V
P3.2
VCC = 3.0 V
−5.0
P3.2
−10.0
−15.0
−20.0
−25.0
−30.0
−35.0
−40.0
−4
−8
−12
−45.0
TA = 85°C
−16
TA = 85°C
−50.0
−55.0
TA = 25°C
−60.0
TA = 25°C
−20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
VOH – High-Level Output Voltage – V
Figure 8-8. Typical High-Level Output Current vs
High-Level Output Voltage
Figure 8-9. Typical High-Level Output Current vs
High-Level Output Voltage
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8.15 Crystal Oscillator, XT1, Low-Frequency Mode
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(5)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
0.075
Differential XT1 oscillator crystal fOSC = 32768 Hz, XTS = 0,
ΔIDVCC,LF
current consumption from lowest XT1BYPASS = 0, XT1DRIVEx = 2,
3 V
0.170
µA
drive setting, LF mode
TA = 25°C
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
0.290
XT1 oscillator crystal frequency,
LF mode
fXT1,LF0
XTS = 0, XT1BYPASS = 0
32768
Hz
XT1 oscillator logic-level square-
wave input frequency, LF mode
fXT1,LF,SW
XTS = 0, XT1BYPASS = 1(6) (7)
10 32.768
210
50 kHz
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
Oscillation allowance for
LF crystals(8)
OALF
kΩ
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
XTS = 0, XCAPx = 0(2)
XTS = 0, XCAPx = 1
XTS = 0, XCAPx = 2
XTS = 0, XCAPx = 3
1
5.5
Integrated effective load
capacitance, LF mode(1)
CL,eff
pF
8.5
12.0
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
Duty cycle, LF mode
30%
10
70%
Oscillator fault frequency,
LF mode(4)
fFault,LF
XTS = 0(3)
10000
Hz
ms
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C,
1000
500
CL,eff = 6 pF
tSTART,LF
Start-up time, LF mode
3 V
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C,
CL,eff = 12 pF
(1) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(2) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(3) Measured with logic-level input frequency but also applies to operation with crystals.
(4) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(5) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
•
•
•
•
•
•
Keep the trace between the device and the crystal as short as possible.
Design a good ground plane around the oscillator pins.
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(6) When XT1BYPASS is set, XT1 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
(7) Maximum frequency of operation of the entire device cannot be exceeded.
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(8) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
•
•
•
•
For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
8.16 Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (5)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C
200
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C
260
325
450
XT2 oscillator crystal current
consumption
IDVCC,XT2
3 V
µA
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C
XT2 oscillator crystal frequency,
mode 0
fXT2,HF0
fXT2,HF1
fXT2,HF2
fXT2,HF3
fXT2,HF,SW
XT2DRIVEx = 0, XT2BYPASS = 0(7)
XT2DRIVEx = 1, XT2BYPASS = 0(7)
XT2DRIVEx = 2, XT2BYPASS = 0(7)
XT2DRIVEx = 3, XT2BYPASS = 0(7)
XT2BYPASS = 1(6) (7)
4
8
8
MHz
XT2 oscillator crystal frequency,
mode 1
16 MHz
24 MHz
32 MHz
32 MHz
XT2 oscillator crystal frequency,
mode 2
16
24
0.7
XT2 oscillator crystal frequency,
mode 3
XT2 oscillator logic-level square-
wave input frequency
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
320
200
200
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
Oscillation allowance for
HF crystals(8)
OAHF
Ω
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
fOSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
0.5
0.3
tSTART,HF
Start-up time
3 V
ms
pF
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C, CL,eff = 15 pF
Integrated effective load
CL,eff
1
capacitance, HF mode(1) (2)
Duty cycle
Measured at ACLK, fXT2,HF2 = 20 MHz
XT2BYPASS = 1(3)
40%
30
50%
60%
300 kHz
fFault,HF
Oscillator fault frequency(4)
(1) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(2) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(3) Measured with logic-level input frequency but also applies to operation with crystals.
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(4) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
(5) To improve EMI on the XT2 oscillator the following guidelines should be observed.
•
•
•
•
•
•
Keep the traces between the device and the crystal as short as possible.
Design a good ground plane around the oscillator pins.
Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(6) When XT2BYPASS is set, the XT2 circuit is automatically powered down.
(7) Maximum frequency of operation of the entire device cannot be exceeded.
(8) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
8.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VLO frequency
VLO frequency temperature drift
TEST CONDITIONS
VCC
MIN
TYP
9.4
0.5
4
MAX UNIT
14 kHz
%/°C
fVLO
Measured at ACLK
1.8 V to 3.6 V
1.8 V to 3.6 V
1.8 V to 3.6 V
1.8 V to 3.6 V
6
dfVLO/dT
Measured at ACLK(1)
Measured at ACLK(2)
Measured at ACLK
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
%/V
40%
50%
60%
(1) Calculated using the box method: (MAX(–40°C to +85°C) – MIN(–40°C to +85°C)) / MIN(–40°C to +85°C) / (85°C – (–40°C))
(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
8.18 Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
REFO oscillator current
consumption
IREFO
TA = 25°C
1.8 V to 3.6 V
3
µA
REFO frequency calibrated
Measured at ACLK
Full temperature range
TA = 25°C
1.8 V to 3.6 V
1.8 V to 3.6 V
3 V
32768
Hz
±3.5%
fREFO
REFO absolute tolerance
calibrated
±1.5%
dfREFO/dT
REFO frequency temperature drift Measured at ACLK(1)
1.8 V to 3.6 V
0.01
1.0
%/°C
REFO frequency supply voltage
Measured at ACLK(2)
drift
dfREFO/dVCC
1.8 V to 3.6 V
%/V
Duty cycle
Measured at ACLK
40%/60% duty cycle
1.8 V to 3.6 V
1.8 V to 3.6 V
40%
50%
25
60%
µs
tSTART
REFO start-up time
(1) Calculated using the box method: (MAX(–40°C to +85°C) – MIN(–40°C to +85°C)) / MIN(–40°C to +85°C) / (85°C – (–40°C))
(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
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8.19 DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
DCORSELx = 0, DCOx = 0, MODx = 0
DCORSELx = 0, DCOx = 31, MODx = 0
DCORSELx = 1, DCOx = 0, MODx = 0
DCORSELx = 1, DCOx = 31, MODx = 0
DCORSELx = 2, DCOx = 0, MODx = 0
DCORSELx = 2, DCOx = 31, MODx = 0
DCORSELx = 3, DCOx = 0, MODx = 0
DCORSELx = 3, DCOx = 31, MODx = 0
DCORSELx = 4, DCOx = 0, MODx = 0
DCORSELx = 4, DCOx = 31, MODx = 0
DCORSELx = 5, DCOx = 0, MODx = 0
DCORSELx = 5, DCOx = 31, MODx = 0
DCORSELx = 6, DCOx = 0, MODx = 0
DCORSELx = 6, DCOx = 31, MODx = 0
DCORSELx = 7, DCOx = 0, MODx = 0
DCORSELx = 7, DCOx = 31, MODx = 0
MIN
0.07
0.70
0.15
1.47
0.32
3.17
0.64
6.07
1.3
TYP
MAX UNIT
0.20 MHz
1.70 MHz
0.36 MHz
3.45 MHz
0.75 MHz
7.38 MHz
1.51 MHz
14.0 MHz
3.2 MHz
fDCO(0,0)
fDCO(0,31)
fDCO(1,0)
fDCO(1,31)
fDCO(2,0)
fDCO(2,31)
fDCO(3,0)
fDCO(3,31)
fDCO(4,0)
fDCO(4,31)
fDCO(5,0)
fDCO(5,31)
fDCO(6,0)
fDCO(6,31)
fDCO(7,0)
fDCO(7,31)
DCO frequency (0, 0)
DCO frequency (0, 31)
DCO frequency (1, 0)
DCO frequency (1, 31)
DCO frequency (2, 0)
DCO frequency (2, 31)
DCO frequency (3, 0)
DCO frequency (3, 31)
DCO frequency (4, 0)
DCO frequency (4, 31)
DCO frequency (5, 0)
DCO frequency (5, 31)
DCO frequency (6, 0)
DCO frequency (6, 31)
DCO frequency (7, 0)
DCO frequency (7, 31)
12.3
2.5
28.2 MHz
6.0 MHz
23.7
4.6
54.1 MHz
10.7 MHz
88.0 MHz
19.6 MHz
135 MHz
39.0
8.5
60
Frequency step between range
DCORSEL and DCORSEL + 1
SDCORSEL
SDCO
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3 ratio
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
Measured at SMCLK
1.02
40%
1.12 ratio
Duty cycle
50%
0.1
60%
%/°C
%/V
dfDCO/dT
DCO frequency temperature drift fDCO = 1 MHz
dfDCO/dVCC
DCO frequency voltage drift
fDCO = 1 MHz
1.9
100
VCC = 3.0 V
TA = 25°C
10
DCOx = 31
1
DCOx = 0
0.1
0
1
2
3
4
5
6
7
DCORSEL
Figure 8-10. Typical DCO Frequency
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8.20 PMM, Brownout Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
| dDVCC/dt | < 3 V/s
| dDVCC/dt | < 3 V/s
MIN
TYP
MAX UNIT
BORH on voltage,
DVCC falling level
V(DVCC_BOR_IT–)
1.45
1.50
V
V
BORH off voltage,
DVCC rising level
V(DVCC_BOR_IT+)
V(DVCC_BOR_hys)
tRESET
0.80
50
2
1.30
BORH hysteresis
250 mV
µs
Pulse duration required at RST/NMI pin to accept
a reset
8.21 PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Core voltage, active mode,
PMMCOREV = 3
VCORE3(AM)
VCORE2(AM)
VCORE1(AM)
VCORE0(AM)
VCORE3(LPM)
VCORE2(LPM)
VCORE1(LPM)
VCORE0(LPM)
2.4 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
1.90
V
Core voltage, active mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 17 mA
1.8 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 13 mA
2.4 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
2.2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
1.8 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
1.80
1.60
1.40
1.94
1.84
1.64
1.44
V
V
V
V
V
V
V
Core voltage, active mode,
PMMCOREV = 1
Core voltage, active mode,
PMMCOREV = 0
Core voltage, low-current
mode, PMMCOREV = 3
Core voltage, low-current
mode, PMMCOREV = 2
Core voltage, low-current
mode, PMMCOREV = 1
Core voltage, low-current
mode, PMMCOREV = 0
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8.22 PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SVSHE = 0, DVCC = 3.6 V
0
nA
I(SVSH)
SVS current consumption
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
SVSHE = 1, SVSHRVL = 0
200
2.0
µA
1.59
1.79
1.98
2.10
1.62
1.88
2.07
2.20
2.32
2.56
2.85
2.85
1.64
1.84
2.04
2.16
1.74
1.94
2.14
2.26
2.40
2.70
3.00
3.00
2.5
1.69
SVSHE = 1, SVSHRVL = 1
1.91
V
V(SVSH_IT–)
SVSH on voltage level(1)
SVSHE = 1, SVSHRVL = 2
2.11
SVSHE = 1, SVSHRVL = 3
2.23
1.81
2.01
2.21
SVSHE = 1, SVSMHRRL = 0
SVSHE = 1, SVSMHRRL = 1
SVSHE = 1, SVSMHRRL = 2
SVSHE = 1, SVSMHRRL = 3
2.33
V
V(SVSH_IT+)
SVSH off voltage level(1)
SVSHE = 1, SVSMHRRL = 4
2.48
SVSHE = 1, SVSMHRRL = 5
2.84
3.15
3.15
SVSHE = 1, SVSMHRRL = 6
SVSHE = 1, SVSMHRRL = 7
SVSHE = 1, dVDVCC/dt = 10 mV/µs, SVSHFP = 1
SVSHE = 1, dVDVCC/dt = 1 mV/µs, SVSHFP = 0
SVSHE = 0→1, SVSHFP = 1
SVSHE = 0→1, SVSHFP = 0
tpd(SVSH)
SVSH propagation delay
µs
µs
20
12.5
100
t(SVSH)
SVSH on or off delay time
DVCC rise time
dVDVCC/dt
0
1000
V/s
(1) The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430F5xx and MSP430F6xx Family User's Guide on recommended settings and usage.
8.23 PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SVMHE = 0, DVCC = 3.6 V
0
nA
I(SVMH)
SVMH current consumption
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
SVMHE = 1, SVSMHRRL = 0
200
2.0
µA
1.86
1.65
1.85
2.02
2.18
2.32
2.56
2.85
2.85
1.74
1.94
2.14
2.26
2.40
2.70
3.00
3.00
3.75
2.5
SVMHE = 1, SVSMHRRL = 1
2.02
SVMHE = 1, SVSMHRRL = 2
2.22
SVMHE = 1, SVSMHRRL = 3
2.35
V(SVMH)
SVMH on or off voltage level(1)
SVMHE = 1, SVSMHRRL = 4
2.48
2.84
3.15
3.15
V
SVMHE = 1, SVSMHRRL = 5
SVMHE = 1, SVSMHRRL = 6
SVMHE = 1, SVSMHRRL = 7
SVMHE = 1, SVMHOVPE = 1
SVMHE = 1, dVDVCC/dt = 10 mV/µs, SVMHFP = 1
SVMHE = 1, dVDVCC/dt = 1 mV/µs, SVMHFP = 0
SVMHE = 0→1, SVSMFP = 1
tpd(SVMH)
SVMH propagation delay
SVMH on or off delay time
µs
µs
20
12.5
100
t(SVMH)
SVMHE = 0→1, SVMHFP = 0
(1) The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430F5xx and MSP430F6xx Family User's Guide on recommended settings and usage.
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8.24 PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SVSLE = 0, PMMCOREV = 2
0
nA
µA
µs
I(SVSL)
SVSL current consumption
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
SVSLE = 1, dVCORE/dt = 10 mV/µs, SVSLFP = 1
SVSLE = 1, dVCORE/dt = 1 mV/µs, SVSLFP = 0
SVSLE = 0→1, SVSLFP = 1
200
2.0
2.5
20
tpd(SVSL)
SVSL propagation delay
SVSL on or off delay time
12.5
100
t(SVSL)
µs
SVSLE = 0→1, SVSLFP = 0
8.25 PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SVMLE = 0, PMMCOREV = 2
0
nA
µA
µs
I(SVML)
SVML current consumption
SVMLE = 1, PMMCOREV = 2, SVMLFP = 0
SVMLE = 1, PMMCOREV = 2, SVMLFP = 1
SVMLE = 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
SVMLE = 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
SVMLE = 0→1, SVMLFP = 1
200
2.0
2.5
20
tpd(SVML) SVML propagation delay
12.5
100
t(SVML)
SVML on or off delay time
µs
SVMLE = 0→1, SVMLFP = 0
8.26 Wake-up Times From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
fMCLK ≥ 4 MHz
3
6.5
Wake-up time from LPM2,
LPM3, or LPM4 to active
mode(1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
tWAKE-UP-FAST
µs
1 MHz < fMCLK
4 MHz
<
4
8.0
Wake-up time from LPM2,
LPM3, or LPM4 to active
mode(2) (3)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 0
tWAKE-UP-SLOW
150
165
µs
Wake-up time from LPM3.5 or
LPM4.5 to active mode(4)
tWAKE-UP-LPM5
tWAKE-UP-RESET
2
2
3
3
ms
ms
Wake-up time from RST or
BOR event to active mode(4)
(1) This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the
performance mode of the low-side supervisor (SVSL) and low-side monitor (SVML). tWAKE-UP-FAST is possible with SVSL and SVML in
full performance mode or disabled. For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode
Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430F5xx and MSP430F6xx
Family User's Guide.
(2) This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the
performance mode of the low-side supervisor (SVSL) and low-side monitor (SVML). tWAKE-UP-SLOW is set with SVSL and SVML in
normal mode (low current mode). For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode
Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430F5xx and MSP430F6xx
Family User's Guide.
(3) The wake-up times from LPM0 and LPM1 to AM are not specified. They are proportional to MCLK cycle time but are not affected by
the performance mode settings as for LPM2, LPM3, and LPM4.
(4) This value represents the time from the wake-up event to the reset vector execution.
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8.27 Timer_A, Timers TA0, TA1, and TA2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Internal: SMCLK or ACLK,
External: TACLK,
fTA
Timer_A input clock frequency
1.8 V, 3 V
20 MHz
Duty cycle = 50% ±10%
All capture inputs, Minimum pulse
duration required for capture
tTA,cap
Timer_A capture timing
1.8 V, 3 V
20
ns
8.28 Timer_B, Timer TB0
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Internal: SMCLK or ACLK,
External: TBCLK,
fTB
Timer_B input clock frequency
1.8 V, 3 V
20 MHz
Duty cycle = 50% ±10%
All capture inputs, Minimum pulse
duration required for capture
tTB,cap
Timer_B capture timing
1.8 V, 3 V
20
ns
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8.29 Battery Backup
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
0.43
MAX UNIT
TA = –40°C
VBAT = 1.7 V,
DVCC not connected,
RTC running
TA = 25°C
TA = 60°C
TA = 85°C
TA = –40°C
TA = 25°C
TA = 60°C
TA = 85°C
TA = –40°C
TA = 25°C
TA = 60°C
TA = 85°C
General
0.52
0.58
0.64
0.50
VBAT = 2.2 V,
DVCC not connected,
RTC running
0.59
Current into VBAT terminal if no
primary battery is connected
IVBAT
µA
0.64
0.71
0.68
VBAT = 3 V,
DVCC not connected,
RTC running
0.75
0.79
0.86
VSVSH_IT-
SVSHRL = 0
SVSHRL = 1
SVSHRL = 2
SVSHRL = 3
1.59
1.79
1.98
2.10
1.69
VSWITCH
Switch-over level (VCC to VBAT) CVCC = 4.7 µF
1.91
2.11
2.23
V
ON-resistance of switch between
VBAT = 1.8 V
RON_VBAT
0 V
0.35
1
kΩ
V
VBAT and VBAK
1.8 V
3 V
0.6
1.0
1.2
±5%
±5%
±5%
VBAT to ADC input channel 12:
VBAT divided, VBAT3 = VBAT/3
VBAT3
3.6 V
tSample,
VBAT to ADC: Sampling time
required if VBAT3 selected
ADC12ON = 1,
Error of conversion result ≤ 1 LSB
1000
2.65
ns
V
VBAT3
VCHVx
Charger end voltage
CHVx = 2
CHCx = 1
CHCx = 2
CHCx = 3
2.7
2.9
5
RCHARGE
Charge limiting resistor
10
20
kΩ
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8.30 USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Internal: SMCLK or ACLK,
External: UCLK,
fUSCI
USCI input clock frequency
fSYSTEM MHz
Duty cycle = 50% ±10%
BITCLK clock frequency
(equals baud rate in MBaud)
fBITCLK
1
MHz
ns
2.2 V
3 V
50
50
600
600
tτ
UART receive deglitch time(1)
(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
8.31 USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
(see Figure 8-11 and Figure 8-12)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
SMCLK or ACLK,
fUSCI
USCI input clock frequency
fSYSTEM MHz
Duty cycle = 50% ±10%
PMMCOREV = 0
1.8 V
3 V
55
38
30
25
0
tSU,MI
SOMI input data setup time
SOMI input data hold time
ns
2.4 V
3 V
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
1.8 V
3 V
0
tHD,MI
ns
2.4 V
3 V
0
0
1.8 V
3 V
20
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 0
18
ns
16
tVALID,MO SIMO output data valid time(2)
2.4 V
3 V
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 3
15
1.8 V
3 V
–10
–8
CL = 20 pF, PMMCOREV = 0
CL = 20 pF, PMMCOREV = 3
tHD,MO
SIMO output data hold time(3)
ns
2.4 V
3 V
–10
–8
(1) fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)
)
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
(2) Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 8-11 and Figure 8-12.
