LMT01QLPGMQ1 [TI]
具有脉冲序列接口的汽车级 0.5°C 高精度双引脚温度传感器 | LPG | 2 | -40 to 125;
| 型号： | LMT01QLPGMQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有脉冲序列接口的汽车级 0.5°C 高精度双引脚温度传感器 | LPG | 2 | -40 to 125 温度传感 脉冲 传感器 温度传感器 |
| 文件： | 总34页 (文件大小：2613K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
具有脉冲计数接口的 LMT01-Q1 0.5°C 精度双引脚数字输出温度传感器
1 特性
3 说明
1
•
符合 AEC-Q100 标准，其中包括以下内容：
LMT01-Q1器件是一款高精度双引脚温度传感器，具备
一个易于使用的脉冲计数电流环路接口，因此适用于汽
车、工业和消费品市场中的 板载和非板载 应用。
LMT01-Q1 具有数字脉冲计数输出，可在宽温度范围
内实现高精度，因此适合与所有 MCU 配对使用，不仅
能够降低软件开销，而且不会影响集成 ADC 的质量或
可用性。TI 的 LMT01-Q1 器件在 –20°C 至 90°C 的温
度范围内支持 ±0.5°C 的最大精度，同时具有极高的分
辨率 (0.0625°C)，无需借助系统校准或软硬件补偿。
–
–
–
温度等级 0 (E)：–40°C 至 +150°C (2)
温度等级 1 (Q) 级：–40°C 至 +125°C
人体模型 (HBM) 静电放电 (ESD) 组件分类等级
2
–
充电器件模型 (CDM) ESD 组件分类等级 C5
•
在 –40°C 至 150°C 宽温度范围内保持高精度
–
–
–
–20°C 至 90°C：±0.5°C（最大值）
90°C 至 120°C：±0.625°C（最大值）
–40°C 至 –20°C：±0.625°C（最大值）
LMT01-Q1 的脉冲计数接口设计用于直接连接 GPIO
或比较器输入，从而简化硬件实施。同样，LMT01-Q1
具备集成的 EMI 抑制功能和简单的双引脚架构，因而
适用于噪声环境中的板载和非板载温度传感。LMT01-
Q1 器件可轻松转换成双线温度探针，电线长度可达两
米。
•
•
通过双引脚封装简化精密数字温度测量
脉冲计数电流环路可由处理器轻松读取。脉冲计
数，分辨率为 0.0625°C
•
•
•
•
通信频率：88kHz
转换电流：34μA
每次转换的连续温度更新100ms
器件信息(1)
由具有集成 EMI 抗扰度的 2V 至 5.5V (VP-VN) 悬
空电源供电运行
器件型号
LMT01QLPG
LMT01ELPG
LMT01QDQX
封装
TO-92 (2)
封装尺寸（标称值）
4.00mm × 3.15mm
4.00mm × 3.15mm
1.70mm × 2.50mm
•
多种双引脚封装产品：TO-92/LPG (3.1mm × 4mm
× 1.5mm) – 尺寸为传统 TO-92 和具有可湿性侧面
的 WSON 的一半
TO-92 (2)
WSON (2)
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
2 应用
(2) 仅适用于 LPG 封装。
•
汽车
–
–
电池管理系统
引擎管理和 ADAS
双引脚集成电路 (IC) 温度传感器
V
: 3.0V to 5.5V
DD
•
•
•
数字输出接线探针
暖通空调 (HVAC)
电源和电池管理
GPIO
Up to 2m
MCU/
FPGA/
ASIC
VP
LMT01
VN
Min 2.0V
LMT01-Q1 精度
GPIO/
COMP
1.0
0.8
Max Limit
LMT01 Pulse Count Interface
0.6
Conversion Time
ADC Conversion Result
0.4
Power Off
0.2
0.0
Power On
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
75
0
25
50
100
125
150
œ50
œ25
LMT01 Junction Temperaure (°C)
C014
在曲线中心绘制的典型单元
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNIS192
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
目录
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 15
8.1 Application Information............................................ 15
8.2 Typical Application .................................................. 16
8.3 System Examples .................................................. 18
Power Supply Recommendations...................... 20
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
8
9
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 21
11 器件和文档支持 ..................................................... 22
11.1 接收文档更新通知 ................................................. 22
11.2 社区资源................................................................ 22
11.3 商标....................................................................... 22
11.4 静电放电警告......................................................... 22
11.5 术语表 ................................................................... 22
12 机械、封装和可订购信息....................................... 22
6.6 Electrical Characteristics - TO-92/LPG Pulse Count
to Temperature LUT................................................... 6
6.7 Electrical Characteristics - WSON/DQX Pulse Count
to Temperature LUT................................................... 6
6.8 Switching Characteristics.......................................... 7
6.9 Timing Diagram......................................................... 7
6.10 Typical Characteristics............................................ 8
Detailed Description ............................................ 11
7
4 修订历史记录
Changes from Revision B (June 2017) to Revision C
Page
•
•
Added device stamp to the TO-92 pinout top view ................................................................................................................ 3
Changed the TO-92S pin numbers in the Pin Functions........................................................................................................ 3
Changes from Revision A (April 2017) to Revision B
Page
•
Removed Electrical Characteristics: WSON/DQX table; Combined the LPG and DQX Electrical Characteristics
tables together........................................................................................................................................................................ 5
Changed IOL maximum value from: 39 µA to: 40 µA.............................................................................................................. 5
Changed leakage value from: 1 µA to 3.5 µA ........................................................................................................................ 5
Moved the thermal response time parameters to the Electrical Characteristics table ........................................................... 5
Added Missing Cross References ........................................................................................................................................ 11
•
•
•
•
Changes from Original (November 2016) to Revision A
Page
•
•
•
•
•
已添加 全新 WSON/DQX 封装（整个数据表中）................................................................................................................... 1
Changed updated package information. ................................................................................................................................ 3
Added Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT ............................................................... 6
Added -40 for Sample Calculations Table ........................................................................................................................... 12
Added missing cross reference ........................................................................................................................................... 13
2
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
5 Pin Configuration and Functions
DQX Package
2-Pin WSON
Bottom View
VP
VN
LPG Package
2-Pin TO-92
Top View
VN
VP
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
VP
TO-92S
WSON
2
1
1
2
Input Positive voltage pin; may be connected to system power supply or bias resistor.
