MAX3221ECDBRG4 [TI]
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION; 3 V至5.5 V单路RS - 232线路驱动器/接收器15千伏IEC ESD保护
| 型号： | MAX3221ECDBRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION |
| 文件： | 总17页 (文件大小：347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
FEATURES
APPLICATIONS
•
Battery-Powered, Hand-Held, and Portable
Equipment
•
ESD Protection for RS-232 Pins
– ±15 kV Human-Body Model (HBM)
– ±8 kV (IEC 61000-4-2, Contact Discharge)
– ±15 kV (IEC 61000-4-2, Air-Gap Discharge)
•
•
•
•
PDAs and Palmtop PCs
Notebooks, Subnotebooks, and Laptops
Digital Cameras
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Mobile Phones and Wireless Devices
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
DB OR PW PACKAGE
(TOP VIEW)
One Driver and One Receiver
EN
C1+
V+
FORCEOFF
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
V
CC
GND
C1−
C2+
C2−
V−
DOUT
FORCEON
DIN
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
INVALID
ROUT
– SN75C3221E and SN65C3221E
RIN
•
Auto-Powerdown Feature Automatically
Disables Drivers for Power Savings
DESCRIPTION/ORDERING INFORMATION
The MAX3221E is a single driver, single receiver RS-232 solution operating from a single VCC supply. The
RS-232 pins provide IEC G1000-4-2 ESD Protection. The device meets the requirements of TIA/EIA-232-F and
provides the electrical interface between an asynchronous communication controller and the serial-port
connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output
slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled.
If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is
reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown
condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With
auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver
input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high
(valid data) if the receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V
and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and
0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
MAX3221ECDB
TOP-SIDE MARKING
Tube of 80
SSOP – DB
TSSOP – PW
SSOP – DB
TSSOP – PW
MP221EC
Reel of 2000
Tube of 90
MAX3221ECDBR
MAX3221ECPW
–0°C to 70°C
MP221EC
MP221EI
MP221EI
Reel of 2000
Tube of 80
MAX3221ECPWR
MAX3221EIDB
Reel of 2000
Tube of 90
MAX3221EIDBR
–40°C to 85°C
MAX3221EIPW
Reel of 2000
MAX3221EIPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLES
ABC
EACH DRIVER(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER(1)
INPUTS
OUTPUT
ROUT
VALID RIN
RS-232 LEVEL
RIN
EN
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
(off), Open = disconnected input or connected driver off
2
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
11
13
10
DIN
DOUT
16
12
FORCEOFF
FORCEON
INVALID
Auto-powerdown
9
8
1
ROUT
RIN
EN
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive output supply voltage range(2)
Negative output supply voltage range(2)
6
7
V
V
V
V
V–
–7
13
6
V+ – V– Supply voltage difference(2)
DIN, FORCEOFF, FORCEON, EN
–0.3
–25
VI
Input voltage range
V
V
RIN
25
13.2
DOUT
–13.2
VO
θJA
Output voltage range
ROUT, INVALID
DB package
PW package
–0.3 VCC + 0.3
82
108
150
Package thermal impedance(3)(4)
°C/W
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 6
MIN NOM
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
V
Supply voltage
5.5
VIH
Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN
Driver and control low-level input voltage DIN, FORCEOFF, FORCEON, EN
V
2.4
VIL
VI
0.8
5.5
25
70
85
V
V
V
Driver and control input voltage
Receiver input voltage
DIN, FORCEOFF, FORCEON
0
–25
0
VI
MAX3221EC
MAX3221EI
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
3
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
FORCEOFF,
TEST CONDITIONS
MIN TYP(2) MAX UNIT
II
Input leakage current
±0.01
0.3
1
±1
µA
FORCEON, EN
No load,
FORCEOFF and
FORCEON at VCC
Auto-powerdown
disabled
1
mA
VCC = 3.3 V or 5 V, No load,
ICC
Supply current
Powered off
10
10
TA = 25°C
FORCEOFF at GND
µA
No load, FORCEOFF at VCC
FORCEON at GND,
All RIN are open or grounded
,
Auto-powerdown
enabled
1
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Driver Section Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND
5
5.4
–5.4
±0.01
±0.01
±35
V
V
VOL Low-level output voltage
DOUT at RL = 3 kΩ to GND, DIN = VCC
–5
IIH
IIL
High-level input current
Low-level input current
VI = VCC
±1
±1
µA
µA
VI = GND
VCC = 3.6 V,
VO = 0 V
±60
±60
Short-circuit
IOS
ro
mA
Ω
output current(3)
VCC = 5.5 V,
VO = 0 V
±35
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
VO = ±12 V,
VO = ±10 V,
300
10M
VCC = 3 V to 3.6 V
±25
±25
Ioff
Output leakage current
FORCEOFF = GND
µA
VCC = 4.5 V to 5.5 V
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Driver Section Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
250
MAX UNIT
Maximum data rate
Pulse skew(3)
CL = 1000 pF,
RL = 3 kΩ,
See Figure 1