(3) Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure
8-11 and Figure 8-12.
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1/fUCxCLK
CKPL = 0
CKPL = 1
UCLK
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
SIMO
tHD,MO
tVALID,MO
Figure 8-11. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
CKPL = 1
UCLK
tLO/HI
tLO/HI
tHD,MI
tSU,MI
SOMI
SIMO
tHD,MO
tVALID,MO
Figure 8-12. SPI Master Mode, CKPH = 1
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8.32 USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
(see Figure 8-13 and Figure 8-14)
PARAMETER
TEST CONDITIONS
VCC
1.8 V
3 V
MIN
11
8
MAX UNIT
PMMCOREV = 0
tSTE,LEAD STE lead time, STE low to clock
ns
2.4 V
3 V
7
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
PMMCOREV = 0
PMMCOREV = 3
6
1.8 V
3 V
3
3
tSTE,LAG
tSTE,ACC
tSTE,DIS
tSU,SI
STE lag time, Last clock to STE high
STE access time, STE low to SOMI data out
STE disable time, STE high to SOMI high impedance
SIMO input data setup time
ns
2.4 V
3 V
3
3
1.8 V
3 V
66
50
ns
36
2.4 V
3 V
30
30
1.8 V
3 V
23
ns
16
2.4 V
3 V
13
1.8 V
3 V
5
5
2
2
5
5
5
5
ns
2.4 V
3 V
1.8 V
3 V
tHD,SI
SIMO input data hold time
ns
2.4 V
3 V
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
76
60
3 V
2.4 V
3 V
tVALID,SO
SOMI output data valid time(2)
SOMI output data hold time(3)
ns
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 3
44
40
1.8 V
3 V
18
12
10
8
CL = 20 pF,
PMMCOREV = 0
tHD,SO
ns
2.4 V
3 V
CL = 20 pF,
PMMCOREV = 3
(1) fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)
)
For the master parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached master.
(2) Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 8-13 and Figure 8-14.
(3) Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure
8-13 and Figure 8-14.
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
CKPL = 1
UCLK
tSU,SI
tLO/HI
tLO/HI
tHD,SI
SIMO
SOMI
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
Figure 8-13. SPI Slave Mode, CKPH = 0
tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
CKPL = 1
UCLK
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
SOMI
tHD,MO
tVALID,SO
tSTE,ACC
tSTE,DIS
Figure 8-14. SPI Slave Mode, CKPH = 1
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8.33 USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see
Figure 8-15)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Internal: SMCLK or ACLK,
External: UCLK
fUSCI
USCI input clock frequency
fSYSTEM MHz
Duty cycle = 50% ±10%
fSCL
SCL clock frequency
2.2 V, 3 V
2.2 V, 3 V
0
4.0
0.6
4.7
0.6
0
400 kHz
µs
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
2.2 V, 3 V
µs
tHD,DAT
tSU,DAT
Data hold time
Data setup time
2.2 V, 3 V
2.2 V, 3 V
ns
ns
250
4.0
0.6
50
fSCL ≤ 100 kHz
fSCL > 100 kHz
tSU,STO
Setup time for STOP
2.2 V, 3 V
µs
2.2 V
3 V
600
ns
600
Pulse duration of spikes suppressed by
input filter
tSP
50
tHD,STA
tSU,STA
tHD,STA
tBUF
SDA
SCL
tLOW
tHIGH
tSP
tSU,DAT
tSU,STO
tHD,DAT
Figure 8-15. I2C Mode Timing
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8.34 12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2)
PARAMETER
TEST CONDITIONS
VCC
MIN
2.2
0
TYP
MAX UNIT
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
AVCC
Analog supply voltage
3.6
V
V(Ax)
Analog input voltage range(3) All ADC12 analog input pins Ax
AVCC
200
V
2.2 V
3 V
150
150
Operating supply current into
fADC12CLK = 5 MHz(1)
AVCC terminal(4)
IADC12_A
µA
250
Only one terminal Ax can be selected at one
time
CI
RI
Input capacitance
2.2 V
20
25
pF
Ω
Input MUX ON resistance
0 V ≤ VIN ≤ V(AVCC)
10
200
1900
(1) ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0
(2) The leakage current is specified by the digital I/O input leakage.
(3) The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal voltage is used and REFOUT = 1, then decoupling capacitors are
required. See Section 8.40 and Section 8.41.
(4) The internal reference supply current is not included in current consumption parameter IADC12
.
8.35 12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
For specified performance of ADC12 linearity
parameters using an external reference
voltage or AVCC as reference(1)
0.45
4.8
5.0
fADC12CLK
ADC conversion clock
For specified performance of ADC12 linearity 2.2 V, 3 V
parameters using the internal reference(2)
MHz
4.0
0.45
0.45
4.2
2.4
2.4
4.8
For specified performance of ADC12 linearity
parameters using the internal reference(3)
2.7
Internal ADC12
oscillator(5)
fADC12OSC
tCONVERT
tSample
ADC12DIV = 0, fADC12CLK = fADC12OSC
2.2 V, 3 V
2.2 V, 3 V
5.4 MHz
REFON = 0, Internal oscillator,
ADC12OSC used for ADC conversion clock
2.4
3.1
µs
Conversion time
Sampling time
External fADC12CLK from ACLK, MCLK or
SMCLK, ADC12SSEL ≠ 0
13 ×
1 / fADC12CLK
RS = 400 Ω, RI = 200 Ω, CI = 20 pF,
τ = (RS + RI) × CI
2.2 V, 3 V
1000
ns
(4)
(1) REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0,
SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the
specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5 MHz.
(2) SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1
(3) SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when
using the ADC12OSC divided by 2.
(4) Approximately 10 Tau (τ) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
(5) The ADC12OSC is sourced directly from MODOSC inside the UCS.
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8.36 12-Bit ADC, Linearity Parameters Using an External Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Integral linearity error(2)
Differential linearity error(2)
Offset error(3)
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
1.4 V ≤ dVREF ≤ 1.6 V(1)
±2
LSB
±1.7
EI
2.2 V, 3 V
1.6 V < dVREF (1)
See (1)
ED
EO
EG
ET
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
±1
±5.6
±3.5
±2.5
±7.1
±5
LSB
LSB
LSB
LSB
dVREF ≤ 2.2 V(1)
dVREF > 2.2 V(1)
See (1)
±3
±1.5
±1
Gain error(3)
dVREF ≤ 2.2 V(1)
dVREF > 2.2 V(1)
±3.5
±2
Total unadjusted error
(1) The external reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 0. dVREF = VR+ - VR-. VR+ < AVCC. VR- > AVSS.
Unless otherwise mentioned, dVREF > 1.5 V. Impedance of the external reference voltage R < 100 Ω, and two decoupling capacitors,
10 µF and 100 nF, should be connected to VREF+/VREF- to decouple the dynamic current. See also the MSP430F5xx and
MSP430F6xx Family User's Guide.
(2) Parameters are derived using the histogram method.
(3) Parameters are derived using a best fit curve.
8.37 12-Bit ADC, Linearity Parameters Using AVCC as Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
EI
Integral linearity error(2)
See (1)
See (1)
See (1)
See (1)
See (1)
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
±1.7
±1
LSB
LSB
LSB
LSB
LSB
ED
EO
EG
ET
Differential linearity error(2)
Offset error(3)
±1
±2
±2
±2
Gain error(3)
±4
Total unadjusted error
±5
(1) AVCC as reference voltage is selected by: SREF2 = 0, SREF1 = 0, SREF0 = 0.
(2) Parameters are derived using the histogram method.
(3) Parameters are derived using a best fit curve.
8.38 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
VCC
MIN
TYP
MAX UNIT
ADC12SR = 0, REFOUT = 1
fADC12CLK ≤ 4.0 MHz
fADC12CLK ≤ 2.7 MHz
fADC12CLK ≤ 4.0 MHz
fADC12CLK ≤ 2.7 MHz
fADC12CLK ≤ 2.7 MHz
fADC12CLK ≤ 4.0 MHz
fADC12CLK ≤ 2.7 MHz
fADC12CLK ≤ 4.0 MHz
fADC12CLK ≤ 2.7 MHz
fADC12CLK ≤ 4.0 MHz
fADC12CLK ≤ 2.7 MHz
±1.7
LSB
±2.5
EI
Integral linearity error(2)
2.2 V, 3 V
ADC12SR = 0, REFOUT = 0
ADC12SR = 0, REFOUT = 1
ADC12SR = 0, REFOUT = 1
ADC12SR = 0, REFOUT = 0
ADC12SR = 0, REFOUT = 1
ADC12SR = 0, REFOUT = 0
ADC12SR = 0, REFOUT = 1
ADC12SR = 0, REFOUT = 0
ADC12SR = 0, REFOUT = 1
ADC12SR = 0, REFOUT = 0
–1
–1
+1.5
Differential
ED
2.2 V, 3 V
±1
+2.5
±4
LSB
linearity error(2)
±2
±2
±1
EO
EG
ET
Offset error(3)
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
LSB
LSB
±4
±2.5
Gain error(3)
±1%(4) VREF
±5 LSB
±1%(4) VREF
±2
Total unadjusted error
(1) The external reference voltage is selected by: SREF2 = 0, SREF1 = 0, SREF0 = 1. dVREF = VR+ - VR-
.
(2) Parameters are derived using the histogram method.
(3) Parameters are derived using a best fit curve.
(4) The gain error and the total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In
this mode the reference voltage used by the ADC12_A is not available on a pin.
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8.39 12-Bit ADC, Temperature Sensor and Built-In VMID
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
2.2 V
3 V
MIN
TYP
MAX UNIT
Temperature sensor voltage(2)
(see )Figure 8-16
ADC12ON = 1, INCH = 0Ah,
TA = 0°C
680
VSENSOR
mV
680
2.2 V
3 V
2.25
2.25
Temperature coefficient of
sensor(2)
TCSENSOR
ADC12ON = 1, INCH = 0Ah
mV/°C
µs
2.2 V
3 V
100
100
Sample time required if
channel 10 is selected(3)
ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
tSENSOR(sample)
2.2 V
3 V
1.06
1.46
1.1
1.5
1.14
V
1.54
ADC12ON = 1, INCH = 0Bh,
VMID ≈ 0.5 × VAVCC
VMID
AVCC divider at channel 11
Sample time required if
channel 11 is selected(4)
ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
tVMID(sample)
2.2 V, 3 V
1000
ns
(1) The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of
the temperature sensor.
(2) The temperature sensor offset can be significant. TI recommends a single-point calibration to minimize the offset error of the built-in
temperature sensor. The TLV structure contains calibration values for 30°C ±3°C and 85°C ±3°C for each of the available reference
voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature,°C) + VSENSOR, where TCSENSOR and
VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430F5xx and MSP430F6xx Family User's
Guide.
(3) The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on)
(4) The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
.
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10
0 10 20 30 40 50 60 70 80
Ambient Temperature (°C)
Figure 8-16. Typical Temperature Sensor Voltage
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8.40 REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX UNIT
Positive external reference
voltage input
(2)
VeREF+
VeREF+ > VREF-/VeREF-
1.4
AVCC
1.2
V
V
V
Negative external
reference voltage input
(3)
(4)
VREF-/VeREF-
VeREF+ > VREF-/VeREF-
VeREF+ > VREF-/VeREF-
0
VeREF+
VREF-/VeREF-
–
Differential external
reference voltage input
1.4
AVCC
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF- = 0 V,
fADC12CLK = 5 MHz, ADC12SHTx = 1h,
Conversion rate 200 ksps
2.2 V, 3 V
2.2 V, 3 V
–26
26
IVeREF+, IVREF-/
Static input current
µA
VeREF-
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF- = 0 V,
fADC12CLK = 5 MHz, ADC12SHTx = 8h,
Conversion rate 20 ksps
–1.2
10
+1.2
Capacitance at VREF+ or
VREF- terminal(5)
CVREF+/-
µF
(1) The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is
also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to let the charge settle for 12-bit accuracy.
(2) The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
(3) The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
(4) The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
(5) Connect two decoupling capacitors, 10 µF and 100 nF, to VREF to decouple the dynamic current required for an external reference
source if it is used for the ADC12_A. Also see the MSP430F5xx and MSP430F6xx Family User's Guide.
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8.41 REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
REFVSEL = {2} for 2.5 V,
3 V
2.5
±1%
REFON = REFOUT = 1 , IVREF+ = 0 A
REFVSEL = {1} for 2 V,
Positive built-in
VREF+
3 V
2.0
1.5
±1%
±1%
V
reference voltage output REFON = REFOUT = 1, IVREF+ = 0 A
REFVSEL = {0} for 1.5 V,
REFON = REFOUT = 1, IVREF+ = 0 A
2.2 V, 3 V
REFVSEL = {0} for 1.5 V
AVCC minimum voltage,
2.2
2.3
2.8
AVCC(min)
Positive built-in
reference active
REFVSEL = {1} for 2 V
V
REFVSEL = {2} for 2.5 V
ADC12SR = 1(8), REFON = 1, REFOUT = 0,
REFBURST = 0
70
0.45
210
100
µA
ADC12SR = 1(8), REFON = 1, REFOUT = 1,
REFBURST = 0
0.75 mA
310 µA
Operating supply current
into AVCC terminal (2) (7)
IREF+
3 V
ADC12SR = 0(8), REFON = 1, REFOUT = 0,
REFBURST = 0
ADC12SR = 0(8), REFON = 1, REFOUT = 1,
REFBURST = 0
0.95
1.7 mA
REFVSEL = {0, 1, 2},
Load-current regulation, IVREF+ = +10 µA , –1000 µA,
IL(VREF+)
1500
2500 µV/mA
VREF+ terminal(3)
AVCC = AVCC(min) for each reference level,
REFVSEL = {0, 1, 2}, REFON = REFOUT = 1
Capacitance at VREF+
terminal
REFON = REFOUT = 1(6)
0 mA ≤ IVREF+ ≤ IVREF+(max)
,
CVREF+
TCREF+
TCREF+
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
20
100
50
pF
Temperature coefficient IVREF+ is a constant in the range
of built-in reference(4)
of 0 mA ≤ IVREF+ ≤ –1 mA
ppm/
°C
REFOUT = 0
REFOUT = 1
20
20
Temperature coefficient IVREF+ is a constant in the range
ppm/
°C
of built-in reference(4)
of 0 mA ≤ IVREF+ ≤ –1 mA
AVCC = AVCC(min) to AVCC(max),
TA = 25°C, REFVSEL = {0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
Power supply rejection
ratio (DC)
PSRR_DC
PSRR_AC
120
1
300 µV/V
mV/V
AVCC = AVCC(min) to AVCC(max),
TA = 25°C, REFVSEL = {0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
Power supply rejection
ratio (AC)
AVCC = AVCC(min) to AVCC(max),
REFVSEL = {0, 1, 2}, REFOUT = 0,
REFON = 0 → 1
75
75
Settling time of reference
voltage(5)
tSETTLE
µs
AVCC = AVCC(min) to AVCC(max),
CVREF = CVREF(max), REFVSEL = {0, 1, 2},
REFOUT = 1, REFON = 0 → 1
(1) The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers,
one smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well
as, used as the reference for the conversion and uses the larger buffer. When REFOUT = 0, the reference is only used as the
reference for the conversion and uses the smaller buffer.
(2) The internal reference current is supplied by the AVCC terminal. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
(3) Contribution only due to the reference and buffer including package. This does not include resistance due to PCB traces or other
external factors.
(4) Calculated using the box method: (MAX(–40°C to +85°C) – MIN(–40°C to +85°C)) / MIN(–40°C to +85°C)/(85°C – (–40°C)).
(5) The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
(6) Connect two decoupling capacitors, 10 µF and 100 nF, to VREF to decouple the dynamic current required for an external reference
source if it is used for the ADC12_A. Also see the MSP430F5xx and MSP430F6xx Family User's Guide.
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(7) The temperature sensor is provided by the REF module. Its current is supplied by terminal AVCC and is equivalent to IREF+ with
REFON = 1 and REFOUT = 0.
(8) For devices without the ADC12, the parametric with ADC12SR = 0 are applicable.
8.42 12-Bit DAC, Supply Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
AVCC Analog supply voltage
AVCC = DVCC, AVSS = DVSS = 0 V
2.20
3.60
110
V
DAC12AMPx = 2, DAC12IR = 0,
DAC12OG = 1, DAC12_xDAT = 0800h,
VeREF+ = VREF+ = 1.5 V
3 V
65
125
250
750
DAC12AMPx = 2, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
165
350
Supply current, single DAC
IDD
µA
channel(1) (2)
DAC12AMPx = 5, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
2.2 V, 3 V
DAC12AMPx = 7, DAC12IR = 1,
DAC12_xDAT = 0800h,
1100
VeREF+ = VREF+ = AVCC
DAC12_xDAT = 800h,
VeREF+ = 1.5 V, ΔAVCC = 100 mV
2.2 V
3 V
70
70
PSRR Power supply rejection ratio(3) (4)
dB
DAC12_xDAT = 800h,
VeREF+ = 1.5 V or 2.5 V, ΔAVCC = 100 mV
(1) No load at the output pin, DAC12_0 or DAC12_1, assuming that the control bits for the shared pins are set properly.
(2) Current into reference terminals not included. If DAC12IR = 1 current flows through the input divider; see Reference Input
specifications.
(3) PSRR = 20 log (ΔAVCC / ΔVDAC12_xOUT
(4) The internal reference is not used.
)
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8.43 12-Bit DAC, Linearity Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see
Figure 8-17)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
Resolution
12-bit monotonic
12
bits
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
2.2 V
3 V
±2
±2
±4(1)
LSB
±4
INL
Integral nonlinearity(2)
2.2 V
3 V
±0.4
±0.4
±1(1)
LSB
±1
DNL
Differential nonlinearity(2)
VeREF+ = 1.5 V,
DAC12AMPx = 7,
DAC12IR = 1
2.2 V
3 V
±21(1)
Without calibration(2) (3)
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
±21
mV
EO
Offset voltage
VeREF+ = 1.5 V,
DAC12AMPx = 7,
2.2 V
±1.5(1)
DAC12IR = 1
With calibration(2) (3)
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
3 V
±1.5
Offset error temperature
coefficient(2)
dE(O)/dT
With calibration
2.2 V, 3 V
±10
10
µV/°C
VeREF+ = 1.5 V
VeREF+ = 2.5 V
2.2 V
3 V
±2.5
EG
Gain error
%FSR
±2.5
ppm of
FSR/
°C
Gain temperature
coefficient(2)
dE(G)/dT
2.2 V, 3 V
2.2 V, 3 V
DAC12AMPx = 2
165
Time for offset
calibration(4)
tOffset_Cal
DAC12AMPx = 3, 5
DAC12AMPx = 4, 6, 7
66
ms
16.5
(1) This parameter is not production tested.
(2) Parameters calculated from the best-fit curve from 0x0F to 0xFFF. The best-fit curve method is used to deliver coefficients "a" and "b"
of the first-order equation: y = a + bx. VDAC12_xOUT = EO + (1 + EG) × (VeREF+ / 4095) × DAC12_xDAT, DAC12IR = 1.
(3) The offset calibration works on the output operational amplifier. Offset calibration is triggered by setting the DAC12CALON bit.
