LMH0001SQE/NOPB [TI]
SMPTE 259M/344M 串行数字电缆驱动器 | RUM | 16 | -40 to 85;
| 型号： | LMH0001SQE/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SMPTE 259M/344M 串行数字电缆驱动器 | RUM | 16 | -40 to 85 驱动 驱动器 |
| 文件： | 总13页 (文件大小：363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMH0001
www.ti.com
SNLS276C –AUGUST 2007–REVISED APRIL 2013
LMH0001 SMPTE 259M / 344M Serial Digital Cable Driver
Check for Samples: LMH0001
1
FEATURES
DESCRIPTION
The LMH0001 SMPTE 259M / 344M Serial Digital
Cable Driver is designed for use in SMPTE 259M /
344M serial digital video applications. The LMH0001
drives 75Ω transmission lines (Belden 8281, Belden
1694A or equivalent) at data rates up to 540 Mbps.
2
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•
•
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SMPTE 259M and SMPTE 344M Compliant
Data Rates to 540 Mbps
Supports DVB-ASI at 270 Mbps
Differential Input
75Ω Differential Output
The output voltage swing of the LMH0001 is
adjustable via a single external resistor.
Adjustable Output Amplitude
Single 3.3V Supply Operation
Industrial Temperature Range: −40°C to +85°C
125mW Typical Power Consumption
16–pin WQFN Package
The LMH0001 is powered from a single 3.3V supply.
Power consumption is typically 125mW. The
LMH0001 is available in a 16-pin WQFN package.
Footprint Compatible with the LMH0002SQ and
the GS9078A.
APPLICATIONS
•
SMPTE 259M and SMPTE 344M Serial Digital
Interfaces
•
•
•
•
•
•
•
DVB-ASI Applications
Sonet/SDH and ATM Interfaces
Digital Routers and Switches
Distribution Amplifiers
Buffer Applications
Set Top Boxes
Security Cameras
Typical Application
V
CC
0.1 mF
75W
75W
V
CC
5.6 nH
4.7 mF
1.0 mF
V
CC
SDI
75W
75W
SDO
SDO
49.9W
49.9W
LMH0001
4.7 mF
R
REF
SDI
V
Differential
Input
EE
1.0 mF
V
CC
5.6 nH
0.1 mF
750W
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
LMH0001
SNLS276C –AUGUST 2007–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
Absolute Maximum Ratings
Supply Voltage:
−0.5V to 3.6V
−0.3V to VCC+0.3V
28mA
Input Voltage (all inputs)
Output Current
Storage Temperature Range
Junction Temperature
−65°C to +150°C
+150°C
Lead Temperature
(Soldering 4 Sec)
+260°C
Package Thermal Resistance
θJA 16-pin WQFN
θJC 16-pin WQFN
+78.9°C/W
+42.7°C/W
ESD Rating (HBM)
ESD Rating (MM)
5kV
250V
(1) Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE):
3.3V ±5%
Operating Free Air Temperature (TA)
−40°C to +85°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
(1)(2)
.
Parameter
Test Conditions
Reference
SDI, SDI
Min
Typ
Max
Unit
VCMIN
Input Common Mode
Voltage
1.6 +
VSDI/2
VCC
–
V
VSDI/2
VSDI
Input Voltage Swing
Differential
100
2000 mVP−P
V
VCMOUT
Output Common Mode
Voltage
SDO, SDO
VCC
VSDO
–
VSDO
Output Voltage Swing
Single-ended, 75Ω load,
RREF = 750Ω 1%
750
900
800
1000
(3)38
850
1100
43
mVP-P
mVP-P
mA
Single-ended, 75Ω load,
RREF = 590Ω 1%
ICC
Supply Current
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +3.3V and TA = +25°C.
(3) Maximum ICC is measured at VCC = +3.465V and TA = +70°C.
2
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Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0001
LMH0001
www.ti.com
SNLS276C –AUGUST 2007–REVISED APRIL 2013
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
(1)
.
