MAX3243IDBRE4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD (HBM) PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器,具有±15 - kV的ESD ( HBM )保护型号: | MAX3243IDBRE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD (HBM) PROTECTION |
文件: | 总16页 (文件大小:299K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SLLS350L − APRIL 1999 − REVISED MARCH 2004
DB, DW, OR PW PACKAGE
(TOP VIEW)
D
Single-Chip and Single-Supply Interface for
IBM PC/AT Serial Port
D
D
D
D
D
D
D
D
D
D
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
C2+
C2−
1
28 C1+
27 V+
2
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
3
26
25
24
23
22
21
20
19
18
17
16
15
V−
V
CC
4
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
GND
Operates With 3-V to 5.5-V V
Supply
5
C1−
CC
6
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
Three Drivers and Five Receivers
Operates Up To 250 kbit/s
7
8
Designed to Transmit at a Data Rate of
250 kbit/s
9
10
11
12
13
14
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Always-Active Noninverting Receiver
Output (ROUT2B)
D
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3243
D
D
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
D
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3243consists of three line drivers, five line receivers, and a dual charge-pump circuit with 15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial
port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output
(ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down.
The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
AT, IBM, and PC are trademarks of International Business Machines Corporation.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLLS350L − APRIL 1999 − REVISED MARCH 2004
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF
is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than −2.7 V
or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube of 20
Reel of 1000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
Tube of 20
Reel of 1000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
MAX3243CDW
MAX3243CDWR
MAX3243CDB
MAX3243CDBR
MAX3243CPW
MAX3243CPWR
MAX3243IDW
MAX3243IDWR
MAX3243IDB
SOIC (DW)
SSOP (DB)
TSSOP (PW)
SOIC (DW)
SSOP (DB)
TSSOP (PW)
MAX3243C
MAX3243C
MA3243C
MAX3243I
MAX3243I
MB3243I
0°C to 70°C
−40°C to 85°C
MAX3243IDBR
MAX3243IPW
MAX3243IPWR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
VALID RIN
RS-232 LEVEL
DRIVER STATUS
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
H = high level, L = low level, X = irrelevant, Z = high impedance
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢃ
ꢃ ꢆꢇ ꢈ ꢉ ꢊ ꢋꢊ ꢆꢇ ꢀ ꢌꢍꢈ ꢎꢏꢐ ꢁꢑꢑꢒ ꢍ ꢓꢔ ꢆꢄꢃ ꢄ ꢍ ꢎꢑꢒ ꢕꢓꢎ ꢇꢒ ꢓꢖꢓꢒ ꢏꢒ ꢎ ꢇ ꢒꢓ
ꢗ ꢎꢈ ꢐ ꢘ ꢊ ꢆꢙ ꢇ ꢒꢔ ꢕ ꢚꢐꢛꢀ ꢜ ꢝꢓ ꢉ ꢈꢒ ꢏꢈ ꢎꢉ ꢑ
ꢞ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
EACH RECEIVER
INPUTS
OUTPUTS
ROUT2B ROUT
RIN1,
RIN3−RIN5
VALID RIN
RS-232 LEVEL
RECEIVER STATUS
RIN2
FORCEOFF
L
H
X
X
L
L
X
L
H
L
Z
Z
H
L
Powered off while
ROUT2B is active
X
L
L
H
H
H
H
H
Yes
Yes
Yes
Yes
No
L
H
L
Normal operation with
auto-powerdown
disabled/enabled
H
L
H
H
L
H
L
H
H
Open
Open
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected
driver off
logic diagram (positive logic)
14
13
12
9
10
11
DIN1
DOUT1
DOUT2
DOUT3
DIN2
DIN3
22
23
FORCEOFF
FORCEON
21
Auto-powerdown
INVALID
19
20
4
ROUT1
RIN1
RIN2
5 k
Ω
ROUT2B
18
17
16
15
5
ROUT2
5 k
Ω
6
ROUT3
ROUT4
ROUT5
RIN3
RIN4
RIN5
5 k
Ω
7
5 k
Ω
8
5 k
Ω
