MC79L00_08 [TI]
NEGATIVE-VOLTAGE REGULATORS; 负稳压器
| 型号： | MC79L00_08 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | NEGATIVE-VOLTAGE REGULATORS |
| 文件： | 总13页 (文件大小：324K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢅ ꢆ ꢇꢈ ꢉ ꢇꢆ
ꢊꢇꢋ ꢌꢍ ꢉꢎ ꢇꢏꢎꢐ ꢄꢍꢌꢋ ꢇ ꢈꢇꢋ ꢑ ꢄꢌꢍꢐ ꢈꢆ
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
D PACKAGE
(TOP VIEW)
D
D
D
D
D
D
3-Terminal Regulators
Output Current Up To 100 mA
No External Components Required
Internal Thermal-Overload Protection
Internal Short-Circuit Current Limiting
OUTPUT
1
2
3
4
8
7
6
5
NC
INPUT
INPUT
†
†
†
INPUT
†
INPUT
NC
COMMON
Direct Replacement for Industry-Standard
MC79L00 Series
†
Internally connected
NC − No internal connection
D
Available in 5% or 10% Selections
LP PACKAGE
(TOP VIEW)
description/ordering information
This
series
of
fixed
negative-voltage
OUTPUT
integrated-circuit voltage regulators is designed
for a wide range of applications. These include
on-card regulation for elimination of noise and
distribution problems associated with single-point
INPUT
COMMON
regulation. In addition, they can be used to control series pass elements to make high-current voltage-regulator
circuits. One of these regulators can deliver up to 100 mA of output current. The internal current-limiting and
thermal-shutdown features essentially make the regulators immune to overload. When used as a replacement
for a Zener-diode and resistor combination, these devices can provide an effective improvement in output
impedance of two orders of magnitude, with lower bias current.
ORDERING INFORMATION
NOMINAL
OUTPUT
VOLTAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
OUTPUT
VOLTAGE
(V)
†
T
J
PACKAGE
TOLERANCE
Tube of 75
MC79L05ACD
MC79L05ACDR
MC79L05ACLP
MC79L05ACLPR
MC79L12ACD
MC79L12ACDR
MC79L12ACLP
MC79L12ACLPR
MC79L15ACLP
SOIC (D)
79L05A
Reel of 2500
Bulk of 1000
Reel of 2000
Tube of 75
−5
TO-226 / TO-92 (LP)
SOIC (D)
79L05AC
79L12A
Reel of 2500
Bulk of 1000
Reel of 2000
Bulk of 1000
5%
−12
−15
0°C to 125°C
TO-226 / TO-92 (LP)
79L12AC
Ammo of 2000 MC79L15ACLPM
TO-226 / TO-92 (LP)
79L15AC
Reel of 2000
Bulk of 1000
Tube of 75
MC79L15ACLPR
MC79L12CLP
MC79L15CD
−12
−15
TO-226 / TO-92 (LP)
SOIC (D)
79L12C
79L15C
10%
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢒ
ꢈ
ꢐ
ꢓ
ꢑ
ꢁ
ꢍ
ꢉ
ꢐ
ꢊ
ꢓ
ꢌ
ꢍ
ꢌ
ꢔ
ꢕ
ꢖ
ꢗ
ꢘ
ꢙ
ꢚ
ꢛ
ꢔ
ꢗ
ꢕ
ꢔ
ꢜ
ꢝ
ꢞ
ꢘ
ꢘ
ꢟ
ꢕ
ꢛ
ꢚ
ꢜ
ꢗ
ꢖ