Output Negative voltage pin; may be connected to system ground or a bias resistor.
VN
Copyright © 2016–2018, Texas Instruments Incorporated
3
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
(1)(2)
See
.
MIN
−0.3
−65
MAX
6
UNIT
V
Voltage drop (VP – VN)
Storage temperature, Tstg
175
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
6.2 ESD Ratings
VALUE
±2000
±750
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
MIN
-40
MAX
UNIT
°C
Free-air temperature(LPG)
Free-air temperature (DQX)
Voltage drop (VP – VN)
150
125
5.5
–40
2(1)
°C
V
(1) During transmission of pulses at a high level.
6.4 Thermal Information
LMT01-Q1
THERMAL METRIC(1)
DQX (WSON)
LPG (TO-92)
UNIT
2 PINS
213
71
2 PINS
177
94
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
81
152
33
Junction-to-top characterization parameter
Junction-to-board characterization parameter
2.4
ψJB
79
152
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
6.5 Electrical Characteristics
Over operating free-air temperature range and operating VP-VN range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
ACCURACY
150°C(3)
125°C
120°C
110°C
–0.75
-0.75
0.75
0.75
°C
°C
°C
°C
°C
°C
°C
°C
°C
°C
–0.625
–0.5625
–0.5625
–0.5
0.625
0.5625
0.5625
0.5
100°C
90°C
VP – VN of
2.15 V to 5.5 V
(1)(2)
Temperature accuracy
25°C
–0.5
±0.125
0.5
–20°C
–30°C
–40°C
–0.5
0.5
–0.5625
–0.625
0.5625
0.625
PULSE COUNT TRANSFER FUNCTION
Number of pulses at 0°C
800
15
808
816
3228
Output pulse range
Theoretical max (exceeds
device rating)
1
4095
Resolution of one pulse
0.0625
°C
OUTPUT CURRENT
IOL
Low level
High level
28
112.5
3.1
34
125
3.7
40
143
4.5
µA
µA
Output current variation
IOH
High-to-Low level output current ratio
POWER SUPPLY
Accuracy sensitivity to change in VP – VN
Leakage Current VP – VN
2.15 V ≤ VP – VN ≤ 5. 0 V(4)
VDD ≤ 0.4 V
40
133 m°C/V
0.002
3.5
µA
THERMAL RESPONSE
DQX (WSON)
LPG (TO-92)
DQX (WSON)
LPG (TO-92)
0.4
0.8
9.4
28
Stirred oil thermal response time to 63% of final value
(package only)
s
s
Still air thermal response time to 63% of final value
(package only)
(1) Calculated using Pulse Count to Temperature LUT and 0.0625°C resolution per pulse, see section Electrical Characteristics - TO-
92/LPG Pulse Count to Temperature LUT and Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT.
(2) Error can be linearly interpolated between temperatures given in table as shown in the Accuracy vs Temperature curves in section
Typical Characteristics.
(3) Applicable only for the LPG package.
(4) Limit is using end point calculation.
Copyright © 2016–2018, Texas Instruments Incorporated
5
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
6.6 Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT
Over operating free-air temperature range and 2.15 V ≤ VP – VN ≤ 5. 0 V power supply operating range (unless otherwise
noted). LUT is short for Look-up Table.
PARAMETER
TEST CONDITIONS
–40°C
MIN
172
TYP
181
MAX
190
UNIT
–30°C
–20°C
–10°C
0°C
329
338
347
486
494
502
643
651
659
800
808
816
10°C
958
966
974
20°C
1117
1276
1435
1594
1754
1915
2076
2237
2398
2560
2721
2883
3047
3208
1125
1284
1443
1603
1762
1923
2084
2245
2407
2569
2731
2894
3058
3220
1133
1292
1451
1611
1771
1931
2092
2254
2416
2578
2741
2905
3069
3231
30°C
40°C
50°C
Digital output code
pulses
60°C
70°C
80°C
90°C
100°C
110°C
120°C
130°C
140°C
150°C
6.7 Electrical Characteristics - WSON/DQX Pulse Count to Temperature LUT
Over operating free-air temperature range and 2.15 V ≤ VP – VN ≤ 5. 0 V power supply operating range (unless otherwise
noted). LUT is short for Look-up Table.
