LMX2572 [TI]
6.4GHz 低功耗宽带射频合成器;![LMX2572](http://pdffile.icpdf.com/pdf2/p00363/img/icpdf/LMX2572RHAR_2222326_icpdf.jpg)
型号: | LMX2572 |
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描述: | 6.4GHz 低功耗宽带射频合成器 射频 |
文件: | 总90页 (文件大小:2277K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
具有相位同步功能和 JESD204B 支持的 LMX2572 6.4GHz 低功耗宽带射
频合成器
1 特性
3 说明
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输出频率:12.5MHz 至 6.4GHz
LMX2572 是一款低功耗、高性能宽带合成器,可生成
从 12.5MHz 到 6.4GHz 之间的任何频率,而无需使用
内部倍频器。该 PLL 可提供优异的性能,而 3.3V 单
电源中的电流消耗仅为 75mA。
低功耗:75mA,3.3V 电源供电
在 100KHz 偏频和 6.4GHz 载波的情况下具有
-106dBc/Hz 的相位噪声
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PLL 品质因数:–232dBc/Hz
PLL 标称 1/f 噪声:–123.5dBc/Hz
32 位分数 N 分频器
对于数字移动无线电 (DMR) 和无线麦克风等 需要
,LMX2572 支持 FSK 调制。它支持离散电平 FSK 和
脉冲整形 FSK。离散数字 FSK 调制可通过编程或引脚
实现。
用可编程输入乘法器消除整数边界杂散
跨多个设备实现输出相位同步
支持具有可编程延迟的 JESD204B SYSREF
支持斜升和线性调频脉冲函数
支持 FSK 直接数字调制
LMX2572 允许用户同步多个器件的输出,并可支持 需
要输入和输出之间具有确定延迟的 应用。LMX2572 提
供了一个可精准调节相位的选项,以解决电路板上或器
件内的延迟不匹配问题。频率斜升发生器可在自动斜坡
生成选项或手动选项中最多合成 2 段斜坡,以实现最
大的灵活性。通过快速校准算法,用户可在不到 20μs
的时间内改变频率。 LMX2572 还支持生成或重复
SYSREF(符合 JESD204B 标准),这使其成为高速
数据转换器计时的理想低功耗、低噪声时钟源。此配置
中提供了精细的延迟调节,以解决板迹线的延迟差异。
两个可编程输出功率水平差动输出
较快的 VCO 校准速度:< 20µs
3V 至 3.5V 单电源
2 应用
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测试和测量仪器
双线制数字音频广播
低功耗无线电通信系统
卫星通信
LMX2572 集成了通过 3.3V 单电源供电的 LDO,无需
再配备板载低噪声 LDO。
无线麦克风
器件信息(1)
专有无线连接
MIMO
器件型号
LMX2572
封装
VQFN (40)
封装尺寸(标称值)
6.00mm × 6.00mm
雷达
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
高速数据转换器计时
功能方框图
CPout
Vtune
OSCinP
Pre-R
Divider
Post-R
Divider
Charge
Pump
RFoutAP
RFoutAM
,
OSCinM
x2
MULT
CSB
SCK
SDI
N-Divider
÷2/4/8…/256
Serial Interface
LDOs
RFoutBP
RFoutBM
Lock Detect or
Register Readback
Phase
Sync
Ramp Generator
FSK Generator
ꢀû
Modulator
MUXout
Enable
SYSREF
SYNC
CE
RampClk
RampDir
SysRefReq
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNAS740
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
目录
7.5 Programming........................................................... 21
7.6 Register Maps......................................................... 24
Application and Implementation ........................ 64
8.1 Application Information............................................ 64
8.2 Typical Application .................................................. 76
8.3 Do's and Don'ts....................................................... 78
Power Supply Recommendations...................... 79
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements................................................ 8
6.7 Timing Diagrams....................................................... 9
6.8 Typical Characteristics............................................ 10
Detailed Description ............................................ 15
7.1 Overview ................................................................. 15
7.2 Functional Block Diagram ....................................... 15
7.3 Feature Description................................................. 15
7.4 Device Functional Modes........................................ 20
8
9
10 Layout................................................................... 80
10.1 Layout Guidelines ................................................. 80
10.2 Layout Example .................................................... 80
11 器件和文档支持 ..................................................... 81
11.1 器件支持................................................................ 81
11.2 文档支持................................................................ 81
11.3 接收文档更新通知 ................................................. 81
11.4 社区资源................................................................ 81
11.5 商标....................................................................... 81
11.6 静电放电警告......................................................... 81
11.7 术语表 ................................................................... 81
12 机械、封装和可订购信息....................................... 81
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (October 2017) to Revision B
Page
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Changed RampDir pin description from: …ramp size selection… to: …ramp segment selection… ..................................... 4
Changed RFoutAM pin description from: High impedance… to: Low impedance….............................................................. 4
Changed RFoutAP pin description from: High impedance… to: Low impedance… .............................................................. 4
Changed RFoutBM pin description from: High impedance… to: Low impedance….............................................................. 4
Changed RFoutBP pin description from: High impedance… to: Low impedance… .............................................................. 4
Changed VbiasVCO pin decoupling capacitor requirement ................................................................................................... 5
Changed VbiasVCO2 pin decoupling capacitor requirement ................................................................................................. 5
Changed VccMASH pin decoupling capacitor requirement ................................................................................................... 5
Changed VccVCO pin decoupling capacitor requirement ...................................................................................................... 5
Changed VccVCO2 pin decoupling capacitor requirement .................................................................................................... 5
Changed VregVCO pin decoupling capacitor requirement .................................................................................................... 5
Added Vtune pin shunt capacitor requirement ....................................................................................................................... 5
Changed VOH and VOL data in Electrical Characteristics........................................................................................................ 8
Changed SCK to CSB low time symbol ................................................................................................................................ 8
已更改 图 28 ......................................................................................................................................................................... 13
已添加 charge pump gain table ............................................................................................................................................ 16
已删除 sentence 'When the device comes out of the powered down state, either by resuming the POWERDOWN bit
to zero or by pulling back CE pin HIGH (if it was powered down by CE pin), it is required that register R0 with
FCAL_EN = 1 be programmed again to re-calibrate the device.' from the Powerdown section.......................................... 18
•
已添加 sentence 'The wake-up time for the device to come out of the powered state is adjustable.' to the
Powerdown section............................................................................................................................................................... 18
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•
已更改 Programming Sequence step from: Wait 100 µs… to: Wait 500 µs… ..................................................................... 21
已更改 R6 initial programming from: No to: Depends .......................................................................................................... 21
已更改 R52 initial programming from: No to: Yes................................................................................................................. 22
Added LDO_DLY in register R6 .......................................................................................................................................... 24
2
版权 © 2017–2019, Texas Instruments Incorporated
LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
修订历史记录 (接下页)
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Changed R15[0] from: 1 to: 0 .............................................................................................................................................. 24
Changed R15 POR value .................................................................................................................................................... 24
Changed R20[14] from: 0 to: 1............................................................................................................................................. 24
Changed R52[0] from: 0 to: 1 .............................................................................................................................................. 25
已更改 register R0, FCAL_HPFD_ADJ value definition ....................................................................................................... 28
已添加 sentence 'Writing 0 to this field is prohibited.' to FCAL_EN bit description.............................................................. 28
已添加 LDO_DLY in register R6........................................................................................................................................... 30
已更改 MULT bit description from: …30 MHz… to: …40 MHz…......................................................................................... 32
已更改 register R14 default value......................................................................................................................................... 33
已更改 R15[0] from: 1 to: 0................................................................................................................................................... 33
已更改 register R20 default value......................................................................................................................................... 35
已删除 VCO_SEL_STRT_EN = 1 in Register 20 Field Descriptions.................................................................................... 35
已更改 register R46, OUTB_MUX value definition ............................................................................................................... 42
已更改 register R52 programming value .............................................................................................................................. 44
已更改 register R58, INPIN_LVL value definition ................................................................................................................. 45
已更改 from: MASH reset count… to: This register… .......................................................................................................... 48
已更改 VCO_CAPCTRL_STRT reset value ........................................................................................................................ 51
已更改 register R114, FSK_MODE_SEL value definition .................................................................................................... 61
已更改 图 165 and 图 166 .................................................................................................................................................... 65
已更改 setup procedure step from: …divide N… to: …set N = N' / 2… .............................................................................. 68
已更改 RAMP_MODE = 1 to RAMP_MANUAL = 1 in the Manual Ramping Mode section................................................. 69
已更改 RAMP_THRESH value suggestion........................................................................................................................... 69
已删除 paragraph 'For ramping that are not calibration free, the ramp waveform is more like a staircase ramp. For
all automatic ramping waveforms, be aware that there is a very small phase disturbance as the VCO crosses over
the integer boundary, so one might consider using the input Multiplier to avoid these or timing the VCO calibration at
integer boundaries.' from the Automatic Ramping Mode section......................................................................................... 70
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已更改 ADR_HOLD = 1 to ADD_HOLD = 1 ......................................................................................................................... 74
已添加 an application section for external loop filter ............................................................................................................ 75
已添加 an application section for powerup wake up time..................................................................................................... 75
Changes from Original (August 2017) to Revision A
Page
•
已更改 将“预告信息”更改为“生产数据发布”............................................................................................................................. 1
Copyright © 2017–2019, Texas Instruments Incorporated
3
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
5 Pin Configuration and Functions
RHA Package
40-Pin VQFN
Top View
CE
GND
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
RampClk
VrefVCO2
SysRefReq
VbiasVCO2
VccVCO2
GND
VbiasVCO
GND
SYNC
DAP
GND
VccDIG
OSCinP
OSCinM
VregIN
CSB
RFoutAP
RFoutAM
VccBUF
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Chip enable. High impedance CMOS input. 1.8-V to 3.3-V logic. Active HIGH powers on the
device.
CE
1
Input
CPout
CSB
12
24
—
Output
Input
Charge pump output. Place C1 of loop filter close to this pin.
SPI latch. High impedance CMOS input. 1.8-V to 3.3-V logic.
RF ground.
DAP
Ground
2, 4, 25, 31,
34, 39
Ground
VCO ground.
GND
6, 14, 40
Ground
Ground
Output
Input
Digital ground.
13
20
9
Charge pump ground.
MUXout
OSCinM
OSCinP
Multiplexed output pin. Configurable between lock detect and register readback.
Reference input clock (–). High impedance self-biasing pin. Requires AC-coupling.
Reference input clock (+). High impedance self-biasing pin. Requires AC-coupling.
8
Input
Ramp trigger in automatic ramping mode or ramp clock in manual ramping mode. High
impedance CMOS input. 1.8-V to 3.3-V logic.
RampClk
RampDir
30
32
Input
Input
Ramp trigger in automatic ramping mode or ramp segment selection in manual ramping
mode. High impedance CMOS input. 1.8-V to 3.3-V logic.
RFoutAM
RFoutAP
22
23
Output
Output
Differential output A (–). Low impedance output. Requires AC-coupling.
Differential output A (+). Low impedance output. Requires AC-coupling.
Differential output B (–). Low impedance output. Requires AC-coupling. Configurable
between RF output or SYSREF output.
RFoutBM
RFoutBP
18
19
Output
Output
Differential output B (+). Low impedance output. Requires AC-coupling. Configurable
between RF output or SYSREF output.
4
Copyright © 2017–2019, Texas Instruments Incorporated
LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
SCK
SDI
NO.
16
Input
Input
SPI clock. High impedance CMOS input. 1.8-V to 3.3-V logic.
SPI data. High impedance CMOS input. 1.8-V to 3.3-V logic.
17
Phase synchronization trigger. Configurable to accept CMOS input (1.8-V to 3.3-V logic) or
differential input.
SYNC
5
Input
SYSREF request for JESD204B support. Configurable to accept CMOS input (1.8-V to 3.3-V
logic) or differential input.
SysRefReq
VbiasVARAC
VbiasVCO
28
33
3
Input
Bypass
Bypass
VCO Varactor bias. Connect a 10-µF decoupling capacitor to VCO ground.
VCO bias. Connect a 470-nF (X7R) decoupling capacitor to VCO ground as close to this pin
as possible.
VbiasVCO2
VccBUF
27
21
11
7
Bypass
Supply
Supply
Supply
Supply
Supply
Supply
Bypass
Bypass
VCO bias. Connect a 100-nF (X7R) decoupling capacitor to VCO ground.
Supply for output buffers. Connect a 0.1-µF decoupling capacitor to RF ground.
Supply for charge pump. Connect a 0.1-µF decoupling capacitor to charge pump ground.
Digital power supply. Connect a 0.1-µF decoupling capacitor to digital ground.
Digital power supply. Connect a 1-µF decoupling capacitor to digital ground.
Supply for VCO. Connect a 1-µF decoupling capacitor to VCO ground.
Supply for VCO. Connect a 1-µF decoupling capacitor to VCO ground.
VCO supply reference. Connect a 10-µF decoupling capacitor to VCO ground.
VCO supply reference. Connect a 10-µF decoupling capacitor to VCO ground.
VccCP
VccDIG
VccMASH
VccVCO
VccVCO2
VrefVCO
VrefVCO2
15
37
26
36
29
Input reference path regulator output. Connect a 1-µF decoupling capacitor to RF ground as
close to this pin as possible.
VregIN
VregVCO
Vtune
10
38
35
Bypass
Bypass
Input
VCO regulator node. Connect a 10-nF decoupling capacitor to VCO ground.
VCO tuning voltage input. Connect a 1.5-nF or more capacitor to VCO ground. See External
Loop Filter for details.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
3.6
UNIT
V
VCC
VIN
TJ
Power supply voltage
Digital IO input voltage
Junction temperature
Storage temperature
–0.3
VCC + 0.3
150
V
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 2017–2019, Texas Instruments Incorporated
5
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
°C
TA
TJ
Ambient temperature
Junction temperature
–40
85
125
°C
6.4 Thermal Information
LMX2572
THERMAL METRIC(1)
RHA (VQFN)
40 PINS
25.5
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
14.4
8.0
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ΨJB
7.9
RθJC(bot)
1.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
3.0 V ≤ VCC ≤ 3.5 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted)
PARAMETER
POWER SUPPLY
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCC
Supply voltage
3
3.3
75
79
82
86
2.5
3.5
V
fPD = 20 MHz; ICPout = 1.25 mA
fPD = 100 MHz; ICPout = 2.5 mA
fPD = 20 MHz; ICPout = 1.25 mA
fPD = 100 MHz; ICPout = 2.5 mA
Direct VCO
output(1)
ICC
Supply current
mA
Divided down
output(2)
ICCPD
Power down current
INPUT SIGNAL PATH
OSC_2X = 0 (Doubler bypassed)
OSC_2X = 1 (Doubler enabled)
Single-ended input buffer
5
5
250
125
3.6
1
fOSCin
OSCin input frequency
MHz
V
0.3
0.15
10
VOSCin
OSCin input voltage(3)
Differential input buffer
fMULTin
fMULTout
PLL
Multiplier input frequency
Multiplier output frequency
40
MULT ≥ 3
MHz
60
150
Integer channel
1st and 2nd order modulator
3rd order modulator
4th order modulator
CPG = 1
0.25
250
200
160
120
5
5
5
fPD
Phase detector frequency(4)
MHz
µA
625
1250
1875
···
CPG = 2
ICPout
Charge pump current
CPG = 3
···
CPG = 15
6875
(1) fOSCin = 100 MHz; fVCO = fOUT = 6.4 GHz; POUT = 0 dBm; OSC_2X = 0; MULT = 1; one RF output.
(2) fOSCin = 100 MHz; fVCO = 6.4 GHz; fOUT = 3.2 GHz; POUT = 0 dBm; OSC_2X = 0; MULT = 1; one RF output.
(3) See OSCin Configuration for definition of OSCin input voltage.
(4) For lower VCO frequencies, the N-divider minimum value can limit the phase detector frequency.
6
Copyright © 2017–2019, Texas Instruments Incorporated
LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
Electrical Characteristics (continued)
3.0 V ≤ VCC ≤ 3.5 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted)
PARAMETER
Normalized PLL 1/f noise(5)
TEST CONDITIONS
MIN
TYP
–123.5
–232
MAX
UNIT
PNPLL_1/f
Integer channel(6)
Fractional channel(7)
dBc/Hz
PNPLL_Flat
Normalized PLL noise floor(5)
VCO frequency
–232
VCO
fVCO
3200
6400
MHz
10 kHz
100 kHz
1 MHz
–88
–111
–131
–150
–87.5
–111
–131.5
–150
–86.5
–111
–131
–150
–85
fVCO = 3.4 GHz
fVCO = 3.9 GHz
fVCO = 4.4 GHz
fVCO = 4.9 GHz
fVCO = 5.4 GHz
fVCO = 5.9 GHz
10 MHz
10 kHz
100 kHz
1 MHz
10 MHz
10 kHz
100 kHz
1 MHz
10 MHz
10 kHz
100 kHz
1 MHz
PNVCO
Open loop VCO phase noise
dBc/Hz
–110
–130.5
–149.5
–84.5
–109
–129.5
–149
–84
10 MHz
10 kHz
100 kHz
1 MHz
10 MHz
10 kHz
100 kHz
1 MHz
–108.5
–129
–148
39
10 MHz
fVCO = 3.4 GHz
fVCO = 3.9 GHz
fVCO = 4.4 GHz
fVCO = 4.9 GHz
fVCO = 5.4 GHz
fVCO = 5.9 GHz
44
55
KVCO
VCO gain
MHz/V
60
69
62
No assist
130
fOSCin = fPD = 100 MHz; Switch
between 3.2 GHz and 6.4 GHz
tVCOcal
VCO calibration-time(8)
Partial assist
50
µs
°C
Full assist
5
|ΔTCL
|
Allowable temperature drift(9) VCO not being re-calibrated, –40°C ≤ TA ≤ 85°C
125
(5) Measured with a clean OSCin signal with a high slew rate using a wide loop bandwidth. The noise metrics model the PLL noise for an
infinite loop bandwidth as: PLL_Total = 10*log[10(PLL_Flat/10)+10(PLL_Flicker/10)]; PLL_Flat = PN1 Hz + 20*log(N) + 10*log(fPD); PLL_Flicker
= PN10 kHz - 10*log(Offset/10 kHz) + 20*log(fOUT/1 GHz)
(6) fOSCin = 200 MHz; fPD = 100 MHz; fVCO = fOUT = 6 GHz
(7) fOSCin = 200 MHz; fPD = 100 MHz; fVCO = fOUT = 6.001 GHz; Fractional denominator = 1000.
(8) See VCO Calibration for details.
(9) Not tested in production. Ensured by characterization. Allowable temperature drift refers to programming the device at an initial
temperature and allowing this temperature to drift WITHOUT reprogramming the device, and still have the device stay at lock. This
change could be up or down in temperature and the specification does not apply to temperatures that go outside the recommended
operating temperatures of the device.
