LMK01020ISQX/NOPB [TI]
具有 8 个 LVPECL 输出的 1.6GHz 高性能时钟缓冲器、分频器和分配器 | RHS | 48 | -40 to 85;
| 型号： | LMK01020ISQX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 8 个 LVPECL 输出的 1.6GHz 高性能时钟缓冲器、分频器和分配器 | RHS | 48 | -40 to 85 时钟 |
| 文件： | 总26页 (文件大小：455K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
LMK01000 Family LMK01000 Family 1.6 GHz High Performance Clock Buffer, Divider, and
Distributor
Check for Samples: LMK01000
1
FEATURES
•
•
3.15 to 3.45 V operation
Package: 48 pin LLP (7.0 x 7.0 x 0.8 mm)
2
•
30 fs additive jitter (100 Hz to 20 MHz)
Dual clock inputs
•
•
LVDS
Outputs
LVPECL
Outputs
Device
Programmable output channels (0 to 1600
MHz)
LMK01000
LMK01010
LMK01020
3
8
0
5
0
8
•
•
External synchronization
Pin compatible family of clocking devices
TARGET APPLICATIONS
•
•
•
•
•
•
High performance Clock Distribution
Wireless Infrastructure
Medical Imaging
Wired Communications
Test and Measurement
Military / Aerospace
DESCRIPTION
The LMK01000 family provides an easy way to divide and distribute high performance clock signals throughout
the system. These devices provide best-in-class noise performance and are designed to be pin-to-pin and
footprint compatible with LMK03000/LMK02000 family of precision clock conditioners.
The LMK01000 family features two programmable clock inputs (CLKin0 and CLKin1) that allow the user to
dynamically switch between different clock domains.
Each device features 8 clock outputs with independently programmable dividers and delay adjustments. The
outputs of the device can be easily synchronized by an external pin (SYNC*).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
System Diagram
CLKout0
LMK010x0
LMX2531
CLKin1
PLL+VCO
Clock Divider and
Distributor
ADC
CLKout7
ADC
CLKout0
CLKout1
CLKout4
CLKout7
CLKin0
CLKin1
Serializer/
Deserializer
LMK010x0
Clock Divider and
Distributor
LMX2531
PLL+VCO
FPGA
ADC
Functional Block Diagram
CLK
CLKin0
CLKin0*
GOE
SYNC*
Distribution Path
mWire
Port
Control
Registers
Device
Control
Mux
DATA
LE
CLKin1
CLKin1*
CLKout0
CLKout0*
CLKout4
CLKout4*
Mux
Mux
Mux
Mux
Divider
Divider
Divider
Divider
Divider
Mux
Delay
Delay
Delay
Delay
Delay
Delay
Delay
Delay
CLKout1
CLKout1*
CLKout5
CLKout5*
Divider
Divider
Divider
Mux
Mux
Mux
CLKout2
CLKout2*
CLKout6
CLKout6*
CLKout3
CLKout3*
CLKout7
CLKout7*
Low Clock Buffers
High Clock Buffers
2
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Connection Diagram
Figure 1. 48-Pin LLP Package
48
47
46
45
44
43
42
41
40
39
38
37
GND
NC
Bias
1
2
36
35
34
33
32
31
30
29
28
27
26
25
CLKin1*
CLKin1
Vcc10
NC
Vcc1
3
CLKmWire
DATAmWire
LEmWire
NC
4
5
LLP-48
Top Down View
Vcc9
6
Vcc8
7
Vcc2
CLKin0*
CLKin0
SYNC*
Vcc7
8
NC
9
NC
10
11
12
DAP
15
GOE
Test
GND
13
14
16
17
18
19
20
21
22
23
24
Pin Functions
Pin Descriptions
Pin #
1, 25
Pin Name
GND
I/O
Description
-
-
Ground
2, 7, 9,10, 32
NC
No Connect. Pin is not connected to the die.
3, 8, 13, 16, 19, 22, 26,
30, 31, 33, 37, 40, 43, 46
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8,
Vcc9, Vcc10, Vcc11, Vcc12, Vcc13, Vcc14
-
Power Supply
4
5
CLKuWire
DATAuWire
LEuWire
GOE
I
I
I
I
MICROWIRE Clock Input
MICROWIRE Data Input
MICROWIRE Latch Enable Input
Global Output Enable
6
11
This is an output pin used strictly for test purposes
and should be not connected for normal operation.
However, any load of an impedance of more than 1
kΩ is acceptable.
12
Test
O
14, 15
17, 18
20, 21
23, 24
27
CLKout0, CLKout0*
CLKout1, CLKout1*
CLKout2, CLKout2*
CLKout3, CLKout3*
SYNC*
O
O
O
O
I
Clock Output 0
Clock Output 1
Clock Output 2
Clock Output 3
Global Clock Output Synchronization
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
Pin Descriptions (continued)
Pin #
28, 29
34, 35
36
Pin Name
I/O
Description
CLKin0,CLKin0*
CLKin1, CLKin1*
Bias
I
I
CLKin 0 Input; Must be AC coupled
CLKin 1 Input; Must be AC coupled
Bias Bypass
I
38, 39
41, 42
44, 45
47, 48
DAP
CLKout4, CLKout4*
CLKout5, CLKout5*
CLKout6, CLKout6*
CLKout7, CLKout7*
DAP
O
O
O
O
-
Clock Output 4
Clock Output 5
Clock Output 6
Clock Output 7
Die Attach Pad should be connected to ground.