Parameter
Input Data Rate
Additive Jitter
Test Conditions
Reference
(2)SDI, SDI
SDO, SDO
Min
Typ
Max
Unit
Mbps
psP-P
ps
DRSDI
tjit
540
270 Mbps
18
tr,tf
Output Rise Time, Fall
Time
20% – 80%
400
560
800
(2)
(2)
(2)
Mismatch in Rise/Fall Time
Duty Cycle Distortion
Output Overshoot
30
100
8
ps
ps
%
tOS
RLSDO
Output Return Loss
(3)15
20
dB
(1) Typical values are stated for VCC = +3.3V and TA = +25°C.
(2) Specification is ensured by characterization.
(3) Output return loss is dependent on board design. The LMH0001 meets this specification on the SD001SQ evaluation board from 5MHz
to 1.5GHz.
CONNECTION DIAGRAM
16
15
14
13
SDI
SDI
SDO
1
2
3
4
12
11
10
9
SDO
NC
LMH0001
(top view)
V
EE
R
V
CC
REF
5
6
7
8
Figure 1. 16-Pin WQFN Package
See Package Number RUM0016A
PIN DESCRIPTIONS
SOIC
Pin No.
WQFN
Pin No.
Name
Description
1
2
1
2
SDI
Serial data true input.
SDI
Serial data complement input.
Negative power supply (ground).
Output driver level control. Connect a resistor to VCC to set output voltage swing.
Positive power supply (+3.3V).
Serial data complement output.
Serial data true output.
3
3
VEE
4
4
RREF
VCC
SDO
SDO
5
9
7
11
12
8
—
5, 6, 7, 8, NC
10, 13, 14,
15, 16
No connect.
—
DAP
VEE
Connect exposed DAP to negative power supply (ground).
Copyright © 2007–2013, Texas Instruments Incorporated
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3
Product Folder Links: LMH0001
LMH0001
SNLS276C –AUGUST 2007–REVISED APRIL 2013
www.ti.com
DEVICE OPERATION
INPUT INTERFACING
The LMH0001 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC
or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are self-
biased at approximately 2.1V with VCC = 3.3V. Figure 2 shows the differential input stage for SDI and SDI.
V
CC
SDI
SDI
V
CC
5 kW
10 kW
80W
10 kW
10 kW
Figure 2. Differential Input Stage for SDI and SDI.
OUTPUT INTERFACING
The LMH0001 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled
coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the RREF resistor connected between
the RREF pin and VCC
.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
4
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Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH0001
LMH0001
www.ti.com
SNLS276C –AUGUST 2007–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 4
Copyright © 2007–2013, Texas Instruments Incorporated
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5
Product Folder Links: LMH0001
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMH0001SQ/NOPB
LMH0001SQE/NOPB
ACTIVE
ACTIVE
WQFN
WQFN
RUM
RUM
16
16
1000 RoHS & Green
250 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
L001
L001
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMH0001SQ/NOPB
LMH0001SQE/NOPB
WQFN
WQFN
RUM
RUM
16
16
1000
250
178.0
178.0
12.4
12.4
4.3
4.3
4.3
4.3
1.3
1.3
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMH0001SQ/NOPB
LMH0001SQE/NOPB
WQFN
WQFN
RUM
RUM
16
16
1000
250
208.0
208.0
191.0
191.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RUM0016A
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
A
B
PIN 1 INDEX AREA
4.1
3.9
0.8
0.7
C
SEATING PLANE
0.05
0.00
0.08 C
DIM A
OPT 1
0.2
OPT 2
0.1
2X 1.95
SYMM
(DIM A) TYP
5
8
EXPOSED
THERMAL PAD
4
9
2X 1.95
SYMM
17
2.6 0.1
12X 0.65
1
12
0.35
0.25
16X
PIN 1 ID
(45 X 0.3)
13
16
0.1
C A B
0.5
0.3
0.05
16X
4214998/A 11/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RUM0016A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
2.6)
SYMM
SEE SOLDER MASK
DETAIL
13
16
16X (0.6)
1
12
16X (0.3)
17
SYMM
12X (0.65)
(3.8)
(1.05)
4
9
(R0.05) TYP
(
0.2) TYP
VIA
5
8
(1.05)
(3.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
SOLDER MASK DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214998/A 11/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RUM0016A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.675) TYP
13
16
16X (0.6)
1
12
16X (0.3)
(0.675) TYP
(3.8)
17
SYMM
12X (0.65)
4X ( 1.15)
9
4
(R0.05) TYP
8
5
SYMM
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 17
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4214998/A 11/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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