LP38690SDX-ADJ/NOPB [TI]
1A、10V 可调节低压降稳压器 | NGG | 6 | -40 to 125;
| 型号： | LP38690SDX-ADJ/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1A、10V 可调节低压降稳压器 | NGG | 6 | -40 to 125 电源电路 线性稳压器IC |
| 文件： | 总22页 (文件大小：1803K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LP38690-ADJ, LP38692-ADJ
www.ti.com
SNVS323H –DECEMBER 2004–REVISED APRIL 2013
LP38690-ADJ
LP38692-ADJ 1A Low Dropout CMOS Linear Regulators with Adjustable Output
Stable with Ceramic Output Capacitors
Check for Samples: LP38690-ADJ, LP38692-ADJ
1
FEATURES
DESCRIPTION
The LP38690/2-ADJ low dropout CMOS linear
regulators provide 2.5% precision reference voltage,
extremely low dropout voltage (450mV @ 1A load
current, VOUT = 5V) and excellent AC performance
utilizing ultra low ESR ceramic output capacitors.
2
•
Output Voltage Range of 1.25V - 9V
•
•
2.5% Adjust Pin Voltage Accuracy (25°C)
Low Dropout Voltage: 450mV @ 1A (typ, 5V
out)
•
•
•
•
•
•
•
•
Wide Input Voltage Range (2.7V to 10V)
Precision (Trimmed) Bandgap Reference
Ensured Specs for -40°C to +125°C
1µA Off-State Quiescent Current
Thermal Overload Protection
The low thermal resistance of the WSON and SOT-
223 packages allow the full operating current to be
used
even
in
high
ambient
temperature
environments.
The use of a PMOS power transistor means that no
DC base drive current is required to bias it allowing
ground pin current to remain below 100 µA
regardless of load current, input voltage, or operating
temperature.
Foldback Current Limiting
SOT-223 and 6-Lead WSON Packages
Enable Pin (LP38692-ADJ)
Dropout Voltage: 450 mV (typ) @ 1A (typ. 5V out).
Ground Pin Current: 55 µA (typ) at full load.
Adjust Pin Voltage: 2.5% (25°C) accuracy.
APPLICATIONS
•
•
•
•
Hard Disk Drives
Notebook Computers
Battery Powered Devices
Portable Instrumentation
Typical Application Circuits
V
IN
V
OUT
V
IN
V
OUT
LP38690
-ADJ
R1
ADJ
GND
1 mF *
1 mF *
R2
V
IN
V
OUT
V
V
V
IN
OUT
LP38692
-ADJ
R1
EN
V
EN
ADJ
GND
1 mF *
1 mF *
R2
VOUT = VADJ x (1 + R1/R2)
*Minimum value required for stability.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
LP38690-ADJ, LP38692-ADJ
SNVS323H –DECEMBER 2004–REVISED APRIL 2013
www.ti.com
Connection Diagrams
V
1
2
3
4
EN
ADJ
OUT
5 GND
V
V
IN
Figure 1. SOT-223 (LP38692MP-ADJ) – Top View
See Package Number NDC0005A
6
5
4
6
5
4
1
2
3
V
1
2
3
V
V
V
V
V
IN
IN
IN
IN
Exposed Pad
on Bottom
(DAP)
Exposed Pad
on Bottom
(DAP)
GND
N/C
GND
OUT
OUT
ADJ
ADJ
V
EN
Figure 2. 6-Lead WSON (LP38690SD-ADJ) – Top
View
Figure 3. 6-Lead WSON (LP38692SD-ADJ) Top
View
See Package Number NGG0006A
See Package Number NGG
PIN DESCRIPTIONS
Pin
Description
VIN
This is the input supply voltage to the regulator. For WSON package devices, both VIN pins must be tied
together for full current operation (500mA maximum per pin).
GND
Circuit ground for the regulator. For the SOT-223 package this is thermally connected to the die and functions
as a thermal connection when the soldered down to a large copper plane.
VOUT
VEN
Regulated output voltage.
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
ADJ
The adjust pin is used to set the regulated output voltage by connecting it to the external resistors R1 and R2
(see Typical Application Circuits).
DAP
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.
See WSON MOUNTING section in APPLICATION HINTS for more information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS(1)(2)
Storage Temperature Range
Lead Temp. (Soldering, 5 seconds)
ESD Rating(3)
−65°C to +150°C
260°C
2 kV
Power Dissipation(4)
Internally Limited
-0.3V to 12V
Internally Limited
−40°C to +150°C
V(max) All pins (with respect to GND)
(5)
IOUT
Junction Temperature
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.