The LMK01000 family is footprint compatible with the LMK03000/02000 family of devices. All CLKout pins are
pin-to-pin compatible, and CLKin0 and CLKin1 are equivalent to OSCin and Fin, respectively.
Device Configuration Information
Output
CLKout0
CLKout1
CLKout2
CLKout3
CLKout4
CLKout5
CLKout6
CLKout7
LMK01000
LVDS
LMK01010
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
LMK01020
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
LVDS
LVDS
LVPECL
LVPECL
LVPECL
LVPECL
LVPECL
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) (2)
Absolute Maximum Ratings
Parameter
Symbol
VCC
VIN
Ratings
-0.3 to 3.6
-0.3 to (VCC + 0.3)
-65 to 150
+260
Units
V
Power Supply Voltage
Input Voltage
V
Storage Temperature Range
Lead Temperature (solder 4 s)
Junction Temperature
TSTG
TL
°C
°C
°C
TJ
125
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD
protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
Recommended Operating Conditions
Parameter
Ambient Temperature
Power Supply Voltage
Symbol
Min
-40
Typ
25
Max
85
Units
°C
TA
VCC
3.15
3.3
3.45
V
4
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Package Thermal Resistance
Package
θJA
θJ-PAD (Thermal Pad)
(1)
48-Lead LLP
27.4° C/W
5.8° C/W
(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These
vias play a key role in improving the thermal performance of the LLP. It is recommended that the maximum number of vias be used in
the board layout.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
(1)
Electrical Characteristics
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol
Parameter
Conditions
Min Typ Max
Units
Current Consumption
All outputs
LMK01000
LMK01010
271
160
enabled, no
divide or delay
( CLKoutX_MUX
= Bypassed )
LMK01020
LVDS
338
Power Supply Current
ICC
(2)
17.8
mA
Per channel, no
divide or delay
(CLKoutX_MUX
= Bypassed )
LVPECL
(Includes
Emitter
40
1
Resistors)
ICCPD
Power Down Current
POWERDOWN = 1
CLKin0, CLKin0*, CLKin1, CLKin1*
fCLKin
CLKin Frequency Range
1
(3)(4)
1600
MHz
V/ns
SLEWCLKin
CLKin Frequency Input Slew Rate
0.5
30
f
CLKin ≤ 800 MHz
70
60
5
DUTYCLKin
PCLKin
CLKin Frequency Input Duty Cycle
%
fCLKin > 800 MHz
AC coupled
40
Input Power Range for CLKin or CLKin*
-13
dBm
Clock Distribution Section--Delays
CLKoutX ≤ 1 GHz
f
(Delay is limited to maximum
programmable value)
2250
0.5/f
CLKou
tX
DelayCLKout
Maximum Allowable Delay(4)
ps
fCLKoutX > 1 GHz
(Delay is limited to 1/2 of a
period)
Clock Distribution Section - Divides
f
CLKinX ≤ 1300 MHz
1
1
510
2
Allowable divide range. (Note that 1 is the only
allowable odd divide value)
DivideCLKoutX
n/a
1300 MHz < fCLKinX ≤ 1600
MHz
Clock Distribution Section - LVDS Clock Outputs
fCLKoutX
200 MHz
=
80
30
RL = 100 Ω
Bandwidth =
100 Hz to 20
MHz
fCLKoutX
800 MHz
=
(5)
JitterADD
Additive RMS Jitter
fs
fCLKoutX
1600 MHz
=
Vboost = 1
25
fCLKoutX
200 MHz
=
-156
-153
-148
RL = 100 Ω
Vboost = 1
fCLKoutX
800 MHz
=
Noise Floor
Divider Noise Floor(5)
dBc/Hz
fCLKoutX
1600 MHz
=
(1) The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not guaranteed.
(2) See section 3.2 for more current consumption / power dissipation calculation information.
(3) For all frequencies the slew rate, SLEWCLKin1, is measured between 20% and 80%.
(4) Specification is guaranteed by characterization and is not tested in production.
(5) The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower
frequencies this measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use
section 1.3.
6
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Electrical Characteristics (1) (continued)
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol
Parameter
Conditions
Min Typ Max
Units
Equal loading and identical
clock configuration
RL = 100 Ω
(4)
tSKEW
CLKoutX to CLKoutY
-30 ±4 30
ps
Vboost=0
250 350 450
390
(6)
VOD
Differential Output Voltage
mV
Vboost=1
Change in magnitude of VOD for complementary
output states
ΔVOD
VOS
RL = 100 Ω
-50
50
mV
V
1.07
0
1.37
0
Output Offset Voltage
RL = 100 Ω
RL = 100 Ω
1.25
Change in magnitude of VOS for complementary
output states
ΔVOS
-35
-24
-12
35
24
12
mV
mA
mA
ISA
ISB
Clock Output Short Circuit Current
single ended
Single ended outputs shorted
to GND
Clock Output Short Circuit Current
differential
Complementary outputs tied
together
ISAB
Clock Distribution Section - LVPECL Clock Outputs
fCLKoutX
200 MHz
=
65
25
RL = 100 Ω
Bandwidth =
100 Hz to 20
MHz
fCLKoutX
800 MHz
=
JitterADD
Additive RMS Jitter(5)
fs
fCLKoutX
1600 MHz
=
Vboost = 1
25
fCLKoutX
200 MHz
=
-158
-154
-148
RL = 100 Ω
Vboost = 1
fCLKoutX
800 MHz
=
Noise Floor
Divider Noise Floor(7)
CLKoutX to CLKoutY
dBc/Hz
fCLKoutX
1600 MHz
=
Equal loading and identical
clock configuration
Termination = 50 Ω to Vcc - 2
V
(8)
tSKEW
-30
±3
30
ps
Vcc -
0.98
VOH
VOL
Output High Voltage
Output Low Voltage
V
V
Termination = 50 Ω to Vcc - 2
V
Vcc -
1.8
Vboost = 0 660 810 965
Vboost = 1 865
(9)
VOD
Differential Output Voltage
mV
(10)
Digital LVTTL Interfaces
VIH
VIL
IIH
High-Level Input Voltage
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
2.0
Vcc
0.8
5.0
5.0
V
V
VIH = Vcc
VIL = 0
-5.0
µA
µA
IIL
-40.0
Vcc -
0.4
VOH
VOL
High-Level Output Voltage
Low-Level Output Voltage
IOH = +500 µA
IOL = -500 µA
V
V
0.4
(6) See characterization plots to see how this parameter varies over frequency.
