MAX3232CDR [TI]

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器,具有±15 - kV ESD保护
MAX3232CDR
型号: MAX3232CDR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD PROTECTION
3V至5.5V多通道RS - 232线路驱动器/接收器,具有±15 - kV ESD保护

线路驱动器或接收器 驱动程序和接口 接口集成电路 光电二极管 CD PC
文件: 总14页 (文件大小:321K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ  
ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ  
ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
D, DB, DW, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
D
D
RS-232 Bus-Pin ESD Protection Exceeds  
15 kV Using Human-Body Model (HBM)  
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
C1+  
V+  
V
CC  
15 GND  
1
2
3
4
5
6
7
8
16  
Operates With 3-V to 5.5-V V Supply  
CC  
14  
13  
12  
11  
10  
9
C1−  
C2+  
C2−  
V−  
DOUT1  
RIN1  
Operates Up To 250 kbit/s  
ROUT1  
DIN1  
Two Drivers and Two Receivers  
Low Supply Current . . . 300 µA Typical  
External Capacitors . . . 4 × 0.1 µF  
DOUT2  
RIN2  
DIN2  
ROUT2  
Accepts 5-V Logic Input With 3.3-V Supply  
Alternative High-Speed Pin-Compatible  
Device (1 Mbit/s)  
− SNx5C3232  
D
Applications  
− Battery-Powered Systems, PDAs,  
Notebooks, Laptops, Palmtop PCs, and  
Hand-Held Equipment  
description/ordering information  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube of 40  
MAX3232CD  
SOIC (D)  
MAX3232C  
Reel of 2500  
Tube of 40  
MAX3232CDR  
MAX3232CDW  
MAX3232CDWR  
MAX3232CDB  
MAX3232CDBR  
MAX3232CPW  
MAX3232CPWR  
MAX3232ID  
SOIC (DW)  
SSOP (DB)  
TSSOP (PW)  
SOIC (D)  
MAX3232C  
MA3232C  
MA3232C  
MAX3232I  
MAX3232I  
MB3232I  
Reel of 2000  
Tube of 80  
−0°C to 70°C  
Reel of 2000  
Tube of 90  
Reel of 2000  
Tube of 40  
Reel of 2500  
Tube of 40  
MAX3232IDR  
MAX3232IDW  
MAX3232IDWR  
MAX3232IDB  
MAX3232IDBR  
MAX3232IPW  
MAX3232IPWR  
SOIC (DW)  
SSOP (DB)  
TSSOP (PW)  
Reel of 2000  
Tube of 80  
−40°C to 85°C  
Reel of 2000  
Tube of 90  
MB3232I  
Reel of 2000  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢇꢥ  
Copyright 2004, Texas Instruments Incorporated  
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢮ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢊ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁ ꢂ ꢃꢄ ꢃ ꢄ  
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ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
description/ordering information (continued)  
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with  
15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the  
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication  
controller and the serial-port connector. The charge pump and four small external capacitors allow operation  
from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum  
of 30-V/µs driver output slew rate.  
Function Tables  
EACH DRIVER  
INPUT  
DIN  
OUTPUT  
DOUT  
L
H
L
H
H = high level, L = low  
level  
EACH RECEIVER  
INPUT  
RIN  
OUTPUT  
ROUT  
L
H
H
L
Open  
H
H = high level, L = low  
level, Open  
disconnected  
=
input  
or  
connected driver off  
logic diagram (positive logic)  
11  
10  
12  
9
14  
7
DIN1  
DIN2  
DOUT1  
DOUT2  
RIN1  
13  
8
ROUT1  
ROUT2  
RIN2  
2
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SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V  
CC  
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V  
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V  
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V  
Input voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V  
I
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V  
Output voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V  
O
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V  
+ 0.3 V  
CC  
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltages are with respect to network GND.  
