LP2981-30DBVTG4 [TI]
100-mA Ultra-Low Dropout Regulator With Shutdown, 1.25% Tolerance 5-SOT-23 -40 to 125;
| 型号： | LP2981-30DBVTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 100-mA Ultra-Low Dropout Regulator With Shutdown, 1.25% Tolerance 5-SOT-23 -40 to 125 光电二极管 输出元件 调节器 |
| 文件： | 总18页 (文件大小：578K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LP2981
www.ti.com ......................................................................................................................................................... SLVS521F–JULY 2004–REVISED AUGUST 2008
100-mA ULTRA-LOW DROPOUT REGULATOR WITH SHUTDOWN
1
FEATURES
PORTABLE APPLICATIONS
•
•
•
•
•
Mobile Phones
Laptops
Personal Digital Assistants (PDAs)
Digital Cameras and Camcorders
CD and MP3 Players
•
Output Tolerance of
–
–
0.75% (A Grade)
1.25% (Standard Grade)
•
Ultra-Low Dropout, Typically
–
–
200 mV at Full Load of 100 mA
7 mV at 1 mA
DBV (SOT-23) PACKAGE
(TOP VIEW)
•
•
•
•
•
•
•
Wide VIN Range…16 V Max
Low IQ…600 µA Typ at Full Load of 100 mA
Shutdown Current…0.01 µA Typ
Fast Transient Response to Line and Load
Overcurrent and Thermal Protection
High Peak Current Capability
VIN
GND
VOUT
NC
1
2
3
5
4
ON/OFF
NC − No connect; must be left open
ESD Protection Exceeds JESD 22
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
DESCRIPTION/ORDERING INFORMATION
The LP2981 family of fixed-output, low-dropout regulators offers exceptional, cost-effective performance for both
portable and nonportable applications. Available in fixed voltages of 2.8 V, 3 V, 3.3 V, and 5 V, the family has an
output tolerance of 0.75% for the A-grade devices (1.25% for the standard grade) and is capable of delivering
100-mA continuous load current. Standard regulator features, such as overcurrent and overtemperature
protection, are included.
The LP2981 has features that make the regulator an ideal candidate for a variety of portable applications:
•
•
•
•
Low dropout: A PNP pass element allows a typical dropout of 200 mV at 100-mA load current and 7 mV at
1-mA load.
Low quiescent current: The use of a vertical PNP process allows for quiescent currents that are considerably
lower than those associated with traditional lateral PNP regulators.
Shutdown: A shutdown feature is available, allowing the regulator to consume only 0.01 µA when the
ON/OFF pin is pulled low.
Small packaging: For the most space-constrained needs, the regulator is available in the SOT-23 package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated
LP2981
SLVS521F–JULY 2004–REVISED AUGUST 2008......................................................................................................................................................... www.ti.com
ORDERING INFORMATION(1)
VOUT
(NOM)
ORDERABLE
PART NUMBER
TOP-SIDE
TJ
PART GRADE
PACKAGE(2)
MARKING(3)
Reel of 3000
LP2981A-28DBVR
LP2981A-28DBVT
LP2981A-29DBVR
LP2981A-29DBVT
LP2981A-30DBVR
LP2981A-30DBVT
LP2981A-33DBVR
LP2981A-33DBVT
LP2981A-50DBVR
LP2981A-50DBVT
LP2981-28DBVR
LP2981-28DBVT
LP2981-29DBVR
LP2981-29DBVT
LP2981-30DBVR
LP2981-30DBVT
LP2981-33DBVR
LP2981-33DBVT
LP2981-50DBVR
LP2981-50DBVT
2.8 V
2.9 V
3 V
LP6_
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
LRB_
LP8_
LPC_
LPE_
LP5_
LP3_
LP7_
LPB_
LPD_
A grade:
0.75% tolerance
3.3 V
5 V
–40°C to 125°C
SOT-23-5 – DBV
2.8 V
2.9 V
3 V
Standard grade:
1.25% tolerance
3.3 V
5 V
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
2
Submit Documentation Feedback
Copyright © 2004–2008, Texas Instruments Incorporated
LP2981
www.ti.com ......................................................................................................................................................... SLVS521F–JULY 2004–REVISED AUGUST 2008
FUNCTIONAL BLOCK DIAGRAM
V
IN
ON/OFF
1.23 V
V
REF
−
+
R
1
V
OUT
Overcurrent/
R
2
Overtemperature
Protection
GND
BASIC APPLICATION CIRCUIT
LP2981
V
OUT
V
1
2
5
IN
3.3 µF
(see Note A)
1 µF
(see Note A)
GND
ON/OFF
(see Note B)
NC
(see Note C)
3
4
A. Minimum COUT value for stability (can be increased without limit for improved stability and transient response)
B. ON/OFF must be actively terminated. Connect to VIN if shutdown feature is not used.
C. Pin 4 (NC) must be left open. Do not connect anything to this pin.
Figure 1.
