LMK03318RHST [TI]
具有单个 PLL 的超低抖动时钟发生器系列 | RHS | 48 | -40 to 85;
| 型号： | LMK03318RHST |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有单个 PLL 的超低抖动时钟发生器系列 | RHS | 48 | -40 to 85 时钟 时钟发生器 |
| 文件： | 总141页 (文件大小：1971K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
具有一个 PLL、八路输出、集成 EEPROM 的 LMK03318 超低噪声抖动时
钟发生器系列
1 特性
添加了项目符号
1
•
极低噪声、高性能
2 应用
–
抖动：FOUT > 100MHz 时的典型值为 100fs
（均方根 (RMS))
•
•
•
•
•
•
•
交换机和路由器
网络与电信线卡
–
峰值信噪比 (PSNR)：-80dBc，出色的电源噪声
抗扰度
服务器和存储系统
无线基站
•
灵活的器件选项
PCIe 第 1 代、第 2 代、第 3 代、第 4 代
测试和测量
–
多达 8 路 AC-LVPECL、AC-LVDS、AC-
CML、HCSL 或 LVCMOS 输出或任意组合
引脚模式、I2C 模式、EEPROM 模式
–
–
广播基础设施
71 引脚可选择预编程默认启动选项
3 说明
•
•
支持自动或手动选择的双路输入
LMK03318 是一款超低噪声 PLLATINUM™时钟发生
器，具有一个带集成式 VCO、灵活时钟分配和扇出的
分数 N 频率合成器，在片上 EEPROM 中存储有引脚
可选配置状态。该器件可为各种千兆位级串行接口和数
字器件提供多个时钟，从而通过替代多个振荡器和时钟
分配器件来降低物料清单 (BOM) 成本、减小电路板面
积、以及提高可靠性。超低抖动可降低高速串行链路中
的比特误码率 (BER)。
–
–
晶振输入：10MHz 至 52MHz
外部输入：1MHz 至 300MHz
频率裕度选项
–
–
采用低成本可牵引晶振基准精调频率裕度
无毛刺脉冲的粗调频率裕度 (%)，采用输出分频
器
•
其他 特性
–
电源：3.3V 内核、1.8V、2.5V 或 3.3V 输出电
源
器件信息(1)
–
工业温度范围（–40ºC 至 +85ºC）
器件型号
LMK03318
封装
WQFN (48)
封装尺寸（标称值）
空白
7.00mm × 7.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
LMK03318 简化框图
Power
Conditioning
PLL
2
8
8
Output
Dividers
Output
Buffers
Interface
I2C/ROM/
EEPROM
LMK03318
Ultra-high performance clock generator
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNAS669
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
目录
8.25 Typical 161.1328125-MHz Closed-Loop Output
1
2
3
4
5
6
7
8
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 3
说明 （续）.............................................................. 4
器件比较表............................................................... 4
Pin Configuration and Functions......................... 5
Specifications......................................................... 7
8.1 Absolute Maximum Ratings ...................................... 7
8.2 ESD Ratings.............................................................. 7
8.3 Recommended Operating Conditions....................... 8
8.4 Thermal Information.................................................. 8
8.5 Thermal Information.................................................. 8
8.6 Electrical Characteristics - Power Supply ................. 9
Phase Noise Characteristics.................................... 17
8.26 Closed-Loop Output Jitter Characteristics ........... 17
8.27 PCIe Clock Output Jitter ....................................... 17
8.28 Typical Power Supply Noise Rejection
Characteristics ......................................................... 18
8.29 Typical Power-Supply Noise Rejection
Characteristics ......................................................... 18
8.30 Typical Closed-Loop Output Spur Characteristics 18
8.31 Typical Characteristics.......................................... 19
Parameter Measurement Information ................ 23
9.1 Test Configurations................................................. 23
9
10 Detailed Description ........................................... 27
10.1 Overview ............................................................... 27
10.2 Functional Block Diagram ..................................... 27
10.3 Feature Description............................................... 28
10.4 Device Functional Modes...................................... 32
10.5 Programming......................................................... 50
10.6 Register Maps....................................................... 71
11 Application and Implementation...................... 117
11.1 Application Information........................................ 117
11.2 Typical Applications ............................................ 117
12 Power Supply Recommendations ................... 127
12.1 Device Power Up Sequence............................... 127
12.2 Device Power Up Timing .................................... 128
12.3 Power Down........................................................ 129
8.7 Pullable Crystal Characteristics (SECREF_P,
SECREF_N)............................................................. 10
8.8 Non-Pullable Crystal Characteristics (SECREF_P,
SECREF_N)............................................................. 11
8.9 Clock Input Characteristics (PRIREF_P/PRIREF_N,
SECREF_P/SECREF_N)......................................... 11
8.10 VCO Characteristics.............................................. 11
8.11 PLL Characteristics............................................... 12
8.12 1.8-V LVCMOS Output Characteristics
(OUT[7:0]) ................................................................ 12
8.13 LVCMOS Output Characteristics (STATUS[1:0]).. 12
8.14 Open-Drain Output Characteristics
(STATUS[1:0]).......................................................... 13
12.4 Power Rail Sequencing, Power Supply Ramp Rate,
and Mixing Supply Domains .................................. 129
8.15 AC-LVPECL Output Characteristics ..................... 13
8.16 AC-LVDS Output Characteristics.......................... 13
8.17 AC-CML Output Characteristics............................ 14
8.18 HCSL Output Characteristics................................ 14
8.19 Power-On Reset Characteristics........................... 14
12.5 Power Supply Bypassing .................................... 131
13 Layout................................................................. 133
13.1 Layout Guidelines ............................................... 133
13.2 Layout Example .................................................. 133
14 器件和文档支持 ................................................... 135
14.1 器件支持.............................................................. 135
14.2 接收文档更新通知 ............................................... 135
14.3 社区资源.............................................................. 135
14.4 商标..................................................................... 135
14.5 静电放电警告....................................................... 135
14.6 Glossary.............................................................. 135
15 机械、封装和可订购信息..................................... 135
8.20 2-Level Logic Input Characteristics
(HW_SW_CTRL, PDN, GPIO[5:0]).......................... 15
8.21 3-Level Logic Input Characteristics (REFSEL,
GPIO[3:1])................................................................ 15
8.22 Analog Input Characteristics (GPIO[5])................. 15
8.23 I2C-Compatible Interface Characteristics (SDA,
SCL)......................................................................... 16
8.24 Typical 156.25-MHz Closed-Loop Output Phase
Noise Characteristics ............................................... 16
2
版权 © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
4 修订历史记录
Changes from Revision D (December 2017) to Revision E
Page
•
•
•
•
•
Clarified note about VOH (rail-to-rail swing only with VDDO = 1.8 V +/- 5%)........................................................................ 12
Changed Slew Rate minimum and maximum from: 2.25 V/ns and 5 V/ns to: 1 V/ns and 4 V/ns, respectively .................. 14
Updated PRODID reset value to be 0x33 (was 0x31).......................................................................................................... 71
Updated REVID reset value to be 0x02 (was 0x01) ............................................................................................................ 71
Added the Support for PCB Temperature up to 105°C subsection.................................................................................... 133
Changes from Revision C (August 2017) to Revision D
Page
•
•
•
•
•
•
•
向 应用 部分............................................................................................................................................................................ 1
Added PCIe Clock Output Jitter table................................................................................................................................... 17
Added tablenotes to Table 10............................................................................................................................................... 57
Changed the first paragraph of the Powering Up From Single-Supply Rail section .......................................................... 129
Changed the first paragraph of the Powering Up From Split-Supply Rails section and Figure 84 .................................... 130
Changed the first paragraph and added new content to the Slow Power-Up Supply Ramp section ................................ 130
Changed the first paragraph of the Non-Monotonic Power-Up Supply Ramp section ...................................................... 131
Changes from Revision B (August 2016) to Revision C
Page
•
•
Added a table note to Recommended Operating Conditions explaining the NOM values .................................................... 8
Changed Vbb = 1.3 V to 1.8 in Figure 45 ............................................................................................................................ 35
Changes from Revision A (December 2015) to Revision B
Page
•
•
•
Changed title from Configuring the PLL to Device Functional Modes.................................................................................. 32
Changed title from Interface and Control to Programming .................................................................................................. 50
Added new sections to Power Supply Recommendations ................................................................................................ 129
版权 © 2015–2018, Texas Instruments Incorporated
3
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
5 说明 （续）
对于 PLL，可以选择差分时钟、单端时钟或晶振输入作为参考时钟。所选基准输入可用于将 VCO 频率锁定在基准
输入频率的整数或小数倍。VCO 频率可在 4.8GHz 至 5.4GHz 范围内进行调整。凭借 PLL，用户可以根据应用需
求灵活选择预定义或用户定义的环路带宽。PLL 有一个后分频器，分频选项包括 2 分频、3 分频、4 分频、5 分
频、6 分频、7 分频或 8 分频。
所有输出通道均可选择经过 PLL 分频的 VCO 时钟作为输出驱动器的时钟源，从而设置最终输出频率。部分输出通
道还可以单独选择 PLL 的基准输入作为将旁路到相应输出缓冲器的备用时钟源。8 位输出分频器支持 1 至 256（偶
数或奇数）的分频范围，输出频率高达 1GHz，并且具有输出相位同步功能。
所有输出对均为以地为基准并具有可编程摆幅的 CML 驱动器，并且可通过交流耦合方式连接到 LVDS、LVPECL
或 CML 接收器。另外，所有输出对还可以单独配置为 HCSL 输出或 2 x 1.8V LVCMOS 输出。与以电压为基准的
驱动器设计（例如，传统的 LVDS 和 LVPECL 驱动器）相比，该输出具有更低的功耗（1.8V 时）、更出色的性能
和电源抗扰度、以及更少的电磁干扰 (EMI)。通过 STATUS 引脚可获得两个额外的 3.3V LVCMOS 输出。这是一
项可选特性，可在需要 3.3V LVCMOS 输出及不需要器件状态信号时使用。
该器件 具有 自启动功能，通过片上可编程 EEPROM 或预定义的 ROM 存储器实现，有多种定制器件模式可通过
引脚控制进行选择来免除对串行编程的需求。可通过与 I2C 兼容的串行接口对器件寄存器和片上 EEPROM 设置进
行完全编程。器件从地址可在 EEPROM 中编程，LSB 可使用 3 状态引脚置位。
该器件提供有两种频率裕度选项，支持无毛刺脉冲运行，可为标准合规性和系统时序裕度测试等系统设计验证测试
(DVT) 提供支持。通过在内部晶振 (XO) 上使用低成本可牵引晶振并选择该输入作为 PLL 合成器的基准，可支持精
调频率裕度（用 ppm 表示）。频率裕度范围取决于晶振的修整灵敏度和片上变容二极管范围。XO 频率裕度可通过
引脚或 I2C 接口控制，灵活度较高且易于使用。通过 I2C 接口更改输出分频值后，可在任意输出通道上使用粗调频
率裕度（用 % 表示），同时会停止并重启输出时钟以防止更改分频器后出现毛刺脉冲或短脉冲。
内部电源调节功能提供出色的电源噪声抑制 (PSNR)，降低了供电网络的成本和复杂性。模拟和数字内核块由
3.3V±5% 电源供电运行，输出块由 1.8V、2.5V 或 3.3V±5% 电源供电运行。
6 器件比较表
表 1. 不同积分带宽范围内的 LVPECL 输出抖动
输出频率 (MHz)
< 100
积分带宽
抖动典型值（ps，rms）
12 kHz - 5 MHz
0.15
0.1
> 100
1 kHz – 5 MHz
12 kHz – 20 MHz
4
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
7 Pin Configuration and Functions
RHS Package
48-Pin QFN
Top View
STATUS0
STATUS1
CAP_DIG
VDD_DIG
1
2
3
4
36 VDD_PLL
35 CAP_PLL
34 LF
33 GPIO5
VDD_IN
5
6
32 GPIO4
31 GPIO3
30 GPIO2
29 NC
PRIREF_P
PRIREF_N
REFSEL
7
8
9
HW_SW_CTRL
28 CAP_LDO
SECREF_P 10
27 VDD_LDO
26 SCL
SECREF_N 11
GPIO0 12
25 SDA
Pin Functions
NO.
NAME
TYPE
DESCRIPTION
POWER
n/a
DAP
Ground
Die Attach Pad.
The DAP is an electrical connection and provides a thermal dissipation path. For proper
electrical and thermal performance of the device, a 6 × 6 via pattern (0.3 mm holes) is
recommended to connect the DAP to multiple ground layers of the PCB. Refer to Layout
Guidelines.
4
VDD_DIG
VDD_IN
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
3.3 V power supply for digital control and STATUS outputs.
3.3 V power supply for input block.
5
18
19
27
36
37
40
43
46
VDDO_01
VDDO_23
VDD_LDO
VDD_PLL
VDDO_4
VDDO_5
VDDO_6
VDDO_7
1.8 V, 2.5 V, or 3.3 V power supply for OUT0/OUT1 channel.
1.8 V, 2.5 V, or 3.3 V power supply for OUT2/OUT3 channel.
3.3 V power supply for PLL LDO.
3.3 V power supply for PLL/VCO.
1.8 V, 2.5 V, or 3.3 V power supply for OUT4 channel.
1.8 V, 2.5 V, or 3.3 V power supply for OUT5 channel.
1.8 V, 2.5 V, or 3.3 V power supply for OUT6 channel.
1.8 V, 2.5 V, or 3.3 V power supply for OUT7 channel.
Copyright © 2015–2018, Texas Instruments Incorporated
5
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Pin Functions (continued)
NO.
NAME
TYPE
DESCRIPTION
INPUT BLOCK
6, 7
PRIREF_P,
PRIREF_N
Universal Primary reference clock.
Accepts a differential or single-ended input. Input pins have AC-coupling capacitors and
biasing internally. For LVCMOS input, the non-driven input pin must be pulled down to
ground.
8
REFSEL
LVCMOS Manual reference input selection for PLL (3-state).
Weak pul-lup resistor.
9
HW_SW_CTRL
LVCMOS Selection for Hard Pin Mode (ROM), Soft Pin Mode (EEPROM), or Register Default Mode.
Weak pullup resistor.
10, 11
SECREF_P,
SECREF_N
Universal Secondary reference clock.
Accepts a differential or single-ended input or crystal input. Input pins have AC-coupling
capacitors and biasing internally. For LVCMOS input, external input termination is needed
to attenuate the swing to less than 2.6 V, and the non-driven input pin must be pulled
down to ground.
For crystal input, AT-cut fundamental crystal must be used as per defined specification,
and pullable crystal should be used for fine margining.
SYNTHESIZER BLOCK
3
CAP_DIG
Analog
Analog
Analog
Analog
External bypass capacitor for digital blocks. Attach a 10 µF to GND.
External bypass capacitor for PLL LDO. Attach a 10 µF to GND.
External loop filter for PLL.
28
CAP_LDO
LF
34
35
CAP_PLL
External bypass capacitor for PLL. Attach a 10 µF to GND.
OUTPUT BLOCK
14, 15
17, 16
20, 21
23, 22
39, 38
42, 41
45, 44
48, 47
OUT0_P, OUT0_N
OUT1_P, OUT1_N
OUT2_P, OUT2_N
OUT3_P, OUT3_N
OUT4_P, OUT4_N
OUT5_P, OUT5_N
OUT6_P, OUT6_N
OUT7_P, OUT7_N
Universal Differential/LVCMOS output pair 0. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 1. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 2. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 3. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 4. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 5. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 6. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
Universal Differential/LVCMOS output pair 7. Programmable driver with differential or 2 × 1.8-V
LVCMOS outputs.
6
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
NO.
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Pin Functions (continued)
NAME
TYPE
DESCRIPTION
DIGITAL CONTROL / INTERFACES(1)
1
2
STATUS0
Universal Status output 0 (open drain, requires external pullup) or 3.3-V LVCMOS output from synth
(push-pull).
Status signal selection and output polarity are programmable.
STATUS1
Universal Status output 1 (open drain, requires external pullup) or 3.3-V LVCMOS output from synth
(push-pull).
Status signal selection and output polarity are programmable.
12
13
24
25
GPIO0
PDN
LVCMOS Multifunction inputs (2-state).
LVCMOS Device power-down (active low). Weak pullup resistor.
GPIO1
SDA
LVCMOS Multifunction input (3-state or 2-state).
LVCMOS I2C serial data (bidirectional, open drain).
Requires an external pullup resistor to VDD_DIG.
I2C slave address is initialized from on-chip EEPROM.
26
SCL
LVCMOS I2C serial clock (bidirectional, open drain).
Requires an external pullup resistor to VDD_DIG.
29
30
31
32
33
NC
N/A
No connect.
GPIO2
GPIO3
GPIO4
GPIO5
LVCMOS Multifunction input (3-state or 2-state).
LVCMOS Multifunction input (3-state or 2-state).
LVCMOS Multifunction input (2-state).
Universal Multifunction input (2-state) or analog input for frequency margin.
(1) Refer to Device Configuration Control for details on the digital control/interfaces.
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage for input, synthesizer, control, and output blocks, VDD_IN, VDD_PLL, VDD_LDO,
VDD_DIG, VDDO_x
–0.3
3.6
V
Input voltage, clock and logic inputs, VIN
Output voltage for clock and logic outputs, VOUT
Junction temperature, TJ
–0.3
–0.3
VDD +0.3
VDD + 0.3
150
V
V
°C
°C
Storage temperature, Tstg
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.
Copyright © 2015–2018, Texas Instruments Incorporated
7
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
MAX UNIT
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
3.135
1.7
NOM
3.3
1.8
2.5
3.3
25
Supply voltage for input, analog, control blocks, VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG
Supply voltage for output drivers (Differential, LVCMOS), VDDO_x(1)
3.465
3.465
3.465
3.465
85
V
1.7
V
1.7
Ambient temperature, TA
–40
°C
°C
ms
Junction temperature, TJ
125
Maximum VDD power-up ramp, dVDD/dt
EEPROM number of writes, WR
0.1
100
100
(1) The 3 different NOM values are the 3 typical test voltages throughout the data sheet.
8.4 Thermal Information
(2) (3) (4)
LMK03318
RHA (WQFN)
48 PINS
THERMAL METRIC(1)
UNIT
Airflow (LFM) 0
26.47
Airflow (LFM) 200
Airflow (LFM) 400
RθJA
Junction-to-ambient thermal resistance
16.4
n/a
14.62
n/a
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
16.57
RθJB
ψJT
Junction-to-board thermal resistance
6.84
n/a
n/a
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.23
0.31
3.86
n/a
0.47
3.84
n/a
ψJB
4.02
RθJC(bot) Junction-to-case (bottom) thermal resistance
1.06
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) The package thermal resistance is calculated on a 4-layer JEDEC board.
(3) Package DAP connected to PCB GND plane with 16 thermal vias (0.3 mm diameter).
(4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. Refer to the Layout section for more
information on ensuring good system reliability and quality.
8.5 Thermal Information
LMK03318
THERMAL METRIC(1)
CONDITION
RHA (WQFN)
48 PINS
UNIT
Junction-to-ambient thermal
resistance
10-layer 200 mm × 250 mm board, 36 thermal vias,
Airflow = 0 LFM
RθJA
10
°C/W
°C/W
Junction-to-board
characterization parameter
10-layer 200 mm × 250 mm board, 36 thermal vias,
Airflow = 0 LFM
ψJB
2.8
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics application report.
8
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.6 Electrical Characteristics - Power Supply
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C(1)(2)
PARAMETER
TEST CONDITIONS
Primary input (differential or single-ended) - active
Secondary input (differential or single-ended) - active
Secondary input (XO) - active
MIN
TYP
10
10
11
4
MAX UNIT
Core current consumption,
per block
lDD
mA
PLL doubler - active
PLL block – active
110
53
46
Control block
Output channel (MUX and Divider only) – active
AC-LVDS driver (one pair)
AC-coupled to 100 Ω differential
10
18
16
25
10
21
AC-LVPECL driver (one pair), AC-coupled to 100 Ω
differential
AC-CML driver (one pair), AC-coupled to 100 Ω
differential
Output current
consumption, per block
IDDO
mA
HCSL driver (one pair)
50 Ω to GND
1.8-V LVCMOS driver (two outputs), 100 MHz, 5 pF
load(2)
3.3-V LVCMOS driver on STATUS0, STATUS1, 100
MHz, 5 pF load(2)
IDD_IN
Inputs:
48
128
15
65
158
30
mA
mA
mA
mA
mA
mA
mA
mA
mA
-
-
-
-
-
PRI input enabled, set to LVDS mode
SEC input enabled, set to crystal mode
Input MUX set to auto select
Reference clock is 25 MHz
IDD_PLL
IDD_LDO
IDD_DIG
IDDO_01
IDDO_23
IDDO_4
IDDO_5
IDDO_6
19
38
R dividers set to 1
85
105
105
75
PLL:
-
-
-
-
-
-
-
M divider = 1
Doubler enabled
ICP = 6.4 mA
Loop bandwidth = 400 kHz
VCO Frequency = 5 GHz
Feedback divider = 100
Post divider = 8
85
58
Current consumption, per
supply pin
58
75
58
75
Outputs:
-
-
-
OUT[0-7] = 156.25 MHz LVPECL
STATUS1: Loss of lock PLL
STATUS0: Loss of secondary reference
IDDO_7
IDD-PD
58
30
75
50
mA
mA
Power Supplies:
-
-
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V
VDDO_xx = 3.3 V
Total device, LMK03318
Power down (PDN = 0)
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) PTOTAL = PDC + PAC, where: PDC = 3.4 mA typical. PAC = C × V2 × fOUT
.
Copyright © 2015–2018, Texas Instruments Incorporated
9
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
8.7 Pullable Crystal Characteristics (SECREF_P, SECREF_N)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
(1)(2)(3)(4)
+85°C
PARAMETER
TEST CONDITIONS
Fundamental Mode
fXTAL = 10 MHz to 16 MHz
MIN
TYP
MAX UNIT
fXTAL
ESR
Crystal frequency
10
52
60
50
30
MHz
Equivalent series resistance fXTAL = 16 MHz to 30 MHz
fXTAL = 30 MHz to 52 MHz
Ω
CL
C0
Load capacitance
9
pF
pF
Shunt capacitance
2.1
Recommended crystal specifications
Shunt capacitance to
motional capacitance ratio
C0/C1
PXTAL
220
250
300
Crystal maximum drive level
µW
pF
On-Chip XO input
capacitance at SECREF_P
and SECREF_N
CXO
Single-ended, each pin referenced to GND
14
24
CL = 9 pF, fXTAL = 50 MHz
CL = 9 pF, fXTAL = 25 MHz
25
35
Trim
Trim sensitivity
ppm/pF
fF
On-chip tunable capacitor
variation over VT across
crystal load of 5 pF
Con-chip-5p-
load
Frequency accuracy of crystal over temperature, aging
and initial accuracy < ±25 ppm.
450
1.5
On-chip tunable capacitor
variation over VT across
crystal load of 12 pF
Con-chip-12p-
load
Frequency accuracy of crystal over temperature, aging
and initial accuracy < ±25 ppm.
pF
fPR
Pulling range
Crystal C0/C1 < 250
±50
ppm
(1) Parameter is specified by characterization and is not tested in production.
(2) The crystal pullability ratio is considered in the case where the XO frequency margining option is enabled. The actual pull range
depends on the crystal pullability, as well as on-chip capacitance (Con-chip), device crystal oscillator input capacitance (CXO), PCB stray
capacitance (CPCB), and any installed on-board tuning capacitance (CTUNE). Trim sensitivity or pullability (ppm/pF), TS = C1 × 1e6 / [2 ×
(C0 + CL)2]. If the total external capacitance is less than the crystal CL, the crystal oscillates at a higher frequency than the nominal
crystal frequency. If the total external capacitance is higher than CL, the crystal oscillates at a lower frequency than nominal.
(3) Using a crystal with higher ESR can degrade output phase noise and may impact crystal start-up.
(4) Verified with crystals specified for a load capacitance of CL = 9 pF. PCB stray capacitance was measured to be 1 pF. Crystals tested:
19.2-MHz TXC (Part Number: 7M19272001), 19.44 MHz TXC (Part Number: 7M19472001), 25 MHz TXC (Part Number: 7M25072001),
38.88-MHz TXC (Part Number: 7M38872001), 49.152-MHz TXC (Part Number: 7M49172001), 50-MHz TXC (Part Number:
7M50072001).
10
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.8 Non-Pullable Crystal Characteristics (SECREF_P, SECREF_N)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
(1)(2)(3)
+85°C
PARAMETER
Crystal frequency
TEST CONDITIONS
Fundamental mode
MIN
TYP
MAX
52
UNIT
fXTAL
ESR
10
MHz
fXTAL = 10 MHz to 16 MHz
fXTAL = 16 MHz to 30 MHz
fXTAL = 30 MHz to 52 MHz
60
Equivalent series resistance
Crystal maximum drive level
50
Ω
30
PXTAL
CXO
300
µW
pF
On-Chip XO input capacitance Single-ended, each pin referenced to
at Xi and Xo
14
24
GND
On-chip tunable capacitor
variation over VT across
crystal load of 5 pF
Frequency accuracy of crystal over
temperature, aging and initial accuracy
< ± 25 ppm.
Con-chip-5p-load
450
fF
On-chip tunable capacitor
variation over VT across
crystal load of 12 pF
Frequency accuracy of crystal over
temperature, aging and initial accuracy
< ± 25 ppm.
Con-chip-12p-load
1.5
pF
(1) Parameter is specified by characterization and is not tested in production.
(2) Using a crystal with higher ESR can degrade XO phase noise and may impact crystal start-up.
(3) Verified with crystals specified for a load capacitance of CL = 9 pF. PCB stray capacitance was measured to be 1 pF. Crystal tested: 25-
MHz TXC (part number: 7M25072001).
8.9 Clock Input Characteristics (PRIREF_P/PRIREF_N, SECREF_P/SECREF_N)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
85°C(1)
PARAMETER
TEST CONDITIONS
MIN
1
TYP
MAX
300
UNIT
MHz
V
fCLK
Input frequency range
(2)
VIH
VIH
VIL
LVCMOS input high voltage PRI_REF
LVCMOS input high voltage SEC_REF
LVCMOS input low voltage
1.4
1.4
0
VDD_IN
2.6
(2)
(2)
V
0.5
V
Input voltage swing,
differential peak-peak
Differential input (where VCLK – VnCLK = |VID| × 2)
VID,DIFF,PP
VICM
0.2
2
2
V
Input common-mode voltage Differential input
0.1
0.5
V
Input edge slew rate (20% to Differential input, peak-peak
80%)
V/ns
V/ns
dV/dt(3)
Single-ended input, non-driven input tied to GND
0.5
IDC(3)
IIN
Input clock duty cycle
Input leakage current
Input capacitance
40%
–100
60%
100
µA
pF
CIN
Single-ended, each pin
2
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Slew-rate-detect circuitry must be used when VIH < 1.7 V and VIL > 0.2 V. VIH/VIL detect circuitry must be used when VIH < 1.5 V and VIL
> 0.4 V. Refer to REFDETCTL Register; R25 for relevant register information.
(3) Ensured by characterization.
8.10 VCO Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C
PARAMETER
Frequency range
VCO Gain
TEST CONDITIONS
MIN
TYP
MAX
UNIT
GHz
fVCO
4.8
5.4
KVCO
55
MHz/V
Copyright © 2015–2018, Texas Instruments Incorporated
11
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
8.11 PLL Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
fPD
Phase detector frequency
PLL figure of merit(1)
1
150
PN1Hz
–231
–136
dBc/Hz
PLL 1/f noise at 10 kHz offset ICP = 6.4 mA, 25 MHz phase detector
normalized to 1 GHz(2)
PN10kHz
ICP-HIZ
dBc/Hz
nA
Charge-pump leakage in Hi-Z
Mode
55
(1) PLL flat phase noise = PN1 Hz + 20 × log(N) + 10 × log(fPD), with wide loop bandwidth and away from1/f noise region.
(2) Phase noise normalized to 1 GHz. PLL 1/f phase noise = PN10 kHz + 20 × log(fOUT/1 GHz) – 10 × log(offset/10 kHz)
8.12 1.8-V LVCMOS Output Characteristics (OUT[7:0])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C, outputs loaded with 2 pF to GND(1)
PARAMETER
TEST CONDITIONS
MIN
1
TYP
MAX
UNIT
MHz
V
fOUT
VOH
VOL
IOH
Output frequency
200
(2)
Output high voltage
Output low voltage
Output high current
Output low current
Output rise/fall time
Output-to-output skew
Output-to-output skew
IOH = 1 mA
IOL = 1 mA
1.35
0.35
V
21
–21
250
mA
mA
ps
IOL
tR/tF
20% to 80%
(3)
(3)
tSKEW
tSKEW
same divide value
100
1.5
ps
LVCMOS-to-differential; same divide value
ns
tPROP-CMOS IN-to-OUT propagation delay PLL bypass
Output phase noise floor
1
ns
PN-Floor
66.66 MHz
–155
dBc/Hz
(fOFFSET > 10 MHz)
Output Duty Cycle
Output Impedance
ODC(3)
ROUT
45%
55%
50
Ω
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) The 1.8-V LVCMOS driver supports rail-to-rail output swing only when powered from VDDO = 1.8 V +/- 5% (recommended VDDO for
use with LVCMOS output format). VOH level is NOT rail-to-rail for VDDO = 2.5 V or 3.3 V due to the dropout voltage of the output
channel’s internal LDO regulator.
(3) Ensured by characterization.
8.13 LVCMOS Output Characteristics (STATUS[1:0])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDD_O = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to 85°C,
outputs loaded with 2 pF to GND(1)
PARAMETER
Output frequency
Output high voltage
Output low voltage
Output high current
Output low current
Output rise/fall time
TEST CONDITIONS
MIN
3.75
2.5
TYP
MAX
UNIT
MHz
V
fOUT
VOH
VOL
IOH
200
IOH = 1 mA
IOL = 1 mA
0.6
V
33
–33
2.1
mA
mA
ns
IOL
(2)
tR/tF
20% to 80%, R49[3-2], R49[1:0] = 10
20% to 80%, R49[3-2], R49[1-0] = 00
0.35
ns
Output phase noise floor
(fOFFSET > 10 MHz)
PN-Floor
66.66 MHz
–148
dBc/Hz
ODC(2)
ROUT
Output duty cycle
Output impedance
45%
55%
50
Ω
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Ensured by characterization.
12
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.14 Open-Drain Output Characteristics (STATUS[1:0])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VOL
Output low voltage
0.6
V
8.15 AC-LVPECL Output Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
85°C, output pair AC-coupled to 100-Ω differential load(1)
PARAMETER
Output frequency(2)
TEST CONDITIONS
MIN
1
TYP
MAX
1000
1000
UNIT
MHz
mV
V
fOUT
VOD
Output voltage swing
500
800
VOUT-PP
Differential output peak-to-
peak swing
2 × |VOD
|
VOS
Output common mode
Output-to-output skew
300
700
60
mV
ps
ps
ps
ps
(3)
tSKEW
LVPECL-to-LVPECL; same divide value
tPROP-DIFF IN-to-OUT propagation delay PLL bypass
400
175
(3)
tR/tF
Output rise or fall time
20% to 80%, < 300 MHz
300
200
±100 mV around center point, > 300 MHz
Output phase noise floor
(fOFFSET > 10 MHz)
PN-Floor
ODC(3)
156.25 MHz
–164
dBc/Hz
Output duty cycle
45%
55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) An output frequency over fOUT maximum specification is possible, but output swing may be less than VOD minimum specification.
(3) Ensured by characterization.
8.16 AC-LVDS Output Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
85°C, output pair AC-coupled to 100-Ω differential load(1)
PARAMETER
Output frequency(2)
TEST CONDITIONS
MIN
1
TYP
MAX
800
UNIT
MHz
mV
V
fOUT
VOD
Output voltage swing
250
400
450
VOUT-PP
Differential output peak-to-
peak swing
2 × |VOD
|
VOS
Output common mode
Output-to-output skew
150
350
60
mV
ps
ps
ps
ps
(2)
tSKEW
LVDS-to-LVDS; same divide value
tPROP-DIFF IN-to-OUT propagation delay PLL bypass
400
200
(3)
tR/tF
Output rise/fall time
20% to 80%, < 300 MHz
300
200
±100 mV around center point, > 300 MHz
Output phase noise floor
(fOFFSET > 10 MHz)
PN-Floor
ODC(3)
156.25 MHz
–160
dBc/Hz
Output duty cycle
45%
55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) An output frequency over fOUT maximum specification is possible, but output swing may be less than VOD minimum specification.
(3) Ensured by characterization.
Copyright © 2015–2018, Texas Instruments Incorporated
13
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
8.17 AC-CML Output Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C, output pair AC-coupled to 100-Ω differential load(1)
PARAMETER
Output frequency(2)
TEST CONDITIONS
MIN
1
TYP
MAX
1000
800
UNIT
MHz
mV
V
fOUT
VOD
VSS
Output voltage swing
400
600
Differential output peak-to-
peak swing
2 × |VOD
|
VOS
Output common mode
Output-to-output skew
250
550
60
mV
ps
(3)
tSKEW
CML-to-CML; same divide value
PLL bypass
tPROP-
DIFF
IN-to-OUT propagation delay
ps
400
190
(3)
tR/tF
Output rise/fall time
20% to 80%, < 300 MHz
300
200
ps
ps
±100 mV around center point, > 300 MHz
Output phase noise floor
(fOFFSET > 10 MHz)
PN-Floor
ODC(3)
156.25 MHz
–160
dBc/Hz
Output duty cycle
45%
55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) An output frequency over fOUT maximum specification is possible, but output swing may be less than VOD minimum specification.
(3) Ensured by characterization.
8.18 HCSL Output Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG= 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C, outputs with 50 Ω || 2 pF to GND(1)
PARAMETER
TEST CONDITIONS
MIN
1
TYP
MAX
400
UNIT
MHz
mV
fOUT
Output frequency
VOH
Output high voltage(2)
Output low voltage(2)
Absolute crossing voltage(3)
660
–150
250
850
150
550
VOL
mV
VCROSS
mV
(3)
VCROSS-
DELTA
Variation of VCROSS
mV
0
140
100
(4)
tSKEW
Output-to-output skew
IN-to-OUT propagation delay
Slew rate(2)
Same divide value
ps
ps
tPROP-DIFF
dV/dt(4)
PLL bypass
400
1
4
V/ns
Output phase noise floor
(fOFFSET > 10 MHz)
PN-Floor
ODC(4)
100 MHz
–158
dBc/Hz
Output duty cycle
45%
55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Measured from -150 mV to +150 mV on the differential waveform (OUT minus nOUT) with the 300 mVpp measurement window
centered on the differential zero crossing.
(3) Ensured by design.
(4) Ensured by characterization.
8.19 Power-On Reset Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
2.95
0.1
UNIT
V
VTHRESH Threshold voltage
2.72
VDROOP
Allowable voltage droop
V
Start-up time with 25-MHz
XTAL
Measured from time of supply reaching 3.135 V to
time of output toggling
tS-XTAL
10
10
ms
ms
Start-up time with 25-MHz
clock input
Measured from time of supply reaching 3.135 V to
time of output toggling
tS-CLK
14
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.20 2-Level Logic Input Characteristics (HW_SW_CTRL, PDN, GPIO[5:0])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C
PARAMETER
Input high voltage
Input low voltage
Input high current
Input low current
Input capacitance
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIH
VIL
IIH
1.2
0.6
40
40
V
VIH = VDD_DIG
VIL = GND
–40
–40
µA
µA
pF
IIL
CIN
2
8.21 3-Level Logic Input Characteristics (REFSEL, GPIO[3:1])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C
PARAMETER
Input high voltage
Input mid voltage
Input low voltage
Input high current
Input low current
Input capacitance
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIH
VIM
VIL
IIH
1.4
0.9
V
0.4
40
40
V
VIH = VDD_DIG
VIL = GND
–40
–40
µA
µA
pF
IIL
CIN
2
8.22 Analog Input Characteristics (GPIO[5])
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C, pulldown resistor on GPIO[5] to GND as specified below, HW_SW_CTRL = 0
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VCTRL
VSTEP
tDELAY
Control voltage range
0
VDD_DIG
V
50 Ω to GND: Selects on-chip capacitive load set by
R88 and R89
50
200
2.32 kΩ to GND: Selects on-chip capacitive load set
by R90 and R91
5.62 kΩ to GND: Selects on-chip capacitive load set
by R92 and R93
400
10.5 kΩ to GND: Selects on-chip capacitive load set
by R94 and R95
600
Input voltage for XO
frequency offset step
selection on GPIO[5]
mV
18.7 kΩ to GND: Selects on-chip capacitive load set
by R96 and R97
800
34.8 kΩ to GND: Selects on-chip capacitive load set
by R98 and R99
1000
1200
1400
100
84.5 kΩ to GND: Selects on-chip capacitive load set
by R100 and R101
Left floating: Selects on-chip capacitive load set by
R102 and R103
Delay between voltage
changes on GPIO[5] pin
ms
Copyright © 2015–2018, Texas Instruments Incorporated
15
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
8.23 I2C-Compatible Interface Characteristics (SDA, SCL)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = –40°C to
+85°C(1)(2)
PARAMETER
Input High Voltage
Input Low Voltage
Input Leakage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIH
1.2
VIL
0.6
40
V
IIH
–40
µA
pF
pF
V
CIN
Input Capacitance
Input Capacitance
Output Low Voltage
I2C Clock Rate
2
COUT
VOL
400
0.6
IOL = 3 mA
fSCL
100
0.6
0.6
0.6
1.3
0
400
kHz
µs
µs
µs
µs
µs
ns
ns
ns
µs
tSU_STA
tH_STA
tPH_STA
tPL_STA
tH_SDA
tSU_SDA
START Condition Setup Time
START Condition Hold Time
SCL Pulse Width High
SCL Pulse Width Low
SDA Hold Time
SCL high before SDA low
SCL low after SDA low
SDA valid after SCL low
CBUS = 10 pF to 400 pF
0.9
SDA Setup Time
115
tR_IN / tF_IN SCL/SDA Input Rise and Fall Time
300
250
tF_OUT
SDA Output Fall Time
tSU_STOP
STOP Condition Setup Time
0.6
1.3
Bus Free Time between STOP and
START
tBUS
µs
(1) Total capacitive load for each bus line ≤ 400 pF.
