LMV1012TPX-15/NOPB [TI]
用于高增益双线麦克风的模拟输入麦克风前置放大器 | YPB | 4 | -40 to 85;
| 型号： | LMV1012TPX-15/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于高增益双线麦克风的模拟输入麦克风前置放大器 | YPB | 4 | -40 to 85 放大器 商用集成电路 |
| 文件： | 总23页 (文件大小：667K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV1012
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SNAS194H –NOVEMBER 2002–REVISED MAY 2013
LMV1012 Analog Series: Pre-Amplified IC's for High Gain 2-Wire Microphones
Check for Samples: LMV1012
1
FEATURES
DESCRIPTION
The LMV1012 is an audio amplifier series for small
form factor electret microphones. This 2-wire portfolio
is designed to replace the JFET amplifier currently
being used. The LMV1012 series is ideally suited for
applications requiring high signal integrity in the
presence of ambient or RF noise, such as in cellular
communications. The LMV1012 audio amplifiers are
specified to operate over a 2.2V to 5.0V supply
voltage range with fixed gains of 7.8 dB, 15.6 dB,
20.9 dB, and 23.8 dB. The devices offer excellent
THD, gain accuracy and temperature stability as
compared to a JFET microphone.
2
•
Typical LMV1012-15, 2.2V Supply, RL = 2.2 kΩ,
C = 2.2 μF, VIN = 18 mVPP, Unless Otherwise
Specified
•
•
•
•
•
•
Supply Voltage: 2V - 5V
Supply Current: <180 μA
Signal to Noise Ratio (A-Weighted): 60 dB
Output Voltage Noise (A-Weighted): −89 dBV
Total Harmonic Distortion: 0.09%
Voltage Gain
–
–
–
–
LMV1012-07: 7.8 dB
LMV1012-15: 15.6 dB
LMV1012-20: 20.9 dB
LMV1012-25: 23.8 dB
The LMV1012 series enables a two-pin electret
microphone solution, which provides direct pin-to-pin
compatibility with the existing JFET market.
The devices are offered in extremely thin space
saving 4-bump DSBGA packages. The LMV1012XP
is designed for 1.0 mm canisters and thicker ECM
canisters. These extremely miniature packages are
designed for electret condenser microphones (ECM)
form factor.
•
•
Temperature Range: −40°C to 85°C
Offered in 4-Bump DSBGA Packages
APPLICATIONS
•
•
•
•
•
•
Cellular Phones
Headsets
Mobile Communications
Automotive Accessories
PDAs
Accessory Microphone Products
Schematic Diagram
Built-In Gain Electret Microphone
DIAPHRAGM
V
DD
2.2k
AIRGAP
ELECTRET
2.2mF
BACKPLATE
CONNECTOR
OUTPUT
LMV1012
IC
-
INPUT
+
-
+
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
LMV1012
SNAS194H –NOVEMBER 2002–REVISED MAY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Absolute Maximum Ratings(1)(2)
Human Body Model
Machine Model
VDD - GND
2500V
250V
ESD Tolerance(3)
Supply Voltage
5.5V
Storage Temperature Range
Junction Temperature(4)
Mounting Temperature
−65°C to 150°C
150°C max
235°C
Infrared or Convection (20 sec.)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the 5V Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model (HBM) is 1.5 kΩ in series with 100 pF.
(4) The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings(1)
Supply Voltage
2V to 5V
Temperature Range
−40°C to 85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the 5V Electrical Characteristics.
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2.2V Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for TJ = 25°C, VDD = 2.2V, VIN = 18 mV, RL = 2.2 kΩ and C = 2.2 μF.
Boldface limits apply at the temperature extremes.
