MAX3243ECDBG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器【 15千伏IEC ESD保护
| 型号： | MAX3243ECDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION |
| 文件： | 总26页 (文件大小：742K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
1
FEATURES
DB, DW, OR PW PACKAGE
2
•
Single-Chip and Single-Supply Interface for
IBM™ PC/AT™ Serial Port
(TOP VIEW)
C2+
C2−
V−
C1+
1
28
27
26
25
24
23
22
21
20
19
18
17
•
ESD Protection for RS-232 Bus Pins
V+
VCC
2
–
–
–
±15-kV Human-Body Model (HBM)
3
±8-kV IEC61000-4-2, Contact Discharge
±15-kV IEC61000-4-2, Air-Gap Discharge
RIN1
RIN2
GND
C1−
4
5
•
Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
RIN3
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
6
RIN4
RIN5
7
•
•
Operates With 3-V to 5.5-V VCC Supply
8
DOUT1
DOUT2
DOUT3
DIN3
9
Always-Active Noninverting Receiver Output
(ROUT2B)
10
11
12
•
Designed to Transmit at a Data Rate up to
500 kbit/s
DIN2 13
14
16 ROUT4
15
•
•
•
•
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
DIN1
ROUT5
QFN PACKAGE
(TOP VIEW)
Designed to Be Interchangeable With Maxim
MAX3243E
•
•
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
32 31 30 29 28 27 26 25
RIN1
RIN2
GND
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
•
Package Options Include Plastic Small-Outline
(DW), Shrink Small-Outline (DB), and Thin
Shrink Small-Outline (PW) Packages
C1–
RIN3
FORCEON
FORCEOFF
INVALID
ROUTB2
ROUT1
ROUT2
RIN4
RIN5
APPLICATIONS
DOUT1
DOUT2
DOUT3
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
9
10 11 12 13 14 15 16
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
IBM, PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2009, Texas Instruments Incorporated
MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
DESCRIPTION
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)
protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous communication controller and the serial-port connector. This
combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or
compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data while the device is powered down. The device operates at
data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V
or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between –0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
The MAX3243EC is characterized for operation from 0°C to 70°C. The MAX3243EI is characterized for operation
from –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
MAX3243ECDW
MAX3243ECDWR
MAX3243ECDB
TOP-SIDE MARKING
SOIC – DW
SSOP – DB
Tape and reel
MAX3243EC
Tape and reel
MAX3243EC
0°C to 70°C
MAX3243ECDBR
MAX3243ECPW
MAX3243ECPWR
MAX3243ECRHBR
MAX3243EIDB
TSSOP – PW
QFN – RHB
SSOP – DB
Tape and reel
Tape and reel
Tape and reel
MP243EC
MP243E
MAX3243EI
MAX3243EIDBR
MAX3243EIDW
SOIC – DW
Tape and reel
MAX3243EI
–40°C to 85°C
MAX3243EIDWR
MAX3243EIPW
TSSOP – PW
QFN – RHB
Tape and reel
Tape and reel
MP243EI
MR243E
MAX3243EIPWR
MAX3243EIRHBR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
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Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
FUNCTION TABLES
ABC
EACH DRIVER(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER(1)
INPUTS
OUTPUTS
VALID RIN
RS-232
LEVEL
RECEIVER STATUS
RIN1,
RIN3–RIN5
ROUT1,
ROUT3–5
RIN2
FORCEOFF
ROUT2B ROUT2
L
H
X
X
L
L
X
L
H
L
Z
Z
H
L
Z
Z
H
L
Powered off while
ROUT2B is active
X
L
L
H
H
H
H
H
YES
YES
YES
YES
YES
L
H
L
Normal operation with
auto-powerdown
disabled/enabled
H
L
H
H
L
H
L
H
L
H
H
Open
Open
H
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
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MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
14
13
12
9
10
11
DIN1
DIN2
DIN3
DOUT1
DOUT2
DOUT3
22
23
FORCEOFF
FORCEON
21
Auto-powerdown
INVALID
19
20
4
5
ROUT1
RIN1
RIN2
ROUT2B
18
17
16
15
ROUT2
6
7
8
ROUT3
ROUT4
ROUT5