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 4 and Figure 4)  
MIN NOM  
MAX  
3.6  
UNIT  
V
V
V
V
= 3.3 V  
= 5 V  
3
4.5  
2
3.3  
5
CC  
CC  
CC  
CC  
Supply voltage  
V
5.5  
= 3.3 V  
= 5 V  
V
V
Driver high-level input voltage  
DIN  
V
V
IH  
2.4  
Driver low-level input voltage  
Driver input voltage  
DIN  
DIN  
0.8  
5.5  
25  
70  
85  
IL  
0
−25  
0
V
I
V
Receiver input voltage  
MAX3232C  
MAX3232I  
T
A
Operating free-air temperature  
°C  
−40  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
CC  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.  
CC  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 4)  
PARAMETER  
TEST CONDITIONS  
No load, = 3.3 V or 5 V  
MIN TYP  
MAX  
UNIT  
I
Supply current  
V
0.3  
1
mA  
CC  
CC  
All typical values are at V  
= 3.3 V or V = 5 V, and T = 25°C.  
CC A  
CC  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V  
CC  
= 5 V 0.5 V.  
CC  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
DRIVER SECTION  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 4)  
PARAMETER  
TEST CONDITIONS  
DOUT at R = 3 kto GND, DIN = GND  
DIN = V  
MIN TYP  
MAX  
UNIT  
V
V
V
High-level output voltage  
Low-level output voltage  
High-level input current  
Low-level input current  
5
5.4  
−5.4  
0.01  
0.01  
OH  
L
DOUT at R = 3 kto GND,  
−5  
V
OL  
L
CC  
I
IH  
V = V  
I CC  
1
µA  
µA  
I
IL  
V at GND  
I
1
V
CC  
V
CC  
V
CC  
= 3.6 V,  
V
O
V
O
V
O
= 0 V  
I
Short-circuit output current  
Output resistance  
35  
60  
mA  
OS  
= 5.5 V,  
= 0 V  
2 V  
r
, V+, and V− = 0 V,  
=
300  
10M  
W
o
All typical values are at V  
CC  
= 3.3 V or V = 5 V, and T = 25°C.  
CC A  
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output  
should be shorted at a time.  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
CC  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.  
CC  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 4)  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
C
= 1000 pF,  
R
L
= 3 k,  
See Figure 1  
L
Maximum data rate  
150  
250  
300  
kbit/s  
One DOUT switching,  
R
= 3 kto 7 k,  
L
§
t
Pulse skew  
C
= 150 pF to 2500 pF  
ns  
sk(p)  
L
L
See Figure 2  
C
C
= 150 pF to 1000 pF  
6
4
30  
30  
Slew rate, transition region  
(see Figure 1)  
R
V
= 3 kto 7 k,  
= 3.3 V  
L
L
SR(tr)  
V/µs  
= 150 pF to 2500 pF  
CC  
§
All typical values are at V  
CC  
= 3.3 V or V = 5 V, and T = 25°C.  
CC A  
Pulse skew is defined as |t  
− t  
| of each channel of the same device.  
PLH PHL  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.  
CC  
CC  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ  
ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ  
ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
RECEIVER SECTION  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 4)  
PARAMETER  
High-level output voltage  
Low-level output voltage  
TEST CONDITIONS  
= −1 mA  
MIN  
−0.6V  
TYP  
V −0.1 V  
CC  
MAX  
UNIT  
V
V
V
I
I
V
CC  
OH  
OH  
= 1.6 mA  
0.4  
2.4  
2.4  
V
OL  
OL  
V
V
V
V
= 3.3 V  
= 5 V  
1.5  
CC  
CC  
CC  
CC  
V
IT+  
Positive-going input threshold voltage  
Negative-going input threshold voltage  
V
V
1.8  
1.2  
1.5  
0.3  
5
= 3.3 V  
= 5 V  
0.6  
0.8  
V
V
IT−  
Input hysteresis (V  
Input resistance  
− V  
)
V
hys  
IT+  
IT−  
r
V = 3 V to 25 V  
3
7
kW  
i
I
All typical values are at V  
CC  
= 3.3 V or V = 5 V, and T = 25°C.  