(4) The offset calibration can be done if DAC12AMPx = {2, 3, 4, 5, 6, 7}. The output operational amplifier is switched off with DAC12AMPx
= {0, 1}. TI recommends configuring the DAC12 module before initiating calibration. Port activity during calibration may effect accuracy
and is not recommended.
DAC VOUT
DAC Output
VR+
RLoad = ¥
Ideal transfer
function
AVCC
2
Offset Error
Positive
Gain Error
CLoad = 100 pF
Negative
DAC Code
Figure 8-17. Linearity Test Load Conditions and Gain and Offset Definitions
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8.44 12-Bit DAC, Output Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
No load, VeREF+ = AVCC
,
DAC12_xDAT = 0h, DAC12IR = 1,
DAC12AMPx = 7
0
0.005
No load, VeREF+ = AVCC
DAC12_xDAT = 0FFFh, DAC12IR = 1,
DAC12AMPx = 7
,
AVCC
0.05
–
AVCC
Output voltage range(1)
(see Figure 8-18)
VO
2.2 V, 3 V
V
RLoad = 3 kΩ, VeREF+ = AVCC
,
DAC12_xDAT = 0h, DAC12IR = 1,
DAC12AMPx = 7
0
0.1
RLoad = 3 kΩ, VeREF+ = AVCC
DAC12_xDAT = 0FFFh, DAC12IR = 1,
DAC12AMPx = 7
,
AVCC
0.13
–
AVCC
Maximum DAC12 load
capacitance
CL(DAC12)
2.2 V, 3 V
2.2 V, 3 V
100
pF
DAC12AMPx = 2, DAC12_xDAT = 0FFFh,
VO/P(DAC12) > AVCC – 0.3
–1
Maximum DAC12 load
current
IL(DAC12)
mA
DAC12AMPx = 2, DAC12_xDAT = 0h,
VO/P(DAC12) < 0.3 V
1
250
250
6
RLoad = 3 kΩ, VO/P(DAC12) < 0.3 V,
DAC12AMPx = 2, DAC12_xDAT = 0h
150
150
Output resistance (see RLoad = 3 kΩ, VO/P(DAC12) > AVCC – 0.3 V,
Figure 8-18)
RO/P(DAC12)
2.2 V, 3 V
Ω
DAC12_xDAT = 0FFFh
RLoad = 3 kΩ,
0.3 V ≤ VO/P(DAC12) ≤ AVCC – 0.3 V
(1) Data is valid after the offset calibration of the output amplifier.
RO/P(DAC12_x)
Max
RLoad
ILoad
AVCC
DAC12
2
CLoad = 100 pF
O/P(DAC12_x)
Min
0.3
AVCC – 0.3 V
VOUT
AVCC
Figure 8-18. DAC12_x Output Resistance Tests
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8.45 12-Bit DAC, Reference Input Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
DAC12IR = 0(1) (2)
VCC
MIN
TYP
MAX UNIT
AVCC / 3 AVCC + 0.2
AVCC AVCC + 0.2
Reference input voltage
range
VeREF+
2.2 V, 3 V
V
DAC12IR = 1(3) (4)
DAC12_0 IR = DAC12_1 IR = 0
DAC12_0 IR = 1, DAC12_1 IR = 0
DAC12_0 IR = 0, DAC12_1 IR = 1
20
MΩ
48
48
Ri(VREF+)
Ri(VeREF+)
,
Reference input resistance
2.2 V, 3 V
kΩ
DAC12_0 IR = DAC12_1 IR = 1,
24
DAC12_0 SREFx = DAC12_1 SREFx(5)
(1) For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).
(2) The maximum voltage applied at reference input voltage terminal VeREF+ = (AVCC – VE(O)) / (3 × (1 + EG)).
(3) For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).
(4) The maximum voltage applied at reference input voltage terminal VeREF+ = (AVCC – VE(O)) / (1 + EG).
(5) When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel
reducing the reference input resistance.
8.46 12-Bit DAC, Dynamic Specifications
VREF = VCC, DAC12IR = 1 (see Figure 8-19 and Figure 8-20), over recommended ranges of supply voltage and
operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
DAC12AMPx = 0 → {2, 3, 4}
60
120
DAC12_xDAT = 800h,
ErrorV(O) < ±0.5 LSB(1)
(see Figure 8-19)
tON
DAC12 on time
DAC12AMPx = 0 → {5, 6}
DAC12AMPx = 0 → 7
DAC12AMPx = 2
2.2 V, 3 V
15
30
12
µs
µs
µs
6
100
40
200
80
DAC12_xDAT =
80h → F7Fh → 80h
tS(FS)
tS(C-C)
SR
Settling time, full scale
DAC12AMPx = 3, 5
DAC12AMPx = 4, 6, 7
DAC12AMPx = 2
2.2 V, 3 V
2.2 V, 3 V
15
30
5
DAC12_xDAT =
3F8h → 408h → 3F8h,
BF8h → C08h → BF8h
Settling time, code to
code
DAC12AMPx = 3, 5
DAC12AMPx = 4, 6, 7
DAC12AMPx = 2
2
1
0.05
0.35
1.50
0.35
1.10
5.20
DAC12_xDAT =
Slew rate
DAC12AMPx = 3, 5
DAC12AMPx = 4, 6, 7
2.2 V, 3 V
2.2 V, 3 V
V/µs
nV-s
80h → F7Fh → 80h(2)
DAC12_xDAT =
800h → 7FFh → 800h
Glitch energy
DAC12AMPx = 7
35
(1) RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 8-19.
(2) Slew rate applies to output voltage steps ≥ 200 mV.
Conversion 1
Conversion 2
1/2 LꢀS
Conversion 3
VOUT
DAC Output
Glitch
Energy
RLoad = 3 kW
ILoad
AVCC
2
1/2 LꢀS
CLoad = 100 pF
RO/P(DAC12.x)
tsettleLH
tsettleHL
Figure 8-19. Settling Time and Glitch Energy Testing
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Conversion 1
Conversion 2
Conversion 3
VOUT
90%
90%
10%
10%
tSRLH
tSRHL
Figure 8-20. Slew Rate Testing
8.47 12-Bit DAC, Dynamic Specifications (Continued)
over recommended ranges of supply voltage and TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
DAC12AMPx = {2, 3, 4}, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
40
3-dB bandwidth,
VDC = 1.5 V,
VAC = 0.1 VPP
(see Figure 8-21)
DAC12AMPx = {5, 6}, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
BW–3dB
2.2 V, 3 V
180
550
kHz
DAC12AMPx = 7, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
DAC12_0DAT = 800h, No load,
DAC12_1DAT = 80h ↔ F7Fh, RLoad = 3 kΩ,
fDAC12_1OUT = 10 kHz at 50/50 duty cycle
–80
–80
Channel-to-channel
crosstalk(1) (see Figure
8-22)
2.2 V, 3 V
dB
DAC12_0DAT = 80h ↔ F7Fh, RLoad = 3 kΩ,
DAC12_1DAT = 800h, No load,
fDAC12_0OUT = 10 kHz at 50/50 duty cycle
(1) RLoad = 3 kΩ, CLoad = 100 pF
RLoad = 3 kW
ILoad
VeREF+
AVCC
2
DAC12_x
DACx
AC
DC
CLoad = 100 pF
Figure 8-21. Test Conditions for 3-dB Bandwidth Specification
RLoad
ILoad
AVCC
DAC12_xDAT
VOUT
080h
080h
F7Fh
080h
F7Fh
DAC12_0
DAC12_1
2
DAC0
CLoad = 100 pF
RLoad
VREF+
VDAC12_yOUT
ILoad
VDAC12_xOUT
AVCC
2
1/fToggle
DAC1
CLoad = 100 pF
Figure 8-22. Crosstalk Test Conditions
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8.48 Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX UNIT
VCC
Supply voltage
1.8
3.6
40
50
V
1.8 V
2.2 V
CBPWRMD = 00
30
40
Comparator operating supply current
IAVCC_COMP into AVCC terminal, excludes
reference resistor ladder
3 V
65 µA
30
CBPWRMD = 01
CBPWRMD = 10
2.2 V, 3 V
2.2 V, 3 V
10
0.1
0.5
Quiescent current of local reference
IAVCC_REF
CBREFACC = 1, CBREFLx = 01
22 µA
voltage amplifier into AVCC terminal
VIC
Common-mode input range
Input offset voltage
0
VCC – 1
V
CBPWRMD = 00
±20
±10
VOFFSET
CIN
mV
CBPWRMD = 01, 10
Input capacitance
5
3
pF
kΩ
On (switch closed)
4
RSIN
Series input resistance
Off (switch open)
50
MΩ
CBPWRMD = 00, CBF = 0
CBPWRMD = 01, CBF = 0
CBPWRMD = 10, CBF = 0
450
600
50
ns
µs
tPD
Propagation delay, response time
Propagation delay with filter active
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 00
0.35
0.6
1.0
1.8
0.6
1.0
1.8
3.4
1
1.0
1.8
3.4
6.5
2
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 01
tPD,filter
µs
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 10
CBPWRMD = 00, CBON = 1,
CBF = 1, CBFDLY = 11
CBON = 0 to CBON = 1,
CBPWRMD = 00, 01
tEN_CMP
Comparator enable time, settling time
µs
CBON = 0 to CBON = 1,
CBPWRMD = 10
100
tEN_REF
Resistor reference enable time
Reference voltage for a given tap
CBON = 0 to CBON = 1
0.3
1.5
µs
V
VIN ×
(n + 0.5)
/ 32
VIN ×
(n + 1) (n + 1.5)
/ 32 / 32
VIN ×
VIN = reference into resistor
ladder, n = 0 to 31
VCB_REF
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8.49 Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
High-level output voltage
Low-level output voltage
High-level input voltage
Low-level input voltage
TEST CONDITIONS
VUSB = 3.3 V ±10%, IOH = –25 mA
VUSB = 3.3 V ±10%, IOL = 25 mA
VUSB = 3.3 V ±10%
MIN
MAX
UNIT
VOH
VOL
VIH
VIL
2.4
V
V
V
V
0.4
2.0
VUSB = 3.3 V ±10%
0.8
8.50 USB Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
D+, D– single ended
D+, D– single ended
D+, D– impedance
Rise time
TEST CONDITIONS
MIN
2.8
0
MAX UNIT
VOH
USB 2.0 load conditions
USB 2.0 load conditions
3.6
0.3
44
V
V
VOL
Z(DRV)
tRISE
tFALL
Including external series resistor of 27 Ω
28
4
Ω
Full speed, differential, CL = 50 pF, 10%/90%, Rpu on D+
Full speed, differential, CL = 50 pF, 10%/90%, Rpu on D+
20
ns
ns
Fall time
4
20
8.51 USB Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN
MAX UNIT
V(CM)
Z(IN)
VCRS
VIL
Differential input common-mode range
0.8
2.5
V
kΩ
V
Input impedance
300
1.3
Crossover voltage
2.0
0.8
Static SE input logic low level
Static SE input logic high level
Differential input voltage
V
VIH
2.0
V
VDI
0.2
V
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8.52 USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VLAUNCH
VBUS
VBUS detection threshold
3.75
5.5
V
V
V
V
USB bus voltage
Normal operation
3.76
VUSB
USB LDO output voltage
3.3
1.8
±9%
V18
Internal USB voltage(1)
IUSB_EXT
IDET
Maximum external current from VUSB terminal(2)
USB LDO current overload detection(3)
USB LDO is on
12 mA
60
100 mA
USB LDO is on,
USB PLL disabled
ISUSPEND
Operating supply current into VBUS terminal.(4)
250
µA
CBUS
CUSB
C18
VBUS terminal recommended capacitance
VUSB terminal recommended capacitance
V18 terminal recommended capacitance
4.7
220
220
µF
nF
nF
Within 2%,
recommended capacitances
tENABLE
RPUR
Settling time VUSB and V18
2
ms
Ω
Pullup resistance of PUR terminal(5)
70
110
150
(1) This voltage is for internal use only. No external DC loading should be applied.
(2) This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
(3) A current overload is detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
(4) Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
(5) This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
8.53 USB-PLL (USB Phase-Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
MIN
TYP
MAX UNIT
IPLL
Operating supply current
PLL frequency
7
mA
MHz
MHz
ms
fPLL
48
fUPD
tLOCK
tJitter
PLL reference frequency
PLL lock time
1.5
3
2
PLL jitter
1000
ps
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8.54 Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TJ
MIN
TYP
MAX UNIT
DVCC(PGM/ERASE) Program and erase supply voltage
1.8
3.6
5
V
mA
IPGM
Average supply current from DVCC during program
3
6
6
IERASE
Average supply current from DVCC during erase
Average supply current from DVCC during mass erase or bank erase
Cumulative program time(1)
15
15
16
mA
IMERASE, IBANK
tCPT
mA
ms
Program and erase endurance
104
100
64
105
cycles
years
µs
tRetention
tWord
Data retention duration
25°C
Word or byte program time(2)
85
65
tBlock, 0
Block program time for first byte or word(2)
49
µs
Block program time for each additional byte or word, except for last byte
or word(2)
tBlock, 1–(N–1)
37
49
µs
tBlock, N
Block program time for last byte or word(2)
55
23
73
32
µs
tSeg Erase
Erase time for segment, mass erase, and bank erase when available(2)
ms
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4.MGR1 = 1)
fMCLK,MGR
0
1
MHz
(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word or byte write and block write modes.
(2) These values are hardwired into the state machine of the flash controller.
8.55 JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
MAX UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
0
20 MHz
tSBW,Low Spy-Bi-Wire low clock pulse duration
2.2 V, 3 V
0.025
15
1
µs
µs
tSBW, En
tSBW,Rst
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge)(1)
Spy-Bi-Wire return to normal operation time
2.2 V, 3 V
15
0
100
5
µs
2.2 V
3 V
MHz
fTCK
TCK input frequency (4-wire JTAG)(2)
Internal pulldown resistance on TEST
0
10 MHz
80 kΩ
Rinternal
2.2 V, 3 V
45
60
(1) Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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9 Detailed Description
9.1 Overview
The MSP430F563x devices include a high-performance 12-bit ADC, a comparator, two USCIs, USB 2.0, a
hardware multiplier, DMA, four 16-bit timers, an RTC module with alarm capabilities, and up to 74 I/O pins.
9.2 CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations,
other than program-flow instructions, are performed as register operations in conjunction with seven addressing
modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register
operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant
generator, respectively. The remaining registers are general-purpose registers (see Figure 9-1).
Peripherals are connected to the CPU using data, address, and control buses. Peripherals can be managed with
all instructions.
Program Counter
PC/R0
SP/R1
SR/CG1/R2
CG2/R3
R4
Stack Pointer
Status Register
Constant Generator
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
Figure 9-1. Integrated CPU Registers
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9.3 Instruction Set
The instruction set consists of the original 51 instructions with three formats and seven address modes and
additional instructions for the expanded address range. Each instruction can operate on word and byte data.
Table 9-1 lists examples of the three types of instruction formats; Table 9-2 lists the address modes.
Table 9-1. Instruction Word Formats
INSTRUCTION WORD FORMAT
Dual operands, source-destination
Single operands, destination only
Relative jump, un/conditional
EXAMPLE
ADD R4,R5
CALL R8
JNE
OPERATION
R4 + R5 → R5
PC → (TOS), R8 → PC
Jump-on-equal bit = 0
Table 9-2. Address Mode Descriptions
ADDRESS MODE
Register
S(1)
+
D(1)
+
SYNTAX
EXAMPLE
OPERATION
R10 → R11
MOV Rs,Rd
MOV R10,R11
Indexed
+
+
MOV X(Rn),Y(Rm)
MOV EDE,TONI
MOV &MEM, &TCDAT
MOV @Rn,Y(Rm)
MOV 2(R5),6(R6)
M(2+R5) → M(6+R6)
M(EDE) → M(TONI)
M(MEM) → M(TCDAT)
M(R10) → M(Tab+R6)
Symbolic (PC relative)
Absolute
+
+
+
+
Indirect
+
MOV @R10,Tab(R6)
MOV @R10+,R11
MOV #45,TONI
M(R10) → R11
R10 + 2 → R10
Indirect auto-increment
Immediate
+
+
MOV @Rn+,Rm
MOV #X,TONI
#45 → M(TONI)
(1) S = source, D = destination
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9.4 Operating Modes
These devices have one active mode and seven software-selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
Software can configure the following operating modes:
•
Active mode (AM)
– All clocks are active
•
Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– FLL loop control remains active
Low-power mode 1 (LPM1)
•
•
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active, MCLK is disabled
Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DC generator of the DCO remains enabled
– ACLK remains active
•
•
Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DC generator of the DCO is disabled
– ACLK remains active
Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DC generator of the DCO is disabled
– Crystal oscillator is stopped
– Complete data retention
•
•
Low-power mode 3.5 (LPM3.5)
– Internal regulator disabled
– No data retention
– RTC enabled and clocked by low-frequency oscillator
– Wake-up signal from RST/NMI, RTC_B, P1, P2, P3, and P4
Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wake-up signal from RST/NMI, P1, P2, P3, and P4
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9.5 Interrupt Vector Addresses
The interrupt vectors and the power-up start address are in the address range 0FFFFh to 0FF80h (see Table
9-3). The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 9-3. Interrupt Sources, Flags, and Vectors of MSP430F563x Configurations
WORD
ADDRESS
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
PRIORITY
System Reset
Power-Up, External Reset
Watchdog Time-out, Key Violation
Flash Memory Key Violation
WDTIFG, KEYV (SYSRSTIV)(1) (3)
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG, VLRLIFG,
VLRHIFG, VMAIFG, JMBNIFG, JMBOUTIFG (SYSSNIV)
(Non)maskable
(Non)maskable
0FFFCh
0FFFAh
62
61
(1)
User NMI
NMI
Oscillator Fault
NMIIFG, OFIFG, ACCVIFG, BUSIFG (SYSUNIV)(1) (3)
Flash Memory Access Violation
Comp_B
Comparator B interrupt flags (CBIV)(1) (2)
TB0CCR0 CCIFG0(2)
Maskable
Maskable
0FFF8h
0FFF6h
60
59
Timer TB0
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TBIV)(1) (2)
Timer TB0
Maskable
0FFF4h
58
Watchdog Interval Timer Mode
USCI_A0 Receive or Transmit
USCI_B0 Receive or Transmit
ADC12_A(5)
WDTIFG
Maskable
Maskable
Maskable
Maskable
Maskable
0FFF2h
0FFF0h
0FFEEh
0FFECh
0FFEAh
57
56
55
54
53
UCA0RXIFG, UCA0TXIFG (UCA0IV)(1) (2)
UCB0RXIFG, UCB0TXIFG (UCB0IV)(1) (2)
ADC12IFG0 to ADC12IFG15 (ADC12IV)(1) (2)
TA0CCR0 CCIFG0(2)
Timer TA0
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV)(1) (2)
Timer TA0
USB_UBM
DMA
Maskable
Maskable
Maskable
Maskable
Maskable
0FFE8h
0FFE6h
0FFE4h
0FFE2h
0FFE0h
52
51
50
49
48
USB interrupts (USBIV)(1) (2)
DMA0IFG, DMA1IFG, DMA2IFG, DMA3IFG, DMA4IFG,
DMA5IFG (DMAIV)(1) (2)
Timer TA1
Timer TA1
TA1CCR0 CCIFG0(2)
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV)(1) (2)
I/O Port P1
USCI_A1 Receive or Transmit
USCI_B1 Receive or Transmit
I/O Port P2
P1IFG.0 to P1IFG.7 (P1IV)(1) (2)
UCA1RXIFG, UCA1TXIFG (UCA1IV)(1) (2)
UCB1RXIFG, UCB1TXIFG (UCB1IV)(1) (2)
P2IFG.0 to P2IFG.7 (P2IV)(1) (2)
Reserved
Maskable
Maskable
Maskable
Maskable
Maskable
0FFDEh
0FFDCh
0FFDAh
0FFD8h
0FFD6h
47
46
45
44
43
Reserved
RTCRDYIFG, RTCTEVIFG, RTCAIFG, RT0PSIFG,
RT1PSIFG, RTCOFIFG (RTCIV)(1) (2)
RTC_B
Maskable
0FFD4h
42
DAC12_A(6)
Timer TA2
DAC12_0IFG, DAC12_1IFG(1) (2)
TA2CCR0 CCIFG0(2)
Maskable
Maskable
0FFD2h
0FFD0h
41
40
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,
TA2IFG (TA2IV)(1) (2)
Timer TA2
Maskable
0FFCEh
39
I/O Port P3
I/O Port P4
P3IFG.0 to P3IFG.7 (P3IV)(1) (2)
P4IFG.0 to P4IFG.7 (P4IV)(1) (2)
Maskable
Maskable
0FFCCh
0FFCAh
0FFC8h
⋮
38
37
36
Reserved
Reserved(4)
⋮
0FF80h
0, lowest
(1) Multiple source flags
(2) Interrupt flags are in the module.