(7) The noise floor of the divider is measured as the far out phase noise of the divider. Typically this offset is 40 MHz, but for lower
frequencies this measurement offset can be as low as 5 MHz due to measurement equipment limitations. If the delay is used, then use
section 1.3.
(8) Specification is guaranteed by characterization and is not tested in production.
(9) See characterization plots to see how this parameter varies over frequency.
(10) Applies to GOE, LD, and SYNC*.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
Electrical Characteristics (1) (continued)
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed).
Symbol
Parameter
Digital MICROWIRE Interfaces
Conditions
(11)
Min Typ Max
Units
VIH
VIL
IIH
High-Level Input Voltage
1.6
Vcc
0.4
5.0
5.0
V
V
Low-Level Input Voltage
High-Level Input Current
Low-Level Input Current
VIH = Vcc
VIL = 0
-5.0
-5.0
µA
µA
IIL
MICROWIRE Timing
tCS
Data to Clock Set Up Time
Data to Clock Hold Time
Clock Pulse Width High
Clock Pulse Width Low
See Data Input Timing
See Data Input Timing
See Data Input Timing
See Data Input Timing
See Data Input Timing
See Data Input Timing
See Data Input Timing
25
8
ns
ns
ns
ns
ns
ns
ns
tCH
tCWH
tCWL
tES
25
25
25
25
25
Clock to Enable Set Up Time
Enable to Clock Set Up Time
Enable Pulse Width High
tCES
tEWH
(11) Applies to CLKuWire, DATAuWire, and LEuWire.
Serial Data Timing Diagram
MSB
LSB
A0
DATAuWire
CLKuWire
LEuWire
D27
D26
D25
D24
D23
D0
A3
A2
A1
t
t
CWH
CS
t
t
ES
t
CH
CES
t
CWL
t
EWH
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the
CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to the
addressed register determined by the LSB bits. After the programming is complete the CLKuWire, DATAuWire,
and LEuWire signals should be returned to a low state. The slew rate of CLKuWire, DatauWire, and LEuWire
should be at least 30 V/µs.
8
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Functional Description
The LMK01000 family includes a programmable divider, a phase synchronization circuit, a programmable delay,
a clock output mux, and an LVDS or LVPECL output buffer in each channel. This allows multiple integer-related
and phase-adjusted copies of the reference to be distributed to up to eight system components.
This family of devices comes in a 48-pin LLP package that is pin-to-pin and footprint compatible with other
LMK02000/LMK03000 family of clocking devices.
BIAS PIN
To properly use the device, bypass Bias (pin 36) with a low leakage 1 µF capacitor connected to Vcc. This is
important for low noise performance.
CLKin0/CLKin0* and CLKin1/CLKin1 INPUT PORTS
The device can be driven either by the CLKin0/CLKin0* or the CLKin1/CLKin1* pins. The choice of which one to
use is software selectable. These input ports must be AC coupled. To drive these inputs in a single ended
fashion, AC ground the complementary input.
When choosing AC coupling capacitors for clock signals 0.1 µF is a good starting point, but lower frequencies
may require higher value capacitors while higher frequencies may use lower value capacitors.
CLKout DELAYS
Each individual clock output includes a delay adjustment. Clock output delay registers (CLKoutX_DLY) support a
150 ps step size and range from 0 to 2250 ps of total delay. When the delay is enabled it adds to the output
noise floor; the total additive noise is 10(log( 10^(Output Noise Floor/10) + 10^(Delay Noise Floor/10) ). Refer to
the Typical Performance Characteristics plots for the Delay Noise Floor information.
LVDS/LVPECL OUTPUTS
Each LVDS or LVPECL output may be disabled individually by programming the CLKoutX_EN bits. All the
outputs may be disabled simultaneously by pulling the GOE pin low or programming EN_CLKout_Global to 0.
GLOBAL CLOCK OUTPUT SYNCHRONIZATION
The SYNC* pin synchronizes the clock outputs. When the SYNC* pin is held in a logic low state, the divided
outputs are also held in a logic low state. When the SYNC* pin goes high, the divided clock outputs are activated
and will transition to a high state simultaneously. Clocks in the Bypassed state are not affected by SYNC* and
are always synchronized with the divided outputs.