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLLS350L − APRIL 1999 − REVISED MARCH 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, V : Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
I
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, V : Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
O
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
MIN NOM
MAX
3.6
UNIT
V
= 3.3 V
= 5 V
3
4.5
2
3.3
5
CC
CC
CC
CC
Supply voltage
V
V
V
V
5.5
= 3.3 V
= 5 V
V
IH
Driver and control high-level input voltage
V
DIN, FORCEOFF, FORCEON
2.4
V
V
V
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, FORCEOFF, FORCEON
DIN, FORCEOFF, FORCEON
0.8
5.5
25
70
85
V
V
V
IL
0
−25
0
I
I
MAX3243C
MAX3243I
T
A
Operating free-air temperature
°C
−40
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
‡
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
Input leakage
current
FORCEOFF,
FORCEON
I
I
0.01
1
µA
No load,
FORCEOFF and
FORCEON at V
Auto-powerdown
disabled
0.3
1
1
mA
CC
Powered off
V
T
A
= 3.3 V or 5 V, No load, FORCEOFF at GND
10
CC
= 25°C
I
Supply current
CC
No load, FORCEOFF at V
FORCEON at GND,
,
CC
µA
Auto-powerdown
enabled
1
10
All RIN are open or grounded,
All DIN are grounded
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢃ
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ꢗ ꢎꢈ ꢐ ꢘ ꢊ ꢆꢙ ꢇ ꢒꢔ ꢕ ꢚꢐꢛꢀ ꢜ ꢝꢓ ꢉ ꢈꢒ ꢏꢈ ꢎꢉ ꢑ
ꢞ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
All DOUT at R = 3 kΩ to GND
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
5
5.4
OH
L
All DOUT at R = 3 kΩ to GND
−5
−5.4
V
OL
L
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = V , 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
CC
V
O
5
V
I
I
High-level input current
Low-level input current
V = V
CC
0.01
0.01
1
1
µA
µA
IH
I
V at GND
I
IL
V
V
V
= 3.6 V,
V
O
V
O
V
O
V
O
V
O
= 0 V
= 0 V
CC
CC
CC
‡
I
35
60
mA
Short-circuit output current
OS
= 5.5 V,
r
Output resistance
, V+, and V− = 0 V,
=
=
=
2 V
300
10M
Ω
o
12 V,
10 V,
V
V
= 3 V to 3.6 V
25
25
CC
I
off
Output leakage current
FORCEOFF = GND
µA
= 4.5 V to 5.5 V
CC
†
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
C
= 1000 pF,
R
L
= 3 kΩ,
See Figure 1
L
Maximum data rate
150
250
100
kbit/s
One DOUT switching,
R
= 3 kΩ to 7 kΩ,
L
§
t
Pulse skew
C
= 150 pF to 2500 pF
ns
sk(p)
L
See Figure 2
C
C
= 150 pF to 1000 pF
6
4
30
30
Slew rate, transition region
(see Figure 1)
V
R
= 3.3 V,
= 3 kΩ to 7 kΩ
L
L
CC
L
SR(tr)
V/µs
= 150 pF to 2500 pF
†
§
All typical values are at V
Pulse skew is defined as |t
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
− t
| of each channel of the same device.
PLH PHL
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
CC
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢆ
ꢙ
ꢇ
ꢒ
ꢔ
ꢕ
ꢚ
ꢐ
ꢛ
ꢀ
ꢜ
ꢝ
ꢓ
ꢉ
ꢈꢒ
ꢏ
ꢈꢎ
ꢉ
ꢑ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
I
I
= −1 mA
= 1.6 mA
V
−0.6 V
V −0.1 V
CC
OH
OH
CC
0.4
2.4
2.4
V
OL
OL
V
V
V
V
= 3.3 V
= 5 V
1.6
1.9
1.1
1.4
0.5
0.05
5
CC
CC
CC
CC
V
IT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
= 3.3 V
= 5 V
0.6
0.8
V
V
IT−
Input hysteresis (V
IT+
− V
)
V
hys
IT−
I
off
Output leakage current (except ROUT2B)
Input resistance
FORCEOFF = 0 V
V = 3 V to 25 V
10
7
µA
kΩ
r
3
i
I
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
ns
t
t
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
150
150
200
200
50
PLH
PHL
en
C
C
= 150 pF, See Figure 3
L
L
ns
ns
= 150 pF, R = 3 kΩ, See Figure 4
L
Output disable time
ns
dis
‡
Pulse skew
See Figure 3
= 5 V, and T = 25°C.