PARAMETER
TEST CONDITIONS
–40°C
MIN
172
TYP
181
MAX
190
UNIT
–30°C
–20°C
–10°C
0°C
328
338
346
486
494
502
643
651
659
800
808
816
10°C
20°C
30°C
40°C
50°C
60°C
70°C
80°C
90°C
100°C
110°C
120°C
125°C
958
966
974
1117
1276
1435
1594
1754
1915
2076
2237
2398
2560
2721
2802
1125
1284
1443
1602
1762
1923
2084
2245
2407
2569
2731
2814
1133
1292
1451
1611
1771
1931
2092
2254
2416
2578
2741
2826
Digital output code
pulses
6
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
6.8 Switching Characteristics
Over operating free-air temperature range and operating VP – VN range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
CL = 10 pF, RL = 8 k
MIN
TYP
1.45
88
MAX
UNIT
µs
tR, tF
fP
Output current rise and fall time
Output current pulse frequency
Output current duty cycle
Temperature conversion time(1)
Data transmission time
82
40%
46
94
60%
54
kHz
50%
50
tCONV
tDATA
2.15 V to 5.5 V
ms
ms
44
47
50
(1) Conversion time includes power up time or device turn on time that is typically 3 ms after POR threshold of 1.2 V is exceeded.
6.9 Timing Diagram
tCONV
tDATA
Power
125µA
34µA
tR
Power Off
Output
Current
tF
1/fP
Figure 1. Timing Specification Waveform
Copyright © 2016–2018, Texas Instruments Incorporated
7
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
6.10 Typical Characteristics
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
Min Limit
75
-0.8
-1.0
0
25
50
75
100
125
150
0
25
50
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C017
C016
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT
Temperature LUT
VP – VN = 2.15 V
VP – VN = 2.4 V
Figure 2. Accuracy vs LMT01-Q1 Junction Temperature
Figure 3. Accuracy vs LMT01-Q1 Junction Temperature
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
Min Limit
Min Limit
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C015
C014
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT
Temperature LUT
VP – VN = 2.7 V
VP – VN = 3 V
Figure 4. Accuracy vs LMT01-Q1 Junction Temperature
Figure 5. Accuracy vs LMT01-Q1 Junction Temperature
1.0
1.0
0.8
0.8
Max Limit
Max Limit
0.6
0.4
0.6
0.4
0.2
0.2
0.0
0.0
-0.2
-0.4
-0.6
-0.2
-0.4
-0.6
Min Limit
Min Limit
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C013
C012
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT
Temperature LUT
VP – VN = 4 V
VP – VN = 5 V
Figure 6. Accuracy vs LMT01-Q1 Junction Temperature
Figure 7. Accuracy vs LMT01-Q1 Junction Temperature
8
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
Typical Characteristics (continued)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
1.00
0.80
Max Limit
0.60
0.40
0.20
0.00
-0.20
-0.40
-0.60
Min Limit
-0.80
-1.00
0
25
50
75
100
125
150
œ50
œ25
0
25
50
75
100
125
150
œ50
œ25
LMT01 Junction Temperaure (°C)
C018
LMT01 Junction Temperature (°C)
C011
Using Electrical Characteristics - TO-92/LPG Pulse Count to
Temperature LUT
VP – VN = 5.5 V
Using Temp = (PC/4096 × 256°C ) – 50°C
VP – VN = 2.15 V
Figure 9. Accuracy Using Linear Transfer Function
Figure 8. Accuracy vs LMT01-Q1 Junction Temperature
3.0
150
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
125
100
75
50
25
0
High Level Current
Low Level Current
0
25
50
75
100
125
150
2
3
4
5
6
œ50
œ25
LMT01 Junction Temperaure (°C)
VP - VN (V)
C019
C004
Using Temp = (PC/4096 × 256°C ) – 50°C
VP – VN = 5.5V
TA = 30°C
Figure 10. Accuracy Using Linear Transfer Function
Figure 11. Output Current vs VP-VN Voltage
150
110
100
90
80
70
60
50
40
30
20
10
0
125
100
75
50
25
0
High Level Current
Low Level Current
0
25
50
75
100
125
150
0
120 240 360 480 600 720 840 960 1080 1200
œ50
œ25
LMT01 Juntion Temperature (°C)
Time (seconds)
C003
C033
VP – VN = 3.3 V
TINITIAL = 23°C,
VP – VN = 3.3 V
TFINAL = 70°C
Figure 12. Output Current vs Temperature
Figure 13. Thermal Response in Still Air (TO92S/LPG
Package)
Copyright © 2016–2018, Texas Instruments Incorporated
9
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
Typical Characteristics (continued)
110
100
90
80
70
60
50
40
30
20
10
0
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80 100 120 140 160 180 200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Time (seconds)
Time (seconds)
C032
C031
VP – VN = 3.3 V
TINITIAL = 23°C,
Air Flow = 2.34
meters/sec
VP – VN = 3.3 V
TINITIAL = 23°C,
TFINAL = 70°C
TFINAL = 70°C
Figure 14. Thermal Response in Moving Air (TO92S/LPG
Package)
Figure 15. Thermal Response in Stirred Oil (TO92S/LPG
Package)
10
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
7 Detailed Description
7.1 Overview
The LMT01-Q1 temperature output is transmitted over a single wire using a train of current pulses that typically
change from 34 µA to 125 µA. A simple resistor can then be used to convert the current pulses to a voltage. With
a 10-kΩ resistor, the output voltage levels range from 340 mV to 1.25 V, typically. A simple microcontroller
comparator or external transistor can be used convert this signal to valid logic levels the microcontroller can
process properly through a GPIO pin. The temperature can be determined by gating a simple counter on for a
specific time interval to count the total number of output pulses. After power is first applied to the device the
current level will remain below 34 µA for at most 54 ms while the LMT01-Q1 is determining the temperature.