The SYNC* pin must be held low for greater than one clock cycle of the Frequency Input port, also known as the
distribution path. Once this low event has been registered, the outputs will not reflect the low state for four more
cycles. When the SYNC* pin becomes high, the outputs will not simultaneously transition high until four more
distribution path clock cycles have passed. See the SYNC* timing diagram for further detail. In the timing
diagram below the clocks are programmed as CLKout0_MUX = Bypassed, CLKout1_MUX = Divided,
CLKout1_DIV = 2, CLKout2_MUX = Divided, and CLKout2_DIV = 4.
SYNC* Timing Diagram
Distribution
Path
SYNC*
CLKout0
CLKout1
CLKout2
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
The SYNC* pin provides an internal pull-up resistor as shown on the functional block diagram. If the SYNC* pin
is not terminated externally the clock outputs will operate normally. If the SYNC* function is not used, clock
output synchronization is not guaranteed.
CONNECTION TO LVDS OUTPUTS
LMK01000 and LMK01010 LVDS outputs can be connected in AC or DC coupling configurations; however, in DC
coupling configuration, proper conditions must be presented by the LVDS receiver. To ensure such conditions,
we recommend the usage of LVDS receivers without fail-safe or internal input bias such as National
Semiconductor's DS90LV110T. The LMK01000 family LVDS drivers provide the adequate DC bias for the LVDS
receiver. We recommend AC coupling when using LVDS receivers with fail-safe or internal input bias.
CLKout OUTPUT STATES
Each clock output may be individually enabled with the CLKoutX_EN bits. Each individual output enable control
bit is gated with the Global Output Enable input pin (GOE) and the Global Output Enable bit
(EN_CLKout_Global).
All clock outputs can be disabled simultaneously if the GOE pin is pulled low by an external signal or
EN_CLKout_Global is set to 0.
CLKoutX
_EN bit
EN_CLKout
_Global bit
GOE pin
Clock X Output State
1
1
Low
Low
Off
Don't care
0
Don't care
1
Don't care
0
1
Don't care
Off
High / No Connect
Enabled
When an LVDS output is in the Off state, the outputs are at a voltage of approximately 1.5 volts. When an
LVPECL output is in the Off state, the outputs are at a voltage of approximately 1 volt.
GLOBAL OUTPUT ENABLE
The GOE pin provides an internal pull-up resistor. If it is not terminated externally, the clock output states are
determined by the Clock Output Enable bits (CLKoutX_EN) and the EN_CLKout_Global bit.
POWER-ON-RESET
When supply voltage to the device increases monotonically from ground to Vcc, the power-on-reset circuit sets
all registers to their default values, which are specified in the General Programming Information section. Voltage
should be applied to all Vcc pins simultaneously.
General Programming Information
The LMK01000 family device is programmed using several 32-bit registers. The registers consist of a data field
and an address field. The last 4 register bits, ADDR[3:0] form the address field. The remaining 28 bits form the
data field DATA[27:0].
During programming, LEuWire is low and serial data is clocked in on the rising edge of clock (MSB first). When
LEuWire goes high, data is transferred to the register bank selected by the address field. Only registers R0 to R7
and R14 need to be programmed for proper device operation.
It is required to program register R14.
RECOMMENDED PROGRAMMING SEQUENCE
The recommended programming sequence involves programming R0 with the reset bit set (RESET = 1) to
ensure the device is in a default state. It is not necessary to program R0 again, but if R0 is programmed again,
the reset bit is programmed clear (RESET = 0). An example programming sequence is shown below.
•
Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the reset
bit is set in R0, the other R0 bits are ignored.
–
If R0 is programmed again, the reset bit is programmed clear (RESET = 0).
10
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
•
•
Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay settings.
Program R14 with global clock output bit, power down setting.
–
R14 must be programmed in accordance with the register map as shown in the register map (See Section
2.2).
Table 1. Register Map
Re
gis 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
ter
9
8
7
6
5
4
3
2
1
0
Data [27:0]
CL
A3 A2 A1 A0
RE
R0 SE
T
CLKout0 Ko
CLKout0_DIV
[7:0]
CLKout0_DLY
[3:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
_MUX
[1:0]
ut0
_E
N
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
CL
CLKout1 Ko
CLKout1_DIV
[7:0]
CLKout1_DLY
[3:0]
R1
R2
R3
R4
R5
R6
0
0
0
0
0
0
_MUX
[1:0]
ut1
_E
N
CL
CLKout2 Ko
CLKout2_DIV
[7:0]
CLKout2_DLY
[3:0]
_MUX
[1:0]
ut2
_E
N
CL
CLKout3 Ko
CLKout3_DIV
[7:0]
CLKout3_DLY
[3:0]
_MUX
[1:0]
ut3
_E
N
CL
CLKout4 Ko
CLKout4_DIV
[7:0]
CLKout4_DLY
[3:0]
_MUX
[1:0]
ut4
_E
N
CL
CLKout5 Ko
CLKout5_DIV
[7:0]
CLKout5_DLY
[3:0]
_MUX
[1:0]
ut5
_E
N
CL
CLKout6 Ko
CLKout6_DIV
[7:0]
CLKout6_DLY
[3:0]
_MUX
[1:0]
ut6
_E
N
CL
CLKout7 Ko
CLKout7_DIV
[7:0]
CLKout7_DLY
[3:0]
R7
R9
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
_MUX
[1:0]
ut7
_E
N
0
1
1
0
1
0
1
1
Vb
o
0
0
1
0
0
0
0
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
ost
EN
_C
LK
out
_G
lob
al
CL
Kin
_S
EL
EC
T
PO
W
0
R1
4
ER
DO
W
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
N
REGISTER R0 to R7
Registers R0 through R7 control the eight clock outputs. Register R0 controls CLKout0, Register R1 controls
CLKout1, and so on. There is one additional bit in register R0 called RESET. Aside from this, the functions of
these bits are identical. The X in CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and CLKoutX_EN denote the
actual clock output which may be from 0 to 7.
