LM7341_15 [TI]
Rail-to-Rail Input/Output ±15V, 4.6 MHz GBW, Operational Amplifier in SOT-23 Package;
| 型号： | LM7341_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Rail-to-Rail Input/Output ±15V, 4.6 MHz GBW, Operational Amplifier in SOT-23 Package |
| 文件： | 总27页 (文件大小：900K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM7341
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SNOSAW9B –MAY 2008–REVISED MARCH 2013
LM7341 Rail-to-Rail Input/Output ±15V, 4.6 MHz GBW, Operational Amplifier in SOT-23
Package
Check for Samples: LM7341
1
FEATURES
DESCRIPTION
The LM7341 is a rail-to-rail input and output amplifier
in a small SOT-23 package with a wide supply
voltage and temperature range. The LM7341 has a
2
•
(VS = ±15V, TA = 25°C, Typical Values.)
Tiny 5-pin SOT-23 Package Saves Space
•
•
Greater than Rail-to-Rail Input CMVR −15.3V to
15.3V
4.6 MHz gain bandwidth and
a 1.9 volt per
microsecond slew rate, and draws 0.75 mA of supply
current at no load.
•
•
•
•
•
•
•
•
•
•
Rail-to-Rail Output Swing −14.84V to 14.86V
Supply Current 0.7 mA
The LM7341 is tested at −40°C, 125°C and 25°C with
modern
automatic
test
equipment.
Detailed
Gain Bandwidth 4.6 MHz
performance specifications at 2.7V, ±5V, and ±15V
and over a wide temperature range make the
LM7341 a good choice for automotive, industrial, and
other demanding applications.
Slew Rate 1.9 V/µs
Wide Supply Range 2.7V to 32V
High Power Supply Rejection Ratio 106 dB
High Common Mode Rejection Ratio 115 dB
Excellent Gain 106 dB
Greater than rail-to-rail input common mode range
with a minimum 76 dB of common mode rejection at
±15V makes the LM7341 a good choice for both high
and low side sensing applications.
Temperature Range −40°C to 125°C
Tested at −40°C, 125°C and 25°C at 2.7V, ±5V
and ±15V
LM7341 performance is consistent over a wide
voltage range, making the part useful for applications
where the supply voltage can change, such as
automotive electrical systems and battery powered
electronics.
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
Automotive
Industrial Robotics
The LM7341 uses a small SOT23-5 package, which
takes up little board space, and can be placed near
signal sources to reduce noise pickup.
Sensor Output Buffers
Multiple Voltage Power Supplies
Reverse Biasing of Photodiodes
Low Current Optocouplers
High Side Sensing
Comparator
Battery Chargers
Test Point Output Buffers
Below Ground Current Sensing
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2013, Texas Instruments Incorporated
LM7341
SNOSAW9B –MAY 2008–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
140
158
135
140
120
158
R
C
= 1 MW
V
= ±15V
= 1 MW
= 20 pF
L
S
120
135
= 20 pF
R
L
L
L
C
100
80
60
40
20
0
113
90
68
45
23
0
100
80
60
40
20
0
113
90
68
45
23
0
PHASE
PHASE
±15V
±5V
-40°C
25°C
125°C
±1.35V
±15V
GAIN
GAIN
±5V
125°C, 25°C, -40°C
±1.35V
1M
-20
1k
-23
100M
-20
1k
-23
100M
1M
FREQUENCY (Hz)
100k
10M
10k
100k
10M
10k
FREQUENCY (Hz)
Figure 1. Open Loop Frequency Response
Figure 2. Open Loop Frequency Response
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
ESD Tolerance(3)
Human Body Model
Machine Model
2000V
200V
Charge-Device Model
1000V
VIN Differential
±15V
Voltage at Input/Output Pin
Supply Voltage (VS = V+ − V−)
Input Current
(V+) + 0.3V, (V−) −0.3V
35V
±10 mA
Output Current(4)
±20 mA
Power Supply Current
Soldering Information
25 mA
Infrared or Convection (20 sec)
235°C
Wave Soldering Lead Temp. (10 sec.)
260°C
Storage Temperature Range
Junction Temperature(5)
−65°C to 150°C
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly unto a PC board.
Operating Ratings(1)
Supply Voltage (VS = V+ − V−)
Temperature Range(2)
2.5V to 32V
−40°C to 125°C
325°C/W
Package Thermal Resistance (θJA
)
5-Pin SOT-23
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly unto a PC board.