(3) A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
(4) Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To
maintain compatibility with other devices, TI recommends reserving these locations.
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(5) Only on devices with peripheral module ADC12_A, otherwise reserved.
(6) Only on devices with peripheral module DAC12_A, otherwise reserved.
9.6 Memory
Table 9-4 summarizes the memory map for all device variants.
Table 9-4. Memory Organization
MSP430F5636
MSP430F5633
MSP430F5630
MSP430F5637
MSP430F5634
MSP430F5631
MSP430F5638
MSP430F5635
MSP430F5632
(1) (3)
Memory (flash)
Main: interrupt vector
128KB
00FFFFh to 00FF80h
192KB
00FFFFh to 00FF80h
256KB
00FFFFh to 00FF80h
Total Size
Bank 3
64KB
047FFFh to 038000h
N/A
N/A
N/A
64KB
037FFFh to 028000h
64KB
037FFFh to 028000h
Bank 2
Main: code memory
64KB
027FFFh to 018000h
64KB
027FFFh to 018000h
64KB
027FFFh to 018000h
Bank 1
64KB
017FFFh to 008000h
64KB
017FFFh to 008000h
64KB
017FFFh to 008000h
Bank 0
4KB
4KB
4KB
Sector 3
Sector 2
Sector 1
Sector 0
0063FFh to 005400h
0063FFh to 005400h
0063FFh to 005400h
4KB
4KB
4KB
0053FFh to 004400h
0053FFh to 004400h
0053FFh to 004400h
RAM
4KB
4KB
4KB
0043FFh to 003400h
0043FFh to 003400h
0043FFh to 003400h
4KB
4KB
4KB
0033FFh to 002400h
0033FFh to 002400h
0033FFh to 002400h
Size
RAM
2KB
2KB
2KB
USB RAM(2)
0023FFh to 001C00h
0023FFh to 001C00h
0023FFh to 001C00h
128 bytes
0019FFh to 001980h
128 bytes
0019FFh to 001980h
128 bytes
0019FFh to 001980h
Info A
Info B
Info C
Info D
BSL 3
BSL 2
BSL 1
BSL 0
Size
128 bytes
00197Fh to 001900h
128 bytes
00197Fh to 001900h
128 bytes
00197Fh to 001900h
Information memory
(flash)
128 bytes
0018FFh to 001880h
128 bytes
0018FFh to 001880h
128 bytes
0018FFh to 001880h
128 bytes
00187Fh to 001800h
128 bytes
00187Fh to 001800h
128 bytes
00187Fh to 001800h
512 bytes
0017FFh to 001600h
512 bytes
0017FFh to 001600h
512 bytes
0017FFh to 001600h
512 bytes
0015FFh to 001400h
512 bytes
0015FFh to 001400h
512 bytes
0015FFh to 001400h
Bootloader (BSL)
memory (flash)
512 bytes
0013FFh to 001200h
512 bytes
0013FFh to 001200h
512 bytes
0013FFh to 001200h
512 bytes
0011FFh to 001000h
512 bytes
0011FFh to 001000h
512 bytes
0011FFh to 001000h
4KB
4KB
4KB
Peripherals
000FFFh to 000000h
000FFFh to 000000h
000FFFh to 000000h
(1) N/A = Not available.
(2) USB RAM can be used as general-purpose RAM when not used for USB operation.
(3) Backup RAM is accessed through the control registers BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.
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9.7 Bootloader (BSL)
The BSL lets users program the flash memory or RAM using various serial interfaces. Access to the device
memory by the BSL is protected by an user-defined password. For complete description of the features of the
BSL and its implementation, see MSP430™ Flash Devices Bootloader (BSL) User's Guide.
9.7.1 USB BSL
All devices come preprogrammed with the USB BSL. Use of the USB BSL requires external access to six pins
(see Table 9-5). In addition to these pins, the application must support external components necessary for
normal USB operation; for example, the proper crystal on XT2IN and XT2OUT or proper decoupling.
Table 9-5. USB BSL Pin Requirements and
Functions
DEVICE SIGNAL
RST/NMI/SBWTDIO
PU.0/DP
BSL FUNCTION
Entry sequence signal
USB data terminal DP
USB data terminal DM
USB pullup resistor terminal
USB bus power supply
USB ground supply
PU.1/DM
PUR
VBUS
VSSU
Note
The default USB BSL evaluates the logic level of the PUR pin after a BOR reset. If the PUR pin is
pulled high externally, the BSL is invoked. Therefore, unless the application is invoking the BSL, it is
important to keep PUR pulled low after a BOR reset, even if BSL or USB is never used. TI
recommends applying a 1-MΩ resistor to ground.
9.7.2 UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the
preprogrammed, factory supplied, USB BSL. Use of the UART BSL requires external access to six pins (see
Table 9-6).
Table 9-6. UART BSL Pin Requirements and
Functions
DEVICE SIGNAL
BSL FUNCTION
Entry sequence signal
Entry sequence signal
Data transmit
RST/NMI/SBWTDIO
TEST/SBWTCK
P1.1
P1.2
VCC
VSS
Data receive
Power supply
Ground supply
9.8 JTAG Operation
9.8.1 JTAG Standard Interface
The MSP430 family supports the standard JTAG interface which requires four signals for sending and receiving
data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the
JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430
development tools and device programmers. Table 9-7 lists the JTAG pin requirements. For further details on
interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide. For a
complete description of the features of the JTAG interface and its implementation, see MSP430 Programming
With the JTAG Interface.
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Table 9-7. JTAG Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
JTAG clock input
JTAG state control
JTAG data input, TCLK input
JTAG data output
Enable JTAG pins
External reset
PJ.3/TCK
IN
IN
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
IN
OUT
IN
TEST/SBWTCK
RST/NMI/SBWTDIO
VCC
IN
Power supply
VSS
Ground supply
9.8.2 Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire interface. Spy-
Bi-Wire can be used to interface with MSP430 development tools and device programmers. Table 9-8 lists the
Spy-Bi-Wire interface pin requirements. For further details on interfacing to development tools and device
programmers, see the MSP430 Hardware Tools User's Guide. For a complete description of the features of the
JTAG interface and its implementation, see MSP430 pRogramming With the JTAG Interface.
Table 9-8. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
TEST/SBWTCK
RST/NMI/SBWTDIO
VCC
DIRECTION
FUNCTION
Spy-Bi-Wire clock input
Spy-Bi-Wire data input/output
Power supply
IN
IN, OUT
VSS
Ground supply
9.9 Flash Memory
The flash memory can be programmed by the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the
flash memory include:
•
Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
•
•
Segments 0 to n may be erased in one step, or each segment may be individually erased.
Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also
called information memory.
•
Segment A can be locked separately.
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9.10 RAM
The RAM is made up of n sectors. Each sector can be completely powered down to save leakage; however, all
data is lost. Features of the RAM include:
•
•
•
•
RAM has n sectors. The size of a sector can be found in Section 9.6.
Each sector 0 to n can be complete disabled; however, data retention is lost.
Each sector 0 to n automatically enters low power retention mode when possible.
For devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.
9.11 Backup RAM
The backup RAM provides a limited number of bytes of RAM that are retained during LPMx.5 and during
operation from a backup supply if the Battery Backup System module is implemented.
Eight bytes of backup RAM are available. The backup RAM can be wordwise accessed by the control registers
BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.
9.12 Peripherals
Peripherals are connected to the CPU through data, address, and control buses. Peripherals can be managed
using all instructions. For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User's
Guide.
9.12.1 Digital I/O
Up to nine 8-bit I/O ports are implemented: P1 through P6, P8, and P9 are complete, P7 contains six individual
I/O ports, and PJ contains four individual I/O ports.
•
•
•
•
•
•
•
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Programmable pullup or pulldown on all ports.
Programmable drive strength on all ports.
All eight bits of ports P1, P2, P3, and P4 support edge-selectable interrupt input.
All instructions support read and write access to port-control registers.
Ports can be accessed byte-wise (P1 through P9) or word-wise in pairs (PA through PD).
9.12.2 Port Mapping Controller
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P2. Table
9-9 lists the mnemonic for each function that can be assigned.
Table 9-9. Port Mapping Mnemonics and Functions
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT
–
Comparator_B output
1
2
PM_TB0CLK
Timer TB0 clock input
–
PM_ADC12CLK
PM_DMAE0
–
ADC12CLK
–
DMAE0 Input
–
PM_SVMOUT
SVM output
3
Timer TB0 high-impedance input
TB0OUTH
PM_TB0OUTH
–
4
5
6
7
8
9
PM_TB0CCR0B
PM_TB0CCR1B
PM_TB0CCR2B
PM_TB0CCR3B
PM_TB0CCR4B
PM_TB0CCR5B
Timer TB0 CCR0 capture input CCI0B
Timer TB0 CCR1 capture input CCI1B
Timer TB0 CCR2 capture input CCI2B
Timer TB0 CCR3 capture input CCI3B
Timer TB0 CCR4 capture input CCI4B
Timer TB0 CCR5 capture input CCI5B
Timer TB0: TB0.0 compare output Out0
Timer TB0: TB0.1 compare output Out1
Timer TB0: TB0.2 compare output Out2
Timer TB0: TB0.3 compare output Out3
Timer TB0: TB0.4 compare output Out4
Timer TB0: TB0.5 compare output Out5
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Table 9-9. Port Mapping Mnemonics and Functions (continued)
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
Timer TB0 CCR6 capture input CCI6B
USCI_A0 UART RXD (Direction controlled by USCI – input)
OUTPUT PIN FUNCTION
10
PM_TB0CCR6B
PM_UCA0RXD
PM_UCA0SOMI
PM_UCA0TXD
PM_UCA0SIMO
PM_UCA0CLK
PM_UCB0STE
PM_UCB0SOMI
PM_UCB0SCL
PM_UCB0SIMO
PM_UCB0SDA
PM_UCB0CLK
PM_UCA0STE
PM_MCLK
Timer TB0: TB0.6 compare output Out6
11
12
13
14
15
16
USCI_A0 SPI slave out master in (direction controlled by USCI)
USCI_A0 UART TXD (Direction controlled by USCI – output)
USCI_A0 SPI slave in master out (direction controlled by USCI)
USCI_A0 clock input/output (direction controlled by USCI)
USCI_B0 SPI slave transmit enable (direction controlled by USCI – input)
USCI_B0 SPI slave out master in (direction controlled by USCI)
USCI_B0 I2C clock (open drain and direction controlled by USCI)
USCI_B0 SPI slave in master out (direction controlled by USCI)
USCI_B0 I2C data (open drain and direction controlled by USCI)
USCI_B0 clock input/output (direction controlled by USCI)
USCI_A0 SPI slave transmit enable (direction controlled by USCI – input)
17
18
–
MCLK
Reserved
Reserved for test purposes. Do not use this setting.
Reserved for test purposes. Do not use this setting.
19
Reserved
20–30
Reserved
None
DVSS
Disables the output driver and the input Schmitt-trigger to prevent parasitic cross currents
when applying analog signals.
31 (0FFh)(1)
PM_ANALOG
(1) The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are 5 bits wide, and the upper bits are ignored,
which results in a maximum value of 31.
Table 9-10 lists the default values for all pins that support port mapping.
Table 9-10. Default Mapping
PxMAPy
MNEMONIC
PIN
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
PM_UCB0STE,
PM_UCA0CLK
USCI_B0 SPI slave transmit enable (direction controlled by USCI – input),
USCI_A0 clock input/output (direction controlled by USCI)
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
PM_UCB0SIMO,
PM_UCB0SDA
USCI_B0 SPI slave in master out (direction controlled by USCI),
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0SOMI,
PM_UCB0SCL
USCI_B0 SPI slave out master in (direction controlled by USCI),
USCI_B0 I2C clock (open drain and direction controlled by USCI)
PM_UCB0CLK,
PM_UCA0STE
USCI_B0 clock input/output (direction controlled by USCI),
USCI_A0 SPI slave transmit enable (direction controlled by USCI – input)
PM_UCA0TXD,
PM_UCA0SIMO
USCI_A0 UART TXD (direction controlled by USCI – output),
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0RXD,
PM_UCA0SOMI
USCI_A0 UART RXD (direction controlled by USCI – input),
USCI_A0 SPI slave out master in (direction controlled by USCI)
P2.6/P2MAP6
P2.7/P2MAP7
PM_NONE
PM_NONE
–
–
DVSS
DVSS
9.12.3 Oscillator and System Clock
The clock system is supported by the Unified Clock System (UCS) module that includes support for a 32-kHz
watch crystal oscillator (in XT1 LF mode; XT1 HF mode is not supported), an internal very-low-power low-
frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an integrated internal digitally
controlled oscillator (DCO), and a high-frequency crystal oscillator XT2. The UCS module is designed to meet
the requirements of both low system cost and low power consumption. The UCS module features digital
frequency-locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the DCO frequency
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to a programmable multiple of the watch-crystal frequency. The internal DCO provides a fast turnon clock source
and stabilizes in 3 µs (typical). The UCS module provides the following clock signals:
•
Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal digitally-
controlled oscillator DCO.
•
•
•
Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources available to
ACLK.
Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources available to ACLK.
ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
9.12.4 Power-Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The SVS
and SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
9.12.5 Hardware Multiplier (MPY) (Link to User's Guide)
The multiplication operation is supported by a dedicated peripheral module. The module performs operations
with 32-, 24-, 16-, and 8-bit operands. The module supports signed and unsigned multiplication as well as signed
and unsigned multiply-and-accumulate operations.
9.12.6 Real-Time Clock (RTC_B)
The RTC_B module can be configured for real-time clock (RTC) or calendar mode providing seconds, minutes,
hours, day of week, day of month, month, and year. Calendar mode integrates an internal calendar which
compensates for months with less than 31 days and includes leap year correction. The RTC_B also supports
flexible alarm functions and offset-calibration hardware. The implementation on this device supports operation in
LPM3.5 mode and operation from a backup supply.
Using the MSP430 RTC_B Module With Battery Backup Supply describes how to use the RTC_B with battery
backup supply functionality to retain the time and keep the RTC counting through loss of main power supply, and
how to perform correct reinitialization when the main power supply is restored.
9.12.7 Watchdog Timer (WDT_A)
The primary function of the WDT_A module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the module can be configured as an interval timer and can generate interrupts at selected time
intervals.
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9.12.8 System Module (SYS)
The SYS module handles many of the system functions within the device. These include power-on reset and
power-up clear handling, NMI source selection and management, reset interrupt vector generators, bootloader
entry mechanisms, and configuration management (device descriptors). SYS also includes a data exchange
mechanism through JTAG called a JTAG mailbox that can be used in the application.
Table 9-11 lists the SYS interrupt vector registers.
Table 9-11. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER
INTERRUPT EVENT
No interrupt pending
Brownout (BOR)
RST/NMI (BOR)
PMMSWBOR (BOR)
LPM3.5 or LPM4.5 wakeup (BOR)
Security violation (BOR)
SVSL (POR)
WORD ADDRESS
OFFSET
00h
PRIORITY
02h
Highest
04h
06h
08h
0Ah
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
SVMH_OVP (POR)
PMMSWPOR (POR)
WDT time-out (PUC)
WDT key violation (PUC)
KEYV flash key violation (PUC)
Reserved
10h
SYSRSTIV, System Reset
019Eh
12h
14h
16h
18h
1Ah
1Ch
Peripheral area fetch (PUC)
PMM key violation (PUC)
Reserved
1Eh
20h
22h to 3Eh
00h
Lowest
Highest
No interrupt pending
SVMLIFG
02h
SVMHIFG
04h
DLYLIFG
06h
DLYHIFG
08h
SYSSNIV, System NMI
VMAIFG
019Ch
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
SVMLVLRIFG
10h
SVMHVLRIFG
12h
Reserved
14h to 1Eh
00h
Lowest
Highest
No interrupt pending
NMIIFG
02h
OFIFG
04h
SYSUNIV, User NMI
019Ah
0198h
ACCVIFG
06h
BUSIFG
08h
Reserved
0Ah to 1Eh
00h
Lowest
No interrupt pending
USB wait state time-out
Reserved
SYSBERRIV, Bus Error
02h
Highest
Lowest
04h to 1Eh
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9.12.9 DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU intervention.
For example, the DMA controller can be used to move data from the ADC12_A conversion memory to RAM.
Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces
system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move
data to or from a peripheral. Table 9-12 lists the trigger assignments for each DMA channel.
The USB timestamp generator also uses the channel 0, 1, and 2 DMA trigger assignments.
Table 9-12. DMA Trigger Assignments
CHANNEL
TRIGGE
R(1)
0
1
2
3
4
5
0
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR2 CCIFG
TA1CCR0 CCIFG
TA1CCR2 CCIFG
TA2CCR0 CCIFG
TA2CCR2 CCIFG
TBCCR0 CCIFG
TBCCR2 CCIFG
Reserved
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
UCA0RXIFG
UCA0TXIFG
UCB0RXIFG
UCB0TXIFG
UCA1RXIFG
UCA1TXIFG
UCB1RXIFG
UCB1TXIFG
ADC12IFGx(2)
DAC12_0IFG(3)
DAC12_1IFG(3)
USB FNRXD
USB ready
MPY ready
DMA5IFG
DMA0IFG
DMA1IFG
DMA2IFG
DMAE0
DMA3IFG
DMA4IFG
(1) Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not
cause any DMA trigger event when selected.
(2) Only on devices with peripheral module ADC12_A. Reserved on devices without ADC.
(3) Only on devices with peripheral module DAC12_A. Reserved on devices without DAC.
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9.12.10 Universal Serial Communication Interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 or 4 pin) or I2C.
The MSP430F563x series includes two complete USCI modules (n = 0 or 1).
9.12.11 Timer TA0
Timer TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple
capture/compares, PWM outputs, and interval timing (see Table 9-13). TA0 also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each capture/
compare register.