(2) Ensured by design.
8.24 Typical 156.25-MHz Closed-Loop Output Phase Noise Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V, VDDO_x = 1.8 V, 2.5 V, 3.3 V, TA = 25°C, Reference Input = 50 MHz,
PFD = 100 MHz, Integer-N PLL bandwidth = 400 kHz, VCO frequency = 5 GHz, post divider = 8, output divider = 4, Output
Type = AC-LVPECL/AC-LVDS/AC-CML/HCSL/LVCMOS(1)(2)
OUTPUT TYPE
PARAMETER
UNIT
AC-LVPECL
–143
AC-LVDS
–142
AC-CML
–142
–143
–144
–146
–149
–160
–164
HCSL
–141
–142
–144
–146
–149
–159
–161
LVCMOS
–139
phn10k
phn50k
phn100k
phn500k
phn1M
Phase noise at 10-kHz offset
Phase noise at 50-kHz offset
Phase noise at 100-kHz offset
Phase noise at 500-kHz offset
Phase noise at 1-MHz offset
Phase noise at 5-MHz offset
Phase noise at 20-MHz offset
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
–143.5
–144
–143
–141
–144
–143
–146
–146
–145
–149.5
–160.5
–164.5
–149
–149
phn5M
–160
–158
phn20M
–164
–159
Random jitter integrated from 10-kHz to 20-
MHz offsets
RJ
96
99
99
107
119
fs, RMS
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Jitter specifications apply for differential output formats with low-jitter differential input clock or crystal input. Phase jitter measured with
Agilent E5052 signal source analyzer using a differential-to-single-ended converter (balun or buffer).
16
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.25 Typical 161.1328125-MHz Closed-Loop Output Phase Noise Characteristics(1)(2)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V, VDDO_x = 1.8 V, 2.5 V, 3.3 V, TA = 25°C, Reference Input = 50 MHz,
PFD = 100 MHz, Fractional-N PLL bandwidth = 400 kHz, VCO Frequency = 5.15625 GHz, Post Divider = 8, Output Divider =
4, Output Type = AC-LVPECL/AC-LVDS/AC-CML/HCSL/LVCMOS
OUTPUT TYPE
PARAMETER
UNIT
AC-LVPECL AC-LVDS
AC-CML
–136
–139
–140
–142
–150
–160
–164
HCSL
–135
–139
–140
–142
–149
–159
–161
LVCMOS
–135
phn10k
phn50k
phn100k
phn500k
phn1M
Phase noise at 10-kHz offset
Phase noise at 50-kHz offset
Phase noise at 100-kHz offset
Phase noise at 500-kHz offset
Phase noise at 1-MHz offset
Phase noise at 5-MHz offset
Phase noise at 20-MHz offset
–136
–139
–136
–139
–140
–142
–150
–160
–164
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
–139
–140
–140
–142
–142
–150
–149
phn5M
–160.5
–164.5
–158
phn20M
–159
Random jitter integrated from 10-kHz to 20-
MHz offsets
RJ
120
122
122
130
136
fs, RMS
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Jitter specifications apply for differential output formats with low-jitter differential input clock or crystal input. Phase jitter measured with
Agilent E5052 signal source analyzer using a differential-to-single-ended converter (balun or buffer).
(1)(2)(3)(4)
8.26 Closed-Loop Output Jitter Characteristics
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V ± 5%, VDDO_x = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5%, TA = -40°C to
85°C, Integer-N PLL with 4.8 GHz, 4.9152 GHz, 4.97664 GHz, 5 GHz or 5.1 GHz VCO, 400 kHz PLL bandwidth and doubler
enabled or disabled, fractional-N PLL with 4.8 GHz, 4.9152 GHz, 4.944 GHz, 4.97664 GHz, 5 GHz, 5.15 GHz or 5.15625
GHz VCO, 400 kHz bandwidth and doubler enabled or disabled, 1.8-V or 3.3-V LVCMOS output load of 2 pF to GND, AC-
LVPECL/AC-LVDS/CML output pair AC-coupled to 100 Ω differential load, HCSL outputs with 50 Ω || 2 pF to GND.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RMS Phase Jitter
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
19.2-MHz, 19.44-MHz, 25-MHz, 27-MHz,
RJ
RJ
RJ
RJ
RJ
38.88-MHz crystal, integer-N PLL, fOUT
100 MHz, all differential output types
≥
120
200
fs RMS
RMS Phase Jitter
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
19.2 MHz, 19.44 MHz, 25 MHz, 27 MHz,
38.8 MHz crystal, fractional-N PLL, fOUT
100 MHz, all differential output types
≥
200
100
140
350
150
210
800
fs RMS
fs RMS
fs RMS
fs RMS
RMS Phase Jitter
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
50-MHz crystal, Integer-N PLL, fOUT
=
156.25 MHz, all differential output types
RMS Phase Jitter
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
50-MHz crystal, Fractional-N PLL, fOUT
=
155.52 MHz, all differential output types
RMS Phase Jitter
(12 kHz – 20 MHz) or
(12 kHz – 5 MHz)
fOUT ≥ 10 MHz, 1.8-V or 3.3-V LVCMOS
output, integer-N or fractional-N PLL
(1) Phase jitter measured with Agilent E5052 source signal analyzer using a differential-to-single-ended converter (balun or buffer) for
differential outputs.
(2) Verified with crystals specified for a load capacitance of CL = 9 pF. PCB stray capacitance was measured to be 1 pF. Crystals tested:
19.2-MHz TXC (Part Number: 7M19272001), 19.44-MHz TXC (Part Number: 7M19472001), 25-MHz TXC (Part Number: 7M25072001),
27-MHz TXC (Part Number: 7M27072001), 38.88-MHz TXC (Part Number: 7M38872001), 50-MHz TXC (Part Number: 7M50072001).
(3) Refer to Parameter Measurement Information for relevant test conditions.
(4) For output frequency < 40 MHz, integration band for RMS phase jitter is 12 kHz – 5 MHz.
8.27 PCIe Clock Output Jitter
VDD_IN / VDD_PLL1 / VDD_PLL2 / VDD_DIG = 3.3 V, VDDO_x = 1.8 V, 2.5 V, 3.3 V, TA = 25°C, Reference Input = 25-MHz
crystal, OUT = 100-MHz HCSL
PARAMETER
TEST CONDITIONS
TYP PCle Spec
UNIT
RJGEN3
RJGEN4
PCIe Gen 3 Common Clock
PCIe Gen 4 Common Clock
PCIe Gen 3 transfer function applied(1)
PCIe Gen 4 transfer function applied(1)
25
25
1000
500
fs RMS
fs RMS
(1) Excludes oscilloscope sampling noise
Copyright © 2015–2018, Texas Instruments Incorporated
17
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
8.28 Typical Power Supply Noise Rejection Characteristics(1)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3 V, VDDO_x = 3.3 V, TA = 25°C, Reference Input = 50 MHz, PFD = 100
MHz, PLL bandwidth = 400 kHz, VCO Ffrequency = 5 GHz, post divider = 8, output divider = 4, AC-LVPECL/AC-LVDS/CML
output pair AC-coupled to 100-Ω differential load, HCSL outputs with 50 Ω || 2 pF to GND, sinusoidal noise injected in either
of the following supply nodes: VDD_IN, VDD_PLL, VDD_DIG or VDDO_x.
50 mV RIPPLE ON SUPPLY TYPE
PARAMETER
UNIT
VDD_IN VDD_PLL VDD_LDO VDD_DIG VDDO_x
PSNR50k
50-kHz spur on 156.25-MHz output
-86
-85
-87
-91
-87
-86
-89
-92
-87
-86
-89
-92
-110
-110
-110
-110
-103
-98
-97
-94
dBc
dBc
dBc
dBc
PSNR100k 100-kHz spur on 156.25-MHz output
PSNR500k 500-kHz spur on 156.25-MHz output
PSNR1M
1-MHz spur on 156.25-MHz output
(1) Refer to Parameter Measurement Information for relevant test conditions.
8.29 Typical Power-Supply Noise Rejection Characteristics(1)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG= 3.3 V, VDDO_x = 1.8 V, TA = 25°C, Reference Input = 50 MHz, PFD = 100 MHz,
PLL bandwidth = 400 kHz, VCO frequency = 5 GHz, post divider = 8, output divider = 4, AC-LVPECL/AC-LVDS/CML output
pair AC-coupled to 100-Ω differential load, HCSL outputs with 50 Ω || 2 pF to GND, sinusoidal noise injected in VDDO_x.
50 mV RIPPLE ON SUPPLY TYPE
PARAMETER
UNIT
VDD_IN VDD_PLL VDD_LDO VDD_DIG VDDO_x
PSNR50k
PSNR100k
PSNR500k
PSNR1M
50-kHz spur on 156.25-MHz output
100-kHz spur on 156.25-MHz output
500-kHz spur on 156.25-MHz output
1-MHz spur on 156.25-MHz output
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
-93
-88
-78
-74
dBc
dBc
dBc
dBc
(1) Refer to Parameter Measurement Information for relevant test conditions.
8.30 Typical Closed-Loop Output Spur Characteristics(1)
VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG = 3.3V, VDDO_x = 1.8 V, 2.5 V, 3.3 V, TA = –40°C to +85°C, 50 MHz reference
input, 156.25 MHz or 125 MHz output with VCO frequency = 5 GHz, integer-N PLL, PLL bandwidth = 400 kHz, post divider =
8, output divider = 4 or 5, 161.1328125 MHz output with VCO frequency = 5.15625 GHz, fractional-N PLL, PLL bandwidth =
400 kHz, post divider = 8, output divider = 4, LVCMOS output load of 2 pF to GND, AC-LVPECL/AC-LVDS/AC-CML output
pair AC-coupled to 100 Ω differential load, HCSL outputs with 50 Ω || 2 pF to GND
OUTPUT TYPE
PARAMETER
CONDITION
UNIT
AC-
AC-LVDS AC-CML HCSL LVCMOS
LVPECL
PFD/reference clock
spurs
PSPUR-PFD
PSPUR-PFD
PSPUR-FRAC
156.25 ± 78.125 MHz
–77
–80
–74
–74
–77
–73
–76
–79
–76
–73
–77
–73
–75
–82
–74
dBc
dBc
dBc
PFD/reference clock
spurs
161.1328125 ± 80.56640625
MHz
Largest fractional PLL
spurs
161.1328125 ± 80.56640625
MHz
fVICTIM = 156.25-MHz OUT4,
fAGGR = 125-MHz OUT5, AC-
LVPECL aggressor
Output channel-to-
channel isolation
PSPUR-OUT
PSPUR-OUT
PSPUR-OUT
PSPUR–OUT
–73
–76
–78
–72
–70
–74
–74
–70
–70
–75
–75
–71
–67
–71
–72
–66
–74
–79
–77
–73
dBc
dBc
dBc
dBc
fVICTIM = 156.25-MHz OUT4,
fAGGR = 125-MHz OUT5, AC-
LVDS aggressor
Output channel-to-
channel isolation
fVICTIM = 156.25-MHz OUT4,
fAGGR = 125-MHz OUT5,
HCSL aggressor
Output channel-to-
channel isolation
fVICTIM = 156.25-MHz OUT4,
fAGGR = 125-MHz OUT5,
LVCMOS aggressor
Output channel-to-
channel isolation
(1) Refer to Parameter Measurement Information for relevant test conditions.
18
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
8.31 Typical Characteristics
œ228.5
œ229.0
œ229.5
œ230.0
œ230.5
œ231.0
œ231.5
œ110
œ120
œ130
œ140
œ150
œ160
œ170
0
1
2
3
4
5
6
100
1000
10000
100000 1000000 10000000
Input Slew Rate (V/ns)
Offset Frequency (Hz)
D003
D004
Figure 1. PLL Figure of Merit (FOM) vs Slew Rate
Figure 2. Closed-Loop Phase Noise of AC-LVPECL Outputs
at 156.25 MHz With PLL Bandwidth at 1 MHz, Integer N PLL,
50-MHz Crystal Input, 5-GHz VCO Frequency, Post Divider =
8, Output Divider = 4
œ110
œ120
œ130
œ140
œ150
œ160
œ170
œ110
œ120
œ130
œ140
œ150
œ160
œ170
100
1000
10000
100000 1000000 10000000
100
1000
10000
100000 1000000 10000000
Offset Frequency (Hz)
Offset Frequency (Hz)
D005
D006
Figure 3. Closed-Loop Phase Noise of AC-LVDS Outputs at
156.25 MHz With PLL Bandwidth at 1 MHz, Integer N PLL,
50-MHz Crystal Input, 5-GHz VCO Frequency, Post Divider =
8, Output Divider = 4
Figure 4. Closed-Loop Phase Noise of AC-CML Outputs at
156.25 MHz With PLL Bandwidth at 1 MHz, Integer N PLL,
50-MHz Crystal Input, 5-GHz VCO Frequency, Post Divider =
8, Output Divider = 4
œ110
œ120
œ130
œ140
œ150
œ160
œ170
œ110
œ120
œ130
œ140
œ150
œ160
œ170
100
1000
10000
100000 1000000 10000000
100
1000
10000
100000 1000000 10000000
Offset Frequency (Hz)
Offset Frequency (Hz)
D007
D008
Figure 5. Closed-Loop Phase Noise of HCSL Outputs at
156.25 MHz With PLL Bandwidth at 1 MHz, Integer N PLL,
50-MHz Crystal Input, 5-GHz VCO Frequency, Post Divider =
8, Output Divider = 4
Figure 6. Closed-Loop Phase Noise of AC-LVPECL Outputs
at 161.1328125 MHz With PLL Bandwidth at 400 kHz,
Fractional N PLL, 50-MHz Crystal Input, 5.15625-GHz VCO
Frequency, Post Divider = 8, Output Divider = 4
Copyright © 2015–2018, Texas Instruments Incorporated
19
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Characteristics (continued)
œ110
œ110
œ120
œ130
œ140
œ150
œ160
œ170
œ120
œ130
œ140
œ150
œ160
œ170
100
1000
10000
100000 1000000 10000000
100
1000
10000
100000 1000000 10000000
Offset Frequency (Hz)
Offset Frequency (Hz)
D009
D010
Figure 7. Closed-Loop Phase Noise of AC-LVDS Outputs at
161.1328125 MHz With PLL Bandwidth at 400 kHz, Fractional
N PLL, 50-MHz Crystal Input, 5-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
Figure 8. Closed-Loop Phase Noise of AC-CML Outputs at
161.1328125 MHz With PLL Bandwidth at 400 kHz, Fractional
N PLL, 50-MHz Crystal Input, 5-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
10
œ110
œ120
œ130
œ140
œ150
œ160
œ170
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
78.125
109.375
140.625
171.875
203.125
234.375
100
1000
10000
100000 1000000 10000000
Frequency (MHz)
D012
Offset Frequency (Hz)
D011
Figure 10. 156.25 ± 78.125 MHz AC-LVPECL Output
Spectrum With PLL Bandwidth at 1 MHz, Integer N PLL, 50-
MHz Crystal Input, 5-GHz VCO Frequency, Post Divider = 8,
Output Divider = 4
Figure 9. Closed-Loop Phase Noise of HCSL Outputs at
161.1328125 MHz With PLL Bandwidth at 400 kHz, Fractional
N PLL, 50-MHz Crystal Input, 5-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
10
0
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
78.125
109.375
140.625
171.875
203.125
234.375
78.125
109.375
140.625
171.875
203.125
234.375
Frequency (MHz)
Frequency (MHz)
D013
D014
Figure 11. 156.25 ± 78.125 MHz AC-LVDS Output Spectrum
With PLL Bandwidth at 1 MHz, Integer N PLL, 50-MHz
Crystal Input, 5-GHz VCO Frequency, Post Divider = 8,
Output Divider = 4
Figure 12. 156.25 ± 78.125 MHz AC-CML Output Spectrum
With PLL Bandwidth at 1 MHz, Integer N PLL, 50-MHz
Crystal Input, 5 GHz VCO Frequency, Post Divider = 8,
Output Divider = 4
20
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Typical Characteristics (continued)
10
10
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-10
-20
-30
-40
-50
-60
-70
-80
-90
78.125
109.375
140.625
171.875
203.125
234.375
80
100
120
140
160
180
200
220
240
Frequency (MHz)
Frequency (MHz)
D015
D016
Figure 13. 156.25 ± 78.125 MHz HCSL Output Spectrum With
PLL Bandwidth at 1 MHz, Integer N PLL, 50-MHz Crystal
Input, 5-GHz VCO Frequency, Post Divider = 8, Output
Divider = 4
Figure 14. 161.1328125 ± 80.56640625 MHz AC-LVPECL
Output Spectrum With PLL Bandwidth at 400 kHz, Fractional
N PLL, 50-MHz Crystal Input, 5.15625-GHz VCO Frequency,
Post Divider = 8, Output Divider = 4
10
0
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
80
100
120
140
160
180
200
220
240
80
100
120
140
160
180
200
220
240
Frequency (MHz)
Frequency (MHz)
D017
D018
Figure 15. 161.1328125 ± 80.56640625 MHz AC-LVDS Output
Spectrum With PLL Bandwidth at 400 kHz, Fractional N PLL,
50-MHz Crystal Input, 5.15625-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
Figure 16. 161.1328125 ± 80.56640625 MHz AC-CML Output
Spectrum With PLL Bandwidth at 400 kHz, Fractional N PLL,
50-MHz Crystal Input, 5.15625-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
10
0
1.7
1.6
1.5
1.4
1.3
1.2
1.1
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
80
100
120
140
160
180
200
220
240
0
200
400
600
800
1000
Frequency (MHz)
Output Frequency (MHz)
D019
D020
Figure 17. 161.1328125 ± 80.56640625 MHz HCSL Output
Spectrum With PLL Bandwidth at 400 kHz, Fractional N PLL,
50-MHz Crystal Input, 5.15625-GHz VCO Frequency, Post
Divider = 8, Output Divider = 4
Figure 18. AC-LVPECL Differential Output Swing vs
Frequency
Copyright © 2015–2018, Texas Instruments Incorporated
21
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Characteristics (continued)
0.9
1.3
1.25
1.2
0.8
0.7
0.6
0.5
1.15
1.1
1.05
1
0.95
0.9
0
200
400
600
800
1000
0
200
400
600
800
1000
Output Frequency (MHz)
Output Frequency (MHz)
D021
D022
Figure 19. AC-LVDS Differential Output Swing vs Frequency
Figure 20. AC-CML Differential Output Swing vs Frequency
1.5
2
1.45
1.4
1.9
1.8
1.7
1.6
1.35
1.3
0
100
200
300
400
0
50
100
150
200
Output Frequency (MHz)
Output Frequency (MHz)
D023
D024
Figure 21. HCSL Differential Output Swing vs Frequency
Figure 22. 1.8-V LVCMOS (on OUT[7:0]) Output Swing vs
Frequency
3.5
3.4
3.3
3.2
3.1
3
2.9
0
50
100
150
200
Output Frequency (MHz)
D025
Figure 23. 3.3-V LVCMOS (on STATUS[1:0]) Output Swing vs Frequency
22
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
9 Parameter Measurement Information
9.1 Test Configurations
This section describes the characterization test setup of each block in the LMK03318.
High impedance probe
LVCMOS
LMK03318
Oscilloscope
2 pF
Figure 24. LVCMOS Output DC Configuration During Device Test
Phase Noise/
LVCMOS
LMK03318
Spectrum
Analyzer
Figure 25. LVCMOS Output AC Configuration During Device Test
High impedance differential probe
AC-LVPECL,
LMK03318
AC-LVDS,
AC-CML
Oscilloscope
Figure 26. AC-LVPECL, AC-LVDS, AC-CML Output DC Configuration During Device Test
High impedance differential probe
HCSL
LMK03318
Oscilloscope
HCSL
50 ꢀ
50 ꢀ
Figure 27. HCSL Output DC Configuration During Device Test
AC-LVPECL, AC-LVDS, AC-CML
Phase Noise/
Spectrum
Analyzer
Diff-to-SE
Balun/Buffer
LMK03318
AC-LVPECL, AC-LVDS, AC-CML
Figure 28. AC-LVPECL, AC-LVDS, AC-CML Output AC Configuration During Device Test
Copyright © 2015–2018, Texas Instruments Incorporated
23
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Test Configurations (continued)
HCSL
Phase Noise/
Spectrum
Analyzer
Balun
LMK03318
HCSL
50 ꢀ
50 ꢀ
Figure 29. HCSL Output AC Configuration During Device Test
PRI_REF
LVCMOS
Signal
Generator
LMK03318
Offset = VDD_IN/2
Figure 30. LVCMOS Primary Input DC Configuration During Device Test
125 ꢀ
SEC_REF
LVCMOS
Signal
LMK03318
Generator
Offset = VDD_IN/2
375 ꢀ
Figure 31. LVCMOS Secondary Input DC Configuration During Device Test
Signal
Generator
LMK03318
100 ꢀ
LVDS
Figure 32. LVDS Input DC Configuration During Device Test
Signal
Generator
LVPECL
LMK03318
50 ꢀ
50 ꢀ
VDD_IN - 2
Figure 33. LVPECL Input DC Configuration During Device Test
24
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Test Configurations (continued)
50 ꢀ
Signal
Generator
LMK03318
HCSL
50 ꢀ
Figure 34. HCSL Input DC Configuration During Device Test
Signal
Generator
Differential
LMK03318
100 ꢀ
Figure 35. Differential Input AC Configuration During Device Test
Crystal
LMK03318
Figure 36. Crystal Reference Input Configuration During Device Test
Sine wave
Modulator
Power Supply
Phase Noise/
Spectrum
Analyzer
Signal
Generator
LMK03318
Device Output
Balun
Reference
Input
Figure 37. PSNR Test Setup
Copyright © 2015–2018, Texas Instruments Incorporated
25
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Test Configurations (continued)
OUTx_P
OUTx_N
VOD
80%
VOUT,DIFF,PP = 2 x VOD
0 V
20%
tR
tF
Figure 38. Differential Output Voltage and Rise/Fall Time
80%
VOUT,SE
OUT_REFx/2
20%
tR
tF
Figure 39. Single-Ended Output Voltage and Rise/Fall Time
OUTx_P
OUTx_N
OUTx_P
OUTx_N
Differential
tSK,DIFF,INT
Differential
tSK,SE-DIFF,INT
OUTx_P/N
Single Ended
tSK,SE,INT
OUTx_P/N
Single Ended
Figure 40. Differential and Single-Ended Output Skew
26
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10 Detailed Description
10.1 Overview
The LMK03318 generates eight outputs with less than 0.2 ps, rms maximum random jitter in integer PLL mode
and less than 0.35 ps, rms maximum random jitter in fractional PLL mode with a crystal input or a clean external
reference input.
10.2 Functional Block Diagram
C2
VCC (x4)
3.3 V
VCCO (x6)
1.8 / 2.5 / 3.3 V
LF
Power Conditioning
Outputs
SYNC
Inputs
REFSEL
PRIREF
OUT0
OUT1
Integer Div
8-b
R Div
3-b
PLL
x1, x2
x1, x2
M Div
5-b
/2, /3, /4,
/5, /6, /7, /8
¥
OUT2
OUT3
SECREF
XO
Integer Div
8-b
VCO: 4.8 GHz ~ 5.4 GHz
N Div
MARGIN
∑û fractional
0
1
2
Integer Div
8-b
OUT4
OUT5
0
1
2
Integer Div
8-b
/4, /5
0
1
2
Integer Div
8-b
Control
Registers
OUT6
OUT7
Integer Div
/6 - /256
SYNC
EEPROM
SDA od
0
1
2
Integer Div
8-b
SCL od
PDN
Device Control
and Status
GPIO[5:0]
3
STATUS1
STATUS0
3
= 3-level input
CAP (x3)
od = open-drain
3.3-V LVCMOS
Copyright © 2016, Texas Instruments Incorporated
NOTE
Input and control blocks are compatible with 1.8 V, 2.5 V, or 3.3 V I/O voltage levels.
Copyright © 2015–2018, Texas Instruments Incorporated
27
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.3 Feature Description
10.3.1 Device Block-Level Description
The LMK03318 includes an on-chip fractional PLL with integrated VCO that supports a frequency range of 4.8
GHz to 5.4 GHz. The PLL block consists of an input selection MUX, a phase frequency detector (PFD), charge
pump, on-chip passive loop filter that only needs an external capacitor to ground, a feedback divider that can
support both integer and fractional values, and a delta-sigma engine for spur suppression in fractional PLL mode.
The universal inputs support single-ended and differential clocks in the frequencies of 1 MHz to 300 MHz; the
secondary input additionally supports crystals in the frequencies of 10 MHz to 52 MHz. When the PLL operates
with the crystal as its reference, the output frequencies can be margined based on changing the on-chip
capacitor loading on each leg of the crystal. Completing the device is the combination of integer output dividers
and universal output buffers. The PLL is powered by on-chip low dropout (LDO) linear voltage regulators, and the
regulated supply network is partitioned such that the sensitive analog supplies are running from separate LDOs
than the digital supplies which use their own LDO. The LDOs provide isolation of the isolation of the PLL from
any noise in the external power supply rail with a PSNR of better than –70 dBc at 50-kHz to 1-MHz ripple
frequencies at 1.8-V output supplies and better than –80 dBc at 50-kHz to 1-MHz ripple frequencies at > 2.5-V
output supplies. The regulator capacitor pins must each be connected to ground by 10-µF capacitors to ensure
stability.
10.3.2 Device Configuration Control
Figure 41 shows the relationships between device states, the configuration pins, device initialization and
configuration, and device operational modes. In hard-pin-configuration mode, the state of the configuration pins
determines the configuration of the device as selected from all device states programmed in the on-chip ROM. In
soft-pin-configuration mode, the state of the configuration pins determines the initialized state of the device as
programmed in the on-chip EEPROM. In either mode, the host can update any device configuration after the
device enables the host interface and the host writes a sequence that updates the device registers. Once the
device configuration is set, the host can also write to the on-chip EEPROM for a new set of power-up defaults
based on the configuration pin settings in the soft-pin-configuration mode. A system may transition a device from
hard-pin mode to soft-pin mode by changing the state of the HW_SW_CTRL pin, then triggering a device power
cycling via the PDN pin. In reset mode, the device disables the outputs so that unwanted sporadic activity
associated with device initialization does not appear on the device outputs. Table 2 lists the functionality of the
GPIO[5:0] pins during hard pin and soft pin modes.
28
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Feature Description (continued)
Power-on Internal Reset Pulse
or PDN Pin
0
1
Sample HW_SW_CTRL
GPIO[5] is multi-state; GPIO[4]
and GPIO[0] are 2-state;
GPIO[3:1] are 3-state
GPIO[5:0] are 2-state
Hard pin mode
Soft pin mode
I2C enabled.
I2C is still enabled, LSB of I2C
address is 00
Sample GPIO[5:0] for selecting 1 of 64
pre-defined ROM settings
Sample
GPIO[3:2]
Sample GPIO1
GPIO[3:2] selects PLL and output types/divider/source
for up to 6 EEPROM configurations. Leaving the pins
floating bypasses EEPROM loading and register defaults
are loaded. GPIO[5] selects one of eight crystal
frequency margining offset settings and GPIO[4]
enables/disables crystal frequency margining control.
GPIO1
determines 1 of 3
I2C Addresses
Save desired
configuration
into the
corresponding
EEPROM page
User can operate from EEPROM loaded configurations or reprogram
the device register via I2C
Figure 41. LMK03318 Simplified Programming Flow
Table 2. GPIO Pin Mapping for Hard Pin Mode and Soft Pin Mode
PIN NAME
HARD-PIN MODE
FUNCTION
SOFT-PIN MODE
FUNCTION
STATE
STATE
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
ROM page select for hard pin
mode
2
2
2
2
2
2
Output synchronization (active low)
I2C slave address LSB select
2
3
3
3
2
8
EEPROM page select for soft pin mode
or register default mode
Frequency margining enable
Frequency margining offset select
10.3.2.1 Hard-Pin Mode (HW_SW_CTRL = 1)
In this mode, the GPIO[5:0] pins allow hardware pin configuration of the PLL synthesizer, its input clock
selection, and output frequency and type selection. I2C is still enabled, and the LSB of device address is set to
00 . The GPIO pins are 2-state and are sampled or latched at POR — the combination selects one of 64 page
settings that are predefined in on-chip ROM. In this mode, automatic output divider and PLL post divider
synchronization is performed on power up or upon toggling PDN. Table 14, Table 15, Table 17, and Table 18
show the predefined ROM configurations according to the GPIO[5:0] pin settings.
Copyright © 2015–2018, Texas Instruments Incorporated
29
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Following are the blocks that are configured by the GPIO[5:0] pins.
10.3.2.1.1 PLL Block
Sets the PLL synthesizer frequency and loop bandwidth by configuring registers related to the PLL dividers, input
frequency doubler, and PLL power down.
10.3.2.1.2 Output Buffer Auto Mute
When the selected source of an output MUX is invalid (for example, the PLL is unlocked or selected reference
input is not present), the individual output mute controls will determine output mute state per the ROM default
settings (CH_x_MUTE=0x1, CHx_MUTE_LVL=0x3):
1. In differential mode, the positive output node is driven to the internal regulator output voltage rail (when AC
coupled to load), and the negative output node is driven to the GND rail.
2. In LVCMOS mode, a DC connection to the receiver is assumed, so the output in a “mute” condition will be
forced LOW.
10.3.2.1.3 Input Block
The input block sets the input type for primary and secondary inputs, selects input MUX type for the PLL, and
selects R divider value for primary input to the input MUX.
10.3.2.1.4 Channel Mux
The channel mux controls the channel mux selection for each channel.
10.3.2.1.5 Output Divider
The output divider sets the 8-bit output divide value for each channel (/1 to /256).
10.3.2.1.6 Output Driver Format
The output driver format selects the output format for each driver pair, or disable channel.
10.3.2.1.7 Status MUX, Divider and Slew Rate
These blocks select the status pins as either 3.3-V LVCMOS PLL clock outputs or status outputs. When
configured as LVCMOS clock outputs, these blocks select divider values and rise/fall time settings.
10.3.2.2 Soft-Pin Programming Mode (HW_SW_CTRL = 0)
In this mode, I2C is enabled and GPIO[3:2] are purposed as 3-state pins (tied to VDD_DIG, GND or VIM) and are
used to select one of 6 EEPROM pages and one register default setting (2 of 9 states are invalid). GPIO[0] is
also purposed as a 2-state output synchronization (active-low SYNCN) function, GPIO[1] is now purposed as a
3-state I2C address function to change last 2 bits of I2C address (ADD; 0x0 is GND, 0x1 is VIM, and 0x3 is
VDD_DIG). GPIO[5] is purposed as a multi-state input for the MARGIN function and GPIO[4] is purposed as an
input that enables or disables hardware margining. The GPIO pins are sampled and latched at POR.
NOTE
No software reset or power cycling must occur during EEPROM programming or else it
will be corrupted. Please refer to Programming for more details on the EEPROM
programming.
GPIO[3:2] allows hardware pin configuration for the PLL synthesizers, their respective input clock selection
modes, the crystal input frequency margining option, all output channel blocks, comprised of channel muxes,
dividers, and output drivers. The GPIO inputs[3:2] are sampled and latched at power-on reset (POR), and select
one of 6 EEPROM pages, which are custom-programmable. When GPIO[3:2] are left floating, EEPROM is not
used, and the hardware register default settings are loaded. Table 10, Table 11, Table 12 and Table 13 show the
predefined EEPROM configurations according to the GPIO[3:2] pin settings.
The following sections give a brief overview of the register settings for each block configured by the GPIO[3:2]
pin modes.
30
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.3.2.2.1 Device Config Space
An 8-b for unique identifier programmed to EEPROM that can be used to distinguish between each EEPROM
page.
10.3.2.2.2 PLL Block
The PLL block sets the PLL synthesizer frequency and loop bandwidth by configuring registers related to the PLL
dividers, input frequency doubler, and PLL power down.
10.3.2.2.3 Output Buffer Auto Mute
When the selected source of an output MUX is invalid (for example, the PLL is unlocked or selected reference
input is not present), the individual output mute controls determine output mute state per the EEPROM default
settings (CH_x_MUTE=0x1, CHx_MUTE_LVL=0x3):
1. In differential mode, the positive output node is driven to the internal regulator output voltage rail (when AC
coupled to load), and the negative output node is driven to the GND rail.
2. In LVCMOS mode, assuming there is a DC connection to the receiver, the output in a mute condition is
forced LOW.
10.3.2.2.4 Input Block
The input block sets the input type for primary and secondary inputs, selects input MUX type for the PLL and
selects R divider value for primary input to the input MUX.
10.3.2.2.5 Channel Mux
The channel mux controls the channel mux selection for each channel.
10.3.2.2.6 Output Divider
The output divider sets the 8-bit output divide value for each channel (/1 to /256).
10.3.2.2.7 Output Driver Format
The output driver format selects the output format for each driver pair, or disables channel.
10.3.2.2.8 Status MUX, Divider and Slew Rate
These blocks select the status pins as either 3.3-V LVCMOS PLL clock outputs or status outputs. When
configured as LVCMOS clock outputs, these blocks select divider values and rise/fall time settings.
10.3.2.3 Register File Reference Convention
Figure 42 shows the method that this document employs to refer to an individual register bit or a grouping of
register bits. If a drawing or text references an individual bit the format is to specify the register number first and
the bit number second. The LMK03318 contains 124 registers that are 8 bits wide. The register addresses and
the bit positions both begin with the number zero (0). A period separates the register address and bit address.
The first bit in the register file is address ‘R0.0’ meaning that it is located in Register 0 and is bit position 0. The
last bit in the register file is addressR31.7 referring to the 8th bit of register address 31 (the 32nd register in the
device). Figure 42 lists specific bit positions as a number contained within a box. A box with the register address
encloses the group of boxes that represent the bits relevant to the specific device circuitry in context.
Reg5
Bit Number (s)
Register Number (s)
5
4
3
2
Figure 42. LMK03318 Register Reference Format
Copyright © 2015–2018, Texas Instruments Incorporated
31
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.4 Device Functional Modes
The PLL in LMK03318 can be configured to accommodate various input and output frequencies either through
I2C programming interface or in the absence of programming, the PLL can be configured by the ROM page,
EEPROM page, or register default settings selected through the control pins. The PLL can be configured by
setting its Smart Input MUX, Reference Divider, PLL Loop Filter, Feedback Divider, Prescaler Divider and Output
Dividers.
For the PLL to operate in closed-loop mode, the following condition in Equation 1 has to be met when using
primary input or secondary input for the reference clock (FREF).
FVCO = (FREF/R) × D × [(INT + NUM/DEN)/M]
where
•
•
•
•
•
•
•
•
FVCO: PLL/VCO Frequency
FREF: Frequency of selected reference input clock
D: PLL input frequency doubler, 1=Disabled, 2=Enabled
INT: PLL feedback divider integer value (12 bits, 1 to 4095)
NUM: PLL feedback divider fractional numerator value ( 22 bits, 0 to 4194303)
DEN: PLL feedback divider fractional denominator value ( 22 bits, 1 to 4194303)
R: Primary reference divider value (3 bits, 1 to 8); R = 1 for secondary reference
M: PLL reference input divider value (5 bits, 1 to 32)
(1)
The output frequency is related to the PLL/VCO frequency or the reference input frequency (based on the output
MUX selection) as given in Equation 2 and Equation 3:
FOUT = FREF when reference input clock selected by OUTMUX
FOUT = FVCO / (P × OUTDIV) when PLL is selected by OUTMUX
(2)
where
•
•
OUTDIV: Output divider value (8 bits, 1 to 256)
P: PLL post-divider value (2, 3, 4, 5, 6, 7, 8)
(3)
10.4.1 Smart Input MUX
The PLL has a Smart Input MUX. The input selection mode of the PLL can be configured using the 3-state
REFSEL pin or programmed through I2C. The Smart Input MUX supports auto-switching and manual-switching
using control pin (or through register). The Smart Input MUX is designed such that glitches created during
switching in both auto and manual modes are suppressed at the MUX output.
In the automatic mode, the frequencies of both primary (PRIREF) and secondary (SECREF) input clocks have to
be within 2000 ppm. The phase of the input clocks can be any. To minimize phase jump at the output, TI
recommends setting very low PLL loop bandwidth, set R29.7 = 1 and R51.7 = 1; the outputs that are not muted
should have its respective mute bypass bit in R20 and R21 be set to 0 to ensure that these outputs are available
during an input switchover event. In the case that the primary reference is detected to be unavailable, the input
MUX automatically switches from the primary reference to the secondary reference. When primary reference is
detected to be available again, the input MUX switches back to the primary reference. When both primary and
secondary references are detected as unavailable, the input MUX waits on secondary reference until either the
primary or the secondary reference is detected as available again. When both the primary and secondary
reference inputs are detected as unavailable, LOS is active, and the PLL outputs are automatically disabled. The
timing diagram of an auto-switch at the input MUX is shown in Figure 43.
