MAX202_07 [TI]
5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION; 5 - V双RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | MAX202_07 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION |
| 文件： | 总14页 (文件大小：383K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
FEATURES
•
ESD Protection for RS-232 Bus Pins
±15-kV – Human-Body Model
D, DW, N, OR PW PACKAGE
(TOP VIEW)
–
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
2
3
4
5
6
7
8
C1+
V+
VCC
15 GND
16
•
•
•
•
Operates at 5-V VCC Supply
Operates Up to 120 kbit/s
14
13
12
11
10
9
C1-
DOUT1
RIN1
C2+
C2-
External Capacitors . . . 4 × 0.1 µF
ROUT1
DIN1
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V-
DOUT2
RIN2
DIN2
ROUT2
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The MAX202 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The device operates at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output
slew rate.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
MAX202CN
TOP-SIDE MARKING
MAX202CN
PDIP – N
SOIC – D
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
MAX202CD
MAX202C
MAX202C
MAX202CDR
MAX202CDW
MAX202CDWR
MAX202CPW
MAX202CPWR
MAX202IN
0°C to 70°C
SOIC – DW
TSSOP – PW
PDIP – N
MA202C
MAX202IN
MAX202I
MAX202ID
SOIC – D
MAX202IDR
–40°C to 85°C
MAX202IDW
SOIC – DW
MAX202I
MB202I
MAX202IDWR
MAX202IPW
TSSOP – PW
MAX202IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
Function Tables
xxx
EACH DRIVER(1)
INPUT
OUTPUT
DIN
DOUT
L
H
L
H
(1) H = high level, L = low level
EACH RECEIVER(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
9
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
8
ROUT1
ROUT2
RIN2
2
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive charge pump voltage range(2)
Negative charge pump voltage range(2)
6
14
V
V
V
VCC – 0.3
–14
V–
0.3
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V – –0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
73
VO
Output voltage range
Short-circuit duration
Receivers
DOUT
D package
DW package
N package
PW package
57
θJA
Package thermal impedance(3)(4)
°C/W
67
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
(see Figure 4)
MIN
4.5
2
NOM
MAX UNIT
Supply voltage
5
5.5
V
V
V
VIH
VIL
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
DIN
DIN
DIN
0.8
5.5
30
70
85
0
–30
0
VI
V
Receiver input voltage
MAX202C
MAX202I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ±0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Suppy current
TEST CONDITIONS
No load, VCC = 5 V
MIN
TYP(2)
MAX
UNIT
ICC
8
15
mA
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
3
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
Short-circuit output current
Output resistance
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND, DIN = GND
DOUT at RL = 3 kΩ to GND, DIN = VCC
VI = VCC
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
5
9
–9
V
V
–5
15
200
–200
±60
µA
µA
mA
Ω
IIL
VI at 0 V
–15
±10
(3)
IOS
rO
VCC = 5.5 V
VO = 0 V
VCC, V+, and V– = 0 V
VO = ±2 V
300
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 50 to 1000 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 1
Maximum data rate
120
kbit/s
One DOUT switching,
CL = 2500 pF,
RL = 3 kΩ,
Propagation delay time, low- to
high-level output
tPLH(D)
tPHL(D)
tsk(p)
2
2
µs
µs
ns
All drivers loaded,
CL = 2500 pF,
See Figure 1
RL = 3 kΩ,
Propagation delay time, high- to
low-level output
All drivers loaded,
CL = 150 to 2500 pF,
See Figure 1
RL = 3 kΩ to 7 kΩ,
See Figure 2
Pulse skew(3)
300
CL = 50 to 1000 pF,
VCC = 5 V
RL = 3 kΩ to 7 kΩ,
Slew rate, transition region
(see Figure 1)
SR(tr)
3
6
30
V/µs
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PIN
TEST CONDITIONS
TYP
UNIT
DOUT, RIN
Human-body model
±15
kV
4
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (seeFigure 4)
PARAMETER
TEST CONDITIONS
IOH = –1 mA
MIN
3.5 VCC – 0.4
TYP(2)
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
ri
High-level output voltage
V
Low-level output voltage
IOL = 1.6 mA
VCC = 5 V,
VCC = 5 V,
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
TA = 25°C
TA = 25°C
1.7
0.8
0.2
3
1.2
0.5
5
V
Input hysteresis (VIT+ – VIT–
)
1
7
V
Input resistance
VI = ±3 V to ±25 V
kΩ
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
CL = 150 pF
MIN
TYP(2)
0.5
MAX
10
UNIT
µs
tPLH(R)
tPHL(R)
tsk(p)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
CL = 150 pF
0.5
10
µs
300
ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
5
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
tPLH (D)
VOH
VOL
Input
1.5 V
1.5 V
RS-232
Output
Generator
50 W
(see Note B)
tPHL (D)
CL
(see Note A)
RL
3 V
–3 V
3 V
–3 V
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
tPHL(D) or tPLH(D)
SR(tf) =
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3 V
RS-232
Output
1.5 V
1.5 V
Input
0 V
tPLH (D)
Generator
50 W
(see Note B)
CL
(see Note A)
tPHL (D)
RL
VOH
VOL
50%
50%
Output
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
–3 V
Output
Generator
50 W
(see Note B)
tPHL (R)
tPLH (R)
CL
(see Note A)
VOH
VOL
50%
50%
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
APPLICATION INFORMATION
1
2
3
4
16
15
VCC
C1+
V+
+
–
CBYPASS
= 0.1 mF,
C1
0.1 mF,
6.3 V
+
–
C3†
0.1 mF
16 V
GND
+
–
14
13
DOUT1
RIN1
C1–
C2+
C2–
V–
5 kW
C2
+
–
0.1 mF,
16 V
5
6
7
12
11
ROUT1
DIN1
C4
–
+
0.1 mF,
16 V
10
9
DOUT2
DIN2
8
RIN2
ROUT2
5 kW
†
C3 can be connected to VCC or GND.
NOTES: A . Resistor values shown are nominal.
B . Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The MAX202 requires 0.1-µF capacitors,
although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
ESD Protection
TI MAX202 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV when powered down.
7
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MAX202
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS576E–JULY 2003–REVISED APRIL 2007
APPLICATION INFORMATION (continued)
ESD Test Conditions
Stringent ESD testing is performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5. Figure 6 shows the current waveform that is generated during a
discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of
concern, and subsequently discharged into the device under test (DUT) through a 1.5-kΩ resistor.
RD
1.5 kW
CS
+
DUT
VHBM
-
100 pF
Figure 5. HBM ESD Test Circuit
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
1.0
0.5
0.0
0
50
100
150
200
Time - ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
8
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2007
PACKAGING INFORMATION
Orderable Device
MAX202CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202CDE4
MAX202CDR
SOIC
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202CDRE4
MAX202CDW
MAX202CDWE4
MAX202CDWR
MAX202CDWRE4
MAX202CPW
MAX202CPWE4
MAX202CPWR
MAX202CPWRE4
MAX202ID
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202IDE4
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202IDR
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202IDRE4
MAX202IDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202IDWE4
MAX202IDWR
MAX202IDWRE4
MAX202IPW
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX202IPWE4
MAX202IPWR
MAX202IPWRE4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Mar-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
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相关型号：
MAX2031
High-Linearity, 815MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch
MAXIM
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