MAX3237ECPW [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER; 3V至5.5V多通道RS - 232 1 - Mbit / s的线路驱动器/接收器
| 型号： | MAX3237ECPW |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 1-MBit/s LINE DRIVER/RECEIVER |
| 文件： | 总15页 (文件大小：233K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
FEATURES
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
•
ESD Protection for RS-232 I/O Pins and Logic
Input pins
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates From 250 kbits/s to 1 Mbit/s
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
– ±15 kV – Human-Body Model (HBM)
– ±8 kV – IEC61000-4-2, Contact Discharge
– ±15 kV – IEC61000-4-2, Air-Gap Discharge
APPLICATIONS
Accepts 5-V Logic Input With 3.3-V Supply
•
Battery-Powered, Hand-Held, and Portable
Equipment
PDAs and Palmtop PCs
Notebooks, Sub-Notebooks, and Laptops
Digital Cameras
Designed to Be Interchangeable With Maxim
MAX3237E
•
•
•
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Mobile Phones and Wireless Devices
DB, DW, OR PW PACKAGE
(TOP VIEW)
QFN PACKAGE
(TOP VIEW)
C2+
GND
C2−
C1+
V+
1
28
27
26
25
24
23
22
21
20
19
18
17
2
V
CC
3
32 31 30 29 28 27 26 25
V−
C1−
DIN1
4
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
C1–
DIN1
IN2
DIN3
ROUT1
ROUT2
DIN4
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
DOUT1
DOUT2
DOUT3
RIN1
5
DIN2
6
DIN3
7
ROUT1
ROUT2
DIN4
8
RIN2
DOUT4
RIN3
9
10
11
12
ROUT3
ROUT3
DIN5
NC
DOUT5
9 10 11 12 13 14 15 16
EN 13
14
16 ROUT1B
15
SHDN
MBAUD
DESCRIPTION
The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode
(MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/µs.
DESCRIPTION (CONTINUED)
The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device
is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 µA. Also, during shutdown, the
onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also
can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time,
regardless of the EN and SHDN condition.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
The MAX3237EC is characterized for operation from 0°C to 70°C. The MAX3237EI is characterized for
operation from –40°C to 85°C.
AVAILABLE OPTIONS
TA
PACKAGED DEVICES
MAX3237ECDBR
MAX3237ECPWR
0°C to 70°C
MAX3237ECRHBR (QFN package)
MAX3237ECDWR
MAX3237EIDBR
MAX3237EIPWR
–40°C to 85°C
MAX3237EIRHBR (QFN package)
MAX3237EIDWR
FUNCTION TABLE
INPUTS
OUTPUTS
ROUT
Active
Z(1)
SHDN
EN
0
DOUT
Z(1)
Z(1)
ROUT1B
Active
0
0
1
1
1
Active
0
Active
Active
Active
Z(1)
Active
1
Active
(1) Z = high impedance (off)
2
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
24
5
DIN1
DIN2
DOUT1
23
22
19
17
6
7
DOUT2
DOUT3
DOUT4
DOUT5
DIN3
DIN4
10
12
DIN5
14
15
SHDN
MBAUD
16
21
ROUT1B
ROUT1
8
RIN1
20
9
ROUT2
RIN2
RIN3
18
13
11
ROUT3
EN
3
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
6
V
7
V
V
V
V–
–7
V+ – V– Supply voltage difference(2)
13
Driver (SHDN, MBAUD, EN)
Receiver
–0.3
–25
6
25
VI
Input voltage range
Output voltage range
V
V
Driver
–13.2
–0.3
13.2
VO
Receiver
VCC + 0.3
Unlimited
62
Short-circuit duration
DOUT to GND
θJA
Package thermal impedance(3)
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Storage temperature range
°C/W
°C
260
Tstg
–65
150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 5
MIN NOM MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
5.5
5.5
5.5
0.8
25
Supply voltage
V
V
VIH
Driver and control high-level input voltage
DIN, SHDN, MBAUD, EN
DIN, SHDN, MBAUD, EN
2.4
0
VIL
VI
Driver and control low-level input voltage
Receiver input voltage
V
V
–25
0
MAX3237EC
MAX3237EI
70
TA
Operating free-air temperature
°C
–40
85
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3 V to 5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Input leakage current
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
II
DIN, SHDN, MBAUD, EN
Shutdown supply current
9
0.5
1
18
2
µA
mA
µA
No load, SHDN = VCC
SHDN = GND
Supply current
(TA = 25°C)
10
ICC
SHDN = RIN = GND,
DIN = GND or VCC
10
300
nA
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
4
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
DRIVER SECTION
xxx
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
Short-circuit output current(3)
Output resistance
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND,
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