PRI_REF
SEC_REF
1
2
3
4
1
2
Internal
Reference Clock
Figure 43. Smart Input MUX Auto-Switch Mode Timing Diagram
32
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Device Functional Modes (continued)
R50[1-0] are the register bits that control the smart input MUX for the PLL and can be programmed through I2C.
Table 3 shows the input clock selection options for the PLL that are supported by the REFSEL pin or through I2C
programming.
Table 3. Input Clock Selection Through I2C Programming or REFSEL Pin
R50.1
R50.0
REFSEL
MODE
Automatic
Manual
PLL REFERENCE
PLL prefers primary
PLL selects primary
PLL selects secondary
PLL prefers primary
PLL selects primary
PLL selects secondary
0
0
0
0
1
1
0
1
1
1
0
1
X
0
VIM
1
Manual
Automatic
Manual
X
X
Manual
For those applications requiring device start-up from a crystal on the secondary input, do a one-time-only
switchover to the primary input once available and, when auto-switch on the PLL's smart MUX is enabled, R51.2
can be set to 0 which automatically disables the secondary crystal input path after switchover to the primary input
is complete. This removes coupling between the primary and secondary inputs and prevents input crosstalk
components from appearing at the outputs. However, if the auto-switch between primary and secondary is
desired at any point of normal device operation, R51.2 must be set to 1, PLL must be set to a very low loop
bandwidth, and R20, R21, and R22 must be set to 0x0 to ensure minimal phase hit once PLL is relocked after
switchover to either primary or secondary inputs. Figure 44 shows flowchart of events triggered when R51.2 is
set to 1 or 0 .
Copyright © 2015–2018, Texas Instruments Incorporated
33
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
no
Is PLL‘s SMARTMUX set to
Auto Select?
yes
R51.2
1
0
Single auto-switch event
Multiple auto-switch event
Startup from XTAL (SECREF)
Startup from XTAL (SECREF)
PLL locked to SECREF
PLL locked to SECREF
no
no
Is PRIREF
Valid?
Is PRIREF
Valid?
SECREF turned on
Auto switch to SECREF
PLL unlocked momentarily
(~ ms) and large phase hit
Auto switch to SECREF
Minimal phase hit during
auto switch
yes
yes
Auto switch to PRIREF
SECREF turned off
Auto switch to PRIREF
SECREF left on
no
no
PLL locked to PRIREF
PLL locked to PRIREF
No impact to phase noise/spurs from freq
difference between PRIREF and SECREF
since SECREF is turned off
Onus on customer to minimize freq
difference between PRIREF and SECREF
Otherwise phase noise/spur impact
yes
yes
Is PRIREF
Valid?
Is PRIREF
Valid?
Figure 44. Flowchart Describing Events When R51.2 is Set to 0 or 1
34
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.4.2 Universal Input Buffer (PRI_REF, SEC_REF)
The primary reference can support differential or single-ended clocks. The secondary reference can support
differential or single-ended clocks or crystal. The differential input buffers on both primary and secondary support
internal 50 Ω to ground or 100 Ω termination between P and N followed by on-chip AC-coupling capacitors to
internal self-biased circuitry. Internal biasing is offered before the on-chip AC-coupling capacitors when the clock
inputs are AC coupled externally, and this is enabled by setting R29.0 = 1 (for primary reference) or R29.1 = 1
(for secondary reference). When the clock inputs are DC coupled, the internal biasing before the on-chip AC-
coupling capacitors is disabled by settings R29.0 = 0 (for primary reference) or R29.1 = 0 (for secondary
reference). Figure 45 shows the differential input buffer termination options implemented on both primary and
secondary and the switches (SWLVDS, SWHCSL, SWAC) are controlled by R29[5-0]. Table 4 shows the primary
and secondary buffer configuration matrix for LVPECL, CML, LVDS, HCSL and LVCMOS inputs.
LMK03318
Differential Input Control
7 pF
PRIREF_P /
SECREF_P
SWHCSL
R29.4,
R29.5
50 ꢀ
SWAC
R29.0,
R29.1
SWLVDS
R29.2,
R29.3
Vbb = 1.8 V
(weak bias)
50 ꢀ
PRI_REF / SEC_REF
SWAC
R29.0,
R29.1
50 ꢀ
PRIREF_N /
SECREF_N
SWHCSL
R29.4,
R29.5
7 pF
50 ꢀ
R29
5
4
3
2
1
0
Copyright © 2017, Texas Instruments Incorporated
Figure 45. Differential Input Buffer Termination Options on Primary and Secondary Reference
Table 4. Input Buffer Configuration Matrix on Primary and/or Secondary Reference(1)
R50.5 / R50.7 R50.4 / R50.6 R29.4 / R29.5 R29.2 / R29.3 R29.0 / R29.1
MODE
EXTERNAL TERMINATIO
BIASING
COUPLING
N
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
HCSL
LVDS
AC
AC
AC
AC
Internal
Internal
Internal
Internal
Internal
Internal
Internal
Internal
LVPECL
CML
(1) When termination is set to External, internal on-chip termination of LMK03318 should be disabled.
Copyright © 2015–2018, Texas Instruments Incorporated
35
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 4. Input Buffer Configuration Matrix on Primary and/or Secondary Reference() (continued)
R50.5 / R50.7 R50.4 / R50.6 R29.4 / R29.5 R29.2 / R29.3 R29.0 / R29.1
MODE
EXTERNAL TERMINATIO
BIASING
COUPLING
N
0
0
0
0
0
1
1
1
1
0
1
0
0
0
0
0
1
0
0
0
0
0
0
0
0
HCSL
LVDS
DC
DC
DC
DC
DC
Internal
Internal
External
External
N/A
External
External
External
External
N/A
LVPECL
CML
LVCMOS
Figure 46 through Figure 55 show recommendations for interfacing primary or secondary inputs of the
LMK03318 with LVCMOS, LVPECL, LVDS, CML and HCSL drivers, respectively.
NOTE
The secondary reference accepts up to 2.6-V maximum swing when LVCMOS input
option is selected.
RS
PRI_REF
LVCMOS
3.3-V LVCMOS
Driver
LMK03318
Figure 46. Interfacing LMK03318 Primary Input With 3.3-V LVCMOS Signal
125 ꢀ
RS
SEC_REF
LVCMOS
3.3-V LVCMOS
Driver
LMK03318
375 ꢀ
Figure 47. Interfacing LMK03318 Secondary Input With 3.3-V LVCMOS Signal
LVPECL
Driver
LVPECL
LMK03318
50 ꢀ
50 ꢀ
VDDO - 2
Figure 48. DC-Coupling LMK03318 Inputs With LVPECL Signal
LMK03318
100 ꢀ
LVDS Driver
LVDS
Figure 49. DC-Coupling LMK03318 Inputs With LVDS Signal
36
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
CML
Driver
CML
LMK03318
Figure 50. DC-Coupling LMK03318 Inputs With CML Signal
50 ꢀ
HCSL
Driver
LMK03318
HCSL
50 ꢀ
Figure 51. DC-Coupling LMK03318 Inputs With HCSL Signal
LVPECL Driver
LVPECL
LMK03318
100 ꢀ
RPD
RPD
Figure 52. AC-Coupling LMK03318 Inputs With LVPECL Signal (Internal Biasing Enabled)
LMK03318
100 ꢀ
LVDS Driver
LVDS
Figure 53. AC-Coupling LMK03318 Inputs With LVDS Signal (Internal Biasing Enabled)
CML
Driver
LMK03318
CML
100 ꢀ
Figure 54. AC-Coupling LMK03318 Inputs With CML Signal (Internal Biasing Enabled)
50 ꢀ
HCSL
Driver
LMK03318
HCSL
100 ꢀ
50 ꢀ
Figure 55. AC-Coupling LMK03318 Inputs With HCSL Signal (Internal Biasing Enabled)
Copyright © 2015–2018, Texas Instruments Incorporated
37
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.4.3 Crystal Input Interface (SEC_REF)
The LMK03318 implements an input crystal oscillator circuitry, known as the Pierce oscillator, shown in
Figure 56. It is enabled when R50.7, R50.6, and R29.1 are set to 1, 0, and 1 respectively. The crystal oscillator
circuitry includes programmable on-chip capacitances on each leg of the crystal and a damping resistor intended
to minimize over-driven condition of the crystal. The recommended oscillation mode of operation for the input
crystal is fundamental mode, and the recommended type of circuit for the crystal is parallel resonance with low or
high pull-ability.
A crystal’s load capacitance refers to all capacitances in the oscillator feedback loop. It is equal to the amount of
capacitance seen between the terminals of the crystal in the circuit. For parallel resonant mode circuits, the
correct load capacitance is necessary to ensure the oscillation of the crystal within the expected parameters. The
LMK03318 has been characterized with 9 pF parallel resonant crystals with maximum motional resistance of 30
Ω and maximum drive level of 300 µW.
The normalized frequency error of the crystal, due to load capacitance mismatch, can be calculated as
Equation 4:
CS
CS
Dƒ
ƒ
=
-
2(CL,R + C0 ) 2(CL,A + C0 )
where
•
•
•
•
•
•
CS is the motional capacitance of the crystal
C0 is the shunt capacitance of the crystal
CL,R is the rated load capacitance for the crystal
CL,A is the actual load capacitance in the implemented PCB for the crystal
Δƒ is the frequency error of the crystal
ƒ is the rated frequency of the crystal.
(4)
The first 3 parameters can be obtained from the crystal vendor.
SECREF_P
SECREF_N
LMK03318
Crystal Input Control
500 ꢀ
Con-chip
Con-chip
R50
R86
R93
R98
R87
R94
R90
R95
R91
R96
R92
R97
7
6
R99 R100 R101 R102
R29
1
R103 R104 R105 R106
Figure 56. Crystal Input Interface on Secondary Reference
38
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
If reducing frequency error of the crystal is of utmost importance, a crystal with low pullability should be used. If
frequency margining or frequency spiking is desired, a crystal with high pullability should be used to ensure that
the desired frequency offset is added to the nominal oscillation frequency. A total of ±50 ppm pulling range is
obtained with a crystal whose ratio of shunt capacitance to motional capacitance (C0/C1) is no more than 250.
The programmable capacitors on LMK03318 can be tuned from 14 pF to 24 pF in steps of 14 fF using either an
analog voltage on GPIO5 in soft pin mode or through I2C in soft pin or hard pin mode. When using crystals with
low pullability, the preferred method is to program R86.3 = 1, R86.2 = 0, and program the appropriate binary
code to R104 and R105, in this exact order, that sets the required on-chip load capacitance for least frequency
error. GPIO4 pin must be tied to VDD, and GPIO5 pin should be floating when device is operating in soft-pin
mode. Table 4 shows the binary code for on-chip load capacitance on each leg of crystal.
When using crystals with high pullability, the same method as above can be repeated for setting a fixed
frequency offset to the nominal oscillation frequency according to Equation 4. In case of a closed loop system
where the crystal frequency can be dynamically changed based on a control signal, the LMK03318 must operate
in soft-pin mode, the R86.3 must be programmed to 0, and the R86.2 must be programmed to 1. The GPIO5 pin
is now configured as an 8-level input with a full-scale range of 0 V to 1.8 V, and every 200 mV corresponds to a
frequency change according to Equation 4. There are three possibilities to enable margining feature with GPIO5:
•
•
Programming R86.3 = 0 and R86.2 = 1. In this case, status of GPIO4 pin is ignored.
When R86.3 = 0 and R86.2 = 0 is programmed, GPIO4 must be tied to GND. Tying GPIO4 to VDD disables
GPIO5 for margining purposes and R94 and R95 determine the on-chip load capacitance for the crystal. If
any frequency offset is desired at the output, the appropriate binary code should be programmed to R94 and
R95.
•
When R86.3 = 1 and R86.2 = 0 is programmed, GPIO4 must be tied to GND. Tying GPIO4 to VDD disables
GPIO5 for margining purposes and R104 and R105 determine the on-chip load capacitance for the crystal. If
any frequency offset is desired at the output, the appropriate binary code should be programmed to R104 and
R105.
There are two possibilities to drive the GPIO5 pin:
•
The first method is to achieve the desired voltage between 0 V to 1.8 V according to Analog Input
Characteristics (GPIO[5]). The pulldown resistor value sets the voltage on GPIO[5] pin that falls within one of
eight settings whose pre-programmed on-chip crystal load capacitances are set by R88, R89, R90, R91, R92,
R93, R94, R95, R96, R97, R98, R99, R100, R101, R102, and R103.
•
The second method is using a low-pass filtered PWM signal to drive the 8-level GPIO5 pin as shown in
Figure 57. The PWM signal could be generated from the frequency difference between a highly stable TCXO
and the output of LMK03318 that is provided as a feedback into the GPIO5 pin and used to adjust the on-chip
load capacitance on the crystal input to reduce frequency errors from the crystal. This is a quick alternative
that produces a frequency error at the LMK03318's output and could be acceptable to any application when
compared to a full-characterization with a chosen crystal to understand the exact load pulling required to
minimize frequency error at the LMK03318's output. More details on frequency margining are provided in
Application and Implementation.
Copyright © 2015–2018, Texas Instruments Incorporated
39
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
SECREF_P
SECREF_N
LMK03318
Crystal Input Control
500 ꢀ
PWM
GPIO5
Con-chip
Con-chip
DSP
Low Pass
Filter
Figure 57. Crystal Load Capacitance Compensation Using PWM Signal
The incremental load capacitance for each step should be programmed to R88, R89, R90, R91, R92, R93, R94,
R95, R96, R97, R98, R99, R100, R101, R102, and R103 according to the chosen crystal's trim sensitivity
specifications. The least-significant bit programmed to any of the XO offset register corresponds to a load
capacitance delta of about 0.02 pF on the crystal input pins.
Good layout practices are fundamental to the correct operation and reliability of the oscillator. It is critical to
locate the crystal components very close to the SECREF_P and SECREF_N pins to minimize routing distances.
Long traces in the oscillator circuit are a very common source of problems. Don’t route other signals across the
oscillator circuit, and make sure power and high-frequency traces are routed as far away as possible to avoid
crosstalk and noise coupling. If drive level of the crystal should be reduced, a damping resistor (less than 500 Ω)
should be accommodated in the layout between the crystal leg and SECREF_P pin. Vias in the oscillator circuit
are recommended primarily for connections to the ground plane. Don’t share ground connections; instead, make
a separate connection to ground for each component that requires grounding. If possible, place multiple vias in
parallel for each connection to the ground plane. The layout must be designed to minimize stray capacitance
across the crystal to less than 2 pF total under all circumstances to ensure proper crystal oscillation.
10.4.4 Reference Doubler
The primary and secondary references each have a frequency doubler that can be enabled by programming
R57.4 = 1 for the primary reference and R72.4 = 1 for the secondary reference. Enabling the doubler allows a
higher comparison frequency for the PLL and results in a 3-dB reduction in the in-band phase noise of the
LMK03318 device’s outputs. However, enabling the doubler poses the requirement of less than 0.5% duty cycle
distortion of its reference input to minimize high spurious signals in the LMK03318’s outputs. If the reference
input duty cycle is requirement is not met, the higher order loop filter components (R3 and C3) of the PLL can be
used to suppress the reference input spurs.
10.4.5 Reference Divider (R)
The reference (R) divider is a continuous 3-b counter that is present on the primary reference before the smart
input MUX of the PLL. The output of the R divider sets the input frequency for the smart input MUX and the auto
switch capability of the smart input MUX can then be employed as long as the secondary input frequency is no
more than 2000 ppm different from the output of the R divider, which is programmed in R52 for the PLL.
40
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.4.6 Input Divider (M)
The input (M) divider is a continuous 5-b counter that is present after the smart input MUX of the PLL. The output
of the M divider sets the PFD frequency to the PLL and should be in the range of 1 MHz to 150 MHz. The M
divider is programmed in R53 for the PLL.
10.4.7 Feedback Divider (N)
The N divider of the PLL includes fractional compensation and can achieve any fractional denominator (DEN)
from 1 to 4,194,303. The integer portion, INT, is the whole part of the N divider value and the fractional portion,
NUM / DEN, is the remaining fraction. N, NUM, and DEN are programmed in R58, R59, R60, R61, R62, R63,
R64, and R65 for the PLL. The total programmed N divider value, N, is determined by: N = INT + NUM / DEN.
The output of the N divider sets the PFD frequency to the PLL and should be in the range of 1 MHz to 150 MHz.
10.4.8 Phase Frequency Detector (PFD)
The PFD of the PLL takes inputs from the input divider output and the feedback divider output and produces an
output that is dependent on the phase and frequency difference between the two inputs. The allowable range of
frequencies at the inputs of the PFD is from 1 MHz to 150 MHz.
10.4.9 Charge Pump
The PLL has charge pump slices of 0.4 mA, 0.8 mA, 1.6 mA, or 6.4 mA. These slices can be selected in the
following combinations to vary the charge pump current from 0.4 mA to 6.4 mA by programming R57[3-0] for the
PLL.
10.4.10 Loop Filter
The PLL supports programmable loop bandwidth from 200 Hz to 1 MHz. The loop filter components, R2, C1, R3,
and C3, can be configured by programming R67, R68, R69, and R70 for the PLL. C2 for the PLL is an external
component that is added on the LF pin. When the PLL is configured in the fractional mode, R69.0 should be set
to 1 and R118[2-0] should be set to 0x7. When the PLL is configured in integer mode, R69.0 should be set to 0
and R118[2-0] should be set to 0x3 for second-order (NOTE: R69 should be set to 0x0) or 0x7 for third-order,
respectively. When the PLL's loop bandwidth is desired to be set to 200 Hz, R120.0 should be set to 0. Figure 58
shows the loop filter structure of the PLL.
It is important to set the PLL to best possible bandwidth to minimize output jitter. A high bandwidth (≥ 100 kHz)
provides best input signal tracking and is therefore desired with a clean input reference (clock generator mode).
A low bandwidth (≤ 1 kHz) is desired if the input signal quality is unknown (jitter cleaner mode). TI provides the
WEBENCH Clock Architect that makes it easy to select the right loop filter components.
Copyright © 2015–2018, Texas Instruments Incorporated
41
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
C2
LF
LMK03318
R2
R3
From PFD /
Charge Pump
>>
>>
C3
C1
Loop Filter Control
R67 R68 R69 R70
Figure 58. Loop Filter Structure of PLL
10.4.11 VCO Calibration
The PLL of the LMK03318 includes an LC VCO that is designed using high-Q monolithic inductor to oscillate
between 4.8 GHz and 5.4 GHz and has low phase-noise characteristics. The VCO must be calibrated to ensure
that the clock outputs deliver optimal phase noise performance. Fundamentally, a VCO calibration establishes an
optimal operating point within the tuning range of the VCO. While transparent to the user, the LMK03318 and the
host system perform the following steps comprising a VCO calibration sequence:
1. Normal Operation - When the LMK03318 is in normal (operational) mode, the state of the power-down pin
(PDN) is high.
2. Entering the reset state - If the user wishes to initialize the selected pin mode default settings (from ROM,
EEPROM, or register default) and initiate a VCO calibration sequence, then the host system must place the
device in reset through the PDN pin, or through software reset (R12.7) through I2C, or by removing and
restoring device power. Pulling the PDN pin low low or setting R12.7 = 0 places the device in the reset state.
3. Exiting the reset state – The device calibrates the VCO either by exiting the device reset state or through
the device reset command initiated through the host interface. Exiting the reset state occurs automatically
after power is applied and/or the system restores the state of the PDN or R12.7 from the low to high state.
Exiting the reset state using the PDN pin causes the selected pin mode defaults to be loaded/reloaded into
the device register bank. Invoking software reset through R12.7 does not reinitialize the registers; rather, the
device retains settings related to the current clock frequency plan. Using this method allows for a VCO
calibration for a frequency plan other than the default state (that is,. the device calibrates the VCO based on
the settings current register settings). The nominal state of this bit is high. Writing this bit to a low state and
then returning it to the high state invokes a device reset without restoring the pin mode.
4. Device stabilization – After exiting the reset state as described in Step 3, the device monitors internal
voltages and starts a reset timer. Only after internal voltages are at the correct level and the reset time has
expired will the device initiate a VCO calibration. This ensures that the device power supplies and reference
inputs have stabilized prior to calibrating the VCO.
5. VCO Calibration - The LMK03318 calibrates the VCO. During the calibration routine, the device mutes
output channels configured with their respective auto-mute control enabled, so that they generate no
spurious clock signals. After a successful calibration routine, the PLL will lock the VCO to the selected
reference input.
42
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.4.12 Fractional Circuitry
The delta-sigma modulator is a key component of the fractional circuitry and is involved in noise shaping for
better phase noise and spurs in the band of interest. The order of the delta sigma modulator is selectable from
integer mode to third order and can be programmed in R66[1-0] for the PLL. There are also several dithering
modes that are also programmed in R66[3-2] for the PLL.
10.4.12.1 Programmable Dithering Levels
If used appropriately, dithering may be used to reduce sub-fractional spurs, but if used inappropriately, it can
actually create spurs and increase phase noise. Table 5 provides guidelines for the use of dithering based on the
fractional denominator, after the fraction is reduced to lowest terms.
Table 5. Dithering Recommendations
FRACTION
RECOMMENDATION
COMMENTS
Fractional Numerator = 0
Disable Dithering
This is often the worst case for spurs, and can actually be turned into
the best case by disabling dithering. Performance is then similar to
integer mode.
Equivalent Denominator < 20
Disable Dithering
Disable Dithering
Consider Dithering
These fractions are not well randomized and dithering will likely
create phase noise and spurs.
Equivalent denominator is not
divisible by 2 or 3
There will be no sub-fractional spurs, so dithering is likely not to be
very effective.
Equivalent denominator > 200
and is divisible by 2 or 3
Dithering may help reduce the sub-fractional spurs, but understand it
may degrade the PLL phase noise.
10.4.12.2 Programmable Delta Sigma Modulator Order
The programmable fractional modulator order gives the opportunity to better optimize phase noise and spurs.
Theoretically, higher order modulators push out phase noise to farther offsets, as described in Table 6.
Table 6. Delta Sigma Modulator Order Recommendations
ORDER
APPLICATIONS
Integer Mode (Order = 0)
If the fractional numerator is zero, it is best to run the PLL in integer mode to minimize phase
noise and spurs.
First Order Modulator
When the equivalent fractional denominator is 6 or less, the first order modulator theoretically
has lower phase noise and spurs, so it always makes sense in these situations. When the
fractional denoninator is between 6 and about 20, consider using the first order modulator
because the spurs might be far enough outside the loop bandwidth that they will be filtered.
The first order modulator also does not create any sub-fractional spurs or phase noise.
Second and Third Order Modulator
The choice between 2nd and 3rd order modulator tends to be a little more application
specific. If the fractional denominator is not divisible by 3, then the second and third order
modulators will have spurs in the same offsets, so the third is generally better for spurs.
However, if stronger levels of dithering is used, the third order modulator will create more
close-in phase noise than the second order modulator.
Copyright © 2015–2018, Texas Instruments Incorporated
43
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Figure 59 and Figure 60 give an idea of the theoretical impact of the delta sigma modulator order on the shaping
of the phase noise and spurs. In terms of phase noise, this is what one would theoretically expect if strong
dithering was used for a well-randomized fraction. Dithering can be set to different levels or even disabled and
the noise can be eliminated. In terms of spurs, they can change based on fraction, but they will theoretically
pushed out to higher phase detector frequencies. However, one must be aware that these are just
THEORETICAL graphs and for offsets that are less than 5% of the phase detector frequency, other factors can
impact the noise and spurs. In Figure 59, the curves all cross at 1/6th of the phase detector frequency and that
this transfer function peaks at half of the phase detector frequency, which is assumed to be well outside the loop
bandwidth. Figure 60 shows the impact of the phase detector frequency on the modulator noise.
-50
-60
-70
-80
-90
-100
-110
-120
-130
1st Order Modulator
2nd Order Modulator
3rd Order Modulator
-140
-150
1x106 2x106
5x106 1x107 2x107
Offset (Hz)
5x107 1x108 2x108
Figure 59. Theoretical Delta Sigma Noise Shaping for a 100 MHz Phase Detector Frequency
-50
-60
-70
-80
-90
-100
-110
-120
-130
Fpd=10MHz
Fpd=100 MHz
Fpd=200 MHz
-140
-150
1x106 2x106
5x106 1x107 2x107
Offset (Hz)
5x107 1x108 2x108
Figure 60. Theoretical Delta Sigma Noise Shaping for 3rd Order Modulator
10.4.13 Post Divider
Each PLL has a post divider that supports divide-by 2, 3, 4, 5, 6, 7, and 8 from the VCO frequency and
distributed to the output section by programming R56[4-2] for PLL and R71[4-2] for PLL2.
44
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.4.14 High-Speed Output MUX
The output section is made up of four high-speed output MUX’s. Each of the four MUX able to select between
primary reference, secondary reference or the divided PLLclock by programming R37[7-6], R39[7-6], R41[7-6],
and R43[7-6]. Each of the four MUX’s distributes individually to outputs 4, 5, 6, and 7. When reference doubler is
enabled and any output MUX selects that reference input, the output frequency will be the same as the reference
frequency (non-doubled) but the output phase could be the same or complementary of the reference input.
10.4.15 High-Speed Output Divider
There are six high-speed output dividers and each supports divide values of 1 to 256. Outputs 0 and 1 share an
output divider, as well as outputs 2 and 3. Outputs 4, 5, 6, and 7 have their own individual output dividers. The
divide values are programmed in R33, R36, R38, R40, R42, and R44. These output dividers also support coarse
frequency margining for all output divide values greater than 8 and can be enabled on any output channel by
setting the appropriate bit in R24 to a 1. In such a use case, a dynamic change in the output divider value
through I2C ensures that there are no glitches at the output irrespective of when the change is initiated.
Depending on the VCO frequency and output divide values, as low as a 5% change can be initiated in the output
frequency. An example case of coarse frequency margining on an output is shown in Figure 61.
VCO Clock
Output 1
(output divider = 12)
Output 2
(original divider = 12
new devider = 13)
Delay from auto sync after new
divider (no glitch)
USER ACTION:
Output 2 divider change from
divide-by-12 to divide-by-13
Output 3
(original divider = 12
new divider = 13)
Delay from auto sync after new
divider (no glitch and completes
active pulse before change)
USER ACTION:
Output 3 divider change from
divide-by-12 to divide-by-13
Figure 61. Simplified Diagram for Coarse Frequency Margining
10.4.16 High-Speed Clock Outputs
Each output can be configured as AC-LVPECL, AC-LVDS, AC-CML, HCSL or LVCMOS by programming R31,
R32, R34, R35, R37, R39, R41, and R43. Each output has the option to be muted or not, in case the source from
which it is derived becomes invalid, by programming R22. An invalid source could be a primary or secondary
reference that is no longer present or any PLL that is unlocked. When outputs are to be muted, R20 and R21
must each be programmed to 0xFF. Outputs 0 and 1 share an output supply (VDDO_01), as well as outputs 2
and 3 (VDDO_23). Outputs 4, 5, 6, 7 have individual output supplies (VDDO_4, VDDO_5, VDDO_6, VDDO_7).
Each output supply can be independently set to 1.8 V, 2.5 V or 3.3 V. When a particular output is desired to be
disabled, the bits [5:0] in the corresponding output control register (R31, R32, R34, R35, R37, R39, R41 or R43)
must be set to 0x00. If any of outputs 4, 5, 6, and 7 and their output dividers are disabled; their corresponding
supplies can be connected to GND.
Copyright © 2015–2018, Texas Instruments Incorporated
45
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
The AC-LVDS, AC-CML, and AC-LVPECL output structure is given in Figure 62 where the tail currents can be
programmed to either 4 mA, 6 mA, or 8 mA to generate output voltage swings that are compatible with LVDS,
CML or LVPECL, respectively. Because this output structure is GND referenced, the output supplies can be
operated from 1.8 V, 2.5 V or 3.3 V and offer lower power dissipation compared to traditional LVDS, CML, or
LVPECL structures without any impact on jitter performance or other AC or DC specifications. Interfacing to
LVDS, CML or LVPECL receivers are done with just an external AC-coupling capacitor for each output. No
source termination is needed since the on-chip termination is automatically enabled when selecting AC-LVDS,
AC-CML, or AC-LVPECL for good impedance matching to 50 Ω interconnects.
1.8 V, 2.5 V, 3.3 V
LDO
4 mA
I1
P
N
P
N
Output Current can be programmed
to 4 mA, 6 mA, or 8 mA
(I1 + I2)
IN
OUT
INb
0, 2, 4 mA
I2
P
N
P
N
OUTb
Figure 62. Structure of AC-LVDS, AC-CML, and AC-LVPECL Output Stage
The HCSL output structure is open drain and can be direct coupled or AC coupled to HCSL receivers with
appropriate termination scheme. This output strcture supports either on-chip 50 Ω termination or off-chip 50 Ω
termination. The on-chip 50 Ω termination is provided primarily for convenience when driving short traces. In the
case of driving long traces possibly through a connector, the on-chip termination should be disabled and a 50 Ω
to GND termination at the receiver should be implemented. The output supplies can be operated from 1.8 V, 2.5
V or 3.3 V without any impact on jitter performance or other AC or DC specifications.
The LVCMOS outputs on each side (P and N) can be configured individually to be complementary or in-phase or
can be turned off (high output impedance). The LVCMOS outputs are always at 1.8 V logic level irrespective of
the output supply. In case 3.3-V LVCMOS outputs are needed, STATUS1 and/or STATUS0 can be configured as
3.3-V LVCMOS outputs.
Figure 63 through Figure 68 show recommendations for interfacing between LMK03318’s high-speed clock
outputs and LVCMOS, LVPECL, LVDS, CML, and HCSL receivers, respectively.
NOTE
If 1.8-V LVCMOS signals from the high-speed clock outputs are desired to be interfaced
with a 3.3-V LVCMOS receiver, a level-shifter like LSF0101 must be used to convert the
1.8-V LVCMOS signal to a 3.3-V LVCMOS signal.
46
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
LVCMOS
1.8-V LVCMOS
Receiver
LMK03318
Figure 63. Interfacing LMK03318’s 1.8-V LVCMOS Output With 1.8-V LVCMOS Receiver
VrefB = 3.3 V
VrefA = 1.8 V
LVCMOS
3.3-V LVCMOS
Receiver
LMK03318
LSF0101
Figure 64. Interfacing LMK03318’s 1.8-V LVCMOS Output With 3.3-V LVCMOS Receiver
LVPECL
Receiver
LMK03318
AC-LVPECL
50 ꢀ
50 ꢀ
VDD_IN - 2
Figure 65. Interfacing LMK03318’s AC-LVPECL Output With LVPECL Receiver
LVDS
Receiver
LMK03318
AC-LVDS
100 ꢀ
Figure 66. Interfacing LMK03318’s AC-LVDS Output With LVDS Receiver
50 ꢀ
CML
Receiver
LMK03318
AC-CML
50 ꢀ
Figure 67. Interfacing LMK03318’s AC-CML Output With CML Receiver
33 ꢀ (optional)
HCSL
Receiver
LMK03318
HCSL
33 ꢀ (optional)
50 ꢀ
50 ꢀ
Figure 68. Interfacing LMK03318’s Output With HCSL Receiver
Copyright © 2015–2018, Texas Instruments Incorporated
47
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.4.17 Output Synchronization
All output dividers and the PLL post divider can be synchronized using the active-low SYNCN signal. This signal
can come from the GPIO0 pin (in soft pin mode only) or from R12.6. The most common way to execute the
output synchronization is to toggle the GPIO0 pin. When R56.1 is set to 1, to enable synchronization of outputs
that is derived from the PLL, and GPIO0 pin is asserted (VGPIO0 ≤ VIL), the corresponding output driver(s) are
muted and divider is reset.
NOTE
Output-to-output skew specification can only be assured when PLL post divider is greater
than 2 and after an output synchronization event.
The latency to reset VCO divider is a sum of:
1. 2 to 3 negative edge of output clock cycles of the largest divided value + “x” nano seconds of asynchronous
delay + 2 to 3 VCO clock cycle.
2. If SYNCN happens after rising but before negative edge, sync delay is less 3 clock cycle and closer to 2
clock cycle.
3. The latency is deterministic and its variation is no more than 1 VCO clock cycle and an example scenario is
illustrated in Figure 62.
Table 7. Output Channel Synchronization
GPIO0 / R12.6
OUTPUT DIVIDER AND DRIVER STATE
Output driver(s) is tri-stated and divider is reset
Normal output driver/divider operation as configured
0
1
Minimum SYNCN pulse width = 3 negative clock edge of slowest output clock cycle + “x” nano second of prop
delay + 3 VCO clock cycle. The synchronization feature is particularly helpful in systems with multiple LMK03318
devices. If SYNCN is released simultaneously for all devices, the total remaining output delay variation is ±1
VCO clock cycles for all devices configured to identical output mux settings. Output enable/disable events are
synchronous to minimize glitch/runt pulses. In Soft Pin Mode, the SYNCN control can also be used to disable
any outputs to prevent output clocks from being distributed to down-stream devices, such as DSPs or FPGAs,
until they are configured and ready to accept the incoming clock.
PLL Clock or
Reference Clock
1
2
3
4
5
6
7
8
9
10
11
12
One post-divider clock cycle
uncertainty, of when the
output turns on for one
device in one particular
configuration
GPIO0 or
R12.6
OUT0
Possibility (A)
Output Low
OUT0
Possibility (B)
Output Low
Figure 69. SYNCN to Output Delay Variation
10.4.18 Status Outputs
The device vitals such as input signal quality, smart MUX input selection, PLL loss of lock can be monitored by
reading device registers or by monitoring the status pins, STATUS1 and STATUS0. R27 and R28 allow
customizing which of the vitals are mapped out to these two pins. Table 7 lists the events that can be mapped to
each status pin and which can also be read in the register space. The polarity of the events mapped to the status
pins can be selected by programming R15.
48
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
A logic-high interrupt output (INTR) can also be selected on either status pins to indicate interrupt status from
any of the device vitals listed in R16. To use this feature, R17.0 should be set to 1, R14[4:2] must be set to 0x7,
and R14.0 must be set to 1. The interrupts listed in R16 can be combined in an AND or OR functionality by
programming R17.1. If interrupts stemming from particular device vitals are to be ignored, the appropriate bits in
R14 should be programmed as needed. The contents of R16 can be read back at any time irrespective of
whether the INTR function is chosen in either status pins as long as R17.0 = 1 and the contents of R16 are self-
cleared once the readback is complete. There also exists a “real-time” interrupt register, R13, which indicate
interrupt status from the device vitals irrespective of the state of R17.0. The contents of R13 can be also read
back at any time and are self-cleared once the readback is complete.
10.4.18.1 Loss of Reference
The primary and secondary references can be monitored for their input signal quality and appropriate register
bits and status outputs, if enabled, are flagged if a loss of signal event is encountered. For differential inputs, a
“loss of signal” event occurs when the differential input swing is lower than the threshold as programmed in
R25[3-2] for secondary reference and in R25[1-0] for primary reference. For LVCMOS inputs, a loss of signal
event can be triggered based on either a minimum threshold, programmed in R25[3-2] for secondary reference
and in R25[1-0] for primary reference, or a minimum slew rate of 0.3 V/ns, rising edge or falling edge or both
being monitored based on selections programmed in R25[7-6] for secondary reference and in R25[5-4] for
primary reference.
10.4.18.2 Loss of Lock
The PLL’s loss of lock detection circuit is a digital circuit that detects any frequency error, even a single cycle
slip. The PLL unlock is detected when a certain number of cycle slips have been exceeded, at which point the
counter is reset. If the loss of lock is intended to toggle a system reset, an RC filter on the status output, which is
programmed to indicate loss of lock, is recommended to avoid rare cycle slips from triggering an entire system
reset.
Table 8. Device Vitals Selection Matrix for STATUS[1:0]
NUMBER
SIGNAL
PRIREF Loss of Signal (LOS)
SECREF Loss of Signal (LOS)
PLL Loss of Lock (LOL)
0
1
2
3
PLL R Divider, divided by 2 (when R Divider is not bypassed)
PLL N Divider, divided by 2
RESERVED
4
5
6
RESERVED
7
RESERVED
8
PLL VCO Calibration Active (CAL)
RESERVED
9
10
11
12
13
14
15
Interrupt (INTR)
PLL M Divider, divided by 2 (when M Divider is not bypassed)
RESERVED
EEPROM Active
PLL Secondary to Primary Switch in Automatic Mode
RESERVED
When the status pins are programmed as 3.3-V LVCMOS PLL clock outputs with fast output rise/fall time setting,
they support up to 200 MHz operation and each output can independently be programmed to different
frequencies. Each output has the option to be muted or not, in case the PLL from which it is derived loses lock,
by programming R23 and when muted, the output is held at a static state depending on the programmed output
type/polarity. in a loss-of-lock event. To reduce coupling onto the high-speed outputs, the output rise/fall time can
be modified in R49 to support slower slew rates.
Copyright © 2015–2018, Texas Instruments Incorporated
49
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
NOTE
When either status pin is set as a 3.3-V LVCMOS output, there is fairly significant mixing
of these output frequencies into the high-speed outputs, especially outputs 4, 5, 6, and 7.