Copyright © 2017–2019, Texas Instruments Incorporated
7
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
Electrical Characteristics (continued)
3.0 V ≤ VCC ≤ 3.5 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RF OUTPUT
fOUT
RF output frequency
12.5
6400
MHz
dBm
POUT
Single-ended output power
fOUT = 6.4GHz
4.5
–20
–37
–25
–13
14
fVCO = fOUT = 6.4 GHz
H2OUT
Second harmonic
OUTx_PWR
= 50
fVCO = 6.4 GHz, fOUT = 3.2 GHz
fVCO = fOUT = 6.4 GHz
dBc
ps
H3OUT
Third harmonic
fVCO = 6.4 GHz, fOUT = 3.2 GHz
fOUT = 3.2 GHz
|tskewCH|
Channel to channel skew
PHASE SYNCHRONIZATION
Category 3
5
5
100
200
OSCin input frequency with
SYNC
fOSCinSYNC
|tskewSYNC|
MHz
ns
Categories 1 and 2
After phase synchronization;
fOSCinSYNC = fOUT = 100 MHz
OSCin to RFout skew
2
DIGITAL INTERFACE
VIH
VIL
IIH
High-level input voltage
1.4
VCC
0.4
25
V
µA
V
Low-level input voltage
High-level input current
Low-level input current
High-level output voltage
Low-level output voltage
–25
–25
IIL
25
VOH
VOL
Load current = –5 mA
Load current = 5 mA
VCC – 0.5
MUXout pin
0.5
6.6 Timing Requirements
3.0 V ≤ VCC ≤ 3.5 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
SERIAL INTERFACE WRITE TIMING
fSCK
tCE
SCK frequency
1 / (tCWL+ tCWH
)
75
MHz
ns
SCK to CSB low time
SDI to SCK setup time
SDI to SCK hold time
SCK pulse width high
SCK pulse width low
CSB to SCK setup time
CSB pulse width high
5
2
2
5
5
5
2
tCS
ns
tCH
ns
tCWH
tCWL
tCES
tEWH
图 1
ns
ns
ns
ns
SERIAL INTERFACE READ TIMING
fSCK
tCE
SCK frequency
1 / (tCWL+ tCWH
)
50
MHz
ns
SCK to CSB low time
SDI to SCK setup time
SDI to SCK hold time
SCK pulse width high
SCK pulse width low
CSB to SCK setup time
CSB pulse width high
10
10
10
10
10
10
10
tCS
ns
tCH
ns
tCWH
tCWL
tCES
tEWH
图 1
ns
ns
ns
ns
SYNC AND SYSREFREQ TIMING
tCS
tCH
Pin to OSCin setup time
Pin to OSCin hold time
2.5
2
ns
ns
图 2
8
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6.7 Timing Diagrams
MSB
(R/W)
Address
(7-bit)
LSB
(D0)
SDI
SCK
(D15 œ D1)
tCS
tCH
1st
2nd
3rd œ 7th
8th
9th œ 23rd
24th
tCE
tCES
tCWH
tEWH
tCWL
Read back register value
16-bit
MUXout
CSB
图 1. Serial Interface Timing Diagram
SYNC
SysRefReq
tCS
tCH
OSCin
图 2. Trigger Signals Timing Diagram
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6.8 Typical Characteristics
At TA = 25°C, unless otherwise noted
-40
-60
-40
-60
3400 MHz
3900 MHz
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
1
1
1
10
100
Offset (kHz)
1000
10000 40000
1
1
1
10
100
Offset (kHz)
1000
10000 40000
D009
D010
图 3. Open-Loop VCO Phase Noise at 3.4 GHz
图 4. Open-Loop VCO Phase Noise at 3.9 GHz
-40
-60
-40
-60
4400 MHz
4900 MHz
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
10
100
Offset (kHz)
1000
10000 40000
10
100
Offset (kHz)
1000
10000 40000
D011
D012
图 5. Open-Loop VCO Phase Noise at 4.4 GHz
图 6. Open-Loop VCO Phase Noise at 4.9 GHz
-40
-60
-40
-60
5400 MHz
5900 MHz
-80
-80
-100
-120
-140
-160
-100
-120
-140
-160
10
100
1000
10000 40000
10
100
1000
10000 40000
Offset (kHz)
Offset (kHz)
D013
D014
图 7. Open-Loop VCO Phase Noise at 5.4 GHz
图 8. Open-Loop VCO Phase Noise at 5.9 GHz
10
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Typical Characteristics (接下页)
At TA = 25°C, unless otherwise noted
-60
-60
-70
3400 MHz
3400 MHz
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
1
1
1
10
100
Offset (kHz)
1000
10000
100000
1
1
1
10
100
Offset (kHz)
1000
10000
100000
D015
D024
图 9. Wide Band Phase Noise at 3.4 GHz
图 10. Narrow Band Phase Noise at 3.4 GHz
-60
-70
-60
-70
3900 MHz
3900 MHz
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
10
100
Offset (kHz)
1000
10000
100000
10
100
Offset (kHz)
1000
10000
100000
D016
D025
图 11. Wide Band Phase Noise at 3.9 GHz
图 12. Narrow Band Phase Noise at 3.9 GHz
-60
-70
-60
-70
4400 MHz
4400 MHz
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
10
100
1000
10000
100000
10
100
1000
10000
100000
Offset (kHz)
Offset (kHz)
D017
D026
图 13. Wide Band Phase Noise at 4.4 GHz
图 14. Narrow Band Phase Noise at 4.4 GHz
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Typical Characteristics (接下页)
At TA = 25°C, unless otherwise noted
-60
-60
-70
4900 MHz
4900 MHz
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
1
1
1
10
100
Offset (kHz)
1000
10000
100000
1
1
1
10
100
Offset (kHz)
1000
10000
100000
D018
D027
图 15. Wide Band Phase Noise at 4.9 GHz
图 16. Narrow Band Phase Noise at 4.9 GHz
-60
-70
-60
-70
5400 MHz
5400 MHz
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
10
100
Offset (kHz)
1000
10000
100000
10
100
Offset (kHz)
1000
10000
100000
D019
D028
图 17. Wide Band Phase Noise at 5.4 GHz
图 18. Narrow Band Phase Noise at 5.4 GHz
-60
-70
-60
-70
5900 MHz
5900 MHz
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
10
100
1000
10000
100000
10
100
1000
10000
100000
Offset (kHz)
Offset (kHz)
D020
D029
图 19. Wide Band Phase Noise at 5.9 GHz
图 20. Narrow Band Phase Noise at 5.9 GHz
12
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Typical Characteristics (接下页)
At TA = 25°C, unless otherwise noted
-75
-75
-85
6400 MHz
3200 MHz
1600 MHz
800 MHz
400 MHz
200 MHz
100 MHz
50 MHz
6400 MHz
3200 MHz
1600 MHz
800 MHz
400 MHz
200 MHz
100 MHz
50 MHz
-85
-95
-95
-105
-115
-125
-135
-145
-155
-165
-105
-115
-125
-135
-145
-155
-165
25 MHz
25 MHz
1
10
100
1000
10000
100000
1
10
100
1000
10000
100000
Offset (kHz)
Offset (kHz)
D021
D030
图 21. Direct and Divided Down Outputs
图 22. Direct and Divided Down Outputs
-80
-100
-120
-140
-160
-80
-100
-120
-140
-160
1
10
100
1000
10000
100000
1
10
100
1000
10000
100000
Offset (kHz)
Offset (kHz)
D022
D023
fVCO = 6397 MHz; fPD = 100 MHz; 3rd order modulator; Fractional
denominator = 1000; Loop filter bandwidth = 115 kHz
图 23. Wide Band Fractional Spurs
fVCO = 6397 MHz; fPD = 100 MHz; 3rd order modulator; Fractional
denominator = 232 – 1; Loop filter bandwidth = 115 kHz
图 24. Wide Band Fractional Spurs
6800
6400
6000
5600
5200
4800
4400
4000
3600
3200
2800
2400
6800
VCO frequency jump from 6400 MHz to 3200 MHz
6400
6000
5600
5200
4800
4400
4000
3600
3200
2800
2400
2000
1600
2000
VCO frequency jump from 3200 MHz to 6400 MHz
1600
-20
0
20
40
60
80 100 120 140 160 180
-20
0
20
40
60
80 100 120 140 160 180
Time (µs)
Time (µs)
D003
D004
图 25. VCO Calibration Time
图 26. VCO Calibration Time
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Typical Characteristics (接下页)
At TA = 25°C, unless otherwise noted
6240
10
8
RAMP_THRESH = 30 MHz
6200
6160
6120
6080
6040
6000
5960
6
4
2
OUTx_PWR = 15
OUTx_PWR = 31
OUTx_PWR = 63
0
-2
-4
-6
-8
-100
0
100 200 300 400 500 600 700 800 900
0
800 1600 2400 3200 4000 4800 5600 6400
Time (µs)
fOUT (MHz)
D005
D001
图 27. Automatic Ramping
图 28. Output Power vs Frequency
487.5032
487.5026
487.5019
487.5013
487.5006
487.5
425.085
425.068
425.051
425.034
425.017
425
487.4994
487.4987
487.4981
487.4974
487.4968
424.983
424.966
424.949
424.932
424.915
-250 -200 -150 -100 -50
0
50 100 150 200 250
-500
-300
-100
100
300
500
Time (µs)
Time (µs)
D007
D008
图 29. 4-Level GFSK Modulation
图 30. Discrete-Level FSK Modulation
14
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7 Detailed Description
7.1 Overview
The LMX2572 is a low-power, high-performance, wideband frequency synthesizer with integrated VCO and
output divider. The VCO operates from 3.2 to 6.4 GHz, and this can be combined with the output divider to
produce any frequency in the range of 12.5 MHz to 6.4 GHz. Within the input path, there are two dividers and a
multiplier for flexible frequency planning. The multiplier also allows reduction of spurs by moving the frequencies
away from the integer boundary.
The PLL is a fractional-N PLL with a programmable delta-sigma modulator up to 4th order. The fractional
denominator is a programmable 32-bit long that can supply fine frequency steps easily below the 1-Hz resolution.
The denominator can also be used to do exact fractions like 1/3, 7/1000, and many others.
For applications where deterministic or adjustable phase is desired, the SYNC pin can be used to get the phase
relationship between the OSCin and RFout pins deterministic. Once this is done, the phase can be adjusted in
very fine steps of the VCO period divided by the fractional denominator.
The ultra-fast VCO calibration is ideal for applications where the frequency must be swept or abruptly changed.
The frequency can be manually programmed, or the device can be set up to do ramps and chirps.
The JESD204B support includes using the RFoutB output to create a differential SYSREF output that can be
either a single pulse, series of pulse, or a continuous stream of pulses. These pulses are synchronous with the
RFoutA signal with an adjustable delay.
The FSK generator can support FSK generation in discrete 2-, 4-, or 8-level FSK, or it can any arbitrary level
FSK making it ideal to support pulse-shaped FSK modulation such as GFSK.
The LMX2572 device requires only a single 3.3-V power supply and uses very low current. The internal power
supplies are provided by integrated LDOs, eliminating the need for high performance external LDOs.
Digital logic interface is compatible with 1.8-V input. The user can program the device through the serial
interface. The device can be powered down through register programming or by toggling the Chip Enable (CE)
pin.
7.2 Functional Block Diagram
CPout
Vtune
OSCinP
OSCinM
Pre-R
Divider
Post-R
Divider
Charge
Pump
RFoutAP
RFoutAM
,
x2
MULT
CSB
SCK
SDI
N-Divider
÷2/4/8…/256
Serial Interface
LDOs
RFoutBP
RFoutBM
Lock Detect or
Register Readback
Phase
Sync
Ramp Generator
FSK Generator
ꢀû
Modulator
MUXout
Enable
SYSREF
SYNC
CE
RampClk
RampDir
SysRefReq
7.3 Feature Description
7.3.1 Reference Oscillator Input
The OSCin pins are used as a frequency reference input to the device. The input is high impedance and requires
AC-coupling capacitors at the pin. The OSCin pins can be driven single-ended with a CMOS clock, XO, or single-
ended differential clock. Differential clock input is also supported, which makes the device easier to interface with
high-performance system clock devices such as TI’s LMK series clock devices. As the OSCin signal is used as a
clock for the VCO calibration, a proper reference signal must be applied at the OSCin pin at the time of
programming FCAL_EN.
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Feature Description (接下页)
7.3.2 Reference Path
The reference path consists of an OSCin doubler (OSC_2X), Pre-R divider (PLL_R_PRE), Multiplier (MULT), and
a Post-R divider (PLL_R).
Phase
Frequency
Detector
Pre-R
Divider
Post-R
Divider
OSCin
Doubler
Multiplier
图 31. Reference Path
The Doubler allows one to double the input reference frequency up to 250 MHz. The Doubler adds minimal noise
and is useful for raising the phase detector frequency for better phase noise. The Doubler can also be used to
avoid spurs. The Doubler uses both the rising and falling edges of the input signal, so the input signal must have
50% duty cycle if the Doubler is enabled. Note that the Multiplier cannot be used if the Doubler is engaged.
The Pre-R divider can help reduce input frequency so that the Multiplier can be used and the maximum 200-MHz
input frequency limitation of the Post-R divider can be met.
The Multiplier multiplies the frequency up under the allowable multiplications of 3, 4, 5, 6, and 7. In combination
with the Pre-R and Post-R dividers, the Multiplier offers the flexibility to shift the phase detector frequency away
from frequencies that may create integer boundary spurs with the VCO and the output frequencies. Be aware
that unlike the Doubler, the Multiplier degrades the PLL figure of merit. This degradation would only matter,
however, for a very clean reference oscillator input and if the loop bandwidth was wide. The user should not use
the Doubler while using the Multiplier. The Multiplier is bypassed if its value is set to 1.
The Post-R divider can be used to further divide down the frequency to the phase detector frequency. When it is
used (PLL_R > 1), the input frequency to this divider is limited to 200 MHz.
Use 公式 1 to calculate the phase detector frequency, fPD
.
fPD = fOSCin × OSC_2X × MULT / (PLL_R_PRE × PLL_R)
(1)
表 1 summarizes the usage boundaries of these functional blocks in the reference path.
表 1. Reference Path Boundaries
INPUT
FREQUENCY
(MHz)
OUTPUT
FREQUENCY
(MHz)
PARAMETER
VALUE
NOTES
MIN
MAX
MIN
MAX
OSCin
Doubler
N/A
5
250
When OSC_2X = 1, Multiplier cannot be used at the same
time.
0 (Bypassed), 1 (x2)
5
5
125
200
40
10
0.25
60
250
200
150
200
Pre-R divider
Multiplier
1 (Bypassed), 2, 3, …, 254, 255
1 (Bypassed), 3, 4, 5, 6, 7
1 (Bypass), 2, 3, …, 254, 255
Keep it equals 1 unless when necessary.
When the output frequency is greater than 100MHz, set
MULT_HI = 1.
10
5
Post-R divider
200
0.25
7.3.3 PLL Phase Detector and Charge Pump
The phase detector compares the outputs of the Post-R divider and N divider and generates a correction current
corresponding to the phase error until the two signals are aligned in phase. This charge-pump current is software
programmable to many different levels, allowing modification of the closed-loop bandwidth of the PLL.
表 2. Charge Pump Gain
CGP
0
1
2
3
4 or 8
5 or 9
6 or 10
7 or 11
12
13
14
15
UNIT
Gain
Tri-state
625
1250
1875
2500
3125
3750
4375
5000
5625
6250
6875
µA
16
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7.3.4 PLL N Divider and Fractional Circuitry
The N divider includes fractional compensation and can achieve any fractional denominator (PLL_DEN) from 1 to
(232 – 1). The integer portion of N (PLL_N) is the whole part of the N divider value, and the fractional portion,
Nfrac = PLL_NUM / PLL_DEN, is the remaining fraction. PLL_N, PLL_NUM and PLL_DEN are software
programmable. The higher the denominator, the finer the resolution step of the output. For example, even when
using fPD = 200 MHz, the output can increment in steps of 200 MHz / (232 – 1) = 0.0466 Hz. 公式 2 shows the
relationship between the phase detector and VCO frequencies. Note that in SYNC mode, there is an extra divider
that is not shown in 公式 2.
fVCO = fPD × [PLL_N + (PLL_NUM / PLL_DEN)]
(2)
The multi-stage noise-shaping (MASH) sigma-delta modulator that controls the fractional division is also
programmable from integer mode to fourth order. All of these settings work for integer channel where PLL_NUM
= 0. To make the fractional spurs consistent, the modulator is reset any time that the R0 register is programmed.
The N divider has minimum value restrictions based on the modulator order. Furthermore, the PFD_DLY_SEL bit
must be programmed in accordance to 表 3.
表 3. Minimum N Divider Restrictions
MASH ORDER
SECOND ORDER
VCO
FREQUENCY
(GHz)
INTEGER
FIRST ORDER
PFD_DLY_SEL
THIRD ORDER
PFD_DLY_SEL
FOURTH ORDER
N
PFD_DLY_SEL
N
N
PFD_DLY_SEL
N
N
PFD_DLY_SEL
fVCO < 4
20
24
24
0
1
1
25
29
29
1
2
2
26
30
30
1
2
2
32
32
36
2
2
3
44
44
48
4
4
5
4 ≤ fVCO < 4.9
4.9 ≤ fVCO ≤ 6.4
7.3.5 Voltage-Controlled Oscillator
The LMX2572 includes a fully integrated VCO. The VCO generates a frequency which varies with the tuning
voltage from the loop filter. The entire VCO frequency range, 3.2 to 6.4 GHz, covers an octave that allows the
channel divider to take care of frequencies below the lower bound.
To reduce the VCO tuning gain, thus improving the VCO phase noise performance, the VCO frequency range is
divided into 6 different frequency bands. This creates the need for frequency calibration to determine the correct
frequency band given in a desired output frequency. The VCO is also calibrated for amplitude to optimize phase
noise. These calibration routines are activated any time that the R0 register is programmed with the FCAL_EN bit
equals one. It is important that a valid OSCin signal must present before VCO calibration begins. This device will
support a full sweep of the valid temperature range of 125°C (–40°C to 85°C) without having to re-calibrate the
VCO. This is important for continuous operation of the synthesizer under the most extreme temperature variation.
7.3.6 Channel Divider
To go below the VCO lower bound of 3.2 GHz, the channel divider can be used. The channel divider consists of
several segments, and the total division value is equal to the multiplication of them. Therefore, not all values are
valid.
VCO
RFoutA
RFoutB
÷2,4,8,16,
32,64,128,
256
SYSREF
图 32. Channel Divider
The channel divider is automatically powered up whenever the MUXs have selected divided down output or
SYSREF output, regardless of whether the RF output buffers are turned on or not. When an output is not used,
TI recommends selecting the VCO output (OUTx_MUX = 1) to ensure that the channel divider is not
unnecessarily powered up.
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表 4. Channel Divider
OUTA_MUX
OUTB_MUX
CHANNEL DIVIDER
0: Channel divider output
Don't care
Powered up
0: Channel divider output
2: SYSREF output
Don't care
All other cases
Powered down
7.3.7 Output Buffer
The output buffers are differential push-pull type buffers, thus no external pullup to VCC is required. The output
impedance of the buffer is very small, and as such, the buffer can be AC-coupled to drive a 50-Ω load. Output
power of the buffer can be programed to various levels. The buffer can be disabled while still keeping the PLL in
lock. Buffer A supports direct VCO output or divided down output. Buffer B supports direct VCO output, divided
down output or SYSREF output.
