LM6152ACMX/NOPB [TI]
双路、75MHz、GBW、轨至轨 I/O 运算放大器 | D | 8 | 0 to 70;型号: | LM6152ACMX/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | 双路、75MHz、GBW、轨至轨 I/O 运算放大器 | D | 8 | 0 to 70 放大器 光电二极管 运算放大器 |
文件: | 总27页 (文件大小:1322K) |
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LM6152, LM6154
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
LM6152/LM6154 Dual and Quad 75 MHz GBW Rail-to-Rail I/O Operational Amplifiers
1 Features
3 Description
Using
patented
circuit
topologies,
the
1
•
At VS = 5V, typical unless noted.
LM6152/LM6154 provides new levels of speed vs.
power performance in applications where low voltage
supplies or power limitations previously made
compromise necessary. With only 1.4 mA/amplifier
supply current, the 75 MHz gain bandwidth of this
device supports new portable applications where
higher power devices unacceptably drain battery life.
The slew rate of the devices increases with
increasing input differential voltage, thus allowing the
device to handle capacitive loads while maintaining
large signal amplitude.
•
Greater than Rail-to-rail Input CMVR −0.2 5V to
5.25 V
•
•
•
Rail-to-rail Output Swing 0.01 V to 4.99 V
Wide Gain-bandwidth 75 MHz @ 100 kHz
Slew Rate
–
–
Small Signal 5 V/µs
Large Signal 45 V/µs
•
•
•
Low Supply Current 1.4 mA/amplifier
Wide Supply Range 2.7 V to 24 V
The LM6152/LM6154 can be driven by voltages that
exceed both power supply rails, thus eliminating
concerns about exceeding the common-mode voltage
range. The rail-to-rail output swing capability provides
the maximum possible dynamic range at the output.
This is particularly important when operating on low
supply voltages.
Fast Settling Time of 1.1 µs for 2 V Step (to
0.01%)
•
•
PSRR 91 dB
CMRR 84 dB
2 Applications
Operating on supplies from 2.7 V to over 24 V, the
LM6152/LM6154 is excellent for a very wide range of
applications, from battery operated systems with
large bandwidth requirements to high speed
instrumentation.
•
•
•
Portable High Speed Instrumentation
Signal Conditioning Amplifier/ADC Buffers
Barcode Scanners
Device Information(1)
PART NUMBER
LM6152
PACKAGE
SOIC (8)
SOIC (14)
BODY SIZE (NOM)
4.902 mm × 3.912 mm
8.636 mm × 3.912 mm
LM6154
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Offset Voltage vs. Supply voltage
Supply Current vs. Supply Voltage
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM6152, LM6154
SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
www.ti.com
Table of Contents
6.7 2.7 V DC Electrical Characteristics.......................... 7
6.8 2.7 V AC Electrical Characteristics .......................... 7
6.9 24 V DC Electrical Characteristics........................... 8
6.10 24 V AC Electrical Characteristics ......................... 8
6.11 Typical Performance Characteristics ...................... 9
Application and Implementation ........................ 14
Device and Documentation Support.................. 16
8.1 Related Links .......................................................... 16
8.2 Trademarks............................................................. 16
8.3 Electrostatic Discharge Caution.............................. 16
8.4 Glossary.................................................................. 16
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Handling Ratings....................................................... 4
6.3 Recommended Operating Conditions(1) ................... 4
6.4 Thermal Information.................................................. 4
6.5 5.0 V DC Electrical Characteristics.......................... 5
6.6 5.0 V AC Electrical Characteristics.......................... 6
7
8
9
Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
Changes from Revision D (March 2013) to Revision E
Page
•
•
Changed "Junction Temperature Range" to "Operating Temperature Range" and deleted "TJ" in Recommended
Operating Conditions ............................................................................................................................................................. 4
Deleted TJ = 25°C for Electrical Characteristics Tables......................................................................................................... 5