Symbol
IDD
Parameter
Supply Current
Conditions
LMV1012-07
Min(2)
Typ(3)
Max(2)
Units
VIN = GND
139
250
300
LMV1012-15
LMV1012-20
LMV1012-25
180
160
141
300
325
μA
250
300
250
300
SNR
Signal to Noise Ratio
Max Input Signal
Output Voltage
f = 1 kHz, VIN = 18 mV, LMV1012-07
59
60
A-Weighted
LMV1012-15
dB
LMV1012-20
LMV1012-25
61
61
VIN
f = 1 kHz and THD+N < LMV1012-07
170
100
50
1%
LMV1012-15
mVPP
LMV1012-20
LMV1012-25
28
VOUT
VIN = GND
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
1.65
1.54
1.90
2.03
2.09
1.54
1.48
1.81
1.85
1.90
1.94
2.00
V
1.65
1.55
2.03
2.13
1.65
2.02
1.49
2.18
fLOW
fHIGH
en
Lower −3dB Roll Off Frequency
Upper −3dB Roll Off Frequency
Output Noise
RSOURCE = 50Ω
RSOURCE = 50Ω
A-Weighted
65
95
Hz
kHz
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
−96
−89
−84
−82
0.10
0.09
0.12
0.15
2
dBV
%
THD
Total Harmonic Distortion
f = 1 kHz,
VIN = 18 mV
CIN
ZIN
AV
Input Capacitance
Input Impedance
Gain
pF
>1000
7.8
GΩ
f = 1 kHz,
RSOURCE = 50Ω
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
6.4
5.5
9.5
10.0
14.0
13.1
15.6
20.9
23.8
16.9
17.5
dB
19.5
17.4
22.0
23.3
22.5
25.0
21.4
25.7
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ > TA.
(2) All limits are specified by design or statistical analysis.
(3) Typical values represent the most likely parametric norm.
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5V Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for TJ = 25°C, VDD = 5V, VIN = 18 mV, RL = 2.2 kΩ and C = 2.2 μF.
Boldface limits apply at the temperature extremes.
Symbol
IDD
Parameter
Supply Current
Conditions
LMV1012-07
Min(2)
Typ(3)
Max(2)
Units
VIN = GND
158
250
300
LMV1012-15
LMV1012-20
LMV1012-25
200
188
160
300
325
μA
260
310
250
300
SNR
Signal to Noise Ratio
Max Input Signal
Output Voltage
f = 1 kHz, VIN = 18 mV, LMV1012-07
59
60
A-Weighted
LMV1012-15
dB
LMV1012-20
LMV1012-25
61
61
VIN
f = 1 kHz and THD+N < LMV1012-07
170
100
55
1%
LMV1012-15
mVPP
LMV1012-20
LMV1012-25
28
VOUT
VIN = GND
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
4.45
4.38
4.65
4.80
4.85
4.34
4.28
4.56
4.58
4.65
4.74
4.80
V
4.40
4.30
4.75
4.85
4.45
4.83
4.39
4.86
fLOW
fHIGH
en
Lower −3dB Roll Off Frequency
Upper −3dB Roll Off Frequency
Output Noise
RSOURCE = 50Ω
RSOURCE = 50Ω
A-Weighted
67
150
−96
−89
−84
−82
0.12
0.13
0.18
0.21
2
Hz
kHz
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
dBV
%
THD
Total Harmonic Distortion
f = 1 kHz,
VIN = 18 mV
CIN
ZIN
AV
Input Capacitance
Input Impedance
Gain
pF
>1000
8.1
GΩ
f = 1 kHz,
RSOURCE = 50Ω
LMV1012-07
LMV1012-15
LMV1012-20
LMV1012-25
6.4
5.5
9.5
10.7
14.0
13.1
15.6
21.1
23.9
16.9
17.5
dB
19.2
17.0
22.3
23.5
22.5
25.0
21.2
25.8
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ > TA.
(2) All limits are specified by design or statistical analysis.
(3) Typical values represent the most likely parametric norm.
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Connection Diagram
A2
B2
OUTPUT
GND
X
A1
B1
GND
INPUT
4-Bump DSBGA (Top View)
NOTE
Pin numbers are referenced to package marking text orientation.
The actual physical placement of the package marking will vary slightly from part to part.
The package will designate the date code and will vary considerably. Package marking
does not correlate to device type in any way.
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Typical Performance Characteristics
Unless otherwise specified, VS = 2.2V, RL = 2.2 kΩ, C = 2.2 μF, single supply, TA = 25°C
Supply Current vs. Supply Voltage (LMV1012-07)
Supply Current vs. Supply Voltage (LMV1012-15)
180
260
170
240
85°C
160
25°C
220
200
180
85°C
150
140
25°C
130
120
160
140
120
110
-40°C
-40°C
100
2
3
3.5
4
4.5
5
5.5
2.5
3
3.5
2
2.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 1.