7.3.8 Lock Detect
The MUXout pin can be configured to output a signal that gives an indication for the PLL being locked. If the
MUXout pin is configured as a lock detect output (MUXOUT_LD_SEL = 1), the MUXout pin output is a logic
HIGH voltage when the device is locked. When the device is unlocked, the MUXout pin output is a logic LOW
voltage.
There are options to select the definition of PLL being locked. If LD_TYPE = 0, lock detect asserts a HIGH output
after the VCO has finished calibration and the LD_DLY timeout counter is finished. If LD_TYPE = 1, in addition to
the VCO calibration and counter check, lock detect will assert a HIGH output if the VCO tuning voltage is also
within an acceptable limits.
7.3.9 Register Readback
The MUXout pin can also be configured to read back useful information from the device. Common uses for
readback are:
•
Read back registers to ensure that they have been programmed to the correct value. LMX2572 allows any of
its registers to be read back.
•
•
Read back the lock detect status to determine if the PLL is in lock.
Read back VCO calibration information so that it can be used to improve the lock time.
7.3.10 Powerdown
The LMX2572 can be powered up and down using the CE pin or the POWERDOWN bit. All registers are
preserved in memory while the device is powered down.
The wake-up time for the device to come out of the powered state is adjustable. See Power-Up, Wake-Up Time
for details.
7.3.11 Phase Synchronization
The SYNC pin allows the user to synchronize the LMX2572 such that the delay from the rising edge of th OSCin
signal to the RF output signal is deterministic. Phase synchronization is especially useful if there are multiple
LMX2572 devices in a system and it is desirable to have all the RF outputs aligned in phase.
fOUT
1
2
fOSCin
Device 1
fOUT1
fOUT
SYNC
fOSCin
Device 2
fOUT2
SYNC
t1
t2
图 33. Phase Synchronization
18
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Initially, the devices are locked to the input but are not synchronized. The user sends a synchronization pulse
that is re-clocked to the next rising edge of the OSCin pulse. After a given time, t1, the devices are synchronized.
This time is dominated by the sum of the VCO calibration time, the analog settling time of the PLL loop, and the
MASH_RST_COUNT, if used in fractional mode. After synchronization, both devices will have a deterministic
delay of t2, related to OSCin.
7.3.12 Phase Adjustment
The LMX2572 can use the sigma-delta modulator to adjust the output signal phase with respect to the input
reference. The phase shift every time you write the value of MASH_SEED is 公式 3:
Phase shift in degree = 360° × (MASH_SEED / PLL_DEN) × (P / CHDIV)
where
•
P = 2 when VCO_PHASE_SYNC_EN = 1, else P = 1
(3)
For example, if
•
•
•
•
MASH_SEED = 800
PLL_DEN = 1000
CHDIV = 32
VCO_PHASE_SYNC_EN = 0
Phase shift = 360° × (800 / 1000) × (1 / 32) = 9°. If we write 800 to MASH_SEED 40 times, then we will shift the
phase by 360°.
There are a couple of restrictions when using phase adjustment:
•
•
Phase adjustment does not work with MASH_ORDER equals 0 (Integer mode) or 1 (First order).
Phase adjustment is possible with integer channels (PLL_NUM = 0) as long as MASH_ORDER is greater
than 1.
•
PLL_DEN must be greater than PLL_NUM + MASH_SEED.
7.3.13 Ramping Function
The LMX2572 supports the ability to make frequency ramping waveforms using manual mode or automatic
mode.
In manual ramping mode, the user defines a step and uses the RampClk and RampDir pins to create the ramp.
The output frequency jumps from one frequency to another frequency on each ramp.
In automatic ramping mode, the user sets up the ramp with up to two linear segments in advance and the device
automatically creates this ramp. The output waveform is a continuous frequency sweep between the start and
end frequencies. If the frequency ramping range is small (approximately 10 MHz), no VCO calibration break is
necessary in the middle of the ramp.
When using ramp, the following must be set accordingly:
•
•
•
•
Phase detector frequency must be between fOSCin / 2CAL_CLK_DIV and 125 MHz.
OUT_FORCE = 1 to force the RF outputs not to be automatically muted during VCO calibration.
LD_DLY = 0 to avoid interfering with VCO calibration.
PLL_DEN = 232 – 1. The actual denominator value being used in ramping mode is 224.
Time
Time
Manual Ramping Mode
Automatic Ramping Mode
图 34. Ramping Modes
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19
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.14 SYSREF
RFoutB of LMX2572 can be used to generate or duplicate SYSREF signal. The output of RFoutB can be a single
pulse, series of pulse, or a continuous stream of pulses. These pulses are synchronous with the RFoutA signal
with an adjustable delay. To use the SYSREF capability, the PLL must be in SYNC mode with
VCO_PHASE_SYNC_EN = 1. SYSREF output is triggered when there is a 0 → 1 transition at the SysRefReq
pin. In SYSREF Pulsed mode, a maximum of 15 consecutive pulses can be generated at a time.
RFoutA
LMX2572
SysRefReq
RFoutB
Programmable delay
SYSREF Pulsed/Continuous Mode
RFoutA
tp
tp
LMX2572
SysRefReq
RFoutB
Programmable delay
SYSREF Repeater Mode
图 35. SYSREF Modes
7.3.15 FSK Modulation
Direct digital FSK modulation is supported in LMX2572. FSK modulation is achieved by changing the output
frequency by changing the N divider value. The LMX2572 supports two different types of FSK operation.
1. FSK SPI mode. This mode supports discrete 2-, 4- and 8-level FSK modulation. There are eight dedicated
registers used to pre-store the desired FSK frequency deviations. Program FSK_SPI_DEV_SEL to select
one of the FSK deviations at a time.
2. FSK SPI FAST mode. In this mode, instead of selecting one of the pre-stored FSK deviations, change the
FSK deviation directly by writing to FSK_SPI_FAST_DEV. As a result, this mode supports arbitrary-level
FSK, which is useful to construct pulse-shaping or analog-FM modulation.
Time
图 36. FSK Modulation
7.4 Device Functional Modes
表 5 lists the device functional modes of the LMX2572.
表 5. Device Functional Modes
MODE
DESCRIPTION
Normal operation mode The device is used as a high frequency signal source without any addition features.
FSK mode
SYNC mode
Generates discrete-level FSK or arbitrary-level pulse-shaped FSK modulation.
This mode is used to ensure deterministic phase between OSCin and RFout.
The device is used as a JESD204B SYSREF clock generator or repeater.
Automatic frequency sweeping without the need of continuous SPI programming.
SYSREF mode
Ramping mode
20
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LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
7.5 Programming
The LMX2572 is programmed using several 24-bit shift registers. The shift register consists of a data field, an
address field, and a R/W bit. The MSB is the R/W bit. 0 means register write while 1 means register read. The
following seven bits, ADDR[6:0], form the address field which is used to decode the internal register address.
The remaining 16 bits form the data field DATA[15:0]. Serial data is shifted MSB first into the shift register. See
图 1 for timing diagram details.
To write registers:
•
•
The R/W bit must be set to 0.
The data on SDI pin is clocked into the shift register upon the rising edge of the clocks on SCK pin. On the
rising edge of the 24th clock cycle, the data is transferred from the data field into the selected register bank.
•
•
The CSB pin may be held high after programming, which causes the LMX2572 to ignore clock pulses.
If the SCK and SDI lines are toggled while the VCO is in lock, as is sometimes the case when these lines are
shared between devices, the phase noise may be degraded during the time of this programming.
To read back registers:
•
•
•
The R/W bit must be set to 1.
The data field contents on the SDI line are ignored.
The read back data on MUXout pin is clocked out starting from the falling edge of the 8th clock cycle.
7.5.1 Recommended Initial Power-On Programming
7.5.1.1 Programming Sequence
When the device is first powered up, it must be initialized, and the ordering of this programming is important. The
sequence is listed below. After this sequence is completed, the device should be running and locked to the
proper frequency.
1. Apply power to the device and ensure all the supply pins are at the proper levels.
2. If CE is low, pull it high.
3. Wait 500 µs for the internal LDOs to become stable.
4. Ensure that a valid reference clock is applied to the OSCin pins.
5. Program register R0 with RESET = 1. This will ensure all the registers are reset to their default values. This
bit is self-clearing.
6. Program in sequence registers R125, R124, R123, ..., R1 and then R0.
7.5.1.2 Programming Register
There are altogether 126 programmable registers. However, not every register is required to be programmed at
initial power-on.
For example, most of the registers have fixed field value which is also equal to their silicon default value. After
programming R0 with RESET = 1, these register fields have returned to their silicon default values. As such, it is
not necessary to program these registers again. Similarly, for those registers having configurable fields, if the
desired field values are equal to the silicon default values, again it is not necessary to program these registers
again after programming R0 with RESET = 1.
In 表 6, Depends means it is up to the user's decision of whether programming the register or not based upon
the application need.
表 6. Suggested Register Programming
REGISTER
PROGRAM
Yes
REGISTER
PROGRAM
REGISTER
PROGRAM
Yes
REGISTER
PROGRAM
REGISTER
PROGRAM
Depends
Depends
Depends
No
REGISTER
105
PROGRAM
Depends
Depends
No
0
1
2
3
4
5
6
21
22
23
24
25
26
27
No
No
No
No
No
No
No
42
43
44
45
46
47
48
63
64
65
66
67
68
69
No
No
84
85
86
87
88
89
90
Depends
No
Yes
106
Depends
Depends
Depends
No
No
107
No
No
108
No
No
No
No
109
No
Depends
Depends
No
No
110
No
No
Depends
No
111
No
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LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
Programming (接下页)
表 6. Suggested Register Programming (接下页)
REGISTER
PROGRAM
Depends
Depends
Depends
Depends
Depends
Depends
No
REGISTER
PROGRAM
REGISTER
PROGRAM
REGISTER
PROGRAM
Depends
Yes
REGISTER
PROGRAM
No
REGISTER
112
PROGRAM
No
7
28
29
30
31
32
33
34
35
36
37
38
39
40
41
No
49
50
51
52
53
54
55
56
57
58
59
60
61
62
No
70
71
72
73
74
75
76
77
78
79
80
81
82
83
91
8
Yes
No
92
No
113
No
9
Yes
No
Depends
Depends
Depends
Depends
No
93
No
114
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
No
10
11
12
13
14
15
16
17
18
19
20
No
Yes
94
No
115
No
No
95
No
116
No
No
96
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
Depends
117
Depends
No
No
97
118
Depends
No
No
No
98
119
Yes
Yes
Yes
99
120
Depends
Depends
No
Yes
Depends
Depends
Depends
No
Depends
Depends
Depends
Depends
Depends
100
101
102
103
104
121
Yes
122
Yes
123
Depends
Depends
Depends
Depends
124
Depends
125
7.5.2 Recommended Sequence for Changing Frequencies
The recommended sequence for changing frequencies in different scenarios is as follows:
1. If the N divider is changing, program the relevant registers and then program R0 with FCAL_EN = 1.
2. In FSK and Ramp mode, the fractional numerator is changing; program the relevant registers only.
7.5.3 Double Buffering
Some register fields support double buffering. That is, the change to these fields would not be effective
immediately. To latch the new values into the device requires programming R0 again with FCAL_EN = 1. The
following register fields support double buffering, see 表 70 for details.
•
•
•
•
MASH order (MASH_ORDER)
Fractional numerator (PLL_NUM)
N divider (PLL_N)
Doubler (OSC_2X); Pre-R divider (PLL_R_PRE); Multiplier (MULT); Post-R divider (PLL_R)
For example,
1. Program PLL_R and PLL_N to new values. If double buffering for these fields is enabled, the PLL will remain
unchanged.
2. Program R0 with FCAL_EN = 1. The PLL will calibrate and lock using the new PLL_R and PLL_N values.
7.5.4 Block Programming
In a register write sequence, instead of sending 24 bits (one W/R bit, seven address bits, and 16 data bits) of
payload for each register (with Block Programming), only the first register write requires the W/R bit and the
address bits. The succeeding registers require sending only the 16-bit of data. However, the succeeding
registers must be in descending order. For example, if the first register is R20, then all 24 bits of payload must be
sent for R20. The next register must be R19, but only the 16-bit data is required. The programming sequence is
as follows:
1. Pull CSB pin LOW.
2. Write 0x14aaaa for R20.
3. Write 0xbbbb for R19, followed by 0xcccc for R18, and so on.
4. After the last register write is completed, pull CSB pin HIGH to finish Block Programming.
Since there is no CSB pulse between each register, the 16-bit of data field of each register can be sent
immediately after the previous one.
22
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LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
MSB
(R/W)
Address
(7-bit)
Data
(R20)
Data
(R19)
Data
(R18)
SDI
SCK
CSB
1st
2ndœ8th
9thœ24th
25thœ40th
41thœ56th
图 37. Block Programming Timing Example
Block Programming applies to both register write and read.
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23
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
7.6 Register Maps
DATA[15:0]
8
REG.
POR
15
14
13
12
11
10
9
7
6
5
4
3
2
1
0
VCO_PHASE_
SYNC_EN
MUXOUT_
LD_SEL
POWER
DOWN
R0
RAMP_EN
1
0
ADD_HOLD
0
OUT_MUTE
FCAL_HPFD_ADJ
FCAL_LPFD_ADJ
1
FCAL_EN
RESET
00221Ch
R1
R2
R3
R4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
1
1
0
0
0
1
1
0
1
1
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
CAL_CLK_DIV
010808h
020500h
030782h
040A43h
0
0
0
0
1
1
0
0
1
IPBUF_
TYPE
IPBUF_
TERM
R5
R6
R7
0
0
1
0
0
0
0
0
0
0
0
0
1
0
1
1
0
0
0
0
1
0
0
1
1
0
0
0
0
0
0
1
1
0
0
0
0530C8h
06C802h
0700B2h
LDO_DLY
0
OUT_
FORCE
0
0
0
0
0
VCO_
DACISET_
FORCE
VCO_
CAPCTRL_
FORCE
R8
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
082000h
R9
0
0
1
0
0
0
0
0
0
0
0
MULT_HI
0
0
1
0
0
0
0
0
0
0
1
OSC_2X
0
0
0
1
0
1
0
1
0
1
1
1
0
0
0
0
0
0
0
0
090004h
0A10F8h
0BB018h
0C5001h
0D4000h
0E1840h
0F060Eh
100080h
110096h
120064h
1327B7h
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
0
0
1
1
0
0
0
0
0
0
1
1
1
0
1
0
0
0
0
0
MULT
PLL_R
PLL_R_PRE
0
0
1
0
0
0
0
0
0
0
1
0
0
0
1
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
0
CPG
0
VCO_DACISET
VCO_DACISET_STRT
0
1
0
0
1
1
1
0
0
0
1
0
0
0
0
0
VCO_CAPCTRL
VCO_SEL_
FORCE
R20
0
1
VCO_SEL
0
0
0
1
143048h
R21
R22
R23
R24
R25
R26
R27
R28
R29
R30
R31
R32
R33
R34
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
1
0
0
0
1
0
0
1
0
1
0
0
1
1
0
0
1
0
0
0
1
1
0
0
0
0
1
1
0
0
0
0
0
1
0
1
0
0
0
0
1
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
1
1
0
0
0
0
1
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
1
0
0
0
0
1
1
1
0
0
0
0
1
1
0
0
0
0
0
0
0
1
0
1
1
0
1
1
0
1
0
1
0
0
0
1
0
0
0
0
1
0
1
0
0
0
0
1
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
1
150409h
160001h
17007Ch
18071Ah
190624h
1A0808h
1B0002h
1C0488h
1D18C6h
1E18C6h
1FC3E6h
2005BFh
211E01h
220010h
0
0
1
0
0
1
0
0
1
1
1
0
PLL_N[18:16]
24
Copyright © 2017–2019, Texas Instruments Incorporated
LMX2572
www.ti.com.cn
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
Register Maps (continued)
DATA[15:0]
REG.
POR
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R35
R36
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
230004h
240028h
PLL_N
MASH_
SEED_EN
R37
0
PFD_DLY_SEL
0
0
0
0
0
1
0
1
250205h
R38
R39
R40
R41
R42
R43
PLL_DEN[31:16]
PLL_DEN[15:0]
26FFFFh
27FFFFh
280000h
290000h
2A0000h
2B0000h
MASH_SEED[31:16]
MASH_SEED[15:0]
PLL_NUM[31:16]
PLL_NUM[15:0]
OUTB_
PD
OUTA_
PD
MASH_
RESET_N
R44
0
0
OUTA_PWR
0
0
MASH_ORDER
2C22A2h
R45
R46
R47
R48
R49
R50
R51
R52
R53
R54
R55
R56
R57
1
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
OUTA_MUX
1
1
0
0
0
0
0
1
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0
0
0
0
0
0
0
OUTB_PWR
2DC622h
2E07F0h
2F0300h
3003E0h
314180h
320080h
330080h
340420h
350000h
360000h
370000h
380000h
390000h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
0
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
OUTB_MUX
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
INPIN_
IGNORE
INPIN_
HYST
R58
INPIN_LVL
INPIN_FMT
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
3A8001h
R59
R60
R61
0
0
0
0
0
0
0
0
0
0
0
LD_TYPE
3B0001h
3C03E8h
3D00A8h
LD_DLY
0
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
DBLBUF_
EN_5
DBLBUF_
EN_4
DBLBUF_ DBLBUF_
DBLBUF_
EN_1
DBLBUF_
EN_0
R62
0
3E00AFh
EN_3
EN_2
R63
R64
R65
R66
R67
R68
R69
R70
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
1
0
1
0
0
0
1
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
3F0000h
401388h
410000h
4201F4h
430000h
4403E8h
450000h
46C350h
MASH_RST_COUNT[31:16]
MASH_RST_COUNT[15:0]
Copyright © 2017–2019, Texas Instruments Incorporated
25
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
Register Maps (continued)
DATA[15:0]
8
REG.