If 3.3-V LVCMOS outputs are desired, proper care should be taken during frequency
planning with the LMK03318 to ensure that the outputs, required with low jitter, are
selected from either output 0, 1, 2, or 3. For best jitter performance, TI recommends using
both status pins to generate complementary 3.3-V LVCMOS outputs at any time.
10.5 Programming
The host (DSP, Microcontroller, FPGA, etc) configures and monitors the LMK03318 through the I2C port. The
host reads and writes to a collection of control/status bits called the register map. The device blocks can be
controlled and monitored through a specific grouping of bits located within the register file. The host controls and
monitors certain device-wide critical parameters directly through register control/status bits. In the absence of the
host, the LMK03318 can be configured to operate in pin-mode either from its on-chip ROM or EEPROM
depending on the state of HW_SW_CTRL pin. The EEPROM or ROM arrays are automatically copied to the
device registers upon powerup. The user has the flexibility to re-write the contents of EEPROM from the SRAM
up to a 100 times but the contents of ROM cannot be re-written.
Within the device registers, there are certain bits that have read/write access. Other bits are read-only (an
attempt to write to a read only bit will not change the state of the bit). Certain device registers and bits are
reserved meaning that they must not be changed from their default reset state. Figure 70 shows interface and
control blocks within LMK03318 and the arrows refer to read access from and write access to the different
embedded memories (ROM, EEPROM, and SRAM).
50
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Programming (continued)
ROM (hard pin mode)
1 of 64 images
Reg89
7
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
Reg88
7
Reg87
7
Reg86
7
6
6
6
Reg3
7
Reg2
7
Reg1
7
Reg 0
7
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
STATUS0
STATUS1
PDN
Device Registers
Reg200
7
Reg199
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
Control/
Status Pins
7
Reg29
7
Reg28
7
Device
Control
And
Device
Hardware
Reg3
7
Reg2
7
Reg1
7
Reg 0
7
Status
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
SCL
SDA
I2C
Port
HW_SW_CTRL
Reg89
7
Reg88
Reg89
7
Reg88
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
7
Reg87
7
Reg86
7
7
Reg87
7
Reg86
7
Reg3
7
Reg2
7
Reg1
7
Reg 0
7
Reg3
7
Reg2
7
Reg1
7
Reg 0
7
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
SRAM (soft pin mode)
1 of 6 images
EEPROM (soft pin mode)
1 of 6 images
Figure 70. LMK03318 Interface and Control Block
Copyright © 2015–2018, Texas Instruments Incorporated
51
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Programming (continued)
10.5.1 I2C Serial Interface
The I2C port on the LMK03318 works as a slave device and supports both the 100 kHz standard mode and 400
kHz fast-mode operations. Fast mode imposes a glitch tolerance requirement on the control signals. Therefore,
the input receivers ignore pulses of less than 50-ns duration. The I2C timing is given in I2C-Compatible Interface
Characteristics (SDA, SCL) I2C-Compatible Interface Characteristics (SDA, SCL). The timing diagram is given in
Figure 71.
STOP
START
ACK
STOP
tW(SCLL)
tf(SM)
tW(SCLH)
tr(SM)
VIH(SM)
VIL(SM)
SCL
th(START)
tSU(START)
tBUS
tSU(SDATA)
tr(SM)
th(SDATA)
tSU(STOP)
tf(SM)
VIH(SM)
VIL(SM)
SDA
Figure 71. I2C Timing Diagram
In an I2C bus system, the LMK03318 acts as a slave device and is connected to the serial bus (data bus SDA
and clock bus SCL). These are accessed through a 7-bit slave address transmitted as part of an I2C packet. Only
the device with a matching slave address responds to subsequent I2C commands. In soft pin mode, the
LMK03318 allows up to three unique slave devices to occupy the I2C bus based on the pin strapping of GPIO1
(tied to VDD_DIG, GND or VIM). The device slave address is 10100xx (the two LSBs are determined by the
GPIO1 pin).
NOTE
The PDN pin of LMK03318 should be high before any I2C communication on the bus. The
first I2C transaction after power cycling LMK03318 should be ignored.
During the data transfer through the I2C interface, one clock pulse is generated for each data bit transferred. The
data on the SDA line must be stable during the high period of the clock. The high or low state of the data line can
change only when the clock signal on the SCL line is low. The start data transfer condition is characterized by a
high-to-low transition on the SDA line while SCL is high. The stop data transfer condition is characterized by a
low-to-high transition on the SDA line while SCL is high. The start and stop conditions are always initiated by the
master. Every byte on the SDA line must be eight bits long. Each byte must be followed by an acknowledge bit
and bytes are sent MSB first. The I2C register structure of the LMK03318 is shown in Figure 72.
I2C PROTOCOL
7
1
8
8
A6 A5 A4 A3 A2 A1 A0
I2C ADDRESS
W/R
REGISTER ADDRESS
DATA BYTE
Figure 72. I2C Register Structure
52
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Programming (continued)
The acknowledge bit (A) or non-acknowledge bit (A’) is the 9th bit attached to any 8-bit data byte and is always
generated by the receiver to inform the transmitter that the byte has been received (when A = 0) or not (when A’
= 0). A = 0 is done by pulling the SDA line low during the 9th clock pulse and A’ = 0 is done by leaving the SDA
line high during the 9th clock pulse.
The I2C master initiates the data transfer by asserting a start condition which initiates a response from all slave
devices connected to the serial bus. Based on the 8-bit address byte sent by the master over the SDA line
(consisting of the 7-bit slave address (MSB first) and an R/W’ bit), the device whose address corresponds to the
transmitted address responds by sending an acknowledge bit. All other devices on the bus remain idle while the
selected device waits for data transfer with the master.
After the data transfer has occurred, stop conditions are established. In write mode, the master asserts a stop
condition to end data transfer during the 10th clock pulse following the acknowledge bit for the last data byte
from the slave. In read mode, the master receives the last data byte from the slave but does not pull SDA low
during the 9th clock pulse. This is known as a non-acknowledge bit. By receiving the non-acknowledge bit, the
slave knows the data transfer is finished and enters the idle mode. The master then takes the data line low
during the low period before the 10th clock pulse, and high during the 10th clock pulse to assert a stop condition.
A generic transation is shown in Figure 73.
1
7
1
1
8
1
1
S
Slave Address
R/W
LSB
A
Data Byte
A
P
MSB
MSB
LSB
S
Start Condition
Sr Repeated Start Condition
R/W 1 = Read (Rd) from slave; 0 = Write (Wr) to slave
A
P
Acknowledge (ACK = 0 and NACK = 1)
Stop Condition
Master to Slave Transmission
Slave to Master Transmission
Figure 73. Generic Programming Sequence
The LMK03318 I2C interface supports “Block Register Write/Read”, “Read/Write SRAM”, and “Read/Write
EEPROM” operations. For “Block Register Write/Read” operations, the I2C master can individually access
addressed registers that are made of an 8-bit data byte. The offset of the indexed register is encoded in R10 and
part of the EEPROM, as described in Table 9 below. To change the most significant 5 bits of the I2C slave
address from its default value, the EEPROM byte 11 can be re-written with the desired value and R10 provides a
read-back of the new slave address.
Table 9. I2C Slave Address
Operating
Mode
R10.7
R10.6
R10.5
R10.4
R10.3
R10.2
R10.1
Hard pin
Soft pin
1
1
0
0
1
1
0
0
0
0
0
0
Controlled by GPIO1 state.
GPIO1
R10[2-1]
0
VIM
1
0x0
0x1
0x3
Copyright © 2015–2018, Texas Instruments Incorporated
53
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.5.2 Block Register Write
The I2C Block Register Write transaction is illustrated in Figure 74 and consists of the following sequence:
1. Master issues a Start Condition.
2. Master writes the 7-bit Slave Address following by a Write bit.
3. Master writes the 8-bit Register address as the CommandCode of the programming sequence.
4. Master writes one or more Data Bytes each of which should be acknowledged by the slave. The slave
increments the internal register address after each byte.
5. Master issues a Stop Condition to terminate the transaction.
1
7
1
1
8
1
S
Slave Address
Wr
A
CommandCode
A
8
1
8
1
1
...
Data Byte 0
A
Data Byte N-1
A
P
Figure 74. Block Register Write Programming Sequence
10.5.3 Block Register Read
The I2C Block Register Read transaction is illustrated in Figure 75 and consists of the following sequence:
1. Master issues a Start Condition.
2. Master writes the 7-bit Slave Address followed by a Write bit.
3. Master writes the 8-bit Register address as the CommandCode of the programming sequence.
4. Master issues a Repeated Start Condition.
5. Master writes the 7-bit Slave Address following by a Read bit.
6. Slave returns one or more Data Bytes as long as the Master continues to acknowledge them. The slave
increments the internal register address after each byte.
7. Master issues a Stop Condition to terminate the transaction.
1
7
1
1
8
1
1
7
1
1
S
Slave Address
Wr
A
CommandCode
A
Sr
Slave Address
Rd
A
8
1
8
1
1
...
Data Byte 0
A
Data Byte N-1
A
P
Figure 75. Block Register Read Programming Sequence
10.5.4 Write SRAM
The on-chip SRAM is a volatile, shadow memory array used to temporarily store register data, and is intended
only for programming the non Volatile EEPROM array with one or more device start-up configuration settings
(pages). The SRAM has the identical data format as the EEPROM map. The register configuration data can be
transferred to the SRAM array through special memory access registers in the register map.
The SRAM is made up of a base memory array and 6 pages of identical memory arrays. To successfully
program the SRAM, the complete base array and at least one page should be written.
The following details the programming sequence to transfer the device registers into the appropriate SRAM
page.
1. Program the device registers to match a desired setting.
2. Write R145[3:0] with a valid SRAM page (0 to 5) to commit the current register data.
3. Write a 1 to R137.6. This ensures that the device registers are copied to the desired SRAM page.
4. If another device setting is desired to be written to a different SRAM page, repeat steps 1-3 and select an
unused SRAM page.
54
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
The SRAM can also be written with particular values according to the following programming sequence.
1. Write the most significant 8th bit of the SRAM address in R139.0 and write the least significant 8 bits in
R140.
2. Write the desired data byte in R142 in the same I2C transaction and this data byte will be written to the
address specified in the step above. Any additional access that is part of the same transaction will cause the
SRAM address to be incremented and a write will take place to the next SRAM address. Access to SRAM
will terminate at the end of current I2C transaction.
3. Steps 1 and 2 need to be followed to change EEPROM bytes 11 and 12. Byte 11 denotes the I2C slave
address of LMK03318 and Byte 12 denotes an 8-b user space that can be used as a device identifier among
multiple LMK03318 instances with different EEPROM images.
NOTE
It is possible to increment SRAM address incorrectly when 2 successive accesses are
made to R140.
10.5.5 Write EEPROM
The on-chip EEPROM is a non-volatile memory array used to permanently store register data for one or more
device start-up configuration settings (pages), which can be selected to initialize registers upon power-up or
POR. There are a total of 6 independent EEPROM pages of which each page is selected by the 3-level
GPIO[3:2] pins, and each page is comprised of bits shown in the EEPROM Map. The transfer must first happen
to the corresponding SRAM page and then to the EEPROM page. During “EEPROM write”, R137.2 is a 1 and
the EEPROM contents cannot be accessed. The following details the programming sequence to transfer the
entire contents of SRAM to EEPROM:
1. Make sure the Write SRAM procedure (Write SRAM) was done to commit the register settings to the SRAM
page(s) with start-up configurations intended for programming to the EEPROM array.
2. Write 0xEA to R144. This provides basic protection from inadvertent programming of EEPROM.
3. Write a 1 to R137.0. This programs the entire SRAM contents to EEPROM. Once completed, the contents in
R136 will increment by 1. R136 contains the total number of EEPROM programming cycles that are
successfully completed.
4. Write 0x00 to R144 to protect against inadvertent programming of EEPROM.
5. If an EEPROM write is unsuccessful, a readback of R137.5 results in a 1. In this case, the device will not
function correctly and will be locked up. To unlock the device for correct operation, a new EEPROM write
sequence should be initiated and successfully completed.
10.5.6 Read SRAM
The contents of the SRAM can be read out, one word at a time, starting with that of the requested address. The
following details the programming sequence for an SRAM read by address.
1. Write the most significant 9th bit of the SRAM address in R139.0 and write the least significant 8 bits of the
SRAM address in R140.
2. The SRAM data located at the address specified in the step above can be obtained by reading R142 in the
same I2C transaction. Any additional access that is part of the same transaction will cause the SRAM
address to be incremented and a read will take place of the next SRAM address. Access to SRAM will
terminate at the end of current I2C transaction.
NOTE
It is possible to increment SRAM address incorrectly when 2 successive accesses are
made to R140.
Copyright © 2015–2018, Texas Instruments Incorporated
55
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.5.7 Read EEPROM
The contents of the EEPROM can be read out, one word at a time, starting with that of the requested address.
The following details the programming sequence for an EEPROM read by address.
1. Write the most significant 9th bit of the EEPROM address in R139.0 and write the least significant 8 bits of
the EEPROM address in R140.
2. The EEPROM data located at the address specified in the step above can be obtained by reading R141 in
the same I2C transaction. Any additional access that is part of the same transaction will cause the EEPROM
address to be incremented and a read will take place of the next EEPROM address. Access to EEPROM will
terminate at the end of current I2C transaction.
NOTE
It is possible to increment EEPROM address incorrectly when 2 successive accesses are
made to R140.
10.5.8 Read ROM
The contents of the ROM can be read out, one word at a time, starting with that of the requested address. The
following details the programming sequence of a ROM read by address.
1. Write the most significant 11th, 10th, 9th, and 8th bit of the ROM address in R139[3-0] and write the least
significant 8 bits of the ROM address in R140.
2. The ROM data located at the address specified in the step above can be obtained by reading R143 in the
same I2C transaction. Any additional access that is part of the same transaction will cause the ROM address
to be incremented and a read will take place of the next ROM address. Access to ROM will terminate at the
end of current I2C transaction.
56
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.5.9 Default Device Configurations in EEPROM and ROM
Table 10 through Table 13 show the device default configurations stored in the on-chip EEPROM. Table 14 through Table 18 show the device default
configurations stored in the on-chip ROM.
Table 10. Default EEPROM Contents (HW_SW_CTRL = 0) – Input and Status Configuration(1)(2)
STATUS1 /
STATUS1 /
PRI
INPUT
(MHz)
SEC
INPUT
(MHz)
STATUS0
RISE /
GPIO
[3:2]
PRI
DOUBLER
XO INT
LOAD (pF) DOUBLER
SEC
STATUS1
MUX
STATUS0
MUX
STATUS0
FREQ
PRI TYPE
SEC TYPE
PREDIV
DIV
FALL TIME
(ns)
(MHz)
VIM, VIM
00
25
25
25
DIFF
DIFF
Enabled
Enabled
Enabled
25
25
25
XTAL
XTAL
XTAL
9
9
9
Enabled
Enabled
Enabled
LOL
LOL
LOL
Disable
PLL
n/a
4
n/a
25
25
n/a
n/a
n/a / 50
n/a / 50
n/a / 2.1
n/a / 2.1
01
LVCMOS
PLL
4
(1) 100-Ω internal termination enabled (if applicable)
(2) Internal AC biasing enabled (if applicable)
Copyright © 2015–2018, Texas Instruments Incorporated
57
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 11. Default EEPROM Contents (HW_SW_CTRL = 0) – PLL Configuration(1)
GPIO PLL INPUT PLL INPUT
PLL N DIV PLL N DIV PLL N DIV PLL FRAC PLL FRAC
PLL VCO
(MHz)
PLL TYPE PLL R DIV PLL M DIV PLL N DIV
PLL P DIV
[3:2]
MUX
(MHz)
INT
NUM
DEN
ORDER
DITHER
Clock Gen
Integer
VIM, VIM
REFSEL
50
1
1
1
1
1
1
102
100
100
102
0
1
n/a
Disabled
5100
5000
5000
8
2
2
Clock Gen
Integer
00
01
REFSEL
REFSEL
50
50
100
100
0
0
4000000
4000000
n/a
n/a
Disabled
Disabled
Clock Gen
Integer
(1) When PLL is set as an integer-based clock generator, external loop filter component, C2, should be 3.3 nF and loop bandwidth is around 400 kHz. When PLL is set as a fractional-based
clock generator, external loop filter component, C2, should be 33 nF and loop bandwidth is around 400 kHz.
58
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
GPIO [3:2]
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 12. Default EEPROM Contents (HW_SW_CTRL = 0) – Outputs [0-3] Configuration
OUT0-1 FREQ
(MHz)
OUT2-3 FREQ
(MHz)
OUT0-1 DIVIDER
OUT0 TYPE
OUT1 TYPE
OUT2-3 DIVIDER
OUT2 TYPE
OUT3 TYPE
VIM, VIM
00
n/a
25
25
n/a
100
100
Disable
LVPECL
Disable
n/a
25
25
n/a
100
100
Disable
Disable
LVCMOS (+/-)
LVCMOS (+/-)
LVCMOS (+/-)
LVCMOS (+/-)
LVCMOS (+/-)
LVCMOS (+/-)
01
LVCMOS (+/-)
Copyright © 2015–2018, Texas Instruments Incorporated
59
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 13. Default EEPROM Contents (HW_SW_CTRL = 0) – Outputs [4-7] Configuration
OUT4
FREQ
(MHz)
OUT4
MUX
SELECT
OUT5
FREQ
(MHz)
OUT5
MUX
SELECT
OUT6
FREQ
(MHz)
OUT6
MUX
SELECT
OUT7
FREQ
(MHz)
OUT7
MUX
SELECT
GPIO OUT4
OUT4
TYPE
OUT5
DIV
OUT5
TYPE
OUT6
DIV
OUT6
TYPE
OUT7
DIV
OUT7
TYPE
[3:2]
DIV
VIM, VIM
00
3
212.5
PLL
PLL
LVPECL
LVPECL
3
212.5
125
PLL
PLL
LVPECL
LVPECL
6
106.25
125
PLL
PLL
LVPECL
LVDS
6
106.25
25
PLL
PLL
LVPECL
LVPECL
16
156.25
20
20
100
LVCMOS
(+/-)
01
25
100
PLL
20
125
PLL
LVDS
20
125
PLL
LVDS
20
125
PLL
LVDS
60
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 14. Default ROM Contents (HW_SW_CTRL = 1) - Input Configuration
GPIO[5:0] (decimal)
PRI INPUT (MHz)
PRI TYPE
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
PRI DOUBLER
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
SEC INPUT (MHz)
SEC TYPE
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
LVCMOS
XTAL
XO INT LOAD (pF)
SEC DOUBLER
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
0
50
50
50
50
9
9
1
2
50
50
9
3
50
50
9
4
50
50
9
5
50
50
9
6
30.72
19.2
10
30.72
19.2
10
9
7
9
8
9
9
25
25
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
50
50
9
25
25
9
50
50
9
25
25
9
50
50
9
25
25
9
50
50
9
25
25
9
50
50
9
25
25
9
50
50
9
19.44
38.88
25
19.44
38.88
25
9
9
9
50
50
9
19.44
38.88
25
19.44
38.88
25
9
9
n/a
n/a
9
25
25
25
25
50
50
9
25
25
n/a
n/a
9
25
25
25
25
Copyright © 2015–2018, Texas Instruments Incorporated
61
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 14. Default ROM Contents (HW_SW_CTRL = 1) - Input Configuration (continued)
GPIO[5:0] (decimal)
PRI INPUT (MHz)
PRI TYPE
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
PRI DOUBLER
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
SEC INPUT (MHz)
SEC TYPE
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XO INT LOAD (pF)
SEC DOUBLER
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
50
19.44
38.88
25
50
19.44
38.88
25
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
50
50
19.44
38.88
19.44
38.88
19.44
38.88
25
19.44
38.88
19.44
38.88
19.44
38.88
25
50
50
25
25
50
50
25
25
50
50
25
25
50
50
25
25
50
50
19.44
38.88
25
19.44
38.88
25
25
25
25
25
50
50
25
25
50
50
25
25
62
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 15. Default ROM Contents (HW_SW_CTRL = 1) - Status Configuration
STATUS1
RISE/FALL
TIME (ns)
STATUS0
RISE/FALL
TIME (ns)
GPIO[5:0]
(decimal)
STATUS1
MUX
STATUS0
MUX
STATUS1
PREDIV
STATUS1
FREQ (MHz)
STATUS0
PREDIV
STATUS0
FREQ (MHz)
STATUS1 DIV
STATUS0 DIV
0
LOL
LOL
PLL
PLL
n/a
n/a
n/a
n/a
n/a
5
n/a
n/a
n/a
n/a
n/a
40
n/a
n/a
n/a
n/a
n/a
25
n/a
n/a
n/a
n/a
n/a
2.1
n/a
n/a
n/a
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.1
n/a
n/a
2.1
2.1
2.1
2.1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
5
20
40
50
25
2.1
2.1
n/a
n/a
n/a
2.1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
1
5
2
LOL
LOR_PRI
LOL
LOR_PRI
PLL
n/a
n/a
n/a
5
n/a
n/a
n/a
40
n/a
n/a
n/a
25
3
LOR_PRI
LOL
4
5
PLL
6
LOR_PRI
LOR_PRI
LOR_PRI
PLL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
n/a
n/a
n/a
4
n/a
n/a
n/a
51
n/a
n/a
n/a
25
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
PLL
4
51
25
PLL
5
30
33.3333
33.3333
25
PLL
5
30
PLL
4
51
PLL
4
51
25
PLL
4
51
25
PLL
4
51
25
LOR_PRI
LOR_PRI
PLL
n/a
n/a
5
n/a
n/a
40
n/a
n/a
25
PLL
5
40
25
PLL
5
40
25
PLL
5
40
25
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
Copyright © 2015–2018, Texas Instruments Incorporated
63
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 15. Default ROM Contents (HW_SW_CTRL = 1) - Status Configuration (continued)
STATUS1
RISE/FALL
TIME (ns)
STATUS0
RISE/FALL
TIME (ns)
GPIO[5:0]
(decimal)
STATUS1
MUX
STATUS0
MUX
STATUS1
PREDIV
STATUS1
FREQ (MHz)
STATUS0
PREDIV
STATUS0
FREQ (MHz)
STATUS1 DIV
STATUS0 DIV
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
LOR_PRI
PLL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
LOL
n/a
5
n/a
15
n/a
66.6666
66.6666
66.6666
66.6666
n/a
n/a
2.1
2.1
2.1
2.1
n/a
n/a
n/a
n/a
2.1
2.1
2.1
2.1
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
PLL
5
15
PLL
5
15
PLL
5
15
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
PLL
n/a
n/a
n/a
n/a
4
n/a
n/a
n/a
n/a
32
n/a
n/a
n/a
38.88
38.88
38.88
38.88
n/a
PLL
4
32
PLL
4
32
PLL
4
32
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
LOR_PRI
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
n/a
64
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 16. Default ROM Contents (HW_SW_CTRL = 1) – PLL Configuration(1)
GPIO[5:0]
(decimal)
PLL IN
MUX
PLL IN
(MHz)
PLL R PLL M
PLL N
DIV INT
PLL N DIV
NUM
PLL N
DIV DEN
PLL FRAC PLL FRAC
PLL VCO
(MHz)
PLL TYPE
PLL N DIV
PLL P DIV
DIV
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DIV
1
1
1
1
1
1
24
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
ORDER
DITHER
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
0
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
50
50
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Jitter Cleaner Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Fractional
Clock Gen Integer
Clock Gen Fractional
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
50
50
50
0
1
n/a
5000
5000
5000
5000
5000
5000
4915.2
4915.2
4915.2
5100
5100
5000
5000
5100
5100
5100
5100
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5000
5
5
5
4
2
2
4
4
4
8
8
2
2
3
3
3
3
8
8
8
8
8
8
2
2
2
2
2
8
8
2
1
50
0
1
n/a
2
50
50
50
0
1
n/a
3
50
50
50
0
1
n/a
4
50
50
50
0
1
n/a
5
50
50
50
0
1
n/a
6
30.72
19.2
10
3840
3840
256
491
102
51
0
1
n/a
7
256
0
1
n/a
8
491.52
1300000
2500000
Third
n/a
9
25
102
0
1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
50
51
0
1
n/a
25
100
100
50
0
1
n/a
50
50
0
1
n/a
25
102
102
51
0
1
n/a
50
51
0
1
n/a
25
102
102
51
0
1
n/a
50
51
0
1
n/a
25
100
100
50
0
1
n/a
50
50
0
1
n/a
25
100
50
100
50
0
1
n/a
50
0
1
n/a
19.44
38.88
25
257.2016461
128.600823
100
257
128
100
50
157536
781250
Third
Third
n/a
469393
781250
0
1
50
50
0
1
n/a
19.44
38.88
25
257.2016461
128.600823
100
257
128
100
100
100
50
157536
781250
Third
Third
n/a
469393
781250
0
0
0
0
1
1
1
1
25
100
n/a
25
100
n/a
50
50
n/a
(1) When PLL is set as an integer-based clock generator, external loop filter component, C2, should be 3.3nF and loop bandwidth is around 400kHz. When PLL is set as a fractional-based
clock generator, external loop filter component, C2, should be 33nF and loop bandwidth is around 400kHz.
Copyright © 2015–2018, Texas Instruments Incorporated
65
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
PLL P DIV
Table 16. Default ROM Contents (HW_SW_CTRL = 1) – PLL Configuration(1) (continued)
GPIO[5:0]
(decimal)
PLL IN
MUX
PLL IN
(MHz)
PLL R PLL M
PLL N
DIV INT
PLL N DIV
NUM
PLL N
DIV DEN
PLL FRAC PLL FRAC
ORDER
PLL VCO
(MHz)
PLL TYPE
PLL N DIV
DIV
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DIV
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DITHER
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
REFSEL
25
25
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Fractional
Clock Gen Fractional
Clock Gen Integer
Clock Gen Integer
Clock Gen Fractional
Clock Gen Integer
Clock Gen Fractional
Clock Gen Integer
Clock Gen Fractional
Clock Gen Fractional
Clock Gen Fractional
Clock Gen Integer
Clock Gen Fractional
Clock Gen Integer
Clock Gen Integer
Clock Gen Fractional
Clock Gen Fractional
Clock Gen Integer
Clock Gen Fractional
Clock Gen Fractional
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Integer
Clock Gen Fractional
100
100
100
100
100
50
0
1
n/a
5000
5000
2
2
8
8
8
8
8
8
8
8
8
8
8
8
5
5
8
8
8
8
2
2
8
8
8
8
2
2
8
8
8
8
8
0
1
n/a
25
100
0
1
n/a
5000
50
50
0
1
n/a
5000
19.44
38.88
25
257.2016461
128.600823
100
257
128
100
50
157536
781250
Third
Third
n/a
5000
469393
781250
5000
0
1
5000
50
50
0
1
n/a
5000
19.44
38.88
19.44
38.88
19.44
38.88
25
257.2016461
128.600823
256
257
128
256
128
256
128
100
50
157536
781250
Third
Third
n/a
5000
469393
781250
5000
0
1
4976.64
4976.64
4976.64
4976.64
5000
128
0
1
n/a
256
0
1
n/a
128
0
1
n/a
100
0
1
n/a
50
50
0
1
n/a
5000
25
100
100
50
0
1
n/a
5000
50
50
0
1
n/a
5000
25
100
100
50
0
1
n/a
5000
50
50
0
1
n/a
5000
25
106.25
53.125
103.125
51.5625
265.2391976
132.6195988
100
106
53
1000000
4000000
First
First
First
First
Third
Third
n/a
5312.5
5312.5
5156.25
5156.25
5156.25
5156.25
5000
50
500000
4000000
25
103
51
500000
4000000
50
2250000
4000000
19.44
38.88
25
265
132
100
100
100
50
597994
2500000
1548997
2500000
0
0
0
0
0
0
0
1
1
1
1
1
1
1
25
100
n/a
5000
25
100
n/a
5000
50
50
n/a
5000
25
100
100
50
n/a
5000
50
50
n/a
5000
25
100
100
n/a
5000
66
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 17. Default ROM Contents (HW_SW_CTRL = 1) - Outputs [0-4] Configuration
GPIO[5:0]
(decimal)
OUT0-1
DIVIDER
OUT0-1 FREQ
(MHz)
OUT0
TYPE
OUT2-3
DIVIDER
OUT2-3 FREQ
(MHz)
OUT2
TYPE
OUT4 FREQ OUT4 MUX
OUT1 TYPE
OUT3 TYPE
OUT4 DIV
OUT4 TYPE
(MHz)
SELECT
0
5
5
200
LVDS
LVDS
LVDS
LVDS
10
10
10
8
100
LVDS
LVDS
LVDS
LVDS
1
1
n/a
n/a
Disable
Disable
LVDS
1
200
100
n/a
n/a
2
10
4
100
LVDS
LVDS
100
LVDS
LVDS
8
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
3
312.5
125
LVDS
LVDS
156.25
156.25
156.25
245.76
245.76
245.76
106.25
106.25
125
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVDS
10
25
16
8
125
LVDS
4
20
16
4
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
16
16
5
100
LVPECL
LVPECL
LVDS
5
156.25
307.2
307.2
307.2
106.25
106.25
156.25
156.25
106.25
106.25
425
156.25
153.6
153.6
153.6
212.5
212.5
100
6
7
4
5
LVPECL
LVDS
LVPECL
LVDS
8
LVDS
8
4
5
8
LVDS
9
6
6
LVPECL
LVDS
LVPECL
LVDS
3
LVPECL
LVDS
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
6
6
3
16
16
16
16
4
LVPECL
LVDS
LVPECL
LVDS
20
20
16
16
8
LVPECL
LVDS
LVPECL
LVDS
25
25
17
17
17
17
4
HCSL
125
100
HCSL
LVPECL
LVDS
LVPECL
LVDS
106.25
106.25
212.5
212.5
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
100
LVPECL
LVDS
LVPECL
LVDS
100
HCSL
100
HCSL
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
100
HCSL
4
425
8
100
HCSL
4
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
312.5
156.25
625
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
LVPECL
LVDS
156.25
156.25
156.25
156.25
156.25
156.25
100
LVPECL
LVDS
4
4
4
4
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
4
4
4
4
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
4
4
4
16
16
16
16
16
4
LVPECL
LVDS
LVPECL
LVDS
16
16
16
16
25
4
LVPECL
LVDS
LVPECL
LVDS
25
25
25
25
50
4
LVDS
100
LVDS
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
100
LVDS
100
LVDS
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
50
LVPECL
LVPECL
LVPECL
LVDS
156.25
156.25
156.25
156.25
625
156.25
156.25
156.25
156.25
100
4
4
4
8
16
16
4
16
16
25
16
4
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
Copyright © 2015–2018, Texas Instruments Incorporated
67
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
OUT4 TYPE
Table 17. Default ROM Contents (HW_SW_CTRL = 1) - Outputs [0-4] Configuration (continued)
GPIO[5:0]
(decimal)
OUT0-1
DIVIDER
OUT0-1 FREQ
(MHz)
OUT0
TYPE
OUT2-3
DIVIDER
OUT2-3 FREQ
(MHz)
OUT2
TYPE
OUT4 FREQ OUT4 MUX
OUT1 TYPE
OUT3 TYPE
OUT4 DIV
(MHz)
156.25
156.25
156.25
156.25
125
SELECT
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
4
4
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
311.04
311.04
622.08
622.08
100
LVPECL
LVDS
LVPECL
LVDS
4
4
156.25
156.25
156.25
156.25
125
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
4
4
LVPECL
LVDS
4
LVPECL
LVDS
LVPECL
LVDS
4
4
LVPECL
LVDS
4
4
4
4
LVPECL
LVDS
LVPECL
LVDS
5
5
LVDS
4
5
125
LVDS
LVDS
5
125
LVDS
4
LVPECL
LVDS
LVPECL
LVDS
5
125
HCSL
HCSL
5
125
LVDS
4
5
125
LVDS
LVDS
5
125
LVDS
2
LVPECL
LVDS
LVPECL
LVDS
4
155.52
155.52
622.08
622.08
100
LVDS
LVDS
4
155.52
155.52
155.52
155.52
250
LVPECL
LVDS
2
4
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
4
1
LVPECL
LVDS
LVPECL
LVDS
1
4
LVDS
1
1
4
LVDS
10
10
25
25
25
25
25
25
4
LVPECL
LVDS
LVPECL
LVDS
10
10
2
4
LVPECL
LVDS
100
100
4
250
25
LVPECL
LVDS
LVPECL
LVDS
312.5
4
156.25
156.25
156.25
156.25
156.25
156.25
322.265625
322.265625
322.265625
322.265625
100
LVPECL
LVDS
25
2
312.5
4
25
LVPECL
LVDS
LVPECL
LVDS
4
156.25
156.25
106.25
106.25
161.1328125
161.1328125
161.1328125
161.1328125
156.25
156.25
312.5
LVPECL
LVDS
LVPECL
LVDS
4
LVPECL
LVDS
25
4
4
106.25
106.25
161.1328125
161.1328125
161.1328125
161.1328125
156.25
156.25
312.5
LVPECL
LVDS
LVPECL
LVDS
25
25
4
LVPECL
LVDS
LVPECL
LVDS
17
17
2
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVPECL
LVDS
4
4
2
4
LVPECL
LVDS
LVPECL
LVDS
4
2
LVPECL
LVDS
4
4
2
16
16
2
LVPECL
LVDS
LVPECL
LVDS
16
16
2
25
25
2
HCSL
100
HCSL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
312.5
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
2
312.5
2
312.5
2
312.5
4
156.25
156.25
125
4
156.25
156.25
125
4
156.25
156.25
125
4
4
4
5
5
5
68
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Table 18. Default ROM Contents (HW_SW_CTRL = 1) - Outputs [5-7] Configuration
OUT5
MUX
SELECT
GPIO[5:0]
(decimal)
OUT5 FREQ
(MHz)
OUT5
TYPE
OUT6 FREQ
(MHz)
OUT6 MUX
SELECT
OUT7 FREQ
(MHz)
OUT7 MUX
SELECT
OUT7
TYPE
OUT5 DIV
OUT6 DIV
OUT6 TYPE OUT7 DIV
0
1
1
n/a
n/a
n/a
Disable
Disable
LVDS
1
1
n/a
n/a
n/a
Disable
Disable
LVDS
1
1
n/a
n/a
n/a
Disable
Disable
LVDS
1
n/a
n/a
n/a
2
8
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
8
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
8
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
3
10
20
20
8
125
LVDS
25
16
20
10
10
10
3
50
LVDS
25
16
20
10
10
10
3
50
LVDS
4
125
LVPECL
LVPECL
LVDS
156.25
125
LVPECL
LVPECL
LVDS
156.25
125
LVPECL
LVPECL
LVDS
5
125
6
153.6
153.6
153.6
212.5
212.5
100
122.88
122.88
122.88
212.5
212.5
25
122.88
122.88
122.88
212.5
212.5
25
7
8
LVDS
LVDS
LVDS
8
8
LVDS
LVDS
LVDS
9
3
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
3
3
3
25
25
17
17
34
34
4
HCSL
100
100
17
17
3
LVDS
100
100
17
17
16
16
5
LVCMOS
LVCMOS
HCSL
100
HCSL
25
LVDS
25
100
HCSL
100
HCSL
100
100
HCSL
100
HCSL
100
HCSL
50
LVDS
566.67
566.67
125
LVPECL
LVPECL
LVPECL
LVDS
106.25
106.25
125
LVDS
50
LVDS
3
LVDS
156.25
156.25
125
LVPECL
LVDS
5
LVPECL
LVDS
4
5
125
5
125
5
LVPECL
LVDS
5
125
LVPECL
LVDS
5
125
LVPECL
LVDS
5
125
5
125
5
125
5
125
LVPECL
LVDS
5
125
LVPECL
LVDS
5
125
LVPECL
LVDS
5
125
5
125
5
125
25
25
25
25
20
4
100
LVDS
20
20
20
20
25
4
125
LVDS
20
20
20
20
100
25
25
20
100
125
LVDS
100
LVDS
125
LVDS
125
LVDS
100
LVDS
125
LVDS
125
LVDS
100
LVDS
125
LVDS
125
LVDS
125
LVPECL
LVPECL
LVCMOS
LVDS
100
LVCMOS
LVPECL
LVCMOS
LVDS
25
LVCMOS
LVCMOS
LVCMOS
LVDS
156.25
25
156.25
25
25
25
8
25
25
25
25
312.5
100
100
125
25
HCSL
100
HCSL
25
LVPECL
Copyright © 2015–2018, Texas Instruments Incorporated
69
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Table 18. Default ROM Contents (HW_SW_CTRL = 1) - Outputs [5-7] Configuration (continued)
OUT5
MUX
SELECT
GPIO[5:0]
(decimal)
OUT5 FREQ
(MHz)
OUT5
TYPE
OUT6 FREQ
(MHz)
OUT6 MUX
SELECT
OUT7 FREQ
(MHz)
OUT7 MUX
SELECT
OUT7
TYPE
OUT5 DIV
OUT6 DIV
OUT6 TYPE OUT7 DIV
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
25
4
100
156.25
156.25
156.25
156.25
156.25
156.25
156.25
156.25
155.52
155.52
155.52
155.52
250
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
LVDS
LVPECL
LVDS
25
5
100
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
LVDS
LVDS
25
5
100
125
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
PLL
LVDS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVCMOS
LVDS
4
5
125
LVDS
5
125
4
LVPECL
LVDS
5
125
LVDS
5
125
4
5
125
LVDS
5
125
4
LVPECL
LVDS
5
125
LVDS
5
125
4
5
125
LVDS
5
125
4
LVPECL
LVDS
5
125
LVDS
5
125
4
5
125
LVDS
5
125
4
LVPECL
LVDS
8
77.76
77.76
77.76
77.76
25
LVDS
8
77.76
77.76
77.76
77.76
66.67
66.67
312.5
312.5
125
4
8
LVDS
8
LVDS
4
LVDS
8
LVDS
8
LVDS
4
LVDS
8
LVDS
8
LVDS
4
LVPECL
LVDS
40
40
5
LVCMOS
LVCMOS
LVPECL
LVDS
15
15
2
LVCMOS
LVCMOS
LVPECL
LVDS
4
250
25
10
10
5
62.5
LVPECL
LVDS
125
62.5
5
125
2
125
LVPECL
LVDS
5
125
LVPECL
LVDS
5
LVPECL
LVDS
5
125
5
125
5
125
17
17
2
156.25
156.25
322.265625
322.265625
322.265625
322.265625
100
LVPECL
LVDS
17
17
2
156.25
156.25
322.265625
322.265625
322.265625
322.265625
100
LVPECL
LVDS
17
17
2
156.25
156.25
322.265625
322.265625
322.265625
322.265625
100
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
LVPECL
LVDS
2
2
2
2
LVPECL
LVDS
2
LVPECL
LVDS
2
LVPECL
LVDS
2
2
2
25
25
2
HCSL
25
25
2
HCSL
25
25
2
HCSL
100
HCSL
100
HCSL
100
HCSL
312.5
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
312.5
312.5
156.25
156.25
125
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
312.5
312.5
156.25
156.25
125
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
2
312.5
2
2
4
156.25
156.25
125
4
4
4
4
4
5
5
5
70
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6 Register Maps
The register map is shown in the table below. The registers occupy a single unified address space and all registers are accessible at any time. A total of
103 registers are present in the LMK03318.