Copyright © 2004–2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
LP2981
SLVS521F–JULY 2004–REVISED AUGUST 2008......................................................................................................................................................... www.ti.com
Absolute Maximum Ratings(1)
over virtual junction temperature range (unless otherwise noted)
MIN
–0.3
MAX
16
UNIT
VIN
Continuous input voltage range(2)
ON/OFF input voltage range
Output voltage range(3)
V
V
V
VON/OFF
VOUT
–0.3
16
–0.3
9
Internally limited
(short-circuit protected)
IOUT
Output current(4)
θJA
TJ
Package thermal impedance(4)(5)
Operating virtual junction temperature
Storage temperature range
206
°C/W
°C
150
150
Tstg
–65
°C
Human-Body Model (HBM)
Machine Model (MM)
2000
200
ESD
Electrostatic discharge protection
V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The PNP pass transistor has a parasitic diode connected between the input and output. This diode normally is reverse biased
(VIN > VOUT), but will be forward biased if the output voltage exceeds the input voltage by a diode drop (see Application Information for
more details).
(3) If load is returned to a negative power supply, the output must be diode clamped to GND.
(4) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
MIN
2.2(1)
0
MAX
16
UNIT
V
VIN
Supply input voltage
ON/OFF input voltage
Input-output differential
Output current
VON/OFF
VIN – VOUT
IOUT
VIN
11
V
0.7
V
100
125
mA
°C
TJ
Virtual junction temperature
–40
(1) Minimum VIN of 2.2 V is needed for proper biasing of LDO control circuitry.
4
Submit Documentation Feedback
Copyright © 2004–2008, Texas Instruments Incorporated
LP2981
www.ti.com ......................................................................................................................................................... SLVS521F–JULY 2004–REVISED AUGUST 2008
Electrical Characteristics
at specified free-air temperature range, VIN = VOUT(NOM) + 1 V, VON/OFF = 2 V, CIN = 1 µF, IL = 1 mA, COUT = 4.7 µF
(unless otherwise noted)
LP2981A-xx
MIN TYP
LP2981-xx
MIN TYP
PARAMETER
TEST CONDITIONS
IL = 1 mA
TA
UNIT
%VNOM
%/V
MAX
MAX
1.25
2
25°C
25°C
–0.75
–1
0.75 –1.25
Output voltage
tolerance
ΔVOUT
1
–2
IL = 1 mA to 100 mA
–40°C to 125°C
25°C
–2.5
2.5
–3.5
3.5
0.007 0.014
0.032
0.007 0.014
0.032
Output voltage
line regulation
VIN = (VOUT(NOM) + 1 V) to
16 V
ΔVOUT/ΔVIN
–40°C to 125°C
25°C
1
3
5
1
3
5
IL = 0
–40°C to 125°C
25°C
7
10
7
10
IL = 1 mA
IL = 25 mA
IL = 100 mA
IL = 0
–40°C to 125°C
25°C
15
15
Dropout
VIN – VOUT
mV
voltage(1)
70
100
150
250
375
95
70
100
150
250
375
95
–40°C to 125°C
25°C
200
65
200
65
–40°C to 125°C
25°C
–40°C to 125°C
25°C
125
110
170
300
550
1000
1700
0.8
2
125
110
170
300
550
1000
1700
0.8
2
80
80
IL = 1 mA
IL = 25 mA
–40°C to 125°C
25°C
200
600
200
600
Ground pin
current
IGND
–40°C to 125°C
25°C
µA
IL = 100 mA
–40°C to 125°C
25°C
VON/OFF < 0.3 V (OFF)
VON/OFF < 0.15 V (OFF)
0.01
0.05
0.01
0.05
–40°C to 105°C
–40°C to 125°C
25°C
5
5
1.4
0.5
0.01
5
1.4
0.5
0.01
5
High = O/P ON
Low = O/P OFF
VON/OFF = 0
–40°C to 125°C
25°C
1.6
1.6
ON/OFF input
voltage(2)
VON/OFF
V
–40°C to 125°C
25°C
0.15
–1
0.15
–1
–40°C to 125°C
25°C
ON/OFF input
current
ION/OFF
µA
VON/OFF = 5 V
–40°C to 125°C
15
15
Peak output
current
IOUT(PK)
Vn
VOUT ≥ VOUT(NOM) – 5%
25°C
150
400
400
mA
Output noise
voltage (RMS)
BW = 300 Hz to 50 kHz,
COUT = 10 µF
25°C
25°C
25°C
160
63
160
63
µV
dB
ΔVOUT/ΔVIN Ripple rejection f = 1 kHz, COUT = 10 µF
Short-circuit
current
IOUT(MAX)
RL = 0 (steady state)
150
150
mA
(1) Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a
1-V differential. This dropout specification does not apply to the 1.8-V option, as the minimum VIN = 2.2 V must be observed for proper
biasing of LDO control circuitry.
