概述
规格参数
数据手册
替代型号LT1009ILPE3 概述
2.5-V INTEGRATED REFERENCE CIRCUIT 2.5 -V集成参考电路 电压基准芯片 参考电压源
LT1009ILPE3 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Obsolete | 零件包装代码： | TO-92 |
| 包装说明： | TO-92, 3 PIN | 针数： | 3 |
| Reach Compliance Code： | compliant | ECCN代码： | EAR99 |
| HTS代码： | 8542.39.00.01 | 风险等级： | 5.11 |
| Is Samacsys： | N | 其他特性： | +/-5 PERCENT ADJUSTABLE REFERENCE VOLTAGE |
| 模拟集成电路 - 其他类型： | TWO TERMINAL VOLTAGE REFERENCE | JESD-30 代码： | O-PBCY-W3 |
| JESD-609代码： | e3 | 功能数量： | 1 |
| 输出次数： | 1 | 端子数量： | 3 |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 最大输出电压： | 2.52 V | 最小输出电压： | 2.48 V |
| 标称输出电压： | 2.5 V | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | TO-92 | 封装等效代码： | SIP3,.1,50 |
| 封装形状： | ROUND | 封装形式： | CYLINDRICAL |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 认证状态： | Not Qualified |
| 子类别： | Voltage References | 表面贴装： | NO |
| 技术： | BIPOLAR | 最大电压温度系数： | 35 ppm/°C |
| 温度等级： | INDUSTRIAL | 端子面层： | Matte Tin (Sn) |
| 端子形式： | WIRE | 端子节距： | 1.27 mm |
| 端子位置： | BOTTOM | 处于峰值回流温度下的最长时间： | NOT SPECIFIED |
| 微调/可调输出： | YES | 最大电压容差： | 0.2% |
| Base Number Matches： | 1 |
LT1009ILPE3 数据手册
通过下载LT1009ILPE3数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
FEATURES
D OR PW PACKAGE
(TOP VIEW)
•
•
•
•
•
•
Excellent Temperature Stability
Initial Tolerance…0.2% Max
NC
NC
NC
CATHODE
NC
CATHODE
ADJ
1
2
3
4
8
7
6
5
Dynamic Impedance…0.6 Ω Max
Wide Operating Current Range
Directly Interchangeable With LM136
ANODE
Needs No Adjustment for Minimum
Temperature Coefficient
NC − No internal connection
DESCRIPTION/ORDERING INFORMATION
LP PACKAGE
(TOP VIEW)
The LT1009 reference circuit is a precision-trimmed
2.5-V shunt regulator featuring low dynamic
impedance and a wide operating current range. The
maximum initial tolerance is ±5 mV in the LP package
and ±10 mV in the D package. The reference
tolerance is achieved by on-chip trimming, which
minimizes the initial voltage tolerance and the
ANODE
CATHODE
ADJ
temperature coefficient, αVZ
.
<br/>
Although the LT1009 needs no adjustments, a third terminal (ADJ) allows the reference voltage to be adjusted
±5% to eliminate system errors. In many applications, the LT1009 can be used as a terminal-for-terminal
replacement for the LM136-2.5, which eliminates the external trim network.
The LT1009 uses include 5-V system references, 8-bit analog-to-digital converter (ADC) and digital-to-analog
converter (DAC) references, and power-supply monitors. The device also can be used in applications such as
digital voltmeters and current-loop measurement and control systems.