POR
15
14
13
12
11
0
10
9
7
6
5
4
3
2
1
0
SYSREF_
PULSE
SYSREF_
EN
SYSREF_
REPEAT
R71
0
0
0
0
0
0
0
SYSREF_DIV_PRE
0
1
470080h
R72
R73
R74
R75
R76
R77
0
0
0
0
0
0
0
0
0
SYSREF_DIV
480001h
49003Fh
4A0000h
4B0800h
4C000Ch
4D0000h
JESD_DAC2_CTRL
JESD_DAC4_CTRL
CHDIV
JESD_DAC1_CTRL
JESD_DAC3_CTRL
SYSREF_PULSE_CNT
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RAMP_
THRESH[32]
QUICK_
RECAL_EN
R78
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VCO_CAPCTRL_STRT
1
4E0064h
R79
R80
RAMP_THRESH[31:16]
RAMP_THRESH[15:0]
4F0000h
500000h
RAMP_LIMIT_
HIGH[32]
R81
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
510000h
R82
R83
RAMP_LIMIT_HIGH[31:16]
RAMP_LIMIT_HIGH[15:0]
520000h
530000h
RAMP_LIMIT_
LOW[32]
R84
0
0
540000h
R85
R86
R87
R88
R89
R90
R91
R92
R93
R94
R95
RAMP_LIMIT_LOW[31:16]
RAMP_LIMIT_LOW[15:0]
550000h
560000h
570000h
580000h
590000h
5A0000h
5B0000h
5C0000h
5D0000h
5E0000h
5F0000h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RAMP_
BURST_EN
R96
RAMP_BURST_COUNT
RAMP_TRIGB
0
0
600000h
R97
R98
RAMP0_RST
0
0
0
0
0
0
0
RAMP_TRIGA
0
0
RAMP_BURST_TRIG
RAMP0_DLY
610000h
620000h
630000h
640000h
RAMP0_INC[29:16]
0
R99
RAMP0_INC[15:0]
RAMP0_LEN
R100
RAMP1_
DLY
RAMP1_
RST
RAMP0_
NEXT
R101
0
0
0
0
0
0
0
0
0
RAMP0_NEXT_TRIG
650000h
R102
R103
R104
RAMP1_INC[29:16]
RAMP1_INC[15:0]
RAMP1_LEN
660000h
670000h
680000h
26
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
Register Maps (continued)
DATA[15:0]
8
REG.
POR
15
14
13
12
11
10
9
7
6
5
4
3
2
1
0
RAMP_
MANUAL
RAMP1_
NEXT
R105
R106
RAMP_DLY_CNT
0
0
RAMP1_NEXT_TRIG
RAMP_SCALE_COUNT
694440h
6A0007h
RAMP_
TRIG_CAL
0
0
0
0
0
0
0
0
0
0
0
0
R107
R108
R109
R110
R111
R112
R113
R114
R115
R116
R117
R118
R119
R120
R121
R122
R123
R124
R125
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6B0000h
6C0000h
6D0000h
6E0000h
6F0000h
700000h
710000h
727800h
730000h
740000h
750000h
760000h
770000h
780000h
790000h
7A0000h
7B0000h
7C0000h
7D2288h
0
0
0
0
0
rb_LD_VTUNE
rb_VCO_SEL
0
0
0
0
0
0
0
0
rb_VCO_CAPCTRL
rb_VCO_DACISET
0
0
0
0
0
0
0
0
0
0
0
1
0
FSK_EN
0
0
FSK_SPI_LEVEL
FSK_DEV_SCALE
FSK_SPI_DEV_SEL
FSK_MODE_SEL
0 0
0
FSK_DEV0
FSK_DEV1
FSK_DEV2
FSK_DEV3
FSK_DEV4
FSK_DEV5
FSK_DEV6
FSK_DEV7
FSK_SPI_FAST_DEV
0
0
1
0
0
0
1
0
1
0
0
0
1
0
0
0
Copyright © 2017–2019, Texas Instruments Incorporated
27
LMX2572
ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
www.ti.com.cn
表 7 lists the access codes for the LMX2572 registers.
表 7. Access Type Codes
ACCESS TYPE CODE
Read Type
DESCRIPTION
R
R
Read
Write Type
W
W
Write
Reset or Default Value
-n
Value after reset
7.6.1 Register R0 (offset = 00h) [reset = 221Ch]
图 38. Register R0
15
14
13
1
12
0
11
10
0
9
8
7
6
5
4
1
3
2
1
0
RAMP_E VCO_PH
ADD_HO
LD
OUT_MU
TE
FCAL_HPFD_ADJ
FCAL_LPFD_ADJ
FCAL_E MUXOU
N
RESET
POWER
DOWN
N
ASE_SY
NC_EN
T_LD_S
EL
R/W-0h
R/W-0h
R/W-2h
R/W-0h
R/W-0h
R/W-1h
R/W-0h
R/W-0h
R/W-1h
R/W-1h
R/W-1h
R/W-0h
R/W-0h
表 8. Register R0 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h
15
RAMP_EN
Enables frequency ramping. The action of programming register R0 with RAMP_EN =
1 starts the ramping. Be aware that this is in the same register as FCAL_EN, so
toggling this bit also can active the ramping if RAMP_EN = 1. RAMP_EN applies to
both automatic and manual ramping modes.
0: Normal operation
1: Starts frequency ramping
14
VCO_PHASE_SYNC_EN R/W 0h
Enables phase sync mode. In this state, part of the channel divider is put in the
feedback path to ensure deterministic phase. The action of toggling this bit from 0 to 1
also sends an asynchronous SYNC pulse.
0: Normal operation
1: Phase sync mode
13 - 12
11
R/W 2h
Program 2h to this field.
ADD_HOLD
R/W 0h
Freeze the register address in Block Programming. See Block Programming for
details.
10
9
R/W 0h
R/W 1h
Program 0h to this field.
OUT_MUTE
Mutes RF outputs (RFoutA and RFoutB) when the VCO is calibrating.
0: Disabled
1: Muted
8 - 7
FCAL_HPFD_ADJ
R/W 0h
Set this field in accordance to the phase detector frequency for optimal VCO
calibration.
0: fPD ≤ 37.5 MHz
1: 37.5 MHz < fPD ≤ 75 MHz
2: 75 MHz < fPD ≤ 100 MHz
3: fPD > 100 MHz
6 - 5
FCAL_LPFD_ADJ
R/W 0h
Set this field in accordance to the phase detector frequency for optimal VCO
calibration.
0: fPD ≥ 10 MHz
1: 10 MHz > fPD ≥ 5 MHz
2: 5 MHz > fPD ≥ 2.5 MHz
3: fPD < 2.5 MHz
4
3
R/W 1h
R/W 1h
Program 1h to this field.
FCAL_EN
Enables and activates VCO frequency calibration. Writing register R0 with this bit set
to a 1 enables and triggers the VCO frequency calibration. Writing 0 to this field is
prohibited.
0: Invalid
1: Enabled
28
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
表 8. Register R0 Field Descriptions (接下页)
Bit
Field
Type Reset Description
2
MUXOUT_LD_SEL
R/W 1h
R/W 0h
R/W 0h
Selects the functionality of the MUXout pin.
0: Register readback
1: Lock detect
1
0
RESET
Resets all registers to silicon default values. This bit is self-clearing.
0: Normal operation
1: Reset
POWERDOWN
Powers down the device.
0: Normal operation
1: Power down
7.6.2 Register R1 (offset = 01h) [reset = 0808h]
图 39. Register R1
15
0
14
0
13
0
12
0
11
1
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
1
2
1
0
CAL_CLK_DIV
R/W-0h
R/W-101h
表 9. Register R1 Field Descriptions
Bit
Field
Type Reset Description
15 - 3
2 - 0
R/W 101h
R/W 0h
Program 101h to this field.
CAL_CLK_DIV
Divides down the state machine clock during VCO calibration. Maximum state
machine clock frequency is 200 MHz.
State machine clock frequency = fOSCin / (2CAL_CLK_DIV).
0: fOSCin ≤ 200 MHz
1: 200 MHz < fOSCin ≤ 250 MHz
All other values are not used.
7.6.3 Register R2 (offset = 02h) [reset = 0500h]
图 40. Register R2
15
0
14
0
13
0
12
0
11
0
10
1
9
0
8
1
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-500h
表 10. Register R2 Field Descriptions
Bit
Field
Type Reset Description
R/W 500h Program 500h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.4 Register R3 (offset = 03h) [reset = 0782h]
图 41. Register R3
15
0
14
0
13
0
12
0
11
0
10
1
9
1
8
1
7
1
6
0
5
0
4
0
3
0
2
0
1
1
0
0
R/W-782h
表 11. Register R3 Field Descriptions
Bit
Field
Type Reset Description
R/W 782h Program 782h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
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LMX2572
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www.ti.com.cn
7.6.5 Register R4 (offset = 04h) [reset = 0A43h]
图 42. Register R4
15
0
14
0
13
0
12
0
11
1
10
0
9
1
8
0
7
0
6
1
5
0
4
0
3
0
2
0
1
1
0
1
R/W-A43h
表 12. Register R4 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W A43h Program A43h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.6 Register R5 (offset = 05h) [reset = 30C8h]
图 43. Register R5
15
0
14
0
13
1
12
11
10
0
9
0
8
0
7
1
6
1
5
0
4
0
3
1
2
0
1
0
0
0
IPBUF_T IPBUF_T
YPE
ERM
R/W-1h
R/W-1h
R/W-0h
R/W-C8h
表 13. Register R5 Field Descriptions
Bit
15 - 13
12
Field
Type Reset Description
R/W 1h
Program 1h to this field.
IPBUF_TYPE
IPBUF_TERM
R/W 1h
Selects OSCin input type.
0: Differential input
1: Single-ended input
11
R/W 0h
Enables internal 50-Ω terminations on both OSCin and OSCin* pins. This function is
valid even if OSCin input is configured as single-ended input.
0: Normal operation
1: OSCin and OSCin* pins are internally 50-Ω terminated
10 - 0
R/W C8h
Program C8h to this field.
7.6.7 Register R6 (offset = 06h) [reset = C802h]
图 44. Register R6
15
14
13
12
11
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
1
0
0
LDO_DLY
R/W-19h
R/W-2h
表 14. Register R6 Field Descriptions
Bit
Field
Type Reset Description
15 - 11 LDO_DLY
R/W 19h
LDO start up delay. Delay duration is a function of state machine clock. See Power-
Up, Wake-Up Time for details.
10 - 0
R/W 2h
Program 2h to this field.
30
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
7.6.8 Register R7 (offset = 07h) [reset = 00B2h]
图 45. Register R7
15
0
14
13
0
12
0
11
0
10
0
9
0
8
0
7
1
6
0
5
1
4
1
3
0
2
0
1
1
0
0
OUT_FO
RCE
R/W-0h
R/W-0h
R/W-B2h
表 15. Register R7 Field Descriptions
Bit
15
14
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
OUT_FORCE
Forces the RF outputs not to be automatically muted during VCO calibration. This bit
should be enabled during frequency ramping.
0: Mute setting depends on OUT_MUTE
1: No mute during VCO calibration
13 - 0
R/W B2h
Program B2h to this field.
7.6.9 Register R8 (offset = 08h) [reset = 2000h]
图 46. Register R8
15
0
14
13
1
12
0
11
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
VCO_DA
CISET_F
ORCE
VCO_CA
PCTRL_
FORCE
R/W-0h
R/W-0h
R/W-2h
R/W-0h
R/W-0h
表 16. Register R8 Field Descriptions
Bit
15
14
Field
Type Reset Description
R/W 0h Program 0h to this field.
VCO_DACISET_FORCE R/W 0h
Forces VCO_DACISET value. Useful for fully-assisted VCO calibration and debugging
purposes.
0: Normal operation
1: Use VCO_DACISET value instead of the value obtained from VCO calibration
13 - 12
11
R/W 2h
Program 2h to this field.
VCO_CAPCTRL_FORCE R/W 0h
Forces VCO_CAPCTRL value. Useful for fully-assisted VCO calibration and
debugging purposes.
0: Normal operation
1: Use VCO_CAPCTRL value instead of the value obtained from VCO calibration
10 - 0
R/W 0h
Program 0h to this field.
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LMX2572
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www.ti.com.cn
7.6.10 Register R9 (offset = 09h) [reset = 0004h]
图 47. Register R9
15
0
14
13
0
12
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
1
1
0
0
0
MULT_H
I
OSC_2X
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-4h
表 17. Register R9 Field Descriptions
Bit
15
14
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
MULT_HI
Sets this bit to 1 if the output frequency of the Multiplier is greater than 100 MHz.
0: Multiplier output ≤ 100 MHz
1: Multiplier output > 100 MHz
13
12
R/W 0h
R/W 0h
Program 0h to this field.
OSC_2X
Enables reference path Doubler.
0: Disabled
1: Enabled
11 - 0
R/W 4h
Program 4h to this field.
7.6.11 Register R10 (offset = 0Ah) [reset = 10F8h]
图 48. Register R10
15
0
14
0
13
0
12
1
11
10
9
8
7
6
1
5
1
4
1
3
1
2
0
1
0
0
0
MULT
R/W-1h
R/W-1h
R/W-78h
表 18. Register R10 Field Descriptions
Bit
Field
Type Reset Description
15 - 12
R/W 1h
R/W 1h
Program 1h to this field.
11 - 7 MULT
Reference path frequency Multiplier. Input frequency to the Multiplier: 10 to 40 MHz.
Multiplier output frequency: 60 to 150 MHz.
0: Not used
1: Bypassed
2: Not recommended. Use OSC_2X instead of MULT
3: 3X
·····
7: 7X
8 - 31: Not recommended
6 - 0
R/W 78h
Program 78h to this field.
7.6.12 Register R11 (offset = 0Bh) [reset = B018h]
图 49. Register R11
15
1
14
0
13
1
12
1
11
10
9
8
7
6
5
4
3
1
2
0
1
0
0
0
PLL_R
R/W-Bh
R/W-1h
R/W-8h
表 19. Register R11 Field Descriptions
Bit
Field
Type Reset Description
15 - 12
R/W Bh
R/W 1h
R/W 8h
Program Bh to this field.
11 - 4 PLL_R
3 - 0
Reference path Post-R divider. It is the divider after the frequency Multiplier.
Program 8h to this field.
32
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
7.6.13 Register R12 (offset = 0Ch) [reset = 5001h]
图 50. Register R12
15
0
14
1
13
0
12
1
11
10
9
8
7
6
5
4
3
2
1
0
PLL_R_PRE
R/W-1h
R/W-5h
表 20. Register R12 Field Descriptions
Bit
Field
Type Reset Description
15 - 12
R/W 5h
R/W 1h
Program 5h to this field.
Reference path Pre-R divider. It is the divider before the frequency Multiplier.
11 - 0 PLL_R_PRE
7.6.14 Register R13 (offset = 0Dh) [reset = 4000h]
图 51. Register R13
15
0
14
1
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-4000h
表 21. Register R13 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 4000h Program 4000h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.15 Register R14 (offset = 0Eh) [reset = 1840h]
图 52. Register R14
15
0
14
0
13
0
12
1
11
1
10
0
9
0
8
0
7
0
6
5
4
3
2
0
1
0
0
0
CPG
R/W-30h
R/W-8h
R/W-0h
表 22. Register R14 Field Descriptions
Bit
Field
Type Reset Description
15 - 7
6 - 3
R/W 30h
R/W 8h
Program 30h to this field.
CPG
Effective charge pump gain. This is the sum of the up and down currents. Each
increment represents 625 µA.
0: Tri-state
1: 625 µA
2: 1250 µA
3: 1875 µA
·····
15: 6875 µA
2 - 0
R/W 0h
Program 0h to this field.
7.6.16 Register R15 (offset = 0Fh) [reset = 060Eh]
图 53. Register R15
15
0
14
0
13
0
12
0
11
0
10
1
9
1
8
0
7
0
6
0
5
0
4
0
3
1
2
1
1
1
0
0
R/W-60Eh
表 23. Register R15 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 60Eh Program 60Eh to this field.
After programming R0 with RESET = 1, no need to program this register.
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7.6.17 Register R16 (offset = 10h) [reset = 0080h]
图 54. Register R16
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
7
6
5
4
3
2
1
0
VCO_DACISET
R/W-80h
R/W-0h
表 24. Register R16 Field Descriptions
Bit
Field
Type Reset Description
15 - 9
8 - 0
R/W 0h
Program 0h to this field.
Programmable current setting for the VCO that is applied when
VCO_DACISET_FORCE = 1. Useful for fully-assisted VCO calibration.
VCO_DACISET
R/W 80h
7.6.18 Register R17 (offset = 11h) [reset = 0096h]
图 55. Register R17
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
7
6
5
4
3
2
1
0
VCO_DACISET_STRT
R/W-96h
R/W-0h
表 25. Register R17 Field Descriptions
Bit
Field
Type Reset Description
15 - 9
8 - 0
R/W 0h
Program 0h to this field.
Starting calibration value for VCO_DACISET.
VCO_DACISET_STRT
R/W 96h
7.6.19 Register R18 (offset = 12h) [reset = 0064h]
图 56. Register R18
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
1
5
1
4
0
3
0
2
1
1
0
0
0
R/W-64h
表 26. Register R18 Field Descriptions
Bit
Field
Type Reset Description
R/W 64h Program 64h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.20 Register R19 (offset = 13h) [reset = 27B7h]
图 57. Register R19
15
0
14
0
13
1
12
0
11
0
10
1
9
1
8
1
7
6
5
4
3
2
1
0
VCO_CAPCTRL
R/W-B7h
R/W-27h
表 27. Register R19 Field Descriptions
Bit
Field
Type Reset Description
15 - 8
7 - 0
R/W 27h
R/W B7h
Program 27h to this field.
VCO_CAPCTRL
Programmable band within VCO core that applies when VCO_CAPCTRL_FORCE = 1.
Valid values are 183 to 0, where the higher number is a lower frequency.
34
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7.6.21 Register R20 (offset = 14h) [reset = 3048h]
图 58. Register R20
15
0
14
1
13
12
11
10
9
0
8
0
7
0
6
1
5
0
4
0
3
1
2
0
1
0
0
0
VCO_SEL
VCO_SE
L_FORC
E
R/W-0h
R/W-6h
R/W-0h
R/W-48h
表 28. Register R20 Field Descriptions
Bit
Field
Type Reset Description
15 - 14
R/W 0h
R/W 6h
Program 1h to this field.
13 - 11 VCO_SEL
User specified start VCO for calibration. This sets the VCO that is used when
VCO_SEL_FORCE = 1.
1: VCO1
2: VCO2
·····
6: VCO6
All other values are not used.
10
VCO_SEL_FORCE
R/W 0h
Forces the VCO to use the core specified by VCO_SEL.
0: Disabled
1: Enabled
9 - 0
R/W 48h
Program 48h to this field.