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 15
2
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
Package D08A
8-Pin
Top View
Package D14A
14-Pin
Top View
Pin Functions
PIN
LM6152
LM6154
I/O
DESCRIPTION
NAME
D08A
D14A
2
-IN A
+IN A
-IN B
+IN B
-IN C
+IN C
-IN D
+IN D
OUT A
OUT B
OUT C
OUT D
V-
2
3
6
5
I
I
ChA Inverting Input
ChA Non-inverting Input
ChB Inverting Input
ChB Non-inverting Input
ChC Inverting Input
ChC Non-inverting Input
ChD Inverting Input
ChD Non-inverting Input
ChA Output
3
6
I
5
I
9
I
10
13
12
1
I
I
I
1
7
O
O
O
O
I
7
ChB Output
8
ChC Output
14
11
4
ChD Output
4
8
Negative Supply
V+
I
Positive Supply
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6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN
MAX
UNIT
Differential Input Voltage
Voltage at Input/Output Pin
±15
V
(V+) + 0.3
V
(V−) −0.3
Supply Voltage (V+ − V−)
35
±10
±25
50
V
Current at Input Pin
mA
mA
mA
°C
(3)
Current at Output Pin
Current at Power Supply Pin
Lead Temperature (soldering, 10 sec)
260
150
(4)
Junction Temperature
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–T A)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.2 Handling Ratings
MIN
MAX
+150
2500
UNIT
Tstg
Storage temperature range
Electrostatic discharge
-65
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
V(ESD)
V
(1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. Human body model
is 1.5 kΩ in series with 100 pF
6.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
2.7 ≤ V+ ≤ 24
+70
UNIT
V
Supply Voltage
Operating Temperature Range, LM6152,LM6154
0
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
6.4 Thermal Information
D08A
8 PINS
193°C/W
D14A
THERMAL METRIC(1)
UNIT
14 PINS
126°C/W
RθJA
Junction-to-ambient thermal resistance
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
6.5 5.0 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface
limits apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
TEST CONDITIONS
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
VOS
Input Offset Voltage
2
4
5
7
mV
max
0.54
TCVOS
IB
Input Offset Voltage Average Drift
Input Bias Current
10
µV/°C
0V ≤ VCM ≤ 5V
500
750
980
1500
980
1500
nA max
IOS
Input Offset Current
32
40
100
160
100
160
nA max
RIN
Input Resistance, CM
0V ≤ VCM ≤ 4V
0V ≤ VCM ≤ 4V
0V ≤ VCM ≤ 5V
5V ≤ V+ ≤ 24V
30
94
84
MΩ
CMRR
Common Mode Rejection Ratio
70
60
70
60
dB
min
PSRR
VCM
Power Supply Rejection Ratio
dB
min
91
80
80
Input Common-Mode Voltage Range
Low
−0.25
0
0
V
V
High
5.25
5.0
5.0
AV
VO
Large Signal Voltage Gain
Output Swing
RL = 10 kΩ
V/mV
min
214
0.006
4.992
0.04
50
50
RL = 100 kΩ
RL = 2 kΩ
Sourcing
0.02
0.03
0.02
0.03
V
max
4.97
4.96
4.97
4.96
V
min
0.10
0.12
0.10
0.12
V
max
4.80
4.70
4.80
4.70
V
min
4.89
ISC
Output Short Circuit Current
3
2.5
3
2.5
mA
min
6.2
27
27
mA
17
17
max
Sinking
7
5
7
5
mA
min
16.9
1.4
mA
max
40
40
IS
Supply Current
Per Amplifier
2
2.25
2
2.25
mA
max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.6 5.0 V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for V+ = 5.0V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface limits
apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
Slew Rate
TEST CONDITIONS
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
SR
±4V Step @ VS = ±6V,
RS < 1 kΩ
24
24
V/µs
min
30
15
15
GBW
Gain-Bandwidth Product
Amp-to-Amp Isolation
f = 100 kHz
RL = 10 kΩ
f = 1 kHz
75
125
9
MHz
dB
en
Input-Referred Voltage Noise
Input-Referred Current Noise
Total Harmonic Distortion
nV/√Hz
pA/√Hz
dBc
in
f = 1 kHz
0.34
T.H.D
f = 100 kHz, RL = 10 kΩ
AV = −1, VO = 2.5 VPP
−65
ts
Settling Time
2V Step to 0.01%
1.1
µs
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
6
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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014
6.7 2.7 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface
limits apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
TEST CONDITIONS
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
VOS
Input Offset Voltage
2
5
5
8
mV
max
0.8
TCVOS
IB
Input Offset Voltage Average Drift
Input Bias Current
10
500
50
µV/°C
nA
IOS
Input Offset Current
nA
RIN
Input Resistance, CM
0V ≤ VCM ≤ 1.8V
30
MΩ
CMRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 1.8V