(4) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). The junction-to-ambient thermal resistance (θJ-A) for the SOT-223 is approximately 125 °C/W for a PC board mounting
with the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat
dissipator for the SOT-223, the θJ-A drops to approximately 70 °C/W. The θJ-A values for the WSON package are also dependent on
trace area, copper thickness, and the number of thermal vias used (refer to the TI AN-1187 Application Report and the WSON
MOUNTING section in this datasheet). If power disspation causes the junction temperature to exceed specified limits, the device will go
into thermal shutdown.
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
OPERATING RATINGS
VIN Supply Voltage
2.7V to 10V
Operating Junction Temperature Range
−40°C to +125°C
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ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: VIN = VOUT + 1V, CIN = COUT = 10 µF, ILOAD = 10mA. Min/Max limits are specified through testing,
statistical correlation, or design.
Symbol
Parameter
Conditions
Min
Typ(1)
Max
Units
VIN = 2.7V
1.219
1.25
1.281
VADJ
ADJ Pin Voltage
V
3.2V ≤ VIN ≤ 10V
100 µA < IL < 1A
1.187
1.25
0.03
1.8
1.313
0.1
ΔVO/ΔVIN
ΔVO/ΔIL
Output Voltage Line Regulation(2) VO + 0.5V ≤ VIN ≤ 10V
%/V
%/A
IL = 25mA
Output Voltage Load Regulation(3) 1 mA < IL < 1A
VIN = VO + 1V
5
(VO = 1.8V)
IL = 1A
950
1600
(VO = 2.5V)
IL = 0.1A
IL = 1A
80
800
145
1300
VIN - VO
Dropout Voltage(4)
mV
(VO = 3.3V)
IL = 0.1A
IL = 1A
65
650
110
1000
(VO = 5V)
IL = 0.1A
IL = 1A
45
450
100
800
IQ
Quiescent Current
V
IN ≤ 10V, IL = 100 µA - 1A
55
100
1
VEN ≤ 0.4V, (LP38692-ADJ Only)
0.001
µA
IL(MIN)
IFB
Minimum Load Current
Foldback Current Limit
VIN - VO ≤ 4V
VIN - VO > 5V
VIN - VO < 4V
100
450
mA
dB
1500
PSRR
TSD
Ripple Rejection
VIN = VO + 2V(DC), with 1V(p-p) / 120Hz
Ripple
55
160
10
Thermal Shutdown Activation
(Junction Temp)
°C
nA
TSD (HYST) Thermal Shutdown Hysteresis
(Junction Temp)
IADJ
ADJ Input Leakage Current
VADJ = 0 - 1.5V
VIN = 10V
-100
0.01
100
en
Output Noise
BW = 10Hz to 10kHz
VO = 3.3V
0.7
0.5
µV/√Hz
VO (LEAK)
VEN
Output Leakage Current
VO = VO(NOM) + 1V @ 10VIN
Output = OFF
2
µA
Enable Voltage (LP38692-ADJ
Only)
0.4
Output = ON, VIN = 4V
Output = ON, VIN = 6V
Output = ON, VIN = 10V
VEN = 0V or 10V, VIN = 10V
1.8
3.0
4.0
-1
V
IEN
Enable Pin Leakage (LP38692-
ADJ Only)
0.001
1
µA
(1) Typical numbers represent the most likely parametric norm for 25°C operation.
(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.
(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to
full load.
(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
BLOCK DIAGRAMS
V
IN
P-FET
P-FET
-
MOSFET
DRIVER
+
ENABLE
LOGIC
N/C
FOLDBACK
CURRENT
LIMITING
V
OUT
THERMAL
SHUTDOWN
1.25V
REFERENCE
ADJ
GND
Figure 4. LP38690-ADJ Functional Diagram (WSON)
V
IN
P-FET
P-FET
-
MOSFET
DRIVER
+
ENABLE
LOGIC
V
EN
FOLDBACK
CURRENT
LIMITING
V
OUT
THERMAL
SHUTDOWN
1.25V
REFERENCE
ADJ
GND
Figure 5. LP38692-ADJ Functional Diagram (SOT-223, WSON)
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, enable pin is tied to VIN (LP38692-ADJ only), VO = 1.25V, VIN
2.7V, IL = 10mA.
=
Noise vs Frequency
Noise vs Frequency
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
C
= 10 mF
OUT
C
= 1 mF
OUT
0.2
0.0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6.