7.6.22 Register R21 (offset = 15h) [reset = 0409h]
图 59. Register R21
15
0
14
0
13
0
12
0
11
0
10
1
9
0
8
0
7
0
6
0
5
0
4
0
3
1
2
0
1
0
0
1
R/W-409h
表 29. Register R21 Field Descriptions
Bit
Field
Type Reset Description
R/W 409h Program 409h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.23 Register R22 (offset = 16h) [reset = 0001h]
图 60. Register R22
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1
R/W-1h
表 30. Register R22 Field Descriptions
Bit
Field
Type Reset Description
R/W 1h Program 1h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
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7.6.24 Register R23 (offset = 17h) [reset = 007Ch]
图 61. Register R23
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
1
5
1
4
1
3
1
2
1
1
0
0
0
R/W-7Ch
表 31. Register R23 Field Descriptions
Bit
Field
Type Reset Description
R/W 7Ch Program 7Ch to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.25 Register R24 (offset = 18h) [reset = 071Ah]
图 62. Register R24
15
0
14
0
13
0
12
0
11
0
10
1
9
1
8
1
7
0
6
0
5
0
4
1
3
1
2
0
1
1
0
0
R/W-71Ah
表 32. Register R24 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 71Ah Program 71Ah to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.26 Register R25 (offset = 19h) [reset = 0624h]
图 63. Register R25
15
0
14
0
13
0
12
0
11
0
10
1
9
1
8
0
7
0
6
0
5
1
4
0
3
0
2
1
1
0
0
0
R/W-624h
表 33. Register R25 Field Descriptions
Bit
Field
Type Reset Description
R/W 624h Program 624h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.27 Register R26 (offset = 1Ah) [reset = 0808h]
图 64. Register R26
15
0
14
0
13
0
12
0
11
1
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
1
2
0
1
0
0
0
R/W-808h
表 34. Register R26 Field Descriptions
Bit
Field
Type Reset Description
R/W 808h Program 808h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
36
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7.6.28 Register R27 (offset = 1Bh) [reset = 0002h]
图 65. Register R27
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
1
0
0
R/W-2h
表 35. Register R27 Field Descriptions
Bit
Field
Type Reset Description
R/W 2h Program 2h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.29 Register R28 (offset = 1Ch) [reset = 0488h]
图 66. Register R28
15
0
14
0
13
0
12
0
11
0
10
1
9
0
8
0
7
1
6
0
5
0
4
0
3
1
2
0
1
0
0
0
R/W-488h
表 36. Register R28 Field Descriptions
Bit
Field
Type Reset Description
R/W 488h Program 488h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.30 Register R29 (offset = 1Dh) [reset = 18C6h]
图 67. Register R29
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-18C6h
表 37. Register R29 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 18C6h Program 0h to this field.
7.6.31 Register R30 (offset = 1Eh) [reset = 18C6h]
图 68. Register R30
15
0
14
0
13
0
12
1
11
1
10
0
9
0
8
0
7
1
6
0
5
1
4
0
3
0
2
1
1
1
0
0
R/W-18C6h
表 38. Register R30 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 18C6h Program 18A6h to this field.
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7.6.32 Register R31 (offset = 1Fh) [reset = C3E6h]
图 69. Register R31
15
1
14
1
13
0
12
0
11
0
10
0
9
1
8
1
7
1
6
1
5
1
4
0
3
0
2
1
1
1
0
0
R/W-C3E6h
表 39. Register R31 Field Descriptions
Bit
Field
Type Reset
R/W C3E6h Program C3E6h to this field.
After programming R0 with RESET = 1, no need to program this register.
Description
15 - 0
7.6.33 Register R32 (offset = 20h) [reset = 05BFh]
图 70. Register R32
15
0
14
0
13
0
12
0
11
0
10
1
9
0
8
1
7
1
6
0
5
1
4
1
3
1
2
1
1
1
0
1
R/W-5BFh
表 40. Register R32 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 5BFh Program 5BFh to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.34 Register R33 (offset = 21h) [reset = 1E01h]
图 71. Register R33
15
0
14
0
13
0
12
1
11
1
10
1
9
1
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1
R/W-1E01h
表 41. Register R33 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 1E01h Program 1E01h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.35 Register R34 (offset = 22h) [reset = 0010h]
图 72. Register R34
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
1
3
0
2
1
0
PLL_N[18:16]
R/W-0h
R/W-2h
表 42. Register R34 Field Descriptions
Bit
Field
Type Reset Description
15 - 3
2 - 0
R/W 2h
R/W 0h
Program 2h to this field.
Upper 3 bits of N-divider.
PLL_N[18:16]
38
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7.6.36 Register R35 (offset = 23h) [reset = 0004h]
图 73. Register R35
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
1
1
0
0
0
R/W-4h
表 43. Register R35 Field Descriptions
Bit
Field
Type Reset Description
R/W 4h Program 4h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.37 Register R36 (offset = 24h) [reset = 0028h]
图 74. Register R36
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PLL_N
R/W-28h
表 44. Register R36 Field Descriptions
Bit
Field
Type Reset Description
R/W 28h Lower 16 bits of N-divider.
15 - 0 PLL_N
7.6.38 Register R37 (offset = 25h) [reset = 0205h]
图 75. Register R37
15
14
0
13
12
11
10
9
8
7
0
6
0
5
0
4
0
3
0
2
1
1
0
0
1
MASH_S
EED_EN
PFD_DLY_SEL
R/W-0h
R/W-0h
R/W-2h
R/W-5h
表 45. Register R37 Field Descriptions
Bit
Field
Type Reset Description
15
MASH_SEED_EN
R/W 0h
Enables the MASH_SEED value to be used. This can be used for programmable
phase stepping or fractional spur optimization.
0: Disabled
1: Enabled
14
R/W 0h
R/W 2h
Program 0h to this field.
13 - 8 PFD_DLY_SEL
PFD_DLY_SEL must be adjusted in accordance to the N-divider value. See 表 3 for
details.
7 - 0
R/W 5h
Program 5h to this field.
7.6.39 Register R38 (offset = 26h) [reset = FFFFh]
图 76. Register R38
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PLL_DEN[31:16]
R/W-FFFFh
表 46. Register R38 Field Descriptions
Bit
Field
Type Reset
Description
15 - 0 PLL_DEN[31:16]
R/W FFFFh Upper 16 bits of fractional denominator (DEN).
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7.6.40 Register R39 (offset = 27h) [reset = FFFFh]
图 77. Register R39
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PLL_DEN[15:0]
R/W-FFFFh
表 47. Register R39 Field Descriptions
Bit
Field
Type Reset
Description
15 - 0 PLL_DEN[15:0]
R/W FFFFh Lower 16 bits of fractional denominator (DEN).
7.6.41 Register R40 (offset = 28h) [reset = 0000h]
图 78. Register R40
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MASH_SEED[31:16]
R/W-0h
表 48. Register R40 Field Descriptions
Bit
Field
Type Reset Description
15 - 0 MASH_SEED[31:16]
R/W 0h
Upper 16 bits of MASH_SEED. MASH_SEED sets the initial state of the fractional
engine. Useful for producing a phase shift and fractional spur optimization.
7.6.42 Register R41 (offset = 29h) [reset = 0000h]
图 79. Register R41
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MASH_SEED[15:0]
R/W-0h
表 49. Register R41 Field Descriptions
Bit
Field
Type Reset Description
15 - 0 MASH_SEED[15:0]
R/W 0h
Lower 16 bits of MASH_SEED. MASH_SEED sets the initial state of the fractional
engine. Useful for producing a phase shift and fractional spur optimization.
7.6.43 Register R42 (offset = 2Ah) [reset = 0000h]
图 80. Register R42
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PLL_NUM[31:16]
R/W-0h
表 50. Register R42 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Upper 16 bits of fractional numerator (NUM).
15 - 0 PLL_NUM[31:16]
40
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7.6.44 Register R43 (offset = 2Bh) [reset = 0000h]
图 81. Register R43
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PLL_NUM[15:0]
R/W-0h
表 51. Register R43 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Lower 16 bits of fractional numerator (NUM).
15 - 0 PLL_NUM[15:0]
7.6.45 Register R44 (offset = 2Ch) [reset = 22A2h]
图 82. Register R44
15
0
14
0
13
12
11
10
9
8
7
6
5
4
0
3
0
2
1
0
OUTA_PWR
OUTB_P OUTA_P MASH_R
MASH_ORDER
D
D
ESET_N
R/W-0h
R/W-22h
R/W-1h
R/W-0h
R/W-1h
R/W-0h
R/W-2h
表 52. Register R44 Field Descriptions
Bit
Field
Type Reset Description
15 - 14
R/W 0h
R/W 22h
R/W 1h
Program 0h to this field.
13 - 8 OUTA_PWR
Adjusts RFoutA output power. Higher numbers give more output power.
7
6
5
OUTB_PD
Powers down RF output B.
0: Normal operation
1: Power down
OUTA_PD
R/W 0h
R/W 1h
Powers down RF output A.
0: Normal operation
1: Power down
MASH_RESET_N
Resets MASH.
0: Reset
1: Normal operation
4 - 3
2 - 0
R/W 0h
R/W 2h
Program 0h to this field.
MASH_ORDER
Sets the MASH order.
0: Integer mode
1: First order modulator
2: Second order modulator
3: Third order modulator
4: Fourth order modulator
5 - 7: Not used
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7.6.46 Register R45 (offset = 2Dh) [reset = C622h]
图 83. Register R45
15
1
14
1
13
0
12
OUTA_MUX
R/W-0h
11
10
1
9
1
8
0
7
0
6
0
5
4
3
2
1
0
OUTB_PWR
R/W-22h
R/W-6h
R/W-18h
表 53. Register R45 Field Descriptions
Bit
Field
Type Reset Description
15 - 13
R/W 6h
R/W 0h
Program 6h to this field.
12 - 11 OUTA_MUX
Selects the input source to RFoutA.
0: Channel divider
1: VCO
2: Not used
3: High impedance
10 - 6
5 - 0
R/W 18h
R/W 22h
Program 18h to this field.
OUTB_PWR
Adjusts RFoutB output power. Higher numbers give more output power.
7.6.47 Register R46 (offset = 2Eh) [reset = 07F0h]
图 84. Register R46
15
0
14
0
13
0
12
0
11
0
10
1
9
1
8
1
7
1
6
1
5
1
4
1
3
0
2
0
1
0
OUTB_MUX
R/W-0h
R/W-1FCh
表 54. Register R46 Field Descriptions
Bit
Field
Type Reset Description
15 - 2
1 - 0
R/W 1FCh Program 1FCh to this field.
OUTB_MUX
R/W 0h
Selects the input source to RFoutB.
0: Channel divider
1: VCO
2: SYSREF
3: High impedance
7.6.48 Register R47 (offset = 2Fh) [reset = 0300h]
图 85. Register R47
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
1
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-300h
表 55. Register R47 Field Descriptions
Bit
Field
Type Reset Description
R/W 300h Program 300h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
42
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7.6.49 Register R48 (offset = 30h) [reset = 03E0h]
图 86. Register R48
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
1
7
1
6
1
5
1
4
0
3
0
2
0
1
0
0
0
R/W-3E0h
表 56. Register R48 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 3E0h Program 3E0h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.50 Register R49 (offset = 31h) [reset = 4180h]
图 87. Register R49
15
0
14
1
13
0
12
0
11
0
10
0
9
0
8
1
7
1
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-4180h
表 57. Register R49 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 4180h Program 4180h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.51 Register R50 (offset = 32h) [reset = 0080h]
图 88. Register R50
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
1
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-80h
表 58. Register R50 Field Descriptions
Bit
Field
Type Reset Description
R/W 80h Program 80h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.52 Register R51 (offset = 33h) [reset = 0080h]
图 89. Register R51
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
1
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-80h
表 59. Register R51 Field Descriptions
Bit
Field
Type Reset Description
R/W 80h Program 80h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.53 Register R52 (offset = 34h) [reset = 0420h]
图 90. Register R52
15
0
14
0
13
0
12
0
11
0
10
1
9
0
8
0
7
0
6
0
5
1
4
0
3
0
2
0
1
0
0
1
R/W-420h
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表 60. Register R52 Field Descriptions
Bit
Field
Type Reset Description
R/W 420h Program 421h to this field.
15 - 0
7.6.54 Register R53 (offset = 35h) [reset = 0000h]
图 91. Register R53
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 61. Register R53 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.55 Register R54 (offset = 36h) [reset = 0000h]
图 92. Register R54
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 62. Register R54 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.56 Register R55 (offset = 37h) [reset = 0000h]
图 93. Register R55
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 63. Register R55 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.57 Register R56 (offset = 38h) [reset = 0000h]
图 94. Register R56
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 64. Register R56 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
44
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7.6.58 Register R57 (offset = 39h) [reset = 0000h]
图 95. Register R57
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
1
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 65. Register R57 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 20h to this field.
15 - 0
7.6.59 Register R58 (offset = 3Ah) [reset = 8001h]
图 96. Register R58
15
14
13
12
11
10
9
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1
INPIN_I
GNORE
INPIN_H
YST
INPIN_LVL
INPIN_FMT
R/W-1h
R/W-0h
R/W-0h
R/W-0h
R/W-1h
表 66. Register R58 Field Descriptions
Bit
Field
Type Reset Description
15
INPIN_IGNORE
R/W 1h
Ignore SYNC and SysRefReq pins when VCO_PHASE_SYNC = 0. This bit should be
set to 1 unless VCO_PHASE_SYNC = 1.
14
INPIN_HYST
R/W 0h
Enables high hysteresis for LVDS input to SysRefReq and SYNC pin.
0: Disabled
1: Enabled
13 - 12 INPIN_LVL
11 - 9 INPIN_FMT
R/W 0h
R/W 0h
Sets bias level for LVDS input to SysRefReq and SYNC pin.
0: Vin / 4
1: Vin
2: Vin / 2
3: Invalid
Defines the input format of SysRefReq and SYNC pin.
0: SYNC = SysRefReq = CMOS
1: SYNC = LVDS; SysRefReq = CMOS
2: SYNC = CMOS; SysRefReq = LVDS
3: SYNC = SysRefReq = LVDS
4: SYNC = SysRefReq = CMOS
5: SYNC = LVDS (filtered); SysRefReq = CMOS
6: SYNC = CMOS; SysRefReq = LVDS (filtered)
7: SYNC = SysRefReq = LVDS (filtered)
8 - 0
R/W 1h
Program 1h to this field.
7.6.60 Register R59 (offset = 3Bh) [reset = 0001h]
图 97. Register R59
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
LD_TYP
E
R/W-0h
R/W-1h
表 67. Register R59 Field Descriptions
Bit
15 - 1
0
Field
Type Reset Description
R/W 0h
R/W 1h
Program 0h to this field.
Defines lock detect type.
LD_TYPE
0: VCOCal. Lock detect asserts a HIGH output after the VCO has finished calibration
and the LD_DLY timeout counter is finished.
1: Vtune and VCOCal. Lock detect asserts a HIGH output when VCOCal lock detect
would assert a HIGH signal and the tuning voltage to the VCO is within acceptable
limits.
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7.6.61 Register R60 (offset = 3Ch) [reset = 03E8h]
图 98. Register R60
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
LD_DLY
R/W-3E8h
表 68. Register R60 Field Descriptions
Bit
Field
Type Reset Description
15 - 0 LD_DLY
R/W 3E8h For the VCOCal lock detect, this is the delay in ¼ fPD cycles that is added after the
calibration is finished before the VCOCal lock detect is asserted HIGH.
7.6.62 Register R61 (offset = 3Dh) [reset = 00A8h]
图 99. Register R61
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
1
6
0
5
1
4
0
3
1
2
0
1
0
0
0
R/W-A8h
表 69. Register R61 Field Descriptions
Bit
Field
Type Reset Description
R/W A8h Program A8h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.63 Register R62 (offset = 3Eh) [reset = 00AFh]
图 100. Register R62
15
14
13
12
11
10
9
0
8
0
7
1
6
0
5
1
4
0
3
1
2
1
1
1
0
1
DBLBUF DBLBUF DBLBUF DBLBUF DBLBUF DBLBUF
_EN_5
_EN_4
_EN_3
_EN_2
_EN_1
_EN_0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-AFh
表 70. Register R62 Field Descriptions
Bit
Field
Type Reset Description
15
DBLBUF_EN_5
DBLBUF_EN_4
DBLBUF_EN_3
DBLBUF_EN_2
R/W 0h
R/W 0h
R/W 0h
R/W 0h
Enables double buffering for the MASH order.
0: Disabled
1: Enabled
14
13
12
Enables double buffering for fractional numerator NUM.
0: Disabled
1: Enabled
Enables double buffering for the integer portion of the N-divider.
0: Disabled
1: Enabled
Enables double buffering for the Pre-R and Post-R dividers in the reference path.
Effective only if DBL_BUF_EN_3 = 1.
0: Disabled
1: Enabled
11
10
DBLBUF_EN_1
DBLBUF_EN_0
R/W 0h
R/W 0h
R/W AFh
Enables double buffering for the Multiplier in the reference path. Effective only if
DBL_BUF_EN_3 = 1.
0: Disabled
1: Enabled
Enables double buffering for the Doubler in the reference path. Effective only if
DBL_BUF_EN_3 = 1.
0: Disabled
1: Enabled
9 - 0
Program AFh to this field.
46
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7.6.64 Register R63 (offset = 3Fh) [reset = 0000h]
图 101. Register R63
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 71. Register R63 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.65 Register R64 (offset = 40h) [reset = 1388h]
图 102. Register R64
15
0
14
0
13
0
12
1
11
0
10
0
9
1
8
1
7
1
6
0
5
0
4
0
3
1
2
0
1
0
0
0
R/W-1388h
表 72. Register R64 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 1388h Program 1388h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.66 Register R65 (offset = 41h) [reset = 0000h]
图 103. Register R65
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 73. Register R65 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.67 Register R66 (offset = 42h) [reset = 01F4h]
图 104. Register R66
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
1
7
1
6
1
5
1
4
1
3
0
2
1
1
0
0
0
R/W-1F4h
表 74. Register R66 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 1F4h Program 1F4h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.68 Register R67 (offset = 43h) [reset = 0000h]
图 105. Register R67
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
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表 75. Register R67 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.69 Register R68 (offset = 44h) [reset = 03E8h]
图 106. Register R68
15
0
14
0
13
0
12
0
11
0
10
0
9
1
8
1
7
1
6
1
5
1
4
0
3
1
2
0
1
0
0
0
R/W-3E8h
表 76. Register R68 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 3E8h Program 3E8h to this field.
After programming R0 with RESET = 1, no need to program this register.
7.6.70 Register R69 (offset = 45h) [reset = 0000h]
图 107. Register R69
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MASH_RST_COUNT[31:16]
R/W-0h
表 77. Register R69 Field Descriptions
Bit
Field
Type Reset Description
15 - 0 MASH_RST_COUNT
[31:16]
R/W 0h Upper 16 bits of MASH_RST_COUNT. This register is used to add a delay when
using phase SYNC. The delay should be set at least four times the PLL lock time. This
delay is expressed in state machine clock periods. One of these periods is equal to
2CAL_CLK_DIV / fOSCin
.
7.6.71 Register R70 (offset = 46h) [reset = C350h]
图 108. Register R70
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MASH_RST_COUNT[15:0]
R/W-C350h
表 78. Register R70 Field Descriptions
Bit
Field
Type Reset Description
15 - 0 MASH_RST_COUNT
[15:0]
R/W C350h Lower 16 bits of MASH_RST_COUNT.
7.6.72 Register R71 (offset = 47h) [reset = 0080h]
图 109. Register R71
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
6
5
4
3
2
1
0
0
1
SYSREF_DIV_PRE
SYSREF SYSREF SYSREF
_PULSE
R/W-0h
_EN
_REPEA
T
R/W-0h
R/W-4h
R/W-0h
R/W-0h
R/W-0h
48
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表 79. Register R71 Field Descriptions
Bit
Field
Type Reset Description
15 - 8
7 - 5
R/W 0h
R/W 4h
Program 0h to this field.
SYSREF_DIV_PRE
This divider is used to get the frequency input to the Post-SR divider within acceptable
limits. See Application for SYSREF for details.
2: Divide by 2
4: Divide by 4
All other values are invalid.