2
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SNOSAW9B –MAY 2008–REVISED MARCH 2013
2.7V Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = 25°C, V+ = 2.7V, V− = 0V, VCM = 0.5V, VOUT = 1.35V and RL > 1 MΩ to
1.35V. Boldface limits apply at the temperature extremes
Symbol
VOS
Parameter
Input Offset Voltage
Conditions
Min(1)
Typ(2)
Max(1)
Units
VCM = 0.5V and VCM = 2.2V
−4
−5
±0.2
+4
+5
mV
TCVOS
IB
Input Offset Voltage Temperature Drift
Input Bias Current
±2
μV/°C
VCM = 0.5V
−180
−200
−90
nA
nA
VCM = 2.2V
30
1
60
70
IOS
Input Offset Current
VCM = 0.5V and VCM = 2.2V
0V ≤ VCM ≤ 1.0V
0V ≤ VCM ≤ 2.7V
40
50
CMRR
Common Mode Rejection Ratio
82
80
106
80
dB
dB
62
60
PSRR
CMVR
Power Supply Rejection Ratio
Common Mode Voltage Range
2.7V ≤ VS ≤ 30V
VCM = 0.5V
86
84
106
CMRR > 60 dB
−0.3
3.0
65
0.0
V
2.7
AVOL
VOUT
Open Loop Voltage Gain
0.5V ≤ VO ≤ 2.2V
RL = 10 kΩ to 1.35V
12
8
V/mV
Output Voltage Swing
High
RL = 10 kΩ to 1.35V
VID = 100 mV
50
95
120
150
RL = 2 kΩ to 1.35V
150
VID = 100 mV
200
mV from
either rail
Output Voltage Swing
Low
RL = 10 kΩ to 1.35V
VID = −100 mV
55
120
150
RL = 2 kΩ to 1.35V
VID = −100 mV
100
12
150
200
IOUT
Output Current
Supply Current
Sourcing, VOUT = 0V
VID = 200 mV
6
4
mA
mA
Sinking, VOUT = 0V
VID = −200 mV
5
3
10
IS
VCM = 0.5V and VCM = 2.2V
0.6
0.9
1.0
SR
Slew Rate
±1V Step
1.5
3.6
35
0.28
−66
4
V/μs
MHz
GBW
en
Gain Bandwidth
f = 100 kHz, RL = 100 kΩ
f = 1 kHz
Input Referred Voltage Noise Density
Input Referred Voltage Noise Density
Total Harmonic Distortion + Noise
Propagation Delay
nV/√Hz
pA/√Hz
dB
in
f = 1 kHz
THD+N
tPD
f = 10 kHz
Overdrive = 50 mV(3)
Overdrive = 1V(3)
20% to 80%(3)
80% to 20%(3)
µs
3
tr
tf
Rise Time
Fall Time
1
µs
µs
1
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) The maximum differential voltage between the input pins is VIN Differential = ±15V.
Copyright © 2008–2013, Texas Instruments Incorporated
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±5V Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = 25°C, V+ = +5V, V− = −5V, VCM = VOUT = 0V and RL > 1 MΩ to 0V.
Boldface limits apply at the temperature extremes.
Symbol
VOS
Parameter
Input Offset Voltage
Conditions
Min(1)
Typ(2)
Max(1)
Units
VCM = −4.5V and VCM = 4.5V
−4
−5
±0.2
+4
+5
mV
TCVOS
IB
Input Offset Voltage Temperature Drift
Input Bias Current
±2
μV/°C
VCM = −4.5V
−200
−250
−95
nA
nA
dB
VCM = 4.5V
35
1
70
80
IOS
Input Offset Current
VCM = −4.5V and VCM = 4.5V
−5V ≤ VCM ≤ 3V
40
50
CMRR
Common Mode Rejection Ratio
84
82
112
92
−5V ≤ VCM ≤ 5V
72
70
PSRR
CMVR
Power Supply Rejection Ratio
Common Mode Voltage Range
2.7V ≤ VS ≤ 30V, VCM = −4.5V
CMRR ≥ 65 dB
86
84
106
dB
V
−5.3
5.3
−5.0
5.0
AVOL
VOUT
Open Loop Voltage Gain
−4V ≤ VO ≤ 4V
RL = 10 kΩ to 0V
20
12
110
V/mV
Output Voltage Swing
High
RL = 10 kΩ to 0V,
VID = 100 mV
80
170
90
150
200
RL = 2 kΩ to 0V,
VID = 100 mV
300
400
mV from
either rail
Output Voltage Swing
Low
RL = 10 kΩ to 0V
VID = −100 mV
150
200
RL = 2 kΩ to 0V
VID = −100 mV
210
11
300
400
IOUT
Output Current
Supply Current
Sourcing, VOUT = −5V
6
VID = 200 mV
4
mA
mA
Sinking, VOUT = 5V
VID = −200 mV
6
4
12
IS
VCM = −4.5V and VCM = 4.5V
0.65
1.0
1.1
SR
Slew Rate
±4V Step
1.7
4.0
33
0.26
−66
8
V/μs
MHz
GBW
en
Gain Bandwidth
f = 100 kHz, RL = 100 kΩ
f = 1 kHz
Input Referred Voltage Noise Density
Input Referred Voltage Noise Density
Total Harmonic Distortion + Noise
Propagation Delay
nV/√Hz
pA/√Hz
dB
in
f = 1 kHz
THD+N
tPD
f = 10 kHz
Overdrive = 50 mV(3)
Overdrive = 1V(3)
20% to 80%(3)
80% to 20%(3)
µs
6
tr
tf
Rise Time
Fall Time
5
µs
µs
5
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) The maximum differential voltage between the input pins is VIN Differential = ±15V.