Table 9-13. Timer TA0 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
OUTPUT PIN NUMBER
MODULE
BLOCK
PZ
ZQW
PZ
ZQW
34-P1.0
L5-P1.0
TA0CLK
ACLK
SMCLK
TA0CLK
TA0.0
DVSS
TACLK
ACLK
SMCLK
TACLK
CCI0A
CCI0B
GND
Timer
CCR0
NA
NA
34-P1.0
35-P1.1
L5-P1.0
M5-P1.1
35-P1.1
M5-P1.1
TA0
TA0.0
DVSS
DVCC
VCC
36-P1.2
40-P1.6
J6-P1.2
J7-P1.6
TA0.1
TA0.1
CCI1A
CCI1B
36-P1.2
40-P1.6
J6-P1.2
J7-P1.6
ADC12_A (internal)(1)
ADC12SHSx = {1}
CCR1
TA1
TA0.1
DVSS
GND
DVCC
TA0.2
TA0.2
DVSS
DVCC
TA0.3
DVSS
DVSS
DVCC
TA0.4
DVSS
DVSS
DVCC
VCC
CCI2A
CCI2B
GND
37-P1.3
41-P1.7
H6-P1.3
M7-P1.7
37-P1.3
41-P1.7
H6-P1.3
M7-P1.7
CCR2
CCR3
CCR4
TA2
TA3
TA4
TA0.2
TA0.3
TA0.4
VCC
38-P1.4
39-P1.5
M6-P1.4
L6-P1.5
CCI3A
CCI3B
GND
38-P1.4
39-P1.5
M6-P1.4
L6-P1.5
VCC
CCI4A
CCI4B
GND
VCC
(1) Only on devices with peripheral module ADC12_A.
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9.12.12 Timer TA1
Timer TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 supports multiple
capture/compares, PWM outputs, and interval timing (see Table 9-14). TA1 also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each capture/
compare register.
Table 9-14. Timer TA1 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
OUTPUT PIN NUMBER
MODULE
BLOCK
PZ
ZCA, ZQW
PZ
ZCA, ZQW
42-P3.0
L7-P3.0
TA1CLK
ACLK
TACLK
ACLK
SMCLK
TACLK
CCI0A
CCI0B
GND
Timer
CCR0
NA
NA
SMCLK
TA1CLK
TA1.0
42-P3.0
43-P3.1
L7-P3.0
H7-P3.1
43-P3.1
44-P3.2
H7-P3.1
M8-P3.2
DVSS
TA0
TA1.0
DVSS
DVCC
VCC
44-P3.2
45-P3.3
M8-P3.2
L8-P3.3
TA1.1
CCI1A
DAC12_A(1)
DAC12_0, DAC12_1
(internal)
CBOUT
(internal)
CCI1B
CCR1
CCR2
TA1
TA2
TA1.1
TA1.2
DVSS
DVCC
TA1.2
GND
VCC
CCI2A
45-P3.3
L8-P3.3
ACLK
(internal)
CCI2B
DVSS
DVCC
GND
VCC
(1) Only on devices with peripheral module DAC12_A.
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9.12.13 Timer TA2
Timer TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA2 supports multiple
capture/compares, PWM outputs, and interval timing (see Table 9-15). TA2 also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each capture/
compare register.
Table 9-15. Timer TA2 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
OUTPUT PIN NUMBER
MODULE
BLOCK
PZ
ZCA, ZQW
PZ
ZCA, ZQW
46-P3.4
J8-P3.4
TA2CLK
ACLK
TACLK
ACLK
SMCLK
TACLK
CCI0A
CCI0B
GND
Timer
CCR0
NA
NA
SMCLK
TA2CLK
TA2.0
46-P3.4
47-P3.5
J8-P3.4
M9-P3.5
47-P3.5
48-P3.6
M9-P3.5
L9-P3.6
DVSS
TA0
TA2.0
DVSS
DVCC
VCC
48-P3.6
49-P3.7
L9-P3.6
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
CCR1
CCR2
TA1
TA2
TA2.1
TA2.2
DVSS
DVCC
TA2.2
GND
VCC
M10-P3.7
CCI2A
49-P3.7
M10-P3.7
ACLK
(internal)
CCI2B
DVSS
DVCC
GND
VCC
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9.12.14 Timer TB0
Timer TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. TB0 supports multiple
capture/compares, PWM outputs, and interval timing (see Table 9-16). TB0 also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each capture/
compare register.
Table 9-16. Timer TB0 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
OUTPUT PIN NUMBER
MODULE
BLOCK
PZ
ZCA, ZQW
PZ
ZCA, ZQW
58-P8.0
J11-P8.0
TB0CLK
TB0CLK
P2MAPx(3)
P2MAPx(3)
ACLK
ACLK
Timer
NA
NA
SMCLK
SMCLK
58-P8.0
J11-P8.0
TB0CLK
TB0CLK
P2MAPx(3)
P2MAPx(3)
50-P4.0
J9-P4.0
TB0.0
TB0.0
CCI0A
CCI0B
50-P4.0
J9-P4.0
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
ADC12 (internal) (1)
ADC12SHSx = {2}
CCR0
CCR1
TB0
TB1
TB0.0
TB0.1
DVSS
GND
DVCC
TB0.1
TB0.1
VCC
51-P4.1
M11-P4.1
CCI1A
CCI1B
51-P4.1
P2MAPx(3)
M11-P4.1
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
ADC12 (internal) (1)
ADC12SHSx = {3}
DVSS
GND
DVCC
TB0.2
TB0.2
VCC
52-P4.2
L10-P4.2
CCI2A
CCI2B
52-P4.2
P2MAPx(3)
L10-P4.2
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
DAC12_A(2)
DAC12_0, DAC12_1
(internal)
CCR2
TB2
TB0.2
DVSS
GND
DVCC
TB0.3
TB0.3
DVSS
DVCC
TB0.4
TB0.4
DVSS
DVCC
TB0.5
TB0.5
DVSS
DVCC
TB0.6
TB0.6
DVSS
DVCC
VCC
CCI3A
CCI3B
GND
53-P4.3
M12-P4.3
53-P4.3
M12-P4.3
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
CCR3
CCR4
CCR5
CCR6
TB3
TB4
TB5
TB6
TB0.3
TB0.4
TB0.5
TB0.6
VCC
54-P4.4
L12-P4.4
CCI4A
CCI4B
GND
54-P4.4
L12-P4.4
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
VCC
55-P4.5
L11-P4.5
CCI5A
CCI5B
GND
55-P4.5
L11-P4.5
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
VCC
56-P4.6
K11-P4.6
CCI6A
CCI6B
GND
56-P4.6
K11-P4.6
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
P2MAPx(3)
VCC
(1) Only on devices with peripheral module ADC12_A.
(2) Only on devices with peripheral module DAC12_A.
(3) Timer functions selectable by the port mapping controller.
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9.12.15 Comparator_B
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
9.12.16 ADC12_A
The ADC12_A module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit SAR
core, sample select control, reference generator, and a 16-word conversion-and-control buffer. The conversion-
and-control buffer allows up to 16 independent ADC samples to be converted and stored without any CPU
intervention.
The DAC12_A module is a 12-bit R-ladder voltage-output DAC. The DAC12_A may be used in 8-bit or 12-bit
mode, and may be used with the DMA controller. When multiple DAC12_A modules are present, they may be
grouped together for synchronous operation.
9.12.18 CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
9.12.19 Voltage Reference (REF) Module
The REF module generates all of the critical reference voltages that can be used by the various analog
peripherals in the device.
9.12.20 USB Universal Serial Bus
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module
supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO,
PHY, and PLL. The PLL is highly flexible and can support a wide range of input clock frequencies. USB RAM,
when not used for USB communication, can be used by the system.
9.12.21 Embedded Emulation Module (EEM)
The EEM supports real-time in-system debugging. The L version of the EEM has the following features:
•
•
•
•
•
•
•
Eight hardware triggers or breakpoints on memory access
Two hardware triggers or breakpoints on CPU register write access
Up to 10 hardware triggers can be combined to form complex triggers or breakpoints
Two cycle counters
Sequencer
State storage
Clock control on module level
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9.12.22 Peripheral File Map
Table 9-17 lists the register base address for all of the available peripheral modules.
Table 9-17. Peripherals
MODULE NAME
Special Functions (see Table 9-18)
PMM (see Table 9-19)
BASE ADDRESS
0100h
0120h
0140h
0150h
0158h
015Ch
0160h
0180h
01B0h
01C0h
01D0h
0200h
0220h
0240h
0260h
0280h
0320h
0340h
0380h
03C0h
0400h
0480h
04A0h
04C0h
0500h
0510h
0520h
0530h
0540h
0550h
0560h
05C0h
05E0h
0600h
0620h
0700h
0780h
08C0h
0900h
0920h
OFFSET ADDRESS RANGE(1)
000h to 01Fh
000h to 010h
000h to 00Fh
000h to 007h
000h to 001h
000h to 001h
000h to 01Fh
000h to 01Fh
000h to 001h
000h to 003h
000h to 007h
000h to 01Fh
000h to 01Fh
000h to 00Bh
000h to 00Bh
000h to 00Bh
000h to 01Fh
000h to 02Eh
000h to 02Eh
000h to 02Eh
000h to 02Eh
000h to 01Fh
000h to 01Fh
000h to 02Fh
000h to 00Fh
000h to 00Ah
000h to 00Ah
000h to 00Ah
000h to 00Ah
000h to 00Ah
000h to 00Ah
000h to 01Fh
000h to 01Fh
000h to 01Fh
000h to 01Fh
000h to 03Fh
000h to 01Fh
000h to 00Fh
000h to 014h
000h to 01Fh
Flash Control (see Table 9-20)
CRC16 (see Table 9-21)
RAM Control (see Table 9-22)
Watchdog (see Table 9-23)
UCS (see Table 9-24)
SYS (see Table 9-25)
Shared Reference (see Table 9-26)
Port Mapping Control (see Table 9-27)
Port Mapping Port P2 (see Table 9-27)
Port P1, P2 (see Table 9-28)
Port P3, P4 (see Table 9-29)
Port P5, P6 (see Table 9-30)
Port P7, P8 (see Table 9-31)
Port P9 (see Table 9-32)
Port PJ (see Table 9-33)
Timer TA0 (see Table 9-34)
Timer TA1 (see Table 9-35)
Timer TB0 (see Table 9-36)
Timer TA2 (see Table 9-37)
Battery Backup (see Table 9-38)
RTC_B (see Table 9-39)
32-bit Hardware Multiplier (see Table 9-40)
DMA General Control (see Table 9-41)
DMA Channel 0 (see Table 9-41)
DMA Channel 1 (see Table 9-41)
DMA Channel 2 (see Table 9-41)
DMA Channel 3 (see Table 9-41)
DMA Channel 4 (see Table 9-41)
DMA Channel 5 (see Table 9-41)
USCI_A0 (see Table 9-42)
USCI_B0 (see Table 9-43)
USCI_A1 (see Table 9-44)
USCI_B1 (see Table 9-45)
ADC12_A (see Table 9-46)
DAC12_A (see Table 9-47)
Comparator_B (see Table 9-48)
USB configuration (see Table 9-49)
USB control (see Table 9-50)
(1) For a detailed description of the individual control register offset addresses, see the MSP430F5xx and MSP430F6xx Family User's
Guide.
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Table 9-18. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFR interrupt flag
SFRIE1
00h
02h
04h
SFRIFG1
SFR reset pin control
SFRRPCR
Table 9-19. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM control 0
PMMCTL0
00h
02h
04h
06h
0Ch
0Eh
10h
PMM control 1
PMMCTL1
SVSMHCTL
SVSMLCTL
PMMIFG
SVS high-side control
SVS low-side control
PMM interrupt flags
PMM interrupt enable
PMM power mode 5 control
PMMIE
PM5CTL0
Table 9-20. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
OFFSET
Flash control 1
Flash control 3
Flash control 4
FCTL1
FCTL3
FCTL4
00h
04h
06h
Table 9-21. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
CRC data input
CRC result
CRC16DI
00h
04h
CRC16INIRES
Table 9-22. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
REGISTER
OFFSET
OFFSET
OFFSET
RAM control 0
RCCTL0
00h
00h
Table 9-23. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
REGISTER
Watchdog timer control
WDTCTL
Table 9-24. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
UCS control 0
UCS control 1
UCS control 2
UCS control 3
UCS control 4
UCS control 5
UCS control 6
UCS control 7
UCS control 8
UCSCTL0
00h
02h
04h
06h
08h
0Ah
0Ch
0Eh
10h
UCSCTL1
UCSCTL2
UCSCTL3
UCSCTL4
UCSCTL5
UCSCTL6
UCSCTL7
UCSCTL8
Table 9-25. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
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Table 9-25. SYS Registers (Base Address: 0180h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Bootloader configuration area
SYSBSLC
02h
06h
08h
0Ah
0Ch
0Eh
18h
1Ah
1Ch
1Eh
JTAG mailbox control
SYSJMBC
SYSJMBI0
SYSJMBI1
SYSJMBO0
SYSJMBO1
SYSBERRIV
SYSUNIV
JTAG mailbox input 0
JTAG mailbox input 1
JTAG mailbox output 0
JTAG mailbox output 1
Bus error vector generator
User NMI vector generator
System NMI vector generator
Reset vector generator
SYSSNIV
SYSRSTIV
Table 9-26. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
OFFSET
Shared reference control
REFCTL
00h
Table 9-27. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P2: 01D0h)
REGISTER DESCRIPTION
REGISTER
Port mapping password
Port mapping control
Port P2.0 mapping
Port P2.1 mapping
Port P2.2 mapping
Port P2.3 mapping
Port P2.4 mapping
Port P2.5 mapping
Port P2.6 mapping
Port P2.7 mapping
PMAPPWD
00h
02h
00h
01h
02h
03h
04h
05h
06h
07h
PMAPCTL
P2MAP0
P2MAP1
P2MAP2
P2MAP3
P2MAP4
P2MAP5
P2MAP6
P2MAP7
Table 9-28. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
02h
04h
06h
08h
0Ah
0Eh
18h
1Ah
1Ch
01h
03h
05h
07h
09h
0Bh
Port P1 output
Port P1 direction
P1OUT
P1DIR
P1REN
P1DS
P1SEL
P1IV
Port P1 pullup/pulldown enable
Port P1 drive strength
Port P1 selection
Port P1 interrupt vector word
Port P1 interrupt edge select
Port P1 interrupt enable
Port P1 interrupt flag
Port P2 input
P1IES
P1IE
P1IFG
P2IN
Port P2 output
P2OUT
P2DIR
P2REN
P2DS
P2SEL
Port P2 direction
Port P2 pullup/pulldown enable
Port P2 drive strength
Port P2 selection
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Table 9-28. Port P1, P2 Registers (Base Address: 0200h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P2 interrupt vector word
Port P2 interrupt edge select
Port P2 interrupt enable
Port P2 interrupt flag
P2IV
1Eh
19h
1Bh
1Dh
P2IES
P2IE
P2IFG
Table 9-29. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
02h
04h
06h
08h
0Ah
0Eh
18h
1Ah
1Ch
01h
03h
05h
07h
09h
0Bh
1Eh
19h
1Bh
1Dh
Port P3 output
Port P3 direction
P3OUT
P3DIR
P3REN
P3DS
P3SEL
P3IV
Port P3 pullup/pulldown enable
Port P3 drive strength
Port P3 selection
Port P3 interrupt vector word
Port P3 interrupt edge select
Port P3 interrupt enable
Port P3 interrupt flag
P3IES
P3IE
P3IFG
P4IN
Port P4 input
Port P4 output
P4OUT
P4DIR
P4REN
P4DS
P4SEL
P4IV
Port P4 direction
Port P4 pullup/pulldown enable
Port P4 drive strength
Port P4 selection
Port P4 interrupt vector word
Port P4 interrupt edge select
Port P4 interrupt enable
Port P4 interrupt flag
P4IES
P4IE
P4IFG
Table 9-30. Port P5, P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
02h
04h
06h
08h
0Ah
01h
03h
05h
07h
09h
0Bh
Port P5 output
P5OUT
P5DIR
P5REN
P5DS
Port P5 direction
Port P5 pullup/pulldown enable
Port P5 drive strength
Port P5 selection
P5SEL
P6IN
Port P6 input
Port P6 output
P6OUT
P6DIR
P6REN
P6DS
Port P6 direction
Port P6 pullup/pulldown enable
Port P6 drive strength
Port P6 selection
P6SEL
Table 9-31. Port P7, P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
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Table 9-31. Port P7, P8 Registers (Base Address: 0260h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 output
P7OUT
P7DIR
P7REN
P7DS
02h
04h
06h
08h
0Ah
01h
03h
05h
07h
09h
0Bh
Port P7 direction
Port P7 pullup/pulldown enable
Port P7 drive strength
Port P7 selection
P7SEL
P8IN
Port P8 input
Port P8 output
P8OUT
P8DIR
P8REN
P8DS
Port P8 direction
Port P8 pullup/pulldown enable
Port P8 drive strength
Port P8 selection
P8SEL
Table 9-32. Port P9 Register (Base Address: 0280h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P9 input
P9IN
00h
02h
04h
06h
08h
0Ah
Port P9 output
P9OUT
P9DIR
P9REN
P9DS
Port P9 direction
Port P9 pullup/pulldown enable
Port P9 drive strength
Port P9 selection
P9SEL
Table 9-33. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
02h
04h
06h
08h
Port PJ output
PJOUT
PJDIR
PJREN
PJDS
Port PJ direction
Port PJ pullup/pulldown enable
Port PJ drive strength
Table 9-34. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
02h
04h
06h
08h
0Ah
10h
12h
14h
16h
18h
1Ah
20h
2Eh
Capture/compare control 0
Capture/compare control 1
Capture/compare control 2
Capture/compare control 3
Capture/compare control 4
TA0 counter
TA0CCTL0
TA0CCTL1
TA0CCTL2
TA0CCTL3
TA0CCTL4
TA0R
Capture/compare 0
Capture/compare 1
Capture/compare 2
Capture/compare 3
Capture/compare 4
TA0 expansion 0
TA0CCR0
TA0CCR1
TA0CCR2
TA0CCR3
TA0CCR4
TA0EX0
TA0 interrupt vector
TA0IV
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Table 9-35. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
02h
04h
06h
10h
12h
14h
16h
20h
2Eh
Capture/compare control 0
Capture/compare control 1
Capture/compare control 2
TA1 counter
TA1CCTL0
TA1CCTL1
TA1CCTL2
TA1R
Capture/compare 0
Capture/compare 1
Capture/compare 2
TA1 expansion 0
TA1CCR0
TA1CCR1
TA1CCR2
TA1EX0
TA1 interrupt vector
TA1IV
Table 9-36. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
02h
04h
06h
08h
0Ah
0Ch
0Eh
10h
12h
14h
16h
18h
1Ah
1Ch
1Eh
20h
2Eh
Capture/compare control 0
Capture/compare control 1
Capture/compare control 2
Capture/compare control 3
Capture/compare control 4
Capture/compare control 5
Capture/compare control 6
TB0 counter
TB0CCTL0
TB0CCTL1
TB0CCTL2
TB0CCTL3
TB0CCTL4
TB0CCTL5
TB0CCTL6
TB0R
Capture/compare 0
TB0CCR0
TB0CCR1
TB0CCR2
TB0CCR3
TB0CCR4
TB0CCR5
TB0CCR6
TB0EX0
Capture/compare 1
Capture/compare 2
Capture/compare 3
Capture/compare 4
Capture/compare 5