Name
Address Reset
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
VNDRID_BY1
VNDRID_BY0
PRODID
0
1
2
3
4
8
0x10
0x0B
0x33
0x02
0x01
0x00
VNDRID[15:8]
VNDRID[7:0]
PRODID[7:0]
REVID[7:0]
PRTID[7:0]
REVID
PARTID
PINMODE_SW
HW_SW_CTR GPIO32_SW_MODE[2:0]
L_MODE
RSRVD
PINMODE_HW
SLAVEADR
EEREV
9
0x00
0x50
0x00
0xD9
GPIO_HW_MODE[5:0]
SLAVEADR_GPIO1_SW[7:1]
EEREV[7:0]
RSRVD
10
11
12
RSRVD
DEV_CTL
RESETN_SW SYNCN_SW
RSRVD
SYNC_AUTO
SYNC_MUTE
AONAFTER
LOCK
PLLSTRTMODE AUTOSTRT
INT_LIVE
13
14
0x00
0x00
LOL
LOS
CAL
RSRVD
RSRVD
SECTOPRI
RSRVD
RSRVD
INT_MASK
LOL_MASK
LOS_MASK
CAL_MASK
SECTOPRI_
MASK
INT_FLAG_POL 15
0x00
0x00
LOL_POL
LOL_INTR
RSRVD
LOS_POL
LOS_INTR
CAL_POL
CAL_INTR
RSRVD
RSRVD
SECTOPRI_
POL
RSRVD
RSRVD
INT_EN
INT_FLAG
16
SECTOPRI_
INTR
INTCTL
17
18
0x00
0x00
INT_AND_OR
OSCCTL2
RISE_VALID_ FALL_VALID_
SEC
RISE_VALID_
PRI
FALL_VALID_
PRI
RSRVD
SEC
STATCTL
19
0x00
RSRVD
STAT1_SHOOT_ STAT0_SHOOT_ RSRVD
THRU_LIMIT THRU_LIMIT
STAT1_OPEND STAT0_OPEND
MUTELVL1
MUTELVL2
OUT_MUTE
20
21
22
0x55
0x55
0xFF
0x02
CH3_MUTE_LVL[1:0]
CH7_MUTE_LVL[1:0]
CH2_MUTE_LVL[1:0]
CH6_MUTE_LVL[1:0]
CH1_MUTE_LVL[1:0]
CH5_MUTE_LVL[1:0]
CH0_MUTE_LVL[1:0]
CH4_MUTE_LVL[1:0]
CH_7_MUTE
RSRVD
CH_6_MUTE
CH_5_MUTE
CH_4_MUTE
CH_3_MUTE
CH_2_MUTE
CH_1_MUTE
CH_0_MUTE
STATUS_MUTE 23
STATUS1_
MUTE
STATUS0_
MUTE
DYN_DLY
24
0x00
RSRVD
DIV_7_DYN_
DLY
DIV_6_DYN_
DLY
DIV_5_DYN_
DLY
DIV_4_DYN_
DLY
DIV_23_DYN_
DLY
DIV_01_DYN_
DLY
REFDETCTL
STAT0_INT
STAT1
25
27
28
0x55
0x58
0x28
DETECT_MODE_SEC[1:0]
STAT0_SEL[3:0]
DETECT_MODE_PRI[1:0]
LVL_SEL_SEC[1:0]
STAT0_POL
LVL_SEL_PRI[1:0]
RSRVD
RSRVD
STAT1_SEL[3:0]
STAT1_POL
Copyright © 2015–2018, Texas Instruments Incorporated
71
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Register Maps (continued)
Name
Address Reset
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
OSCCTL1
29
0x06
DETECT_BYP RSRVD
TERM2GND_
SEC
TERM2GND_
PRI
DIFFTERM_SEC DIFFTERM_PRI AC_MODE_SEC AC_MODE_PRI
PWDN
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
0x00
0xB0
0x30
0x01
0xB0
0x30
0x03
0x18
0x02
0x18
0x02
0x18
0x05
0x18
0x05
0x0A
0x00
0x00
0x95
0x03
RSRVD
RSRVD
RSRVD
CMOSCHPWDN CH7PWDN
OUT_0_SEL[1:0]
CH6PWDN
CH5PWDN
CH4PWDN
CH23PWDN
CH01PWDN
RSRVD
OUTCTL_0
OUTCTL_1
OUTDIV_0_1
OUTCTL_2
OUTCTL_3
OUTDIV_2_3
OUTCTL_4
OUTDIV_4
OUTCTL_5
OUTDIV_5
OUTCTL_6
OUTDIV_6
OUTCTL_7
OUTDIV_7
OUT_0_MODE1[1:0]
OUT_1_MODE1[1:0]
OUT_0_MODE2[1:0]
OUT_1_MODE2[1:0]
OUT_1_SEL[1:0]
RSRVD
OUT_0_1_DIV[7:0]
RSRVD
RSRVD
OUT_2_SEL[1:0]
OUT_3_SEL[1:0]
OUT_2_MODE1[1:0]
OUT_3_MODE1[1:0]
OUT_2_MODE2[1:0]
OUT_3_MODE2[1:0]
RSRVD
RSRVD
OUT_2_3_DIV[7:0]
CH_4_MUX[1:0]
OUT_4_DIV[7:0]
CH_5_MUX[1:0]
OUT_5_DIV[7:0]
CH_6_MUX[1:0]
OUT_6_DIV[7:0]
CH_7_MUX[1:0]
OUT_7_DIV[7:0]
RSRVD
OUT_4_SEL[1:0]
OUT_5_SEL[1:0]
OUT_6_SEL[1:0]
OUT_7_SEL[1:0]
PLLCMOSPREDIV[1:0]
OUT_4_MODE1[1:0]
OUT_4_MODE2[1:0]
OUT_5_MODE1[1:0]
OUT_6_MODE1[1:0]
OUT_7_MODE1[1:0]
STATUS1MUX[1:0]
OUT_5_MODE2[1:0]
OUT_6_MODE2[1:0]
OUT_7_MODE2[1:0]
STATUS0MUX[1:0]
CMOSDIVCTRL 45
CMOSDIV0 46
STATUS_SLEW 49
CMOSDIV0[7:0]
RSRVD
STATUS1SLEW[1:0]
RSRVD
STATUS0SLEW[1:0]
INSEL_PLL[1:0]
IPCLKSEL
IPCLKCTL
50
51
SECBUFSEL[1:0]
PRIBUFSEL[1:0]
CLKMUX_
BYPASS
RSRVD
SECONSWITCH SECBUFGAIN
PRIBUFGAIN
PLL_RDIV
PLL_MDIV
PLL_CTRL0
PLL_CTRL1
52
53
56
57
0x00
0x00
0x1E
0x18
0x00
0x66
0x00
RSRVD
PLLRDIV[2:0]
RSRVD
PLLMDIV[4:0]
RSRVD
PLL_P[2:0]
PRI_D
PLL_SYNC_EN PLL_PDN
RSRVD
PLL_CP[3:0]
PLL_NDIV_BY1 58
PLL_NDIV_BY0 59
RSRVD
PLL_NDIV[11:8]
PLL_NDIV[7:0]
RSRVD
PLL_
FRACNUM_BY2
60
61
62
PLL_NUM[21:16]
PLL_
FRACNUM_BY1
0x00
0x00
PLL_NUM[15:8]
PLL_NUM[7:0]
PLL_
FRACNUM_BY0
72
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Register Maps (continued)
Name
Address Reset
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
PLL_
FRACDEN_BY2
63
64
65
66
0x00
0x00
0x00
0x0C
RSRVD
PLL_DEN[21:16]
PLL_
FRACDEN_BY1
PLL_DEN[15:8]
PLL_DEN[7:0]
RSRVD
PLL_
FRACDEN_BY0
PLL_
PLL_DTHRMODE[1:0]
PLL_ORDER[1:0]
MASHCTRL
PLL_LF_R2
PLL_LF_C1
PLL_LF_R3
67
68
69
0x24
0x00
0x00
RSRVD
RSRVD
RSRVD
PLL_LF_R2[5:0]
PLL_LF_C1[2:0]
PLL_LF_R3[5:0]
PLL_LF_INT_FR
AC
PLL_LF_C3
SEC_CTRL
70
72
0x00
0x18
0x00
0x00
RSRVD
RSRVD
RSRVD
RSRVD
PLL_LF_C3[2:0]
SEC_D
RSRVD
MARGIN_OPTION[1:0]
XO_MARGINING 86
MARGIN_DIG_STEP[2:0]
RSRVD
RSRVD
XO_OFFSET_
GPIO5_STEP_1
_BY1
88
89
90
91
92
93
94
95
XOOFFSET_STEP1[9:8]
XOOFFSET_STEP2[9:8]
XOOFFSET_STEP3[9:8]
XOOFFSET_STEP4[9:8]
XO_OFFSET_
GPIO5_STEP_1
_BY0
0xDE
0x01
0x18
0x01
0x4B
0x01
0x86
XOOFFSET_STEP1[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_2
_BY1
XO_OFFSET_
GPIO5_STEP_2
_BY0
XOOFFSET_STEP2[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_3
_BY1
XO_OFFSET_
GPIO5_STEP_3
_BY0
XOOFFSET_STEP3[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_4
_BY1
XO_OFFSET_
GPIO5_STEP_4
_BY0
XOOFFSET_STEP4[7:0]
Copyright © 2015–2018, Texas Instruments Incorporated
73
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Register Maps (continued)
Name
Address Reset
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
XO_OFFSET_
GPIO5_STEP_5
_BY1
96
0x01
0xBE
0x01
0xFE
0x02
0x47
0x02
0x9E
RSRVD
XOOFFSET_STEP5[9:8]
XOOFFSET_STEP6[9:8]
XOOFFSET_STEP7[9:8]
XOOFFSET_STEP8[9:8]
XOOFFSET_SW[9:8]
XO_OFFSET_
GPIO5_STEP_5
_BY0
97
XOOFFSET_STEP5[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_6
_BY1
98
XO_OFFSET_
GPIO5_STEP_6
_BY0
99
XOOFFSET_STEP6[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_7
_BY1
100
101
102
103
XO_OFFSET_
GPIO5_STEP_7
_BY0
XOOFFSET_STEP7[7:0]
RSRVD
XO_OFFSET_
GPIO5_STEP_8
_BY1
XO_OFFSET_
GPIO5_STEP_8
_BY0
XOOFFSET_STEP8[7:0]
XO_OFFSET_
SW_BY1
104
105
117
0x00
0x00
0x00
RSRVD
XO_OFFSET_
SW_BY0
XOOFFSET_SW[7:0]
PLL_CTRL2
PLL_STRETC RSRVD
H
PLL_CTRL3
118
119
0x03
0x01
RSRVD
RSRVD
PLL_DISABLE_4TH[2:0]
PLL_CLSDWAIT[1:0] PLL_VCOWAIT[1:0]
PLL_
CALCTRL0
PLL_
120
0x00
RSRVD
PLL_LOOPBW
CALCTRL1
NVMSCRC
NVMCNT
135
136
137
138
139
0x00
0x00
0x10
0x00
0x00
NVMSCRC[7:0]
NVMCNT[7:0]
NVMCTL
RSRVD
REGCOMMIT
NVMCRCERR
NVMAUTOCRC NVMCOMMIT
MEMADR[11:8]
NVMBUSY
RSRVD
NVMPROG
NVMLCRC
MEMADR_BY1
NVMLCRC[7:0]
RSRVD
74
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Register Maps (continued)
Name
Address Reset
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
MEMADR_BY0
NVMDAT
RAMDAT
ROMDAT
NVMUNLK
140
141
142
143
144
145
0x00
0x00
0x00
0x00
0x00
0x00
MEMADR[7:0]
NVMDAT[7:0]
RAMDAT[7:0]
ROMDAT[7:0]
NVMUNLK[7:0]
RSRVD
REGCOMMIT_
PAGE
REGCOMMIT_PG[3:0]
XOCAPCTRL_
BY1
199
200
0x00
0x00
RSRVD
XO_CAP_CTRL[9:8]
XOCAPCTRL_
BY0
XO_CAP_CTRL[7:0]
Copyright © 2015–2018, Texas Instruments Incorporated
75
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.1 VNDRID_BY1 Register; R0
The VNDRID_BY1 and VNDRID_BY0 registers are used to store the unique 16-bit Vendor Identification number
assigned to I2C vendors.
Bit # Field
Type Reset
0x10
EEPRO Description
M
[7:0] VNDRID[15:8]
R
N
Vendor Identification Number Byte 1. The Vendor Identification Number is a
unique 16-bit identification number assigned to I2C vendors.
10.6.2 VNDRID_BY0 Register; R1
The VNDRID_BY0 register is described in the following table.
Bit # Field
Type Reset
0x0B
EEPROM Description
N Vendor Identification Number Byte 0.
[7:0] VNDRID[7:0]
R
10.6.3 PRODID Register; R2
The PRODID register is used to identify the LMK03318 device.
Bit # Field
Type Reset
0x33
EEPROM Description
Product Identification Number. The Product Identification Number is a unique 8-
bit identification number used to identify the LMK03318.
[7:0] PRODID[7:0]
R
N
10.6.4 REVID Register; R3
The REVID register is used to identify the LMK03318 mask revision.
Bit # Field
Type Reset
0x02
EEPROM Description
Device Revision Number. The Device Revision Number is used to identify the
LMK03318 die revision
[7:0] REVID[7:0]
R
N
10.6.5 PARTID Register; R4
Each LMK03318 device can be identified by a unique 8-bit number stored in the PARTID register. This register is
always initialized from on-chip EEPROM.
Bit # Field
Type Reset EEPROM Description
[7:0] PRTID[7:0]
R
0x01
Y
Part Identification Number. The Part Identification Number is a unique 8-bit
number which is used to serialize individual LMK03318 devices. The Part
Identification Number is factory programmed and cannot be modified by the user.
76
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.6 PINMODE_SW Register; R8
The PINMODE_SW register records the device configuration setting. The configuration setting is registered when
the reset is deasserted.
Bit # Field
[7] HW_SW_CTRL_M
ODE
Type Reset EEPROM
Description
R
0
N
HW_SW_CTRL Pin Configuration. The HW_SW_CTRL_MODE field reflects the
values sampled on the HW_SW_CTRL pin on the most recent device reset.
HW_SW_CTRL_MOD HW_SW_CTRL
E
0
1
Soft Pin Mode
Hard Pin Mode
[6:4] GPIO32_SW_MO
DE[2:0]
R
0x0
N
GPIO32_SW Pin Configuration Mode. The GPIO_SW_MODE field reflects the
values sampled on the GPIO[3:2] pins when HW_SW_CTRL is 0 on the most
recent device reset. When HW_SW_CTRL is 1 this field reads back 0x0.
GPIO_SW_MODE
0 (0x0)
GPIO[3]
GPIO[2]
0
0
0
1
1
1
0
Z
1
0
Z
1
1 (0x1)
2 (0x2)
3 (0x3)
4 (0x4)
5 (0x5)
[3:0] RSRVD
-
-
N
Reserved.
10.6.7 PINMODE_HW Register; R9
The PINMODE_HW register records the device configuration setting. The configuration setting is registered when
the reset is deasserted.
Bit # Field
Type Reset EEPROM
R 0x00 N
Description
[7:2] GPIO_HW_MOD
E[5:0]
GPIO_HW[5:0] Pin Configuration Mode. The GPIO_HW_MODE field reflects the
values sampled on pins GPIO[5:0] when HW_SW_CTRL is 1 on the most recent
device reset. When HW_SW_CTRL is 0 this field reads back 0x0.
GPIO_HW_MODE
0 (0x00)
1 (0x01)
2 (0x02)
..
GPIO[5:0]
0x00
0x01
0x02
..
..
..
61 (0x3D)
62 (0x3E)
63 (0x3F)
Reserved.
0x3D
0x3E
0x3F
[1:0] RSRVD
-
-
N
10.6.8 SLAVEADR Register; R10
The SLAVEADR register reflects the 7-bit I2C Slave Address value initialized from on-chip EEPROM.
Bit # Field
Type Reset EEPROM
R 0x50 Y
Description
[7:1] SLAVEADR_GPI
O1_SW[7:1]
I2C Slave Address. This field holds the 7-bit Slave Address used to identify this
device during I2C transactions. When HW_SW_CTRL is 0 the two least significant
bits of the address can be configured using GPIO[1] as shown. When
HW_SW_CTRL is 1 then the two least significant bits are 00.
SLAVEADR_GPIO1_SW[2:1]
GPIO[1]
0 (0x0)
0
1 (0x1)
VIM
1
3 (0x3)
[0]
RSRVD
-
-
N
Reserved.
Copyright © 2015–2018, Texas Instruments Incorporated
77
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.9 EEREV Register; R11
The EEREV register provides EEPROM/ROM image revision record and is initialized from EEPROM or ROM.
Bit # Field
Type Reset EEPROM Description
[7:0] EEREV[7:0]
R
0x0
Y
EEPROM Image Revision ID. EEPROM Image Revision is automatically retrieved
from EEPROM and stored in the EEREV register after a reset or after a EEPROM
commit operation.
10.6.10 DEV_CTL Register; R12
The DEV_CTL register holds the control functions described in the following table.
Bit Field
#
Type Reset EEPROM Description
[7] RESETN_SW
RW
RW
1
1
N
Software Reset ALL functions (active low). Writing a 0 will cause the device to return
to its power-up state apart from the I2C registers and the configuration controller.
The configuration controller is excluded to prevent a re-transfer of EEPROM data to
on-chip registers.
[6] SYNCN_SW
N
Software SYNC Assertion (active low). Writing a 0 to this bit is equivalent to
asserting the GPIO0 pin.
[5] RSRVD
-
-
N
Y
Reserved.
[4] SYNC_AUTO
RW
1
Automatic Synchronization at startup. When SYNC_AUTO is 1 at device startup a
synchronization sequence is initiated automatically after PLL lock has been
achieved.
[3] SYNC_MUTE
RW
1
0
Y
Synchronization Mute Control. The SYNC_MUTE field determines whether or not
the output drivers are muted during a Synchronization event.
SYNC_MUTE
SYNC Mute Behaviour
0
1
Do not mute any outputs during SYNC
Mute all outputs during SYNC
[2] AONAFTERLOCK RW
Y
Always On Clock behaviour after Lock. If AONAFTERLOCK is 0 then the system
clock is switched from the Always On Clock to the VCO Clock after lock and the
Always On Clock oscillator is disabled. If AONAFTERLOCK is 1 then the Always on
Clock will remain as the digital system clock regardless of the PLL Lock state. TI
recommends setting the AONAFTERLOCK to 1.
[1] RSRVD
RW
RW
0
1
Y
Y
Reserved.
[0] AUTOSTRT
Autostart. If AUTOSTRT is set to 1 the device will automatically attempt to achieve
lock and enable outputs after a device reset. A device reset can be triggered by the
power-on-reset, RESETn pin or by writing to the RESETN_SW bit. If AUTOSTRT is
0 then the device will halt after the configuration phase, a subsequent write to set
the AUTOSTRT bit to 1 will trigger the PLL Lock sequence.
10.6.11 INT_LIVE Register; R13
The INT_LIVE register reflects the current status of the interrupt sources, regardless of the state of the INT_EN
bit.
Bit # Field
Type Reset EEPROM Description
[7]
[6]
LOL
LOS
R
R
0
0
N
N
Loss of lock on PLL.
Loss of input signal to PLL. If input signal to PLL is lost and as a result PLL is
unlocked, LOS will take precedence over LOL and only LOS will be set to 1.
[5]
CAL
R
-
0
-
N
N
N
N
VCO calibration active on PLL.
[4:2] RSRVD
Reserved.
[1]
[0]
SECTOPRI
RSRVD
R
-
0
-
Switch from secondary reference to primary reference in automatic mode for PLL.
Reserved.
78
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.12 INT_MASK Register; R14
The INT_MASK register allows masking of the interrupt sources.
Bit # Field
Type Reset EEPROM Description
[7]
[6]
[5]
LOL_MASK
RW
RW
RW
RW
0
0
0
Y
Y
Y
Mask loss of lock on PLL. When LOL_MASK is 1 then the LOL interrupt source is
masked and will not cause the interrupt signal to be activated.
LOS_MASK
CAL_MASK
Mask loss of input signal to PLL. When LOS_MASK is 1 then the LOS interrupt
source is masked and will not cause the interrupt signal to be activated.
Mask VCO calibration active on PLL. When CAL_MASK is 1 then the CAL interrupt
source is masked and will not cause the interrupt signal to be activated.
[4:2] RSRVD
0
0
Y
Y
Reserved.
[1]
SECTOPRI_MAS RW
K
Mask switch from secondary reference to primary reference for PLL. When
SECTOPRI_MASK is 1 then the SECTOPRI interrupt source is masked and will not
cause the interrupt signal to be activated.
[0]
RSRVD
RW
0
Y
Reserved.
10.6.13 INT_FLAG_POL Register; R15
The INT_FLAG_POL register controls the signal polarity that sets the Interrupt Flags.
Bit # Field
Type Reset EEPRO
M
Description
[7]
[6]
[5]
LOL_POL
RW
RW
RW
RW
0
0
0
Y
Y
Y
LOL Flag Polarity. When LOL_POL is 1 then a rising edge on LOL will set the
LOL_INTR bit of the INTERRUPT_FLAG register. When LOL_POL is 0 then a falling
edge on LOL will set the LOL_INTR bit.
LOS_POL
CAL_POL
LOS Flag Polarity. When LOS_POL is 1 then a rising edge on LOS will set the
LOS_INTR bit of the INTERRUPT_FLAG register. When LOS_POL is 0 then a falling
edge on LOS will set the LOS_INTR bit.
CAL Flag Polarity. When CAL_POL is 1 then a rising edge on CAL will set the
CAL_INTR bit of the INTERRUPT_FLAG register. When CAL_POL is 0 then a falling
edge on CAL1 will set the CAL_INTR bit.
[4:2] RSRVD
0
0
Y
Y
Reserved.
[1]
SECTOPRI_POL RW
SECTOPRI Flag Polarity. When SECTOPRI_POL is 1 then a rising edge on
SECTOPRI will set the SECTOPRI_INTR bit of the INTERRUPT_FLAG register.
When SECTOPRI_POL is 0 then a falling edge on SECTOPRI will set the
SECTOPRI_INTR bit.
[0]
RSRVD
RW
0
Y
Reserved.
10.6.14 INT_FLAG Register; R16
The INT_FLAG register records rising or falling edges on the interrupt sources. The polarity is controlled by the
INT_FLAG_POL register. This register is only updated if the INT_EN register bit is set to 1.
Bit # Field
Type Reset EEPRO
M
Description
[7]
[6]
[5]
LOL_INTR
R
R
R
0
0
0
N
N
N
LOL Interrupt. The LOL_INTR bit is set when an edge of the correct polarity is
detected on the LOL interrupt source. The LOL_INTR bit is cleared by writing a 0.
LOS_INTR
CAL_INTR
LOS Interrupt. The LOS_INTR bit is set when an edge of the correct polarity is
detected on the LOS interrupt source. The LOS_INTR bit is cleared by writing a 0.
CAL Interrupt. The CAL_INTR bit is set when an edge of the correct polarity is
detected on the CAL interrupt source. The CAL_INTR bit is cleared by writing a 0.
[4:2] RSRVD
R
R
0
0
N
N
Reserved.
[1]
SECTOPRI_INTR
SECTOPRI Interrupt. The SECTOPRI_INTR bit is set when an edge of the correct
polarity is detected on the SECTOPRI interrupt source. The SECTOPRI_INTR bit is
cleared by writing a 0.
[0]
RSRVD
R
0
N
Reserved.
Copyright © 2015–2018, Texas Instruments Incorporated
79
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.15 INTCTL Register; R17
The INTCTL register allows configuration of the Interrupt operation.
Bit # Field
Type Reset EEPROM Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1]
INT_AND_OR
RW
0
Interrupt AND/OR Combination. If INT_AND_OR is 1 then the interrupts are
combined in an AND structure. In which case ALL un mAsked interrupt flags must be
active to generate the interrupt. If INT_AND_OR is 0 then the interrupts are
combined in an OR structure. In which case ANY un mAsked interrupt flags can
generate the interrupt
INT_AND_OR
Interrupt Function
0
1
OR
AND
[0]
INT_EN
RW
0
Y
Interrupt Enable. If INT_EN is 1 then the interrupt circuit is enabled, if INT_EN is 0
the interrupt circuit is disabled. When INT_EN is 0, interrupts cannot be signalled on
the STATUS pins and the INT_FLAG registers will not be updated, however the
INT_LIVE register will still reflect the current state of the internal interrupt signals.
10.6.16 OSCCTL2 Register; R18
The OSCCTL2 register provides access to input reference status signals
Bit Field
#
Type Rese EEPROM Description
t
[7] RISE_VALID_SEC
[6] FALL_VALID_SEC
[5] RISE_VALID_PRI
[4] FALL_VALID_PRI
R
R
R
R
-
0
0
0
0
-
N
N
N
N
N
Secondary Input Rising Valid Indicator from Slew Rate Detector.
Secondary Input Falling Valid Indicator from Slew Rate Detector.
Primary Input Rising Valid Indicator from Slew Rate Detector.
Primary Input Falling Valid Indicator from Slew Rate Detector.
Reserved.
[3:0 RSRVD
]
10.6.17 STATCTL Register; R19
The STATCTL register provides to STATUS0/1 output driver control signals.
Bit # Field
Type Reset EEPROM Description
[7:6] RSRVD
-
-
N
Y
Reserved.
[5]
STAT1_SHOOT_ RW
THRU_LIMIT
0
STATUS1 Output Shoot Through Current Limit. When
STAT1_SHOOT_THRU_LIMIT is 1 then the transient current spikes are minimized,
the performance of the STATUS1 output is degraded in this mode.
[4]
STAT0_SHOOT_ RW
THRU_LIMIT
0
Y
STATUS0 Output Shoot Through Current Limit. When
STAT0_SHOOT_THRU_LIMIT is 1 then the transient current spikes are minimized,
the performance of the STATUS0 output is degraded in this mode.
[3:2] RSRVD
RW 0x0
Y
Y
Reserved.
[1]
STAT1_OPEND
RW
0
STATUS1 Open Drain Enable. When STAT1_OPEND is 1 the STATUS1 output is
configured as an open drain output driver.
[0]
STAT0_OPEND
RW
0
Y
STATUS0 Open Drain Enable. When STAT0_OPEND is 1 the STATUS0 output is
configured as an open drain output driver.
80
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.18 MUTELVL1 Register; R20
The MUTELVL1 register determines the Output Driver during mute for output drivers 0 to 3.
Bit # Field
Type Res EEPROM Description
et
[7:6] CH3_MUTE_LVL RW 0x1
[1:0]
Y
Y
Y
Channel 3 Output Driver Mute Level. CH3_MUTE_LVL determines the configuration of
the CH3 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH3_MUTE_LVL does not determine whether the
CH3 driver is muted or not, instead this is determined by the CH_3_MUTE register bit.
CH3_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH3 Mute Bypass
CH3 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
[5:4] CH2_MUTE_LVL RW 0x1
[1:0]
Channel 2 Output Driver Mute Level. CH2_MUTE_LVL determines the configuration of
the CH2 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH2_MUTE_LVL does not determine whether the
CH2 driver is muted or not, instead this is determined by the CH_2_MUTE register bit.
CH2_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH2 Mute Bypass
CH2 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
[3:2] CH1_MUTE_LVL RW 0x1
[1:0]
Channel 1 Output Driver Mute Level. CH1_MUTE_LVL determines the configuration of
the CH1 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH1_MUTE_LVL does not determine whether the
CH1 driver is muted or not, instead this is determined by the CH_1_MUTE register bit.
CH1_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH1 Mute Bypass
CH1 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
Copyright © 2015–2018, Texas Instruments Incorporated
81
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Bit # Field
Type Res EEPROM Description
et
[1:0] CH0_MUTE_LVL RW 0x1
[1:0]
Y
Channel 0 Output Driver Mute Level. CH0_MUTE_LVL determines the configuration of
the CH0 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH0_MUTE_LVL does not determine whether the
CH0 driver is muted or not, instead this is determined by the CH_0_MUTE register bit.
CH0_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH0 Mute Bypass
CH0 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
10.6.19 MUTELVL2 Register; R21
The MUTELVL2 register determines the Output Driver during mute for output drivers 4 to 7.
Bit # Field
Type Reset EEPROM Description
[7:6] CH7_MUTE_LV RW 0x1
L[1:0]
Y
Channel 7 Output Driver Mute Level. CH7_MUTE_LVL determines the configuration
of the CH7 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH7_MUTE_LVL does not determine whether the
CH7 driver is muted or not, instead this is determined by the CH_7_MUTE register
bit.
CH7_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH7 Mute Bypass
CH7 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
[5:4] CH6_MUTE_LV RW 0x1
L[1:0]
Y
Channel 6 Output Driver Mute Level. CH6_MUTE_LVL determines the configuration
of the CH6 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH6_MUTE_LVL does not determine whether the
CH6 driver is muted or not, instead this is determined by the CH_6_MUTE register
bit.
CH6_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH6 Mute Bypass
CH6 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Input Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
82
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
Bit # Field
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Type Reset EEPROM Description
[3:2] CH5_MUTE_LV RW 0x1
L[1:0]
Y
Channel 5 Output Driver Mute Level. CH5_MUTE_LVL determines the configuration
of the CH5 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH5_MUTE_LVL does not determine whether the
CH5 driver is muted or not, instead this is determined by the CH_5_MUTE register
bit.
CH5_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH5 Mute Bypass
CH5 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
[1:0] CH4_MUTE_LV RW 0x1
L[1:0]
Y
Channel 4 Output Driver Mute Level. CH4_MUTE_LVL determines the configuration
of the CH4 Output Driver during mute as shown in the following table and is
recommended to be set to 0x3. CH4_MUTE_LVL does not determine whether the
CH4 driver is muted or not, instead this is determined by the CH_4_MUTE register
bit.
CH4_MUTE_LVL
0 (0x0)
DIFF MODE
CMOS MODE
CH4 Mute Bypass
CH4 Mute Bypass
1 (0x1)
Powerdown, output goes to Out_P Normal Operation,
Vcm
Out_N Force Output Low
2 (0x2)
3 (0x3)
Force output High
Out_P Force Output Low,
Out_N Normal Operation
Force the positive output
node to the internal
Out_P Force Output Low,
Out_N Force Output Low
regulator output voltage rail
(when AC coupled to load)
and the negative output
node to the GND rail
Copyright © 2015–2018, Texas Instruments Incorporated
83
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.20 OUT_MUTE Register; R22
Output Channel Mute Control
Bit # Field
CH_7_MUTE
Type Reset EEPROM Description
Channel 7 Mute Control. When CH_7_MUTE is set to 1 Output Channel 7 is
[7]
[6]
[5]
[4]
[3]
[2]
[1]
[0]
RW
RW
RW
RW
RW
RW
RW
RW
1
1
1
1
1
1
1
1
Y
Y
Y
Y
Y
Y
Y
Y
automatically disabled when the selected clock source is invalid. When
CH_7_MUTE_7 is 0 Channel 7 will continue to operate regardless of the state of the
selected clock source.
CH_6_MUTE
CH_5_MUTE
CH_4_MUTE
CH_3_MUTE
CH_2_MUTE
CH_1_MUTE
CH_0_MUTE
Channel 6 Mute Control. When CH_6_MUTE is set to 1 Output Channel 6 is
automatically disabled when the selected clock source is invalid. When
CH_6_MUTE_6 is 0 Channel 6 will continue to operate regardless of the state of the
selected clock source.
Channel 5 Mute Control. When CH_5_MUTE is set to 1 Output Channel 5 is
automatically disabled when the selected clock source is invalid. When
CH_5_MUTE_5 is 0 Channel 5 will continue to operate regardless of the state of the
selected clock source.
Channel 4 Mute Control. When CH_4_MUTE is set to 1 Output Channel 4 is
automatically disabled when the selected clock source is invalid. When
CH_4_MUTE_4 is 0 Channel 4 will continue to operate regardless of the state of the
selected clock source.
Channel 3 Mute Control. When CH_3_MUTE is set to 1 Output Channel 3 is
automatically disabled when the selected clock source is invalid. When CH_3_MUTE
is 0 Channel 3 will continue to operate regardless of the state of the selected clock
source.
Channel 2 Mute Control. When CH_2_MUTE is set to 1 Output Channel 2 is
automatically disabled when the selected clock source is invalid. When CH_2_MUTE
is 0 Channel 2 will continue to operate regardless of the state of the selected clock
source.
Channel 1 Mute Control. When CH_1_MUTE is set to 1 Output Channel 1 is
automatically disabled when the selected clock source is invalid. When CH_1_MUTE
is 0 Channel 1 will continue to operate regardless of the state of the selected clock
source.
Channel 0 Mute Control. When CH_0_MUTE is set to 1 Output Channel 0 is
automatically disabled when the selected clock source is invalid. When CH_0_MUTE
is 0 Channel 0 will continue to operate regardless of the state of the selected clock
source.
10.6.21 STATUS_MUTE Register; R23
Status CMOS Output Mute Control
Bit # Field
Type Reset EEPROM Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1]
STATUS1_MUTE RW
1
STATUS 1 Mute Control. When the STATUS1 output is configuted to provide a
CMOS Clock and the STATUS1_MUTE bit is set to 1 then the STATUS1 Output is
automatically disabled when the selected clock source is invalid. When
STATUS1_MUTE is 0 the STATUS1 Output will continue to operate regardless of the
state of the selected clock source. If the STATUS1 output is not configured to provide
a Clock then it will continue to operate regardless of the STATUS1_MUTE bit value.
[0]
STATUS0_MUTE RW
0
Y
STATUS 0 Mute Control. When the STATUS0 output is configuted to provide a
CMOS Clock and the STATUS0_MUTE bit is set to 1 then the STATUS0 Output is
automatically disabled when the selected clock source is invalid. When
STATUS0_MUTE is 0 the STATUS0 Output will continue to operate regardless of the
state of the selected clock source. If the STATUS0 output is not configured to provide
a Clock then it will continue to operate regardless of the STATUS0_MUTE bit value.
84
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.22 DYN_DLY Register; R24
Output Divider Dynamic Delay Control
Bit # Field
Type Reset EEPROM Description
[7:6] RSRVD
-
-
N
Y
Reserved.
[5]
[4]
[3]
[2]
[1]
[0]
DIV_7_DYN_DL RW
Y
0
Channel 7 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
DIV_6_DYN_DL RW
Y
0
0
0
0
0
Y
Y
Y
Y
Y
Channel 6 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
DIV_5_DYN_DL RW
Y
Channel 5 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
DIV_4_DYN_DL RW
Y
Channel 4 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
DIV_23_DYN_D RW
LY
Channel 23 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
DIV_01_DYN_D RW
LY
Channel 01 Divider Dynamic Delay Control. Enables coarse frequency margining for
divide value > 8
Copyright © 2015–2018, Texas Instruments Incorporated
85
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.23 REFDETCTL Register; R25
The REFDETCTL register provides control over input reference clock detect features.
Bit # Field
Type Reset EEPROM Description
[7:6] DETECT_MOD RW 0x1
E_SEC[1:0]
Y
Secondary Input Energy Detector Mode Control. The DETECT_MODE_SEC field
determines the method for Energy Detection on a single-ended signal on the
Secondary Input as follows. When rising and/or falling slew rate detector is enabled,
the reference input should meet the following conditions for correct operation: VIH
<
1.7 V and VIL > 0.2 V. When VIH/VIL level detector is enabled, the reference input
should meet the following conditions for correct operation: VIH < 1.5 V and VIL > 0.4
V.
