LP324DR [TI]
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS; 超低功率翻两番运算放大器
| 型号： | LP324DR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS |
| 文件： | 总9页 (文件大小：240K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A–MARCH 2005–REVISED MAY 2005
FEATURES
D, N, OR PW PACKAGE
(TOP VIEW)
•
•
•
•
•
•
•
Low Supply Current . . . 85 µA Typ
Low Offset Voltage . . . 2 mV Typ
Low Input Bias Current . . . 2 nA Typ
Input Common Mode to GND
Wide Supply Voltage . . . 3 V < VCC < 32 V
Pin Compatible With LM324
Applications
1
2
3
4
5
6
7
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
1OUT
1IN−
1IN+
14
13
12
11
10
9
V
CC
2IN+
2IN−
8
2OUT
– LCD Displays
– Portable Instrumentation
– Sensor/Metering Equipment
– Consumer Electronics (MP3 Players, Toys,
Etc.)
– Power Supplies
DESCRIPTION/ORDERING INFORMATION
The LP324 and LP2902 are quadruple low-power operational amplifiers especially suited for battery-operated
applications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-low
supply current. Single-supply operation is achieved with an input common-mode range that includes GND.
The LP324 and LP2902 are ideal in applications where wide supply voltage and low power are more important
than speed and bandwidth. These applications include portable instrumentation, LCD displays, consumer
electronics (MP3 players, toys, etc.), and power supplies.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
LP324N
TOP-SIDE MARKING
LP324N
PDIP – N
SOIC – D
Tube of 25
Tube of 50
Reel of 2500
Tube of 90
Reel of 2000
Tube of 25
Tube of 50
Reel of 2500
Tube of 50
Reel of 2500
LP324D
LP324
0°C to 70°C
LP324DR
LP324PW
LP324PWR
LP2902N
TSSOP – PW
PDIP – N
LP324
LP2902N
LP2902
LP2902D
SOIC – D
–40°C to 85°C
LP2902DR
LP2902PW
LP2902PWR
TSSOP – PW
LP2902
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
SYMBOL (EACH AMPLIFIER)
−
IN−
OUT
+
IN+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A–MARCH 2005–REVISED MAY 2005
SCHEMATIC (EACH AMPLIFIER)
V
CC
OUT
IN−
IN+
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
VID
VI
Supply voltage range(2)
Differential input voltage(3)
±16 or 32
±32
V
V
V
Input voltage (either input)
–0.3
32
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VCC ≤ 15 V(4)
Unlimited
86
D package
θJA
Package thermal impedance(5)(6)
N package
80
°C/W
PW package
113
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+, with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
ESD Protection
TEST CONDITIONS
TYP
UNIT
Human-Body Model
±2
kV
2
LP324, LP2902
ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS460A–MARCH 2005–REVISED MAY 2005
Electrical Characteristics
TA = 25°C, VCC = 5 V, VIC = VCC/2, RL = 100 kΩ to GND (unless otherwise noted)
LP324
MIN TYP(3)
LP2902
MIN TYP(3)
2
(2)
PARAMETER
TEST CONDITIONS(1)
TA
UNIT
mV
nA
nA
V/mV
dB
V
MAX
4
MAX
4
25°C
Full range
25°C
2
VIO
Input offset voltage
Input bias current
Input offset current
9
10
20
40
4
2
10
20
2
2
IIB
Full range
25°C
0.2
0.5
IIO
Full range
25°C
4
8
50
40
80
75
80
75
100
90
90
85
3.6
0.7
10
5
40
30
80
75
80
75
70
90
90
85
3.6
0.7
10
5
Large-signal
voltage gain
RL = 10 kΩ to GND,
VCC = 30 V
AV
Full range
25°C
Common-mode
rejection ratio
VCC = 30 V,
VIC = 0 V to VCC – 1.5 V
CMRR
kVSR
ICC
Full range
25°C
Power-supply
rejection ratio
VCC = 5 V to 30 V
Full range
25°C
150
250
150
275
Supply current
RL = ∞
µA
V
Full range
25°C
3.4
3.4
Output voltage
swing (high)
IL = 0.35 mA to GND,
VIC = 0 V
VOH
VOL
IO
Full range
25°C
VCC – 1.9
VCC – 1.9
0.82
1
0.82
1
Output voltage
swing (low)
IL = 0.35 mA from VCC
,
V
VIC = 0 V
Full range
25°C
7
7
Output source
current
VO = 3 V, VID = 1 V
mA
Full range
25°C
4
4
4
4
VO = 1.5 V, VID = –1 V
Full range
25°C
3
3
IO
Output sink current
mA
2
4
2
4
VO = 1.5 V, VID = –1 V,
VIC = 0 V
Full range
25°C
1
1
20
15
35
40
30
45
20
15
35
40
30
45
IOS,GND Output short to GND VID = 1 V
IOS,VCC Output short to VCC VID = –1 V
mA
mA
Full range
25°C
Full range
Input offset
VIO
25°C
25°C
10
10
10
10
µV/°C
pA/°C
voltage drift
Input offset
IIO
current drift
(1) For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted)
(2) Full range is 0°C to 70°C for LP324 and –40°C to 85°C for LP2902.
(3) All typical values are at TA = 25°C.
Operating Conditions
VCC = ±15 V, TA = 25°C
PARAMETER
TYP
100
50
UNIT
GBW
SR
Gain bandwidth product
Slew rate
kHz
V/ms
3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
LP2902D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP2902DE4
LP2902DR
LP2902DRE4
LP2902N
SOIC
SOIC
D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
LP2902NE4
LP2902PW
LP2902PWE4
LP2902PWR
LP2902PWRE4
LP324D
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP324DE4
LP324DR
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP324DRE4
LP324N
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
LP324NE4
LP324PW
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LP324PWE4
LP324PWR
LP324PWRE4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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amplifier.ti.com
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