Figure 7.
Noise vs Frequency
Ripple Rejection
70
1.5
1.0
0.5
0.0
C
OUT
= 100 mF
60
50
40
30
20
10
0
V
V
(DC) = 3.25V
IN
IN
(AC) = 1V(p-p)
C
= 10 mF
OUT
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
Figure 9.
FREQUENCY (Hz)
Figure 8.
Ripple Rejection
Ripple Rejection
70
60
70
60
50
40
30
20
10
0
50
40
30
20
10
0
V
(DC) = 3.25V
IN
IN
V
V
(DC) = 3.25V
IN
IN
V
(AC) = 1V(p-p)
(AC) = 1V(p-p)
= 100 mF
C
= 1 mF
OUT
C
OUT
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10.
Figure 11.
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, enable pin is tied to VIN (LP38692-ADJ only), VO = 1.25V, VIN
=
2.7V, IL = 10mA.
VADJ vs Temperature
Line Transient Response
0.4
0.2
0
V
= 1.25V
OUT
20
10
0
C
OUT
= 100 mF
V
OUT
-0.2
-0.4
-0.6
-0.8
-1
-10
-20
4
3
2
1
V
IN
200 ms/DIV
-50 -25
0
25
50
75 100 125
TEMPERATURE (oC)
Figure 12.
Figure 13.
Line Transient Response
Line Transient Response
= 3.3V
V
OUT
V
OUT
= 1.25V
20
10
0
40
20
0
C
OUT
= 100 mF
C
OUT
= 10 mF
V
OUT
V
OUT
-10
-20
-20
-40
4
3
2
1
V
IN
5
4
3
V
IN
200 ms/DIV
Figure 14.
200 ms/DIV
Figure 15.
Line Transient Response
Line Transient Response
V
OUT
= 3.3V
V
OUT
= 1.25V
100
50
100
50
C
OUT
= 10 mF
C
OUT
= 1 mF
V
OUT
V
OUT
0
0
-50
-100
-50
-100
4
3
2
1
V
IN
5
4
3
V
IN
100 ms/DIV
Figure 16.
40 ms/DIV
Figure 17.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, enable pin is tied to VIN (LP38692-ADJ only), VO = 1.25V, VIN
2.7V, IL = 10mA.
=
Line Transient Response
Load Transient Response
100
50
V
OUT
= 3.3V
100
50
C
OUT
= 1 mF
V
OUT
0
V
OUT
0
C
= 100 mF
OUT
-50
-100
-50
-100
1
I
LOAD
5
4
3
V
IN
0.01
100 ms/DIV
200 ms/DIV
Figure 18.
Load Transient Response
= 10 mF
Figure 19.
Load Transient Response
= 10 mF
200
100
0
400
200
0
C
OUT
C
OUT
V
V
OUT
OUT
-100
-200
-200
-400
0.5
1
I
LOAD
I
LOAD
0.01
0.01
40 ms/DIV
Figure 20.
40 ms/DIV
Figure 21.
Load Transient Response
= 1 mF
Load Transient Response
= 1 mF
400
200
0
400
200
0
C
OUT
C
OUT
V
OUT
V
OUT
-200
-400
-200
-400
0.5
1
I
LOAD
I
LOAD
0.01
0.01
10 ms/DIV
Figure 22.
10 ms/DIV
Figure 23.
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, enable pin is tied to VIN (LP38692-ADJ only), VO = 1.25V, VIN
2.7V, IL = 10mA.
=
VOUT vs VIN , VOUT = 1.25V
VOUT vs VIN , VOUT = 1.80V
Figure 24.
Figure 25.
VOUT vs VIN (Power-Up)
VOUT vs VEN, ON (LP38692 Only)
Figure 26.
Figure 27.
VOUT vs VEN, OFF (LP38692 Only)
Minimum VIN vs IOUT
3.4
3.2
3
125°C
2.8
2.6
2.4
25°C
-40°C
2.2
2
0
200
400
600
800
1000
I
(mA)
OUT
Figure 28.
Figure 29.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ = 25°C, CIN = COUT = 10 µF, enable pin is tied to VIN (LP38692-ADJ only), VO = 1.25V, VIN
2.7V, IL = 10mA.
=
Dropout Voltage vs IOUT
Enable Voltage vs Temperature
1600
1400
1200
1000
800
600
400
200
0
2.3
2.1
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
V
= 1.8V
OUT
V
= 10V
IN
125°C
V
IN
= 6V
= 4V
25°C
-40°C
V
IN
-50 -25
0
25
50
75 100 125
0
200
400
600
(mA)
800
1000
TEMPERATURE (oC)
I
OUT
Figure 30.