Figure 2.
Supply Current vs. Supply Voltage (LMV1012-20)
Supply Current vs. Supply Voltage (LMV1012-25)
220
260
240
200
220
85°C
85°C
180
200
25°C
180
25°C
160
140
160
140
-40°C
120
120
-40°C
100
100
5.5
2
2.5
3
3.5
4
4.5
5
2
2.5
3
3.5
4
4.5
5
5.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 3.
Figure 4.
Gain and Phase vs. Frequency (LMV1012-07)
Gain and Phase vs. Frequency (LMV1012-15)
10
300
0
18
16
14
GAIN
250
GAIN
-40
8
6
200
-80
150
4
2
PHASE
-120
12
10
8
100
50
PHASE
-160
-200
-240
-280
-320
-360
0
-2
-4
-6
0
6
-50
-100
4
2
-150
-200
-8
-10
0
10k
10
100
1k
100k
1M
100k
10
100
1k
10k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 5.
Figure 6.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VS = 2.2V, RL = 2.2 kΩ, C = 2.2 μF, single supply, TA = 25°C
Gain and Phase vs. Frequency (LMV1012-20)
Gain and Phase vs. Frequency (LMV1012-25)
25
25
20
15
300
300
250
200
GAIN
GAIN
250
200
20
150
100
150
100
PHASE
PHASE
15
10
50
0
50
0
10
5
-50
-50
5
0
-100
-100
-150
-200
-150
-200
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 7.
Figure 8.
Total Harmonic Distortion vs. Frequency (LMV1012-07)
Total Harmonic Distortion vs. Frequency (LMV1012-15)
0.7
0.6
V
IN
= 18 mV
PP
V
IN
= 18 mV
PP
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.0
0.1
0.0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 9.
Figure 10.
Total Harmonic Distortion vs. Frequency (LMV1012-20)
Total Harmonic Distortion vs. Frequency (LMV1012-25)
0.6
0.6
V
= 18 mV
V = 18 mV
IN PP
IN
PP
0.5
0.4
0.3
0.2
0.1
0.0
0.5
0.4
0.3
0.2
0.1
0.0
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 11.
Figure 12.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VS = 2.2V, RL = 2.2 kΩ, C = 2.2 μF, single supply, TA = 25°C
Total Harmonic Distortion vs. Input Voltage (LMV1012-07)
Total Harmonic Distortion vs. Input Voltage (LMV1012-15)
1.0
1.0
f = 1 kHz
0.9
f = 1 kHz
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
50
100
150
200
250
0
20
40
60
80
100
120
INPUT VOLTAGE (mV
)
INPUT VOLTAGE (mV
)
PP
PP
Figure 13.
Figure 14.
Total Harmonic Distortion vs. Input Voltage (LMV1012-20)
Total Harmonic Distortion vs. Input Voltage (LMV1012-25)
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.1
f = 1 kHz
f = 1 kHz
50 60
0.0
0.0
0
10
20
30
40
0
10
20
30
40
INPUT VOLTAGE (mV )
PP
INPUT VOLTAGE (mV
)
PP
Figure 15.
Figure 16.
Output Noise vs. Frequency (LMV1012-07)
Output Noise vs. Frequency (LMV1012-15)
-100
-100
INPUT IS CONNECTED
TO GND
INPUT IS CONNECTED TO
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
GND
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 17.
Figure 18.
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Typical Performance Characteristics (continued)
Unless otherwise specified, VS = 2.2V, RL = 2.2 kΩ, C = 2.2 μF, single supply, TA = 25°C
Output Noise vs. Frequency (LMV1012-20)
Output Noise vs. Frequency (LMV1012-25)
-100
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
INPUT IS CONNECTED
TO GND
INPUT IS CONNECTED
TO GND
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 19.
Figure 20.
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APPLICATION SECTION
HIGH GAIN
The LMV1012 series provides outstanding gain versus the JFET and still maintains the same ease of
implementation, with improved gain, linearity and temperature stability. A high gain eliminates the need for extra
external components.
BUILT IN GAIN
The LMV1012 is offered in 0.3 mm height space saving small 4-pin DSBGA packages in order to fit inside the
different size ECM canisters of a microphone. The LMV1012 is placed on the PCB inside the microphone.