When the temperature is determined, the pulse train begins. The individual pulse frequency is typically 88 kHz.
The LMT01-Q1 will continuously convert and transmit data when the power is applied approximately every 104
ms (maximum).
The LMT01-Q1 uses thermal diode analog circuitry to detect the temperature. The temperature signal is then
amplified and applied to the input of a ΣΔ ADC that is driven by an internal reference voltage. The ΣΔ ADC
output is then processed through the interface circuitry into a digital pulse train. The digital pulse train is then
converted to a current pulse train by the output signal conditioning circuitry that includes high and low current
regulators. The voltage applied across the pins of the LMT01-Q1 is regulated by an internal voltage regulator to
provide a consistent Chip VDD that is used by the ADC and its associated circuitry.
7.2 Functional Block Diagram
VP
Chip VDD
Chip VSS
Voltage
Regulator
and
Output
Signal
Thermal Diode
Analog Circuitry
Data
Interface
ADC
Conditioning
VREF
LMT01
7.3 Feature Description
7.3.1 Output Interface
The LMT01-Q1 provides a digital output in the form of a pulse count that is transmitted by a train of current
pulses. After the LMT01-Q1 is powered up, it transmits a very low current of 34 µA for less than 54 ms while the
part executes a temperature to digital conversion, as shown in Figure 16. When the temperature-to-digital
conversion is complete, the LMT01-Q1 starts to transmit a pulse train that toggles from the low current of 34 µA
to a high current level of 125 µA. The pulse train total time interval is at maximum 50 ms. The LMT01-Q1
transmits a series of pulses equivalent to the pulse count at a given temperature as described in Electrical
Characteristics - TO-92/LPG Pulse Count to Temperature LUT. After the pulse count has been transmitted the
LMT01-Q1 current level will remain low for the remainder of the 50 ms. The total time for the temperature to
digital conversion and the pulse train time interval is 104 ms (maximum). If power is continuously applied, the
pulse train output will repeat start every 104 ms (maximum).
Copyright © 2016–2018, Texas Instruments Incorporated
11
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
Feature Description (continued)
Start of data
transmission
Start of next
conversion result data
End of data
Power
ON
End of data
54ms
max
104ms max
Power
50ms max
50ms max
Power
Off
Pulse
Train
Figure 16. Temperature to Digital Pulse Train Timing Cycle
The LMT01-Q1 can be powered down at any time to conserve system power. Take care to ensure that a
minimum power-down wait time of 50 ms is used before the device is turned on again.
7.3.2 Output Transfer Function
TheLMT01-Q1 outputs at minimum 1 pulse and a theoretical maximum 4095 pulses. Each pulse has a weight of
0.0625°C. One pulse corresponds to a temperature less than –50°C while a pulse count of 4096 corresponds to
a temperature greater than 200°C. Note that the LMT01-Q1 is only ensured to operate up to 150°C. Exceeding
this temperature by more than 5°C may damage the device. The accuracy of the device degrades as well when
150°C is exceeded.
Two different methods of converting the pulse count to a temperature value are discussed in this section. The
first method is the least accurate and uses a first order equation, and the second method is the most accurate
and uses linear interpolation of the values found in the look-up table (LUT) as described in Electrical
Characteristics - TO-92/LPG Pulse Count to Temperature LUT.
The output transfer function appears to be linear and can be approximated by Equation 1:
PC
≈
’
Temp =
ì 256èC - 50èC
∆
«
÷
4096
◊
where
•
•
PC is the Pulse Count
Temp is the temperature reading
(1)
Table 1 shows some sample calculations using Equation 1.
Table 1. Sample Calculations Using Equation 1
TEMPERATURE (°C)
NUMBER OF PULSES
–40
–20
0
160
480
800
30
1280
1600
2400
3200
50
100
150
12
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
The curve shown in Figure 17 shows the output transfer function using equation Equation 1 (blue line) and the
look-up table (LUT) found in Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT (red line).