Figure 31.
Load Regulation vs Temperature
Line Regulation vs Temperature
-1.0
-1.5
-2.0
0.034
0.032
0.03
0.028
0.026
0.024
0.022
0.02
-2.5
-3.0
-3.5
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 32.
Figure 33.
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SNVS323H –DECEMBER 2004–REVISED APRIL 2013
APPLICATION HINTS
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are required to assure stability. These capacitors must be
correctly selected for proper performance.
INPUT CAPACITOR:
An input capacitor of at least 1µF is required (ceramic recommended). The capacitor must be located not more
than one centimeter from the input pin and returned to a clean analog ground.
OUTPUT CAPACITOR:
An output capacitor is required for loop stability. It must be located less than 1 centimeter from the device and
connected directly to the output and ground pins using traces which have no other currents flowing through them.
The minimum amount of output capacitance that can be used for stable operation is 1µF. Ceramic capacitors are
recommended (the LP38690/2-ADJ was designed for use with ultra low ESR capacitors). The LP38690/2-ADJ is
stable with any output capacitor ESR between zero and 100 Ohms.
SETTING THE OUTPUT VOLTAGE:
The output voltage is set using the external resistors R1 and R2 (see Typical Application Circuits). The output
voltage will be given by the equation:
VOUT = VADJ x (1 + ( R1 / R2 ) )
(1)
Because the part has a minimum load current requirement of 100 µA, it is recommended that R2 always be 12k
Ohms or less to provide adequate loading. Even if a minimum load is always provided by other means, it is not
recommended that very high value resistors be used for R1 and R2 because it can make the ADJ node
susceptible to noise pickup. A maximum value of 100k is recommended for R2 to prevent this from occurring.
ENABLE PIN (LP38692-ADJ only):
The LP38692–ADJ has an Enable pin (EN) which allows an external control signal to turn the regulator output
On and Off. The Enable On/Off threshold has no hysteresis. The voltage signal must rise and fall cleanly, and
promptly, through the ON and OFF voltage thresholds. The Enable pin has no internal pull-up or pull-down to
establish a default condition and, as a result, this pin must be terminated either actively or passively. If the
Enable pin is driven from a source that actively pulls high and low, the drive voltage should not be allowed to go
below ground potential or higher than VIN. If the application does not require the Enable function, the pin should
be connected directly to the VIN pin.
FOLDBACK CURRENT LIMITING:
Foldback current limiting is built into the LP38690/2-ADJ which reduces the amount of output current the part can
deliver as the output voltage is reduced. The amount of load current is dependent on the differential voltage
between VIN and VOUT. Typically, when this differential voltage exceeds 5V, the load current will limit at about 450
mA. When the VIN -VOUT differential is reduced below 4V, load current is limited to about 1500 mA.
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required amount of capacitance is provided over the full
operating temperature range.
Capacitor Characteristics
CERAMIC
For values of capacitance in the 10 to 100 µF range, ceramics are usually larger and more costly than tantalums
but give superior AC performance for bypassing high frequency noise because of very low ESR (typically less
than 10 mΩ). However, some dielectric types do not have good capacitance characteristics as a function of
voltage and temperature.
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Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or
Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V
also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of
the temperature range.
X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage. Of
course, they are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
TANTALUM
Solid Tantalum capacitors have good temperature stability: a high quality Tantalum will typically show a
capacitance value that varies less than 10-15% across the full temperature range of -40°C to 125°C. ESR will
vary only about 2X going from the high to low temperature limits.
The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the stability range at room temperature).
REVERSE VOLTAGE
A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin.
Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that
the input to output voltage becomes reversed. A less common condition is when an alternate voltage source is
connected to the output.
There are two possible paths for current to flow from the output pin back to the input during a reverse voltage
condition.
1) While VIN is high enough to keep the control circuity alive, and the Enable pin (LP38692-ADJ only) is above
the VEN(ON) threshold, the control circuitry will attempt to regulate the output voltage. If the input voltage is less
than the programmed output voltage, the control circuit will drive the gate of the pass element to the full ON
condition. In this condition, reverse current will flow from the output pin to the input pin, limited only by the
RDS(ON) of the pass element and the output to input voltage differential. Discharging an output capacitor up to
1000 μF in this manner will not damage the device as the current will rapidly decay. However, continuous
reverse current should be avoided. When the Enable pin is low this condition will be prevented.
