MAX3238E [TI]

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD (HBM) PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器【 15千伏ESD ( HBM )保护
MAX3238E
型号: MAX3238E
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD (HBM) PROTECTION
3V至5.5V多通道RS - 232线路驱动器/接收器【 15千伏ESD ( HBM )保护

驱动器
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
FEATURES  
DB, DW, OR PW PACKAGE  
RS-232 Bus-Pin ESD Protection Exceeds  
(TOP VIEW)  
±15 kV Using Human-Body Model (HBM)  
C2+  
GND  
C2−  
C1+  
27 V+  
26  
1
28  
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
2
3
V
CC  
Operates With 3-V to 5.5-V VCC Supply  
Operates up to 400 kbit/s  
V−  
4
25 C1−  
DOUT1  
DOUT2  
DOUT3  
RIN1  
5
24 DIN1  
Five Drivers and Three Receivers  
6
23  
22  
21  
20  
19  
18  
17  
16  
15  
DIN2  
Auto-Powerdown Plus Feature Enables  
Flexible Power-Down Mode  
7
DIN3  
8
ROUT1  
ROUT2  
DIN4  
9
RIN2  
DOUT4  
RIN3  
Low Standby Current . . . 1 µA Typical  
External Capacitors . . . 4 × 0.1 µF  
10  
11  
12  
13  
14  
ROUT3  
DIN5  
Accepts 5-V Logic Input With 3.3-V Supply  
DOUT5  
FORCEON  
FORCEOFF  
Always-Active Noninverting Receiver Output  
(ROUT1B)  
ROUT1B  
INVALID  
Alternative High-Speed Pin-Compatible  
Device (1 Mbit/s) for SNx5C3238  
ESD Protection for RS-232 Interface Pins  
±15 kV – Human-Body Model (HBM)  
±8 kV – IEC61000-4-2, Contact Discharge  
±15 kV – IEC61000-4-2, Air-Gap Discharge  
RHB PACKAGE  
(TOP VIEW)  
APPLICATIONS  
32 31 30 29 28 27 26 25  
Battery-Powered Systems  
PDAs  
Notebooks  
Subnotebooks  
Laptops  
Palmtop PCs  
Hand-Held Equipment  
Modems  
1
2
3
4
5
6
7
8
24  
DOUT1  
DOUT2  
DOUT3  
RIN1  
RIN2  
DOUT4  
RIN3  
C1–  
DIN1  
DIN2  
DIN3  
ROUT1  
ROUT2  
DIN4  
23  
22  
21  
20  
19  
18  
17  
NC  
ROUT3  
9 10 11 12 13 14 15 16  
Printers  
DESCRIPTION/ORDERING INFORMATION  
The MAX3238E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV  
ESD (HBM) protection on the driver output (DOUT) and receiver input (RIN) terminals. The device meets the  
requirements of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook  
computer applications. The charge pump and four small external capacitors allow operation from a single 3-V to  
5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows  
applications using the ring indicator to transmit data while the device is powered down. This device operates at  
data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
Flexible control options for power management are featured when the serial port and driver inputs are inactive.  