4
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SNOSAW9B –MAY 2008–REVISED MARCH 2013
±15V Electrical Characteristics
Unless otherwise specified, all limits ensured for TA = 25°C, V+ = 15V, V− = −15V, VCM = VOUT = 0V and RL > 1 MΩ to 0V.
Boldface limits apply at the temperature extremes
Symbol
VOS
Parameter
Input Offset Voltage
Conditions
Min(1)
Typ(2)
Max(1)
Units
VCM = −14.5V and VCM = 14.5V
−4
−5
±0.2
+4
+5
mV
TCVOS
IB
Input Offset Voltage Temperature Drift
Input Bias Current
±2
μV/°C
VCM = −14.5V
−250
−300
−110
nA
nA
dB
VCM = 14.5V
40
1
80
90
IOS
Input Offset Current
VCM = −14.5V and VCM = 14.5V
−15V ≤ VCM ≤12V
40
50
CMRR
Common Mode Rejection Ratio
84
82
115
100
106
−15V ≤ VCM ≤ 15V
2.7V ≤ VS ≤ 30V, VCM = −14.5V
CMRR > 80 dB
78
76
PSRR
CMVR
Power Supply Rejection Ratio
Common Mode Voltage Range
86
84
dB
V
−15.3
15.3
200
−15.0
15.0
AVOL
VOUT
Open Loop Voltage Gain
−13V ≤ VO ≤ 13V
RL = 10 kΩ to 0V
25
15
V/mV
Output Voltage Swing
High
RL = 10 kΩ to 0V
VID = 100 mV
135
160
10
300
400
mV from
either rail
Output Voltage Swing
Low
Output Current(3)
RL = 10 kΩ to 0V
VID = −100 mV
300
400
IOUT
Sourcing, VOUT = −15V
5
VID = 200 mV
3
mA
mA
Sinking, VOUT = 15V
VID = −200 mV
8
5
13
IS
Supply Current
VCM = −14.5V and VCM = 14.5V
0.7
1.2
1.3
SR
Slew Rate
±12V Step
1.9
4.6
31
V/μs
MHz
GBW
en
Gain Bandwidth
f = 100 kHz, RL = 100 kΩ
f = 1 kHz
Input Referred Voltage Noise Density
Input Referred Voltage Noise Density
Total Harmonic Distortion + Noise
Propagation Delay
nV/√Hz
pA/√Hz
dB
in
f = 1 kHz
0.27
−65
17
THD+N
tPD
f = 10 kHz
Overdrive = 50 mV(4)
Overdrive = 1V(4)
20% to 80%(4)
80% to 20%(4)
µs
12
tr
tf
Rise Time
Fall Time
13
µs
µs
13
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly unto a PC board.
(4) The maximum differential voltage between the input pins is VIN Differential = ±15V.
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Connection Diagram
5-Pin SOT-23
Figure 3. Top View
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Typical Performance Characteristics
Output Swing vs. Sourcing Current
Output Swing vs. Sinking Current
10
1
10
V
= 2.5V
S
V
= 2.5V
S
1
125°C
125°C
85°C
85°C
25°C
25°C
0.1
0.1
0.1
0.01
-40°C
-40°C
0.01
0.01
1
10
100
0.01
0.1
1
10
100
100
100
I
(mA)
I
(mA)
Figure 4.
SINK
SOURCE
Figure 5.