ns
sk(p)
†
‡
All typical values are at V
CC
= 3.3 V or V
CC
A
Pulse skew is defined as |t
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
CC
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢃ
ꢃ ꢆꢇ ꢈ ꢉ ꢊ ꢋꢊ ꢆꢇ ꢀ ꢌꢍꢈ ꢎꢏꢐ ꢁꢑꢑꢒ ꢍ ꢓꢔ ꢆꢄꢃ ꢄ ꢍ ꢎꢑꢒ ꢕꢓꢎ ꢇꢒ ꢓꢖꢓꢒ ꢏꢒ ꢎ ꢇ ꢒꢓ
ꢗ ꢎꢈ ꢐ ꢘ ꢊ ꢆꢙ ꢇ ꢒꢔ ꢕ ꢚꢐꢛꢀ ꢜ ꢝꢓ ꢉ ꢈꢒ ꢏꢈ ꢎꢉ ꢑ
ꢞ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
†
TYP
PARAMETER
TEST CONDITIONS
FORCEON = GND,
FORCEOFF = V
MIN
MAX
UNIT
Receiver input threshold
for INVALID high-level output voltage
V
V
V
V
V
2.7
V
T+(valid)
T−(valid)
T(invalid)
OH
CC
FORCEON = GND,
FORCEOFF = V
Receiver input threshold
for INVALID high-level output voltage
−2.7
−0.3
V
V
V
V
CC
FORCEON = GND,
FORCEOFF = V
Receiver input threshold
for INVALID low-level output voltage
0.3
0.4
CC
= −1 mA, FORCEON = GND,
I
OH
FORCEOFF = V
INVALID high-level output voltage
INVALID low-level output voltage
V
−0.6
CC
CC
= 1.6 mA, FORCEON = GND,
I
OL
FORCEOFF = V
OL
CC
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
†
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
MIN TYP
MAX
UNIT
µs
t
t
t
1
valid
invalid
en
30
µs
100
µs
†
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
C
t
t
TLH
L
THL
R
L
(see Note A)
V
OH
OL
3 V
−3 V
3 V
FORCEOFF
3 V
−3 V
Output
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃꢄ
ꢅ
ꢃ
ꢞ
ꢃ
ꢆ
ꢇ
ꢈꢉ
ꢊ
ꢋ
ꢊ
ꢆ
ꢇ
ꢀ
ꢌ
ꢍꢈ
ꢎ
ꢏ
ꢐ
ꢁ
ꢑ
ꢑ
ꢒ
ꢍ
ꢓ
ꢔ
ꢆ
ꢄ
ꢃ
ꢄ
ꢍ
ꢎ
ꢑ
ꢒ
ꢕ
ꢓ
ꢎ
ꢇ
ꢒ
ꢓ
ꢖ
ꢓ
ꢒ
ꢏ
ꢒ
ꢎ
ꢇ
ꢒ
ꢓ
ꢗ
ꢎ
ꢈ
ꢐ
ꢘ
ꢊꢆ
ꢙ
ꢇ
ꢒ
ꢔ
ꢕ
ꢚ
ꢐ
ꢛ
ꢀ
ꢜ
ꢝ
ꢓ
ꢉ
ꢈ
ꢒ
ꢏ
ꢈ
ꢎ
ꢉ
ꢑ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
t
t
L
PHL
PLH
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3 V
−3 V
Input
1.5 V
1.5 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
V
V
OH
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
3 V
0 V
Input
1.5 V
1.5 V
V
CC
S1
GND
3 V or 0 V
FORCEON
t
t
PHZ
PZH
(S1 at GND)
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
FORCEOFF
50 Ω
t
t
PLZ
(S1 at V
PZL
(S1 at V
)
)
CC
CC
Generator
(see Note B)
0.3 V
Output
50%
V
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
PLZ
PZL
PHZ
PZH
are the same as t
.