The LMT01-Q1 output transfer function as described by the LUT appears to be linear, but upon close inspection,
it can be seen as truly not linear. To actually see the difference, the accuracy obtained by the two methods must
be compared.
4096
3584
3072
2560
2048
1536
1024
512
0
0
25 50 75 100 125 150 175 200 225
œ50 œ25
LMT01 Junction Temperature (°C)
C002
Figure 17. LMT01-Q1 Output Transfer Function
For more exact temperature readings the output pulse count can be converted to temperature using linear
interpolation of the values found in Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT.
The curves in Figure 18 and Figure 19, show the accuracy of typical units when using the Equation 1 and linear
interpolation using Electrical Characteristics - TO-92/LPG Pulse Count to Temperature LUT, respectively. When
compared, the improved performance when using the LUT linear interpolation method can clearly be seen. For a
limited temperature range of 25°C to 80°C, the error shown in Figure 18 is flat, so the linear equation will provide
good results. For a wide temperature range, TI recommends that linear interpolation and the LUT be used.
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
1.0
0.8
Max Limit
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Min Limit
75
0
25
50
75
100
125
150
0
25
50
100
125
150
œ50
œ25
œ50
œ25
LMT01 Junction Temperaure (°C)
LMT01 Junction Temperaure (°C)
C018
C017
Figure 18. LMT01-Q1 Typical Accuracy When Using First
Order Equation Equation 1 – 92 Typical Units Plotted at
(VP – VN) = 2.15 V
Figure 19. LMT01-Q1 Accuracy Using Linear Interpolation
of LUT Found in Electrical Characteristics - WSON/DQX
Pulse Count to Temperature LUT – 92 Typical Units
Plotted at (VP – VN) = 2.15 V
7.3.3 Current Output Conversion to Voltage
The minimum voltage drop across the LMT01-Q1 must be maintained at 2.15 V during the conversion cycle.
After the conversion cycle, the minimum voltage drop can decrease to 2.0 V. Thus the LMT01-Q1 can be used
for low voltage applications. See Application Information for more information on low voltage operation and other
information on picking the actual resistor value for different applications conditions. The resistor value is
dependent on the power supply level and the variation and the threshold level requirements of the circuitry the
resistor is driving (that is, MCU, GPIO, or Comparator).
Copyright © 2016–2018, Texas Instruments Incorporated
13
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
Stray capacitance can be introduced when connecting the LMT01-Q1 through a long wire. This stray capacitance
influences the signal rise and fall times. The wire inductance has negligible effect on the AC signal integrity. A
simple RC time constant model as shown in Figure 20 can be used to determine the rise and fall times.
POWER
tHL
LMT01
VF
VHL
OUTPUT
VS
C
100pF
34 and
125 µA
R
10k
Figure 20. Simple RC Model for Rise and Fall Times
≈
∆
«
’
÷
VF - VS
VF - VHL ◊
tHL = RìCìIn
where
•
•
•
•
RC as shown in Figure 20
VHL is the target high level
the final voltage VF = 125 µA × R
the start voltage VS = 34 µA × R
(2)
(3)
For the 10% to 90% level rise time (tr), Equation 2 simplifies to:
tr= R×C×2.197
Take care to ensure that the LMT01-Q1 voltage drop does not exceed 300 mV under reverse bias conditions, as
given in the Absolute Maximum Ratings.
7.4 Device Functional Modes
The only functional mode the LMT01-Q1 has is that it provides a pulse count output that is directly proportional to
temperature.
14
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Mounting, Temperature Conductivity, and Self-Heating
The LMT01-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface to ensure good temperature conductivity. The temperatures of the lands and
traces to the leads of the LMT01-Q1 also affect the temperature reading, so they must be a thin as possible.
Alternatively, the LMT01-Q1 can be mounted inside a sealed-end metal tube, and then can be dipped into a bath
or screwed into a threaded hole in a tank. As with any IC, the LMT01-Q1 and accompanying wiring and circuits
must be kept insulated and dry to avoid excessive leakage and corrosion. Printed-circuit coatings are often used
to ensure that moisture cannot corrode the leads or circuit traces.
The junction temperature of the LMT01-Q1 is the actual temperature being measured by the device. The thermal
resistance junction-to-ambient (RθJA) is the parameter (from Thermal Information) used to calculate the rise of a
device junction temperature (self-heating) due to its average power dissipation. The average power dissipation of
the LMT01-Q1 is dependent on the temperature it is transmitting as it effects the output pulse count and the
voltage across the device. Equation 4 is used to calculate the self-heating in the die temperature of the LMT01-
Q1 (TSH).