DETECT_MODE_SEC
0 (0x0)
Energy Detection Method
Rising Slew Rate Detector
Rising and Falling Slew Rate Detector
Falling Slew Rate Detector
VIH/VIL Level Detector
1 (0x1)
2 (0x2)
3 (0x3)
[5:4] DETECT_MOD RW 0x1
E_PRI[1:0]
Y
Primary Input Energy Detector Mode Control. The DETECT_MODE_PRI field
determines the method for Energy Detection on a single-ended signal on the Primary
Input as follows. When rising and/or falling slew rate detector is enabled, the
reference input should meet the following conditions for correct operation: VIH < 1.7 V
and VIL > 0.2 V. When VIH/VIL level detector is enabled, the reference input should
meet the following conditions for correct operation: VIH < 1.5 V and VIL > 0.4 V.
DETECT_MODE_PRI
0 (0x0)
Energy Detection Method
Rising Slew Rate Detector
Rising and Falling Slew Rate Detector
Falling Slew Rate Detector
VIH/VIL Level Detector
1 (0x1)
2 (0x2)
3 (0x3)
[3:2] LVL_SEL_SEC[ RW 0x1
1:0]
Y
Secondary Input Comparator Level Selection. The LVL_SEL_SEC fields determines
the levels on a differential signal for the Secondary Input Energy Detection block as
follows.
LVL_SEL_SEC
0 (0x0)
Comparator Levels
200 mV Differential
300 mV Differential
400 mV Differential
RESERVED
1 (0x1)
2 (0x2)
3 (0x3)
[1:0] LVL_SEL_PRI[1 RW 0x1
:0]
Y
Primary Input Comparator Level Selection. The LVL_SEL_PRI field determines the
levels on a differential signal for the Primary Input Energy Detection block as follows.
LVL_SEL_PRI
0 (0x0)
Comparator Levels
200 mV Differential
300 mV Differential
400 mV Differential
RESERVED
1 (0x1)
2 (0x2)
3 (0x3)
86
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.24 STAT0_INT Register; R27
The STAT0_INT register provides control of the STATUS0 output and Interrupt configuration. The STATUS0 pin
is also used for test and diagnostic functions. The test configuration registers override the STAT0_INT register.
Bit # Field
Type Reset EEPROM Description
[7:4] STAT0_SEL[3:0] RW 0x5
Y
STATUS0 Indicator Signal Select.
STAT0CFG
0 (0x0)
STATUS0 Information
PRIREF Loss of Signal (LOS)
SECREF Loss of Signal (LOS)
PLL Loss of Lock (LOL)
1 (0x1)
2 (0x2)
3 (0x3)
PLL R Divider, divided by 2 (when R Divider is
not bypassed)
4 (0x4)
5 (0x5)
6 (0x6)
7 (0x7)
8 (0x8)
9 (0x9)
10 (0xA)
PLL N Divider, divided by 2
Reserved
Reserved
Reserved
PLL VCO Calibration Active (CAL)
Reserved
Interrupt (INTR). Derived from INT_FLAG
register bits.
11 (0xB)
PLL M Divider, divided by 2 (when M Divider is
not bypassed)
12 (0xC)
13 (0xD)
14 (0xE)
Reserved
EEPROM Active
PLL Secondary to Primary Switch in Automatic
Mode
15 (0xF)
Reserved
The polarity of STATUS0 is set by the STAT0POL bit.
Copyright © 2015–2018, Texas Instruments Incorporated
87
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Bit # Field
Type Reset EEPROM Description
[3]
STAT0_POL
RW
1
Y
STATUS0 Output Polarity. The STAT0_POL bit defines the polarity of information
presented on the STATUS0 output. If STAT0_POL is set to 1 then STATUS0 is active
high, if STAT0_POL is 0 then STATUS0 is active low.
[2:0] RSRVD
-
-
N
Reserved.
10.6.25 STAT1 Register; R28
The STAT1_INT register provides control of the STATUS1 output. The STATUS1 pin is also used for test and
diagnostic functions. The test configuration registers override the STAT0 register.
Bit # Field
Type Reset EEPROM Description
[7:4] STAT1_SEL[3:0] RW 0x2
Y
STATUS1 Indicator Signal Select. The STAT1_SEL field determines what
information is presented on the STATUS1 output as follows.
STAT1CFG
0 (0x0)
STATUS1 Information
PRIREF Loss of Signal (LOS)
SECREF Loss of Signal (LOS)
PLL Loss of Lock (LOL)
1 (0x1)
2 (0x2)
3 (0x3)
PLL R Divider, divided by 2 (when R Divider is
not bypassed)
4 (0x4)
5 (0x5)
6 (0x6)
7 (0x7)
8 (0x8)
9 (0x9)
10 (0xA)
11 (0xB)
PLL N Divider, divided by 2
Reserved
Reserved
Reserved
PLL VCO Calibration Active (CAL)
Reserved
Interrupt (INTR)
PLL M Divider, divided by 2 (when M Divider is
not bypassed)
12 (0xC)
13 (0xD)
14 (0xE)
Reserved
EEPROM Active
PLL Secondary to Primary Switch in Automatic
Mode
15 (0xF)
Reserved
The polarity of STATUS1 is set by the STAT1POL bit.
[3]
STAT1_POL
RW
-
1
-
Y
N
STATUS1 Output Polarity. The STAT1_POL bit defines the polarity of information
presented on the STATUS1 output. If STAT1_POL is set to 1 then STATUS1 is
active high, if STAT1_POL is 0 then STATUS1 is active low.
[2:0] RSRVD
Reserved.
88
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.26 OSCCTL1 Register; R29
The OSCCTL1 register provides control over input reference clock features.
Bit # Field
Type Reset EEPROM
Description
[7]
DETECT_BYP RW
0
Y
Signal Detector Bypass. When DETECT_BYP is 1 the output of the Signal Detector's,
both Primary and Secondary are ingored and the inputs are always considered to be
valid by the PLL control state machines. The DETECT_BYP bit has no effect on the
Interrupt register or STATUS output's.
[6]
[5]
RSRVD
-
-
N
Y
Reserved.
TERM2GND_S RW
EC
0
Differential Termination to GND Control for Secondary Input. When
TERM2GND_SEC is 1 an internal 50 Ω termination to GND is selected on the
Secondary input in differential mode.
[4]
TERM2GND_P RW
RI
0
Y
Differential Termination to GND Control for Primary Input. When TERM2GND_PRI is
1 an internal 50 Ω termination to GND is selected on the Primary input in differential
mode.
[3]
[2]
[1]
DIFFTERM_SE RW
C
0
1
1
Y
Y
Y
Differential Termination Control for Secondary Input. When DIFFTERM_SEC is 1 an
internal 100 Ω termination is selected on the Secondary input in differential mode.
DIFFTERM_PRI RW
Differential Termination Control for Primary Input. When DIFFTERM_PRI is 1 an
internal 100 Ω termination is selected on the Primary input in differential mode.
AC_MODE_SE RW
C
AC Coupling Mode for Secondary Input. When AC_MODE_SEC is 1, this enables the
internal input biasing to support an externally AC coupled input signal on the
SECREF inputs. When AC_MODE_SEC is 0, the internal input bias is not used.
[0]
AC_MODE_PRI RW
0
Y
AC Coupling Mode for Primary Input. When AC_MODE_PRI is 1, this enables the
internal input biasing to support an externally AC coupled input signal on the PRIREF
inputs. When AC_MODE_PRI is 0, the internal input bias is not used.
10.6.27 PWDN Register; R30
The PWDN register is described in the following table.
Bit # Field
Type Res EEPROM
et
Description
[7]
[6]
RSRVD
-
-
N
Y
Reserved.
CMOSCHPWD RW
N
0
CMOS Output Channel Powerdown.
[5]
[4]
[3]
[2]
[1]
[0]
CH7PWDN
CH6PWDN
CH5PWDN
CH4PWDN
CH23PWDN
CH01PWDN
RW
RW
RW
RW
RW
RW
0
0
0
0
0
0
Y
Y
Y
Y
Y
Y
Output Channel 7 Powerdown. When CH7PWDN is 1, the MUX and divider of channel
7 will be disabled. To shut down entire output path (output MUX, divider and buffer),
R43[5:4] should be set to 0x0 irrespective of R30.5.
Output Channel 6 Powerdown. When CH6PWDN is 1, the MUX and divider of channel
6 will be disabled. To shut down entire output path (output MUX, divider and buffer),
R41[5:4] should be set to 0x0 irrespective of R30.4.
Output Channel 5 Powerdown. When CH5PWDN is 1, the MUX and divider of channel
5 will be disabled. To shut down entire output path (output MUX, divider and buffer),
R39[5:4] should be set to 0x0 irrespective of R30.3.
Output Channel 4 Powerdown. When CH4PWDN is 1, the MUX and divider of channel
4 will be disabled. To shut down entire output path (output MUX, divider and buffer),
R37[5:4] should be set to 0x0 irrespective of R30.2.
Output Channel 23 Powerdown. When CH23PWDN is 1, the MUX and divider of
channels 2 and 3 will be disabled. To shut down entire output paths (output MUX,
divider and buffers), R35[6:5] and R34[6:5] should be set to 0x0 irrespective of R30.1.
Output Channel 01 Powerdown. When CH01PWDN is 1, the MUX and divider of
channels 0 and 1 will be disabled. To shut down entire output paths (output MUX,
divider and buffers), R32[6:5] and R31[6:5] should be set to 0x0 irrespective of R30.0.
Copyright © 2015–2018, Texas Instruments Incorporated
89
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.28 OUTCTL_0 Register; R31
The OUTCTL_0 register provides control over Output 0.
Bit # Field
[7] RSRVD
Type Reset EEPROM Description
RW
1
Y
Y
Reserved. TI recommends setting it to "0".
[6:5] OUT_0_SEL[1:0 RW 0x1
]
Channel 0 Output Driver Format Select. The OUT_0_SEL field controls the Channel 0
Output Driver as shown below.
OUT_0_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[4:3] OUT_0_MODE1 RW 0x2
[1:0]
Y
Y
N
Channel 0 Output Driver Mode1 Select.
OUT_0_MODE1 Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
4 mA (AC-LVDS)
6 mA (AC-CML)
Powerdown, low
8 mA (AC-LVPECL)
Powerup, negative polarity
Powerup, positive polarity
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[2:1] OUT_0_MODE2 RW 0x0
[1:0]
Channel 0 Output Driver Mode2 Select.
OUT_0_MODE2 Diff-Mode, RLOAD in HCSL CMOS=Mode, Out_N
mode
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Reserved.
Tristate
50 Ω
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
[0]
RSRVD
-
-
10.6.29 OUTCTL_1 Register; R32
The OUTCTL_1 register provides control over Output 1.
Bit # Field
[7] RSRVD
Type Reset EEPROM
Description
-
-
N
Y
Reserved.
[6:5] OUT_1_SEL[1: RW 0x1
0]
Channel 1 Output Driver Format Select. The OUT_1_SEL field controls the Channel
1 Output Driver as shown below.
OUT_1_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[4:3] OUT_1_MODE RW 0x2
1[1:0]
Y
Y
N
Channel 1 Output Driver Mode1 Select.
OUT_1_MODE1 Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
4 mA (AC-LVDS)
6 mA (AC-CML)
Powerdown, low
8 mA (AC-LVPECL)
Powerup, negative polarity
Powerup, positive polarity
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[2:1] OUT_1_MODE RW 0x0
2[1:0]
Channel 1 Output Driver Mode2 Select.
OUT_1_MODE2 Diff-Mode, Rload in HCSL CMOS=Mode, Out_N
mode
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Reserved.
Tristate
50 Ω
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
[0]
RSRVD
-
-
90
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.30 OUTDIV_0_1 Register; R33
Channel [1:0] Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_0_1_DIV RW 0x01
[7:0]
Y
Channel's 0 and 1 Output Divider. The Channel 0 and 1 Divider, OUT_0_1_DIV, is a
8-bit divider. The valid values for OUT_0_1_DIV range from 1 to 256 as shown below.
OUT_0_1_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
10.6.31 OUTCTL_2 Register; R34
The OUTCTL_2 register provides control over Output 2.
Bit # Field
[7] RSRVD
Type Reset EEPROM
Description
RW
1
Y
Y
Reserved. TI recommends setting it to 0.
[6:5] OUT_2_SEL[1: RW 0x1
0]
Channel 2 Output Driver Format Select. The OUT_2_SEL field controls the Channel 2
Output Driver as shown below.
OUT_2_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[4:3] OUT_2_MODE RW 0x2
1[1:0]
Y
Y
N
Channel 2 Output Driver Mode1 Select.
OUT_2_MODE1 Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
4 mA (AC-LVDS)
6 mA (AC-CML)
Powerdown, low
8 mA (AC-LVPECL)
Powerup, negative polarity
Powerup, positive polarity
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[2:1] OUT_2_MODE RW 0x0
2[1:0]
Channel 2 Output Driver Mode2 Select.
OUT_2_MODE2 Diff-Mode, Rload in HCSL
mode
CMOS=Mode, Out_N
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Reserved.
Tristate
50 Ω
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
[0]
RSRVD
-
-
Copyright © 2015–2018, Texas Instruments Incorporated
91
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.32 OUTCTL_3 Register; R35
The OUTCTL_3 register provides control over Output 3.
Bit # Field
Type Rese EEPROM
t
Description
[7] RSRVD
-
-
N
Y
Reserved.
[6:5] OUT_3_SEL[1: RW
0]
0x1
Channel 3 Output Driver Format Select. The OUT_3_SEL field controls the Channel 3
Output Driver as shown below.
OUT_3_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[4:3] OUT_3_MODE RW
1[1:0]
0x2
0x0
-
Y
Y
N
Channel 3 Output Driver Mode1 Select.
OUT_3_MODE1 Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
4 mA (AC-LVDS)
6 mA (AC-CML)
Powerdown, low
8 mA (AC-LVPECL)
Powerup, negative polarity
Powerup, positive polarity
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[2:1] OUT_3_MODE RW
2[1:0]
Channel 3 Output Driver Mode2 Select.
OUT_3_MODE2 Diff-Mode, Rload in HCSL
mode
CMOS=Mode, Out_N
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Reserved.
Tristate
50 Ω
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
[0]
RSRVD
-
10.6.33 OUTDIV_2_3 Register; R36
Channel [3:2] Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_2_3_DIV RW 0x03
[7:0]
Y
Channel's 2 and 3 Output Divider. The Channel 2 and 3 Divider, OUT_2_3_DIV, is a
8-bit divider. The valid values for OUT_2_3_DIV range from 1 to 256 as shown below.
OUT_2_3_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
92
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.34 OUTCTL_4 Register; R37
The OUTCTL_4 register provides control over Output 4
Bit # Field
Type Reset EEPROM
Description
[7:6] CH_4_MUX[1: RW 0x0
0]
Y
Channel 4 Clock Source Mux Control.
CH_4_MUX
0 (0x0)
CH4 Clock Source
PLL
1 (0x1)
Reserved
2 (0x2)
PRIMARY REFERENCE
SECONDARY REFERENCE
3 (0x3)
When the doubler is enabled the Primary and Secondary Reference options will
reflect the frequency doubled reference. If the Primary or Secondary Reference
options are selected the output divider is by-passed.
[5:4] OUT_4_SEL[1: RW 0x1
0]
Y
Y
Y
Channel 4 Output Driver Format Select. The OUT_4_SEL field controls the Channel 4
Output Driver as shown below.
OUT_1_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[3:2] OUT_4_MODE RW 0x2
1[1:0]
Channel 4 Output Driver Mode1 Select.
OUT_4_MODE1
0 (0x0)
Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
Powerdown, low
4 mA (AC-LVDS)
6 mA (AC-CML)
8 mA (AC-LVPECL)
1 (0x1)
2 (0x2)
Powerup, negative polarity
3 (0x3)
16 mA (HCSL) or 8 mA Powerup, positive polarity
(AC-LVPECL)
[1:0] OUT_4_MODE RW 0x0
2[1:0]
Channel 4 Output Driver Mode2 Select.
OUT_4_MODE2
Diff-Mode, Rload in
CMOS=Mode, Out_N
HCSL mode
Tristate
50 Ω
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Powerdown, tristate
Powerdown, low
100 Ω
Powerup, negative polarity
Powerup, positive polarity
200 Ω
10.6.35 OUTDIV_4 Register; R38
Channel 4 Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_4_DIV[7: RW 0x02
0]
Y
Channel 4 Output Divider. The Channel 4 Divider, OUT_4_DIV, is a 8-bit divider. The
valid values for OUT_4_DIV range from 1 to 256 as shown below. The divider only
operates on Channel 4 when the clock source is PLL or PLL2.
OUT_4_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
Copyright © 2015–2018, Texas Instruments Incorporated
93
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.36 OUTCTL_5 Register; R39
The OUTCTL_5 register provides control over Output 5.
Bit # Field
Type Reset EEPROM
Description
[7:6] CH_5_MUX[1 RW 0x0
:0]
Y
Channel 5 Clock Source Mux Control.
CH_5_MUX
0 (0x0)
CH5 Clock Source
PLL
1 (0x1)
Reserved
2 (0x2)
PRIMARY REFERENCE
SECONDARY REFERENCE
3 (0x3)
When the doubler is enabled the Primary and Secondary Reference options will
reflect the frequency doubled reference. If the Primary or Secondary Reference
options are selected the output divider is by-passed.
[5:4] OUT_5_SEL[ RW 0x1
1:0]
Y
Channel 5 Output Driver Format Select. The OUT_5_SEL field controls the Channel 5
Output Driver as shown below.
OUT_1_SEL
0 (0x0)
OUTPUT OPERATION
Disabled
1 (0x1)
AC-LVDS/AC-CML/AC-
LVPECL
2 (0x2)
HCSL
3 (0x3)
LVCMOS
[3:2] OUT_5_MOD RW 0x2
E1[1:0]
Y
Channel 5 Output Driver Mode1 Select.
OUT_5_MODE1
0 (0x0)
Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
4 mA (AC-LVDS)
6 mA (AC-CML)
8 mA (AC-LVPECL)
1 (0x1)
Powerdown, low
2 (0x2)
Powerup, negative polarity
Powerup, positive polarity
3 (0x3)
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[1:0] OUT_5_MOD RW 0x0
E2[1:0]
Y
Channel 5 Output Driver Mode2 Select.
OUT_5_MODE2
Diff-Mode, Rload in HCSL
CMOS=Mode, Out_N
mode
Tristate
50 Ω
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
10.6.37 OUTDIV_5 Register; R40
Channel 5 Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_5_DIV[7: RW 0x02
0]
Y
Channel 5 Output Divider. The Channel 5 Divider, OUT_5_DIV, is a 8-bit divider. The
valid values for OUT_5_DIV range from 1 to 256 as shown below. The divider only
operates on Channel 5 when the clock source is PLL or PLL2.
OUT_5_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
94
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.38 OUTCTL_6 Register; R41
The OUTCTL_6 register provides control over Output 6.
Bit # Field
Type Reset EEPROM
Description
[7:6] CH_6_MUX[1 RW 0x0
:0]
Y
Channel 6 Clock Source Mux Control.
CH_6_MUX
0 (0x0)
CH6 Clock Source
PLL
1 (0x1)
Reserved
2 (0x2)
PRIMARY REFERENCE
SECONDARY REFERENCE
3 (0x3)
When the doubler is enabled the Primary and Secondary Reference options will reflect
the frequency doubled reference. If the Primary or Secondary Reference options are
selected the output divider is by-passed.
[5:4] OUT_6_SEL[ RW 0x1
1:0]
Y
Y
Y
Channel 6 Output Driver Format Select. The OUT_6_SEL field controls the Channel 6
Output Driver as shown below.
OUT_1_SEL
OUTPUT OPERATION
Disabled
0 (0x0)
1 (0x1)
AC-LVDS/AC-CML/AC-LVPECL
HCSL
2 (0x2)
3 (0x3)
LVCMOS
[3:2] OUT_6_MOD RW 0x2
E1[1:0]
Channel 6 Output Driver Mode1 Select.
OUT_6_MODE1
0 (0x0)
Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
4 mA (AC-LVDS)
6 mA (AC-CML)
8 mA (AC-LVPECL)
1 (0x1)
Powerdown, low
2 (0x2)
Powerup, negative polarity
Powerup, positive polarity
3 (0x3)
16 mA (HCSL) or 8 mA
(AC-LVPECL)
[1:0] OUT_6_MOD RW 0x0
E2[1:0]
Channel 6 Output Driver Mode2 Select.
OUT_6_MODE2
Diff-Mode, Rload in HCSL
CMOS=Mode, Out_N
mode
Tristate
50 Ω
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
10.6.39 OUTDIV_6 Register; R42
Channel 6 Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_6_DIV[ RW 0x05
7:0]
Y
Channel 6 Output Divider. The Channel 6 Divider, OUT_6_DIV, is a 8-bit divider. The
valid values for OUT_6_DIV range from 1 to 256 as shown below. The divider only
operates on Channel 6 when the clock source is PLL or PLL2.
OUT_6_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
Copyright © 2015–2018, Texas Instruments Incorporated
95
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.40 OUTCTL_7 Register; R43
The OUTCTL_7 register provides control over Output 7.
Bit # Field
Type Reset EEPROM
Description
[7:6] CH_7_MUX[ RW
1:0]
0x0
Y
Channel 7 Clock Source Mux Control.
CH_7_MUX
0 (0x0)
CH7 Clock Source
PLL
1 (0x1)
Reserved
2 (0x2)
PRIMARY REFERENCE
SECONDARY REFERENCE
3 (0x3)
When the doubler is enabled the Primary and Secondary Reference options will
reflect the frequency doubled reference. If the Primary or Secondary Reference
options are selected the output divider is by-passed.
[5:4] OUT_7_SEL[ RW
1:0]
0x1
Y
Channel 7 Output Driver Format Select. The OUT_7_SEL field controls the Channel
7 Output Driver as shown below.
OUT_1_SEL
0 (0x0)
OUTPUT OPERATION
Disabled
1 (0x1)
AC-LVDS/AC-CML/AC-
LVPECL
2 (0x2)
HCSL
3 (0x3)
LVCMOS
[3:2] OUT_7_MO RW
DE1[1:0]
0x2
Y
Channel 7 Output Driver Mode1 Select.
OUT_7_MODE1
0 (0x0)
Diff-Mode, Itail
CMOS-Mode, Out_P
Powerdown, tristate
Powerdown, low
4 mA (AC-LVDS)
6 mA (AC-CML)
8 mA (AC-LVPECL)
1 (0x1)
2 (0x2)
Powerup, negative polarity
3 (0x3)
16 mA (HCSL) or 8 mA (AC- Powerup, positive polarity
LVPECL)
[1:0] OUT_7_MO RW
DE2[1:0]
0x0
Y
Channel 7 Output Driver Mode2 Select.
OUT_7_MODE2
Diff-Mode, Rload in HCSL
CMOS=Mode, Out_N
mode
Tristate
50 Ω
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
Powerdown, tristate
Powerdown, low
100 Ω
200 Ω
Powerup, negative polarity
Powerup, positive polarity
10.6.41 OUTDIV_7 Register; R44
Channel 7 Output Divider
Bit # Field
Type Reset EEPROM
Description
[7:0] OUT_7_DIV[ RW
7:0]
0x05
Y
Channel 7 Output Divider. The Channel 7 Divider, OUT_7_DIV, is a 8-bit divider. The
valid values for OUT_7_DIV range from 1 to 256 as shown below. The divider only
operates on Channel 7 when the clock source is PLL or PLL2.
OUT_7_DIV
0 (0x00)
1 (0x01)
2 (0x02)
...
DIVIDE RATIO
1
2
3
255 (0xFF)
256
96
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.42 CMOSDIVCTRL Register; R45
CMOS Output Divider Control. The CMOS Clock Outputs provided on STATUS0 and STATUS1 can come from
either CMOS Divider0 or CMOS Divider1. Additionally the clock source routed to the CMOS Dividers can come
from either the PLL LVCMOS Pre-Divider or the PLL2 LVCMOS Pre-Divider.
Bit # Field
Type Reset EEPROM
Description
[7:6] RSRVD
RW 0x0
Y
Y
Reserved.
[5:4] PLLCMOSPR RW 0x0
EDIV[1:0]
PLL LVCMOS Pre-Divider Selection. The PLLCMOSPREDIV field selects the divider
value for the PLL pre-divider that drives the CMOS Dividers.
PLLCMOSPREDIV
0 (0x0)
Divider Value
Disabled
1 (0x1)
4
2 (0x2)
5
3 (0x3)
Reserved
[3:2] STATUS1MU RW 0x2
X[1:0]
Y
STATUS1 Mux Selection. The STATUS1MUX field controls the signal source for the
STATUS1 Pin as described below.
STATUS1MUX
0 (0x0)
STATUS1 OPERATION
LVCMOS Clock, from STATUS0 Divider
LVCMOS Clock, from STATUS1 Divider
Normal Status Operation
1 (0x1)
2 (0x2)
3 (0x3)
STATUS1 Disabled
[1:0] STATUS0MU RW 0x2
X[1:0]
Y
STATUS0 Mux Selection. The STATUS0MUX field controls the signal source for the
STATUS0 Pin as described below.
STATUS0MUX
0 (0x0)
STATUS0 OPERATION
LVCMOS Clock, from STATUS0 Divider
LVCMOS Clock, from STATUS1 Divider
Normal Status Operation
1 (0x1)
2 (0x2)
3 (0x3)
STATUS0 Disabled
10.6.43 CMOSDIV0 Register; R46
CMOS Output Divider 0
Bit # Field
Type Reset EEPROM
Description
[7:0] CMOSDIV0[7 RW 0x00
:0]
Y
CMOS Output Divider 0. The CMOS Divider0, CMOSDIV0, is a 8-bit divider that
divides the clock source from the PLL LVCMOS Pre-Divider output. The valid values
for CMOSDIV0 range from 1 to 256 as shown below.
CMOSDIV0
0 (0x00)
DIVIDE RATIO
Disabled
6
1 (0x01), 2 (0x02), 3 (0x03), 4
(0x04), 5 (0x05)
6 (0x06)
7 (0x07)
...
7
8
255 (0xFF)
256
Copyright © 2015–2018, Texas Instruments Incorporated
97
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.44 STATUS_SLEW Register; R49
Status CMOS Output Slew Control
Bit # Field
Type Reset EEPROM
Description
[7:4] RSRVD
-
-
N
Y
Reserved.
[3:2] STATUS1SL RW 0x0
EW[1:0]
STATUS1 Slew Control. The STATUS1SLEW field controls the slew rate of the
STATUS1 output as shown below.
STATUS1SLEW
0 (0x0)
STATUS1 Rise/Fall Time
Fast (0.35 ns)
1 (0x1)
RESERVED
2 (0x2)
Slow (2.1 ns)
3 (0x3)
RESERVED
[1:0] STATUS0SL RW 0x0
EW[1:0]
Y
STATUS0 Slew Control. The STATUS0SLEW field controls the slew rate of the
STATUS0 output as shown below.
STATUS0SLEW
0 (0x0)
STATUS0 Rise/Fall Time
Fast (0.35 ns)
1 (0x1)
RESERVED
2 (0x2)
Slow (2.1 ns)
3 (0x3)
RESERVED
10.6.45 IPCLKSEL Register; R50
Input Clock Select
Bit # Field
Type Reset EEPROM
Description
[7:6] SECBUFSEL RW 0x2
[1:0]
Y
Secondary Input Buffer Selection. SECBUFSEL configures the Secondary Input Buffer
as follows.
SECBUFSEL
0 (0x0)
Mode
Single-ended Input
Differential Input
Crystal Input
Disabled
1 (0x1)
2 (0x2)
3 (0x3)
[5:4] PRIBUFSEL[ RW 0x1
1:0]
Y
Primary Input Buffer Selection. PRIBUFSEL configures the Primary Input Buffer as
follows.
PRIBUFSEL
0 (0x0)
Mode
Single-ended Input
Differential Input
Disabled
1 (0x1)
2 (0x2)
3 (0x3)
Disabled
[3:2] RSRVD
RW 0x1
Y
Y
Reserved.
[1:0] INSEL_PLL[1 RW 0x1
:0]
Reference Input Selection for PLL. INSEL_PLL Determines the input select for PLL as
follows.
INSEL_PLL
0 (0x0)
Input Mode
Automatic, Primary is preferred.
Determined by external pin, REFSEL.
Primary Input Selected.
1 (0x1)
2 (0x2)
3 (0x3)
Secondary Input Selected.
When INSEL_PLL is equal to b01 the REFSEL pin determines the reference clock
source for PLL as follows.
REFSEL
PLL Reference Clock
0
PLL Reference is Primary input
PLL Reference is Secondary input
PLL Input MUX is set to Automatic Mode
VIM
1
98
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.46 IPCLKCTL Register; R51
Input Clock Control
Bit # Field
[7] CLKMUX_BY RW
PASS
Type Reset EEPROM
Description
0
Y
Clock Mux Bypass. Controls whether the glitch-less clock mux on the the Primary and
Secondary Reference paths is enabled. When CLKMUX_BYPASS is 1 then the clock
mux is by-passed.
[6:3] RSRVD
RW 0x0
Y
Y
Reserved.
[2]
SECONSWIT RW
0
1
1
Secondary Crystal Input Buffer On after Switch. Determines whether the Secondary
Crystal Input Buffer remains on after a switch back to the Primary Input. If
SECONSWITCH is 0 then the Secomdary Crystal Input Buffer is disabled after a
switch back to the Primary input. If SECONSWITCH is 1 then the Secondary Crystal
Input Buffer remains active after a switch back to the Primary input.
CH
[1]
[0]
SECBUFGAI RW
N
Y
Y
Secondary Input Buffer Gain.
SECBUFGAIN
GAIN
0
Minimum
Maximum
1
PRIBUFGAI RW
N
Primary Input Buffer Gain.
PRIBUFGAIN
GAIN
0
1
Minimum
Maximum
10.6.47 PLL_RDIV Register; R52
R Divider for PLL
Bit # Field
Type Reset EEPROM
Description
[7:3] RSRVD
-
-
N
Y
Reserved.
[2:0] PLLRDIV[2:0 RW 0x0
]
PLL R Divider. PLL R Divider ratio is set by PLLRDIV.
PLLRDIV
0 (0x0)
1 (0x1)
...
PLL R-Divider Value
Bypass
2
...
8
7 (0x7)
10.6.48 PLL_MDIV Register; R53
M Divider for PLL
Bit # Field
Type Reset EEPROM
Description
[7:5] RSRVD
-
-
N
Y
Reserved.
[4:0] PLLMDIV[4:0 RW 0x00
]
PLL M Divider. PLL M Divider ratio is set by PLLMDIV.
PLLMDIV
0 (0x00)
1 (0x01)
...
PLL M-Divider Value
Bypass
2
...
32
31 (0x1F)
Copyright © 2015–2018, Texas Instruments Incorporated
99
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.49 PLL_CTRL0 Register; R56
The PLL_CTRL0 register provides control of PLL. The PLL_CTRL0 register fields are described in the following
table.
Bit # Field
Type Reset EEPROM
Description
[7:5] RSRVD
[4:2] PLL_P[2:0]
-
-
N
Y
Reserved.
RW 0x7
PLL Post-Divider. The PLL_P field selects the PLL post-divider value as follows.
PLL_P
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
4 (0x4)
5 (0x5)
6 (0x6)
7 (0x7)
Post Divider Value
2
2
3
4
5
6
7
8
[1]
[0]
PLL_SYNC_ RW
EN
1
Y
Y
PLL SYNC Enable. If PLL_SYNC_EN is 1 then a SYNC event will cause all channels
which use PLL as a clock source to be re-synchronized.
PLL_PDN
RW
0
PLL Powerdown. The PLL_PDN bit determines whether PLL is automatically enabled
and calibrated after a hardware reset. If the PLL_PDN bit is set to 1 during normal
operation then PLL is disabled and the calibration circuit is reset. When PLL_PDN is
then cleared to 0 PLL is re-enabled and the calibration sequence is automatically
restarted.
PLL_PDN
PLL STATE
PLL Enabled
PLL Disabled
0
1
10.6.50 PLL_CTRL1 Register; R57
The PLL_CTRL1 register provides control of PLL. The PLL_CTRL1 register fields are described in the following
table.
Bit # Field
Type Reset EEPROM
Description
Reserved.
Reserved.
[7:6] RSRVD
-
-
N
Y
Y
[5]
[4]
RSRVD
PRI_D
RW
RW
0
1
Primary Reference Doubler Enable. If PRI_D is 1 the Primary Input Frequency Doubler
is enabled.
[3:0] PLL_CP[3:0 RW 0x8
]
Y
PLL Charge Pump Gain. The PLL_CP sets the chargepump current as follows.
PLL_CP
1 (0x1)
2 (0x2)
3 (0x3)
4 (0x4)
5 (0x5)
6 (0x6)
7 (0x7)
8 (0x8)
Icp (mA)
0.4
0.8
1.2
1.6
2.0
2.4
2.8
6.4
100
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.51 PLL_NDIV_BY1 Register; R58
The 12-bit N integer divider value for PLL is set by the PLL_NDIV_BY1 and PLL_NDIV_BY0 registers.
Bit # Field
Type Res EEPROM
et
Description
[7:4] RSRVD
-
-
N
Y
Reserved.
[3:0] PLL_NDIV[ RW 0x0
11:8]
PLL N Divider Byte 1. PLL Integer N Divider bits 11 to 8.
PLL_NDIV
0 (0x000)
1 (0x001)
...
DIVIDER RATIO
1
1
...
4095 (0xFFF)
4095
10.6.52 PLL_NDIV_BY0 Register; R59
The PLL_NDIV_BY0 register is described in the following table.
Bit Field
#
Type Reset EEPROM
Description
PLL N Divider Byte 0. PLL Integer N Divider bits 7 to 0.
[7:0 PLL_NDIV[7 RW
:0]
0x66
Y
]
10.6.53 PLL_FRACNUM_BY2 Register; R60
The Fractional Divider Numerator value for PLL is set by registers PLL_FRACNUM_BY2, PLL_FRACNUM_BY1
and PLL_FRACNUM_BY0.
Bit Field
#
Type Reset EEPROM
Description
[7:6 RSRVD
]
-
-
N
Y
Reserved.
[5:0 PLL_NUM[2 RW
1:16]
0x00
PLL Fractional Divider Numerator Byte 2. Bits 21 to 16.
]
10.6.54 PLL_FRACNUM_BY1 Register; R61
The PLL_FRACNUM_BY1 register is described in the following table.
Bit Field
#
Type Reset EEPROM
Description
[7:0 PLL_NUM[15 RW 0x00
:8]
Y
PLL Fractional Divider Numerator Byte 1. Bits 15 to 8.
]
10.6.55 PLL_FRACNUM_BY0 Register; R62
The PLL_FRACNUM_BY0 register is described in the following table.
Bit Field
#
Type Reset EEPROM
Description
[7:0 PLL_NUM[7: RW 0x00
0]
Y
PLL Fractional Divider Numerator Byte 0. Bits 7 to 0.
]
10.6.56 PLL_FRACDEN_BY2 Register; R63
The Fractional Divider Denominator value for PLL is set by registers PLL_FRACDEN_BY2, PLL_FRACDEN_BY1
and PLL_FRACDEN_BY0.
Bit # Field
Type Reset EEPROM
Description
[7:6] RSRVD
-
-
N
Y
Reserved.
[5:0] PLL_DEN[2 RW 0x00
1:16]
PLL Fractional Divider Denominator Byte 2. Bits 21 to 16.
Copyright © 2015–2018, Texas Instruments Incorporated
101
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.57 PLL_FRACDEN_BY1 Register; R64
The PLL_FRACDEN_BY1 register is described in the following table.
Bit # Field
Type Reset EEPROM
Description
[7:0] PLL_DEN[1 RW 0x00
5:8]
Y
PLL Fractional Divider Denominator Byte 1. Bits 15 to 8.
10.6.58 PLL_FRACDEN_BY0 Register; R65
The PLL_FRACDEN_BY0 register is described in the following table.
Bit # Field
Type Reset EEPROM Description
[7:0] PLL_DEN[7 RW 0x00
:0]
Y
PLL Fractional Divider Denominator Byte 0. Bits 7 to 0.
10.6.59 PLL_MASHCTRL Register; R66
The PLL_MASHCTRL register provides control of the fractional divider for PLL.
Bit # Field
Type Reset
EEPROM Description
[7:4] RSRVD
-
-
N
Y
Reserved.
[3:2] PLL_DTH RW 0x3
Mash Engine dither mode control.
RMODE[1:
0]
DITHERMODE
0 (0x0)
Dither Configuration
Weak
1 (0x1)
Medium
2 (0x2)
Strong
3 (0x3)
Dither Disabled
[1:0] PLL_ORD RW 0x0
ER[1:0]
Y
Mash Engine Order.
ORDER
Order Configuration
Integer Mode Divider
1st order
0 (0x0)
1 (0x1)
2 (0x2)
2nd order
3 (0x3)
3rd order
10.6.60 PLL_LF_R2 Register; R67
The PLL_LF_R2 register controls the value of the PLL Loop Filter R2.
Bit # Field
Type Reset EEPROM
Description
[7:6] RSRVD
-
-
N
Y
Reserved.
[5:0] PLL_LF_R2 RW 0x24
[5:0]
PLL Loop Filter R2. NOTE: Table below lists commonly used R2 values but more
selections are available.