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode  
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for  
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to  
1 µA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there  
is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and  
FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid signal  
is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than  
2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid  
data) if all receiver input voltages are between –0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for  
receiver input levels.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
MAX3238ECDB  
TOP-SIDE MARKING  
Tube of 50  
SSOP – DB  
MAX3238EC  
Reel of 2000  
Tube of 50  
MAX3238ECDBR  
MAX3238ECPW  
0°C to 70°C  
TSSOP – PW  
MP238EC  
Reel of 2000  
Reel of 2000  
Reel of 2000  
Tube of 50  
MAX3238ECPWR  
MAX3238ECDWR  
MAX3238ECRHBR  
MAX3238EIDB  
SOIC – DW  
QFN – RHB  
MAX3238EC  
Preview  
SSOP – DB  
MAX3238EI  
MP238EI  
Reel of 2000  
Tube of 50  
MAX3238EIDBR  
MAX3238EIPW  
–40°C to 85°C  
TSSOP – PW  
Reel of 2000  
Reel of 2000  
Reel of 2000  
MAX3238EIPWR  
MAX3238ICDWR  
MAX3238EIRHBR  
SOIC – DW  
QFN – RHB  
MAX3238EI  
Preview  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
2
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
FUNCTION TABLES  
abc  
Each Driver(1)  
INPUTS  
OUTPUT  
DOUT  
DRIVER STATUS  
TIME ELAPSED SINCE LAST  
RIN OR DIN TRANSITION  
DIN  
FORCEON  
FORCEOFF  
X
L
X
H
H
L
L
X
Z
H
L
Powered off  
H
H
H
H
H
H
X
Normal operation with  
auto-powerdown plus disabled  
H
L
X
<30 s  
<30 s  
>30 s  
>30 s  
H
L
Normal operation with  
auto-powerdown plus enabled  
H
L
L
L
Z
Z
Powered off by  
auto-powerdown plus feature  
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance  
Each Receiver(1)  
INPUTS  
FORCEOFF  
OUTPUTS  
RECEIVER STATUS  
TIME ELAPSED SINCE LAST  
RIN OR DIN TRANSITION  
ROUT2 AND  
ROUT3  
RIN1  
RIN2–RIN3  
ROUT1B  
L
H
X
X
L
L
X
L
H
L
Z
Z
H
L
Powered off while  
ROUT1B is active  
X
L
L
H
H
H
H
H
<30 s  
<30 s  
<30 s  
<30 s  
<30 s  
L
H
L
Normal operation with  
auto-powerdown plus  
disabled/enabled  
H
L
H
H
L
H
L
H
H
Open  
Open  
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off  
3
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
LOGIC DIAGRAM (POSITIVE LOGIC)  
24  
5
DIN1  
DOUT1  
23  
6
7
DIN2  
DOUT2  
DOUT3  
DOUT4  
DOUT5  
22  
DIN3  
19  
10  
12  
DIN4  
17  
DIN5  
14  
FORCEOFF  
15  
Auto-powerdown Plus  
INVALID  
13  
FORCEON  
16  
ROUT1B  
21  
8
ROUT1  
RIN1  
20  
9
ROUT2  
RIN2  
RIN3  
18  
11  
ROUT3  
4
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.3  
–0.3  
0.3  
MAX  
UNIT  
VCC  
V+  
Supply voltage range(2)  
Positive-output supply voltage range(2)  
Negative-output supply voltage range(2)  
6
V
V
V
V
7
–7  
V–  
V+ – V– Supply voltage difference(2)  
13  
Driver (FORCEOFF, FORCEON)  
Receiver  
–0.3  
–25  
6
VI  
Input voltage range  
Output voltage range  
V
V
25  
Driver  
–13.2  
–0.3  
13.2  
VCC + 0.3  
62  
VO  
Receiver (INVALID)  
DB package  
DW package  
46  
θJA  
Package thermal impedance(3)(4)  
°C/W  
PW package  
62  
RHB package  
TBD  
150  
150  
TJ  
Operating virtual junction temperature  
Storage temperature range  
°C  
°C  
Tstg  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to network GND.  