The bottom side of the PCB usually shows a bull's eye pattern where the outer ring, which is shorted to the metal
can, should be connected to the ground. The center dot on the PCB is connected to the VDD through a resistor.
This phantom biasing allows both supply voltage and output signal on one connection.
DIAPHRAGM
AIRGAP
ELECTRET
BACKPLATE
CONNECTOR
LMV1012
IC
Figure 21. Built in Gain
A-WEIGHTED FILTER
The human ear has a frequency range from 20 Hz to about 20 kHz. Within this range the sensitivity of the human
ear is not equal for each frequency. To approach the hearing response weighting filters are introduced. One of
those filters is the A-weighted filter.
The A-weighted filter is usually used in signal to noise ratio measurements, where sound is compared to device
noise. This filter improves the correlation of the measured data to the signal to noise ratio perceived by the
human ear.
10
0
-10
-20
-30
-40
-50
-60
-70
10
100
1k
10k
100k
FREQUENCY (Hz)
Figure 22. A-Weighted Filter
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MEASURING NOISE AND SNR
The overall noise of the LMV1012 is measured within the frequency band from 10 Hz to 22 kHz using an A-
weighted filter. The input of the LMV1012 is connected to ground with a 5 pF capacitor, as in Figure 23. Special
precautions in the internal structure of the LMV1012 have been taken to reduce the noise on the output.
A-WEIGHTED FILTER
5 pF
Figure 23. Noise Measurement Setup
The signal to noise ratio (SNR) is measured with a 1 kHz input signal of 18 mVPP using an A-weighted filter. This
represents a sound pressure level of 94 dB SPL. No input capacitor is connected for the measurement.
SOUND PRESSURE LEVEL
The volume of sound applied to a microphone is usually stated as a pressure level referred to the threshold of
hearing of the human ear. The sound pressure level (SPL) in decibels is defined by:
Sound pressure level (dB) = 20 log Pm/PO
where
•
•
Pm is the measured sound pressure
PO is the threshold of hearing (20 μPa).
(1)
In order to be able to calculate the resulting output voltage of the microphone for a given SPL, the sound
pressure in dB SPL needs to be converted to the absolute sound pressure in dBPa. This is the sound pressure
level in decibels referred to 1 Pascal (Pa).
The conversion is given by:
dBPa = dB SPL + 20*log 20 μPa
(2)
(3)
dBPa = dB SPL - 94 dB
Translation from absolute sound pressure level to a voltage is specified by the sensitivity of the microphone. A
conventional microphone has a sensitivity of -44 dBV/Pa.
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ABSOLUTE
SOUND
PRESSURE
[dBPa]
SENSITIVITY
[dBV/Pa]
-94 dB
SOUND
PRESSURE
[dB SPL]
VOLTAGE
[dBV]
Figure 24. dB SPL to dBV Conversion
Example: Busy traffic is 70 dB SPL
VOUT = 70 −94 −44 = −68 dBV
(4)
This is equivalent to 1.13 mVPP
Since the LMV1012-15 has a gain of 6 (15.6 dB) over the JFET, the output voltage of the microphone is 6.78
mVPP. By implementing the LMV1012-15, the sensitivity of the microphone is -28.4 dBV/Pa (−44 + 15.6).
LOW FREQUENCY CUT OFF FILTER
To reduce noise on the output of the microphone a low frequency cut off filter has been implemented. This filter
reduces the effect of wind and handling noise.
It's also helpful to reduce the proximity effect in directional microphones. This effect occurs when the sound
source is very close to the microphone. The lower frequencies are amplified which gives a bass sound. This
amplification can cause an overload, which results in a distortion of the signal.
20
15
10
5
85°C
25°C
0
-40°C
V
DD
= 2.2V
-5
10k
FREQUENCY (Hz)
10
100
1k
100k
1M
Figure 25. LMV1012-15 Gain vs. Frequency Over Temperature
The LMV1012 is optimized to be used in audio band applications. By using the LMV1012, the gain response is
flat within the audio band and has linearity and temperature stability (see Figure 25).
