LM5046 [TI]

LM5046 Phase-Shifted Full-Bridge PWM Controller with Integrated MOSFET Drivers; LM5046移相全桥PWM控制器集成MOSFET驱动器
LM5046
型号: LM5046
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LM5046 Phase-Shifted Full-Bridge PWM Controller with Integrated MOSFET Drivers
LM5046移相全桥PWM控制器集成MOSFET驱动器

驱动器 控制器
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LM5046  
www.ti.com  
SNVS703G FEBRUARY 2011REVISED MARCH 2013  
LM5046 Phase-Shifted Full-Bridge PWM Controller with Integrated MOSFET Drivers  
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1
FEATURES  
PACKAGES  
2
Highest Integration Controller for Small Form  
Factor, High Density Power Converters  
TSSOP-28  
WQFN-28 (5mm x 5mm)  
High Voltage Start-up Regulator  
DESCRIPTION  
Intelligent Sync Rectifier Start-up Allows  
Linear Turn-on into Pre-biased Loads  
The LM5046 PWM controller contains all of the  
features necessary to implement a Phase-Shifted  
Full-Bridge topology power converter using either  
current mode or voltage mode control. This device is  
intended to operate on the primary side of an isolated  
dc-dc converter with input voltage up to 100V. This  
highly integrated controller-driver provides dual 2A  
high and low side gate drivers for the four external  
bridge MOSFETs, plus control signals for the  
secondary side synchronous rectifier MOSFETs.  
External resistors program the dead-time to enable  
zero-volt switching of the primary FETs. Intelligent  
startup of the synchronous rectifiers allows monotonic  
turn-on of the power converter even with pre-bias  
load conditions. Additional features include cycle-by-  
cycle current limiting, hiccup mode restart,  
programmable soft-start, synchronous rectifier soft-  
Synchronous Rectifiers Disabled in UVLO  
mode and Hiccup Mode  
Two Independent, Programmable Dead-Time  
Adjustments to Enable Zero-Volt Switching.  
Four High Current 2A Bridge Gate Drivers  
Wide-Bandwidth Opto-coupler Interface  
Configurable for either Current Mode or  
Voltage Mode Control  
Dual-mode Over-Current Protection  
Resistor Programmed 2MHz Oscillator  
Programmable Line UVLO and OVP  
start and  
a
2
MHz capable oscillator with  
synchronization capability and thermal shutdown.  
Simplified Phase-Shifted Full-Bridge Power Converter  
Vin  
Vout  
Q3  
Q4  
Q1  
Q2  
T1  
T1  
VCC  
VCC  
HO1 BST1  
VIN  
LO1 SLOPE RAMP CS LO2 HS2 BST2 HO2  
HS1  
GATE  
DRIVE  
ISOLATION  
SR1  
UVLO  
OVP  
LM5046 PHASE-SHIFTED  
FULL-BRIDGE CONTROLLER  
SR2  
VCC  
WITH INTEGRATED GATE DRIVERS  
ISOLATED  
FEEDBACK  
COMP  
SSOFF  
RT  
RES  
SS  
RD1 RD2 REF PGND AGND  
SSSR  
ISOLATION  
BOUNDARY  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011–2013, Texas Instruments Incorporated  
LM5046  
SNVS703G FEBRUARY 2011REVISED MARCH 2013  
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Connection Diagram  
UVLO  
OVP  
VIN  
HS1  
HO1  
BST1  
SR1  
RAMP  
CS  
BST1  
SLOPE  
COMP  
SR1  
SLOPE  
COMP  
REF  
LO1  
REF  
RT  
5 mm x 5 mm  
WQFN 28  
LO1  
PGND  
PGND  
VCC  
AGND  
RD1  
VCC  
LO2  
TSSOP28  
RT  
AGND  
LO2  
SR2  
RD2  
SR2  
RD1  
RD2  
BST2  
HO2  
HS2  
RES  
SS  
SSSR  
SS OFF  
Figure 1. TSSOP28 Top View  
Figure 2. WQFN-28 Package Top View  
PIN DESCRIPTIONS  
TSSOP  
Pin  
WQFN  
Pin  
Name  
Description  
Line Under-Voltage Lockout  
Application Information  
1
25  
UVLO  
An external voltage divider from the power source sets the  
shutdown and standby comparator levels. When UVLO reaches the  
0.4V threshold the VCC and REF regulators are enabled. At the  
1.25V threshold, the SS pin is released and the controller enters the  
active mode. Hysteresis is set by an internal current sink that pulls  
20µA from the external resistor divider.  