DIN = GND
DIN = VCC
5
5.4
–5.4
V
V
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
±0.01
±0.01
±1
±1
µA
µA
mA
Ω
IIL
VI at GND
IOS
ro
VCC = 3.6 V or 3.3 V,
VCC, V+, and V– = 0 V,
VO = 0 V
±60
VO = ±2 V
300
50k
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX
UNIT
CL = 1000 pF,
MBAUD = GND
250
CL = 1000 pF,
Maximum data
rate
VCC = 4.5 V to 5.5 V,
MBAUD = VCC
RL = 3 kΩ, 1 DIN switching,
See Figure 1
1000
kbit/s
CL = 250 pF,
VCC = 3 V to 4.5 V,
MBAUD = VCC
1000
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
MBAUD = VCC or GND, See Figure 2
tsk(p)
Pulse skew(3)
Slew rate,
100
ns
MBAUD = GND
MBAUD = VCC
MBAUD = GND
6
24
4
30
150
30
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
TA = 25°C
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF,
SR(tr) transition region
(see Figure 1)
V/µs
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
RECEIVER SECTION
xxx
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
High-level output voltage
TEST CONDITIONS
IOH = –1 mA
IOL = 1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6
VCC – 0.1
V
Low-level output voltage
0.4
2.4
2.4
V
VCC = 3.3 V
VCC = 5 V
1.5
2
VIT+
Positive-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
1.5
0.5
±0.05
5
VIT–
Negative-going input threshold voltage
V
Vhys
Ioz
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
V
EN = VCC
±10
µA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2)
UNIT
ns
tPLH Propagation delay time, low- to high-level output
tPHL Propagation delay time, high- to low-level output
150
150
2.6
2.4
50
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ns
ten
Output enable time
Output disable time
µs
tdis
µs
tsk(p) Pulse skew(3)
ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3 V to 5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
TEST CONDITIONS
TYP UNIT
HBM
±15
DIN, RIN, ROUT
IEC61000-4-2, Contact Discharge
IEC61000-4-2, Air-Gap Discharge
±8
kV
±15
6
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
3 V
−3 V
−3 V
VOLTAGE WAVEFORMS
3 V
SHDN = V
Output
CC
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
SHDN = V
50%
50%
VOLTAGE WAVEFORMS
Output
CC
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V or 0 V
EN = GND
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
EN = GND
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
7
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
Input
1.5 V
1.5 V
V
CC
GND
−3 V
(S1 at GND)
S1
3 V or 0 V
t
t
PZH
PHZ
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
EN
t
t
PZL
PLZ
(S1 at V
)
(S1 at V )
CC
CC
Generator
(see Note B)
50 Ω
0.3 V
Output
50%
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 4. Receiver Enable and Disable Times
8
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MAX3237E
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
www.ti.com
SLLS709A–MAY 2006–REVISED OCTOBER 2006
APPLICATION INFORMATION
+
−
C
= 0.1 µF
BYPASS
28
27
C1+
V+
1
2
C2+
+
−
+
GND
†
C3
C2
+
−
−
C1
3
4
26
25
24
C2−
V−
V
CC
−
+
C1−
C4
5
6
7
8
DIN1
DOUT1
DOUT2
DOUT3
RIN1
23
22
21
DIN2
DIN3
ROUT1
ROUT2
5 kΩ
5 kΩ
RS-232 Port
Logic I/Os
9
20
RIN2
10
11
19
18
DOUT4
RIN3
DIN4
ROUT3
5 kΩ
12
17
16
15
DOUT5
DIN5
ROUT1B
MBAUD
13
14
EN
SHDN
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
V
CC
vs CAPACITOR VALUES
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
V
CC
C1
C2, C3, and C4
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
0.1 µF
0.22 µF
0.047 µF
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
3 V to 5.5 V
Figure 5. Typical Operating Circuit and Capacitor Values
9
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
MAX3237ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3237ECDBG4
MAX3237ECDBR
MAX3237ECDBRG4
MAX3237ECDW
MAX3237ECDWG4
MAX3237ECDWR
MAX3237ECDWRG4
MAX3237ECPW
SSOP
SSOP
SSOP
SOIC
DB
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3237ECPWG4
MAX3237ECPWR
MAX3237ECPWRG4
MAX3237EIDB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3237EIDBG4
MAX3237EIDBR
MAX3237EIDBRG4
MAX3237EIDW
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3237EIDWG4
MAX3237EIDWR
MAX3237EIDWRG4
MAX3237EIPW
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3237EIPWG4
MAX3237EIPWR
MAX3237EIPWRG4
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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