RIN3
RIN4
RIN5
4
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Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive output supply voltage range(2)
Negative output supply voltage range(2)
6
V
V
V
V
7
V–
–7
V+ – V– Output supply voltage difference(2)
13
Driver (FORCEOFF, FORCEON)
Receiver
–0.3
–25
6
25
VI
Input voltage range
Output voltage range
V
V
Driver
–13.2
–0.3
13.2
VCC + 0.3
62
VO
Receiver (INVALID)
DB package
θJA
Package thermal impedance(3)(4)
DW package
46
C/W
PW package
62
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Storage temperature range
260
C
C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 6
MIN
3
NOM
3.3
5
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3.6
V
Supply voltage
4.5
2
5.5
VIH Driver and control high-level input voltage
VIL Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
V
2.4
DIN, FORCEOFF, FORCEON
DIN, FORCEOFF, FORCEON
0.8
5.5
25
70
85
V
V
V
VI
VI
Driver and control input voltage
Receiver input voltage
0
–25
0
MAX3243EC
MAX3243EI
TA Operating free-air temperature
C
–40
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2) MAX
UNIT
II
Input leakage current FORCEOFF, FORCEON
0.01
0.3
1
1
µA
No load,
Auto-powerdown disabled
1
mA
FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
10
Supply current
ICC
No load, FORCEOFF at VCC
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
,
(TA = 25°C)
µA
Auto-powerdown enabled
1
10
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
All DOUT at RL = 3 kΩ to GND
MIN TYP(2) MAX
UNIT
V
VOH High-level output voltage
5
5.4
VOL
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
VO
±5
V
IIH
IIL
High-level input current
Low-level input current
VI = VCC
±0.01
±0.01
±1
±1
±1
µA
µA
V
VI at GND
Vhys Input hysteresis
VCC = 3.6 V,
VO = 0 V
IOS
Short-circuit output current(3)
±60
mA
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
FORCEOFF = GND,
VO = ±2 V
VO = ±12 V,
300
10M
Ω
Ioff
Output leakage current
VCC = 0 to 5.5 V
±25
µA
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (see Figure 6)
PARAMETER
Maximum data rate
Pulse skew(3)
TEST CONDITIONS
MIN TYP(2)
MAX
UNIT
kbit/s
ns
CL = 1000 pF,
RL = 3 kΩ
250
500
100
One DOUT switching,
See Figure 1
tsk(p)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ, See Figure 2
CL = 150 pF to 1000 pF
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
PRR = 250 kbit/s
6
4
30
30
Slew rate, transition region
(see Figure 1)
SR(tr)
V/µs
CL = 150 pF to 2500 pF
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V + 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP UNIT
HBM
±15
±15
±8
kV
kV
kV
Driver outputs (pins 9–11)
IEC61000-4-2, Air-Gap Discharge
IEC61000-4-2, Contact Discharge
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MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6
VCC – 0.1
V
IOH = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
VIT–
V
1.4
Vhys
Ioff
ri
Input hysteresis (VIT+ – VIT–
Output leakage current (except ROUT2B) FORCEOFF = 0 V
Input resistance VI = ±3 V or ±25 V
)
0.5
V
±0.05
5
±10
7
µA
kΩ
3
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2) UNIT
tPLH
tPHL
ten
150
150
200
200
50
ns
ns
ns
ns
ns
CL = 150 pF, RL = 3 kΩ, See Figure 4
tdis
Output disable time
Puse skew(3)
tsk(p)
See Figure 3
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP UNIT
HBM
±15
±15
±8
kV
kV
kV
Driver outputs (pins 4–8)
IEC61000-4-2, Air-Gap discharge
IEC61000-4-2, Contact Discharge
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MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
FORCEON = GND,
MIN
MAX UNIT
Receiver input threshold
VIT+(valid)
VIT–(valid)
VT(invalid)
VOH
2.7
0.3
0.4
V
V
V
V
V
for INVALID high-level output voltage
FORCEOFF = VCC
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
–0.3
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
IOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
TYP(1)
1
UNIT
µs
tvalid
tinvalid
ten
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
VCC = 5 V
VCC = 5 V
VCC = 5 V
30
µs
100
µs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
PARAMETER MEASUREMENT INFORMATION
3 V
Input
RS-232
Output
0 V
Generator
(see Note B)
50 Ω
C
L
t
t
TLH
THL
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
FORCEOFF
3 V
−3 V
Output
OL
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PHL
PLH
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
FORCEOFF
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
V
CC
GND
−3 V
(S1 at GND)
3 V or 0 V
FORCEON
S1
t
t
PZH
PHZ
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
FORCEOFF
50 Ω
t
t
PZL
(S1 at V
PLZ
(S1 at V
)
CC
)
CC
Generator
(see Note B)
0.3 V
Output
50%
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 4. Receiver Enable and Disable Times
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PARAMETER MEASUREMENT INFORMATION
3 V
2.7 V
2.7 V
0 V
0 V
Receiver
Input
−2.7 V
−2.7 V
t
ROUT
−3 V
Generator
(see Note B)
50 Ω
t
valid
invalid
V
CC
50% V
50% V
CC
CC
0 V
INVALID
Output
t
en
Auto-
powerdown
INVALID
C = 30 pF
≈V+
V+
L
(see Note A)
0.3 V
Supply
V
CC
0 V
0.3 V
FORCEOFF
FORCEON
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
2.7 V
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdowndisables drivers and reduces supply
current to 1 µA.
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time
Copyright © 2005–2009, Texas Instruments Incorporated
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11
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MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
28
C1+
27
1
V+
C2+
C2−
+
−
+
−
†
C3
C2
+
−
2
3
C1
26
V
CC
+
−
C
BYPASS
= 0.1 µF
25
24
23
V−
GND
C1−
−
+
C4
4
5
6
7
8
RIN1
FORCEON
FORCEOFF
RIN2
RIN3
22
RS-232 Inputs
RIN4
RIN5
21
20
INVALID
ROUT2B
9
DOUT1
DOUT2
19
18
17
10
ROUT1
ROUT2
RS-232 Outputs
5 kΩ
11
DOUT3
5 kΩ
Logic Outputs
12
13
14
DIN3
DIN2
DIN1
ROUT3
5 kΩ
16
15
Logic Inputs
ROUT4
ROUT5
5 kΩ
5 kΩ
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
12
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Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
APPLICATION INFORMATION
ESD Protection
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal
operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly
after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect to
GND:
•
•
•
±15-kV Human Body Model (HBM)
±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)
±8-kV IEC61000-4-2, Contact Discharge
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human Body Model (HBM)
The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that is
generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the
ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ω resistor.
R
D
1.5 kΩ
+
−
100 pF
C
S
DUT
V
HBM
Figure 7. HBM ESD Test Circuit
Copyright © 2005–2009, Texas Instruments Incorporated
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13
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657C–APRIL 2005–REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
1.5
V
HBM
= 2 kV
1.0
0.5
DUT = 10-V 1-Ω Zener Diode
0.0
0
50
100
150
200
Time (ns)
Figure 8. Typical HBM Current Waveform
IEC61000-4-2 (Formerly Known as IEC1000-4-2)
Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is
a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E is
designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with
no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak
current than the HBM, due to the lower series resistance in the IEC model.
Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding
±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the
DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the
DUT with an already energized probe.