Table 2. Default Register Settings after Power-on-Reset
Default
Bit Value
Bit
Location
Bit Name
Bit State
Bit Description
Register
RESET
0
No reset, normal operation
Reset to power on defaults
R0
31
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
Table 2. Default Register Settings after Power-on-Reset (continued)
Default
Bit Value
Bit
Location
Bit Name
CLKoutX_MUX
Bit State
Bit Description
Register
0
0
1
0
0
1
0
Bypassed
Disabled
Divide by 2
0 ps
CLKoutX mux mode
18:17
16
CLKoutX_EN
CLKoutX enable
R0 to R7
CLKoutX_DIV
CLKoutX clock divide
CLKoutX clock delay
Select CLKin0 or CLKin1
Global clock output enable
Device power down
15:8
7:4
29
CLKoutX_DLY
CLKin_SELECT
EN_CLKout_Global
POWERDOWN
CLKin1
Normal - CLKouts normal
Normal - Device active
R14
27
26
Reset Bit -- R0 only
This bit is only in register R0. The use of this bit is optional and it should be set to '0' if not used. Setting this bit
to a '1' forces all registers to their power-on-reset condition and therefore automatically clears this bit. If this bit is
set, all other R0 bits are ignored and R0 needs to be programmed again if used with its proper values and
RESET = 0.
CLKoutX_MUX[1:0] -- Clock Output Multiplexers
These bits control the Clock Output Multiplexer for each clock output. Changing between the different modes
changes the blocks in the signal path and therefore incurs a delay relative to the Bypassed mode. The different
MUX modes and associated delays are listed below.
CLKoutX_MUX[1:0]
Mode
Bypassed (default)
Divided
Added Delay Relative to Bypassed Mode
0
1
0 ps
100 ps
400 ps
2
3
Delayed
(In addition to the programmed delay)
500 ps
Divided and Delayed
(In addition to the programmed delay)
CLKoutX_DIV[7:0] -- Clock Output Dividers
These bits control the clock output divider value. In order for these dividers to be active, the respective
CLKoutX_MUX (See Section 2.3.2) bit must be set to either "Divided" or "Divided and Delayed" mode. After all
the dividers are programed, the SYNC* pin must be used to ensure that all edges of the clock outputs are
aligned (See Section 1.5). By adding the divider block to the output path a fixed delay of approximately 100 ps is
incurred.
The actual Clock Output Divide value is twice the binary value programmed as listed in the table below.
CLKoutX_DIV[7:0]
Clock Output Divider value
0
0
0
0
0
0
.
0
0
0
0
0
0
.
0
0
0
0
0
0
.
0
0
0
0
0
0
.
0
0
0
0
0
0
.
0
0
0
0
1
1
.
0
0
1
1
0
0
.
0
1
0
1
0
1
.
Invalid
2 (default)
4
6
8
10
...
1
1
1
1
1
1
1
1
510
12
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
CLKoutX_DLY[3:0] -- Clock Output Delays
These bits control the delay stages for each clock output. In order for these delays to be active, the respective
CLKoutX_MUX (See Section 2.3.2) bit must be set to either "Delayed" or "Divided and Delayed" mode. By
adding the delay block to the output path a fixed delay of approximately 400 ps is incurred in addition to the
delay shown in the table below.
CLKoutX_DLY[3:0]
Delay (ps)
0 (default)
150
0
1
2
300
3
450
4
600
5
750
6
900
7
1050
1200
1350
1500
1650
1800
1950
2100
2250
8
9
10
11
12
13
14
15
CLKoutX_EN bit -- Clock Output Enables
These bits control whether an individual clock output is enabled or not. If the EN_CLKout_Global bit is set to zero
or if GOE pin is held low, all CLKoutX_EN bit states will be ignored and all clock outputs will be disabled.
CLKoutX_EN bit
Conditions
CLKoutX State
Disabled (default)
Enabled
0
1
EN_CLKout_Global bit = 1
GOE pin = High / No Connect 1
REGISTER R9
R9 only needs to be programmed if Vboost is set to 1. Program all other bits in R9 as indicated in register map
(See Section 2.2)
Vboost - Voltage Boost Bit
Enabling this bit sets all clock outputs in voltage boost mode which increases the voltage at these outputs. This
can improve the noise floor performance of the output, but also increases current consumption, and can cause
the outputs to be too high to meet the LVPECL/LVDS specifications.
Vboost bit
fCLKoutX < 1300 MHz
1300 MHz ≤ fCLKoutX < 1500
1500 MHz ≤ fCLKoutX ≤ 1600 MHz
MHz
0
1
Recommended to hit voltage level
specifications for LVPECL/LVDS
Insufficient voltage level for LVDS/LVPECL specifications, but saves
current
Voltage May overdrive LVPECL/LVDS
specifications, but noise floor is about 2-4 dB
better and current consumption is increased
Voltage is sufficient for
LVDS/LEVPECL specifications.