(2) The ON/OFF input must be actively terminated. Connect to VIN if this function is not used (see Application Information).
Copyright © 2004–2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
LP2981
SLVS521F–JULY 2004–REVISED AUGUST 2008......................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
Capacitors
Input Capacitor (Cin)
A minimum value of 1 µF (over the entire operating temperature range) is required at the input of the LP2981. In
addition, this input capacitor should be located within 1 cm of the input pin and connected to a clean analog
ground. There is no Equivalent Series Resistance (ESR) requirement for this capacitor, and the capacitance can
be increased without limit. A good quality ceramic or tantalum capacitor can be used.
Output Capacitor (Cout
)
As a PNP regulator, the LP2981 requires the output capacitor to meet both a minimum capacitance and ESR
value. Required ESR values as a function of load current are provided for various output voltages, load currents,
and capacitances (see Figure 2 through Figure 5).
•
•
Minimum Cout: 3.3 µF (can be increased without limit to improve transient response stability margin)
ESR range: see Figure 2 through Figure 5
It is critical that both the minimum capacitance and ESR requirement be met over the entire operating
temperature range. Depending on the type of capacitor used, both of these parameters can vary significantly with
temperature (see capacitor characteristics section).
Load Current − mA
Load Current − mA
Figure 2. 5-V/3.3-µF ESR Curves
Figure 3. 5-V/10-µF ESR Curves
Load Current − mA
Load Current − mA
Figure 4. 3-V/3.3-µF ESR Curves
Figure 5. 3-V/10-µF ESR Curves
6
Submit Documentation Feedback
Copyright © 2004–2008, Texas Instruments Incorporated
LP2981
www.ti.com ......................................................................................................................................................... SLVS521F–JULY 2004–REVISED AUGUST 2008
Capacitor Characteristics
Ceramics
Due to their very low ESR values, ceramic capacitors are not suitable for use as the output capacitor. For
instance, a typical 2.2-µF ceramic capacitor has an ESR in the range of 10 mΩ to 20 mΩ and, thus, easily can
fall out of minimum ESR requirements under certain operating conditions.
If a ceramic capacitor is used at the output, a 1-Ω resistor should be placed in series with the capacitor to raise
the ESR seen by the regulator.
Tantalum
Solid tantalum capacitors are optimal choices for the LP2981, but they still must meet the minimum ESR
requirement. Note that the ESR of a tantalum capacitor increases as temperature drops, as much as doubling
from 25°C to –40°C. Thus, ESR margins must be maintained over the temperature range to prevent regulator
instability. For operation at very low temperatures, paralleling a tantalum capacitor with a ceramic one keeps the
combined ESR from increasing near the upper limit of the ESR curve.
Aluminum
Aluminum capacitors can be used, but use with the LP2981 is impractical due to their large physical dimensions.
They also must meet the ESR requirements over the full temperature range. In this regard, aluminium capacitors
are at a big disadvantage due to their sharp ESR increase as temperature drops. For example, over a
temperature drop from 20°C to –40°C, the ESR of an aluminum electrolytic capacitor can increase by a factor of
50. In addition, some of the electrolytes used in these capacitors can freeze at –25°C, making the capacitor
nonoperational.
ON/OFF Operation
The LP2981 allows for a shutdown mode via the ON/OFF pin. If the shutdown feature is not used, ON/OFF
should be connected to the input to ensure that the regulator is on at all times. To drive ON/OFF:
•
•
A LOW (≤0.3 V) turns the regulator OFF; a HIGH (≥1.6 V) turns it ON.