Output Swing vs. Sinking Current
Output Swing vs. Sourcing Current
10
1
10
1
V
= ±5V
S
V
= ±5V
S
125°C
85°C
125°C
85°C
25°C
25°C
0.1
0.1
-40°C
-40°C
0.01
0.01
0.1
1
I
10
100
0.1
1
I
10
(mA)
(mA)
SOURCE
SOURCE
Figure 6.
Output Swing vs. Sourcing Current
Figure 7.
Output Swing vs. Sinking Current
10
1
10
1
V
= ±15V
V = ±15V
S
S
125°C
125°C
85°C
85°C
25°C
25°C
0.1
0.1
-40°C
-40°C
0.01
0.01
0.01
0.01
0.1
1
10
100
0.1
1
10
I
(mA)
I
(mA)
SOURCE
SINK
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
VOS Distribution
VOS vs. VCM (Unit 1)
16
14
12
10
8
0.5
0.4
0.3
0.2
V
= ±5V
V
= ±2.5V
125°C
S
S
85°C
0.1
0
25°C
6
-40°C
-0.1
4
-0.2
-0.3
-0.4
2
0
-3
-2
-1
1
2
3
0
-1
0
1
2
3
4
V
(mV)
OS
V
(V)
CM
Figure 10.
Figure 11.
VOS vs. VCM (Unit 2)
VOS vs. VCM (Unit 3)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
V
S
= 2.5V
-40°C
0.9
-40°C
0.8
0.7
0.6
125°C
25°C
25°C
85°C
85°C
0.5
0.4
125°C
V
= ±2.5V
S
-1
0
1
2
3
4
4
-1
0
1
2
3
V
(V)
CM
V
(V)
CM
Figure 12.
Figure 13.
VOS vs. VCM (Unit 2)
= ±5V
VOS vs. VCM (Unit 1)
0.5
1
0.9
0.8
0.7
0.6
0.4
0.4
V
= ±5V
S
V
S
0.4
0.3
0.2
0.1
0
-40°C
125°C
25°C
85°C
-0.1
-0.2
-0.3
25°C
(V)
125°C
85°C
-40°C
-4
-6
-2
2
4
6
-6
-4
-2
0
2
4
6
0
V
(V)
V
CM
CM
Figure 14.
Figure 15.
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Typical Performance Characteristics (continued)
VOS vs. VCM (Unit 3)
VOS vs. VCM (Unit 1)
0.9
0.85
0.8
1
V
= ±5V
S
V
= ±15V
S
0.9
-40°C
-40°C
25°C
0.8
0.7
0.6
0.75
0.7
25°C
85°C
0.65
0.6
85°C
125°C
125°C
0.5
0.4
0.55
0.5
0
2
10 15 20
-6
-4
-2
2
4
6
-20
-15 -10 -5
0
V
CM
(V)
V
CM
(V)
Figure 16.
Figure 17.
VOS vs. VCM (Unit 2)
= ±15V
VOS vs. VCM (Unit 3)
0.6
0.5
0.4
0.9
0.85
0.8
V
S
-40°C
25°C
0.3
0.2
0.75
0.7
85°C
0.1
0
125°C
0.65
0.6
85°C
125°C
-0.1
-0.2
-0.3
25°C
0
0.55
0.5
-40°C
10 15 20
V
= ±15V
S
-20 -15 -10 -5
5
-20 -15 -10 -5
0
5
10 15 20
V
CM
(V)
V
(V)
CM
Figure 18.
Figure 19.
VOS vs. VS (Unit 1)
VOS vs. VS (Unit 2)
0.1
0
0.9
0.8
-
-
V
= V +0.5V
CM
V
CM
= V +0.5V
-40°C
125°C
85°C
0.7
0.6
0.5
-0.1
25°C
25°C
-0.2
0.3
85°C
-40°C
125°C
0.4
0.3
-0.4
0
5
10 15 20 25 30 35 40
(V)
0
5
10 15 20 25 30 35 40
(V)
V
S
V
S
Figure 20.
Figure 21.
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Typical Performance Characteristics (continued)
VOS vs. VS (Unit 3)
VOS vs. VS (Unit 1)
0.9
0.8
0.7
0.6
-
-40°C
V
= V +0.5V
CM
0.5
0.4
125°C
25°C
85°C
0.3
0.2
0.1
0
85°C
0.6
0.5
25°C
125°C
-40°C
+
V
CM
= V -0.5V
0.4
-0.1
0
5
10 15 20 25 30 35 40
(V)
0
5
10 15 20 25 30 35 40
(V)
V
S
V
S
Figure 22.
Figure 23.