50−100 MΩ
330 Ω
R
C
R
D
High-Voltage
DC Source
+
−
C
S
150 pF
DUT
Figure 9. Simplified IEC61000-4-2 ESD Test Circuit
14
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Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com ................................................................................................................................................... SLLS657C–APRIL 2005–REVISED FEBRUARY 2009
APPLICATION INFORMATION
I
(30A) 100%
(V
contact
= 8 kV)
90%
(16A)
(8A)
10%
t
30 ns
60 ns
t = 0.7 ns to 1 ns
r
Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator
Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
Copyright © 2005–2009, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Link(s): MAX3243E
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2009
PACKAGING INFORMATION
Orderable Device
MAX3243ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
32
32
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243ECDBE4
MAX3243ECDBG4
MAX3243ECDBR
MAX3243ECDBRE4
MAX3243ECDBRG4
MAX3243ECDW
SSOP
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
RHB
RHB
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243ECDWG4
MAX3243ECDWR
MAX3243ECDWRG4
MAX3243ECPW
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
QFN
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243ECPWE4
MAX3243ECPWG4
MAX3243ECPWR
MAX3243ECPWRE4
MAX3243ECPWRG4
MAX3243ECRHBR
MAX3243ECRHBRG4
MAX3243EIDB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP
SSOP
SSOP
SSOP
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243EIDBG4
MAX3243EIDBR
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243EIDBRG4
MAX3243EIDW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243EIDWG4
MAX3243EIDWR
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MAX3243EIDWRG4
MAX3243EIPW
SOIC
DW
28
28
28
28
28
28
28
32
32
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
QFN
PW
PW
PW
PW
PW
PW
RHB
RHB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3243EIPWE4
MAX3243EIPWG4
MAX3243EIPWR
MAX3243EIPWRE4
MAX3243EIPWRG4
MAX3243EIRHBR
MAX3243EIRHBRG4
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
MAX3243ECDBR
MAX3243ECDWR
MAX3243ECPWR
MAX3243ECPWR
MAX3243ECRHBR
MAX3243EIDBR
MAX3243EIDWR
MAX3243EIPWR
MAX3243EIPWR
MAX3243EIRHBR
SSOP
SOIC
DB
DW
PW
PW
RHB
DB
28
28
28
28
32
28
28
28
28
32
2000
1000
2000
2000
3000
2000
1000
2000
2000
3000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
32.4
16.4
16.4
12.4
16.4
32.4
16.4
16.4
12.4
8.2
11.35
7.1
10.5
18.67
10.4
10.2
5.3
2.5
3.1
1.6
1.8
1.5
2.5
3.1
1.6
1.8
1.5
12.0
16.0
12.0
12.0
8.0
16.0
32.0
16.0
16.0
12.0
16.0
32.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q2
Q1
Q1
Q1
Q1
Q2
TSSOP
TSSOP
QFN
6.9
5.3
SSOP
SOIC
8.2
10.5
18.67
10.4
10.2
5.3
12.0
16.0
12.0
12.0
8.0
DW
PW
PW
RHB
11.35
7.1
TSSOP
TSSOP
QFN
6.9
5.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3243ECDBR
MAX3243ECDWR
MAX3243ECPWR
MAX3243ECPWR
MAX3243ECRHBR
MAX3243EIDBR
MAX3243EIDWR
MAX3243EIPWR
MAX3243EIPWR
MAX3243EIRHBR
SSOP
SOIC
DB
DW
PW
PW
RHB
DB
28
28
28
28
32
28
28
28
28
32
2000
1000
2000
2000
3000
2000
1000
2000
2000
3000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
49.0
33.0
33.0
29.0
33.0
49.0
33.0
33.0
29.0
TSSOP
TSSOP
QFN
SSOP
SOIC
DW
PW
PW
RHB
TSSOP
TSSOP
QFN
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI
MAX3243ECDWG4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
TI
MAX3243ECDWR
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV IEC ESD PROTECTION
TI
MAX3243ECDWRG4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
TI
MAX3243ECPWE4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV IEC ESD PROTECTION
TI
MAX3243ECPWG4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION
TI
MAX3243ECPWR
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV IEC ESD PROTECTION
TI
MAX3243ECPWRE4
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV IEC ESD PROTECTION
TI
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