»
ÿ
≈
’
tCONV
»
ÿ
’
tDATA
≈
’
÷
◊
PC
≈
’
÷
◊
≈
∆
«
I
OL +IOH
4096 -PC
(
)
(
)
TSH
=
I
OLì
ì VCONV
+
ì
+
ìIOL
ì
Ÿ
÷
ì V
ìR
…
DATAŸ
∆
∆
«
÷
÷
◊
∆
…
∆
qJA
t
(
CONV + tDATA
t
(
CONV + tDATA
)
4096
)
2
4096
…
«
Ÿ
⁄
«
◊
⁄
where
•
•
•
•
•
•
•
•
TSH is the ambient temperature
IOL and IOH are the output low and high current level, respectively
VCONV is the voltage across the LMT01-Q1 during conversion
VDATA is the voltage across the LMT01-Q1 during data transmission
tCONV is the conversion time
tDATA is the data transmission time
PC is the output pulse count
RθJA is the junction to ambient package thermal resistance
(4)
Plotted in the curve Figure 21 are the typical average supply current (black line using left y axis) and the resulting
self-heating (red and violet lines using right y axis) during continuous conversions. A temperature range of –50°C
to +150°C, a VCONV of 5 V (red line) and 2.15 V (violet line) were used for the self-heating calculation. As can be
seen in the curve, the average power supply current and thus the average self-heating changes linearly over
temperature because the number of pulses increases with temperature. A negligible self-heating of about 45m°C
is observed at 150°C with continuous conversions. If temperature readings are not required as frequently as
every 100 ms, self-heating can be minimized by shutting down power to the part periodically thus lowering the
average power dissipation.
Copyright © 2016–2018, Texas Instruments Incorporated
15
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
Application Information (continued)
60
50
40
30
20
10
0
0.06
0.05
0.04
0.03
0.02
0.01
0.00
Average Current
Self Heating at VP-VN=5V
Self Heating at VP-VN=2.15V
-100
-50
0
50
100
150
200
Temperature (°C)
C001
Figure 21. Average Current Draw and Self-Heating Over Temperature
8.2 Typical Application
8.2.1 3.3-V System VDD MSP430 Interface - Using Comparator Input
V
DD
3.3V
MSP430
GPIO
Divider
VREF
2.73V
or
VP
LMT01
VN
2.24V
TIMER2
COMP_B
CLOCK
+
R
VR
IR = 34
and 125 µA
6.81k
1%
Figure 22. MSP430 Comparator Input Implementation
8.2.1.1 Design Requirements
The design requirements listed in are used in the detailed design procedure.
Table 2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VDD
3.3 V
3.0 V
VDD minimum
LMT01-Q1 VP – VN minimum during conversion
2.15 V
LMT01-Q1 VP – VN minimum during data
transmission
2.0 V
50 mV minimum
< 1 uA
Noise margin
Comparator input current over temperature range
of interest
Resistor tolerance
1%
16
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
8.2.1.2 Detailed Design Procedure
First, select the R and determine the maximum logic low voltage and the minimum logic high voltage while
ensuring that when the LMT01-Q1 is converting, the minimum (VP – VN) requirement of 2.15 V is met.
1. Select R using minimum VP-VN during data transmission (2 V) and maximum output current of the LMT01-
Q1 (143.75 µA)
–
–
R = (3.0 V – 2 V) / 143.75 µA = 6.993 k the closest 1% resistor is 6.980 k
6.993 k is the maximum resistance so if using 1% tolerance resistor the actual resistor value needs to be
1% less than 6.993 k and 6.98 k is 0.2% less than 6.993 k thus 6.81 k must be used.
2. Check to see if the 2.15-V minimum voltage during conversion requirement for the LMT01-Q1 is met with the
maximum IOL of 39 µA and maximum R of 6.81 k + 1%:
–
VLMT01 = 3 V – (6.81 k × 1.01) × 39 µA = 2.73 V
3. Find the maximum low level voltage range using the maximum R of 6.81 k and maximum IOL of 39 µA:
VRLmax = (6.81 k × 1.01) × 39 µA = 268 mV
4. Find the minimum high level voltage using the minimum R of 6.81 k and minimum IOH of 112.5 µA:
VRHmin = (6.81 k × 0.99) × 112.5 µA = 758 mV
–
–
Now select the MSP430 comparator threshold voltage that enables the LMT01-Q1 to communicate to the
MSP430 properly.
1. The MSP430 voltage is selected by selecting the internal VREF and then choosing the appropriate 1 of n/32
settings for n of 1 to 31.
–
–
VMID= (VRLmax – VRHmin) / 2 + VRHmin = (758 mV – 268 mV) / 2 + 268 mV = 513 mV
n = (VMID / VREF ) × 32 = (0.513 / 2.5) × 32 = 7
2. To prevent oscillation of the comparator, output hysteresis must be implemented. The MSP430 allows this by
enabling different n for the rising edge and falling edge of the comparator output. For a falling comparator
output transition, N must be set to 6.