VOS vs. VS (Unit 2)
VOS vs. VS (Unit 3)
1.0
0.9
0.8
0.8
0.7
0.6
+
+
V
= V -0.5V
V
= V -0.5V
CM
CM
-40°C
-40°C
125°C
25°C
125°C
85°C
0.7
0.6
25°C
0.5
0.4
85°C
0.5
0
5
10 15 20 25 30 35 40
(V)
0
5
10 15 20 25 30 35 40
(V)
V
S
V
S
Figure 24.
Figure 25.
IBIAS vs. VCM
IBIAS vs. VCM
40
60
40
20
0
V
= 2.5V
V = ±5V
S
S
20
-40°C
25°C
85°C
0
-20
-40
-60
125°C
-20
-40
-60
85°C
125°C
-80
-80
-100
-120
25°C
-5 -4 -3 -2 -1
-40°C
-100
0
1
2
3
0
1
2
3
4
5
V
(V)
V
CM
(V)
CM
Figure 26.
Figure 27.
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Typical Performance Characteristics (continued)
IBIAS vs. VCM
IBIAS vs. VS
60
40
20
0
-70
-80
-90
-
V
= ±15V
S
V
= V +0.5V
CM
125°C
85°C
-20
-40
-100
-110
-40°C
-60
85°C
25°C
125°C
-80
-100
-120
-40°C
25°C
-5
-120
-15
-10
0
5
10
15
5
10 15 20 25 30 35 40
(V)
0
V
CM
(V)
V
S
Figure 28.
Figure 29.
IBIAS vs. VS
IS vs. VCM
50
45
0.75
0.7
+
V
= 2.5V
-40°C
V
CM
= V -0.5V
S
-40°C
40
35
30
0.65
0.6
25°C
85°C
25°C
85°C
125°C
0.55
0.5
25
20
125°C
0
5
10 15 20 25 30 35 40
(V)
-1
0
1
2
3
4
V
S
V
(V)
CM
Figure 30.
IS vs. VCM
Figure 31.
IS vs. VCM
0.75
0.7
0.85
0.8
-40°C
-40°C
25°C
85°C
0.75
25°C
85°C
0.65
0.6
0.7
0.65
0.6
125°C
125°C
0.55
0.55
0.5
V
= ±5V
S
V
= ±15V
S
0.5
-6
-4
-2
0
2
4
6
-20
-15 -10 -5
0
5
10 15 20
V
(V)
V
(V)
CM
CM
Figure 32.
Figure 33.
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Typical Performance Characteristics (continued)
IS vs. VCM
IS vs. VCM
1
0.9
0.8
1
0.9
0.8
-
+
V
= V +0.5V
V
= V -0.5V
CM
CM
-40°C
-40°C
25°C
25°C
85°C
85°C
0.7
0.6
0.7
0.6
125°C
125°C
0.5
0.5
0
5
10 15 20 25 30 35 40
(V)
0
5
10 15 20 25 30 35 40
(V)
V
S
V
S
Figure 34.
Figure 35.
Positive Output Swing vs. Supply Voltage
Positive Output Swing vs. Supply Voltage
0.5
0.25
0.2
R
= 2 kW
R = 10 kW
L
L
125°C
0.4
125°C
85°C
85°C
0.3
0.2
0.1
0
0.15
0.1
0.05
0
25°C
25°C
-40°C
-40°C
0
10
20
(V)
30
40
0
10
20
(V)
30
40
V
S
V
S
Figure 36.
Figure 37.
Negative Output Swing vs. Supply Voltage
0.9
Negative Output Swing vs. Supply Voltage
0.25
R
= 10 kW
L
R
= 2 kW
L
0.8
0.7
125°C
0.2
85°C
0.6
0.5
125°C
0.15
0.1
0.05
0
25°C
85°C
0.4
0.3
0.2
0.1
0
25°C
-40°C
-40°C
0
10
20
(V)
30
40
0
10
20
(V)
30
40
V
V
S
S
Figure 38.
Figure 39.
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Typical Performance Characteristics (continued)
Open Loop Frequency with Various Capacitive Load
Open Loop Frequency with Various Resistive Load
140
158
140
158
V
= ±15V
V
= ±15V
C = 20 pF
L
S
S
120
135
120
135
R
= 10 MW
L
600W
PHASE
100
80
60
40
20
0
113
90
68
45
23
0
100
80
60
40
20
0
113
90
68
45
23
0
PHASE
100 pF
20 pF
500 pF
100 kW, 1 MW, 10 MW
600W
GAIN
GAIN
1000 pF
500 pF
100 pF
-20
1k
-23
100M
-20
1k
-23
100M
1M
1M
10k
100k
10M
10k
100k
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 40.