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient  
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
See Figure 6  
MIN NOM  
MAX UNIT  
VCC = 3.3 V  
VCC = 5 V  
VCC = 3.3 V  
VCC = 5 V  
3
4.5  
2
3.3  
5
3.6  
V
Supply voltage  
5.5  
5.5  
V
DIN, FORCEOFF,  
FORCEON  
VIH  
Driver and control high-level input voltage  
2.4  
0
5.5  
VIL  
VI  
Driver and control low-level input voltage  
Receiver input voltage  
DIN, FORCEOFF, FORCEON  
0.8  
25  
70  
85  
V
V
–25  
0
MAX3238EC  
MAX3238EI  
TA  
Operating free-air temperature  
°C  
–40  
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)  
PARAMETER  
TEST CONDITIONS  
MIN TYP(2)  
MAX UNIT  
II  
Input leakage current FORCEOFF, FORCEON  
±0.01  
±1  
µA  
Auto-powerdown plus  
disabled  
No load,  
0.5  
1
2
mA  
FORCEOFF and FORCEON at VCC  
Supply current  
(TA = 25°C)  
Powered off  
No load, FORCEOFF at GND  
10  
ICC  
No load, FORCEOFF at VCC  
FORCEON at GND,  
All RIN are open or grounded  
,
µA  
Auto-powerdown plus  
enabled  
1
10  
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
5
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
DRIVER SECTION  
xxx  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)  
PARAMETER  
TEST CONDITIONS  
All DOUT at RL = 3 kto GND  
MIN TYP(2) MAX UNIT  
VOH High-level output voltage  
VOL Low-level output voltage  
5
5.4  
–5.4  
V
V
All DOUT at RL = 3 kto GND  
VI = VCC  
–5  
IIH  
IIL  
High-level input current  
Low-level input current  
±0.01  
±0.01  
±1  
±1  
µA  
µA  
VI at GND  
VCC = 3.6 V,  
VO = 0 V  
±35 ±60  
±40 ±100  
10M  
IOS  
ro  
Short-circuit output current(3)  
Output resistance  
mA  
VCC = 5.5 V,  
VO = 0 V  
VCC, V+, and V– = 0 V,  
VO = ±2 V  
VO = ±12 V,  
VO = ±10 V,  
300  
VCC = 3 V to 3.6 V  
±25  
IOZ  
Output leakage current  
FORCEOFF = GND  
µA  
VCC = 4.5 V to 5.5 V  
±25  
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one  
output should be shorted at a time.  
Switching Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)  
PARAMETER  
TEST CONDITIONS  
MIN TYP(2) MAX UNIT  
CL = 1000 pF,  
One DOUT switching,  
RL = 3 k,  
See Figure 1  
Maximum data rate  
250  
400  
100  
kbit/s  
ns  
CL = 150 pF to 2500 pF,  
See Figure 2  
RL = 3 kto 7 k,  
tsk(p)  
Pulse skew(3)  
CL = 150 pF to 1000 pF  
CL = 150 pF to 2500 pF  
6
4
30  
30  
Slew rate, transition region  
(see Figure 1)  
VCC = 3.3 V,  
RL = 3 kto 7 kΩ  
SR(tr)  
V/µs  
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.  
ESD Protection  
PARAMETER  
TEST CONDITIONS  
TYP  
±15  
±15  
±8  
UNIT  
HBM  
DOUT  
IEC 61000-4-2, Air-Gap Discharge  
IEC 61000-4-2, Contact Discharge  
kV  
6
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
RECEIVER SECTION  
xxx  
Electrical Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)  
PARAMETER  
High-level output voltage  
TEST CONDITIONS  
IOH = –1 mA  
MIN  
TYP(2)  
MAX UNIT  
VOH  
VOL  
VCC – 0.6  
VCC – 0.1  
V
Low-level output voltage  
IOL = 1.6 mA  
VCC = 3.3 V  
VCC = 5 V  
0.4  
2.4  
2.4  
V
1.5  
1.8  
VIT+  
Positive-going input threshold voltage  
V
VCC = 3.3 V  
VCC = 5 V  
0.6  
0.8  
1.2  
VIT–  
Negative-going input threshold voltage  
V
1.5  
Vhys  
IOZ  
ri  
Input hysteresis (VIT+ – VIT–  
)
0.3  
V
Output leakage current (except ROUT1B)  
Input resistance  
FORCEOFF = 0 V  
±0.05  
5
±10  
µA  
kΩ  
VI = ±3 V to ±25 V  
3
7
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
Switching Characteristics(1)  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
CL = 150 pF, See Figure 3  
TYP(2) UNIT  
tPLH Propagation delay time, low- to high-level output  
tPHL Propagation delay time, high- to low-level output  
150  
150  
200  
200  
50  
ns  
ns  
ns  
ns  
ns  
CL = 150 pF, See Figure 3  
CL = 150 pF, RL = 3 k, See Figure 4  
CL = 150 pF, RL = 3 k, See Figure 4  
See Figure 3  
ten  
Output enable time  
Output disable time  
tdis  
tsk(p) Pulse skew(3)  
(1) Testing supply conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 µF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 µF  
and C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.  