Current consumption is
increased, but noise floor is
about the same.
Insufficient voltage for
LVDS/LVPECL specifications, but
still higher than when Vboost=0.
Increased current consumption.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
REGISTER R14
The LMK01000 family requires register R14 to be programmed as shown in the register map (See Section 2.2).
POWERDOWN Bit -- Device Power Down
This bit can power down the device. Enabling this bit powers down the entire device and all blocks, regardless of
the state of any of the other bits or pins.
POWERDOWN bit
Mode
0
1
Normal Operation (default)
Entire Device Powered Down
EN_CLKout_Global Bit -- Global Clock Output Enable
This bit overrides the individual CLKoutX_EN bits. When thisbit is set to 0, all clock outputs are disabled,
regardless of thestate of any of the other bits or pins.
EN_CLKout_Global bit
Clock Outputs
All Off
0
1
Normal Operation (default)
CLKin_SELECT Bit -- Device CLKin Select
This bit determines which CLKin pin is used.
CLKin bit
Mode
CLKin1 (default)
CLKin0
0
1
Application Information
SYSTEM LEVEL DIAGRAM
The following shows a typical application for a LMK01000 family device. In this setup the clock may be divided,
skewed, and redistributed.
To Other Devices
...
100 pF
CLKin1*
100 pF
Fout
CLK
CLKin1
LMX2531
LMK010X0
CLKuWire
DATA
LE
DATAuWire
LEuWire
...
...
3.3 V
3.0 V
Microcontroller
Figure 2. Typical Application
14
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS (Vcc = 3.3 V, TA = 25° C)
Current
Power
Power
Consumption
Dissipated in
LVPECL emitter
resistors (mW)
Block
Condition
Dissipated in
device (mW)
at 3.3 V
(mA)
Core Current
All outputs disabled. Includes input buffer currents.
19
62.7
29.7
-
Low clock buffer The low clock buffer is enabled anytime one of CLKout0 through
(internal)
9
-
CLKout3 are enabled
High clock
The high clock buffer is enabled anytime one of the CLKout4
9
29.7
58.7
72
-
-
buffer (internal) through CLKout7 are enabled
LVDS output, Bypassed mode
17.8
40
LVPECL output, Bypassed mode
(includes 120 Ω emitter resistors)
60
Output buffers
Vboost
LVPECL output, disabled mode
(includes 120 Ω emitter resistors)
17.4
0
38.3
0
19.1
LVPECL output, disabled mode.
No emitter resistors placed; open outputs
-
-
Additional current per channel due
to setting Vboost from 0 to 1.
LVPECL Output
LVDS Output
0.5
1.5
1.65
5.0
Divide enabled, divide = 2
Divide enabled, divide > 2
Delay enabled, delay < 8
Delay enabled, delay > 7
LMK01000
5.3
17.5
28.0
19.1
32.7
223.1
209.9
-
-
Divide circuitry
per output
8.5
5.8
-
Delay circuitry
per output
9.9
-
Entire device
CLKout0 &
CLKout4
85.8
63.6
60
-
LMK01010
enabled in
Bypassed mode
LMK01020
108
236.4
120
Entire device
all outputs
enabled with no
delay and divide
value of 2
LMK01000
LMK01010
323.8
212.8
768.5
702.3
300
-
LMK01020
390.4
808.3
480
From the above table, the current can be calculated in any configuration. For example, the current for the entire
device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) output in Bypassed mode can be calculated by adding up
the following blocks: core current, low clock buffer, high clock buffer, one LVDS output buffer current, and one
LVPECL output buffer current. There will also be one LVPECL output drawing emitter current, but some of the
power from the current draw is dissipated in the external 120 Ω resistors which doesn't add to the power
dissipation budget for the device. If delays or divides are switched in, then the additional current for these stages
needs to be added as well.
For power dissipated by the device, the total current entering the device is multiplied by the voltage at the device
minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter
resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the case of 1 LVDS
(CLKout0) & 1 LVPECL (CLKout4) operating at 3.3 volts for LMK01000, we calculate 3.3 V × (10 + 9 + 9 + 17.8
+ 40) mA = 3.3 V × 85.8 mA = 283.1 mW. Because the LVPECL output (CLKout4) has the emitter resistors
hooked up and the power dissipated by these resistors is 60 mW, the total power dissipation is 283.1 mW - 60
mW = 223.1 mW. When the LVPECL output is active, ~1.9 V is the average voltage on each output as calculated
from the LVPECL Voh & Vol typical specification. Therefore the power dissipated in each emitter resistor is
approximately (1.9 V)2 / 120 Ω = 30 mW. When the LVPECL output is disabled, the emitter resistor voltage is
~1.07 V. Therefore the power dissipated in each emitter resistor is approximately (1.07 V)2 / 120 Ω = 9.5 mW.
THERMAL MANAGEMENT
Power consumption of the LMK01000 family device can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum of
125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not
exceed 125 °C.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to the printed circuit board. To maximize the removal of heat from the package a thermal
land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A
recommended land and via pattern is shown in Figure 3. More information on soldering LLP packages can be
obtained at www.national.com.