Figure 41.
Open Loop Frequency Response with Various
Temperatures
Open Loop Frequency with Various Supply Voltage
140
158
140
158
R
C
= 1 MW
V
= ±15V
= 1 MW
= 20 pF
L
S
120
135
120
135
= 20 pF
R
L
L
L
C
100
80
60
40
20
0
113
90
68
45
23
0
100
80
60
40
20
0
113
90
68
45
23
0
PHASE
PHASE
±15V
±5V
-40°C
25°C
125°C
±1.35V
±15V
GAIN
GAIN
±5V
125°C, 25°C, -40°C
±1.35V
1M
-20
1k
-23
100M
-20
1k
-23
100M
1M
100k
10M
10k
100k
10M
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 42.
Figure 43.
CMRR vs. Frequency
+PSRR vs. Frequency
= ±15V
140
120
100
90
80
70
60
50
40
30
20
10
0
V
S
V
= ±5V
S
100
80
V
= 2.7V
S
V
= ±5V
S
60
40
20
0
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 44.
Figure 45.
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Typical Performance Characteristics (continued)
-PSRR vs. Frequency
Small Signal Step Response
100
90
80
70
60
50
40
30
20
10
0
V
= ±15V
S
INPUT
V
= 2.7V
V = ±5V
S
S
100 pF
360 pF
560 pF
750 pF
1000 pF
2 ms/DIV
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 46.
Figure 47.
Large Signal Step Response
Input Referred Noise Density vs. Frequency
1000
100
10
1
V
= 2.7V
S
INPUT
10,000 pF
100
10
0
VOLTAGE
20,000 pF
30,000 pF
40,000 pF
CURRENT
10
0.1
100k
200 ms/DIV
1
100
1k
10k
FREQUENCY (Hz)
Figure 48.
Input Referred Noise Density vs. Frequency
Figure 49.
Input Referred Noise Density vs. Frequency
1000
1000
100
10
1
100
10
1
V
= ±5V
V
= ±15V
S
S
100
10
0
100
10
0
VOLTAGE
VOLTAGE
CURRENT
10
CURRENT
10
0.1
100k
0.1
100k
1
100
1k
10k
1
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 50.
Figure 51.
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Typical Performance Characteristics (continued)
THD+N vs. Frequency
0
A
V
= +2
V
-10
= 750 mVPP
IN
R
= 100 kW
L
-20
-30
-40
-50
-60
-70
-80
V
= ±15V
V
= 2.7V
10k
S
S
V
= ±5V
1k
S
100k
10
100
1M
FREQUENCY (Hz)
Figure 52.
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APPLICATION INFORMATION
GENERAL INFORMATION
Low supply current and wide bandwidth, greater than rail-to-rail input range, full rail-to-rail output, good capacitive
load driving ability, wide supply voltage and low distortion all make the LM7341 ideal for many diverse
applications.
The high common-mode rejection ratio and full rail-to-rail input range provides precision performance when
operated in non-inverting applications where the common-mode error is added directly to the other system
errors.
CAPACITIVE LOAD DRIVING
The LM7341 has the ability to drive large capacitive loads. For example, 1000 pF only reduces the phase margin
to about 30 degrees.
POWER DISSIPATION
Although the LM7341 has internal output current limiting, shorting the output to ground when operating on a
+30V power supply will cause the op amp to dissipate about 350 mW. This is a worst-case example. In the 5-pin
SOT-23 package, the higher thermal resistance will cause a calculated rise of 113°C. This can raise the junction
temperature to above the absolute maximum temperature of 150°C.
Operating from split supplies greatly reduces the power dissipated when the output is shorted. Operating on
±15V supplies can only cause a temperature rise of 57°C in the 5-pin SOT-23 package, assuming the short is to
ground.
WIDE SUPPLY RANGE
The high power-supply rejection ratio (PSRR) and common mode rejection ratio (CMRR) provide precision
performance when operated on battery or other unregulated supplies. This advantage is further enhanced by the
very wide supply range (2.5V–32V) offered by the LM7341. In situations where highly variable or unregulated
supplies are present, the excellent PSRR and wide supply range of the LM7341 benefit the system designer with
continued precision performance, even in such adverse supply conditions.
SPECIFIC ADVANTAGES OF 5-Pin SOT-23 (TinyPak)
The obvious advantage of the 5-pin SOT-23, TinyPak, is that it can save board space, a critical aspect of any
portable or miniaturized system design. The need to decrease overall system size is inherent in any handheld,
portable, or lightweight system application.