2) The internal PFET pass element has an inherent parasitic diode. During normal operation, the input voltage is
higher than the output voltage and the parasitic diode is reverse biased. However, when VIN is below the value
where the control circuity is alive, or the Enable pin is low (LP38692-ADJ only), and the output voltage is more
than 500 mV (typical) above the input voltage the parasitic diode becomes forward biased and current flows from
the output pin to the input pin through the diode. The current in the parasitic diode should be limited to less than
1A continuous and 5A peak.
If used in a dual-supply system where the regulator output load is returned to a negative supply, the output pin
must be diode clamped to ground to limit the negative voltage transition. A Schottky diode is recommended for
this protective clamp.
PCB LAYOUT
Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.
The input and output capacitors must be directly connected to the input, output, and ground pins of the regulator
using traces which do not have other currents flowing in them (Kelvin connect).
The best way to do this is to lay out CIN and COUT near the device with short traces to the VIN, VOUT, and ground
pins. The regulator ground pin should be connected to the external circuit ground so that the regulator and its
capacitors have a "single point ground".
It should be noted that stability problems have been seen in applications where "vias" to an internal ground plane
were used at the ground points of the IC and the input and output capacitors. This was caused by varying ground
potentials at these nodes resulting from current flowing through the ground plane. Using a single point ground
technique for the regulator and it’s capacitors fixed the problem. Since high current flows through the traces
going into VIN and coming from VOUT, Kelvin connect the capacitor leads to these pins so there is no voltage drop
in series with the input and output capacitors.
12
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Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP38690-ADJ LP38692-ADJ
LP38690-ADJ, LP38692-ADJ
www.ti.com
SNVS323H –DECEMBER 2004–REVISED APRIL 2013
WSON MOUNTING
The NGG0006A (No Pullback) 6-Lead WSON package requires specific mounting techniques which are detailed
in the TI AN-1187 Application Report. Referring to the section PCB Design Recommendations (Page 5), it
should be noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask
defined) type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package
pads to create a solder fillet to improve reliability and inspection.
The input current is split between two VIN pins, 1 and 6. The two VIN pins must be connected together to ensure
that the device can meet all specifications at the rated current.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN
junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be
connected directly to the ground at device lead 2 (i.e. GND). Alternately, but not recommended, the DAP may be
left floating (i.e. no electrical connection). The DAP must not be connected to any potential other than ground.
For the LP38690-ADJ and LP38692-ADJ in the NGG0006A 6- Lead WSON package, the junction-to-case
thermal rating, θJC, is 10.4°C/W, where the case is the bottom of the package at the center of the DAP. The
junction-to-ambient thermal performance for the LP38690-ADJ and LP38692-ADJ in the NGG0006A 6-Lead
WSON package, using the JEDEC JESD51 standards is summarized in the following table:
Board Type
Thermal Vias
θJC
θJA
JEDEC 2–Layer
JESD 51-3
None
10.4°C/W
237°C/W
1
2
4
6
10.4°C/W
10.4°C/W
10.4°C/W
10.4°C/W
74°C/W
60°C/W
49°C/W
45°C/W
JEDEC 4–Layer
JESD 51-7
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic interference) can degrade any integrated circuit’s
performance because of the small dimensions of the geometries inside the device. In applications where circuit
sources are present which generate signals with significant high frequency energy content (> 1 MHz), care must
be taken to ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes
from the output of a switching regulator), good ceramic bypass capacitors must be used at the input pin of the IC.
If a load is connected to the IC output which switches at high speed (such as a clock), the high-frequency current
pulses required by the load must be supplied by the capacitors on the IC output. Since the bandwidth of the
regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that frequency.
This means the effective output impedance of the IC at frequencies above 100 kHz is determined only by the
output capacitor(s).
In applications where the load is switching at high speed, the output of the IC may need RF isolation from the
load. It is recommended that some inductance be placed between the output capacitor and the load, and good
RF bypass capacitors be placed directly across the load.
PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces.
Noisy circuitry should be isolated from "clean" circuits where possible, and grounded through a separate path. At
MHz frequencies, ground planes begin to look inductive and RFI/ EMI can cause ground bounce across the
ground plane. In multi-layer PCB applications, care should be taken in layout so that noisy power and ground
planes do not radiate directly into adjacent layers which carry analog power and ground.