See Figure 2
150
kbit/s
tsk(p)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
100
ns
30
Slew rate,
transition region
(see Figure 1)
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
SR(tr)
V/µs
30
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
Receiver Section Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX
UNIT
V
VOH
VOL
VCC – 0.6
VCC – 0.1
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
VIT–
1.4
Vhys
Ioff
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.5
V
EN = VCC
±0.05
5
±10
µA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Receiver Section Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2) UNIT
tPLH
tPHL
ten
150
150
200
200
50
ns
ns
ns
ns
ns
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
tdis
Output disable time
Pulse skew(3)
tsk(p)
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
NAME
TEST CONDITIONS
TYP UNIT
HBM
±15
RIN/DOUT
IEC G1000-4-2 Contact Discharge
IEC G1000-4-2 Air-Gap Discharge
±8
kV
±15
5
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
Auto-Powerdown Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
Receiver input threshold
for INVALID high-level output voltage
VT+(valid)
VT–(valid)
VT(invalid)
VOH
FORCEON = GND,
FORCEOFF = VCC
FORCEOFF = VCC
FORCEOFF = VCC
2.7
0.3
0.4
V
V
V
V
V
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
–2.7
–0.3
Receiver input threshold
for INVALID low-level output voltage
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
Auto-Powerdown Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Propagation delay time, low- to high-level output
TYP(1) UNIT
tvalid
tinvalid
ten
1
30
µs
µs
µs
Propagation delay time, high- to low-level output
Supply enable time
100
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
PARAMETER MEASUREMENT INFORMATION
FORCEON
3 V
3 V
0 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
3 V
−3 V
−3 V
VOLTAGE WAVEFORMS
3 V
FORCEOFF
Output
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
FORCEON
3 V
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
VOLTAGE WAVEFORMS
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
EN = V
CC
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
7
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
V
CC
GND
0 V
(S1 at GND)
S1
t
t
PZH
PHZ
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
EN
t
t
PZL
PLZ
(S1 at V
)
(S1 at V )
CC
CC
Generator
(see Note B)
50 Ω
0.3 V
Output
50%
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 4. Receiver Enable and Disable Times
8
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
PARAMETER MEASUREMENT INFORMATION
3 V
2.7 V
2.7 V
0 V
0 V
EN = GND
Receiver
Input
ROUT
−2.7 V
−2.7 V
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
50% V
t
50% V
CC
CC
INVALID
Output
0 V
Auto-
powerdown
INVALID
en
C = 30 pF
L
(see Note A)
≈V+
V+
0.3 V
V
CC
Supply
FORCEOFF
FORCEON
0 V
0.3 V
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
2.7 V
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdowndisables drivers and reduces supply
current to 1 µA.
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time
9
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MAX3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 LINE DRIVER/RECEIVER
WITH 15-kV IEC ESD PROTECTION
www.ti.com
SLLS686A–OCTOBER 2005–REVISED MAY 2006
APPLICATION INFORMATION
1
2
16
15
FORCEOFF
EN
V
CC
C1+
V+
+
C
= 0.1 µF
BYPASS
3
−
14
Auto-
powerdown
+
−
+
−
(1)
GND
C1
C3
4
5
C1−
C2+
13
DOUT
+
−
12
11
10
FORCEON
DIN
C2
C4
6
7
C2−
V−
−
+
INVALID
8
9
RIN
ROUT
5 kΩ
(1) C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected
as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
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PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
MAX3221ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3221ECDBG4
MAX3221ECDBR
MAX3221ECDBRG4
MAX3221ECPW
SSOP
SSOP
DB
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
PW
PW
PW
PW
PW
PW
DB
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3221ECPWE4
MAX3221ECPWG4
MAX3221ECPWR
MAX3221ECPWRE4
MAX3221ECPWRG4
MAX3221EIDB
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3221EIDBG4
MAX3221EIDBR
SSOP
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3221EIDBRG4
MAX3221EIPW
SSOP
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3221EIPWE4
MAX3221EIPWG4
MAX3221EIPWR
MAX3221EIPWRE4
MAX3221EIPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
MAX3221ECDBR
MAX3221ECPWR
MAX3221EIDBR
MAX3221EIPWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
12.4
16.4
12.4
8.2
7.0
8.2
7.0
6.6
5.6
6.6
5.6
2.5
1.6
2.5
1.6
12.0
8.0
16.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3221ECDBR
MAX3221ECPWR
MAX3221EIDBR
MAX3221EIPWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
29.0
33.0
29.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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