Furthermore, the low profile can help in height limited designs, such as consumer hand-held remote controls,
sub-notebook computers, and PCMCIA cards.
An additional advantage of the tiny package is that it allows better system performance due to ease of package
placement. Because the tiny package is so small, it can fit on the board right where the op amp needs to be
placed for optimal performance, unconstrained by the usual space limitations. This optimal placement of the tiny
package allows for many system enhancements, not easily achieved with the constraints of a larger package.
For example, problems such as system noise due to undesired pickup of digital signals can be easily reduced or
mitigated. This pick-up problem is often caused by long wires in the board layout going to or from an op amp. By
placing the tiny package closer to the signal source and allowing the LM7341 output to drive the long wire, the
signal becomes less sensitive to such pick-up. An overall reduction of system noise results.
Often times system designers try to save space by using dual or quad op amps in their board layouts. This
causes a complicated board layout due to the requirement of routing several signals to and from the same place
on the board. Using the tiny op amp eliminates this problem.
Additional space savings parts are available in tiny packages from Texas Instruments, including low power
amplifiers, precision voltage references, and voltage regulators.
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LOW DISTORTION, HIGH OUTPUT DRIVE CAPABILITY
The LM7341 offers superior low-distortion performance, with a total-harmonic-distortion-plus-noise of −66 dB at f
= 10 kHz. The advantage offered by the LM7341 is its low distortion levels, even at high output current and low
load resistance.
Typical Applications
HANDHELD REMOTE CONTROLS
The LM7341 offers outstanding specifications for applications requiring good speed/power trade-off. In
applications such as remote control operation, where high bandwidth and low power consumption are needed.
The LM7341 performance can easily meet these requirements.
OPTICAL LINE ISOLATION FOR MODEMS
The combination of the low distortion and good load driving capabilities of the LM7341 make it an excellent
choice for driving opto-coupler circuits to achieve line isolation for modems. This technique prevents telephone
line noise from coupling onto the modem signal. Superior isolation is achieved by coupling the signal optically
from the computer modem to the telephone lines; however, this also requires a low distortion at relatively high
currents. Due to its low distortion at high output drive currents, the LM7341 fulfills this need, in this and in other
telecom applications.
REMOTE MICROPHONE IN PERSONAL COMPUTERS
Remote microphones in Personal Computers often utilize a microphone at the top of the monitor which must
drive a long cable in a high noise environment. One method often used to reduce the nose is to lower the signal
impedance, which reduces the noise pickup. In this configuration, the amplifier usually requires 30 dB–40 dB of
gain, at bandwidths higher than most low-power CMOS parts can achieve. The LM7341 offers the tiny package,
higher bandwidths, and greater output drive capability than other rail-to-rail input/output parts can provide for this
application.
LM7341 AS A COMPARATOR
The LM7341 can also be used as a comparator and provides quite reasonable performance. Note however that
unlike a typical comparator an op amp has a maximum allowed differential voltage between the input pins. For
the LM7341, as stated in the Absolute Maximum Ratings section, this maximum voltage is VIN Differential =
±15V. Beyond this limit, even for a short time, damage to the device may occur.
As an inverting comparator at VS = 30V and 1V of overdrive there is typically 12 μs of propagation delay. At VS =
30V and 50 mV of overdrive there is typically 17 µs of propagation delay.
+V
CC
V
-
IN
V
OUT
+
-V
EE
Figure 53. Inverting Comparator
Similarly a non-inverting comparator at VS = 30V and 1V of overdrive there is typically 12 µs of propagation
delay. At VS = 30V and 50 mV of overdrive there is typically 17 μs of propagation delay.
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+V
CC
-
V
OUT
+
V
IN
-V
EE
Figure 54. Non-Inverting Comparator
COMPARATOR WITH HYSTERESIS
The basic comparator configuration may oscillate or produce a noisy output if the applied differential input
voltage is near the comparator's offset voltage. This usually happens when the input signal is moving very slowly
across the comparator's switching threshold. This problem can be prevented by the addition of hysteresis or
positive feedback.