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NOISE
Noise pick-up by a microphone in cell phones is a well-known problem. A conventional JFET circuit is sensitive
for noise pick-up because of its high output impedance, which is usually around 2.2 kΩ.
RF noise is amongst other caused by non-linear behavior. The non-linear behavior of the amplifier at high
frequencies, well above the usable bandwidth of the device, causes AM-demodulation of high frequency signals.
The AM modulation contained in such signals folds back into the audio band, thereby disturbing the intended
microphone signal. The GSM signal of a cell phone is such an AM-modulated signal. The modulation frequency
of 216 Hz and its harmonics can be observed in the audio band. This kind of noise is called bumblebee noise.
RF noise caused by a GSM signal can be reduced by connecting two external capacitors to ground, see
Figure 26. One capacitor reduces the noise caused by the 900 MHz carrier and the other reduces the noise
caused by 1800/1900 MHz.
V
DD
OUTPUT
INPUT
10 pF
33 pF
Figure 26. RF Noise Reduction
Copyright © 2002–2013, Texas Instruments Incorporated
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13
Product Folder Links: LMV1012
LMV1012
SNAS194H –NOVEMBER 2002–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision G (May 2013) to Revision H
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
14
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Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: LMV1012
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMV1012TP-25/NOPB
LMV1012TPX-15/NOPB
LMV1012TPX-25/NOPB
LMV1012UP-07/NOPB
LMV1012UP-15/NOPB
LMV1012UP-20/NOPB
LMV1012UP-25/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YPB
YPB
YPB
YPC
YPC
YPC
YPC
4
4
4
4
4
4
4
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 RoHS & Green
3000 RoHS & Green
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
-40 to 85
-40 to 85
250
250
250
250
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV1012TP-25/NOPB
DSBGA
YPB
YPB
YPB
YPC
YPC
YPC
YPC
4
4
4
4
4
4
4
250
3000
3000
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
1.02
1.02
1.02
1.02
1.02
1.02
1.02
1.09
1.09
1.09
1.09
1.09
1.09
1.09
0.66
0.66
0.66
0.56
0.56
0.56
0.56
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LMV1012TPX-15/NOPB DSBGA
LMV1012TPX-25/NOPB DSBGA
LMV1012UP-07/NOPB DSBGA
LMV1012UP-15/NOPB DSBGA
LMV1012UP-20/NOPB DSBGA
LMV1012UP-25/NOPB DSBGA
250
250
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV1012TP-25/NOPB
LMV1012TPX-15/NOPB
LMV1012TPX-25/NOPB
LMV1012UP-07/NOPB
LMV1012UP-15/NOPB
LMV1012UP-20/NOPB
LMV1012UP-25/NOPB
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YPB
YPB
YPB
YPC
YPC
YPC
YPC
4
4
4
4
4
4
4
250
3000
3000
250
208.0
208.0
208.0
208.0
208.0
208.0
208.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
250
250
250
Pack Materials-Page 2
MECHANICAL DATA
YPC0004
D
0.350±0.045
E
UPA04XXX (Rev C)
D: Max = 1.057 mm, Min =0.996 mm
E: Max = 0.981 mm, Min = 0.92 mm
4215139/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
PACKAGE OUTLINE
YPB0004
DSBGA - 0.575 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
D
B
E
BALL A1
CORNER
0.575 MAX
C
SEATING PLANE
0.05 C
BALL TYP
0.15
0.11
0.5
B
SYMM
0.5
D: Max = 1.057 mm, Min =0.996 mm
E: Max = 0.981 mm, Min = 0.92 mm
A
1
2
SYMM
0.18
4X
0.16
0.015
C A B
4215097/B 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YPB0004
DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5)
4X ( 0.16)
2
1
A
B
SYMM
(0.5)
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
(
0.16)
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
METAL
(
0.16)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4215097/B 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YPB0004
DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
4X ( 0.3)
(R0.05) TYP
2
1
A
B
SYMM
(0.5) TYP
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125mm THICK STENCIL
SCALE:50X
4215097/B 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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相关型号：
LMV1012UP-07/NOPB
IC 1 CHANNEL, AUDIO PREAMPLIFIER, PBGA4, 0.40 MM HEIGHT, LEAD FREE, MO-211CA, MICRO, SMD-4, Audio/Video Amplifier
NSC
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