4
SYSREF_PULSE
R/W 0h
When in master mode (SYSREF_REPEAT = 0), this allows multiple pulses (as
determined by SYSREF_PULSE_CNT) to be sent out whenever the SysRefReq pin
goes high.
0: Disabled
1: Enabled
3
2
SYSREF_EN
R/W 0h
R/W 0h
Enables SYSREF mode.
0: Disabled
1: Enabled
SYSREF_REPEAT
Defines SYSREF mode.
0: Master mode. In this mode, SYSREF pulses are generated continuously at the
output.
1: Repeater Mode. In this mode, SYSREF pulses are generated in response to the
SysRefReq pin.
1 - 0
R/W 0h
Program 1h to this field.
7.6.73 Register R72 (offset = 48h) [reset = 0001h]
图 110. Register R72
15
0
14
0
13
0
12
0
11
0
10
9
8
7
6
5
4
3
2
1
0
SYSREF_DIV
R/W-1h
R/W-0h
表 80. Register R72 Field Descriptions
Bit
Field
Type Reset Description
15 - 11
R/W 0h
R/W 1h
Program 0h to this field.
10 - 0 SYSREF_DIV
This divider further divides the output frequency for the SYSREF. See Application for
SYSREF for details.
7.6.74 Register R73 (offset = 49h) [reset = 003Fh]
图 111. Register R73
15
0
14
0
13
0
12
0
11
10
9
8
7
6
5
4
3
2
1
0
JESD_DAC2_CTRL
R/W-0h
JESD_DAC1_CTRL
R/W-3Fh
R/W-0h
表 81. Register R73 Field Descriptions
Bit
Field
Type Reset Description
15 - 12
R/W 0h
R/W 0h
R/W 3Fh
Program 0h to this field.
11 - 6 JESD_DAC2_CTRL
5 - 0 JESD_DAC1_CTRL
Programmable delay adjustment for SYSREF mode.
Programmable delay adjustment for SYSREF mode.
7.6.75 Register R74 (offset = 4Ah) [reset = 0000h]
图 112. Register R74
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SYSREF_PULSE_CNT
R/W-0h
JESD_DAC4_CTRL
R/W-0h
JESD_DAC3_CTRL
R/W-0h
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表 82. Register R74 Field Descriptions
Bit
Field
Type Reset Description
15 - 12 SYSREF_PULSE_CNT
11 - 6 JESD_DAC4_CTRL
R/W 0h
R/W 0h
R/W 0h
Used in SYSREF_REPEAT mode to define how many pulses are sent.
Programmable delay adjustment for SYSREF mode.
Programmable delay adjustment for SYSREF mode.
5 - 0
JESD_DAC3_CTRL
7.6.76 Register R75 (offset = 4Bh) [reset = 0800h]
图 113. Register R75
15
0
14
0
13
0
12
0
11
1
10
9
8
7
6
5
0
4
0
3
0
2
0
1
0
0
0
CHDIV
R/W-0h
R/W-1h
R/W-0h
表 83. Register R75 Field Descriptions
Bit
Field
Type Reset Description
15 - 11
R/W 1h
R/W 0h
Program 1h to this field.
10 - 6 CHDIV
Channel divider.
0: Divide by 2
1: Divide by 4
3: Divide by 8
5: Divide by 16
7: Divide by 32
9: Divide by 64
12: Divide by 128
14: Divide by 256
All other values are not used.
5 - 0
R/W 0h
Program 0h to this field.
7.6.77 Register R76 (offset = 4Ch) [reset = 000Ch]
图 114. Register R76
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
1
2
1
1
0
0
0
R/W-Ch
表 84. Register R76 Field Descriptions
Bit
Field
Type Reset Description
R/W Ch Program Ch to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.78 Register R77 (offset = 4Dh) [reset = 0000h]
图 115. Register R77
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 85. Register R77 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
50
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7.6.79 Register R78 (offset = 4Eh) [reset = 0064h]
图 116. Register R78
15
0
14
0
13
0
12
0
11
10
0
9
8
7
6
5
4
3
2
1
0
1
RAMP_T
HRESH[
32]
QUICK_
RECAL_
EN
VCO_CAPCTRL_STRT
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-32h
R/W-0h
表 86. Register R78 Field Descriptions
Bit
15 - 12
11
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
The 33rd bit of RAMP_THRESH.
RAMP_THRESH[32]
RAMP_THRESH sets how much the ramp can change the VCO frequency before a
VCO calibration is required. If the frequency is chosen to be Δf, then RAMP_THRESH
= (Δf / fPD) × 224
.
10
9
R/W 0h
R/W 0h
Program 0h to this field.
QUICK_RECAL_EN
This sets the initial VCO starting calibration values. Especially useful if the frequency
change is smaller, say < 50 MHz or so.
0: Calibration starts with VCO_SEL, VCO_CAPCTRL_START,
VCO_DACISET_START
1: Calibration starts with the current value
8 - 1
0
VCO_CAPCTRL_STRT
R/W 32h
R/W 0h
This sets the starting VCO_CAPCTRL value that is used for VCO frequency
calibration. Smaller values yield a higher frequency band within a VCO core. Valid
number range is 0 to 183.
Program 1h to this field.
7.6.80 Register R79 (offset = 4Fh) [reset = 0000h]
图 117. Register R79
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
RAMP_THRESH[31:16]
R/W-0h
表 87. Register R79 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Upper 16 bits of RAMP_THRESH. See 表 86 for description.
15 - 0 RAMP_THRESH[31:16]
7.6.81 Register R80 (offset = 50h) [reset = 0000h]
图 118. Register R80
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
RAMP_THRESH[15:0]
R/W-0h
表 88. Register R80 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Lower 16 bits of RAMP_THRESH. See 表 86 for description.
15 - 0 RAMP_THRESH[15:0]
7.6.82 Register R81 (offset = 51h) [reset = 0000h]
图 119. Register R81
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
RAMP_L
IMIT_HI
GH[32]
R/W-0h
R/W-0h
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表 89. Register R81 Field Descriptions
Bit
15 - 1
0
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
The 33rd bit of RAMP_LIMIT_HIGH.
RAMP_LIMIT_HIGH[32]
RAMP_LIMIT_HIGH sets a maximum frequency that the ramp cannot exceed so that
the VCO does not get set beyond a valid frequency range.
Suppose fHIGH is this frequency and fVCO is the starting VCO frequency, then:
fHIGH ≥ fVCO
;
RAMP_LIMIT_HIGH = 224 × (fHIGH – fVCO) / fPD
7.6.83 Register R82 (offset = 52h) [reset = 0000h]
图 120. Register R82
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP_LIMIT_HIGH[31:16]
R/W-0h
表 90. Register R82 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Upper 16 bits of RAMP_LIMIT_HIGH. See 表 89 for description.
15 - 0 RAMP_LIMIT_HIGH
[31:16]
7.6.84 Register R83 (offset = 53h) [reset = 0000h]
图 121. Register R83
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP_LIMIT_HIGH[15:0]
R/W-0h
表 91. Register R83 Field Descriptions
Bit
Field
Type Reset Description
Lower 16 bits of RAMP_LIMIT_HIGH. See 表 89 for description.
15 - 0 RAMP_LIMIT_HIGH[15:0] R/W 0h
7.6.85 Register R84 (offset = 54h) [reset = 0000h]
图 122. Register R84
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
RAMP_L
IMIT_LO
W[32]
R/W-0h
R/W-0h
表 92. Register R84 Field Descriptions
Bit
15 - 1
0
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
The 33rd bit of RAMP_LIMIT_LOW.
RAMP_LIMIT_LOW[32]
RAMP_LIMIT_LOW sets a minimum frequency that the ramp cannot exceed so that
the VCO does not get set beyond a valid frequency range.
Suppose fLOW is this frequency and fVCO is the starting VCO frequency, then:
f
LOW ≤ fVCO
;
RAMP_LIMIT_LOW = 233 – 224 × (fVCO – fLOW) / fPD
52
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7.6.86 Register R85 (offset = 55h) [reset = 0000h]
图 123. Register R85
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP_LIMIT_LOW[31:16]
R/W-0h
表 93. Register R85 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Upper 16 bits of RAMP_LIMIT_LOW. See 表 92 for description.
15 - 0 RAMP_LIMIT_LOW
[31:16]
7.6.87 Register R86 (offset = 56h) [reset = 0000h]
图 124. Register R86
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP_LIMIT_LOW[15:0]
R/W-0h
表 94. Register R86 Field Descriptions
Bit
Field
Type Reset Description
Lower 16 bits of RAMP_LIMIT_LOW. See 表 92 for description.
15 - 0 RAMP_LIMIT_LOW[15:0] R/W 0h
7.6.88 Register R87 (offset = 57h) [reset = 0000h]
图 125. Register R87
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 95. Register R87 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.89 Register R88 (offset = 58h) [reset = 0000h]
图 126. Register R88
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 96. Register R88 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.90 Register R89 (offset = 59h) [reset = 0000h]
图 127. Register R89
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
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表 97. Register R89 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.91 Register R90 (offset = 5Ah) [reset = 0000h]
图 128. Register R90
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 98. Register R90 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.92 Register R91 (offset = 5Bh) [reset = 0000h]
图 129. Register R91
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 99. Register R91 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.93 Register R92 (offset = 5Ch) [reset = 0000h]
图 130. Register R92
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 100. Register R92 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.94 Register R93 (offset = 5Dh) [reset = 0000h]
图 131. Register R93
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 101. Register R93 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
54
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7.6.95 Register R94 (offset = 5Eh) [reset = 0000h]
图 132. Register R94
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 102. Register R94 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.96 Register R95 (offset = 5Fh) [reset = 0000h]
图 133. Register R95
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R/W-0h
表 103. Register R95 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Program 0h to this field.
After programming R0 with RESET = 1, no need to program this register.
15 - 0
7.6.97 Register R96 (offset = 60h) [reset = 0000h]
图 134. Register R96
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
RAMP_B
URST_E
N
RAMP_BURST_COUNT
R/W-0h
R/W-0h
R/W-0h
表 104. Register R96 Field Descriptions
Bit
Field
Type Reset Description
15
RAMP_BURST_EN
R/W 0h
This enables ramp burst mode. In this mode, a number of ramps equal to
RAMP_BURST_COUNT is sent out whenever RAMP_EN is set to 1. This is intended
to produce a finite pattern of ramps, instead of a continuous pattern.
0: Disabled
1: Enabled
14 - 2 RAMP_BURST_COUNT
1 - 0
R/W 0h
R/W 0h
When RAMP_BURST_EN = 1, this sets the number of ramps that is sent out.
Program 0h to this field.
7.6.98 Register R97 (offset = 61h) [reset = 0000h]
图 135. Register R97
15
14
0
13
0
12
0
11
0
10
9
8
7
6
5
4
3
2
0
1
0
RAMP0_
RST
RAMP_TRIGB
RAMP_TRIGA
RAMP_BURST_TRI
G
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
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表 105. Register R97 Field Descriptions
Bit
Field
Type Reset Description
15
RAMP0_RST
R/W 0h
Resets RAMP0 at start of ramp to eliminate round-off errors. Applies to automatic
ramping mode only.
0: Disabled
1: Reset
14 - 11
R/W 0h
R/W 0h
Program 0h to this field.
10 - 7 RAMP_TRIGB
Definition of ramp trigger B.
0: Disabled
1: RampClk pin rising edge
2: RampDir pin rising edge
4: Always triggered
9: RampClk pin falling edge
10: RampDir pin falling edge
All other values are not used.
6 - 3
2
RAMP_TRIGA
R/W 0h
R/W 0h
R/W 0h
Definition of ramp trigger A. Options are same as RAMP_TRIGB.
Program 0h to this field.
1 - 0
RAMP_BURST_TRIG
Sets what triggers the next ramp in burst mode.
0: Ramp transition
1: Trigger A
2: Trigger B
3: Not used
7.6.99 Register R98 (offset = 62h) [reset = 0000h]
图 136. Register R98
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
RAMP0_INC[29:16]
RAMP0_
DLY
R/W-0h
R/W-0h
R/W-0h
表 106. Register R98 Field Descriptions
Bit
Field
Type Reset Description
15 - 2 RAMP0_INC[29:16]
R/W 0h
Upper 14 bits of RAMP0_INC.
RAMP0_INC sets the 2's compliment of the number added to the fractional numerator
on every ramp cycle.
1
R/W 0h
R/W 0h
Program 0h to this field.
0
RAMP0_DLY
When enabled, increases RAMP0 length by basing the ramp clock on two phase
detector cycles instead of one.
0: Ramp clock = 1 fPD cycle
1: Ramp clock = 2 fPD cycles
7.6.100 Register R99 (offset = 63h) [reset = 0000h]
图 137. Register R99
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP0_INC[15:0]
R/W-0h
表 107. Register R99 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Lower 16 bits of RAMP0_INC. See 表 106 for description.
15 - 0 RAMP0_INC[15:0]
56
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7.6.101 Register R100 (offset = 64h) [reset = 0000h]
图 138. Register R100
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP0_LEN
R/W-0h
表 108. Register R100 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Length of the ramp in phase detector cycles.
15 - 0 RAMP0_LEN
7.6.102 Register R101 (offset = 65h) [reset = 0000h]
图 139. Register R101
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
5
4
3
0
2
0
1
0
RAMP1_ RAMP1_ RAMP0_
DLY
RAMP0_NEXT_TRI
G
RST
NEXT
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
表 109. Register R101 Field Descriptions
Bit
15 - 7
6
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
RAMP1_DLY
RAMP1_RST
RAMP0_NEXT
When enabled, increases RAMP1 length by basing the ramp clock on two phase
detector cycles instead of one.
0: Ramp clock = 1 fPD cycle
1: Ramp clock = 2 fPD cycles
5
4
R/W 0h
R/W 0h
Resets RAMP1 at start of ramp to eliminate round-off errors. Applies to automatic
ramping mode only.
0: Disabled
1: Reset
Defines what ramp comes after RAMP0.
0: RAMP0
1: RAMP1
3 - 2
1 - 0
R/W 0h
R/W 0h
Program 0h to this field.
RAMP0_NEXT_TRIG
Defines what triggers the next ramp.
0: RAMP0_LEN timeout counter
1: Trigger A
2: Trigger B
3: Not used
7.6.103 Register R102 (offset = 66h) [reset = 0000h]
图 140. Register R102
15
0
14
0
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP1_INC[29:16]
R/W-0h
R/W-0h
表 110. Register R102 Field Descriptions
Bit
Field
Type Reset Description
15 - 14
R/W 0h
R/W 0h
Program 0h to this field.
13 - 0 RAMP1_INC[29:16]
Upper 14 bits of RAMP1_INC.
RAMP1_INC sets the 2's compliment of the number added to the fractional numerator
on every ramp cycle.
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7.6.104 Register R103 (offset = 67h) [reset = 0000h]
图 141. Register R103
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP1_INC[15:0]
R/W-0h
表 111. Register R103 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Lower 16 bits of RAMP1_INC. See 表 110 for description.
15 - 0 RAMP1_INC[15:0]
7.6.105 Register R104 (offset = 68h) [reset = 0000h]
图 142. Register R104
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RAMP1_LEN
R/W-0h
表 112. Register R104 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Length of the ramp in phase detector cycles.
15 - 0 RAMP1_LEN
7.6.106 Register R105 (offset = 69h) [reset = 4440h]
图 143. Register R105
15
14
13
12
11
10
9
8
7
6
5
4
3
0
2
0
1
0
RAMP_DLY_CNT
RAMP_
MANUAL
RAMP1_
NEXT
RAMP1_NEXT_TRI
G
R/W-111h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
表 113. Register R105 Field Descriptions
Bit
Field
Type Reset Description
15 - 6 RAMP_DLY_CNT
R/W 111h
For ramping mode, RAMP_DLY_CNT and RAMP_SCALE_COUNT determine the
minimum necessary time taken for VCO calibration during the ramp.
Min. VCOCal time = (1 / fsmc) / (RAMP_DLY_CNT × 2RAMP_SCALE_COUNT), where fsmc
=
fOSCin / 2CAL_CLK_DIV
.
5
4
RAMP_MANUAL
RAMP1_NEXT
R/W 0h
R/W 0h
Selects the ramping mode.
0: Automatic ramping mode
1: Manual (Pin) ramping mode
Defines what ramp comes after RAMP1.
0: RAMP0
1: RAMP1
3 - 2
1 - 0
R/W 0h
R/W 0h
Program 0h to this field.
RAMP1_NEXT_TRIG
Defines what triggers the next ramp.
0: RAMP1_LEN timeout counter
1: Trigger A
2: Trigger B
3: Not used
7.6.107 Register R106 (offset = 6Ah) [reset = 0007h]
图 144. Register R106
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
3
0
2
1
0
RAMP_T
RIG_CA
L
RAMP_SCALE_COUNT
R/W-0h
R/W-0h
R/W-0h
R/W-7h
58
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表 114. Register R106 Field Descriptions
Bit
15 - 5
4
Field
Type Reset Description
R/W 0h
R/W 0h
Program 0h to this field.
RAMP_TRIG_CAL
Enabling this bit causes VCO calibration to occur in automatic ramping mode at the
beginning of each ramp.
0: Disabled
1: Enabled
3
R/W 0h
R/W 7h
Program 0h to this field.
2 - 0
RAMP_SCALE_COUNT
For ramping mode, RAMP_DLY_CNT and RAMP_SCALE_COUNT determine the
minimum necessary time taken for VCO calibration during the ramp.
Min. VCOCal time = (1 / fsmc) / (RAMP_DLY_CNT × 2RAMP_SCALE_COUNT), where fsmc
=
fOSCin / 2CAL_CLK_DIV
.
7.6.108 Register R107 (offset = 6Bh) [reset = 0000h]
图 145. Register R107
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R-0h
表 115. Register R107 Field Descriptions
Bit
Field
Type Reset Description
R 0h Not used. (Read back only)
15 - 0
7.6.109 Register R108 (offset = 6Ch) [reset = 0000h]
图 146. Register R108
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R-0h
表 116. Register R108 Field Descriptions
Bit
Field
Type Reset Description
R 0h Not used. (Read back only)
15 - 0
7.6.110 Register R109 (offset = 6Dh) [reset = 0000h]
图 147. Register R109
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R-0h
表 117. Register R109 Field Descriptions
Bit
Field
Type Reset Description
R 0h Not used. (Read back only)
15 - 0
7.6.111 Register R110 (offset = 6Eh) [reset = 0000h]
图 148. Register R110
15
0
14
0
13
0
12
0
11
0
10
9
8
0
7
6
5
4
0
3
0
2
0
1
0
0
0
rb_LD_VTUNE
rb_VCO_SEL
R-0h
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表 118. Register R110 Field Descriptions
Bit
Field
Type Reset Description
10 - 9 rb_LD_VTUNE
R
0h
Readback of Vtune lock detect.
0: Unlocked
1: Unlocked
2: Locked
3: Invalid
7 - 5
rb_VCO_SEL
R
0h
Reads back the actual VCO that the calibration has selected.
1: VCO1
2: VCO2
·····
6: VCO6
All other values are not used.