en
Figure 4. Receiver Enable and Disable Times
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢅ ꢃ
ꢃ ꢆꢇ ꢈ ꢉ ꢊ ꢋꢊ ꢆꢇ ꢀ ꢌꢍꢈ ꢎꢏꢐ ꢁꢑꢑꢒ ꢍ ꢓꢔ ꢆꢄꢃ ꢄ ꢍ ꢎꢑꢒ ꢕꢓꢎ ꢇꢒ ꢓꢖꢓꢒ ꢏꢒ ꢎ ꢇ ꢒꢓ
ꢗ ꢎꢈ ꢐ ꢘ ꢊ ꢆꢙ ꢇ ꢒꢔ ꢕ ꢚꢐꢛꢀ ꢜ ꢝꢓ ꢉ ꢈꢒ ꢏꢈ ꢎꢉ ꢑ
ꢞ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
3 V
2.7 V
2.7 V
0 V
0 V
Receiver
Input
−2.7 V
−2.7 V
ROUT
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
50% V
CC
50% V
CC
0 V
INVALID
Output
t
Auto-
powerdown
en
INVALID
= 30 pF
≈V+
V+
C
L
(see Note A)
0.3 V
Supply
Voltages
V
CC
0 V
0.3 V
FORCEOFF
FORCEON
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
0.3 V
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces
supply current to 1 µA.
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
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ꢈ
ꢉ
ꢊ
ꢋ
ꢊꢆ
ꢇ
ꢀ
ꢌ
ꢍꢈ
ꢎ
ꢏ
ꢐ
ꢁ
ꢑ
ꢑ
ꢒ
ꢍ
ꢓ
ꢔ
ꢆ
ꢄ
ꢃ
ꢄ
ꢍ
ꢎ
ꢑ
ꢒ
ꢕ
ꢓ
ꢎ
ꢇ
ꢒ
ꢓ
ꢖ
ꢓ
ꢒ
ꢏ
ꢒ
ꢎ
ꢇ
ꢒ
ꢓ
ꢗ
ꢎ
ꢈ
ꢐ
ꢘ
ꢊ
ꢆ
ꢙ
ꢇ
ꢒ
ꢔ
ꢕ
ꢚ
ꢐ
ꢛ
ꢀ
ꢜ
ꢝ
ꢓ
ꢉ
ꢈꢒ
ꢏ
ꢈ
ꢎ
ꢉ
ꢑ
SLLS350L − APRIL 1999 − REVISED MARCH 2004
APPLICATION INFORMATION
28
27
C1+
V+
1
2
C2+
C2−
+
−
+
C2
−
†
C3
+
−
C1
26
V
CC
GND
C1−
+
−
C
BYPASS
= 0.1 µF
3
25
24
23
V−
−
C4
+
4
5
6
7
8
RIN1
RIN2
FORCEON
FORCEOFF
RIN3
22
RS-232 Inputs
RIN4
RIN5
21
20
INVALID
ROUT2B
9
DOUT1
DOUT2
19
18
17
10
ROUT1
ROUT2
RS-232 Outputs
5 kΩ
11
DOUT3
5 kΩ
Logic Outputs
12
13
14
DIN3
DIN2
DIN1
ROUT3
5 kΩ
16
15
Logic Inputs
ROUT4
ROUT5
5 kΩ
5 kΩ
V
vs CAPACITOR VALUES
CC
†
C3 can be connected to V
or GND.
NOTES: A. Resistor values shown are nominal.
CC
V
C1
C2, C3, and C4
CC
B. Nonpolarized ceramic capacitors are acceptable. If polarized
tantalum or electrolytic capacitors are used, they should be
connected as shown.
3.3 V 0.3 V
5 V 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
MAX3243CDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243CDBE4
MAX3243CDBR
MAX3243CDBRE4
MAX3243CDBRG4
MAX3243CDW
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
PW
PW
PW
PW
PW
PW
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243CDWE4
MAX3243CDWR
MAX3243CPW
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SSOP
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243CPWE4
MAX3243CPWG4
MAX3243CPWR
MAX3243CPWRE4
MAX3243CPWRG4
MAX3243IDB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243IDBE4
MAX3243IDBR
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243IDBRE4
MAX3243IDBRG4
MAX3243IDW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
PW
PW
PW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243IDWR
MAX3243IDWRE4
MAX3243IPW
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243IPWG4
MAX3243IPWR
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Orderable Device
MAX3243IPWRE4
MAX3243IPWRG4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
28
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
PW
28
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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