LMV393-Q1DUAL [TI]
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS;
| 型号： | LMV393-Q1DUAL |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS |
| 文件： | 总14页 (文件大小：764K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV331-Q1 SINGLE, LMV393-Q1 DUAL
www.ti.com
SLOS468D –MAY 2005–REVISED AUGUST 2011
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS
Check for Samples: LMV331-Q1 SINGLE, LMV393-Q1 DUAL
1
FEATURES
LMV393...D PACKAGE
(TOP VIEW)
•
•
•
Qualified for Automotive Applications
2.7-V and 5-V Performance
Low Supply Current
VCC+
1
8
1OUT
1IN–
1IN+
GND
2
3
4
2OUT
2IN–
2IN+
7
6
5
–
–
LMV331 . . . 60 μA Typ
LMV393 . . . 100 μA Typ
•
Input Common-Mode Voltage Range Includes
Ground
LMV331...DBV PACKAGE
(TOP VIEW)
•
•
Low Output Saturation Voltage . . . 200 mV Typ
Open-Collector Output for Maximum Flexibility
1
5
4
IN+
VCC+
2
3
GND
IN–
OUT
DESCRIPTION/ORDERING INFORMATION
The LMV393-Q1 device is a low-voltage (2.7 V to 5.5 V) version of the dual and quad comparators, LM393 and
LM339, which operate from 5 V to 30 V. The LMV331-Q1 is the single-comparator version.
The LMV331-Q1 and LMV393-Q1 are the most cost-effective solutions for applications where low-voltage
operation, low power, space saving, and price are the primary specifications in circuit design for portable
consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393
devices at a fraction of the supply current.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
SOT23-5 – DBV
SOIC – D
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
LADQ
V393Q1
Single
Dual
Reel of 3000
Reel of 2500
LMV331QDBVRQ1
–40°C to 125°C
LMV393QDRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
Figure 1. SYMBOL (EACH COMPARATOR)
IN−
IN+
−
+
OUT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2011, Texas Instruments Incorporated
LMV331-Q1 SINGLE, LMV393-Q1 DUAL
SLOS468D –MAY 2005–REVISED AUGUST 2011
www.ti.com
Figure 2. SIMPLIFIED SCHEMATIC
V
CC+
Q6
Q7
M
OUT
Q1
Q2
Q3
Q4
Q5
IN+
IN−
R1
R2
R3
GND
2
Copyright © 2005–2011, Texas Instruments Incorporated
LMV331-Q1 SINGLE, LMV393-Q1 DUAL
www.ti.com
SLOS468D –MAY 2005–REVISED AUGUST 2011
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VCC+
VID
VI
Supply voltage(2)
Differential input voltage(3)
5.5
±5.5
5.5
V
V
V
Input voltage range (either input)
0
D (8-pin) package
D (14-pin) package
DBV package
97
θJA
Package thermal impedance(4) (5)
86 °C/W
206
TJ
Operating virtual junction temperature
Storage temperature range
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
MIN
MAX
5.5
UNIT
V
VCC+
VOUT
TA
Supply voltage (single-supply operation)
Output voltage
2.7
VCC+ + 0.3
125
V
Operating free-air temperature
–40
°C
Copyright © 2005–2011, Texas Instruments Incorporated
3
LMV331-Q1 SINGLE, LMV393-Q1 DUAL
SLOS468D –MAY 2005–REVISED AUGUST 2011
www.ti.com
Electrical Characteristics
at specified free-air temperature, VCC+ = 2.7 V, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
VIO
Input offset voltage
25°C
1.7
7
mV
Average temperature coefficient
of input offset voltage
αVIO
–40°C to 125°C
5
μV/°C
25°C
–40°C to 125°C
25°C
10
250
400
50
IIB
Input bias current
nA
5
IIO
IO
Input offset current
nA
mA
μA
–40°C to 125°C
25°C
150
Output current (sinking)
Output leakage current
VO ≤ 1.5 V
5
23
25°C
0.003
–40°C to 125°C
1
–0.1
to 2
VICR
VSAT
Common-mode input voltage range
Saturation voltage
25°C
25°C
V
I
O ≤ 1 mA
200
40
mV
LMV331
100
140
200
ICC
Supply current
LMV393 (both comparators)
LMV339 (all four comparators)
25°C
70
μA
140
Switching Characteristics
TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Input overdrive = 10 mV
TYP UNIT
1000
ns
tPHL
Propagation delay, high- to low-level output switching
Propagation delay, low- to high-level output switching
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
350
500
ns
tPLH
400
4
Copyright © 2005–2011, Texas Instruments Incorporated
LMV331-Q1 SINGLE, LMV393-Q1 DUAL
www.ti.com
SLOS468D –MAY 2005–REVISED AUGUST 2011
Electrical Characteristics
at specified free-air temperature, VCC+ = 5 V, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
25°C
MIN
TYP
MAX UNIT
1.7
7
VIO
αVIO
IIB
Input offset voltage
mV
9
–40°C to 125°C
Average temperature coefficient
of input offset voltage
25°C
5
μV/°C
25°C
–40°C to 125°C
25°C
25
250
nA
Input bias current
400
2
50
nA
IIO
IO
Input offset current
–40°C to 125°C
25°C
150
Output current (sinking)
Output leakage current
V
O ≤ 1.5 V
10
20
84
mA
25°C
0.003
μA
–40°C to 125°C
1
–0.1
to 4.2
VICR
AVD
Common-mode input voltage range
Large-signal differential voltage gain
25°C
V
25°C
25°C
50
V/mV
200
400
mV
700
VSAT
Saturation voltage
IO ≤ 4 mA
–40°C to 125°C
25°C
60
100
170
120
150
LMV331
–40°C to 125°C
25°C
200
μA
ICC
Supply current
LMV393 (both comparators)
LMV339 (all four comparators)
–40°C to 125°C
25°C
250
300
350
–40°C to 125°C
Switching Characteristics
TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Input overdrive = 10 mV
TYP UNIT
600
ns
tPHL
Propagation delay, high- to low-level output switching
Propagation delay, low- to high-level output switching
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
200
450
ns
tPLH
300
Copyright © 2005–2011, Texas Instruments Incorporated
5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LMV331QDBVRQ1
LMV393QDRG4Q1
LMV393QDRQ1
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOIC
DBV
5
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LADQ
ACTIVE
ACTIVE
D
D
2500
2500
Green (RoHS
& no Sb/Br)
-40 to 125
V393Q1
V393Q1
SOIC
Green (RoHS
& no Sb/Br)
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
OTHER QUALIFIED VERSIONS OF LMV331-Q1, LMV393-Q1 :
Catalog: LMV331, LMV393
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV331QDBVRQ1
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
LMV331QDBVRQ1
5
3000
Pack Materials-Page 2
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