INVERTING COMPARATOR WITH HYSTERESIS
The inverting comparator with hysteresis requires a three resistor network that is referenced to the supply voltage
VCC of the comparator, as shown in Figure 55. When VIN at the inverting input is less than VA, the voltage at the
non-inverting node of the comparator (VIN < VA), the output voltage is high (for simplicity assume VOUT switches
as high as VCC). The three network resistors can be represented as R1||R3 in series with R2. The lower input trip
voltage VA1 is defined as
VA1 = VCCR2 / ((R1||R3) + R2)
(1)
When VIN is greater than VA (VIN > VA), the output voltage is low, very close to ground. In this case the three
network resistors can be presented as R2||R3 in series with R1. The upper trip voltage VA2 is defined as
VA2 = VCC (R2||R3) / ((R1+ (R2||R3)
(2)
The total hysteresis provided by the network is defined as
Delta VA = VA1- VA2
(3)
For example to achieve 50 mV of hysteresis when VCC = 30V set R1 = 4.02 kΩ, R2 = 4.02 kΩ, and R3 = 1.21 MΩ.
With these resistors selected the error due to input bias current is approximately 1 mV. To minimize this error it is
best to use low resistor values on the inputs.
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+V = +30V
CC
R
1
4.02 kW
30V
OUT
V
IN
-
V
OUT
V
V
A2
V
A1
V
A
+
0
14.975
15.025
V
IN
R
R
3
2
1.21 MW
4.02 kW
V
OUT
HIGH
V
LOW
OUT
+V
+V
CC
CC
R
1
R
1
R
3
V
A2
V
A1
R
R
2
3
R
2
Figure 55. Inverting Comparator with Hysteresis
NON-INVERTING COMPARATOR WITH HYSTERESIS
A non-inverting comparator with hysteresis requires a two resistor network, and a voltage reference (VREF) at the
inverting input. When VIN is low, the output is also low. For the output to switch from low to high, VIN must rise up
to VIN1 where VIN1 is calculated by
VIN1 = R1*(VREF/R2) + VREF
(4)
When VIN is high, the output is also high, to make the comparator switch back to it's low state, VIN must equal
VREF before VA will again equal VREF . VIN can be calculated by
VIN2 = (VREF (R1+ R2) - VCCR1)/R2
(5)
The hysteresis of this circuit is the difference between VIN1 and VIN2
.
Delta VIN = VCCR1/R2
(6)
For example to achieve 50 mV of hysteresis when VCC = 30V set R1 = 20Ω and R2 = 12.1 kΩ.
+V = +30V
CC
V
= +15V
-
REF
V
OUT
V
A
V
IN
+
R
1
20W
R
2
12.1 kW
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V
HIGH
V
OUT
LOW
OUT
+V
V
CC
IN 1
30V
R
R
1
V
A
R
2
2
A
1
V
OUT
V
IN 2
V
IN 1
V
R
= V
REF
= V
REF
0
14.975 15.025
V
IN
V
IN 2
Figure 56. Non-Inverting Comparator with Hysteresis
OTHER SOT-23 AMPLIFIERS
The LM7321 is a rail-to-rail input and output amplifier that can tolerate unlimited capacitive load. It works from
2.7V to ±15V and across the −40°C to 125°C temperature range. It has 20 MHz gain-bandwidth, and is available
in both 5-Pin SOT-23 and 8-Pin SOIC packages.
The LM6211 is a 20 MHz part with CMOS input, which runs on 5V to 24V single supplies. It has rail-to-rail output
and low noise.
The LMP7701 is a rail-to-rail input and output precision part with an input voltage offset under 220 microvolts and
low noise. It has 2.5 MHz bandwidth and works on 2.7V to 12V supplies.
SMALLER SC70 AMPLIFIERS
The LMV641 is a 10 MHz amplifier which uses only 140 micro amps of supply current. The input voltage offset is
less than 0.5 mV.
The LMV851 is an 8 MHz amplifier which uses only 0.4 mA supply current, and is available in the smaller SC70
package. The LMV851 also resists Electro Magnetic Interference (EMI) from mobile phones and similar high
frequency sources. It works on 2.7V to 5.5 V supplies.
Detailed information on these and a wide range of other parts can be found at www.ti.com.
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SNOSAW9B –MAY 2008–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 20
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM7341MF/NOPB
LM7341MFE/NOPB
LM7341MFX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
5
5
5
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
AV4A
ACTIVE
ACTIVE
DBV
DBV
250
Green (RoHS
& no Sb/Br)
-40 to 125
AV4A
AV4A
3000
Green (RoHS
& no Sb/Br)
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM7341MF/NOPB
LM7341MFE/NOPB
LM7341MFX/NOPB
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000
250
178.0
178.0
178.0
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM7341MF/NOPB
LM7341MFE/NOPB
LM7341MFX/NOPB
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000
250
210.0
210.0
210.0
185.0
185.0
185.0
35.0
35.0
35.0
3000
Pack Materials-Page 2
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