7.6.112 Register R111 (offset = 6Fh) [reset = 0000h]
图 149. Register R111
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
6
5
4
3
2
1
0
rb_VCO_CAPCTRL
R-0h
表 119. Register R111 Field Descriptions
Bit
Field
Type Reset Description
R 0h Reads back the actual CAPCTRL value that the VCO calibration has chosen.
7 - 0
rb_VCO_CAPCTRL
7.6.113 Register R112 (offset = 70h) [reset = 0000h]
图 150. Register R112
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
7
6
5
4
3
2
1
0
rb_VCO_DACISET
R-0h
表 120. Register R112 Field Descriptions
Bit
Field
Type Reset Description
R 0h Reads back the actual DACISET value that the VCO calibration has chosen.
8 - 0
rb_VCO_DACISET
7.6.114 Register R113 (offset = 71h) [reset = 0000h]
图 151. Register R113
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
R-0h
表 121. Register R113 Field Descriptions
Bit
Field
Type Reset Description
R 0h Not used. (Read back only)
15 - 0
7.6.115 Register R114 (offset = 72h) [reset = 7800h]
图 152. Register R114
15
0
14
1
13
1
12
1
11
1
10
9
8
0
7
6
5
4
3
2
1
0
FSK_EN
R/W-0h
FSK_SPI_LEVEL
R/W-0h
FSK_SPI_DEV_SEL
R/W-0h
FSK_MODE_SEL
R/W-0h
R/W-Fh
R/W-0h
60
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表 122. Register R114 Field Descriptions
Bit
15 - 11
10
Field
Type Reset Description
R/W Fh
R/W 0h
Program Fh to this field.
FSK_EN
Enables all FSK modes.
0: Disabled
1: Enabled
9 - 7
6 - 5
R/W 0h
R/W 0h
Program 0h to this field.
FSK_SPI_LEVEL
FSK_SPI_DEV_SEL
FSK_MODE_SEL
Defines the desired FSK level in FSK SPI mode. When this bit is zero, FSK operation
in this mode is disabled even if FSK_EN = 1.
0: Disabled
1: 2FSK
2: 4FSK
3: 8FSK
4 - 2
R/W 0h
In FSK SPI mode, these bits select one of the FSK deviations as defined in registers
R116 - R123.
0: FSK_DEV0
1: FSK_DEV1
·····
7: FSK_DEV7
1 - 0
R/W 0h
Defines FSK mode.
0: Not used
1: Not used
2: FSK SPI
3: FSK SPI FAST
7.6.116 Register R115 (offset = 73h) [reset = 0000h]
图 153. Register R115
15
0
14
0
13
0
12
0
11
0
10
0
9
0
8
0
7
6
5
4
3
2
0
1
0
0
0
FSK_DEV_SCALE
R/W-0h
R/W-0h
R/W-0h
表 123. Register R115 Field Descriptions
Bit
15 - 8
7 - 3
2 - 0
Field
Type Reset Description
R/W 0h
R/W 0h
R/W 0h
Program 0h to this field.
The FSK deviation will be scaled by 2FSK_DEV_SCALE
FSK_DEV_SCALE
.
Program 0h to this field.
7.6.117 Register R116 (offset = 74h) [reset = 0000h]
图 154. Register R116
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FSK_DEV0
R/W-0h
表 124. Register R116 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV0
7.6.118 Register R117 (offset = 75h) [reset = 0000h]
图 155. Register R117
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FSK_DEV1
R/W-0h
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表 125. Register R117 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV1
7.6.119 Register R118 (offset = 76h) [reset = 0000h]
图 156. Register R118
15
14
13
12
11
10
9
8
7
6
5
4
3
2
2
2
2
1
1
1
1
0
0
0
0
FSK_DEV2
R/W-0h
表 126. Register R118 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV2
7.6.120 Register R119 (offset = 77h) [reset = 0000h]
图 157. Register R119
15
14
13
12
11
10
9
8
7
6
5
4
3
FSK_DEV3
R/W-0h
表 127. Register R119 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV3
7.6.121 Register R120 (offset = 78h) [reset = 0000h]
图 158. Register R120
15
14
13
12
11
10
9
8
7
6
5
4
3
FSK_DEV4
R/W-0h
表 128. Register R120 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV4
7.6.122 Register R121 (offset = 79h) [reset = 0000h]
图 159. Register R121
15
14
13
12
11
10
9
8
7
6
5
4
3
FSK_DEV5
R/W-0h
表 129. Register R121 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV5
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7.6.123 Register R122 (offset = 7Ah) [reset = 0000h]
图 160. Register R122
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FSK_DEV6
R/W-0h
表 130. Register R122 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV6
7.6.124 Register R123 (offset = 7Bh) [reset = 0000h]
图 161. Register R123
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FSK_DEV7
R/W-0h
表 131. Register R123 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI mode.
15 - 0 FSK_DEV7
7.6.125 Register R124 (offset = 7Ch) [reset = 0000h]
图 162. Register R124
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
FSK_SPI_FAST_DEV
R/W-0h
表 132. Register R124 Field Descriptions
Bit
Field
Type Reset Description
R/W 0h Defines the desired frequency deviation in FSK SPI FAST mode.
15 - 0 FSK_SPI_FAST_DEV
7.6.126 Register R125 (offset = 7Dh) [reset = 2288h]
图 163. Register R125
15
0
14
0
13
1
12
0
11
0
10
0
9
1
8
0
7
1
6
0
5
0
4
0
3
1
2
0
1
0
0
0
R/W-2288h
表 133. Register R125 Field Descriptions
Bit
Field
Type Reset Description
15 - 0
R/W 2288h Program 2288h to this field.
After programming R0 with RESET = 1, no need to program this register.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 OSCin Configuration
OSCin supports single-ended and differential clock. Register R5 defines OSCin configuration.
表 134. OSCin Configuration
OSCin TYPE
SINGLE-ENDED CLOCK
DIFFERENTIAL CLOCK
VT
VT
OSCin
Configuration Diagram
OSCin
OSCin*
OSCin*
50Ω
50Ω
IPBUF_TYPE = 0
IPBUF_TERM = 1
Register Setting
IPBUF_TYPE = 1
Single-ended and differential input clock definitions are shown in 图 164.
VOSCin
VOSCin
VOSCin
CMOS
Sine wave
Differential
图 164. Input Clock Definition
8.1.2 OSCin Slew Rate
The slew rate of the OSCin signal can have an impact on the spurs and phase noise of the LMX2572 if it is too
low. In general, the best performance is for a high slew rate but a lower amplitude signal, such as LVDS.
8.1.3 VCO Gain
The VCO gain varies between the six VCO cores and is the lowest at the lowest end of the band and highest at
the highest end of each band. The typical VCO gain over each VCO core is listed in 表 135.
表 135. VCO Gain
VCO CORE
VCO1
fMin (MHz)
3200
fMax (MHz)
3650
KVCOMin (MHz/V)
KVCOMax (MHz/V)
32
35
47
50
61
57
47
54
64
73
82
79
VCO2
3650
4200
VCO3
4200
4650
VCO4
4650
5200
VCO5
5200
5750
VCO6
5750
6400
64
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For an arbitrary VCO frequency, the VCO gain can be estimated as 公式 4:
KVCO = KVCOMin + (KVCOMax – KVCOMin) × (fVCO – fMin) / (fMax – fMin
)
(4)
8.1.4 VCO Calibration
The purpose of VCO calibration is to find out: (1) the correct VCO core, (2) the best band within the core, and (3)
the best VCO amplitude setting. The LMX2572 allows the user to assist the VCO calibration. In general, there
are three kinds of assistance.
8.1.4.1 Partial Assist
Upon every frequency change, before the FCAL_EN bit is checked, the user provides a good estimate of the
initial starting point for the VCO core (VCO_SEL), band (VCO_CAPCTRL_STRT), and amplitude
(VCO_DACISET_STRT). To do the partial assist for the VCO calibration, follow this procedure:
1. Pick a VCO core that includes the desired VCO frequency. If at the boundary of two cores, choose based on
phase noise or performance.
2. Use 公式 5 to find the approximate band:
VCO_CAPCTRL_STRT = Round[CMin – (fVCO – fMin) × (CMin – CMax) / (fMax – fMin)]
(5)
(6)
3. Use 公式 6 to find the approximate amplitude setting.
VCO_DACISET_STRT = Round[AMin – (fVCO – fMin) × (AMin – AMax) / (fMax – fMin)]
表 136. VCO Core Parametric
VCO CORE
VCO1
fMin (MHz)
3200
fMax (MHz)
3650
CMin
131
143
135
136
133
151
CMax
19
AMin
138
162
126
195
190
256
AMax
137
142
114
172
163
204
VCO2
3650
4200
25
VCO3
4200
4650
34
VCO4
4650
5200
25
VCO5
5200
5750
20
VCO6
5750
6400
27
8.1.4.2 Close Frequency Assist
Upon initialization of the device, the user enables the QUICK_RECAL_EN bit. The next VCO calibration will use
the current VCO core, band, and amplitude settings as the initial starting point. This approach is useful if the
frequency change is small, say 50 MHz or so.
8.1.4.3 Full Assist
The user forces the VCO core (VCO_SEL), band (VCO_CAPCTRL), and amplitude (VCO_DACISET) and
manually sets the value. No VCO calibration will be performed. To force the set values, set VCO_SEL_FORCE,
VCO_CAPCTRL_FORCE, and VCO_DACISET_FORCE equal 1. First do a VCO calibration and then read back
the values to obtain the set values.
8.1.5 Output Buffer Control
8.1.5.1 Output Power
The OUTA_PWR and OUTB_PWR registers can be used to control the output power of the output buffers. The
change in output power becomes not obvious when these registers values are over 35.
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10
8
10
0
6
4
-10
-20
-30
-40
-50
2
OUTx_PWR = 15
OUTx_PWR = 31
OUTx_PWR = 63
0
-2
-4
-6
-8
fOUT
3200 MHz
4000 MHz
4800 MHz
5600 MHz
6400 MHz
0
800 1600 2400 3200 4000 4800 5600 6400
0
8
16
24
32
40
48
56
64
fOUT (MHz)
OUTx_PWR
D001
D002
图 165. Output Power vs Frequency
图 166. Output Power vs Power Control Bits
8.1.5.2 Power-Up Response
Use the OUTx_PD bits to power up or power down the output buffers. The RF output will vanish immediately
when the buffer is powered down. However, it takes some tiny amount of time for it to power up. The response
time is shorter if the output frequency is lower.
图 167. Buffer Power Up at 400-MHz Output
图 168. Buffer Power Up at 6400-MHz Output
8.1.5.3 Unused Output Pin
Each output buffer has two differential pair pins. The buffer can be used as a single differential output or two
single-ended outputs. If only one single-ended output is necessary, the unused pin cannot be left open. The pin
should be terminated properly as shown in 图 169.
System device
RFout
图 169. Unused Output Buffer Differential Pin
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8.1.6 Application for SYNC
The requirements for SYNC depend on certain setup conditions. In cases where the SYNC is not timing critical,
the setup can be done through software by toggling the VCO_PHASE_SYNC_EN bit from 0 to 1. When the
SYNC is timing critical, then setup must be done through the SYNC pin and the setup and hold times for the
OSCin pin are critical.
Determine SYNC
category
M = 1
No
CHDIV ≤ 2
No
No
No
ñ
ñ
M = 2 when Doubler is ON
M = MULT when MULT ≥ 3
Yes
Yes
Category 3
Category 4
fOUT is an
integer multiple of
fOSCin
fOUT is an
integer multiple of
M x fOSCin
SYNC required
SYNC timing critical
fOSCin ≤ 100 MHz
Device cannot be
reliably used in SYNC
mode
No
No
No
Yes
Yes
PLL_NUM = 0
Yes
Category 2
SYNC required
SYNC timing not critical
No limitation on fOSCin
CHDIV ≤ 2
Yes
Category 1b
SYNC not required
SYNC mode required
(VCO_PHASE_SYNC_EN = 1)
CHDIV = 1
Yes
Category 1a
SYNC not required
SYNC mode not
required
图 170. SYNC Category
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The procedure for using SYNC in different SYNC categories is shown in 表 137.
表 137. Procedure for Using SYNC
CATEGORY
CHARACTERISTIC
SETUP PROCEDURE
•
•
SYNC not required.
SYNC mode not required.
1. Setup as usual.
1a
2. Program all the registers as usual. The phase relationship between OSCin
and fOUT will always be deterministic.
•
•
SYNC not required.
SYNC mode required.
1. Set N = N' / 2, where N' is the normal N divider value.
1b
2. Program all the registers with R0 VCO_PHASE_SYNC_EN = 1.
•
•
•
SYNC required.
SYNC timing not critical.
No limitation on fOSCin
1. Setup as usual.
2. Program all the registers as usual. The device is now locked.
3. Program N = N' / 2, where N' is the normal (original) N divider value.
4. Program R0 with VCO_PHASE_SYNC_EN = 1.
5. Program N = N'.
.
2
6. Program R0 with VCO_PHASE_SYNC_EN = 0.
7. Alternatively, step 3 to 6 can be replaced by applying a SYNC signal (0 → 1
transition) to the SYNC pin and the timing on this in not critical.
•
•
•
SYNC required.
SYNC timing critical.
1. Ensure that the maximum fOSCin for SYNC is not violated and there are
hardware accommodations to use the SYNC pin.
fOSCin ≤ 100 MHz
2. If neither OUTA_MUX nor OUTB_MUX is equal to 0 (Channel divider output),
program N divider as usual.
3
3. If one of the OUTA_MUX or OUTB_MUX is equal to 1, set N = N' / 2, where
N' is the normal N divider (integer + fraction) value.
4. Program all the registers with R0 VCO_PHASE_SYNC_EN = 1.
5. Apply a SYNC signal (0 → 1 transition) to the SYNC pin. The timing of the
SYNC signal as shown in Timing Requirements must be obey.
Set these bits to drive the SYNC pin with a LVDS signal:
•
•
•
Set INPIN_FMT to 1 or 3 to enable LVDS input
Set INPIN_LVL to one of the options
Set INPIN_HYST, if necessary
The LVDS driver that is driving the SYNC pin should be configured as shown in 图 171:
SYNC
100ꢀ
LMX2572
Copyright © 2017, Texas Instruments Incorporated
图 171. Driving SYNC Pin With Differential Signal
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8.1.7 Application for Ramp
8.1.7.1 Manual Ramping Mode
Manual ramping is enabled when the user sets RAMP_EN = 1 and RAMP_MANUAL = 1. In this mode, the ramp
is clocked by the rising edges applied to the RampClk pin. The size of the frequency change is defined by
RAMP0_INC and RAMP1_INC. If a LOW is seen at the RampDir pin on the rising edge of RampClk, the output
frequency will be incremented by RAMP0_INC. On the contrary, the output frequency will be incremented by
RAMP1_INC if a HIGH is captured. If a rising edge is seen on the RampClk pin while the VCO is calibrating, then
this rising edge is ignored. The frequency for the RampClk must be limited to a frequency of 250 kHz or less, and
the rising edge of the RampDir signal must be targeted to the falling edge of the RampClk pin. The necessary
register fields for use in manual ramping mode are shown in 表 138.
表 138. Manual Ramping Mode Programming
REGISTER FIELD
VALUE
DESCRIPTION
Set this bit to 1 to enable frequency ramping.
RAMP_EN
1 = Enable ramp
1 = Manual ramping
mode
RAMP_MANUAL
To select manual ramping mode, set this bit to 1.
Greater than the
This sets the upper ramp limit that the ramp cannot go above. Suppose fHigh is this
RAMP_LIMIT_HIGH highest VCO ramp
frequency
frequency and fStart is the starting VCO ramp frequency, then, for fHigh > fStart
,
RAMP_LIMIT_HIGH = 224 × (fHigh – fStart) / fPD
Smaller than the
RAMP_LIMIT_LOW lowest VCO ramp
frequency
This sets the lower ramp limit that the ramp cannot go below. Suppose fLow is this frequency
and fStart is the starting VCO ramp frequency, then, for fStart > fLow
,
RAMP_LIMIT_LOW = 233 – 224 × (fStart – fLow) / fPD
RAMP0_INC
RAMP1_INC
Equal to the ramp
size
Suppose the ramp size is Δf, then
RAMPx_INC = (Δf / fPD) × 224 or = 230 – (Δf / fPD) × 224 if Δf is a negative number.
If the amount of frequency ramp exceeds this threshold, a VCO calibration will be initiated.
For example, if the ramp size is 50 MHz while this threshold is 30 MHz, then VCO
calibration will be executed every time it ramps. Suppose the threshold frequency is fTH,
Suggest less than 50
MHz
RAMP_THRESH
then
RAMP_THRESH = (fTH / fPD) × 224
In manual ramping mode, the ramp is triggered by the rising edges applied to the RampClk
RAMP_TRIGA
RAMP_TRIGB
1 = RampClk rising
edge trigger
pin.
Either RAMP_TRIGA or RAMP_TRIGB can be selected as the trigger source for the next
ramp.
RAMP0_NEXT_TRIG Equal to the selected These fields define what triggers the next ramp. They must be set to the same trigger
RAMP1_NEXT_TRIG RAMP_TRIGx
source selected above.
RAMPx_INC
图 172. Manual Ramp Waveform
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8.1.7.2 Automatic Ramping Mode
Automatic ramping mode is enabled when RAMP_EN = 1 with RAMP_MANUAL = 0. In this mode, there are two
ramps profiles that one can use to set the length and frequency change. In addition to this, there are ramp limits
that can be used to create more complicated waveforms. The output frequency will ramp once on each phase
detector cycle.
Automatic ramping can really be divided into two classes depending on whether the VCO must calibrate in the
middle of the ramping or not. If the VCO can go the entire range without calibrating, this is calibration-free
ramping. Note that this range is less at hot temperatures and less for lower frequency VCOs. This range is not
ensured, so margin must be built into the design.
For ramping that are not calibration free, the ramp waveform is more like a staircase ramp.
表 139. Automatic Ramping Mode Programming
REGISTER FIELD
VALUE
DESCRIPTION
Set this bit to 1 to enable frequency ramping.
RAMP_EN
1 = Enable ramp
0 = Automatic
ramping mode
RAMP_MANUAL
To select automatic ramping mode, set this bit to 0.
Greater than the
This sets the upper ramp limit that the ramp cannot go above. Suppose fHigh is this
RAMP_LIMIT_HIGH highest VCO ramp
frequency
frequency and fStart is the starting VCO ramp frequency, then, for fHigh > fStart
,
RAMP_LIMIT_HIGH = 224 × (fHigh – fStart) / fPD
Smaller than the
RAMP_LIMIT_LOW lowest VCO ramp
frequency
This sets the lower ramp limit that the ramp cannot go below. Suppose fLow is this frequency
and fStart is the lowest VCO ramp frequency, then, for fStart > fLow
,
RAMP_LIMIT_LOW = 233 – 224 × (fStart – fLow) / fPD
RAMP0_INC
RAMP1_INC
Equal to the ramp
size
Suppose the ramp size is Δf, then
RAMPx_INC = (Δf / fPD) × 224 or = 230 – (Δf / fPD) x 224 if Δf is a negative number.