The LT1009C is characterized for operation from 0°C to 70°C. The LT1009I is characterized for operation from
–40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
LT1009CD
TOP-SIDE MARKING
Tube of 75
SOIC – D
1009C
Reel of 2500
Bulk of 1000
Ammo of 2000
Reel of 2000
Tube of 150
Reel of 2000
Tube of 75
LT1009CDR
LT1009CLP
0°C to 70°C
TO-226/TO-92 – LP
LT1009CLPM
LT1009CLPR
LT1009CPW
LT1009CPWR
LT1009ID
LT1009C
TSSOP – PW
SOIC – D
1009C
1009I
Reel of 2500
Bulk of 1000
Ammo of 2000
Reel of 2000
Tube of 150
Reel of 2000
LT1009IDR
LT1009ILP
–40°C to 85°C
TO-226/TO-92 – LP
TSSOP – PW
LT1009ILPM
LT1009ILPR
LT1009IPW
LT1009I
1009I
LT1009IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1987–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
SYMBOL
ANODE
CATHODE
ADJ
SCHEMATIC
CATHODE
Q14
Q11
24 kΩ
24 kΩ
6.6 kΩ
Q8
Q7
20 pF
30 pF
Q10
10 kΩ
500 Ω
30 kΩ
Q2
Q9
Q4
ADJ
Q1
6.6 kΩ
Q6
Q3
Q12
Q5
Q13
720 Ω
ANODE
NOTE: All component values shown are nominal.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
IR
IF
Reverse current
Forward current
20
10
97
mA
mA
D package
LP package
PW package
θJA
Package thermal impedance(2)(3)
140 °C/W
149
TJ
Operating virtual junction temperature
Storage temperature range
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
Recommended Operating Conditions
MIN
0
MAX
70
UNIT
LT1009C
LT1009I
TA
Operating free-air temperature range
°C
–40
85
Electrical Characteristics
at specified free-air temperature
LT1009C
TYP
LT1009I
(1)
PARAMETER
TEST CONDITIONS
TA
UNIT
MIN
MAX
MIN
TYP
MAX
2.51
D package
2.49
2.495
2.485
2.491
0.4
2.5
2.51
2.49
2.5
25°C
LP package
2.5 2.505 2.495
2.515 2.475
2.5 2.505
VZ
VF
Reference voltage
IZ = 1 mA
V
D package
2.525
2.52
1
Full range
LP package
2.509
1
2.48
0.4
Forward voltage
Adjustment range
IF = 2 mA
IZ = 1 mA,
VADJ = GND to VZ
25°C
V
125
45
125
45
25°C
mV
IZ = 1 mA,
VADJ = 0.6 V to VZ – 0.6 V
Change in
reference voltage
with temperature
D package
5
4
15
15
∆VZ(temp)
Full range
mV
LP package
Average temperature
coefficient of
0°C to 70°C
15
25
ppm/
°C
αVZ
reference voltage(2)
–40°C to 85°C
20
35
25°C
2.6
10
12
2.6
6
Change in reference
voltage with current
∆VZ
∆VZ/∆t
ZZ
IZ = 400 µA to 10 mA
mV
Full range
10
Long-term change in
reference voltage
ppm/
khr
IZ = 1 mA
25°C
20
20
25°C
0.3
1
0.3
1
Reference impedance IZ = 1 mA
Ω
Full range
1.4
1.4
(1) Full range is 0°C to 70°C for the LT1009C and –40°C to 85°C for the LT1009I.
(2) The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified
temperature range.
3
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of
the various devices.
REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
CHANGE IN REFERENCE VOLTAGE
vs
REFERENCE CURRENT
2.53
2.52
2.51
2.5
5
4
3
2
I = 1 mA
z
2.49
2.48
2.47
1
0
−50
−25
0
25
50
75
100
125
0
4
8
12
16
20
T
A
− Free-Air Temperature − °C
I
Z
− Reference Current − mA
Figure 1.
Figure 2.
REVERSE CURRENT
vs
REVERSE VOLTAGE
FORWARD VOLTAGE
vs
FORWARD CURRENT
−1
−2
1.2
1
10
T = 25°C
J
10
0.8
0.6
0.4
0.2
0
−3
10
T = 125°C
J
−4
10
10
T = −55°C
J
T = 25°C
J
−5
0.001
0.01
0.1
1
10
0.6
1
1.4
1.8
2.2
2.6
I
F
− Forward Current − mA
V
R
− Reverse Voltage − V
Figure 3.