ꢒꢘ ꢗ ꢣꢞꢝ ꢛ ꢜ ꢝ ꢗꢕ ꢖꢗꢘ ꢙ ꢛꢗ ꢜ ꢠꢟ ꢝ ꢔꢖ ꢔꢝꢚ ꢛꢔꢗꢕ ꢜ ꢠꢟ ꢘ ꢛꢥꢟ ꢛꢟ ꢘ ꢙꢜ ꢗꢖ ꢍꢟꢦ ꢚ ꢜ ꢉꢕꢜ ꢛꢘ ꢞꢙ ꢟꢕꢛ ꢜ
ꢠ
ꢞ
ꢡ
ꢢ
ꢔ
ꢝ
ꢚ
ꢛ
ꢔ
ꢗ
ꢕ
ꢣ
ꢚ
ꢛ
ꢟ
ꢤ
Copyright 2003, Texas Instruments Incorporated
ꢜ ꢛꢚ ꢕ ꢣꢚ ꢘ ꢣ ꢧ ꢚ ꢘꢘ ꢚ ꢕ ꢛꢨꢤ ꢒꢘ ꢗ ꢣꢞꢝ ꢛꢔꢗꢕ ꢠꢘ ꢗꢝ ꢟꢜ ꢜꢔ ꢕꢩ ꢣꢗꢟ ꢜ ꢕꢗꢛ ꢕꢟ ꢝꢟ ꢜꢜ ꢚꢘ ꢔꢢ ꢨ ꢔꢕꢝ ꢢꢞꢣ ꢟ
ꢛꢟ ꢜ ꢛ ꢔꢕ ꢩ ꢗꢖ ꢚ ꢢꢢ ꢠꢚ ꢘ ꢚ ꢙ ꢟ ꢛꢟ ꢘꢜ ꢤ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢅ ꢆꢇ ꢈꢉ ꢇ ꢆ
ꢊ ꢇꢋꢌꢍ ꢉ ꢎꢇ ꢏꢎꢐꢄꢍꢌꢋ ꢇ ꢈꢇ ꢋ ꢑꢄꢌꢍꢐ ꢈꢆ
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
equivalent schematic
COMMON
OUTPUT
INPUT
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Input voltage: MC79L05 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 V
MC79L12, MC79L15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −35 V
Package thermal impedance, θ (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W
Operating free-air, case, or virtual junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functionaloperation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximumpower dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable ambient
J
JA
A
temperatureis P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX
UNIT
MC79L05
MC79L12
MC79L15
−7
−14.5
−17.5
−20
−27
−30
100
125
V
Input voltage
V
I
I
O
Output current
mA
T
J
Operating virtual junction temperature
0
°C
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢅ ꢆ ꢇꢈ ꢉ ꢇꢆ
ꢊꢇꢋ ꢌꢍ ꢉꢎ ꢇꢏꢎꢐ ꢄꢍꢌꢋ ꢇ ꢈꢇꢋ ꢑ ꢄꢌꢍꢐ ꢈꢆ
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
electrical characteristics at specified virtual junction temperature, V = −10 V, I = 40 mA (unless
I
O
otherwise noted)
MC79L05C
MC79L05AC
†
PARAMETER
T
UNIT
TEST CONDITIONS
J
MIN
TYP
MAX
MIN
−4.8
TYP
MAX
25°C
−4.6
−4.5
−4.5
−5
−5.4
−5
−5.2
V = −7 V to −20 V,
I
O
‡
0°C to 125°C
0°C to 125°C
−5.5 −4.75
−5.25
Output voltage
V
I
= 1 mA to 40 mA
V = −10 V, I = 1 mA to 70 mA
−5.5 −4.75
−5.25
150
I
O
V = −7 V to −20 V
200
150
41
I
Input regulation
Ripple rejection
25°C
25°C
mV
dB
V = −8 V to −20 V
100
I
V = −8 V to −18 V, f = 120 Hz
40
49
49
I
I
I
= 1 mA to 100 mA
= 1 mA to 40 mA
60
60
30
O
Output regulation
25°C
mV
30
O
Output noise voltage
Dropout voltage
f = 10 Hz to 100 kHz
= 40 mA
25°C
25°C
25°C
125°C
40
40
µV
I
O
1.7
1.7
V
6
5.5
1.5
0.2
6
5.5
1.5
0.1
Bias current
mA
mA
V = −8 V to −20 V
I
Bias current change
†
0°C to 125°C
I
O
= 1 mA to 40 mA
All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately.