5.0 mm, min
0.33 mm, typ
1.2 mm, typ
Figure 3. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 3 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
TERMINATION AND USE OF CLOCK OUTPUTS
When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter performance:
•
•
Transmission line theory should be followed for good impedance matching to prevent reflections.
Clock drivers should be presented with the proper loads.
–
–
LVDS drivers are current drivers and require a closed current loop.
LVPECL drivers are open emitter and require a DC path to ground.
•
Receivers should be presented with a signal biased to their specified DC bias level (common mode voltage)
for proper operation. Some receivers have self-biasing inputs that automatically bias to the proper voltage
level. In this case, the signal should normally be AC coupled.
It is possible to drive a non-LVPECL or non-LVDS receiver with a LVDS or LVPECL driver as long as the above
guidelines are followed. Check the datasheet of the receiver or input being driven to determine the best
termination and coupling method to be sure the receiver is biased at the optimum DC voltage (common mode
voltage). For example, when driving the OSCin/OSCin* input of the LMK01000 family, OSCin/OSCin* should be
AC coupled because OSCin/ OSCin* biases the signal to the proper DC level, see Figure 2. This is only slightly
different from the AC coupled cases described (See Section 3.4.2) because the DC blocking capacitors are
placed between the termination and the OSCin/OSCin* pins, but the concept remains the same, which is the
receiver (OSCin/ OSCin*) set the input to the optimum DC bias voltage (common mode voltage), not the driver.
Termination for DC Coupled Differential Operation
For DC coupled operation of an LVDS driver, terminate with 100 Ω as close as possible to the LVDS receiver as
shown in Figure 4. To ensure proper LVDS operation when DC coupling it is recommend to use LVDS receivers
without fail-safe or internal input bias such as National Semiconductor's DS90LV110T. The LVDS driver will
provide the DC bias level for the LVDS receiver. For operation with LMK01000 family LVDS drivers it is
recommend to use AC coupling with LVDS receivers that have an internal DC bias voltage. Some fail-safe
circuitry will present a DC bias (common mode voltage) which will prevent the LVDS driver from working
correctly. This precaution does not apply to the LVPECL drivers.
16
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
CLKoutX
CLKoutX*
100W Trace
(Differential)
LVDS
Receiver
LVDS
Driver
Figure 4. Differential LVDS Operation, DC Coupling
For DC coupled operation of an LVPECL driver, terminate with 50 Ω to Vcc - 2 V as shown in Figure 5.
Alternatively terminate with a Thevenin equivalent circuit (120 Ω resistor connected to Vcc and an 82 Ω resistor
connected to ground with the driver connected to the junction of the 120 Ω and 82 Ω resitors) as shown in
Figure 6 for Vcc = 3.3 V.
Vcc - 2 V
CLKoutX
100W Trace
(Differential)
LVPECL
Driver
LVPECL
Receiver
CLKoutX*
Vcc - 2 V
Figure 5. Differential LVPECL Operation, DC Coupling
Vcc
CLKoutX
100W Trace
(Differential)
LVPECL
Driver
LVPECL
Receiver
CLKoutX*
Vcc
Figure 6. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent
Termination for AC Coupled Differential Operation
AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver
standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is important
to ensure the receiver is biased to its ideal DC level.
When driving LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC blocking
capacitors, however the proper DC bias point needs to be established at the receiver. One way to do this is with
the termination circuitry in Figure 7.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
0.1 mF
100W Trace
(Differential)
CLKoutX
LVDS
Receiver
LVDS
Driver
Vbias
CLKoutX*
0.1 mF
Figure 7. Differential LVDS Operation, AC Coupling
LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120 Ω emitter resistors
close to the LVPECL driver to provide a DC path to ground as shown in Figure 11. For proper receiver operation,
the signal should be biased to the DC bias level (common mode voltage) specified by the receiver. The typical
DC bias voltage (common mode voltage) for LVPECL receivers is 2 V. A Thevenin equivalent circuit (82 Ω
resistor connected to Vcc and a 120 Ω resistor connected to ground with the driver connected to the junction of
the 82 Ω and 120 Ω resistors) is a valid termination as shown in Figure 8 for Vcc = 3.3 V. Note: this Thevenin
circuit is different from the DC coupled example in Figure 6.
Vcc
CLKoutX
0.1 mF
100W Trace
(Differential)
LVPECL
Reciever
LVPECL
Driver
0.1 mF
CLKoutX*
Vcc
Figure 8. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent
Termination for Single-Ended Operation
A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into an
unbalanced, single-ended signal.
It is possible to use an LVPECL driver as one or two separate 800 mV p-p signals. When DC coupling one of the
LMK01000 family LVPECL drivers, the termination should still be 50 Ω to Vcc - 2 V as shown in Figure 9. Again
the Thevenin equivalent circuit (120 Ω resistor connected to Vcc and an 82 Ω resistor connected to ground with
the driver connected to the junction of the 120 Ω and 82 Ω resistors) is a valid termination as shown in Figure 10
for Vcc = 3.3 V.