ESD Protection  
PARAMETER  
TEST CONDITIONS  
TYP  
±15  
±15  
±8  
UNIT  
HBM  
RIN  
IEC 61000-4-2, Air-Gap Discharge  
IEC 61000-4-2, Contact Discharge  
kV  
7
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
AUTO-POWERDOWN PLUS SECTION  
xxx  
Electrical Characteristics  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
Receiver input threshold  
for INVALID high-level output voltage  
VT+(valid)  
VT–(valid)  
VT(invalid)  
VOH  
FORCEON = GND, FORCEOFF = VCC  
2.7  
V
Receiver input threshold  
for INVALID high-level output voltage  
FORCEON = GND, FORCEOFF = VCC  
FORCEON = GND, FORCEOFF = VCC  
–2.7  
–0.3  
V
V
V
V
Receiver input threshold  
for INVALID low-level output voltage  
0.3  
0.4  
IOH = –1 mA, FORCEON = GND,  
FORCEOFF = VCC  
INVALID high-level output voltage  
INVALID low-level output voltage  
VCC – 0.6  
IOL = 1.6 mA, FORCEON = GND,  
FORCEOFF = VCC  
VOL  
Switching Characteristics  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)  
PARAMETER  
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
Supply enable time  
MIN  
TYP(1)  
0.1  
MAX UNIT  
tvalid  
tinvalid  
ten  
µs  
µs  
µs  
50  
25  
tdis  
Receiver or driver edge to auto-powerdown plus  
15  
30  
60  
s
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
8
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MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
PARAMETER MEASUREMENT INFORMATION  
3 V  
Input  
RS-232  
0 V  
Output  
Generator  
(see Note B)  
50  
t
t
TLH  
THL  
C
L
R
L
(see Note A)  
V
V
OH  
3 V  
−3 V  
3 V  
−3 V  
3 V  
FORCEOFF  
Output  
OL  
6 V  
tTHL or tTLH  
SR(tr) +  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns,  
tf 10 ns.  
Figure 1. Driver Slew Rate  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
Generator  
(see Note B)  
50  
C
L
t
t
PLH  
PHL  
R
L
(see Note A)  
V
V
OH  
3 V  
FORCEOFF  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
A. CL includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns,  
tf 10 ns.  
Figure 2. Driver Pulse Skew  
3 V or 0 V  
FORCEON  
3 V  
−3 V  
Input  
1.5 V  
1.5 V  
Output  
Generator  
(see Note B)  
t
t
PLH  
PHL  
50  
C
L
(see Note A)  
3 V  
FORCEOFF  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
Figure 3. Receiver Propagation Delay Times  
9
Submit Documentation Feedback  
MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
PARAMETER MEASUREMENT INFORMATION (continued)  
3 V  
Input  
1.5 V  
1.5 V  
V
CC  
GND  
3 V or 0 V  
FORCEON  
0 V  
S1  
t
PHZ  
R
L
(S1 at GND)  
V
OH  
3 V or 0 V  
Output  
50%  
Output  
0.3 V  
C
L
(see Note A)  
FORCEOFF  
50  
t
t
PZL  
PLZ  
(S1 at V )  
CC  
(S1 at V )  
CC  
Generator  
(see Note B)  
0.3 V  
Output  
50%  
V
OL  
TEST CIRCUIT  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
C. tPLZ and tPHZ are the same as tdis  
D. tPZL and tPZH are the same as ten  
VOLTAGE WAVEFORMS  
.
.
Figure 4. Receiver Enable and Disable Times  
10  
Submit Documentation Feedback  
MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
PARAMETER MEASUREMENT INFORMATION (continued)  
Valid RS-232 Level, INVALID High  
ROUT  
2.7 V  
Generator  
(see Note B)  
50  
Indeterminate  
0.3 V  
If Signal Remains Within This Region  
For More Than 30 µs, INVALID Is Low  
0 V  
−0.3 V  
Indeterminate  
Auto-  
powerdown  
Plus  
INVALID  
−2.7 V  
C = 30 pF  
(see Note A)  
L
Valid RS-232 Level, INVALID High  
Auto-powerdown plus disables drivers and reduces  
supply current to 1 µA.  