This specification applies only for dc power dissipation permitted by absolute maximum ratings.
‡
electrical characteristics at specified virtual junction temperature, V = −19 V, I = 40 mA (unless
I
O
otherwise noted)
MC79L12C
MIN TYP
−11.1
MC79L12AC
†
PARAMETER
T
UNIT
TEST CONDITIONS
J
MAX
MIN
TYP
MAX
25°C
−12 −12.9 −11.5
−13.2 −11.4
−12 −12.5
V = −14.5 V to −27 V,
I
O
‡
0°C to 125°C −10.8
0°C to 125°C −10.8
−12.6
Output voltage
V
I
= 1 mA to 40 mA
V = −19 V, I = 1 mA to 70 mA
−13.2 −11.4
−12.6
I
O
V = −14.5 V to −27 V
250
200
250
I
Input regulation
Ripple rejection
25°C
mV
dB
V = −16 V to −27 V
I
200
V = −15 V to −25 V, f = 120 Hz
I
25°C
25°C
36
42
37
42
100
50
I
I
= 1 mA to 100 mA
= 1 mA to 40 mA
100
50
O
Output regulation
mV
O
Output noise voltage
Dropout voltage
f = 10 Hz to 100 kHz
= 40 mA
25°C
25°C
25°C
125°C
80
80
µV
I
O
1.7
1.7
6.5
6
V
6.5
6
Bias current
mA
mA
V = −16 V to −27 V
I
1.5
0.2
1.5
0.1
Bias current change
†
0°C to 125°C
I
O
= 1 mA to 40 mA
All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately.
This specification applies only for dc power dissipation permitted by absolute maximum ratings.
‡
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢅ ꢆꢇ ꢈꢉ ꢇ ꢆ
ꢊ ꢇꢋꢌꢍ ꢉ ꢎꢇ ꢏꢎꢐꢄꢍꢌꢋ ꢇ ꢈꢇ ꢋ ꢑꢄꢌꢍꢐ ꢈꢆ
SLVS011D − OCTOBER 1982 − REVISED AUGUST 2003
electrical characteristics at specified virtual junction temperature, V = −23 V, I = 40 mA (unless
I
O
otherwise noted)
MC79L15C
MIN TYP
−13.8
MC79L15AC
†
PARAMETER
T
UNIT
TEST CONDITIONS
J
MAX
MIN
−14.4
TYP
MAX
25°C
−15 −16.2
−15
−15.6
V = −17.5 V to −30 V,
I
‡
Output voltage
0°C to 125°C −13.5
0°C to 125°C −13.5
25°C
−16.5 −14.25
−15.75
V
I
O
= 1 mA to 40 mA
V = −23 V, I = 1 mA to 70 mA
−16.5 −14.25
−15.75
300
I
O
V = −17.5 V to −30 V
I
300
250
Input regulation
Ripple rejection
Output regulation
mV
dB
V = −17.5 V to −30 V
I
250
V = −18.5 V to −28.5 V, f = 120 Hz
I
25°C
25°C
33
39
34
39
I
= 1 mA to 100 mA
= 1 mA to 40 mA
150
75
150
75
O
O
mV
I
Output noise voltage
Dropout voltage
f = 10 Hz to 100 kHz
= 40 mA
25°C
25°C
25°C
125°C
90
90
µV
I
O
1.7
1.7
V
6.5
6
6.5
6
Bias current
mA
mA
V = −20 V to −30 V
I
1.5
0.2
1.5
0.1
Bias current change
†
0°C to 125°C
I
O
= 1 mA to 40 mA
All characteristics are measured with a 0.33-µF capacitor across the input and a 0.1-µF capacitor across the output. Pulse-testing techniques are
used to maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately.
This specification applies only for dc power dissipation permitted by absolute maximum ratings.