Capture/compare 6
TB0 expansion 0
TB0 interrupt vector
TB0IV
Table 9-37. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
02h
04h
06h
10h
12h
14h
16h
20h
2Eh
Capture/compare control 0
Capture/compare control 1
Capture/compare control 2
TA2 counter
TA2CCTL0
TA2CCTL1
TA2CCTL2
TA2R
Capture/compare 0
Capture/compare 1
Capture/compare 2
TA2 expansion 0
TA2CCR0
TA2CCR1
TA2CCR2
TA2EX0
TA2 interrupt vector
TA2IV
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Table 9-38. Battery Backup Registers (Base Address: 0480h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Battery backup memory 0
Battery backup memory 1
Battery backup memory 2
Battery backup memory 3
Battery backup control
Battery charger control
BAKMEM0
00h
02h
04h
06h
1Ch
1Eh
BAKMEM1
BAKMEM2
BAKMEM3
BAKCTL
BAKCHCTL
Table 9-39. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
01h
02h
03h
08h
0Ah
0Ch
0Dh
0Eh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Eh
RTC control 1
RTCCTL1
RTCCTL2
RTCCTL3
RTCPS0CTL
RTCPS1CTL
RTCPS0
RTC control 2
RTC control 3
RTC prescaler 0 control
RTC prescaler 1 control
RTC prescaler 0
RTC prescaler 1
RTC interrupt vector word
RTC seconds
RTCPS1
RTCIV
RTCSEC
RTC minutes
RTCMIN
RTC hours
RTCHOUR
RTCDOW
RTCDAY
RTC day of week
RTC days
RTC month
RTCMON
RTCYEARL
RTCYEARH
RTCAMIN
RTCAHOUR
RTCADOW
RTCADAY
BIN2BCD
BCD2BIN
RTC year low
RTC year high
RTC alarm minutes
RTC alarm hours
RTC alarm day of week
RTC alarm days
Binary-to-BCD conversion
BCD-to-binary conversion
Table 9-40. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
02h
04h
06h
08h
0Ah
0Ch
0Eh
10h
12h
14h
16-bit operand 1 – signed multiply
16-bit operand 1 – multiply accumulate
16-bit operand 1 – signed multiply accumulate
16-bit operand 2
MPYS
MAC
MACS
OP2
16 × 16 result low word
RESLO
RESHI
16 × 16 result high word
16 × 16 sum extension
SUMEXT
MPY32L
MPY32H
MPYS32L
32-bit operand 1 – multiply low word
32-bit operand 1 – multiply high word
32-bit operand 1 – signed multiply low word
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Table 9-40. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
32-bit operand 1 – signed multiply high word
32-bit operand 1 – multiply accumulate low word
32-bit operand 1 – multiply accumulate high word
32-bit operand 1 – signed multiply accumulate low word
32-bit operand 1 – signed multiply accumulate high word
32-bit operand 2 – low word
MPYS32H
16h
18h
1Ah
1Ch
1Eh
20h
22h
24h
26h
28h
2Ah
2Ch
MAC32L
MAC32H
MACS32L
MACS32H
OP2L
32-bit operand 2 – high word
OP2H
32 × 32 result 0 – least significant word
32 × 32 result 1
RES0
RES1
32 × 32 result 2
RES2
32 × 32 result 3 – most significant word
MPY32 control 0
RES3
MPY32CTL0
Table 9-41. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA general control: DMA module control 0
DMACTL0
00h
02h
04h
06h
08h
0Ah
00h
02h
04h
06h
08h
0Ah
00h
02h
04h
06h
08h
0Ah
00h
02h
04h
06h
08h
0Ah
00h
02h
04h
06h
08h
DMA general control: DMA module control 1
DMA general control: DMA module control 2
DMA general control: DMA module control 3
DMA general control: DMA module control 4
DMA general control: DMA interrupt vector
DMA channel 0 control
DMACTL1
DMACTL2
DMACTL3
DMACTL4
DMAIV
DMA0CTL
DMA0SAL
DMA0SAH
DMA0DAL
DMA0DAH
DMA0SZ
DMA channel 0 source address low
DMA channel 0 source address high
DMA channel 0 destination address low
DMA channel 0 destination address high
DMA channel 0 transfer size
DMA channel 1 control
DMA1CTL
DMA1SAL
DMA1SAH
DMA1DAL
DMA1DAH
DMA1SZ
DMA channel 1 source address low
DMA channel 1 source address high
DMA channel 1 destination address low
DMA channel 1 destination address high
DMA channel 1 transfer size
DMA channel 2 control
DMA2CTL
DMA2SAL
DMA2SAH
DMA2DAL
DMA2DAH
DMA2SZ
DMA channel 2 source address low
DMA channel 2 source address high
DMA channel 2 destination address low
DMA channel 2 destination address high
DMA channel 2 transfer size
DMA channel 3 control
DMA3CTL
DMA3SAL
DMA3SAH
DMA3DAL
DMA3DAH
DMA channel 3 source address low
DMA channel 3 source address high
DMA channel 3 destination address low
DMA channel 3 destination address high
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
www.ti.com
Table 9-41. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 3 transfer size
DMA channel 4 control
DMA3SZ
0Ah
00h
02h
04h
06h
08h
0Ah
00h
02h
04h
06h
08h
0Ah
DMA4CTL
DMA4SAL
DMA4SAH
DMA4DAL
DMA4DAH
DMA4SZ
DMA channel 4 source address low
DMA channel 4 source address high
DMA channel 4 destination address low
DMA channel 4 destination address high
DMA channel 4 transfer size
DMA channel 5 control
DMA5CTL
DMA5SAL
DMA5SAH
DMA5DAL
DMA5DAH
DMA5SZ
DMA channel 5 source address low
DMA channel 5 source address high
DMA channel 5 destination address low
DMA channel 5 destination address high
DMA channel 5 transfer size
Table 9-42. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 0
UCA0CTL0
00h
01h
06h
07h
08h
0Ah
0Ch
0Eh
10h
12h
13h
1Ch
1Dh
1Eh
USCI control 1
UCA0CTL1
UCA0BR0
USCI baud rate 0
USCI baud rate 1
UCA0BR1
USCI modulation control
USCI status
UCA0MCTL
UCA0STAT
UCA0RXBUF
UCA0TXBUF
UCA0ABCTL
UCA0IRTCTL
UCA0IRRCTL
UCA0IE
USCI receive buffer
USCI transmit buffer
USCI LIN control
USCI IrDA transmit control
USCI IrDA receive control
USCI interrupt enable
USCI interrupt flags
USCI interrupt vector word
UCA0IFG
UCA0IV
Table 9-43. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 0
USCI synchronous control 1
USCI synchronous bit rate 0
USCI synchronous bit rate 1
USCI synchronous status
UCB0CTL0
00h
01h
06h
07h
0Ah
0Ch
0Eh
10h
12h
1Ch
1Dh
UCB0CTL1
UCB0BR0
UCB0BR1
UCB0STAT
UCB0RXBUF
UCB0TXBUF
UCB0I2COA
UCB0I2CSA
UCB0IE
USCI synchronous receive buffer
USCI synchronous transmit buffer
USCI I2C own address
USCI I2C slave address
USCI interrupt enable
USCI interrupt flags
UCB0IFG
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-43. USCI_B0 Registers (Base Address: 05E0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
OFFSET
USCI interrupt vector word
UCB0IV
1Eh
Table 9-44. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
USCI control 0
UCA1CTL0
00h
01h
06h
07h
08h
0Ah
0Ch
0Eh
10h
12h
13h
1Ch
1Dh
1Eh
USCI control 1
UCA1CTL1
UCA1BR0
USCI baud rate 0
USCI baud rate 1
UCA1BR1
USCI modulation control
USCI status
UCA1MCTL
UCA1STAT
UCA1RXBUF
UCA1TXBUF
UCA1ABCTL
UCA1IRTCTL
UCA1IRRCTL
UCA1IE
USCI receive buffer
USCI transmit buffer
USCI LIN control
USCI IrDA transmit control
USCI IrDA receive control
USCI interrupt enable
USCI interrupt flags
USCI interrupt vector word
UCA1IFG
UCA1IV
Table 9-45. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 0
USCI synchronous control 1
USCI synchronous bit rate 0
USCI synchronous bit rate 1
USCI synchronous status
UCB1CTL0
00h
01h
06h
07h
0Ah
0Ch
0Eh
10h
12h
1Ch
1Dh
1Eh
UCB1CTL1
UCB1BR0
UCB1BR1
UCB1STAT
UCB1RXBUF
UCB1TXBUF
UCB1I2COA
UCB1I2CSA
UCB1IE
USCI synchronous receive buffer
USCI synchronous transmit buffer
USCI I2C own address
USCI I2C slave address
USCI interrupt enable
USCI interrupt flags
UCB1IFG
USCI interrupt vector word
UCB1IV
Table 9-46. ADC12_A Registers (Base Address: 0700h)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC12 control 0
ADC12CTL0
00h
02h
04h
0Ah
0Ch
0Eh
10h
11h
12h
13h
ADC12 control 1
ADC12CTL1
ADC12CTL2
ADC12IFG
ADC12 control 2
Interrupt flag
Interrupt enable
ADC12IE
Interrupt vector word
ADC memory control 0
ADC memory control 1
ADC memory control 2
ADC memory control 3
ADC12IV
ADC12MCTL0
ADC12MCTL1
ADC12MCTL2
ADC12MCTL3
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
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Table 9-46. ADC12_A Registers (Base Address: 0700h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC memory control 4
ADC memory control 5
ADC memory control 6
ADC memory control 7
ADC memory control 8
ADC memory control 9
ADC memory control 10
ADC memory control 11
ADC memory control 12
ADC memory control 13
ADC memory control 14
ADC memory control 15
Conversion memory 0
Conversion memory 1
Conversion memory 2
Conversion memory 3
Conversion memory 4
Conversion memory 5
Conversion memory 6
Conversion memory 7
Conversion memory 8
Conversion memory 9
Conversion memory 10
Conversion memory 11
Conversion memory 12
Conversion memory 13
Conversion memory 14
Conversion memory 15
ADC12MCTL4
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
22h
24h
26h
28h
2Ah
2Ch
2Eh
30h
32h
34h
36h
38h
3Ah
3Ch
3Eh
ADC12MCTL5
ADC12MCTL6
ADC12MCTL7
ADC12MCTL8
ADC12MCTL9
ADC12MCTL10
ADC12MCTL11
ADC12MCTL12
ADC12MCTL13
ADC12MCTL14
ADC12MCTL15
ADC12MEM0
ADC12MEM1
ADC12MEM2
ADC12MEM3
ADC12MEM4
ADC12MEM5
ADC12MEM6
ADC12MEM7
ADC12MEM8
ADC12MEM9
ADC12MEM10
ADC12MEM11
ADC12MEM12
ADC12MEM13
ADC12MEM14
ADC12MEM15
Table 9-47. DAC12_A Registers (Base Address: 0780h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DAC12_A channel 0 control 0
DAC12_A channel 0 control 1
DAC12_A channel 0 data
DAC12_0CTL0
00h
02h
04h
06h
08h
10h
12h
14h
16h
18h
1Eh
DAC12_0CTL1
DAC12_0DAT
DAC12_A channel 0 calibration control
DAC12_A channel 0 calibration data
DAC12_A channel 1 control 0
DAC12_A channel 1 control 1
DAC12_A channel 1 data
DAC12_0CALCTL
DAC12_0CALDAT
DAC12_1CTL0
DAC12_1CTL1
DAC12_1DAT
DAC12_A channel 1 calibration control
DAC12_A channel 1 calibration data
DAC12_A interrupt vector word
DAC12_1CALCTL
DAC12_1CALDAT
DAC12IV
Table 9-48. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control 0
CBCTL0
00h
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-48. Comparator_B Registers (Base Address: 08C0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control 1
Comp_B control 2
Comp_B control 3
Comp_B interrupt
CBCTL1
02h
04h
06h
0Ch
0Eh
CBCTL2
CBCTL3
CBINT
CBIV
Comp_B interrupt vector word
Table 9-49. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USB key/ID
USBKEYID
00h
02h
04h
08h
0Ah
10h
12h
14h
USB module configuration
USB PHY control
USBCNF
USBPHYCTL
USBPWRCTL
USBPWRVSR
USBPLLCTL
USBPLLDIV
USBPLLIR
USB power control
USB power voltage setting
USB PLL control
USB PLL divider
USB PLL interrupts
Table 9-50. USB Control Registers (Base Address: 0920h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Input endpoint_0 configuration
Input endpoint_0 byte count
Output endpoint_0 configuration
Output endpoint_0 byte count
Input endpoint interrupt enables
Output endpoint interrupt enables
Input endpoint interrupt flags
Output endpoint interrupt flags
USB interrupt vector
USBIEPCNF_0
00h
01h
02h
03h
0Eh
0Fh
10h
11h
12h
16h
18h
1Ah
1Ch
1Dh
1Eh
1Fh
USBIEPCNT_0
USBOEPCNF_0
USBOEPCNT_0
USBIEPIE
USBOEPIE
USBIEPIFG
USBOEPIFG
USBIV
USB maintenance
USBMAINT
USBTSREG
USBFN
Timestamp
USB frame number
USB control
USBCTL
USB interrupt enables
USB interrupt flags
USBIE
USBIFG
Function address
USBFUNADR
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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9.13 Input/Output Diagrams
9.13.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
Figure 9-2 shows the pin diagram. Table 9-51 summarizes how to select the pin function.
Pad Logic
P1REN.x
DVSS
DVCC
0
1
1
Direction
0: Input
1: Output
P1DIR.x
P1OUT.x
0
1
Module X OUT
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
P1.5/TA0.4
P1.6/TA0.1
P1.7/TA0.2
EN
D
Module X IN
P1IRQ.x
P1IE.x
EN
Q
P1IFG.x
Set
P1SEL.x
P1IES.x
Interrupt
Edge
Select
Figure 9-2. Port P1 (P1.0 to P1.7) Diagram
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-51. Port P1 (P1.0 to P1.7) Pin Functions
CONTROL BITS OR SIGNALS
FUNCTION
PIN NAME (P1.x)
x
P1DIR.x
P1SEL.x
P1.0 (I/O)
I: 0; O: 1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
P1.0/TA0CLK/ACLK
P1.1/TA0.0
0
Timer TA0.TA0CLK
ACLK
0
1
P1.1 (I/O)
I: 0; O: 1
1
2
3
4
5
6
7
Timer TA0.CCI0A capture input
Timer TA0.0 output
P1.2 (I/O)
0
1
I: 0; O: 1
P1.2/TA0.1
Timer TA0.CCI1A capture input
Timer TA0.1 output
P1.3 (I/O)
0
1
I: 0; O: 1
P1.3/TA0.2
Timer TA0.CCI2A capture input
Timer TA0.2 output
P1.4 (I/O)
0
1
I: 0; O: 1
P1.4/TA0.3
Timer TA0.CCI3A capture input
Timer TA0.3 output
P1.5 (I/O)
0
1
I: 0; O: 1
P1.5/TA0.4
Timer TA0.CCI4A capture input
Timer TA0.4 output
P1.6 (I/O)
0
1
I: 0; O: 1
P1.6/TA0.1
Timer TA0.CCI1B capture input
Timer TA0.1 output
P1.7 (I/O)
0
1
I: 0; O: 1
P1.7/TA0.2
Timer TA0.CCI2B capture input
Timer TA0.2 output
0
1
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
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9.13.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
Figure 9-3 shows the pin diagram. Table 9-52 summarizes how to select the pin function.
Pad Logic
P2REN.x
DVSS
DVCC
0
1
1
P2DIR.x
0
1
Direction
0: Input
1: Output
From Port Mapping
P2OUT.x
0
1
From Port Mapping
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
D
To Port Mapping
P2IRQ.x
P2IE.x
EN
Q
P2IFG.x
Set
P2SEL.x
P2IES.x
Interrupt
Edge
Select
Figure 9-3. Port P2 (P2.0 to P2.7) Diagram
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-52. Port P2 (P2.0 to P2.7) Pin Functions
CONTROL BITS OR SIGNALS(1)
FUNCTION
PIN NAME (P2.x)
x
0
1
2
3
4
5
6
7
P2DIR.x
P2SEL.x
P2MAPx
P2.0 (I/O)
I: 0; O: 1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6
P2.7/P2MAP7
Mapped secondary digital function
P2.1 (I/O)
X
≤ 19
I: 0; O: 1
Mapped secondary digital function
P2.2 (I/O)
X
≤ 19
I: 0; O: 1
Mapped secondary digital function
P2.3 (I/O)
X
≤ 19
I: 0; O: 1
Mapped secondary digital function
P2.4 (I/O)
X
≤ 19
I: 0; O: 1
Mapped secondary digital function
P2.5 (I/O
X
≤ 19
I: 0; O: 1
Mapped secondary digital function
P2.6 (I/O)
X
I: 0; O: 1
X
≤ 19
Mapped secondary digital function
P2.7 (I/O)
≤ 19
I: 0; O: 1
X
Mapped secondary digital function
≤ 19
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
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9.13.3 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
Figure 9-4 shows the pin diagram. Table 9-53 summarizes how to select the pin function.
Pad Logic
P3REN.x
DVSS
DVCC
0
1
1
Direction
0: Input
1: Output
P3DIR.x
P3OUT.x
0
1
Module X OUT
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
P3.2/TA1.1
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
P3.3/TA1.2
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
P3.6/TA2.1
EN
D
P3.7/TA2.2
Module X IN
P3IRQ.x
P3IE.x
EN
Q
P3IFG.x
Set
P3SEL.x
P3IES.x
Interrupt
Edge
Select
Figure 9-4. Port P3 (P3.0 to P3.7) Diagram
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-53. Port P3 (P3.0 to P3.7) Pin Functions
CONTROL BITS OR SIGNALS
FUNCTION
PIN NAME (P3.x)
x
P3DIR.x
P3SEL.x
P3.0 (I/O)
I: 0; O: 1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
P3.0/TA1CLK/CBOUT
P3.1/TA1.0
0
Timer TA1.TA1CLK
CBOUT
0
1
P3.1 (I/O)
I: 0; O: 1
1
2
3
4
5
6
7
Timer TA1.CCI0A capture input
Timer TA1.0 output
P3.2 (I/O)
0
1
I: 0; O: 1
P3.2/TA1.1
Timer TA1.CCI1A capture input
Timer TA1.1 output
P3.3 (I/O)
0
1
I: 0; O: 1
P3.3/TA1.2
Timer TA1.CCI2A capture input
Timer TA1.2 output
P3.4 (I/O)
0
1
I: 0; O: 1
P3.4/TA2CLK/SMCLK
P3.5/TA2.0
Timer TA2.TA2CLK
SMCLK
0
1
P3.5 (I/O)
I: 0; O: 1
Timer TA2.CCI0A capture input
Timer TA2.0 output
P3.6 (I/O)
0
1
I: 0; O: 1
P3.6/TA2.1
Timer TA2.CCI1A capture input
Timer TA2.1 output
P3.7 (I/O)
0
1
I: 0; O: 1
P3.7/TA2.2
Timer TA2.CCI2A capture input
Timer TA2.2 output
0
1
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
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9.13.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
Figure 9-5 shows the pin diagram. Table 9-54 summarizes how to select the pin function.