0V ≤ VCM ≤ 2.7V
3V ≤ V+ ≤ 5V
Low
88
dB
78
PSRR
VCM
Power Supply Rejection Ratio
69
dB
V
Input Common-Mode Voltage Range
−0.25
2.95
5.5
0
0
High
2.7
2.7
V
AV
VO
Large Signal Voltage Gain
Output Swing
RL = 10 kΩ
RL = 10 kΩ
V/mV
0.07
0.11
0.07
0.11
V
max
0.032
2.64
2.62
2.64
2.62
V
min
2.68
1.35
IS
Supply Current
Per Amplifier
mA
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
6.8 2.7 V AC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+ = 2.7V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface
limits apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
TEST CONDITIONS
f = 100 kHz
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
GBW
Gain-Bandwidth Product
80
MHz
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.9 24 V DC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface
limits apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
TEST CONDITIONS
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
VOS
Input Offset Voltage
2
4
7
9
mV
max
0.3
TCVOS
IB
Input Offset Voltage Average Drift
Input Bias Current
10
500
32
µV/°C
nA
IOS
Input Offset Current
nA
RIN
Input Resistance, CM
0V ≤ VCM ≤ 23V
60
Meg Ω
CMRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 23V
0V ≤ VCM ≤ 24V
0V ≤ VCM ≤ 24V
Low
94
dB
84
PSRR
VCM
Power Supply Rejection Ratio
95
dB
V
Input Common-Mode Voltage Range
−0.25
24.25
55
0
0
High
24
24
V
AV
VO
Large Signal Voltage Gain
Output Swing
RL = 10 kΩ
RL = 10 kΩ
V/mV
0.075
0.090
0.075
0.090
V
max
0.044
23.91
1.6
23.8
23.7
23.8
23.7
V
min
IS
Supply Current
Per Amplifier
2.25
2.50
2.25
2.50
mA
max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
6.10 24 V AC Electrical Characteristics
Unless otherwise specified, all limits are ensured for V+ = 24V, V− = 0V, VCM = VO = V+/2 and RL > 1 MΩ to V+/2. Boldface
limits apply at the temperature extremes.
LM6154BC
LM6152AC
PARAMETER
TEST CONDITIONS
TYP(1)
LM6152BC
LIMIT(2)
UNIT
LIMIT(2)
GBW
Gain-Bandwidth Product
f = 100 kHz
80
MHz
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
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6.11 Typical Performance Characteristics
Figure 1. Supply Current vs. Supply Voltage
Figure 2. Offset Voltage vs. Supply voltage
Figure 3. Bias Current vs. Supply voltage
Figure 4. Bias Current vs. VCM
Figure 5. Bias Current vs. VCM
Figure 6. Bias Current vs. VCM
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Typical Performance Characteristics (continued)
Figure 7. Output Voltage vs. Source Current
Figure 8. Output Voltage vs. Source Current
Figure 9. Output Voltage vs. Source Current
Figure 10. Output Voltage vs. Sink Current
Figure 11. Output Voltage vs. Sink Current
Figure 12. Output Voltage vs. Sink Current
10
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Typical Performance Characteristics (continued)
Figure 13. Crosstalk (dB) vs. Frequency
Figure 14. GBWP (@ 100 kHz) vs. Supply Voltage
Figure 15. Unity Gain Frequency vs. Supply Voltage
for Various Loads
Figure 16. CMRR
Figure 17. Voltage Swing vs. Frequency
(CL = 100 pF)
Figure 18. PSRR vs. Frequency
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Typical Performance Characteristics (continued)
Figure 19. Open Loop Gain/Phase
(VS = 5V)
Figure 20. Open Loop Gain/Phase
(VS = 10V)
Figure 21. Open Loop Gain/Phase
(VS = 24V)
Figure 22. Noise Voltage vs. Frequency
Figure 23. Noise Current vs. Frequency
Figure 24. Voltage Error vs. Settle Time
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Typical Performance Characteristics (continued)
0
V
A
V
= ±5V
= -1
S
-10
-20
V
= 5 V
IN
PP
THD
HD2
R
L
= 10 k:
-30
-40
-50
-60
-70
-80
-90
HD3
-100
100k
1M
FREQUENCY (Hz)
Figure 25. Distortion vs. Frequency
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7 Application and Implementation
The LM6152/LM6154 is ideally suited for operation with about 10 kΩ (Feedback Resistor, RF) between the output
and the negative input terminal.
With RF set to this value, for most applications requiring a close loop gain of 10 or less, an additional small
compensation capacitor (CF) (see Figure 26) is recommended across RF in order to achieve a reasonable
overshoot (10%) at the output by compensating for stray capacitance across the inputs.