Figure 4.
4
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
REFERENCE IMPEDANCE
NOISE VOLTAGE
vs
FREQUENCY
vs
FREQUENCY
100
250
I = 1 mA
T = 25°C
J
z
I = 1 mA
T = −55°C to 125°C
J
z
200
10
150
100
50
1
0.1
10
100
1k
10k
100k
10
100
1k
10k
100k
f − Frequency − Hz
f − Frequency − Hz
Figure 5.
Figure 6.
TRANSIENT RESPONSE
3.5
3
Output
2.5
2
1.5
1
0.5
0
5 kΩ
Input
Output
8
4
0
Input
0
1
20
t − Time − µs
Figure 7.
5
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
APPLICATION INFORMATION
5 V to 35 V
3.6 kΩ
Output
10-kΩ
LT1009
Trim
(see Note A)
A. This does not affect temperature coefficient. It provides ±5% trim range.
Figure 8. 2.5-V Reference
3.6 V to 40 V
V+
LM334
V−
R
62 Ω
Output
LT1009
10 kΩ
Figure 9. Adjustable Reference With Wide Supply Range
LT1084
IN
OUT
V
I
V
O
ADJ
10 µF
10 µF
1.2 kΩ
374 Ω
LT1009
2 kΩ
Figure 10. Power Regulator With Low Temperature Coefficient
6
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L–MAY 1987–REVISED SEPTEMBER 2005
APPLICATION INFORMATION (continued)
5 V
5.1 kΩ
5 V
5.1 kΩ
10 kΩ
1%
LT1009
−5 V
Output
9.76 kΩ
1%
500 Ω
5 kΩ
−5 V
Figure 11. Switchable ±1.25-V Bipolar Reference
1 µF
10 kΩ
V ≥ 6 V
I
1 kΩ
−
+
2.5 V
10 kΩ
1 kΩ
LT1001C
+
+
20 µF
100 kΩ
LT1009
20 µF
Figure 12. Low-Noise 2.5-V Buffered Reference
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Sep-2005
PACKAGING INFORMATION
Orderable Device
LT1009CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CDE4
LT1009CDR
SOIC
SOIC
SOIC
SOIC
D
D
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CDRE4
LT1009CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CLP
LT1009CLPM
LT1009CLPR
LT1009CPK
LT1009CPW
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
TO-92
LP
LP
3
3
3
3
8
1000
2000
2000
TBD
TBD
TBD
TBD
CU SNPB
CU SNPB
CU SNPB
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
LP
OBSOLETE SOT-89
PK
PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CPWE4
LT1009CPWR
LT1009CPWRE4
LT1009ID
PW
PW
PW
D
8
8
8
8
8
8
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IDE4
LT1009IDR
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IDRE4
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009ILP
LT1009ILPR
LT1009IPW
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
TSSOP
LP
LP
3
3
8
1000
2000
TBD
TBD
CU SNPB
CU SNPB
Level-NC-NC-NC
Level-NC-NC-NC
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IPWE4
LT1009IPWR
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
8
8
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IPWRE4
ACTIVE
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009QDR
LT1009Y
OBSOLETE
D
Y
8
0
TBD
TBD
Call TI
Call TI
Call TI
Call TI
OBSOLETE XCEPT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Sep-2005
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
LT1009CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
3
3
3
3
3
3
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CDE4
LT1009CDR
SOIC
SOIC
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CDRE4
LT1009CDRG4
LT1009CLP
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO-92
TO-92
TO-92
TO-92
TO-92
TO-92
LP
LP
LP
LP
LP
LP
1000
1000
2000
2000
2000
2000
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
LT1009CLPE3
LT1009CLPM
LT1009CLPME3
LT1009CLPR
LT1009CLPRE3
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
LT1009CPK
LT1009CPW
OBSOLETE SOT-89
PK