PLL_LF_R2[5:0]
1 (0x01)
R2 (Ω)
236
2 (0x02)
336
4 (0x04)
536
8 (0x08)
735
32 (0x20)
48 (0x30)
1636
2418
10.6.61 PLL_LF_C1 Register; R68
The PLL_LF_C1 register controls the value of the PLL Loop Filter C1.
Bit # Field
Type Reset
EEPROM
Description
[7:3] RSRVD
-
-
N
Y
Reserved.
[2:0] PLL_LF_C RW 0x0
1[2:0]
PLL Loop Filter C1. The value in pF is given by 5 + 50 * PLL_LF_C1 (in binary).
102
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.62 PLL_LF_R3 Register; R69
The PLL_LF_R3 register controls the value of the PLL Loop Filter R3.
Bit # Field
[7] RSRVD
Type Reset
EEPROM
Description
-
-
N
Y
Reserved.
[6:1] PLL_LF_R RW 0x0
3[5:0]
PLL Loop Filter R3. NOTE: Table below lists commonly used R3 values but more
selections are available.
PLL_LF_R3[5:0]
0 (0x00)
R3 (Ω)
18
2 (0x02)
318
4 (0x04)
518
8 (0x08)
717
16 (0x10)
32 (0x20)
64 (0x40)
854
1654
3254
[0]
PLL_LF_I RW
NT_FRAC
0
Y
PLL Loop Filter Setting. Set to 0 for integer PLL and to 1 for fractional PLL.
10.6.63 PLL_LF_C3 Register; R70
The PLL_LF_C3 register controls the value of the PLL Loop Filter C3.
Bit # Field
Type Reset
EEPROM
Description
[7:3] RSRVD
-
-
N
Y
Reserved.
[2:0] PLL_LF_C RW 0x0
3[2:0]
PLL Loop Filter C3. The value in pF is given by 5 * PLL_LF_C3 (in binary).
10.6.64 SEC_CTRL Register; R72
The SEC_CTRL register controls the value of the Secondary Reference Doubler.
Bit # Field
Type Reset EEPROM
Description
Reserved.
Reserved.
[7:6] RSRVD
-
-
N
Y
Y
[5]
[4]
RSRVD
SEC_D
RW
RW
0
1
Secondary Reference Doubler Enable. If SEC_D is 1 the Secondary Input Frequency
Doubler is enabled.
[3:0] RSRVD
RW 0x8
Y
Reserved.
Copyright © 2015–2018, Texas Instruments Incorporated
103
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.65 XO_MARGINING Register; R86
Margin Control
Bit # Field
Type Reset EEPROM
Description
[7]
RSRVD
-
-
N
N
Reserved.
[6:4] MARGIN
_DIG_ST
R
0x0
Margin Digital Step. MARGIN_DIG_STEP allows the current level of the margin selection
pin (GPIO[5]) to be read.
EP[2:0]
MARGIN_DIG_STEP
0 (0x0)
Value
STEP1
1 (0x1)
STEP2
2 (0x2)
STEP3
3 (0x3)
STEP4. (Nominal loading for zero frequency offset
4 (0x4)
STEP5
STEP6
STEP7
STEP8
5 (0x5)
6 (0x6)
7 (0x7)
[3:2] MARGIN RW 0x0
Y
Margin Option Select. The MARGIN_OPTION field defines the operation of the Frequency
Margining as follows.
_OPTIO
N[1:0]
MARGIN_OPTIONS
0 (0x0)
MARGIN Mode
Margining Enabled when GPIO4 pin is low. GPIO5 pin
selects the frequency offset setting (STEP1 to STEP8).
When GPIO4 pin is high, STEP4 offset value is selected
to use the nominal crystal loading.
1 (0x1)
Margining Enabled. GPIO5 pin selects the frequency
offset setting (STEP1 to STEP8). GPIO4 pin state is
ignored.
2 (0x2)
N
Margining Enabled. Frequency offset is controlled by
XOOFFSET_SW register bits (R104 and R105).
[1:0] RSRVD
-
-
Reserved.
10.6.66 XO_OFFSET_GPIO5_STEP_1_BY1 Register; R88
XO Margining Step 1 Offset Value (bits 9-8)
Bit # Field
Type Reset
EEPROM
Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x00
EP1[9:8]
XO Margining Step 1 Offset Value.
10.6.67 XO_OFFSET_GPIO5_STEP_1_BY0 Register; R89
XO Margining Step 1 Offset Value (bits 7-0)
Bit # Field
Type Reset
EEPROM
Description
[7:0] XOOFFSET_ST RW 0xDE
EP1[7:0]
Y
XO Margining Step 1 Offset Value.
10.6.68 XO_OFFSET_GPIO5_STEP_2_BY1 Register; R90
XO Margining Step 1 Offset Value (bits 9-8)
Bit # Field
Type Reset
EEPROM
Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x01
EP2[9:8]
XO Margining Step 2 Offset Value.
104
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.69 XO_OFFSET_GPIO5_STEP_2_BY0 Register; R91
XO Margining Step 2 Offset Value (bits 7-0)
Bit # Field
Type Reset
EEPROM
Description
[7:0] XOOFFSET_ST RW 0x18
EP2[7:0]
Y
XO Margining Step 2 Offset Value.
10.6.70 XO_OFFSET_GPIO5_STEP_3_BY1 Register; R92
XO Margining Step 3 Offset Value (bits 9-8)
Bit # Field
Type Reset EEPROM
Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW
EP3[9:8]
0x01
XO Margining Step 3 Offset Value.
10.6.71 XO_OFFSET_GPIO5_STEP_3_BY0 Register; R93
XO Margining Step 3 Offset Value (bits 7-0)
Bit # Field
Type Reset
EEPROM
Description
[7:0] XOOFFSET_ST RW 0x4B
EP3[7:0]
Y
XO Margining Step 3 Offset Value.
10.6.72 XO_OFFSET_GPIO5_STEP_4_BY1 Register; R94
XO Margining Step 4 Offset Value (bits 9-8)
Bit # Field
Type Reset
EEPROM
Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x1
EP4[9:8]
XO Margining Step 4 Offset Value.
10.6.73 XO_OFFSET_GPIO5_STEP_4_BY0 Register; R95
XO Margining Step 4 Offset Value (bits 7-0)
Bit # Field
Type Reset EEPROM
Description
[7:0] XOOFFSET_ST RW 0x86
EP4[7:0]
Y
XO Margining Step 4 Offset Value.
10.6.74 XO_OFFSET_GPIO5_STEP_5_BY1 Register; R96
XO Margining Step 5 Offset Value (bits 9-8)
Bit # Field
Type Reset EEPROM
Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x1
EP5[9:8]
XO Margining Step 5 Offset Value.
10.6.75 XO_OFFSET_GPIO5_STEP_5_BY0 Register; R97
XO Margining Step 5 Offset Value (bits 7-0)
Bit # Field
Type Reset EEPROM Description
[7:0] XOOFFSET_ST RW
EP5[7:0]
0xBE
Y
XO Margining Step 5 Offset Value.
Copyright © 2015–2018, Texas Instruments Incorporated
105
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.76 XO_OFFSET_GPIO5_STEP_6_BY1 Register; R98
XO Margining Step 6 Offset Value (bits 9-8)
Bit # Field
Type Reset EEPROM Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x1
EP6[9:8]
XO Margining Step 6 Offset Value.
10.6.77 XO_OFFSET_GPIO5_STEP_6_BY0 Register; R99
XO Margining Step 6 Offset Value (bits 7-0)
Bit # Field
Type Reset EEPROM Description
[7:0] XOOFFSET_ST RW 0xFE
EP6[7:0]
Y
XO Margining Step 6 Offset Value.
10.6.78 XO_OFFSET_GPIO5_STEP_7_BY1 Register; R100
XO Margining Step 7 Offset Value (bits 9-8)
Bit # Field
Type Reset EEPROM Description
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW 0x2
EP7[9:8]
XO Margining Step 7 Offset Value.
10.6.79 XO_OFFSET_GPIO5_STEP_7_BY0 Register; R101
XO Margining Step 7 Offset Value (bits 7-0)
Bit # Field
Type Reset EEPROM Description
[7:0] XOOFFSET_ST RW
EP7[7:0]
0x47
Y
XO Margining Step 7 Offset Value.
10.6.80 XO_OFFSET_GPIO5_STEP_8_BY1 Register; R102
XO Margining Step 8 Offset Value (bits 9-8)
Bit # Field
Type Reset EEPRO Description
M
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_ST RW
EP8[9:8]
0x2
XO Margining Step 8 Offset Value.
10.6.81 XO_OFFSET_GPIO5_STEP_8_BY0 Register; R103
XO Margining Step 8 Offset Value (bits 7-0)
Bit # Field
Type Reset EEPRO Description
M
[7:0] XOOFFSET_ST RW
EP8[7:0]
0x9E
Y
XO Margining Step 8 Offset Value.
10.6.82 XO_OFFSET_SW_BY1 Register; R104
Software Controlled XO Margining Offset Value (bits 9-8).
Bit # Field
Type Reset EEPRO Description
M
[7:2] RSRVD
-
-
N
Y
Reserved.
[1:0] XOOFFSET_S
W[9:8]
RW
0x0
XO Margining Software Controlled Offset Value.
106
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.83 XO_OFFSET_SW_BY0 Register; R105
Software Controlled XO Margining Offset Value (bits 7-0).
Bit # Field
Type Reset EEPRO Description
M
[7:0] XOOFFSET_S
W[7:0]
RW
0x00
Y
XO Margining Software Controlled Offset Value.
10.6.84 PLL_CTRL2 Register; R117
The PLL_CTRL2 register provides control of PLL. The PLL_CTRL2 register fields are described in the following
table.
Bit # Field
[7] PLL_STRET RW
CH
Type Reset EEPROM Description
0
Y
Stretch PFD minimum pump width in fractional mode. A value of 0 is recommended for
Integer-N PLL and sets the phase detector pulse width to 200 ps. A value of 1 is
recommended for Fractional-N PLL and stretches the pulse width to roughly 600 ps.
[6:0] RSRVD
-
-
N
Reserved.
10.6.85 PLL_CTRL3 Register; R118
The PLL_CTRL3 register provides control of PLL. The PLL_CTRL3 register fields are described in the following
table.
Bit # Field
Type Reset EEPROM Description
[7:3] RSRVD
-
-
N
Y
Reserved.
[2:0] PLL_DISABL RW
E_4TH[2:0]
0x3
PLL Loop Filter Settings.
PLL_DISABLE_4TH[2:0]
0 (0x0), 1 (0x1), 2 (0x2)
3 (0x3)
MODE
RESERVED
2nd Order Loop Filter Recommended Setting
for Integer PLL Mode.
4 (0x4), 5 (0x5), 6 (0x6)
7 (0x7)
RESERVED
3rd Order Loop Filter Recommended Setting
for Fractional PLL Mode.
10.6.86 PLL_CALCTRL0 Register; R119
The PLL_CALCTRL0 register is described in the following table.
Bit # Field
Type Reset EEPROM Description
[7:4] RSRVD
-
-
N
Y
Reserved.
[3:2] PLL_CLSDW RW
AIT[1:0]
0x0
Closed Loop Wait Period. The CLSDWAIT field sets the closed loop wait period, in
periods of the always on clock as follows. Use 0x1 for clock generator mode (> 10 kHz
loop bandwidth) and 0x3 for jitter cleaner mode (< 1 kHz loop bandwidth).
CLSDWAIT
Analog closed loop VCO stabilization time
0 (0x0)
30 µs
1 (0x1)
300 µs
30 ms
300 ms
2 (0x2)
3 (0x3)
[1:0] PLL_VCOWA RW
IT[1:0]
0x1
Y
VCO Wait Period. Use 0x1 for all modes.
VCOWAIT
0 (0x0)
1 (0x1)
2 (0x2)
3 (0x3)
VCO stabilization time
20 µs
400 µs
8000 µs
200000 µs
Copyright © 2015–2018, Texas Instruments Incorporated
107
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.87 PLL_CALCTRL1 Register; R120
The PLL_CALCTRL1 register is described in the following table.
Bit # Field
Type Reset EEPROM Description
[7:1] RSRVD
-
-
N
Y
Reserved.
[0]
PLL_LOOPB RW
W
0
PLL Loop bandwidth Control. When PLL_LOOPBW is 1 the loop bandwidth of PLL is
reduced to 200 Hz (jitter cleaner mode). When PLL_LOOPBW is 0 the loop bandwidth of
PLL is set to its normal range (clock generator mode). NOTE: Proper PLL settings must
be used (PFD, charge pump, loop filter) with setting the desired value for
PLL_LOOPBW.
10.6.88 NVMCNT Register; R136
The NVMCNT register is intended to reflect the number of on-chip EEPROM Erase/Program cycles that have
taken place in EEPROM. The count is automatically incremented by hardware and stored in EEPROM.
Bit # Field
Type Reset EEPROM Description
0x00
[7:0] NVMCNT[7:0
]
R
Y
EEPROM Program Count. The NVMCNT increments automatically after every EEPROM
Erase/Program Cycle. The NVMCNT value is retreived automatically after reset, after a
EEPROM Commit operation or after a Erase/Program cycle. The NVMCNT register will
increment until it reaches its maximum value of 255 after which no further increments will
take place.
10.6.89 NVMCTL Register; R137
The NVMCTL register allows control of the on-chip EEPROM Memories.
Bit # Field
Type Reset EEPROM Description
[7]
[6]
RSRVD
-
-
N
N
Reserved.
REGCOMMI RWS
T
0
REG Commit to EEPROM SRAM Array. The REGCOMMIT bit is used to initiate a
transfer from the on-chip registers back to the corresponding location in the EEPROM
SRAM Array. The REGCOMMIT bit is automatically cleared to 0 when the transfer is
complete. The particular page of SRAM used as the destination for the transfer is
selected by the REGCOMMIT_PAGE register.
C
[5]
[4]
[3]
NVMCRCE
RR
R
0
1
0
N
N
N
EEPROM CRC Error Indication. The NVMCRCERR bit is set to 1 if a CRC Error has
been detected when reading back from on-chip EEPROM during device configuration.
NVMAUTO RW
CRC
EEPROM Automatic CRC. When NVMAUTOCRC is 1 then the EEPROM Stored CRC
byte is automatically calculated whenever an EEPROM program takes place.
NVMCOMM RWS
IT
EEPROM Commit to Registers. The NVMCOMMIT bit is used to initiate a transfer of the
on-chip EEPROM contents to internal registers. The transfer happens automatically after
reset or when NVMCOMMIT is set to 1. The NVMCOMMIT bit is automatically cleared to
0. The I2C registers cannot be read while a EEPROM Commit operation is taking place.
The NVMCOMMIT operation can only carried out when the Always On Clock is active.
The Always On Clock can be kept running after lock by setting the AONAFTERLOCK bit.
C
[2]
[1]
[0]
NVMBUSY
RSRVD
R
0
0
0
N
N
N
EEPROM Program Busy Indication. The NVMBUSY bit is 1 during an on-chip EEPROM
Erase/Program cycle. While NVMBUSY is 1 the on-chip EEPROM cannot be accessed.
RWS
C
Reserved.
NVMPROG RWS
C
EEPROM Program Start. The NVMPROG bit is used to begin an on-chip EEPROM
Erase/Program cycle. The Erase/Program cycle is only initiated if the immediately
preceding I2C transaction was a write to the NVMUNLK register with the appropriate
code. The NVMPROG bit is automatically cleared to 0. The EEPROM Erase/Program
operation takes around 230 ms.
10.6.90 NVMLCRC Register; R138
The NVMLCRC register holds the Live CRC byte that has been calculated while reading on-chip EEPROM.
Bit # Field
Type Reset EEPROM Description
0x00 EEPROM Live CRC.
[7:0] NVMLCRC[
7:0]
R
N
108
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.91 MEMADR_BY1 Register; R139
The MEMADR_BY1 register holds the MSB of the starting address for on-chip SRAM or EEPROM access.
Bit # Field
Type Reset EEPROM Description
[7:4] RSRVD
-
-
N
N
Reserved.
[3:0] MEMADR[1 RW
1:8]
0x0
Memory Address. The MEMADR value determines the starting address for access to the
on-chip memories. The on-chip memories and the corresponding address ranges are
listed below. The data from the selected address is then accessed using one of the data
registers listed below.
MEMORY
MEMADR Range
Data Register
NVMDAT
EEPROM EEPROM- MEMADR[8:0]
Array
EEPROM SRAM-
Array
MEMADR[8:0]
RAMDAT
ROMDAT
ROM-Array
MEMADR[11:0]
10.6.92 MEMADR_BY0 Register; R140
The MEMADR_BY0 register holds the lower 8-bits of the starting address for on-chip SRAM or EEPROM access.
Bit # Field
Type Reset EEPROM Description
[7:0] MEMADR[7: RW
0]
0x00
N
Memory Address.
10.6.93 NVMDAT Register; R141
The NVMDAT register returns the on-chip EEPROM contents from the starting address specified by the
MEMADR register.
Bit # Field
Type Reset EEPROM Description
0x00
[7:0] NVMDAT[7:
0]
R
N
EEPROM Read Data. The first time an I2C read transaction accesses the NVMDAT
register address, either because it was explicitly targeted or because the address was
auto-incremented, the read transaction will return the EEPROM data located at the
address specified by the MEMADR register. Any additional read's which are part of the
same transaction will cause the EEPROM address to be incremented and the next
EEPROM data byte will be returned. The I2C address will no longer be auto-
incremented, that is, the I2C address will be locked to the NVMDAT register after the first
access. Access to the NVMDAT register will terminate at the end of the current I2C
transaction.
10.6.94 RAMDAT Register; R142
The RAMDAT register provides read and write access to the SRAM that forms part of the on-chip EEPROM
module.
Bit #
Field
Type Reset EEPRO Description
M
[7:0]
RAMDAT[7: RW
0]
0x00
N
RAM Read/Write Data. The first time an I2C read or write transaction accesses the
RAMDAT register address, either because it was explicitly targeted or because the
address was auto-incremented, a read transaction will return the RAM data located at the
address specified by the MEMADR register and a write transaction will cause the current
I2C data to be written to the address specified by the MEMADR register. Any additional
accesses which are part of the same transaction will cause the RAM address to be
incremented and a read or write access will take place to the next SRAM address. The
I2C address will no longer be auto-incremented, that is, the I2C address will be locked to
the RAMDAT register after the first access. Access to the RAMDAT register will
terminate at the end of the current I2Cs transaction.
Copyright © 2015–2018, Texas Instruments Incorporated
109
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
10.6.95 ROMDAT Register; R143
The romdat register provides read to the on-chip ROM module.
Bit #
Field
Type Reset EEPRO Description
M
[7:0]
ROMDAT[7:
0]
R
0x00
N
ROM Read Data. The first time an I2C read or write transaction accesses the romdat
register address, either because it was explicitly targeted or because the address was
auto-incremented, a read transaction will return the ROM data located at the address
specified by the MEMADR register. Any additional accesses which are part of the same
transaction will cause the ROM address to be incremented and a read access will take
place to the next ROM address. The I2C address will no longer be auto-incremented, that
is, the I2C address will be locked to the romdat register after the first access. Access to
the ROMDAT register will terminate at the end of the current I2C transaction.
10.6.96 NVMUNLK Register; R144
The NVMUNLK register provides a rudimentary level of protection to prevent inadvertent programming of the on-
chip EEPROM.
Bit #
Field
Type Reset EEPRO Description
M
[7:0]
NVMUNLK[ RW
7:0]
0x0
N
EEPROM Prog Unlock. The NVMUNLK register must be written immediately prior to
setting the NVMPROG bit of register NVMCTL, otherwise the Erase/Program cycle will
not be triggered. NVMUNLK must be written with a value of 0xEA.
10.6.97 REGCOMMIT_PAGE Register; R145
The REGCOMMIT_PAGE register determines the region of the EEPROM/SRAM array that is populated by the
REGCOMMIT operation.
Bit #
Field
Type Reset EEPRO Description
M
[7:4]
[3:0]
RSRVD
-
-
N
N
Reserved.
REGCOMM RW
IT_PG[3:0]
0x0
Register Commit Page (1 of 6 available pages that can be selected by the GPIO[3:2] pins
for default powerup state. NOTE: Valid page values are 0 to 5. Do not use other values.)
10.6.98 XOCAPCTRL_BY1 Register; R199
The XOCAPCTRL_BY1 and XOCAPCTRL_BY0 registers allow read-back of the XOCAPCTRL value that
displays the on-chip load capacitance selected for the crystal.
Bit #
Field
Type Reset EEPRO
M
Description
[7:2]
[1:0]
RSRVD
-
-
N
N
Reserved.
XO_CAP_
CTRL[9:8]
R
0x0
XO CAP CTRL register.
10.6.99 XOCAPCTRL_BY0 Register; R200
The XOCAPCTRL_BY1 and XOCAPCTRL_BY0 registers allow read-back of the XOCAPCTRL value that
displays the on-chip load capacitance selected for the crystal.
Bit #
Field
Type Reset EEPRO
M
Description
[7:0]
XO_CAP_C
TRL[7:0]
R
0x00
N
XO CAP CTRL register.
110
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
10.6.100 EEPROM Map
The EEPROM map is shown in the table below. There are 6 EEPROM pages and the common EEPROM bits are shown first. Any bit that is labeled as
"RSRVD" should be written with a 0.
Byte #
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
1
1
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
NVMSCRC[0]
NVMCNT[0]
RSRVD
2
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
3
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
4
NVMSCRC[7]
NVMCNT[7]
NVMSCRC[6]
NVMCNT[6]
NVMSCRC[5]
NVMCNT[5]
NVMSCRC[4]
NVMCNT[4]
NVMSCRC[3]
NVMCNT[3]
NVMSCRC[2]
NVMCNT[2]
NVMSCRC[1]
NVMCNT[1]
RSRVD
5
11
SLAVEADR_GPIO SLAVEADR_GPIO1_ SLAVEADR_GPIO1_ SLAVEADR_GPIO1_ SLAVEADR_GPIO1_ RSRVD
1_SW[7]
EEREV[7]
SYNC_AUTO
1
SW[6]
SW[5]
SW[4]
SW[3]
12
13
14
15
EEREV[6]
SYNC_MUTE
1
EEREV[5]
AONAFTERLOCK
1
EEREV[4]
EEREV[3]
AUTOSTRT
1
EEREV[2]
EEREV[1]
LOS_MASK
LOS_POL
INT_EN
EEREV[0]
CAL_MASK
CAL_POL
PLLSTRTMODE
SECTOPRI_MASK
SECTOPRI_POL
LOL_MASK
LOL_POL
RSRVD
RSRVD
RSRVD
RSRVD
INT_AND_OR
STAT1_SHOOT_T
HRU_LIMIT
16
17
18
STAT0_SHOOT_T RSRVD
HRU_LIMIT
RSRVD
STAT1_OPEND
STAT0_OPEND
CH3_MUTE_LVL[1] CH3_MUTE_LVL[0] CH2_MUTE_LVL[1
]
CH2_MUTE_LVL[0 CH1_MUTE_LVL[1] CH1_MUTE_LVL[0] CH0_MUTE_LVL[1] CH0_MUTE_LVL[0] CH7_MUTE_LVL[1] CH7_MUTE_LVL[0] CH6_MUTE_LVL[1
]
]
CH6_MUTE_LVL[0 CH5_MUTE_LVL[1] CH5_MUTE_LVL[0] CH4_MUTE_LVL[1] CH4_MUTE_LVL[0] CH_7_MUTE
]
CH_6_MUTE
CH_5_MUTE
19
20
CH_4_MUTE
CH_3_MUTE
CH_2_MUTE
CH_1_MUTE
CH_0_MUTE
STATUS1_MUTE
STATUS0_MUTE
DIV_7_DYN_DLY
DIV_6_DYN_DLY DIV_5_DYN_DLY
DIV_4_DYN_DLY
DIV_23_DYN_DLY
DIV_01_DYN_DLY
DETECT_MODE_SE DETECT_MODE_SE DETECT_MODE_
C[1]
C[0]
PRI[1]
21
22
23
24
25
26
DETECT_MODE_ LVL_SEL_SEC[1]
PRI[0]
LVL_SEL_SEC[0]
RSRVD
LVL_SEL_PRI[1]
LVL_SEL_PRI[0]
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP
9] 8] 7] 6] 1[5]
XOOFFSET_STEP XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP1[ XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP
1[4] 3] 2] 1] 0] 9] 8] 2[7]
XOOFFSET_STEP XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP2[ XOOFFSET_STEP
2[6] 5] 4] 3] 2] 1] 0] 3[9]
XOOFFSET_STEP XOOFFSET_STEP3[ XOOFFSET_STEP3[ XOOFFSET_STEP3[ XOOFFSET_STEP3[ XOOFFSET_STEP3[ XOOFFSET_STEP3[ XOOFFSET_STEP
3[8] 7] 6] 5] 4] 3] 2] 3[1]
XOOFFSET_STEP XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP
3[0] 9] 8] 7] 6] 5] 4] 5[3]
Copyright © 2015–2018, Texas Instruments Incorporated
111
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Byte #
Bit7
XOOFFSET_STEP XOOFFSET_STEP5[ XOOFFSET_STEP5[ XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP
5[2] 1] 0] 9] 8] 7] 6] 6[5]
XOOFFSET_STEP XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP6[ XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP
6[4] 3] 2] 1] 0] 9] 8] 7[7]
XOOFFSET_STEP XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP7[ XOOFFSET_STEP
7[6] 5] 4] 3] 2] 1] 0] 8[9]
XOOFFSET_STEP XOOFFSET_STEP8[ XOOFFSET_STEP8[ XOOFFSET_STEP8[ XOOFFSET_STEP8[ XOOFFSET_STEP8[ XOOFFSET_STEP8[ XOOFFSET_STEP
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
27
28
29
30
31
32
8[8]
7]
6]
5]
4]
3]
2]
8[1]
XOOFFSET_STEP XOOFFSET_SW[9]
8[0]
XOOFFSET_SW[8]
XOOFFSET_SW[7]
XOOFFSET_SW[6]
XOOFFSET_SW[5]
XOOFFSET_SW[4]
XOOFFSET_SW[3
]
XOOFFSET_SW[2 XOOFFSET_SW[1]
]
XOOFFSET_SW[0]
RSRVD
RSRVD
1
RSRVD
1
33
34
35
36
37
38
1
RSRVD
RSRVD
RSRVD
1
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
1
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
1
1
1
1
RSRVD
1
RSRVD
RSRVD
RSRVD
RSRVD
1
1
1
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
EEPROM_PAGE=0, 1, 2, 3, 4, 5
39, 90,
141, 192,
243, 294
RSRVD
OUT_0_SEL[1]
OUT_0_SEL[0]
OUT_1_MODE1[0]
OUT_0_1_DIV[2]
OUT_2_MODE2[1]
OUT_2_3_DIV[7]
CH_4_MUX[1]
OUT_0_MODE1[1]
OUT_1_MODE2[1]
OUT_0_1_DIV[1]
OUT_2_MODE2[0]
OUT_2_3_DIV[6]
CH_4_MUX[0]
OUT_0_MODE1[0]
OUT_1_MODE2[0]
OUT_0_1_DIV[0]
OUT_3_SEL[1]
OUT_0_MODE2[1]
OUT_0_1_DIV[7]
RSRVD
OUT_0_MODE2[0]
OUT_0_1_DIV[6]
OUT_2_SEL[1]
OUT_1_SEL[1]
40, 91,
142, 193,
244, 295
OUT_1_SEL[0]
OUT_0_1_DIV[4]
OUT_1_MODE1[1]
OUT_0_1_DIV[3]
OUT_0_1_DIV[5]
OUT_2_SEL[0]
41, 92,
143, 194,
245, 296
42, 93,
144, 195,
246, 297
OUT_2_MODE1[1] OUT_2_MODE1[0]
OUT_3_MODE2[1] OUT_3_MODE2[0]
OUT_3_SEL[0]
OUT_2_3_DIV[4]
OUT_4_SEL[0]
OUT_4_DIV[4]
OUT_3_MODE1[1]
OUT_2_3_DIV[3]
OUT_4_MODE1[1]
OUT_4_DIV[3]
OUT_3_MODE1[0]
OUT_2_3_DIV[2]
OUT_4_MODE1[0]
OUT_4_DIV[2]
43, 94,
145, 196,
247, 298
OUT_2_3_DIV[5]
OUT_4_SEL[1]
44, 95,
146, 197,
248, 299
OUT_2_3_DIV[1]
OUT_2_3_DIV[0]
45, 96,
OUT_4_MODE2[1] OUT_4_MODE2[0]
OUT_4_DIV[7]
OUT_4_DIV[6]
OUT_4_DIV[5]
147, 198,
249, 300
112
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Byte #
Bit7
OUT_4_DIV[1]
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
46, 97,
OUT_4_DIV[0]
CH_5_MUX[1]
CH_5_MUX[0]
OUT_5_SEL[1]
OUT_5_SEL[0]
OUT_5_MODE1[1]
OUT_5_MODE1[0]
148, 199,
250, 301
47, 98,
149, 200,
251, 302
OUT_5_MODE2[1] OUT_5_MODE2[0]
OUT_5_DIV[7]
CH_6_MUX[1]
OUT_6_DIV[7]
CH_7_MUX[1]
OUT_7_DIV[7]
RSRVD
OUT_5_DIV[6]
CH_6_MUX[0]
OUT_6_DIV[6]
CH_7_MUX[0]
OUT_7_DIV[6]
RSRVD
OUT_5_DIV[5]
OUT_6_SEL[1]
OUT_6_DIV[5]
OUT_7_SEL[1]
OUT_7_DIV[5]
OUT_5_DIV[4]
OUT_6_SEL[0]
OUT_6_DIV[4]
OUT_7_SEL[0]
OUT_7_DIV[4]
OUT_5_DIV[3]
OUT_5_DIV[2]
OUT_6_MODE1[0]
OUT_6_DIV[2]
OUT_7_MODE1[0]
OUT_7_DIV[2]
STATUS1MUX[0]
CMOSDIV0[2]
RSRVD
48, 99,
150, 201,
252, 303
OUT_5_DIV[1]
OUT_5_DIV[0]
OUT_6_MODE1[1]
OUT_6_DIV[3]
49, 100, OUT_6_MODE2[1] OUT_6_MODE2[0]
151, 202,
253, 304
50, 101, OUT_6_DIV[1]
152, 203,
254, 305
OUT_6_DIV[0]
OUT_7_MODE1[1]
OUT_7_DIV[3]
51, 102, OUT_7_MODE2[1] OUT_7_MODE2[0]
153, 204,
255, 306
52, 103, OUT_7_DIV[1]
154, 205,
256, 307
OUT_7_DIV[0]
STATUS0MUX[0]
CMOSDIV0[0]
RSRVD
PLLCMOSPREDIV[1 PLLCMOSPREDIV[0 STATUS1MUX[1]
]
]
53, 104, STATUS0MUX[1]
155, 206,
257, 308
CMOSDIV0[7]
RSRVD
CMOSDIV0[6]
RSRVD
CMOSDIV0[5]
CMOSDIV0[4]
CMOSDIV0[3]
RSRVD
54, 105, CMOSDIV0[1]
156, 207,
258, 309
RSRVD
RSRVD
55, 106, RSRVD
157, 208,
259, 310
CH_7_PREDRVR
STATUS1SLEW[1]
RSRVD
CH_6_PREDRVR
STATUS1SLEW[0]
RSRVD
CH_5_PREDRVR
STATUS0SLEW[1]
INSEL_PLL[1]
PRIBUFGAIN
PLLMDIV[0]
CH_4_PREDRVR
STATUS0SLEW[0]
INSEL_PLL[0]
PLLRDIV[2]
CH_3_PREDRVR
SECBUFSEL[1]
CLKMUX_BYPASS
PLLRDIV[1]
CH_2_PREDRVR
SECBUFSEL[0]
RSRVD
56, 107, CH_1_PREDRVR CH_0_PREDRVR
158, 209,
260, 311
57, 108, PRIBUFSEL[1]
159, 210,
261, 312
PRIBUFSEL[0]
RSRVD
58, 109, RSRVD
160, 211,
262, 313
RSRVD
SECBUFGAIN
PLLMDIV[1]
PLLRDIV[0]
59, 110, PLLMDIV[4]
161, 212,
PLLMDIV[3]
PLLMDIV[2]
RSRVD
RSRVD
RSRVD
263, 314
Copyright © 2015–2018, Texas Instruments Incorporated
113
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Byte #
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
60, 111, RSRVD
162, 213,
RSRVD
RSRVD
RSRVD
RSRVD
PLL_P[2]
PLL_P[1]
PLL_P[0]
264, 315
61, 112, PLL_SYNC_EN
163, 214,
265, 316
PLL_PDN
RSRVD
PRI_D
PLL_CP[3]
PLL_CP[2]
PLL_CP[1]
PLL_CP[0]
PLL_NDIV[4]
PLL_NUM[18]
PLL_NUM[10]
PLL_NUM[2]
PLL_DEN[16]
PLL_DEN[8]
PLL_DEN[0]
PLL_LF_R2[2]
PLL_LF_R3[4]
RSRVD
62, 113, PLL_NDIV[11]
164, 215,
266, 317
PLL_NDIV[10]
PLL_NDIV[2]
PLL_NUM[16]
PLL_NUM[8]
PLL_NUM[0]
PLL_DEN[14]
PLL_DEN[6]
PLL_NDIV[9]
PLL_NDIV[1]
PLL_NUM[15]
PLL_NUM[7]
PLL_DEN[21]
PLL_DEN[13]
PLL_DEN[5]
PLL_NDIV[8]
PLL_NDIV[0]
PLL_NUM[14]
PLL_NUM[6]
PLL_DEN[20]
PLL_DEN[12]
PLL_DEN[4]
PLL_ORDER[0]
PLL_LF_C1[1]
PLL_LF_R3[0]
1
PLL_NDIV[7]
PLL_NUM[21]
PLL_NUM[13]
PLL_NUM[5]
PLL_DEN[19]
PLL_DEN[11]
PLL_DEN[3]
PLL_LF_R2[5]
PLL_LF_C1[0]
PLL_LF_C3[2]
RSRVD
PLL_NDIV[6]
PLL_NUM[20]
PLL_NUM[12]
PLL_NUM[4]
PLL_DEN[18]
PLL_DEN[10]
PLL_DEN[2]
PLL_LF_R2[4]
PLL_LF_R3[6]
PLL_LF_C3[1]
SEC_D
PLL_NDIV[5]
PLL_NUM[19]
PLL_NUM[11]
PLL_NUM[3]
PLL_DEN[17]
PLL_DEN[9]
PLL_DEN[1]
PLL_LF_R2[3]
PLL_LF_R3[5]
PLL_LF_C3[0]
RSRVD
63, 114, PLL_NDIV[3]
165, 216,
267, 318
64, 115, PLL_NUM[17]
166, 217,
268, 319
65, 116, PLL_NUM[9]
167, 218,
269, 320
66, 117, PLL_NUM[1]
168, 219,
270, 321
67, 118, PLL_DEN[15]
169, 220,
271, 322
68, 119, PLL_DEN[7]
170, 221,
272, 323
69, 120, PLL_DTHRMODE[ PLL_DTHRMODE[0] PLL_ORDER[1]
171, 222, 1]
273, 324
70, 121, PLL_LF_R2[1]
172, 223,
274, 325
PLL_LF_R2[0]
PLL_LF_R3[2]
RSRVD
PLL_LF_C1[2]
PLL_LF_R3[1]
RSRVD
71, 122, PLL_LF_R3[3]
173, 224,
275, 326
72, 123, RSRVD
174, 225,
RSRVD
276, 327
73, 124, RSRVD
175, 226,
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
277, 328
114
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Byte #
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
74, 125, RSRVD
176, 227,
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
278, 329
75, 126, RSRVD
177, 228,
279, 330
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
RSRVD
76, 127, RSRVD
178, 229,
280, 331
RSRVD
RSRVD
RSRVD
RSRVD
77, 128, RSRVD
179, 230,
281, 332
RSRVD
RSRVD
RSRVD
RSRVD
78, 129, RSRVD
180, 231,
282, 333
RSRVD
RSRVD
RSRVD
RSRVD
79, 130, RSRVD
181, 232,
283, 334
RSRVD
RSRVD
RSRVD
RSRVD
80, 131, RSRVD
182, 233,
284, 335
RSRVD
RSRVD
RSRVD
RSRVD
81, 132, RSRVD
183, 234,
285, 336
RSRVD
RSRVD
RSRVD
RSRVD
82, 133, RSRVD
184, 235,
RSRVD
RSRVD
RSRVD
RSRVD
286, 337
83, 134, RSRVD
185, 236,
287, 338
MARGIN_OPTION[1] MARGIN_OPTION[0] STAT0_SEL[3]
STAT0_SEL[2]
STAT1_POL
CMOSCHPWDN
STAT0_SEL[1]
DETECT_BYP
CH7PWDN
STAT0_SEL[0]
TERM2GND_SEC
CH6PWDN
STAT0_POL
TERM2GND_PRI
CH5PWDN
84, 135, STAT1_SEL[3]
186, 237,
288, 339
STAT1_SEL[2]
DIFFTERM_PRI
CH23PWDN
STAT1_SEL[1]
AC_MODE_SEC
CH01PWDN
STAT1_SEL[0]
AC_MODE_PRI
PLL_STRETCH
PLL_LOOPBW
85, 136, DIFFTERM_SEC
187, 238,
289, 340
86, 137, CH4PWDN
188, 239,
290, 341
PLL_DISABLE_4TH[ PLL_DISABLE_4TH[ PLL_DISABLE_4TH[ PLL_CLSDWAIT[1]
2]
1]
0]
87, 138, PLL_CLSDWAIT[0] PLL_VCOWAIT[1]
PLL_VCOWAIT[0]
RSRVD
RSRVD
1
1
189, 240,
291, 342
Copyright © 2015–2018, Texas Instruments Incorporated
115
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Byte #
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
XOOFFSET_STEP4[ XOOFFSET_STEP4[ XOOFFSET_STEP
9] 8] 4[7]
Bit1
Bit0
88, 139, RSRVD
190, 241,
RSRVD
RSRVD
RSRVD
RSRVD
292, 343
89, 140, XOOFFSET_STEP XOOFFSET_STEP4[ XOOFFSET_STEP4[ XOOFFSET_STEP4[ XOOFFSET_STEP4[ XOOFFSET_STEP4[ XOOFFSET_STEP4[ SECONSWITCH
191, 242, 4[6]
293, 344
5]
4]
3]
2]
1]
0]
116
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Application Information
The LMK03318 is an ultra-low jitter clock generator that can be used to provide reference clocks for high-speed
serial links resulting in improved system performance. The LMK03318 also supports a variety of features that
aids the hardware designer during the system debug and validation phase.