The optimum value for CF can best be established experimentally with a trimmer cap in place since its value is
dependant on the supply voltage, output driving load, and the operating gain. Below, some typical values used in
an inverting configuration and driving a 10 kΩ load have been tabulated for reference:
Table 1. Typical BW (−3 dB) at Various
Supply Voltage and Gains
VS
Volts
CF
pF
BW (−3 dB)
GAIN
MHz
−1
−10
−100
−1
5.6
6.8
4
3
1.97
0.797
6.6
None
2.2
24
−10
−100
4.7
2.2
None
0.962
In the non-inverting configuration, the LM6152/LM6154 can be used for closed loop gains of +2 and above. In
this case, also, the compensation capacitor (CF) is recommended across RF (= 10 kΩ) for gains of 10 or less.
Figure 26. Typical Inverting Gain Circuit AV = −1
Because of the unique structure of this amplifier, when used at low closed loop gains, the realizable BW will be
much less than the GBW product would suggest.
The LM6152/LM6154 brings a new level of ease of use to op amp system design.
The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage
range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is
particularly important when operating on low supply voltages.
The high gain-bandwidth with low supply current opens new battery powered applications where higher power
consumption previously reduced battery life to unacceptable levels.
The ability to drive large capacitive loads without oscillating functional removes this common problem.
To take advantage of these features, some ideas should be kept in mind.
The LM6152/LM6154, capacitive loads do not lead to oscillations, in all but the most extreme conditions, but they
will result in reduced bandwidth. They also cause increased settling time.
14
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Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage, causes
the slew rate to be very much a function of the input pulse amplitude. This results in a 10 to 1 increase in slew
rate when the differential input signal increases. Large fast pulses will raise the slew-rate to more than 30 V/µs.
Figure 27. Slew Rate vs. VDIFF
The speed-up action adds stability to the system when driving large capacitive loads.
A conventional op amp exhibits a fixed maximum slew-rate even though the differential input voltage rises due to
the lagging output voltage. In the LM6152/LM6154, increasing lag causes the differential input voltage to
increase but as it does, the increased slew-rate keeps the output following the input much better. This effectively
reduces phase lag. As a result, the LM6152/LM6154 can drive capacitive loads as large as 470 pF at gain of 2
and above, and not oscillate.
Capacitive loads decrease the phase margin of all op amps. This can lead to overshoot, ringing and oscillation.
This is caused by the output resistance of the amplifier and the load capacitance forming an R-C phase shift
network. The LM6152/6154 senses this phase shift and partly compensates for this effect.
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8 Device and Documentation Support
8.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
LM6152
LM6154
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
8.2 Trademarks
All trademarks are the property of their respective owners.
8.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM6152ACM
LM6152ACM/NOPB
LM6152ACMX/NOPB
LM6152BCM/NOPB
LM6152BCMX/NOPB
LM6154BCM
NRND
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
8
8
95
Non-RoHS
& Green
Call TI
Level-1-235C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-235C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM61
52ACM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
95
RoHS & Green
SN
SN
LM61
52ACM
Samples
Samples
Samples
Samples
8
2500 RoHS & Green
95 RoHS & Green
2500 RoHS & Green
LM61
52ACM
8
SN
LM61
52BCM
8
SN
LM61
52BCM
14
55
55
Non-RoHS
& Green
Call TI
LM6154BCM
LM6154BCM/NOPB
LM6154BCMX/NOPB
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
RoHS & Green
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
LM6154BCM
LM6154BCM
Samples
Samples
2500 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2022
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM6152ACMX/NOPB
LM6152BCMX/NOPB
LM6154BCMX/NOPB
SOIC
SOIC
SOIC
D
D
D
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
16.4
6.5
6.5
6.5
5.4
5.4
2.0
2.0
2.3
8.0
8.0
8.0
12.0
12.0
16.0
Q1
Q1
Q1
14
9.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM6152ACMX/NOPB
LM6152BCMX/NOPB
LM6154BCMX/NOPB
SOIC
SOIC
SOIC
D
D
D
8
8
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
14
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM6152ACM
LM6152ACM
D
D
D
D
D
D
D
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
8
8
95
95
95
95
55
55
55
495
495
495
495
495
495
495
8
8
8
8
8
8
8
4064
4064
4064
4064
4064
4064
4064
3.05
3.05
3.05
3.05
3.05
3.05
3.05
LM6152ACM/NOPB
LM6152BCM/NOPB
LM6154BCM
8
8
14
14
14
LM6154BCM
LM6154BCM/NOPB
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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Copyright © 2022, Texas Instruments Incorporated
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