3
8
TBD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009CPWE4
LT1009CPWR
LT1009CPWRE4
LT1009ID
PW
PW
PW
D
8
8
8
8
8
8
8
3
3
3
3
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IDE4
LT1009IDR
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IDRE4
LT1009ILP
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO-92
TO-92
TO-92
TO-92
TSSOP
LP
LP
LP
LP
PW
1000
1000
2000
2000
Pb-Free
(RoHS)
CU SN
CU SN
CU SN
CU SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
LT1009ILPE3
LT1009ILPR
LT1009ILPRE3
LT1009IPW
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
LT1009IPWE4
LT1009IPWR
Status (1)
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
8
8
8
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
ACTIVE
TSSOP
TSSOP
SOIC
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009IPWRE4
ACTIVE
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LT1009QDR
LT1009Y
OBSOLETE
D
Y
8
0
TBD
TBD
Call TI
Call TI
Call TI
Call TI
OBSOLETE XCEPT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.205 (5,21)
0.175 (4,44)
0.165 (4,19)
0.125 (3,17)
DIA
0.210 (5,34)
0.170 (4,32)
Seating
Plane
0.157 (4,00) MAX
0.050 (1,27)
C
0.500 (12,70) MIN
0.022 (0,56)
0.016 (0,41)
0.016 (0,41)
0.014 (0,35)
0.104 (2,65)
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
D
0.135 (3,43) MIN
0.105 (2,67)
0.095 (2,41)
0.055 (1,40)
0.045 (1,14)
1
2
3
0.105 (2,67)
0.080 (2,03)
0.105 (2,67)
0.080 (2,03)
4040001-2/C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.539 (13,70)
0.460 (11,70)
1.260 (32,00)
0.905 (23,00)
0.650 (16,50)
0.610 (15,50)
0.020 (0,50) MIN
0.098 (2,50)
0.384 (9,75)
0.335 (8,50)
0.748 (19,00)
0.217 (5,50)
0.748 (19,00)
0.689 (17,50)
0.433 (11,00)
0.335 (8,50)
0.114 (2,90)
0.094 (2,40)
0.114 (2,90)
0.094 (2,40)
0.169 (4,30)
0.146 (3,70)
DIA
0.266 (6,75)
0.234 (5,95)
0.512 (13,00)
0.488 (12,40)
TAPE & REEL
4040001-3/C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
LT1009ILPE3 CAD模型
引脚图
封装焊盘图
LT1009ILPE3 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| LT1009IZ#PBF | Linear | LT1009 Series - 2.5V Reference; Package: TO-92; Pins: 3; Temperature Range: -40&deg;C | 完全替代 |
|
| LM336Z-2.5/NOPB | TI | 电压基准二极管 | LP | 3 | 0 to 70 | 类似代替 |
|
| LM336BZ-2.5/NOPB | TI | 电压基准二极管 | LP | 3 | 0 to 70 | 类似代替 |
|
LT1009ILPE3 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| LT1009ILPM | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009ILPR | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009ILPRE3 | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009IPW | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009IPWE4 | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009IPWR | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009IPWRE4 | TI | 2.5-V INTEGRATED REFERENCE CIRCUIT | 获取价格 |
|
| LT1009IS8 | Linear | 2.5V Reference | 获取价格 |
|
| LT1009IS8#PBF | Linear | LT1009 Series - 2.5V Reference; Package: SO; Pins: 8; Temperature Range: -40&deg;C to 85&deg;C | 获取价格 |
|
| LT1009IS8#TRPBF | Linear | LT1009 Series - 2.5V Reference; Package: SO; Pins: 8; Temperature Range: -40&deg;C to 85&deg;C | 获取价格 |
|
LT1009ILPE3 相关文章
Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
- 2024-09-20
- 6
Bourns 精密环境传感器产品选型手册(英文版)
- 2024-09-20
- 9
Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
- 2024-09-20
- 8
Bourns GMOV 混合过压保护组件产品选型手册(英文版)
- 2024-09-20
- 6