Use either a totem-pole output or an open-collector output with a pullup resistor tied to VIN (or another logic
supply). The HIGH signal can exceed VIN, but must not exceed the absolute maximum ratings of 20 V for the
ON/OFF pin.
•
Apply a signal with a slew rate of ≥40 mV/µs. A slow slew rate can cause the shutdown function to operate
incorrectly.
Copyright © 2004–2008, Texas Instruments Incorporated
Submit Documentation Feedback
7
LP2981
SLVS521F–JULY 2004–REVISED AUGUST 2008......................................................................................................................................................... www.ti.com
Reverse Input-Output Voltage
An inherent diode is present across the PNP pass element of the LP2981.
V
IN
V
OUT
With the anode connected to the output, this diode is reverse biased during normal operation, since the input
voltage is higher than the output. However, if the output is pulled one VBE higher than the input, or if the input is
abruptly stepped below the output, this diode is forward biased and can cause a parasitic silicon-controlled
rectifier (SCR) to latch, resulting in current flowing from the output to the input (values in excess of 100 mA can
cause damage). Thus, to prevent possible damage to the regulator in any application where the output may be
pulled above the input, an external Schottky diode must be connected between the output and input. With the
anode on output, this Schottky limits the reverse voltage across the output and input pins to 0.3 V, preventing
the regulator's internal diode from forward biasing.
Schottky
V
IN
V
OUT
LP2981
8
Submit Documentation Feedback
Copyright © 2004–2008, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2981-28DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LP53 ~ LP5G ~
LP5L)
LP2981-28DBVRE4
LP2981-28DBVRG4
LP2981-28DBVT
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
-40 to 125
TBD
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP53 ~ LP5G ~
LP5L)
LP2981-28DBVTE4
LP2981-28DBVTG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP53 ~ LP5G ~
LP5L)
LP2981-29DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LP33 ~ LP3G ~
LP3L)
LP2981-29DBVRG4
LP2981-29DBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP33 ~ LP3G ~
LP3L)
LP2981-29DBVTG4
LP2981-30DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP73 ~ LP7G ~
LP7L)
LP2981-30DBVRE4
LP2981-30DBVRG4
LP2981-30DBVT
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
-40 to 125
TBD
250
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP73 ~ LP7G ~
LP7L)
LP2981-30DBVTE4
ACTIVE
SOT-23
DBV
5
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LP73 ~ LP7G ~
LP7L)
LP2981-30DBVTG4
LP2981-33DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LPB3 ~ LPBG ~
LPBL)
LP2981-33DBVRE4
LP2981-33DBVRG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
TBD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2981-33DBVT
LP2981-33DBVTE4
LP2981-33DBVTG4
LP2981-50DBVR
LP2981-50DBVRG4
LP2981-50DBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
5
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
(LPB3 ~ LPBG ~
LPBL)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
250
250
Green (RoHS
& no Sb/Br)
(LPB3 ~ LPBG ~
LPBL)
Green (RoHS
& no Sb/Br)
(LPB3 ~ LPBG ~
LPBL)
3000
3000
250
Green (RoHS
& no Sb/Br)
(LPD3 ~ LPDG ~
LPDL)
Green (RoHS
& no Sb/Br)
(LPD3 ~ LPDG ~
LPDL)
Green (RoHS
& no Sb/Br)
(LPD3 ~ LPDG ~
LPDL)
LP2981-50DBVTG4
LP2981A-28DBVR
250
Green (RoHS
& no Sb/Br)
(LPD3 ~ LPDG ~
LPDL)
3000
Green (RoHS
& no Sb/Br)
(LP63 ~ LP6G ~
LP6L)
LP2981A-28DBVRE4
LP2981A-28DBVRG4
LP2981A-28DBVT
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
-40 to 125
TBD
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP63 ~ LP6G ~
LP6L)
LP2981A-28DBVTE4
LP2981A-28DBVTG4
LP2981A-29DBVR
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 125
-40 to 125
-40 to 125
TBD