‡
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
MC79L05ACD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
3
3
3
3
3
3
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MC79L05ACDE4
MC79L05ACDG4
MC79L05ACDR
SOIC
SOIC
SOIC
SOIC
SOIC
TO-92
TO-92
TO-92
TO-92
TO-92
TO-92
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MC79L05ACDRE4
MC79L05ACDRG4
MC79L05ACLP
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP
LP
LP
LP
LP
LP
1000
1000
2000
2000
2000
2000
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
MC79L05ACLPE3
MC79L05ACLPM
MC79L05ACLPME3
MC79L05ACLPR
MC79L05ACLPRE3
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
MC79L05AILP
MC79L05CD
MC79L05CDR
MC79L05CLP
MC79L12ACD
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
TO-92
SOIC
SOIC
TO-92
SOIC
LP
D
3
8
8
3
8
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
D
LP
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MC79L12ACDE4
MC79L12ACDG4
MC79L12ACDR
MC79L12ACDRE4
MC79L12ACDRG4
MC79L12ACLP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
SOIC
SOIC
SOIC
SOIC
SOIC
TO-92
TO-92
TO-92
TO-92
SOIC
D
D
8
8
8
8
8
3
3
3
3
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP
LP
LP
LP
D
1000
1000
2000
2000
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
MC79L12ACLPE3
MC79L12ACLPR
MC79L12ACLPRE3
MC79L12CD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
Orderable Device
MC79L12CLP
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
MC79L12CLPE3
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
MC79L15ACD
MC79L15ACLP
OBSOLETE
ACTIVE
SOIC
D
8
3
TBD
Call TI
CU SN
Call TI
TO-92
LP
1000
1000
2000
2000
2000
2000
Pb-Free
(RoHS)
N / A for Pkg Type
MC79L15ACLPE3
MC79L15ACLPM
MC79L15ACLPME3
MC79L15ACLPR
MC79L15ACLPRE3
MC79L15CD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
TO-92
TO-92
TO-92
TO-92
TO-92
SOIC
LP
LP
LP
LP
LP
D
3
3
3
3
3
8
8
8
3
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MC79L15CDE4
MC79L15CDG4
MC79L15CLP
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO-92
LP
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2008
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
12
MC79L05ACDR
MC79L12ACDR
D
D
8
8
SITE 27
SITE 27
6.4
6.4
5.2
5.2
2.1
2.1
8
8
12
12
Q1
Q1
330
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Jan-2008
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
MC79L05ACDR
MC79L12ACDR
D
D
8
8
SITE 27
SITE 27
342.9
342.9
338.1
338.1
20.64
20.64
Pack Materials-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.205 (5,21)
0.175 (4,44)
0.165 (4,19)
0.125 (3,17)
DIA
0.210 (5,34)
0.170 (4,32)
Seating
Plane
0.157 (4,00) MAX
0.050 (1,27)
C
0.500 (12,70) MIN
0.022 (0,56)
0.016 (0,41)
0.016 (0,41)
0.014 (0,35)
0.104 (2,65)
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
D
0.135 (3,43) MIN
0.105 (2,67)
0.095 (2,41)
0.055 (1,40)
0.045 (1,14)
1
2
3
0.105 (2,67)
0.080 (2,03)
0.105 (2,67)
0.080 (2,03)
4040001-2/C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.539 (13,70)
0.460 (11,70)
1.260 (32,00)
0.905 (23,00)
0.650 (16,50)
0.610 (15,50)
0.020 (0,50) MIN
0.098 (2,50)
0.384 (9,75)
0.335 (8,50)
0.748 (19,00)
0.217 (5,50)
0.748 (19,00)
0.689 (17,50)
0.433 (11,00)
0.335 (8,50)
0.114 (2,90)
0.094 (2,40)
0.114 (2,90)
0.094 (2,40)
0.169 (4,30)
0.146 (3,70)
DIA
0.266 (6,75)
0.234 (5,95)
0.512 (13,00)
0.488 (12,40)
TAPE & REEL
4040001-3/C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明