Pad Logic
P4REN.x
DVSS
DVCC
0
1
1
Direction
0: Input
1: Output
P4DIR.x
P4OUT.x
0
1
Module X OUT
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
P4.3/TB0.3
P4.4/TB0.4
P4.5/TB0.5
P4.6/TB0.6
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
D
P4.7/TB0OUTH/SVMOUT
Module X IN
P4IRQ.x
P4IE.x
EN
Q
P4IFG.x
Set
P4SEL.x
P4IES.x
Interrupt
Edge
Select
Figure 9-5. Port P4 (P4.0 to P4.7) Diagram
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-54. Port P4 (P4.0 to P4.7) Pin Functions
CONTROL BITS OR SIGNALS
FUNCTION
PIN NAME (P4.x)
x
P4DIR.x
P4SEL.x
P4.0 (I/O)
I: 0; O: 1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
0
1
1
P4.0/TB0.0
0
Timer TB0.CCI0A capture input
Timer TB0.0 output(1)
P4.1 (I/O)
0
1
I: 0; O: 1
P4.1/TB0.1
1
2
3
4
5
6
7
Timer TB0.CCI1A capture input
Timer TB0.1 output(1)
P4.2 (I/O)
0
1
I: 0; O: 1
P4.2/TB0.2
Timer TB0.CCI2A capture input
Timer TB0.2 output(1)
P4.3 (I/O)
0
1
I: 0; O: 1
P4.3/TB0.3
Timer TB0.CCI3A capture input
Timer TB0.3 output(1)
P4.4 (I/O)
0
1
I: 0; O: 1
P4.4/TB0.4
Timer TB0.CCI4A capture input
Timer TB0.4 output(1)
P4.5 (I/O)
0
1
I: 0; O: 1
P4.5/TB0.5
Timer TB0.CCI5A capture input
Timer TB0.5 output(1)
P4.6 (I/O)
0
1
I: 0; O: 1
P4.6/TB0.6
Timer TB0.CCI6A capture input
Timer TB0.6 output(1)
P4.7 (I/O)
0
1
I: 0; O: 1
P4.7/TB0OUTH/ SVMOUT
Timer TB0.TB0OUTH
SVMOUT
0
1
(1) Setting TB0OUTH causes all Timer_B configured outputs to be set to high impedance.
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9.13.5 Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
Figure 9-6 shows the pin diagram. Table 9-55 summarizes how to select the pin function.
Pad Logic
To/From
Reference
P5REN.x
DVSS
DVCC
0
1
1
P5DIR.x
0
1
P5OUT.x
0
1
Module X OUT
P5.0/VREF+/VeREF+
P5.1/VREF–/VeREF–
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
D
Module X IN
Figure 9-6. Port P5 (P5.0 and P5.1) Diagram
Table 9-55. Port P5 (P5.0 and P5.1) Pin Functions
CONTROL BITS OR SIGNALS(1)
PIN NAME (P5.x)
x
FUNCTION
P5DIR.x
P5SEL.x
REFOUT
P5.0 (I/O)(2)
VeREF+(3)
VREF+(4)
I: 0; O: 1
0
1
1
0
1
1
X
0
1
X
0
1
P5.0/VREF+/VeREF+
0
X
X
P5.1 (I/O)(2)
VeREF-(5)
VREF-(6)
I: 0; O: 1
P5.1/VREF-/VeREF-
1
X
X
(1) X = Don't care
(2) Default condition
(3) Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
(4) Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A VREF+ reference is available at the pin.
(5) Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
(6) Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A VREF- reference is available at the pin.
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9.13.6 Port P5 (P5.2 to P5.7) Input/Output With Schmitt Trigger
Figure 9-7 shows the pin diagram. Table 9-56 summarizes how to select the pin function.
Pad Logic
P5REN.x
DVSS
DVCC
0
1
1
Direction
0: Input
1: Output
P5DIR.x
P5OUT.x
0
1
Module X OUT
P5.2
P5.3
P5.4
P5.5
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
P5.6/ADC12CLK/DMAE0
P5.7/RTCCLK
EN
D
Module X IN
Figure 9-7. Port P5 (P5.2 to P5.7) Diagram
Table 9-56. Port P5 (P5.2 to P5.7) Pin Functions
CONTROL BITS OR SIGNALS
PIN NAME (P5.x)
x
FUNCTION
P5DIR.x
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
1
P5SEL.x
P5.2
P5.3
P5.4
P5.5
2
3
4
5
P5.2 (I/O)
P5.3 (I/O)
P5.4 (I/O)
P5.5 (I/O)
P5.6 (I/O)
ADC12CLK
DMAE0
0
0
0
0
0
1
1
0
1
P5.6/ADC12CLK/DMAE0
P5.7/RTCCLK
6
7
0
P5.7 (I/O)
RTCCLK
I: 0; O: 1
1
9.13.7 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
Figure 9-8 shows the pin diagram. Table 9-57 summarizes how to select the pin function.
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Pad Logic
To ADC12
INCHx = y
0
Dvss
1
2
0 if DAC12AMPx=0
1 if DAC12AMPx=1
2 if DAC12AMPx>1
From DAC12_A
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
P6REN.x
DVSS
DVCC
0
1
1
P6DIR.x
P6OUT.x
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
Bus
Keeper
Figure 9-8. Port P6 (P6.0 to P6.7) Diagram
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
Table 9-57. Port P6 (P6.0 to P6.7) Pin Functions
CONTROL BITS OR SIGNALS(1)
FUNCTION
PIN NAME (P6.x)
x
P6DIR.x
P6SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
P6.0 (I/O)
CB0
I: 0; O: 1
0
X
1
0
X
1
0
X
1
0
X
1
0
X
1
0
X
1
0
X
1
X
0
X
1
X
0
1
X
0
1
X
0
1
X
0
1
X
0
1
X
0
1
X
0
1
X
X
0
1
X
X
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
X
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
0
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
0
X
A0(1) (2)
P6.1 (I/O)
CB1
X
I: 0; O: 1
1
2
3
4
5
X
A1(1) (2)
P6.2 (I/O)
CB2
X
I: 0; O: 1
X
A2(1) (2)
P6.3 (I/O)
CB3
X
I: 0; O: 1
X
A3(1) (2)
P6.4 (I/O)
CB4
X
I: 0; O: 1
X
A4(1) (2)
P6.5 (I/O)
CB5
X
I: 0; O: 1
X
A5 (1) (2)
P6.6 (I/O)
CB6
X
I: 0; O: 1
X
X
0
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
6
7
A6(1) (2)
X
X
0
DAC0
X
0
>1
0
P6.7 (I/O)
CB7
I: 0; O: 1
X
X
X
X
X
0
A7(1) (2)
X
0
DAC1
0
>1
(1) Setting the P6SEL.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
(2) The ADC12_A channel Ax is connected internally to AVSS if not selected by the respective INCHx bits.
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9.13.8 Port P7 (P7.2) Input/Output With Schmitt Trigger
Figure 9-9 shows the pin diagram. Table 9-58 summarizes how to select the pin function.
Pad Logic
To XT2
P7REN.2
DVSS
DVCC
0
1
1
P7DIR.2
P7OUT.2
0
1
P7.2/XT2IN
P7DS.2
0: Low drive
1: High drive
P7SEL.2
P7IN.2
Bus
Keeper
Figure 9-9. Port P7 (P7.2) Diagram
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SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
9.13.9 Port P7 (P7.3) Input/Output With Schmitt Trigger
Figure 9-10 shows the pin diagram. Table 9-58 summarizes how to select the pin function.
Pad Logic
To XT2
P7REN.3
DVSS
DVCC
0
1
1
P7DIR.3
0
1
P7OUT.3
P7SEL.2
P7.3/XT2OUT
P7DS.3
0: Low drive
1: High drive
XT2BYPASS
P7SEL.3
P7IN.3
Bus
Keeper
Figure 9-10. Port P7 (P7.3) Diagram
Table 9-58. Port P7 (P7.2 and P7.3) Pin Functions
CONTROL BITS OR SIGNALS(1)
PIN NAME (P5.x)
x
FUNCTION
P7DIR.x
P7SEL.2
P7SEL.3
XT2BYPASS
P7.2 (I/O)
I: 0; O: 1
0
1
1
0
1
1
X
X
X
0
X
0
1
X
0
1
P7.2/XT2IN
2
XT2IN crystal mode(1)
XT2IN bypass mode(1)
P7.3 (I/O)
X
X
I: 0; O: 1
P7.3/XT2OUT
3
XT2OUT crystal mode(2)
P7.3 (I/O)(2)
X
X
X
0
(1) Setting P7SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P7.2 is configured for crystal
mode or bypass mode.
(2) Setting P7SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P7.3 can be used as
general-purpose I/O.
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9.13.10 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
Figure 9-11 shows the pin diagram. Table 9-59 summarizes how to select the pin function.
0
Pad Logic
DVSS
1
2
0 if DAC12AMPx = 0
1 if DAC12AMPx = 1
2 if DAC12AMPx > 1
From DAC12_A
To ADC12
INCHx = y
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
P7REN.x
P7SEL.x
P7DIR.x
DVSS
DVCC
0
1
1
P7OUT.x
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P7DS.x
0: Low drive
1: High drive
P7IN.x
Bus
Keeper
Figure 9-11. Port P7 (P7.4 to P7.7) Diagram
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Table 9-59. Port P7 (P7.4 to P7.7) Pin Functions
CONTROL BITS OR SIGNALS(1)
FUNCTION
PIN NAME (P7.x)
x
P7DIR.x
P7SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
P7.4 (I/O)
I: 0; O: 1
0
X
1
0
X
1
0
X
1
X
0
X
1
X
0
1
X
0
1
X
0
1
X
X
0
1
X
X
n/a
n/a
n/a
n/a
n/a
n/a
X
n/a
n/a
n/a
n/a
n/a
n/a
0
P7.4/CB8/A12
P7.5/CB9/A13
4
Comparator_B input CB8
A12(1) (2)
X
X
P7.5 (I/O)
I: 0; O: 1
5
6
Comparator_B input CB9
A13(1) (2)
X
X
P7.6 (I/O)
I: 0; O: 1
Comparator_B input CB10
A14(1) (2)
X
X
0
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
X
X
0
DAC12_A output DAC0
P7.7 (I/O)
X
1
>1
0
I: 0; O: 1
X
Comparator_B input CB11
A15(1) (2)
X
X
X
X
0
7
X
0
DAC12_A output DAC1
1
>1
(1) Setting the P7SEL.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
(2) The ADC12_A channel Ax is connected internally to AVSS if not selected by the respective INCHx bits.
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9.13.11 Port P8 (P8.0 to P8.7) Input/Output With Schmitt Trigger
Figure 9-12 shows the pin diagram. Table 9-60 summarizes how to select the pin function.
Pad Logic
P8REN.x
DVSS
DVCC
0
1
1
P8DIR.x
0
1
Direction
0: Input
1: Output
From module
0
1
P8OUT.x
Module X OUT
P8.0/TB0CLK
P8DS.x
0: Low drive
1: High drive
P8.1/UCB1STE/UCA1CLK
P8.2/UCA1TXD/UCA1SIMO
P8.3/UCA1RXD/UCA1SOMI
P8.4/UCB1CLK/UCA1STE
P8.5/UCB1SIMO//UCB1SDA
P8.6/UCB1SOMI/UCB1SCL
P8.7
P8SEL.x
P8IN.x
EN
D
Module X IN
Figure 9-12. Port P8 (P8.0 to P8.7) Diagram
Table 9-60. Port P8 (P8.0 to P8.7) Pin Functions
CONTROL BITS OR
SIGNALS(1)
PIN NAME (P9.x)
x
FUNCTION
P8DIR.x
P8SEL.x
P8.0 (I/O)
I: 0; O: 1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
P8.0/TB0CLK
0
1
2
3
4
5
Timer TB0.TB0CLK clock input
P8.1 (I/O)
0
I: 0; O: 1
X
P8.1/UCB1STE/UCA1CLK
P8.2/UCA1TXD/UCA1SIMO
P8.3/UCA1RXD/UCA1SOMI
P8.4/UCB1CLK/UCA1STE
P8.5/UCB1SIMO/UCB1SDA
UCB1STE/UCA1CLK
P8.2 (I/O)
I: 0; O: 1
X
UCA1TXD/UCA1SIMO
P8.3 (I/O)
I: 0; O: 1
X
UCA1RXD/UCA1SOMI
P8.4 (I/O)
I: 0; O: 1
X
UCB1CLK/UCA1STE
P8.5 (I/O)
I: 0; O: 1
X
UCB1SIMO/UCB1SDA
P8.6 (I/O)
I: 0; O: 1
X
P8.6/UCB1SOMI/UCB1SCL
P8.7
6
7
UCB1SOMI/UCB1SCL
P8.7 (I/O)
I: 0; O: 1
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9.13.12 Port P9 (P9.0 to P9.7) Input/Output With Schmitt Trigger
Figure 9-13 shows the pin diagram. Table 9-61 summarizes how to select the pin function.
Pad Logic
P9REN.x
0
1
DVSS
DVCC
1
Direction
0: Input
1: Output
P9DIR.x
P9OUT.x
P9.0
P9.1
P9.2
P9.3
P9.4
P9.5
P9.6
P9.7
P9DS.x
0: Low drive
1: High drive
P9IN.x
Figure 9-13. Port P9 (P9.0 to P9.7) Diagram
Table 9-61. Port P9 (P9.0 to P9.7) Pin Functions
CONTROL BITS OR SIGNALS
PIN NAME (P9.x)
x
FUNCTION
P9DIR.x
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
I: 0; O: 1
P9SEL.x
P9.0
0
1
2
3
4
5
6
7
P9.0 (I/O)
P9.1 (I/O)
P9.2 (I/O)
P9.3 (I/O)
P9.4 (I/O)
P9.5 (I/O)
P9.6 (I/O)
P9.7 (I/O)
0
0
0
0
0
0
0
0
P9.1
P9.2
P9.3
P9.4
P9.5
P9.6
P9.7
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9.13.13 Port PU (PU.0/DP, PU.1/DM, PUR) USB Ports
Figure 9-14 shows the pin diagram. Table 9-62 summarizes how to select the pin function.
PUSEL
VUSB
VSSU
Pad Logic
PUOPE
0
1
USB output enable
PUOUT0
0
1
PU.0/DP
USB DP output
PUIN0
USB DP input
PUIPE
PUIN1
USB DM input
PUOUT1
0
1
PU.1/DM
USB DM output
VUSB
VSSU
Pad Logic
PUREN
PUR
“1”
PUSEL
PURIN
Figure 9-14. Port PU (PU.0 and PU.1) Diagram
Table 9-62. Port PU.0/DP and PU.1/DM Output Functions
CONTROL BITS
PIN NAME
FUNCTION
PUSEL
PUDIR
PUOUT1
PUOUT0
PU.1/DM
PU.0/DP
0
0
0
0
0
1
0
1
1
1
1
X
X
0
0
1
1
X
X
0
1
0
1
X
Hi-Z
0
Hi-Z
0
Outputs off
Outputs enabled
Outputs enabled
Outputs enabled
Outputs enabled
0
1
1
0
1
1
DM
DP
Direction set by USB module
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Table 9-63. Port PUR Input Functions
CONTROL BITS
FUNCTION
PUSEL
PUREN
Input disabled
Pullup disabled
0
0
1
1
0
Input disabled
Pullup enabled
1
0
1
Input enabled
Pullup disabled
Input enabled
Pullup enabled
9.13.14 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
Figure 9-15 shows the pin diagram. Table 9-64 summarizes how to select the pin function.
Pad Logic
PJREN.0
0
1
DVSS
DVCC
1
PJDIR.0
DVCC
0
1
PJOUT.0
0
1
From JTAG
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
Figure 9-15. Port J (PJ.0) Diagram
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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9.13.15 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or
Output
Figure 9-16 shows the pin diagram. Table 9-64 summarizes how to select the pin function.
Pad Logic
PJREN.x
0
1
DVSS
DVCC
1
PJDIR.x
DVSS
0
1
PJOUT.x
0
1
From JTAG
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJDS.x
0: Low drive
1: High drive
From JTAG
PJIN.x
EN
D
To JTAG
Figure 9-16. Port PJ (PJ.1 to PJ.3) Diagram
Table 9-64. Port PJ (PJ.0 to PJ.3) Pin Functions
CONTROL BITS
OR SIGNALS(1)
PIN NAME (PJ.x)
x
FUNCTION
PJDIR.x
I: 0; O: 1
X
PJ.0 (I/O)(1)
PJ.0/TDO
0
1
2
3
TDO(2)
PJ.1 (I/O)(1)
TDI/TCLK(2) (3)
PJ.2 (I/O)(1)
TMS(2) (3)
I: 0; O: 1
X
PJ.1/TDI/TCLK
PJ.2/TMS
I: 0; O: 1
X
PJ.3 (I/O)(1)
TCK(2) (3)
I: 0; O: 1
X
PJ.3/TCK
(1) Default condition
(2) The pin direction is controlled by the JTAG module.
(3) In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are don't care.
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9.14 Device Descriptors
Table 9-65 list the contents of the device descriptor tag-length-value (TLV) structure.
Table 9-65. MSP430F563x Device Descriptor Table
VALUE
SIZE
(bytes)
DESCRIPTION(1)
Info length
ADDRESS
F5638
06h
F5637
06h
F5636
06h
F5635
06h
F5634
06h
F5633
06h
F5632
06h
F5631
06h
F5630
06h
01A00h
01A01h
01A02h
01A04h
01A06h
01A07h
01A08h
01A09h
01A0Ah
01A0Eh
01A10h
01A12h
01A14h
01A15h
01A16h
01A18h
1
1
2
2
1
1
1
1
4
2
2
2
1
1
2
2
CRC length
CRC value
06h
06h
06h
06h
06h
06h
06h
06h
06h
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
8014h 8012h 8010h 800Eh 8044h 8042h 8040h 803Eh 803Ch
Info Block
Device ID
Hardware revision
Firmware revision
Die record tag
Die record length
Lot/wafer ID
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
08h
0Ah
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Die Record
Die X position
Die Y position
Test results
ADC12 calibration tag
ADC12 calibration length
ADC gain factor
ADC offset
11h
10h
11h
10h
11h
10h
11h
10h
11h
10h
11h
10h
11h
10h
11h
10h
11h
10h
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
ADC 1.5-V reference
temp. l 30°C
01A1Ah
01A1Ch
01A1Eh
01A20h
01A22h
01A24h
2
2
2
2
2
2
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit Per unit
ADC 1.5-V reference
Temperature sensor 85°C
ADC12
Calibration
ADC 2.0-V reference
Temperature sensor 30°C
ADC 2.0-V reference
Temperature sensor 85°C
ADC 2.5-V reference
Temperature sensor 30°C
ADC 2.5-V reference
Temperature sensor 85°C
(1) NA = Not applicable
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10 Device and Documentation Support
10.1 Getting Started and Next Steps
For more information on the MSP430™ family of devices and the tools and libraries that are available to help with
your development, visit the MSP430 ultra-low-power sensing & measurement MCUs overview.
10.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP
MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These
prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully
qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
XMS devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated
fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.
TI recommends that these devices not be used in any production system because their expected end-use failure
rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature
range, package type, and distribution format. Figure 10-1 provides a legend for reading the complete device
name.
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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MSP 430 F 5 438 A I PM T -EP
Processor Family
MCU Platform
Device Type
Series
Feature Set
Optional: Additional Features
Optional: Tape and Reel
Packaging
Optional: Temperature Range
Optional: Revision
Processor Family
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
MCU Platform
Device Type
430 = MSP430 low-power microcontroller platform
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash
L = No nonvolatile memory
Specialized Application
AFE = Analog front end
BQ = Contactless power
CG = ROM medical
FE = Flash energy meter
FG = Flash medical
FW = Flash electronic flow meter
Series
1 = Up to 8 MHz
2 = Up to 16 MHz
3 = Legacy
4 = Up to 16 MHz with LCD driver
5 = Up to 25 MHz
6 = Up to 25 MHz with LCD driver
0 = Low-voltage series
Feature Set
Various levels of integration within a series
Updated version of the base part number
Optional: Revision
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small reel
R = Large reel
No markings = Tube or tray
Optional: Additional Features -EP = Enhanced product (–40°C to 105°C)
-HT = Extreme temperature parts (–55°C to 150°C)
-Q1 = Automotive Q100 qualified
Figure 10-1. Device Nomenclature
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MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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10.3 Tools and Software
All MSP microcontrollers are supported by a wide variety of software and hardware development tools. Tools are
available from TI and various third parties. See them all at MSP430 ultra-low-power MCUs – Design &
development.