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LRB3 ~ LRBG ~
LRBL)
LP2981A-29DBVRG4
LP2981A-29DBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LRB3 ~ LRBG ~
LRBL)
LP2981A-29DBVTG4
LP2981A-30DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP83 ~ LP8G ~
LP8L)
LP2981A-30DBVRE4
ACTIVE
SOT-23
DBV
5
TBD
Call TI
Call TI
-40 to 125
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LP2981A-30DBVRG4
LP2981A-30DBVT
ACTIVE
SOT-23
SOT-23
DBV
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP83 ~ LP8G ~
LP8L)
ACTIVE
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LP83 ~ LP8G ~
LP8L)
LP2981A-30DBVTE4
LP2981A-30DBVTG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LP83 ~ LP8G ~
LP8L)
LP2981A-33DBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(LPC3 ~ LPCG ~
LPCL)
LP2981A-33DBVRE4
LP2981A-33DBVRG4
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 125
-40 to 125
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(LPC3 ~ LPCG ~
LPCL)
LP2981A-33DBVT
LP2981A-33DBVTE4
LP2981A-33DBVTG4
LP2981A-50DBVR
LP2981A-50DBVRG4
LP2981A-50DBVT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
(LPC3 ~ LPCG ~
LPCL)
250
Green (RoHS
& no Sb/Br)
(LPC3 ~ LPCG ~
LPCL)
250
Green (RoHS
& no Sb/Br)
(LPC3 ~ LPCG ~
LPCL)
3000
3000
250
Green (RoHS
& no Sb/Br)
(LPE3 ~ LPEG ~
LPEL)
Green (RoHS
& no Sb/Br)
(LPE3 ~ LPEG ~
LPEL)
Green (RoHS
& no Sb/Br)
(LPE3 ~ LPEG ~
LPEL)
LP2981A-50DBVTG4
250
Green (RoHS
& no Sb/Br)
(LPE3 ~ LPEG ~
LPEL)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Dec-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2981-28DBVR
LP2981-28DBVR
LP2981-28DBVT
LP2981-29DBVR
LP2981-29DBVT
LP2981-30DBVR
LP2981-30DBVR
LP2981-30DBVT
LP2981-33DBVR
LP2981-33DBVR
LP2981-33DBVT
LP2981-50DBVR
LP2981-50DBVT
LP2981A-28DBVR
LP2981A-28DBVR
LP2981A-28DBVT
LP2981A-29DBVR
LP2981A-29DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
250
180.0
178.0
180.0
180.0
180.0
180.0
178.0
180.0
178.0
180.0
180.0
180.0
180.0
178.0
180.0
180.0
180.0
180.0
9.2
9.0
9.2
9.2
9.2
9.2
9.0
9.2
9.0
9.2
9.2
9.2
9.2
9.0
9.2
9.2
9.2
9.2
3.17
3.23
3.17
3.17
3.17
3.17
3.23
3.17
3.23
3.17
3.17
3.17
3.17
3.23
3.17
3.17
3.17
3.17
3.23
3.17
3.23
3.23
3.23
3.23
3.17
3.23
3.17
3.23
3.23
3.23
3.23
3.17
3.23
3.23
3.23
3.23
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3000
3000
250
3000
3000
250
3000
250
3000
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Dec-2011
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP2981A-30DBVR
LP2981A-30DBVT
LP2981A-33DBVR
LP2981A-33DBVT
LP2981A-50DBVR
LP2981A-50DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
9.2
9.2
9.2
9.2
9.2
9.2
3.17
3.17
3.17
3.17
3.17
3.17
3.23
3.23
3.23
3.23
3.23
3.23
1.37
1.37
1.37
1.37
1.37
1.37
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3000
250
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2981-28DBVR
LP2981-28DBVR
LP2981-28DBVT
LP2981-29DBVR
LP2981-29DBVT
LP2981-30DBVR
LP2981-30DBVR
LP2981-30DBVT
LP2981-33DBVR
LP2981-33DBVR
LP2981-33DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
3000
3000
250
205.0
180.0
205.0
205.0
205.0
205.0
180.0
205.0
180.0
205.0
205.0
200.0
180.0
200.0
200.0
200.0
200.0
180.0
200.0
180.0
200.0
200.0
33.0
18.0
33.0
33.0
33.0
33.0
18.0
33.0
18.0
33.0
33.0
3000
250
3000
3000
250
3000
3000
250
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Dec-2011
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2981-50DBVR
LP2981-50DBVT
LP2981A-28DBVR
LP2981A-28DBVR
LP2981A-28DBVT
LP2981A-29DBVR
LP2981A-29DBVT
LP2981A-30DBVR
LP2981A-30DBVT
LP2981A-33DBVR
LP2981A-33DBVT
LP2981A-50DBVR
LP2981A-50DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
205.0
205.0
180.0
205.0
205.0
205.0
205.0
205.0
205.0
205.0
205.0
205.0
205.0
200.0
200.0
180.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
200.0
33.0
33.0
18.0
33.0
33.0
33.0
33.0
33.0
33.0
33.0
33.0
33.0
33.0
3000
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明