CC A  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.  
CC  
CC  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (see Note 4 and Figure 3)  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
ns  
t
t
t
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
300  
300  
300  
PLH  
PHL  
sk(p)  
C = 150 pF  
L
ns  
Pulse skew  
ns  
All typical values are at V  
Pulse skew is defined as |t  
= 3.3 V or V = 5 V, and T = 25°C.  
CC A  
CC  
− t  
| of each channel of the same device.  
PLH PHL  
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V  
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V  
CC  
= 5 V 0.5 V.  
CC  
PARAMETER MEASUREMENT INFORMATION  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
Generator  
(see Note B)  
50 Ω  
t
t
C
THL  
TLH  
L
R
(see Note A)  
L
V
OH  
OL  
3 V  
−3 V  
3 V  
Output  
TLH  
−3 V  
V
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
6 V  
or t  
SR(tr) +  
t
THL  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 , 50% duty cycle, t 10 ns, t 10 ns.  
O
r
f
Figure 1. Driver Slew Rate  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
PARAMETER MEASUREMENT INFORMATION  
3 V  
0 V  
RS-232  
Output  
1.5 V  
1.5 V  
Input  
Generator  
(see Note B)  
50 Ω  
C
t
t
L
PHL  
PLH  
R
(see Note A)  
L
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A.  
C
includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 , 50% duty cycle, t 10 ns, t 10 ns.  
O
r
f
Figure 2. Driver Pulse Skew  
3 V  
Input  
1.5 V  
1.5 V  
−3 V  
Output  
Generator  
(see Note B)  
50 Ω  
t
t
PLH  
PHL  
C
L
(see Note A)  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: Z = 50 , 50% duty cycle, t 10 ns, t 10 ns.  
O
r
f
Figure 3. Receiver Propagation Delay Times  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SLLS410I − JANUARY 2000 − REVISED JANUARY 2004  
APPLICATION INFORMATION  
1
2
3
4
16  
V
C1+  
V+  
CC  
+
C
BYPASS  
= 0.1µF  
+
15  
14  
GND  
C1  
+
C3  
DOUT1  
C1−  
C2+  
C2−  
13  
RIN1  
+
5 kΩ  
C2  
5
6
7
12  
11  
ROUT1  
DIN1  
V−  
+
C4  
10  
9
DOUT2  
RIN2  
DIN2  
8
ROUT2  
5 kΩ  
C3 can be connected to V  
or GND.  
NOTES: A. Resistor values shown are nominal.  
CC  
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be  
connected as shown.  
V
CC  
vs CAPACITOR VALUES  
V
CC  
C1  
C2, C3, C4  
3.3 V 0.3 V  
5 V 0.5 V  
3 V to 5.5 V  
0.1 µF  
0.047 µF  
0.1 µF  
0.1 µF  
0.33 µF  
0.47 µF  
Figure 4. Typical Operating Circuit and Capacitor Values  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
MAX3232CD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
MAX3232CDB  
MAX3232CDBR  
MAX3232CDR  
MAX3232CDW  
MAX3232CDWR  
MAX3232CPW  
MAX3232CPWR  
MAX3232ID  
SSOP  
SSOP  
SOIC  
DB  
DB  
D
80  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
2000  
2500  
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SOIC  
DW  
DW  
PW  
PW  
D
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
SOIC  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
SOIC  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
2000  
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
MAX3232IDB  
SSOP  
SSOP  
SOIC  
DB  
DB  
D
80  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
MAX3232IDBR  
MAX3232IDR  
MAX3232IDW  
MAX3232IDWR  
MAX3232IPW  
MAX3232IPWR  
2000  
2500  
40  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SOIC  
DW  
DW  
PW  
PW  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
SOIC  
2000  
90  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
TSSOP  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Mar-2005  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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