3. Determine the noise margin caused by variation in comparator threshold level. Even though the comparator
threshold level theoretically is set to VMID, the actual level varies from device to device due to VREF tolerance,
resistor divider tolerance, and comparator offset. For proper operation, the COMP_B worst case input
threshold levels must be within the minimum high and maximum low voltage levels presented across R,
VRHmin and VRLmax, respectively
N+ N_TOL
(
)
VCHmax = VREFì 1+ V_REF_TOL ì
+ COMP_OFFSET
(
)
32
where
•
•
•
•
•
VREF is the MSP430 COMP_B reference voltage for this example at 2.5 V
V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
N is the divisor for the MSP430 or 7
N_TOL is the tolerance of the divisor or 0.5
COMP_OFFSET is the comparator offset specification or 10 mV
N-N_TOL
(5)
(
)
- COMP_OFFSET
VCLmin = VREFì 1- V_REF_TOL ì
(
)
32
where
•
•
•
•
•
VREF is the MSP430 COMP_B reference voltage for this example at 2.5 V,
V_REF_TOL is the tolerance of the VREF of 1% or 0.01,
N is the divisor for the MSP430 for the hysteresis setting or 6,
N_TOL is the tolerance of the divisor or 0.5,
COMP_OFFSET is the comparator offset specification or 10 mV
(6)
(7)
The noise margin is the minimum of the two differences:
(VRHmin – VCHmax) or (VCHmin – VRLmax
)
which works out to be 145 mV.
Copyright © 2016–2018, Texas Instruments Incorporated
17
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
VDD
Pulse
Count
Signal
VRHmax
VRHmin
VCHmax
VMID
Noise Margin
Noise Margin
VCHmin
VRLmax
VRLmin
GND
Time (µs)
Figure 23. Pulse Count Signal Amplitude Variation
8.2.1.2.1 Setting the MSP430 Threshold and Hysteresis
The comparator hysteresis determines the noise level that the signal can support without causing the comparator
to trip falsely and resulting in an inaccurate pulse count. The comparator hysteresis is set by the precision of the
MSP430 and what thresholds it is capable of. For this case, as the input signal transitions high, the comparator
threshold is dropped by 77 mV. If the noise on the signal is kept below this level as it transitions, the comparator
will not trip falsely. In addition, the MSP430 has a digital filter on the COMP_B output that be used to further filter
output transitions that occur too quickly.
8.2.1.3 Application Curves
Amplitude = 200 mV/div
Time Base = 10 µs/div
Δy at cursors = 500 mV
Δx at cursors = 11.7 µs
Amplitude = 200 mV/div
Time Base = 10 µs/div
Δy at cursors = 484 mV
Δx at cursors = 11.7 µs
Figure 24. MSP430 COMP_B Input Signal No Capacitance
Load
Figure 25. MSP430 COMP_B Input Signal 100-pF
Capacitance Load
8.3 System Examples
The LMT01 device can be configured in a number of ways. Transistor level shifting can be used so that the
output pulse of the device can be read with a GPIO (see Figure 26). An isolation block can be inserted to
achieve electrical isolation (see Figure 27). Multiple LMT01 devices can be controlled with GPIOs enabling
temperature monitor for multiple zones. Lastly, the LMT01 device can be configured to have a common ground
with a high side signal (see Figure 29).
18
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
System Examples (continued)
3.3V
VDD
MCU/
FPGA/
ASIC
VP
LMT01
VN
100k
GPIO
MMBT3904
7.5k
34 and
125 µA
Figure 26. Transistor Level Shifting
3V to 5.5V
3V to 5.5V
ISO734x
VCC1
VCC2
VDD
VP
MCU/FPGA/
ASIC
Min
2.0V
LMT01
100k
VN
GPIO
MMBT3904
7.5k
34 and
125 µA
GND2
GND1
Figure 27. Isolation
V
DD
3V to 5.5V
GPIO1
GPIO2
GPIO n
Up to 2.0m
MCU/FPGA/
ASIC
VP
LMT01
U1
VP
LMT01
U2
VP
LMT01
Un
Min
2.0V
VN
VN
VN
GPIO/
COMP
34 and
125 µA
6.81k
(for 3V)
Note: to turn off an LMT01-Q1 set the GPIO pin connected to VP to high impedance state as setting it low would
cause the off LMT01-Q1 to be reverse biased. Comparator input of MCU must be used.
Figure 28. Connecting Multiple Devices to One MCU Input Pin
Copyright © 2016–2018, Texas Instruments Incorporated
19
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
System Examples (continued)
3.3V
VDD
34 and
125 µA
7.5k
MCU/
FPGA/
ASIC
MMBT3906
VP
LMT01
GPIO
VN
100k
Note: the VN of the LMT01-Q1 must be connected to the MCU GND.
Figure 29. Common Ground With High-Side Signal
9 Power Supply Recommendations
Because the LMT01-Q1 is only a 2-pin device the power pins are common with the signal pins, thus the LMT01-
Q1 has a floating supply that can vary greatly. The LMT01-Q1 has an internal regulator that provides a stable
voltage to internal circuitry.
Take care to prevent reverse biasing of the LMT01-Q1 as exceeding the absolute maximum ratings may cause
damage to the device.
Power supply ramp rate can effect the accuracy of the first result transmitted by the LMT01-Q1. As shown in
Figure 30 with a 1-ms rise time, the LMT01-Q1 output code is at 1286, which converts to 30.125°C. The scope
photo shown in Figure 31 reflects what happens when the rise time is too slow. In Figure 31, the power supply
(yellow trace) is still ramping up to final value while the LMT01-Q1 (red trace) has already started a conversion.