FORCEOFF  
FORCEON  
DIN  
DOUT  
TEST CIRCUIT  
NOTES: A. C includes probe and jig capacitance.  
L
B. The pulse generator has the following  
characteristics: PRR = 5 kbit/s, Z = 50 , 50%  
O
duty cycle, t 10 ns, t 10 ns.  
r
f
3 V  
2.7 V  
Receiver  
Input  
0 V  
0 V  
−2.7 V  
−3 V  
t
invalid  
t
valid  
INVALID  
Output  
V
CC  
50%  
50%  
0 V  
3 V to 5 V  
Driver  
Input  
50%  
50%  
0 V  
5.5 V  
Driver  
Output  
−5.5 V  
t
dis  
t
dis  
t
en  
t
en  
V+  
V+  
V+ −0.3 V  
Supply  
Voltages  
V− +0.3 V  
V−  
V−  
Voltage Waveforms and Timing Diagrams  
Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time  
11  
Submit Documentation Feedback  
MAX3238E  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD (HBM) PROTECTION  
www.ti.com  
SLLS710AFEBRUARY 2006REVISED APRIL 2006  
APPLICATION INFORMATION  
+
C
= 0.1 µF  
BYPASS  
28  
27  
C1+  
V+  
1
2
C2+  
+
+
GND  
C3  
C2  
+
C1  
3
4
26  
25  
24  
C2−  
V−  
V
CC  
+
C1−  
C4  
5
6
7
8
9
DIN1  
DIN2  
DIN3  
DOUT1  
DOUT2  
DOUT3  
RIN1  
23  
22  
21  
20  
ROUT1  
ROUT2  
RS-232 Port  
RIN2  
Logic I/Os  
5 kΩ  
10  
11  
19  
18  
DOUT4  
RIN3  
DIN4  
ROUT3  
5 kΩ  
12  
17  
16  
DOUT5  
DIN5  
ROUT1B  
5 kΩ  
Auto-  
powerdown  
Plus  
13  
14  
15  
FORCEON  
FORCEOFF  
INVALID  
V
CC  
vs CAPACITOR VALUES  
V
CC  
C1  
C2, C3, and C4  
C3 can be connected to V or GND.  
CC  
3.3 V ± 0.15 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
0.1 µF  
0.22 µF  
0.047 µF  
0.22 µF  
0.1 µF  
0.22 µF  
0.33 µF  
1 µF  
NOTES: A. Resistor values shown are nominal.  
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum  
or electrolytic capacitors are used, they should be connected as  
shown.  
3 V to 5.5 V  
Figure 6. Typical Operating Circuit and Capacitor Values  
12  
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Mar-2007  
PACKAGING INFORMATION  
Orderable Device  
MAX3238ECDB  
MAX3238ECDBR  
MAX3238ECDW  
MAX3238ECDWR  
MAX3238ECPW  
MAX3238ECPWG4  
MAX3238ECPWR  
MAX3238ECPWRG4  
MAX3238EIDB  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP  
DB  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
28  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
SOIC  
DB  
DW  
DW  
PW  
PW  
PW  
PW  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SSOP  
SSOP  
SOIC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX3238EIDBR  
MAX3238EIDW  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
PW  
PW  
PW  
PW  
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX3238EIDWR  
MAX3238EIPW  
SOIC  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
MAX3238EIPWG4  
MAX3238EIPWR  
MAX3238EIPWRG4  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Mar-2007  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to  
discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold  
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent  
TI deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using TI components. To minimize the risks associated with customer  
products and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent  
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,  
or process in which TI products or services are used. Information published by TI regarding third-party  
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Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
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Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for  
that product or service voids all express and any implied warranties for the associated TI product or service  
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Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
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Data Converters  
DSP  
Interface  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Military  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
interface.ti.com  
logic.ti.com  
www.ti.com/audio  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Logic  
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Microcontrollers  
Low Power Wireless  
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microcontroller.ti.com  
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Copyright © 2007, Texas Instruments Incorporated  

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