Copyright © 2004–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LP38690-ADJ LP38692-ADJ
LP38690-ADJ, LP38692-ADJ
SNVS323H –DECEMBER 2004–REVISED APRIL 2013
www.ti.com
OUTPUT NOISE
Noise is specified in two ways- Spot Noise or Output Noise density is the RMS sum of all noise sources,
measured at the regulator output, at a specific frequency (measured with a 1Hz bandwidth). This type of noise is
usually plotted on a curve as a function of frequency. Total Output Noise or Broad-Band Noise is the RMS
sum of spot noise over a specified bandwidth, usually several decades of frequencies.
Attention should be paid to the units of measurement. Spot noise is measured in units µV/root-Hz or nV/root-Hz
and total output noise is measured in µV(rms)
The primary source of noise in low-dropout regulators is the internal reference. Noise can be reduced in two
ways: by increasing the transistor area or by increasing the current drawn by the internal reference. Increasing
the area will decrease the chance of fitting the die into a smaller package. Increasing the current drawn by the
internal reference increases the total supply current (ground pin current).
14
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Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP38690-ADJ LP38692-ADJ
LP38690-ADJ, LP38692-ADJ
www.ti.com
SNVS323H –DECEMBER 2004–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 14
Copyright © 2004–2013, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LP38690-ADJ LP38692-ADJ
PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
LP38690SD-ADJ
NRND
ACTIVE
WSON
WSON
NGG
6
6
TBD
Call TI
Call TI
-40 to 125
-40 to 125
L112B
LP38690SD-ADJ/NOPB
NGG
Green (RoHS
& no Sb/Br)
CU SN | Call TI
Level-1-260C-UNLIM
L112B
LP38690SDX-ADJ/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L112B
LP38692MP-ADJ
NRND
SOT-223
SOT-223
NDC
NDC
5
5
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
LJNB
LJNB
LP38692MP-ADJ/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP38692MPX-ADJ/NOPB
ACTIVE
SOT-223
NDC
5
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LJNB
LP38692SD-ADJ
NRND
WSON
WSON
NGG
NGG
6
6
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
L122B
L122B
LP38692SD-ADJ/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LP38692SDX-ADJ/NOPB
ACTIVE
WSON
NGG
6
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L122B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP38690SD-ADJ
WSON
NGG
NGG
NGG
6
6
6
5
5
5
6
6
6
1000
1000
4500
1000
1000
2000
1000
1000
4500
178.0
178.0
330.0
330.0
330.0
330.0
178.0
178.0
330.0
12.4
12.4
12.4
16.4
16.4
16.4
12.4
12.4
12.4
3.3
3.3
3.3
7.0
7.0
7.0
3.3
3.3
3.3
3.3
3.3
3.3
7.5
7.5
7.5
3.3
3.3
3.3
1.0
1.0
1.0
2.2
2.2
2.2
1.0
1.0
1.0
8.0
8.0
12.0
12.0
12.0
16.0
16.0
16.0
12.0
12.0
12.0
Q1
Q1
Q1
Q3
Q3
Q3
Q1
Q1
Q1
LP38690SD-ADJ/NOPB WSON
LP38690SDX-ADJ/NOPB WSON
8.0
LP38692MP-ADJ
SOT-223 NDC
12.0
12.0
12.0
8.0
LP38692MP-ADJ/NOPB SOT-223 NDC
LP38692MPX-ADJ/NOPB SOT-223 NDC
LP38692SD-ADJ
WSON
NGG
NGG
NGG
LP38692SD-ADJ/NOPB WSON
LP38692SDX-ADJ/NOPB WSON
8.0
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP38690SD-ADJ
LP38690SD-ADJ/NOPB
LP38690SDX-ADJ/NOPB
LP38692MP-ADJ
WSON
WSON
NGG
NGG
NGG
NDC
NDC
NDC
NGG
NGG
NGG
6
6
6
5
5
5
6
6
6
1000
1000
4500
1000
1000
2000
1000
1000
4500
210.0
210.0
367.0
367.0
367.0
367.0
210.0
210.0
367.0
185.0
185.0
367.0
367.0
367.0
367.0
185.0
185.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
WSON
SOT-223
SOT-223
SOT-223
WSON
LP38692MP-ADJ/NOPB
LP38692MPX-ADJ/NOPB
LP38692SD-ADJ
LP38692SD-ADJ/NOPB
LP38692SDX-ADJ/NOPB
WSON
WSON
Pack Materials-Page 2
MECHANICAL DATA
NDC0005A
www.ti.com
MECHANICAL DATA
NGG0006A
SDE06A (Rev A)
www.ti.com
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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