This causes the output pulse count to decrease from the previously shown 1286, to 1282 (or 29.875°C). Thus,
for slow ramp rates, TI recommends that the first conversion be discarded. For even slower ramp rates, more
than one conversion may have to be discarded as TI recommends that either the power supply be within final
value before a conversion is used or that ramp rates be faster than 2.5 ms.
Yellow trace = 1 V/div, Red trace = 100 mV/div, Time Base = 20
ms/div
Yellow trace = 1V/div, Red trace = 100 mV/div, Time base = 20
ms/div
TA= 30°C
LMT01 Pulse Count = 1286
Rise Time = 1 ms
TA=30°C
LMT01 Pulse Count = 1282
Rise Time = 100 ms
VP-VN = 3.3 V
VP-VN=3.3 V
Figure 30. Output Pulse Count With Appropriate Power
Supply Rise Time
Figure 31. Output Pulse Count With Slow Power Supply
Rise Time
20
Copyright © 2016–2018, Texas Instruments Incorporated
LMT01-Q1
www.ti.com.cn
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
10 Layout
10.1 Layout Guidelines
The LMT01-Q1 can be mounted to a PCB as shown in Figure 32 and Figure 33. Take care to make the traces
leading to the pads as small as possible to minimize their effect on the temperature the LMT01-Q1 is measuring.
10.2 Layout Example
VP
Figure 32. Layout Example (TO92S/LPG Package)
VN
Figure 33. Layout Example for the DQX (WSON) Package
版权 © 2016–2018, Texas Instruments Incorporated
21
LMT01-Q1
ZHCSFO4C –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请参阅左侧的导航栏。
22
版权 © 2016–2018, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMT01ELPGMQ1
LMT01ELPGQ1
LMT01QDQXRQ1
LMT01QDQXTQ1
LMT01QLPGMQ1
LMT01QLPGQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
WSON
WSON
TO-92
TO-92
LPG
LPG
DQX
DQX
LPG
LPG
2
2
2
2
2
2
3000 RoHS & Green
1000 RoHS & Green
3000 RoHS & Green
SN
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
-40 to 150
-40 to 150
-40 to 125
-40 to 125
-40 to 125
-40 to 125
T01G0
SN
SN
T01G0
13M
250
RoHS & Green
Call TI
SN
13M
3000 RoHS & Green
1000 RoHS & Green
T01G1
T01G1
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMT01QDQXRQ1
LMT01QDQXTQ1
WSON
WSON
DQX
DQX
2
2
3000
250
180.0
180.0
8.4
8.4
2.0
2.0
2.8
2.8
1.0
1.0
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMT01QDQXRQ1
LMT01QDQXTQ1
WSON
WSON
DQX
DQX
2
2
3000
250
200.0
200.0
183.0
183.0
25.0
25.0
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0002A
TO-92 - 5.05 mm max height
S
C
A
L
E
1
.
3
0
0
TRANSISTOR OUTLINE
4.1
3.9
3.25
3.05
0.51
0.40
3X
5.05
MAX
2
1
2.3
2.0
2 MAX
6X 0.076 MAX
15.5
15.1
2X
0.48
0.33
0.51
0.33
3X
3X
2X 1.27 0.05
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
(0.55)
1
2
0.86
0.66
4221971/B 06/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0002A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0.05 MAX
ALL AROUND
TYP
(1.07)
METAL
TYP
3X (R0.38) VIA
(1.7)
(1.7)
1
2
(1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221971/B 06/2022
www.ti.com
TAPE SPECIFICATIONS
LPG0002A
TO-92 - 5.05 mm max height
TRANSISTOR OUTLINE
0
1
13.0
12.4
0
1
1 MAX
21
18
2.5 MIN
6.5
5.5
9.5
8.5
0.25
0.15
19.0
17.5
3.8-4.2 TYP
0.45
0.35
6.55
6.15
12.9
12.5
4221971/B 06/2022
www.ti.com
GENERIC PACKAGE VIEW
DQX 2
1.7 x 2.5, 0 mm pitch
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225319/A
www.ti.com
PACKAGE OUTLINE
DQX0002A
WSON - 0.8 mm max height
S
C
A
L
E
5
.
2
0
0
PLASTIC SMALL OUTLINE - NO LEAD
1.75
1.65
B
A
PIN 1 INDEX AREA
2.55
2.45
C
0.8 MAX
SEATING PLANE
(0.2) TYP
0.05
0.00
(0.45)
0.3
0.2
4X
2X 0.1 MIN
2
2X (0.05)
(0.15)
SYMM
PIN 1 ID
(45 X0.2)
1.1
0.9
1
SYMM
(0.2) TYP
0.8
0.6
0.1
C A B
4222491/E 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DQX0002A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.7)
SYMM
1
(1.2)
SYMM
(1.7)
2
(0.25)
(0.35)
4X (0.25)
(R0.05) TYP
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL EDGE
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222491/E 03/2019
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DQX0002A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.225) TYP
1
(1.225)
TYP
2X (0.6)
2X (0.7)
(0.55)
SYMM
(0.15)
4X (0.45)
4X (0.25)
2
(R0.05) TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222491/E 03/2019
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
©2020 ICPDF网 联系我们和版权申明