Table 10-1 lists the debug features of the MSP430F563x MCUs. See the Code Composer Studio™ IDE for
MSP430™ MCUs User's Guide for details on the available features.
Table 10-1. Hardware Debug Features
BREAK-
POINTS
(N)
RANGE
BREAK-
POINTS
LPMx.5
DEBUGGING
SUPPORT
MSP430
ARCHITECTURE
4-WIRE
JTAG
2-WIRE
JTAG
CLOCK
CONTROL SEQUENCER
STATE
TRACE
BUFFER
MSP430Xv2
Yes
Yes
8
Yes
Yes
Yes
Yes
No
Design Kits and Evaluation Modules
MSP-TS430PZ100USB - 100-pin Target Development Board for MSP430F5x and MSP430F6x MCUs
The MSP-TS430PZ100USB is a stand-alone 100-pin ZIF socket target board used to program and debug the
MSP430 MCU in-system through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol.
100-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x and MSP430F6x MCUs
The MSP-FET is a powerful flash emulation tool to quickly begin application development on the MSP430 MCU.
It includes USB debugging interface used to program and debug the MSP430 in-system through the JTAG
interface or the pin saving Spy Bi-Wire (2-wire JTAG) protocol. The flash memory can be erased and
programmed in seconds with only a few keystrokes, and because the MSP430 flash is ultra-low power, no
external power supply is required.
Software
MSP430Ware™ Software
MSP430Ware software is a collection of code examples, data sheets, and other design resources for all
MSP430 devices delivered in a convenient package. In addition to providing a complete collection of existing
MSP430 design resources, MSP430Ware software also includes a high-level API called MSP430 Driver Library.
This library makes it easy to program MSP430 hardware. MSP430Ware software is available as a component of
CCS or as a stand-alone package.
MSP430F563x, MSP430F663x Code Examples
C code examples are available for every MSP device that configures each of the integrated peripherals for
various application needs.
MSP Driver Library
Driver Library's abstracted API keeps you above the bits and bytes of the MSP430 hardware by providing easy-
to-use function calls. Thorough documentation is delivered through a helpful API Guide, which includes details
on each function call and the recognized parameters. Developers can use Driver Library functions to write
complete projects with minimal overhead.
MSP EnergyTrace™ Technology
EnergyTrace technology for MSP430 microcontrollers is an energy-based code analysis tool that measures and
displays the application's energy profile and helps to optimize it for ultra-low-power consumption.
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ULP (Ultra-Low Power) Advisor
ULP Advisor™ software is a tool for guiding developers to write more efficient code to fully utilize the unique
ultra-low power features of MSP and MSP432 microcontrollers. Aimed at both experienced and new
microcontroller developers, ULP Advisor checks your code against a thorough ULP checklist to squeeze every
last nano amp out of your application. At build time, ULP Advisor will provide notifications and remarks to
highlight areas of your code that can be further optimized for lower power.
IEC 60730 Software Package
The IEC 60730 MSP430 software package was developed to be useful in assisting customers in complying with
IEC 60730-1:2010 (Automatic Electrical Controls for Household and Similar Use – Part 1: General
Requirements) for up to Class B products, which includes home appliances, arc detectors, power converters,
power tools, e-bikes, and many others. The IEC 60730 MSP430 software package can be embedded in
customer applications running on MSP430s to help simplify the customer’s certification efforts of functional
safety-compliant consumer devices to IEC 60730-1:2010 Class B.
Fixed Point Math Library for MSP
The MSP IQmath and Qmath Libraries are a collection of highly optimized and high-precision mathematical
functions for C programmers to seamlessly port a floating-point algorithm into fixed-point code on MSP430
MCUs. These routines are typically used in computationally intensive real-time applications where optimal
execution speed, high accuracy, and ultra-low energy are critical. By using the IQmath and Qmath libraries, it is
possible to achieve execution speeds considerably faster and energy consumption considerably lower than
equivalent code written using floating-point math.
Floating Point Math Library for MSP430
Continuing to innovate in the low-power and low-cost microcontroller space, TI brings you MSPMATHLIB.
Leveraging the intelligent peripherals of our devices, this floating point math library of scalar functions brings you
up to 26x better performance. Mathlib is easy to integrate into your designs. This library is free and is integrated
in both Code Composer Studio and IAR IDEs. Read the user’s guide for an in depth look at the math library and
relevant benchmarks.
Development Tools
Code Composer Studio™ Integrated Development Environment for MSP Microcontrollers
The Code Composer Studio integrated development environment (IDE) supports all MSP microcontroller
devices. The Code Composer Studio IDE comprises a suite of embedded software utilities used to develop and
debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build
environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface
taking you through each step of the application development flow. Familiar utilities and interfaces allow users to
get started faster than ever before. The Code Composer Studio IDE combines the advantages of the Eclipse
software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich
development environment for embedded developers. When using the Code Composer Studio IDE with an
MSP430 MCU, a unique and powerful set of plugins and embedded software utilities are made available to fully
leverage the MSP430 microcontroller.
Command-Line Programmer
MSP Flasher is an open-source shell-based interface for programming MSP microcontrollers through a FET
programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP Flasher can download binary
files (.txt or .hex) files directly to the MSP microcontroller without an IDE.
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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MSP MCU Programmer and Debugger
The MSP-FET is a powerful emulation development tool – often called a debug probe – that lets users quickly
begin application development on MSP low-power microcontrollers (MCU). Creating MCU software usually
requires downloading the resulting binary program to the MSP device for validation and debugging. The MSP-
FET provides a debug communication pathway between a host computer and the target MSP. Furthermore, the
MSP-FET also provides a Backchannel UART connection between the computer's USB interface and the MSP
UART. This gives the MSP programmer a convenient method to communicate serially between the MSP and a
terminal running on the computer. It also supports loading programs (often called firmware) to the MSP target
using the BSL (bootloader) through the UART and I2C communication protocols.
MSP-GANG Production Programmer
The MSP Gang Programmer is a device programmer that can program up to eight identical MSP430 or MSP432
flash or FRAM devices at the same time. The MSP Gang Programmer connects to a host PC using a standard
RS-232 or USB connection and provides flexible programming options that allow the user to fully customize the
process. The MSP Gang Programmer is provided with an expansion board, called the Gang Splitter, that
implements the interconnections between the MSP Gang Programmer and multiple target devices. Eight cables
are provided that connect the expansion board to eight target devices (through JTAG or Spy-Bi-Wire
connectors). The programming can be done with a PC or as a stand-alone device. A PC-side graphical user
interface is also available and is DLL-based.
10.4 Documentation Support
The following documents describe the MSP430F563x MCUs. Copies of these documents are available on the
Internet at www.ti.com.
Receiving Notification of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for your
device on ti.com (for links to the product folders, see Section 10.5). In the upper right corner, click the "Alert me"
button. This registers you to receive a weekly digest of product information that has changed (if any). For change
details, check the revision history of any revised document.
Errata
MSP430F5638 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5637 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5636 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5635 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5634 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5633 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5632 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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MSP430F5631 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
MSP430F5630 Device Erratasheet
Describes the known exceptions to the functional specifications for this device.
User's Guides
MSP430x5xx and MSP430x6xx Family User's Guide
Detailed information on the modules and peripherals available in this device family.
IAR Embedded Workbench IDE for MSP430 MCUs User's Guide
This manual describes the use of IAR Embedded Workbench (EW430) with the MSP430 ultra-low-power
microcontrollers.
MSP430™ Flash Devices Bootloader (BSL) User's Guide
The MSP430 BSL lets users communicate with embedded memory in the MSP430 microcontroller during the
prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data
memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs
found in some digital signal processors (DSPs) that automatically load program code (and data) from external
memory to the internal memory of the DSP.
MSP430 Programming With the JTAG Interface
This document describes the functions that are required to erase, program, and verify the memory module of the
MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition,
it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This
document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG
interface, which is also referred to as Spy-Bi-Wire (SBW).
MSP430 Hardware Tools User's Guide
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the
program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the
parallel port interface and the USB interface, are described.
Application Reports
MSP430 32-kHz Crystal Oscillators
Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal
oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the
correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout
are given. The document also contains detailed information on the possible oscillator tests to ensure stable
oscillator operation in mass production.
MSP430 System-Level ESD Considerations
System-level ESD has become increasingly demanding with silicon technology scaling towards lower voltages
and the need for designing cost-effective and ultra-low-power components. This application report addresses
three different ESD topics to help board designers and OEMs understand and design robust system-level
designs.
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MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
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10.5 Related Links
Table 10-2 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 10-2. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
ORDER NOW
MSP430F5638
MSP430F5637
MSP430F5636
MSP430F5635
MSP430F5634
MSP430F5633
MSP430F5632
MSP430F5631
MSP430F5630
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
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10.6 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.7 Trademarks
MSP430™, MicroStar Junior™, MSP430Ware™, EnergyTrace™, ULP Advisor™, Code Composer Studio™, and TI
E2E™ are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
10.8 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.9 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as
defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled
product restricted by other applicable national regulations, received from disclosing party under nondisclosure
obligations (if any), or any direct product of such technology, to any destination to which such export or re-export
is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.
Department of Commerce and other competent Government authorities to the extent required by those laws.
10.10 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2020 Texas Instruments Incorporated
112
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Product Folder Links: MSP430F5638 MSP430F5637 MSP430F5636 MSP430F5635 MSP430F5634
MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
MSP430F5638, MSP430F5637, MSP430F5636, MSP430F5635
MSP430F5634, MSP430F5633, MSP430F5632, MSP430F5631, MSP430F5630
www.ti.com
SLAS650G – MAY 2010 – REVISED SEPTEMBER 2020
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2020 Texas Instruments Incorporated
Submit Document Feedback
113
Product Folder Links: MSP430F5638 MSP430F5637 MSP430F5636 MSP430F5635 MSP430F5634
MSP430F5633 MSP430F5632 MSP430F5631 MSP430F5630
PACKAGE OPTION ADDENDUM
www.ti.com
14-Sep-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
MSP430F5630IPZ
ACTIVE
LQFP
PZ
100
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
M430F5630
MSP430F5630IZQWR
ACTIVE
NRND
BGA
MICROSTAR
JUNIOR
ZQW
2500
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
M430F5630
M430F5630
MSP430F5630IZQWT
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
-40 to 85
MSP430F5631IPZ
MSP430F5632IPZ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
PZ
PZ
100
100
100
113
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
SNAGCU
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
M430F5631
M430F5632
M430F5632
F5632
LQFP
90
Green (RoHS
& no Sb/Br)
MSP430F5632IPZR
MSP430F5632IZCAR
MSP430F5632IZQWR
LQFP
PZ
1000
2500
2500
Green (RoHS
& no Sb/Br)
NFBGA
ZCA
ZQW
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
JUNIOR
Green (RoHS
& no Sb/Br)
M430F5632
MSP430F5633IPZ
MSP430F5633IPZR
MSP430F5633IZQWR
ACTIVE
ACTIVE
ACTIVE
LQFP
PZ
PZ
100
100
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
M430F5633
M430F5633
M430F5633
LQFP
1000
2500
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
JUNIOR
ZQW
Green (RoHS
& no Sb/Br)
MSP430F5633IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5633
MSP430F5634IPZ
ACTIVE
NRND
LQFP
PZ
100
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
M430F5634
M430F5634
MSP430F5634IZQWT
BGA
MICROSTAR
JUNIOR
ZQW
250
Green (RoHS
& no Sb/Br)
SNAGCU
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Sep-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
MSP430F5635IPZ
MSP430F5635IPZR
MSP430F5635IZCAR
MSP430F5635IZCAT
MSP430F5635IZQWR
ACTIVE
LQFP
LQFP
PZ
100
100
113
113
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
M430F5635
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PZ
1000
2500
250
Green (RoHS
& no Sb/Br)
NIPDAU
SNAGCU
SNAGCU
SNAGCU
M430F5635
F5635
NFBGA
NFBGA
ZCA
ZCA
ZQW
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
F5635
BGA
MICROSTAR
JUNIOR
2500
Green (RoHS
& no Sb/Br)
M430F5635
MSP430F5635IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5635
MSP430F5636IPZ
MSP430F5636IPZR
MSP430F5637IPZ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
LQFP
LQFP
NFBGA
NFBGA
PZ
PZ
100
100
100
100
100
100
113
113
113
90
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
SNAGCU
SNAGCU
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
M430F5636
M430F5636
M430F5637
M430F5637
M430F5638
M430F5638
F5638
1000
90
Green (RoHS
& no Sb/Br)
PZ
Green (RoHS
& no Sb/Br)
MSP430F5637IPZR
MSP430F5638IPZ
PZ
1000
90
Green (RoHS
& no Sb/Br)
PZ
Green (RoHS
& no Sb/Br)
MSP430F5638IPZR
MSP430F5638IZCAR
MSP430F5638IZCAT
MSP430F5638IZQWR
PZ
1000
2500
250
Green (RoHS
& no Sb/Br)
ZCA
ZCA
ZQW
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
F5638
BGA
MICROSTAR
JUNIOR
2500
Green (RoHS
& no Sb/Br)
M430F5638
MSP430F5638IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5638
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
14-Sep-2020
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Sep-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MSP430F5630IZQWR BGA MI
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
OR
MSP430F5630IZQWT BGA MI
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
OR
MSP430F5632IPZR
MSP430F5632IZCAR
LQFP
PZ
100
113
113
1000
2500
2500
330.0
330.0
330.0
24.4
16.4
16.4
17.0
7.3
17.0
7.3
2.1
1.5
1.5
20.0
12.0
12.0
24.0
16.0
16.0
Q2
Q1
Q1
NFBGA
ZCA
ZQW
MSP430F5632IZQWR BGA MI
7.3
7.3
CROSTA
R JUNI
OR
MSP430F5633IPZR
LQFP
PZ
100
113
1000
2500
330.0
330.0
24.4
16.4
17.0
7.3
17.0
7.3
2.1
1.5
20.0
12.0
24.0
16.0
Q2
Q1
MSP430F5633IZQWR BGA MI
ZQW
CROSTA
R JUNI
OR
MSP430F5633IZQWT BGA MI
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Sep-2020
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OR
MSP430F5634IZQWT BGA MI
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
OR
MSP430F5635IPZR
MSP430F5635IZCAR
MSP430F5635IZCAT
LQFP
NFBGA
NFBGA
PZ
100
113
113
113
1000
2500
250
330.0
330.0
180.0
330.0
24.4
16.4
16.4
16.4
17.0
7.3
7.3
7.3
17.0
7.3
7.3
7.3
2.1
1.5
1.5
1.5
20.0
12.0
12.0
12.0
24.0
16.0
16.0
16.0
Q2
Q1
Q1
Q1
ZCA
ZCA
ZQW
MSP430F5635IZQWR BGA MI
2500
CROSTA
R JUNI
OR
MSP430F5635IZQWT BGA MI
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
OR
MSP430F5637IPZR
MSP430F5638IZCAR
MSP430F5638IZCAT
LQFP
NFBGA
NFBGA
PZ
100
113
113
113
1000
2500
250
330.0
330.0
180.0
330.0
24.4
16.4
16.4
16.4
17.0
7.3
7.3
7.3
17.0
7.3
7.3
7.3
2.1
1.5
1.5
1.5
20.0
12.0
12.0
12.0
24.0
16.0
16.0
16.0
Q2
Q1
Q1
Q1
ZCA
ZCA
ZQW
MSP430F5638IZQWR BGA MI
2500
CROSTA
R JUNI
OR
MSP430F5638IZQWT BGA MI
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
CROSTA
R JUNI
OR
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Sep-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MSP430F5630IZQWR BGA MICROSTAR
JUNIOR
ZQW
113
2500
350.0
350.0
43.0
MSP430F5630IZQWT BGA MICROSTAR
JUNIOR
ZQW
113
250
213.0
191.0
55.0
MSP430F5632IPZR
MSP430F5632IZCAR
LQFP
PZ
100
113
113
1000
2500
2500
350.0
350.0
350.0
350.0
350.0
350.0
43.0
43.0
43.0
NFBGA
ZCA
ZQW
MSP430F5632IZQWR BGA MICROSTAR
JUNIOR
MSP430F5633IPZR
LQFP
PZ
100
113
1000
2500
350.0
350.0
350.0
350.0
43.0
43.0
MSP430F5633IZQWR BGA MICROSTAR
JUNIOR
ZQW
MSP430F5633IZQWT BGA MICROSTAR
JUNIOR
ZQW
ZQW
113
113
250
250
213.0
213.0
191.0
191.0
55.0
55.0
MSP430F5634IZQWT BGA MICROSTAR
JUNIOR
MSP430F5635IPZR
MSP430F5635IZCAR
MSP430F5635IZCAT
LQFP
NFBGA
NFBGA
PZ
100
113
113
113
1000
2500
250
350.0
350.0
213.0
350.0
350.0
350.0
191.0
350.0
43.0
43.0
55.0
43.0
ZCA
ZCA
ZQW
MSP430F5635IZQWR BGA MICROSTAR
JUNIOR
2500
MSP430F5635IZQWT BGA MICROSTAR
JUNIOR
ZQW
PZ
113
100
250
213.0
350.0
191.0
350.0
55.0
43.0
MSP430F5637IPZR
LQFP
1000
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Sep-2020
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MSP430F5638IZCAR
MSP430F5638IZCAT
NFBGA
NFBGA
ZCA
ZCA
ZQW
113
113
113
2500
250
350.0
213.0
350.0
350.0
191.0
350.0
43.0
55.0
43.0
MSP430F5638IZQWR BGA MICROSTAR
JUNIOR
2500
MSP430F5638IZQWT BGA MICROSTAR
JUNIOR
ZQW
113
250
213.0
191.0
55.0
Pack Materials-Page 4
PACKAGE OUTLINE
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
ZCA0113A
A
7.1
6.9
B
BALL A1 CORNER
7.1
6.9
1 MAX
C
SEATING PLANE
0.08 C
0.25
0.15
BALL TYP
5.5
TYP
(0.75) TYP
SYMM
M
L
K
J
(0.75) TYP
H
G
F
E
D
C
SYMM
5.5
TYP
0.35
0.25
113X Ø
B
A
0.15
0.05
C
C
A B
1
2
3
4
5
6
7
8
9 10 11 12
0.5 TYP
0.5 TYP
4225149/A 08/2019
NanoFree is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
ZCA0113A
(0.5) TYP
(0.5) TYP
1
2
3
4
5
6
7
8
9
10 11 12
A
B
C
D
E
F
113X (Ø0.25)
SYMM
G
H
J
K
L
M
SYMM
LAND PATTERN EXAMPLE
SCALE: 10X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
EXPOSED
METAL
(Ø 0.25)
METAL
(Ø 0.25)
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225149/A 08/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments
Literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
NFBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
ZCA0113A
(0.5) TYP
(0.5) TYP
1
2
3
4
5
6
7
8
9
10 11 12
A
B
C
D
E
F
(R0.05)
SYMM
G
H
J
METAL TYP
113X ( 0.25)
K
L
M
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.100 mm THICK STENCIL
SCALE: 10X
4225149/A 08/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
M
0,08
51
50
76
26
100
0,13 NOM
1
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
0,25
16,20
SQ
0,05 MIN
0°–7°
15,80
1,45
1,35
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149/B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
1
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