Vcc - 2V
CLKoutX
50W Trace
LVPECL
Driver
Vcc - 2V
Load
CLKoutX*
50W
Figure 9. Single-Ended LVPECL Operation, DC Coupling
18
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
LMK01000
www.ti.com
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
Vcc
CLKoutX
Vcc
50W Trace
LVPECL
Driver
CLKoutX*
Load
Figure 10. Single-Ended LVPECL Operation, DC Coupling, Thevenin Equivalent
When AC coupling an LVPECL driver use a 120 Ω emitter resistor to provide a DC path to ground and ensure a
50 Ω termination with the proper DC bias level for the receiver. The typical DC bias voltage for LVPECL
receivers is 2 V (See Section 3.4.1). If the other driver is not used it should be terminated with either a proper AC
or DC termination. This latter example of AC coupling a single-ended LVPECL signal can be used to measure
single-ended LVPECL performance using a spectrum analyzer or phase noise analyzer. When using most RF
test equipment no DC bias point (0 V DC) is expected for safe and proper operation. The internal 50 Ω
termination the test equipment correctly terminates the LVPECL driver being measured as shown in Figure 11.
When using only one LVPECL driver of a CLKoutX/CLKoutX* pair, be sure to properly terminated the unused
driver.
CLKoutX
50W Trace
0.1 mF
LVPECL
Driver
0.1 mF
CLKoutX*
Load
Figure 11. Single-Ended LVPECL Operation, AC Coupling
Conversion to LVCMOS Outputs
To drive an LVCMOS input with an LMK01000 family LVDS or LVPECL output, an LVPECL/LVDS to LVCMOS
converter such as National Semiconductor's DS90LV018A, DS90LV028A, DS90LV048A, etc. is required. For
best noise performance, LVPECL provides a higher voltage swing into input of the converter.
OSCin INPUT
In addition to LVDS and LVPECL inputs, OSCin can also be driven with a sine wave. The OSCin input can be
driven single-ended or differentially with sine waves. These configurations are shown in Figure 12 and Figure 13.
0.1 mF
50W Trace
LMK
Input
Clock Source
0.1 mF
Figure 12. Single-Ended Sine Wave Input
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Links: LMK01000
LMK01000
SNAS437G –FEBRUARY 2008–REVISED OCTOBER 2009
www.ti.com
0.1 mF
0.1 mF
100W Trace
(Differential)
LMK
Input
Clock Source
Figure 13. Differential Sine Wave Input
Figure 14 shows the recommended power level for sine wave operation for both differential and single-ended
sources over frequency. The part will operate at power levels below the recommended power level, but as power
decreases the PLL noise performance will degrade. The VCO noise performance will remain constant. At the
recommended power level the PLL phase noise degradation from full power operation (8 dBm) is less than 2 dB.
10
5
Minimum Recommended
Power for Single-Ended
Operation
0
-5
Minimum Recommended
Power for Differential
Operation
-10
-15
-20
20
30
40
60
90
10
50
70
80
100
FREQUENCY (MHz)
Figure 14. Recommended OSCin Power for Operation with a Sine Wave Input
MORE THAN EIGHT OUTPUTS WITH AN LMK01000 FAMILY DEVICE
The LMK01000 family device can be used in conjunction with a LMK02000, LMK03000, LMK04000, or even
another LMK01000 device in order to produce more than 8 outputs. When doing this, attention needs to be given
to how the frequencies are assigned for each output to eliminate synchronization issues. Refer to AN-1864 for
more details.
GLOBAL DELAY THROUGH AN LMK01000 FAMILY DEVICE
The delay from CLKin to CLKout is determinsic, but can vary based on the engaged delays and divides as
discussed in Section 2.3.2 for the CLKoutX_MUX bit. In addition, there can be variations based on voltage,
temperature, and frequency. AN-1864 discusses this global delay in more detail.
20
Submit Documentation Feedback
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Links: LMK01000
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMK01000ISQ/NOPB
LMK01000ISQE/NOPB
LMK01000ISQX/NOPB
LMK01010ISQ/NOPB
LMK01010ISQE/NOPB
LMK01010ISQX/NOPB
LMK01020ISQ/NOPB
LMK01020ISQE/NOPB
LMK01020ISQX/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
48
48
48
48
48
48
48
48
48
1000 RoHS & Green
250 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
K01000 I
SN
SN
SN
SN
SN
SN
SN
SN
K01000 I
K01000 I
K01010 I
K01010 I
K01010 I
K01020 I
K01020 I
K01020 I
2500 RoHS & Green
1000 RoHS & Green
250
RoHS & Green
2500 RoHS & Green
1000 RoHS & Green
250
RoHS & Green
2500 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMK01000ISQ/NOPB
LMK01000ISQE/NOPB
LMK01000ISQX/NOPB
LMK01010ISQ/NOPB
LMK01010ISQE/NOPB
LMK01010ISQX/NOPB
LMK01020ISQ/NOPB
LMK01020ISQE/NOPB
LMK01020ISQX/NOPB
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
48
48
48
48
48
48
48
48
48
1000
250
330.0
178.0
330.0
330.0
178.0
330.0
330.0
178.0
330.0
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
7.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
2500
1000
250
2500
1000
250
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMK01000ISQ/NOPB
LMK01000ISQE/NOPB
LMK01000ISQX/NOPB
LMK01010ISQ/NOPB
LMK01010ISQE/NOPB
LMK01010ISQX/NOPB
LMK01020ISQ/NOPB
LMK01020ISQE/NOPB
LMK01020ISQX/NOPB
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
WQFN
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
RHS
48
48
48
48
48
48
48
48
48
1000
250
356.0
208.0
356.0
356.0
208.0
356.0
356.0
208.0
356.0
356.0
191.0
356.0
356.0
191.0
356.0
356.0
191.0
356.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
2500
1000
250
2500
1000
250
2500
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明