11.2 Typical Applications
11.2.1 Application Block Diagram Examples
25 MHz (buffered)
CPLD
Low-jitter PHY
ref clocks
156.25 MHz
10G
PHY
125 MHz
1G
PHY
PLL
5 GHz
CLK
Dist.
100 MHz
33 MHz
PCIe
25-MHz
crystal
Osc
CPU/
NPU
Up to ±50 ppm
frequency
margining with
pullable crystal
Figure 76. 10 Gb Ethernet Switch/Router Line Card
Low-jitter PHY ref
clocks
156.25 MHz (4x)
10G PHY
PLL
5 GHz
CLK
Dist.
25-MHz
crystal
25 MHz
Osc
CPLD
Up to ±50 ppm
frequency
33 MHz
CPU
margining with
pullable crystal
Figure 77. 10-Gb Ethernet Switch
Copyright © 2015–2018, Texas Instruments Incorporated
117
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Applications (continued)
25 MHz
CPLD
10G
10G
156.25 MHz (2x)
106.25 MHz (2x)
132.8125 MHz (2x)
PHY
25-MHz
crystal
8
8G
FC
CLK
Dist.
Osc
PLL (Frac)
5.3125 GHz
Up to ±50 ppm
frequency
G
16G
FC
margining with
pullable crystal
Low-jitter PHY
ref clocks
Figure 78. Storage Area Network With Fibre Channel Over Ethernet (FCoE)
Low-jitter PHY ref
clocks
19.44-MHz
Backplane
From DPLL
155.52 MHz (4x)
PLL
4.97664 GHz
CLK
Dist.
STM-
64
Figure 79. SDH Line Card
11.2.2 Jitter Considerations in Serdes Systems
Jitter-sensitive applications such as 10 Gbps or 100 Gbps Ethernet, deploy a serial link utilizing a serializer in the
transmit section (TX) and a De-serializer in the receive section (RX). These SERDES blocks are typically
embedded in an ASIC or FPGA. Estimating the clock jitter impact on the link budget requires understanding of
the TX PLL bandwidth and the RX CDR bandwidth.
As can be seen in Figure 80, the pass band region between the TX low pass cutoff and RX high pass cutoff
frequencies is the range over which the reference clock jitter adds without any attenuation to the jitter budget of
the link. Outside of these frequencies, the SERDES link will attenuate the reference clock jitter with a 20 dB/dec
or even steeper roll-off. Modern ASIC or FPGA designs have some flexibility on deciding the optimal RX CDR
bandwidth and TX PLL bandwidth. These bandwidths are typically set based on what is achievable in the ASIC
or FPGA process node, without increasing design complexity, and on any jitter tolerance or wander specification
that must be met, as related to the RX CDR bandwidth.
The overall allowable jitter in a serial link is dictated by IEEE or other relevant standards. For example,
IEEE802.3ba states that the maximum transmit jitter (peak-peak) for 10 Gbps Ethernet should be no more than
0.28 * UI and this equates to a 27.1516 ps, p-p for the overall allowable transmit jitter.
The jitter contributing elements are made up of the reference clock, generated potentially from a device like
LMK03318, the transmit medium, transmit driver etc. Only a portion of the overall allowable transmit jitter is
allocated to the reference clock, typically 20% or lower. Therefore, the allowable reference clock jitter, for a 20%
clock jitter budget, is 5.43 ps, p-p.
Jitter in a reference clock is made up of deterministic jitter (arising from spurious signals due to supply noise or
mixing from other outputs or from the reference input) and random jitter (usually due to thermal noise and other
uncorrelated noise sources). A typical clock tree in a serial link system consists of clock generators and fanout
buffers. The allowable reference clock jitter of 5.43 ps, p-p is needed at the output of the fanout buffer. Modern
fanout buffers have low additive random jitter (less than 100 fs, rms) with no substantial contribution to the
deterministic jitter. Therefore, the clock generator and fanout buffer contribute to the random jitter while the
primary contributor to the deterministic jitter is the clock generator. Rule of thumb, for modern clock generators, is
to allocate 25% of allowable reference clock jitter to the deterministic jitter and 75% to the random jitter. This
118
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Typical Applications (continued)
amounts to an allowable deterministic jitter of 1.36 ps, p-p and an allowable random jitter of 4.07 ps, p-p. For
serial link systems that need to meet a BER of 10–12, the allowable random jitter in root-mean-square is 0.29 ps,
rms. This is calculated by dividing the p-p jitter by 14 for a BER of 10–12. Accounting for random jitter from the
fanout buffer, the random jitter needed from the clock generator is 0.27 ps, rms. This is calculated by the root-
mean-square subtraction from the desired jitter at the fanout buffer's output assuming 100 fs, rms of additive jitter
from the fanout buffer.
With careful frequency planning techniques, like spur optimization (covered in the Spur Mitigation Techniques
section) and on-chip LDOs to suppress supply noise, the LMK03318 is able to generate clock outputs with
deterministic jitter that is below 1 ps, p-p and random jitter that is below 0.2 ps, rms. This gives the serial link
system with additional margin on the allowable transmit jitter resulting in a BER better than 10–12
.
Copyright © 2015–2018, Texas Instruments Incorporated
119
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Applications (continued)
TX
RX
Parallel
Serializer
Data
Parallel
Data
Sampler
Serialized clock/data
Recovered
Clock
TX PLL
Ref Clk
CDR
Deserializer
Jitter Transfer (on clock)
Jitter Tolerance (on data)
Jitter Transfer (on clock)
F1 = TX_PLL_BWmax
F2 = RX_CDR_BWmin
F2 = RX_CDR_BWmin
Jitter Tolerance (on data)
F2
SoC trend:
Increase stop band
Less % of jitter budget
Jitter Transfer (on clock)
F2
F1
SoC trend:
Decrease stop band
Improved LO design
Figure 80. Dependence of Clock Jitter in Serial Links
120
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Typical Applications (continued)
11.2.3 Frequency Margining
11.2.3.1 Fine Frequency Margining
IEEE802.3 dictates that Ethernet frames stay compliant to the standard specifications when clocked with a
reference clock that is within ±100 ppm of its nominal frequency. In the worst case, an RX node with its local
reference clock at –100 ppm from its nominal frequency should be able to work seamlessly with a TX node that
has its own local reference clock at +100 ppm from its nominal frequency. Without any clock compensation on
the RX node, the read pointer will severely lag behind the write pointer and cause FIFO overflow errors. On the
contrary, when the RX node’s local clock operates at 100 ppm from its nominal frequency and the TX node’s
local clock operates at –100 ppm from its nominal frequency, FIFO underflow errors occur without any clock
compensation.
To prevent such overflow and underflow errors from occuring, modern ASICs and FGPAs include a clock
compensation scheme that introduces elastic buffers. Such a system, shown in Figure 80, is validated thoroughly
during the validation phase by interfacing slower nodes with faster ones and ensuring compliance to IEEE802.3.
The LMK03318 provides the ability to fine tune the frequency of its outputs based on changing its on-chip load
capacitance when operated with a crystal input. This fine tuning can be done through I2C or through the GPIO5
pin as described in Crystal Input Interface (SEC_REF). A total of ±50 ppm frequency tuning is achievable when
using pullable crystals whose C0/C1 ratio is less than 250. The change in load capacitance is implemented in a
manner such that the outputs of the LMK03318 undergo a smooth monotic change in frequency.
TX
RX
Post Processing
w/ clock
compensation
Serializer
TX PLL
Sampler
Serialized clock/data
Parallel
Data
Parallel
Data
Recovered
Clock
+/- 100 ppm
CDR
Ref Clk
+/- 100 ppm
Ref Clk
Deserializer
Elastic Buffer
(clock compensation)
FIFO
circular
Latency
Read
Pointer
Write
Pointer
Figure 81. System Implementation with Clock Compensation for Standards Compliance
11.2.3.2 Coarse Frequency Margining
Certain systems require the processors to be tested at clock frequencies that are slower or faster by 5% or 10%.
The LMK03318 offers the ability to change its output dividers for the desired change from its nominal output
frequency without resulting in any glitches (as explained in High-Speed Output Divider).
Copyright © 2015–2018, Texas Instruments Incorporated
121
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Applications (continued)
11.2.4 Design Requirements
Consider a typical wired communications application, like a top-of-rack switch, which needs to clock high data
rate 10 Gbps or 100 Gbps Ethernet PHYs and other macros like PCI Express, Fast Ethernet and CPLD. For
such asynchronous systems, the reference input can be a crystal. In such systems, the clocks are expected to
be available upon powerup without the need for any device-level programming. An example of the clock input
and output requirements is :
•
Clock Input:
–
25-MHz crystal
•
Clock Outputs:
–
–
–
–
–
2x 156.25-MHz clock for uplink 10.3125 Gbps, LVPECL
2x 125-MHz clock for downlink 3.125 Gbps, LVPECL
2x 100-MHz clock for PCI Express, HCSL
1x 25-MHz clock for Fast Ethernet, LVDS
2x 33.3333-MHz clock for CPLD, 1.8-V LVCMOS
The section below describes the detailed design procedure to generate the required output frequencies for the
above scenario using LMK03318.
11.2.4.1 Detailed Design Procedure
Design of all aspects of the LMK03318 is quite involved, and software support is available to assist in part
selection, part programming, loop filter design, and phase-noise simulation. This design procedure will give a
quick outline of the process.
1. Device Selection
–
The first step to calculate the specified VCO frequency given required output frequencies. The device
must be able to produce the VCO frequency that can be divided down to the required output frequencies.
–
The WEBENCH Clock Architect Tool from TI will aid in the selection of the right device that meets the
customer's output frequencies and format requirements.
2. Device Configuration
–
–
–
There are many device configurations to achieve the desired output frequencies from a device. However
there are some optimizations and trade-offs to be considered.
The WEBENCH Clock Architect Tool attempts to maximize the phase detector frequency, use smallest
dividers, and maximizes PLL charge pump current.
These guidelines below may be followed when configuring PLL related dividers or other related registers:
–
For lowest possible in-band PLL flat noise, maximize phase detector frequency to minimize N divide
value.
–
For lowest possible in-band PLL flat noise, maximize charge pump current. The highest value charge
pump currents often have similar performance due to diminishing returns.
–
–
To reduce loop filter component sizes, increase N value and/or reduce charge pump current.
For fractional divider values, keep the denominator at highest value possible to minimize spurs. It is
also best to use higher order modulator wherever possible for the same reason.
–
As a rule of thumb, keeping the phase detector frequency approximately between 10 × PLL loop
bandwidth and 100 × PLL loop bandwidth. A phase detector frequency less than 5 * PLL bandwidth
may be unstable and a phase detector frequency > 100 * loop bandwidth may experience increased
lock time due to cycle slipping.
3. PLL Loop Filter Design
–
–
TI recommends using the WEBENCH Clock Architect Tool to design your loop filter.
Optimal loop filter design and simulation can be achieved when custom reference phase noise profiles
are loaded into the software tool.
–
–
While designing the loop filter, adjusting the charge pump current or N value can help with loop filter
component selection. Lower charge pump currents and larger N values result in smaller component
values but may increase impacts of leakage and reduce PLL phase noise performance.
For a more detailed understanding of loop filter design can be found in Dean Banerjee's PLL
122
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Typical Applications (continued)
Performance, Simulation, and Design (www.ti.com/tool/pll_book).
4. Clock Output Assignment
–
At the time of writing this datasheet, the design software does not take into account frequency
assignment to specific outputs except to ensure that the output frequencies can be achieved. It is best to
consider proximity of the clock outputs to each other and other PLL circuitry when choosing final clock
output locations. Here are some guidelines to help achieve optimal performance when assigning outputs
to specific clock output pins.
–
–
Group common frequencies together.
PLL charge pump circuitry can cause crosstalk at the charge pump frequency. Place outputs sharing
charge pump frequency or lower priority outputs not sensitive to charge pump frequency spurs
together.
–
–
Clock output MUXes can create a path for noise coupling. Factor in frequencies which may have
some bleedthrough from non-selected mux inputs.
If possible, use outputs 0, 1, 2 or 3 since they don’t have MUX in the clock path and have limited
opportunity for cross coupled noise.
5. Device Programming
The EVM programming software tool CodeLoader can be used to program the device with the desired
configuration.
–
11.2.4.1.1 Device Selection
Use the WEBENCH Clock Architect Tool. Enter the required frequencies and formats into the tool. To use this
device, find a solution using the LMK03318.
11.2.4.1.1.1 Calculation Using LCM
In this example, the LCM (156.25 MHz, 125 MHz, 100 MHz, 33.3333 MHz, 25 MHz) = 2500 MHz. Valid VCO
frequency for LMK03318 is 5 GHz (2500 × 2).
11.2.4.1.2 Device Configuration
For this example, when using the WEBENCH Clock Architect Tool, the reference would have been manually
entered as 25 MHz according to input frequency requirements. Enter the desired output frequencies and click on
'Generate Solutions'. Select LMK03318 from the solution list.
From the simulation page of the WEBENCH Clock Architect Tool, it can be seen that to maximize phase detector
frequencies, the PLL's R and M dividers are set to 1, doublers are disabled and N divider is set to 200. This
results in a VCO frequency of 5 GHz. The tool also tries to select maximum possible value for the PLL post
divider and for this example, it is set to 2. At this point the design meets all input and output frequency
requirements and it is possible to design a loop filter for system and simulate performance on the clock outputs.
However, consider also the following:
•
At the time of release of this datasheet, the WEBENCH Clock Architect Tool doesn't assign outputs
strategically for minimizing cross-coupled spurs and jitter.
11.2.4.1.3 PLL Loop Filter Design
The WEBENCH Clock Architect Tool allows loading a custom phase noise plot for reference inputs. For
improved accuracy in simulation and optimum loop filter design, be sure to load these custom noise profiles.
After loading a phase noise plot, user should recalculate the recommended loop filter design. The WEBENCH
Clock Architect Tool will return solutions with high reference or phase detector frequencies by default. In the
WEBENCH Clock Architect Tool the user may increase the reference divider to reduce the frequency if desired.
The next section will discuss PLL loop filter design specific to this example using default phase noise profiles.
Copyright © 2015–2018, Texas Instruments Incorporated
123
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Applications (continued)
NOTE
The WEBENCH Clock Architect Tool provides optimal loop filters upon selecting a solution
from the solution list to simulate for the first time. Anytime PLL related inputs change, like
input phase noise, charge pump current, divider values, and so forth, it is best to use the
tool to re-calculate the optimal loop filter component values.
11.2.4.1.3.1 PLL Loop Filter Design
In the WEBENCH Clock Architect Tool simulator, click on the PLL loop filter design button, then press
recommend design. For the PLL loop filter, maximum phase detector frequency and maximum charge pump
current are typically used. The tool recommends a loop filter that is designed to minimize jitter. The integrated
loop filters’ components are minimized with this recommendation as to allow maximum flexibility in achieving
wide loop bandwidths for low PLL noise. With the recommended loop filter calculated, this loop filter is ready to
be simulated.
The PLL loop filter’s bode plot can additionally be viewed and adjustments can be made to the integrated
components. The effective loop bandwidth and phase margin with the updated values is then calculated. The
integrated loop filter components are good to use when attempting to eliminate certain spurs. The recommended
procedure is to increase C3 capacitance, then R3 resistance. Large R3 resistance can result in degraded VCO
phase noise performance.
11.2.4.1.4 Clock Output Assignment
At this time the WEBENCH Clock Architect Tool does not assign output frequencies to specific output ports on
the device with the intention to minimize cross-coupled spurs and jitter. The user may wish to make some
educated re-assignment of outputs when using the EVM programming tool to configure the device registers
appropriately.
In an effort to optimize device configuration for best jitter performance, consider the following guidelines:
•
Because the clock outputs, intended to be used to clock high data rates, are needed with lowest possible
jitter, it is best to assign 156.25 MHz to outputs 0, 1 and assign 125 MHz to outputs 2, 3.
•
Coupling between outputs at different frequencies appear as spurs at offsets that is at the frequency
difference between the outputs and its harmonics. Typical SerDes reference clocks need to have low
integrated jitter upto an offset of 20 MHz and thus, to minimize cross coupling between output 3 and output 4,
it is best to assign 100 MHz to outputs 4 and 5.
•
•
The 25 MHz can then be assigned to output 6.
The 1.8-V LVCMOS clock at 33.3333 MHz is assigned to output 7 and it is best to select complementary
LVCMOS operation. This helps to minimize coupling from this output channel to other outputs.
11.2.4.2 Spur Mitigation Techniques
The LMK03318 offers several programmable features for optimizing fractional spurs. To get the best out of these
features, it makes sense to understand the different kinds of spurs as well as their behaviors, causes, and
remedies. Although optimizing spurs may involve some trial and error, there are ways to make this process more
systematic.
11.2.4.2.1 Phase Detector Spurs
The phase detector spur occurs at an offset from the carrier equal to the phase detector frequency, fPD. To
minimize this spur, a lower phase detector frequency should be considered. In some cases where the loop
bandwidth is very wide relative to the phase detector frequency, some benefit might be gained from using a
narrower loop bandwidth or adding poles to the loop filter by using R3 and C3 if previously unused, but otherwise
the loop filter has minimal impact. Bypassing at the supply pins and board layout can also have an impact on this
spur, especially at higher phase detector frequencies.
124
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Typical Applications (continued)
11.2.4.2.2 Integer Boundary Fractional Spurs
This spur occurs at an offset equal to the difference between the VCO frequency and the closest integer channel
for the VCO. For instance, if the phase detector frequency is 100 MHz and the VCO frequency is 5003 MHz,
then the integer boundary spur would be at 3 MHz offset. This spur can be either PLL or VCO dominated. If it is
PLL dominated, decreasing the loop bandwidth and some of the programmable fractional words may impact this
spur. If the spur is VCO dominated, then reducing the loop filter will not help, but rather reducing the phase
detector and having good slew rate and signal integrity at the selected reference input will help.
11.2.4.2.3 Primary Fractional Spurs
These spurs occur at multiples of fPD/DEN and are not integer boundary spurs. For instance, if the phase
detector frequency is 100 MHz and the fraction is 3/100, the primary fractional spurs would be at 1 MHz, 2 MHz,
4 MHz, 5 MHz, 6 MHz etc. These are impacted by the loop filter bandwidth and modulator order. If a small
frequency error is acceptable, then a larger equivalent fraction may improve these spurs. This larger
unequivalent fraction pushes the fractional spur energy to much lower frequencies where they do not significantly
impact the system peformance.
11.2.4.2.4 Sub-Fractional Spurs
These spurs appear at a fraction of fPD/DEN and depend on modulator order. With the first order modulator, there
are no sub-fractional spurs. The second order modulator can produce 1/2 sub-fractional spurs if the denominator
is even. A third order modulator can produce sub-fractional spurs at 1/2, 1/3, or 1/6 of the offset, depending if it is
divisible by 2 or 3. For instance, if the phase detector frequency is 100 MHz and the fraction is 3/100, no sub-
fractional spurs for a first order modulator or sub-fractional spurs at multiples of 1.5 MHz for a second or third
order modulator would be expected. Aside from strategically choosing the fractional denominator and using a
lower order modulator, another tactic to eliminate these spurs is to use dithering and express the fraction in
larger equivalent terms. Since dithering also adds phase noise, its level must be managed to achieve acceptable
phase noise and spurious performance.
Table 19 gives a summary of the spurs discussed so far and techniques to mitigate them.
Table 19. Spurs and Mitigation Techniques
SPUR TYPE
OFFSET
WAYS TO REDUCE
TRADE-OFFS
Phase Detector
fPD
Reduce Phase Detector
Frequency.
Although reducing the phase
detector frequency does improve
this spur, it also degrades phase
noise.
Integer Boundary
fVCO mod fPD
Methods for PLL Dominated
Spurs
Reducing the loop bandwidth
may degrade the total integrated
noise if the bandwidth is too
narrow.
-Avoid the worst case VCO
frequencies if possible.
-Ensure good slew rate and
signal integrity at reference input.
-Reduce loop bandwidth or add
more filter poles to suppress out
of band spurs.
Methods for VCO Dominated
Spurs
Reducing the phase detector
may degrade the phase noise.
-Avoid the worst case VCO
frequencies if possible.
-Reduce Phase Detector
Frequency.
-Ensure good slew rate and
signal integrity at reference input.
Primary Fractional
fPD/DEN
-Decrease Loop Bandwidth.
-Change Modulator Order.
use Larger Unequivalent
Fractions.
Decreasing the loop bandwidth
may degrade in-band phase
noise. Also, larger unequivalent
fractions don’t always reduce
spurs.
Copyright © 2015–2018, Texas Instruments Incorporated
125
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Typical Applications (continued)
Table 19. Spurs and Mitigation Techniques (continued)
SPUR TYPE
OFFSET
WAYS TO REDUCE
TRADE-OFFS
Sub-Fractional
fPD/DEN/k k=2,3, or 6
use Dithering.
Dithering and larger fractions
use Larger Equivalent Fractions. may increase phase noise.
use Larger Unequivalent
Fractions.
-Reduce Modulator Order.
-Eliminate factors of 2 or 3 in
denominator.
126
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
12 Power Supply Recommendations
12.1 Device Power Up Sequence
Figure 82 shows the power up sequence of the LMK03318 in both the hard pin mode and soft pin mode.
Power on
Reset
tnot
PDN = 1?
(all outputs are disabled)
HW_SW_CTRL
0
1
Soft Pin Mode
Hard Pin Mode
(activate I2C IF)
(activate I2C IF)
Latch GPIO[5:0] to select 1 of 64
device settings from ROM codes
Latch GPIO[3:1] to select 1 of 6
device settings from EEPROM
Registers programmable via I2C.
Latch GPIO1 for LSB of I2C
address.
Enter pin mode specified by
GPIO
Configure all device settings
wait for selected reference input
signal (PRI/SEC) to become valid
wait for selected reference input
signal (PRI/SEC) to become valid
Disable outputs
Calibrate VCO
Auto-synchronize outputs
Mute outputs till PLL locks and
outputs are synchronized
Enable outputs
Disable outputs
Calibrate VCO
Auto-synchronize outputs
Mute outputs till PLL locks and
outputs are synchronized
Enable outputs
Clear R12.6, R56.1
(default enabled)
Normal device operation in Hard
Pin Mode. Host can reprogram
device via I2C.
tnot
yes
GPIO0 pin or
R12.6 = 1?
PDN = 1?
yes
Disable
all
outputs
Synchronize outputs while
outputs are muted
Enable all outputs
Clear R12.6, R56.1
Normal device operation in Soft
Pin Mode. Host can reprogram
device via I2C and can be written
to on-chip EEPROM.
no
GPIO0 pin or
R12.6 = 1?
yes
yes
PDN = 1?
no
Disable
all
outputs
Figure 82. Flow Chart for Device Power Up and Configuration
Copyright © 2015–2018, Texas Instruments Incorporated
127
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
12.2 Device Power Up Timing
Before the outputs are enabled after power up, the LMK03318 goes through the initialization routine given in
Table 20.
Table 20. LMK03318 Power Up Initialization Routine
Parameter
Definition
Duration
Comments
TPWR
Step 1: Power up ramp
Depends on customer
supply ramp time
The POR monitor holds the device in power-
down/reset until the core supply voltages reaches 2.72
V (min) to 2.95 V (max) and VDDO_01 reaches 1.7 V
(min).
TXO
Step 2: XO startup (if
crystal is used)
Depends on XTAL. Could This step assumes PDN=1. The XTAL startup time is
be several ms; For TXC
25 MHz typical XTAL
startup time measures
100 µs.
the time it takes for the XTAL to oscillate with sufficient
amplitude. The LMK03318 has a built-in amplitude
detection circuit, and halts the PLL lock sequence until
the XTAL stage has sufficient swing.
TCAL-PLL
Step 3: Closed loop
Programmable cycles of
This counter is needed for the PLL loop to stabilize. It
calibration period for PLL internal 10 MHz oscillator. can also be used to provide additional delay time for
the selected PLL reference input to stabilize, in case
the reference detection circuit validates the input too
soon. The duration can range from 30 µs to 300 ms
and programmed in R119[3-2]. Recommended
duration for PLL as clock generator (loop bandwidth >
10 kHz) is 300 µs and for PLL as jitter cleaner (loop
bandwidth < 1 kHz) is 300 ms.
TVCO
Step 4: VCO wait period
Step 5: PLL lock time
Programmable cycles of
This counter is needed for the VCO to stabilize. The
internal 10 MHz oscillator. duration can range from 20 µs to 200 ms and
programmed in R119[1-0]. Recommended duration for
VCO1 is 400 µs.
TLOCK-PLL
~4/LBW of PLL
The Outputs turn on immediately after calibration. A
small frequency error remains for the duration of
~4/LBW (so in clock generator mode typically 10 µs for
a PLL bandwidth of 400 kHz). The initial output
frequency will be lower than the target output
frequency, as the loop filter starts out initially
discharged.
TLOL-PLL
Step 6: PLL LOL indicator ~1 PFD clock cycle
low
The PLL loss of lock indicator if selected on STATUS0
or STATUS1 will go low after 1 PFD clock cycle to
indicate PLL is now locked.
128
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
The LMK03318 start-up time for the PLL is defined as the time taken, from the moment the core supplies reach
2.72 V and VDDO_01 reaches 1.7 V, for the PLL to be locked and valid outputs are available at the outputs with
no more than ±300 ppm error. Start-up time for the PLL can be calculated as Equation 5
TPLL-SU = TXO + TCAL-PLL + TVCO + TLOCK-PLL
(5)
12.3 Power Down
The PDN pin (active low) can be used both as device power-down pin and to initialize the device. When this pin
is pulled low, the entire device is powered down. When it is pulled high, the power-on reset (POR) sequence is
triggered and causes all registers to be set to an initial state. The initial state is determined by the device control
pins as described in the Device Configuration Control section. When PDN is pulled low, I2C is disabled. When
PDN is pulled high, the device power-up sequence is initiated as described in Device Power Up Sequence and
Device Power Up Timing.
Table 21. PDN Control
PDN Pin State
Device operation
Device is disabled
Normal operation
0
1
12.4 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
12.4.1 Mixing Supplies
The LMK03318 incorporates flexible power supply architecture. TI recommends driving the VDD_IN, VDD_PLL,
VDD_LDO, and VDD_DIG supplies by the same 3.3-V supply rail, but the individual VDDO_x supplies can be
driven from separate 1.8-V, 2.5-V, or 3.3-V supply rails. Lowest power consumption can be realized by operating
the VDD_IN, VDD_PLL, VDD_LDO, and VDD_DIG supplies from a 3.3-V rail and the VDDO_x supplies from a
1.8-V rail.
12.4.2 Power-On Reset
The LMK03318 integrates a built-in power-on reset (POR) circuit, that holds the device in reset until all of the
following conditions have been met:
•
•
•
the VDD_IN, VDD_PLL, VDD_LDO, or VDD_DIG supplies have reached at least 2.72 V
the VDDO_01 supply has reached at least 1.7 V
the PDN pin has reached at least 1.2 V
After this POR release, device internal counters start (see Device Power Up Timing) followed by device
calibration.
12.4.3 Powering Up From Single-Supply Rail
If the VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG, and VDDO supplies are driven by the same 3.3-V supply rail
that ramp in a monotonic manner from 0 V to 3.135 V, irrespective of the ramp time, then there is no requirement
to add a capacitor on the PDN pin to externally delay the device power-up sequence. As shown in Figure 83, the
PDN pin can be left floating, pulled up externally to VDD, or otherwise driven by a host controller for meeting the
clock sequencing requirements in the system.
Copyright © 2015–2018, Texas Instruments Incorporated
129
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains (continued)
VDD_PLL, VDD_LDO,
3.135 V
VDD_IN, VDD_DIG,
VDDO_01, PDN
Decision Point 3:
VDD_PLL/VDD_LDO/
VDD_IN/VDD_DIG
≥ 2.72 V
VDDO_01
Decision Point 2:
VDDO_01 ≥ 1.7 V
200 kꢀ
Decision Point 1:
PDN ≥ 1.2 V
0 V
Figure 83. Recommendations for Power Up From Single-Supply Rail
12.4.4 Powering Up From Split-Supply Rails
If the VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG, and VDDO supplies are driven from different supply rails, TI
recommends starting the device POR sequence after all core and output supplies have reached their minimum
voltage tolerances (VDD ≥ 3.135 V and VDDO ≥ 1.71 V). This can be realized by delaying the PDN low-to-high
transition. The PDN input incorporates a 200-kΩ resistor to VDDO_01 and as shown in Figure 84, a capacitor
from the PDN pin to GND can be used to form a R-C time constant with the internal pullup resistor or an external
pullup resistor. This R-C time constant can be designed to delay the low-to-high transition of PDN until all core
and output supplies have reached their minimum voltage tolerances. Alternatively, the delayed PDN low-to-high
transition could be controlled by a logic output of a host controller (CPLD/FPGA/CPU) or power sequencer.
VDD_PLL,
VDD_LDO,
VDD_IN,
3.135 V
Decision Point 3
VDD_PLL/VDD_LDO/
VDD_IN/VDD_DIG
VDD_DIG
VDDO_01
≥ 2.72 V
VDDO_01,
VDDO_x,
PDN
Decision Point 2:
VDDO_01 ≥ 1.7 V
200 kΩ
PDN
Decision Point 1:
PDN ≥ 1.2 V
CPDN
Delay
0 V
Figure 84. Recommendations for Power Up From Split-Supply Rails
12.4.5 Slow Power-Up Supply Ramp
In case the VDD_IN, VDD_PLL, VDD_LDO, and VDD_DIG, and VDDO supplies ramp slowly with a ramp time
over 100 ms, TI recommends starting the device POR sequence after all core and output supplies have reached
their minimum voltage tolerances (VDD ≥ 3.135 V and VDDO ≥ 1.71 V). This can be realized by delaying the
PDN low-to-high transition in a manner similar to the condition detailed in Powering Up From Split-Supply Rails
and shown in Figure 84.
130
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains (continued)
If a VDD supply cannot reach 3.135 V before the PDN low-to-high transition, TI recommends toggling the PDN
pin again or chip soft reset bit in R12.7 after all VDD and VDDO supplies reached their minimum tolerances to
re-trigger the device POR sequence for normal chip operation.
If only VDDO supplies ramp after the PDN low-to-high transition, issuing a channel reset on any PLL-driven
output channel with its PLL SYNC enabled (PLL_SYNC_EN=1) is recommended to ensure normal output divider
operation without requiring a full chip reset (through PDN pin or soft reset). A local channel reset can be issued
by toggling the corresponding power-down bit(s) in R30 after its VDDO supply has reached 1.71 V. Alternatively,
an output SYNC can be issued to reset any SYNC-enabled channel (see Output Synchronization).
12.4.6 Non-Monotonic Power-Up Supply Ramp
In case the VDD_IN, VDD_PLL, VDD_LDO, VDD_DIG, and VDDO supplies ramp in a non-monotonic manner, TI
recommends starting the device POR sequence after all core and output supplies have reached their minimum
voltage tolerances (VDD ≥ 3.135 V and VDDO ≥ 1.71 V). This can be realized by delaying the PDN low-to-high
transition in a manner similar to the condition detailed in Powering Up From Split-Supply Rails and shown in
Figure 84.
12.4.7 Slow Reference Input Clock Startup
If the reference input clock is direct coupled to the LMK03318 and has a very slow startup time of over 10 ms, as
defined from the time power supply reaches acceptable operating voltage for the reference input generator,
which is typically 2.97 V for a 3.3-V supply, to the time when the reference input has a stable clock output, take
additional care to prevent unsuccessful PLL calibration. In the case of the reference input building up its
amplitude slowly, TI recommends setting the input buffer to differential irrespective of the input type (LVCMOS or
differential). In case of LVCMOS inputs, TI also recommends enabling on-chip termination by setting R29.4 (for
primary input) and/or R29.5 (for secondary input) to 1. There is one of two additional steps that need to be taken.
The first approach is to add a capacitor to GND on the PDN pin that forms a R-C time constant with the internal
200-kΩ pullup resistor. This R-C time constant can be designed to delay the low-to-high transition of PDN, until
after the reference input clock is stable. The second approach is to program a larger PLL closed loop delay in
R119[3-2] that is longer than the time taken for the reference input clock to be stable.
12.5 Power Supply Bypassing
Figure 85 shows two conceptual layouts detailing recommended placement of power supply bypass capacitors. If
the capacitors are mounted on the back side, 0402 components can be employed; however, soldering to the
Thermal Dissipation Pad can be difficult. For component side mounting, use 0201 body size capacitors to
facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the
device as short as possible. Ground the other side of the capacitor using a low impedance connection to the
ground plane.
Copyright © 2015–2018, Texas Instruments Incorporated
131
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Power Supply Bypassing (continued)
Figure 85. Conceptual Placement of Power Supply Bypass Capacitors (NOT Representative of LMK03318
Supply Pin Locations)
132
Copyright © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
13 Layout
13.1 Layout Guidelines
The following section provides the layout guidelines to ensure good thermal and electrical performance for the
LMK03318.
13.1.1 Ensure Thermal Reliability
The LMK03318 is a high performance device. Therefore, pay careful attention to device configuration and
printed-circuit board (PCB) layout with respect to device power consumption and thermal considerations.
Employing a thermally-enhanced PCB layout can insure good thermal dissipation from the device to the PCB
layers. Observing good thermal layout practices enables the thermal slug, or die attach pad (DAP), on the bottom
of the 48-pin WQFN package to provide a good thermal path between the die contained within the package and
the ambient air through the PCB interface. This thermal pad also serves as the singular ground connection the
device; therefore, a low-inductance connection to multiple PCB ground layers (both internal and external) is
essential.
13.1.2 Support for PCB Temperature up to 105°C
The LMK03328 can maintain a safe junction temperature below the recommended maximum value of 125°C
even when operated on a PCB with a maximum board temperature (Tb) of 105°C . This can shown by the
following example calculation, assuming a worst-case device current consumption from Electrical Characteristics
- Power Supply and the thermal data in Thermal Information using a 4-layer JEDEC test board with no airflow.
TJ = Tb+ (ψjb × Pdmax) = 117.6°C
where
•
•
•
Tb = 105°C
ψjb = 4.02°C/W
Pdmax = IDD × VDD = 952 mA × 3.3 V = 3.14 W
(6)
13.2 Layout Example
Figure 86 shows a PCB layout example showing the application of thermal design practices and low-inductance
ground connection between the device DAP and the PCB. Connecting a 6 x 6 thermal via pattern and using
multiple PCB ground layers (for example, 8- or 10-layer PCB) can help to reduce the junction-to-ambient thermal
resistance, as indicated in the Thermal Information section. The 6 × 6 filled via pattern facilitates both
considerations.
Copyright © 2015–2018, Texas Instruments Incorporated
133
LMK03318
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
www.ti.com.cn
Layout Example (continued)
Figure 86. 4-Layer PCB Thermal Layout Example for LMK03318 (8+ Layers Recommended)
134
版权 © 2015–2018, Texas Instruments Incorporated
LMK03318
www.ti.com.cn
ZHCSEN4E –SEPTEMBER 2015–REVISED APRIL 2018
14 器件和文档支持
14.1 器件支持
14.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
14.2 接收文档更新通知
如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。单击右上角的通知我 进行注册，即可每
周接收产品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
14.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
14.4 商标
PLLATINUM, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
14.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
14.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请参阅左侧的导航栏。
版权 © 2015–2018, Texas Instruments Incorporated
135
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMK03318RHSR
LMK03318RHST
ACTIVE
ACTIVE
WQFN
WQFN
RHS
RHS
48
48
2500 RoHS & Green
250 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
K03318A
K03318A
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMK03318RHSR
LMK03318RHST
WQFN
WQFN
RHS
RHS
48
48
2500
250
330.0
178.0
16.4
16.4
7.3
7.3
7.3
7.3
1.3
1.3
12.0
12.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMK03318RHSR
LMK03318RHST
WQFN
WQFN
RHS
RHS
48
48
2500
250
356.0
208.0
356.0
191.0
35.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RHS0048B
SQA48B (Rev A)
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023，德州仪器 (TI) 公司
相关型号：
©2020 ICPDF网 联系我们和版权申明