If the amount of frequency ramp exceed this threshold, a VCO calibration will be initiated.
Suggest less than 50 For example, if the ramp size is 15 MHz while this threshold is 20 MHz, then VCO
RAMP_THRESH
MHz
calibration will be executed every two ramps. Suppose the threshold frequency is fTH, then
RAMP_THRESH = (fTH / fPD) × 224
Set the number of ramp required in each ramp profile. Maximum value is 216. If this number
is exceeded, enable the RAMPx_DLY bit or reduce the phase detector frequency.
RAMPx_LEN = Ramp duration of a ramp profile × fPD
RAMP0_LEN
RAMP1_LEN
0 to 216
0 or 1
RAMP0_DLY
RAMP1_DLY
If this bit is set to 1, the output frequency will ramp every two fPD cycles.
Set the next ramping profile when the present profile is finished.
RAMP0_NEXT
RAMP1_NEXT
Equal to the next
ramp
RAMP0_NEXT_TRIG 0 = RAMP_LENx time
RAMP1_NEXT_TRIG out counter
Set these bits to 0 in order to start the next ramp immediately after the previous ramp.
RAMP0_RST
0 or 1
If the stop frequency of the present ramp profile is different from the start frequency of the
next ramp profile, set this bit to 1.
RAMP1_RST
These two register fields set the minimum pause time when RAMP_THRESH is hit. This
pause time must be sufficient to allow the VCO to complete a calibration, otherwise it will be
overwritten by the actual VCO calibration time.
RAMP_SCALE_COU
Suggest a minimum
NT
pause time of 50 µs
RAMP_DLY_CNT
Minimum pause time = RAMP_DLY_CNT × 2RAMP_SCALE_COUNT × 2CAL_CLK_DIV / fOSCin
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RAMPx_INC
Configurable
pause time
RAMP_THRESH
1 / fPD
Accumulated
ramp frequency.
RAMP_THRESH
Total ramp time = Desired ramp duration + sum of all pause time.
图 173. Auto Ramp Waveform
8.1.8 Application for SYSREF
SYSREF consists of multiple dividers and a delay circuitry. The dividers include two fixed value dividers, a Pre-
SR divider (SYSREF_DIV_PRE), and a Post-SR divider (SYSREF_DIV).
Pre-SR
Divider
Post-SR
Divider
RFoutB
(SYSREF)
VCO
÷2
÷2
Delay
图 174. SYSREF
SYSREF output frequency, fSYSREF, is calculated by 公式 7:
fSYSREF = fVCO / (4 × SYSREF_DIV_PRE × SYSREF_DIV)
(7)
The delay circuitry is consist of 4 counters (JESD_DAC1_CTRL, JESD_DAC2_CTRL, JESD_DAC3_CTRL, and
JESD_DAC4_CTRL). Altogether, there are 200 useful programmable steps and each step is approximately a 5
ps (Pre-SR divider = 2) or 10 ps (Pre-SR divider = 4) delay. The values of the counters must be set in
accordance to 表 140.
表 140. SYSREF Delay Step
DELAY STEP NUMBER
JESD_DAC1_CTRL
JESD_DAC2_CTRL
JESD_DAC3_CTRL
JESD_DAC4_CTRL
0
…
36
27
0
0
36
0
0
63
62
0
1
0
0
37
…
99
0
0
0
0
63
62
0
1
100
…
162
163
…
0
1
0
0
0
0
63
62
200
> 200
38
0
0
25
Invalid
Invalid
Invalid
Invalid
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表 141 summarizes the usage boundaries of all functional blocks in SYSREF.
表 141. SYSREF Boundaries
PARAMETER
Pre-SR divider
VALUE
1 (Bypassed), 2, 4
NOTES
Post-SR divider
4, 6, 8, 10, …, 4096, 4098
1, 2, 3, …, 14, 15
Input frequency range: 400 to 2300 MHz
Number of SYSREF pulse in Pulsed mode
Number of delay step
0 (No additional delay), 1, 2, 3, …, 199, 200
Since SYSREF operation requires enabling the VCO_PHASE_SYNC_EN bit, during programming, set N = N' / 2,
where N' is the normal N divider value.
8.1.8.1 Driving SysRefReq Pin With Differential Signal
By default, the SysRefReq pin is configured as CMOS type input. VIO and VIH as shown in the Electrical
Specifications apply. In Repeater mode (SYSREF_REPEAT = 1), there is an option to program this pin to
support LVDS input signal.
•
•
•
Set INPIN_FMT to 2 or 3 to enable LVDS input
Set INPIN_LVL to one of the options
Set INPIN_HYST if necessary
The LVDS driver that is driving the SysRefReq pin should be configured like 图 175:
SysRefReq
100ꢀ
LMX2572
Copyright © 2017, Texas Instruments Incorporated
图 175. Driving SysRefReq Pin With Differential Signal
8.1.8.2 SYSREF Output
The SYSREF output comes in differential format through RFoutB. The common mode output voltage of this
driver is between 1.9 V to 2.3 V. If DC-coupling to the receiving device is not possible, there are two strategies
for AC-coupling.
1. Send a series of pulses to establish a DC-bias level across the AC-coupling capacitor.
2. Establish a bias voltage at the receiving device that is below the threshold voltage by using a resistive
divider.
8.1.9 Application for FSK
In fractional mode, the finest delta frequency difference between two programmable output frequencies is equal
to 公式 8:
f1 – f2 = Δfmin = fPD × {[(PLL_N + 1) / PLL_DEN] – (PLL_N / PLL_DEN)} = fPD / PLL_DEN
(8)
In other words, when the fractional numerator is incremented by 1 (one step), the output frequency will change
by Δfmin. A two steps increment will therefore change the frequency by 2 × Δfmin
.
In FSK operation, the instantaneous carrier frequency is kept changing among some pre-defined frequencies. In
general, the instantaneous carrier frequency is defined as a certain frequency deviation from the nominal carrier
frequency. The frequency deviation could be positive and negative.
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Nominal
carrier
frequency
Instantaneous
carrier
frequencies
Negative
deviation
Postivie
deviation
fDEV
0
fDEV
1
图 176. General FSK Definition
公式 9 and 公式 10 define the number of steps required for the desired frequency deviation with respect to the
nominal carrier frequency output. Assume ΔfDEV is the frequency deviation,
For positive deviation, FSK step = Round[(ΔfDEV × PLL_DEN x CHDIV) / (fPD × 2FSK_DEV_SCALE)]
(9)
For negative deviation, FSK step = 216 – the positive deviation, FSK step answer
(10)
In FSK SPI mode, registers R116 – R123 are used to store the desired FSK steps as defined in 公式 9 and 公式
10. The order of the registers, 0 to 7, depends on the application system. A typical 4FSK definition is shown in
图 177. In this case, the FSK_DEV0 and FSK_DEV1 are calculated using 公式 9, while the FSK_DEV2 and
FSK_DEV3 are calculated using 公式 10.
4FSK symbol:
11 10 00 01
Frequency
图 177. Typical 4FSK Definition
FSK SPI mode assumes the user knows which symbol to send. The user can directly write to
FSK_SPI_DEV_SEL to select the desired frequency deviation. For example, to enable the device to support
4FSK modulation in FSK SPI mode, set:
•
•
•
FSK_MODE_SEL = 2 (FSK SPI)
FSK_SPI_LEVEL = 2 (4FSK)
FSK_EN = 1
表 142. FSK SPI Mode Example
DESIRED SYMBOL
WRITE REGISTER FSK_SPI_DEV_SEL
REGISTER SELECTED
FSK_DEV2
FSK_DEV3
FSK_DEV2
FSK_DEV3
FSK_DEV1
FSK_DEV0
…
10
11
10
11
01
00
…
2
3
2
3
1
0
…
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FSK SPI mode supports up to eight levels of FSK. To support an arbitrary-level FSK, use FSK SPI FAST mode.
Constructing pulse-shaping FSK modulation by over-sampling the FSK modulation waveform is one of the used
cases of this mode.
Analog-FM modulation can also be produced in this mode. For example, with a 1-kHz sine wave modulation
signal with peak frequency deviation of ±2 kHz, the signal can be oversampled, say 10 times. Each sample point
corresponding to a scaled frequency deviation.
+2 kHz
t5 t6 t7 t8 t9
Time
t0 t1 t2 t3 t4
Þ2 kHz
图 178. Oversampling Modulation Signal
In FSK SPI FAST mode, write the desired FSK steps directly to FSK_SPI_FAST_DEV. To enable this mode, set:
•
•
FSK_MODE_SEL = 3 (FSK SPI FAST)
FSK_EN = 1
表 143. FSK SPI FAST Mode Example
TIME
t0
FREQUENCY DEVIATION (Hz)
CORRESPONDING FSK STEPS(1)
WRITE TO FSK_SPI_FAST_DEV
618.034
1618.034
2000
396
1036
1280
…
396
1036
1280
…
t1
t2
…
t6
…
–1618.034
–2000
…
64500
64256
…
64500
64256
…
t7
…
(1) fVCO = 3840 MHz, fOUT = 480 MHz, fPD = 100 MHz, CHDIV = 8, PLL_DEN = 8000000, FSK_DEV_SCALE = 0.
Block Programming is possible with FSK SPI FAST mode programming as long as ADD_HOLD = 1, which will
freeze the register address after the first register write. The same programming sequent as shown in 图 37
applies.
8.1.10 Unused Pins
TI recommends to pull these pins low if they are not used:
•
•
•
•
Pin 5, SYNC
Pin 28, SysRefReq
Pin 30, RampClk
Pin 32, RampDir
74
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
8.1.11 External Loop Filter
The LMX2572 requires an external loop filter that is application-specific and can be configured by PLLatinum
Sim. For the LMX2572, it matters what impedance is seen from the Vtune pin looking outwards. This impedance
is dominated by the component C3 for a third order filter or C1 for a second order filter. If there is at least 1.5 nF
for the capacitance that is shunt with this pin, the VCO phase noise will be close to the best it can be. If there is
less, the VCO phase noise in the 100-kHz to 1-MHz region will degrade. This capacitor should be placed close to
the Vtune pin.
C3
3
0
1
2
9
2
2
8
3
2
7
4
2
6
5
2
5
6
2
4
7
2
3
8
2
2
9
1
0
2
1
R3
C1
R2
C2
图 179. External Loop Filter
8.1.12 Power-Up, Wake-Up Time
When the device comes out of the powered-down state, either by resuming the POWERDOWN bit to zero or by
pulling back CE pin HIGH (if it was powered down by CE pin), it takes time for the device to acquire lock again.
This wake-up time depends on LDO_DLY setting, loop bandwidth, and the state machine clock frequency (=
fOSCin / 2CAL_CLK_DIV). If the loop bandwidth is greater than 20 kHz, the wake-up time could be adjusted to less
than 1.5 ms with the LDO_DLY setting listed in 表 144.
表 144. LDO_DLY Setting
STATE MACHINE CLOCK
LDO_DLY
FREQUENCY
130 MHz ≤ f ≤ 200MHz
80 MHz ≤ f < 130 MHz
50 MHz ≤ f < 80 MHz
30 MHz ≤ f < 50 MHz
f < 30 MHz
8
5
3
2
1
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8.2 Typical Application
This application example demonstrates how to set up the LMX2572 in FSK SPI FAST mode to synthesize 4-level
GFSK modulation.
XO
100MHz
100pF
RFoutAP
RFoutAM
OSCin
OSCin*
100pF
50ꢀ
LMX2572
Vtune
CPout
SCK
SDI
FSK data
stream
330Ω
CSB
15nF
2.2nF
Copyright © 2017, Texas Instruments Incorporated
图 180. Application Example Schematic
8.2.1 Design Requirements
表 145 lists the design parameters for this example.
表 145. Design Parameters
PARAMETER
OSCin frequency
EXAMPLE VALUE
100 MHz
490 MHz
RFout frequency
4FSK modulation baud rate
BT of Gaussian filter
FSK frequency deviation
Fractional denominator
125 kSps
0.4
±17 kHz and ±51 kHz
8000000
8.2.2 Detailed Design Procedure
First, determine all the elementary blocks of a synthesizer.
OSCin
Doubler
Pre-R
MULT
Post-R
PDF
VCO
3920
CHDIV
Output
100
1
1
1
1
100
8
490
N
39.2
图 181. Application Example Frequency Plan
76
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
Then, program these registers to make LMX2572 locks to the target output frequency:
•
•
•
•
•
•
•
•
OSC_2X = 0
PLL_R_PRE = 1
MULT = 1
PLL_R = 1
PLL_N[18:16] = 0; PLL_N[15:0] = 39
PLL_NUM[31:16] = 24; PLL_NUM[15:0] = 27136
PLL_DEN[31:16] = 122; PLL_DEN[15:0] = 4680
CHDIV = 8
Then program these registers to enable FSK SPI FAST mode:
•
•
•
FSK_MODE_SEL = 3
FSK_DEV_SCALE = 1
FSK_EN = 1
A Mathlab script is then developed to generate the necessary codes that will be used to continuously bit-stream
the LMX2572. These codes are uploaded to the data generator DG2020, which will generate the SPI data to
modulate the LMX2572.
Mathlab
DG2020
LMX2572
SCK
SDI
CSB
Signal
Analyzer
CLK
DATA
LE
Creates and
generates
codes
Generates
the electrical
signals
图 182. Application Example Test Setup
8.2.3 Application Curves
图 184. Gaussian 4FSK Modulation Quality
图 183. Gaussian 4FSK Modulated Spectrum
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8.3 Do's and Don'ts
•
•
RFout output buffers do not need an external pullup. An AC-couple to the load is good enough.
The last shunt capacitor of the loop filter should be placed close to the Vtune pin.
VCC
X
RFout
RFout
3
0
3
0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
2
9
2
9
2
8
2
8
2
7
2
7
2
6
2
6
2
5
2
5
2
4
2
4
2
3
2
3
2
2
2
2
1
0
2
1
1
0
2
1
图 185. Do's and Don'ts
78
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
9 Power Supply Recommendations
TI recommends placing a 100-nF capacitor close to each of the power supply pins. If fractional spurs are a large
concern, use a ferrite bead to each of these power supply pins to reduce spurs to a small degree. This device
has integrated LDOs, which improves the resistance to power supply noise. 图 186 is a typical application
example.
This device can be powered by an external DC/DC buck converter, such as the TPS62150. Note that although
Rtps1 and Rtps2 are 1.5 Ω in the schematic, they could be potentially replaced with a larger resistor value or
inductor value for better power supply filtering. Alternatively, the use of a larger capacitance value for C2 and C4
could also result in better power supply filtering.
图 186. Power Supply With a DC/DC Converter
LDO output = 3.3 V; Current = 80 mA
图 187. Phase Noise With LDO Power Supply
DC/DC input = 5 V; DC/DC output = 3.3 V; Current = 56 mA
图 188. Phase Noise With DC/DC Power Supply
The power consumption of LMX2572 depends on its configuration. The data as shown in the Electrical
Characteristics table represent the current consumption at some specific conditions. It is possible to get a smaller
or higher current consumption than what is specified in the data sheet. To get a rough estimation on current
consumption at a particular configuration, use TICS Pro.
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10 Layout
10.1 Layout Guidelines
In general, the layout guidelines are similar to most other PLL devices. Here are some specific guidelines:
•
•
•
•
GND pins may be routed on the package back to the DAP.
The OSCin pins are internally biased and must be AC-coupled.
The RampClk, RampDir, and SysRefReq can be grounded to the DAP if not used.
Get a loop filter capacitor as close to the Vtune pin as possible to this. This may mean separating it from the
rest of the loop filter.
•
If a single-ended output is necessary, the other side must have the same loading. However, the routing for
the used side can be optimized by routing the complementary side through a via to the other side of the
board. On this side, make the load look equivalent to the side that is used.
•
•
Ensure the DAP on the device is well-grounded with many vias, preferably copper filled.
Have a thermal pad that is as large as the exposed pad. Add vias to the thermal pad to maximize thermal
performance.
•
Use a low loss dielectric material, such as Rogers 4003, for optimal output power.
10.2 Layout Example
图 189. Layout Example
80
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LMX2572
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ZHCSH13B –OCTOBER 2017–REVISED JANUARY 2019
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
德州仪器 (TI) 在 www.ti.com.cn 提供了多种辅助开发的软件工具。其中包括:
•
•
PLLatinum Sim 程序,用于设计回路滤波器以及对相位噪声和杂散进行仿真。
TICS Pro 软件,用于了解如何对器件和 EVM 板进行编程。
11.2 文档支持
11.2.1 相关文档
请参阅如下相关文档:
•
•
•
•
•
《带有 DCS-Control 的 TPS62150 3V 至 17V 1A 降压转换器》(SLVSAL5)
《AN-1879 分数 N 频率合成》(SNAA062)
《通过 LMX2571 实现移频键控》(SNAA309)
《PLL 性能、仿真和设计手册》(SNAA106)
LMX2572EVM 用户指南 (SNAU217)
11.3 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMX2572RHAR
LMX2572RHAT
ACTIVE
ACTIVE
VQFN
VQFN
RHA
RHA
40
40
2500 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
LMX2572
LMX2572
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMX2572RHAR
LMX2572RHAT
VQFN
VQFN
RHA
RHA
40
40
2500
250
330.0
178.0
16.4
16.4
6.3
6.3
6.3
6.3
1.5
1.5
12.0
12.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMX2572RHAR
LMX2572RHAT
VQFN
VQFN
RHA
RHA
40
40
2500
250
356.0
208.0
356.0
191.0
35.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHA 40
6 x 6, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225870/A
www.ti.com
PACKAGE OUTLINE
RHA0040H
VQFN - 1 mm max height
S
C
A
L
E
2
.
2
0
0
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
B
0.5
0.3
A
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
PIN 1 INDEX AREA
6.1
5.9
(0.1)
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
(0.2) TYP
2X 4.5
EXPOSED
THERMAL PAD
11
20
36X 0.5
10
21
SEE SIDE WALL
DETAIL
2X
41
SYMM
4.5
4.5 0.1
SEE TERMINAL
DETAIL
1
30
0.3
0.2
40X
40
31
PIN 1 ID
(OPTIONAL)
0.1
0.05
C A B
SYMM
0.5
0.3
40X
4219055/B 08/22/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHA0040H
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
4.5)
SYMM
40
31
40X (0.6)
1
30
40X (0.25)
4X
(1.27)
(
0.2) TYP
VIA
(0.73)
(5.8)
TYP
4X
41
SYMM
(1.46)
36X (0.5)
10
21
(R0.05)
TYP
11
(0.73) TYP
4X (1.46)
20
4X (1.27)
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219055/B 08/22/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHA0040H
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.46) TYP
9X ( 1.26)
(R0.05) TYP
40
31
40X (0.6)
1
30
40X (0.25)
41
(1.46)
TYP
SYMM
(5.8)
36X (0.5)
10
21
METAL
TYP
11
20
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 41:
70% PRINTED SOLDER COVERAGE BY AREA
SCALE:15X
4219055/B 08/22/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
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