2
26  
OVP/OTP Over Voltage Protection  
An external voltage divider from the input power supply sets the  
shutdown level during an over-voltage condition. Alternatively, an  
external NTC thermistor voltage divider can be used to set the  
shutdown temperature. The threshold is 1.25V. Hysteresis is set by  
an internal current that sources 20 µA of current into the external  
resistor divider.  
3
4
5
27  
28  
1
RAMP  
CS  
Input to PWM Comparator  
Current Sense Input  
Modulation ramp for the PWM comparator. This ramp can be a  
signal representative of the primary current (current mode) or  
proportional to the input voltage (feed-forward voltage mode). This  
pin is reset to GND at the end of every cycle.  
If CS exceeds 750mV the PWM output pulse will be terminated,  
entering cycle-by-cycle current limit. An internal switch holds CS low  
for 40nS after either output switches high to blank leading edge  
transients.  
SLOPE  
Slope Compensation Current  
A ramping current source from 0 to 100µA is provided for slope  
compensation in current mode control. This pin can be connected  
through an appropriate resistor to the CS pin to provide slope  
compensation. If slope compensation is not required, SLOPE must  
be tied to ground.  
6
2
COMP  
Input to the Pulse Width Modulator An external opto-coupler connected to the COMP pin sources  
current into an internal NPN current mirror. The PWM duty cycle is  
at maximum with zero input current, while 1mA reduces the duty  
cycle to zero. The current mirror improves the frequency response  
by reducing the AC voltage across the opto-coupler.  
2
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PIN DESCRIPTIONS (continued)  
TSSOP  
Pin  
WQFN  
Pin  
Name  
Description  
Application Information  
7
3
REF  
Output of a 5V reference  
Maximum output current is 15mA. Locally decouple with a 0.1µF  
capacitor.  
8
4
RT/SYNC Oscillator Frequency Control and  
Frequency Synchronization  
The resistance connected between RT and AGND sets the  
oscillator frequency. Synchronization is achieved by AC coupling a  
pulse to the RT/SYNC pin that raises the voltage at least 1.5V  
above the 2V nominal bias level.  
9
5
6
AGND  
RD1  
Analog Ground  
Connect directly to the Power Ground.  
10  
Passive to Active Delay  
The resistance connected between RD1 and AGND sets the delay  
from the falling edge of HO1/SR1 or LO1/SR2 and the rising edge  
of LO1 or HO1 respectively.  
11  
12  
7
8
RD2  
RES  
Active to Passive Delay  
Restart Timer  
The resistance connected between RD2 and AGND sets the delay  
from the falling edge of LO2 or HO2 and the rising edge of HO2 or  
LO2 respectively.  
Whenever the CS pin exceeds the 750mV cycle-by-cycle current  
limit threshold, 30µA current is sourced into the RES capacitor for  
the remainder of the PWM cycle. If the RES capacitor voltage  
reaches 1.0V, the SS capacitor is discharged to disable the HO1,  
HO2, LO1, LO2 and SR1, SR2 outputs. The SS pin is held low until  
the voltage on the RES capacitor has been ramped between 2V and  
4V eight times by 10µA charge and 5µA discharge currents. After  
the delay sequence, the SS capacitor is released to initiate a normal  
start-up sequence.  
13  
9
SS  
Soft-Start Input  
An internal 20µA current source charges the SS pin during start-up.  
The input to the PWM comparator gradually rises as the SS  
capacitor charges to steadily increase the PWM duty cycle. Pulling  
the SS pin to a voltage below 200mV stops PWM pulses at HO1,2  
and LO1,2 and turns off the synchronous rectifier FETs to a low  
state.  
14  
15  
10  
11  
SSSR  
Secondary Side Soft-Start  
Soft-Stop Disable  
An external capacitor and an internal 20µA current source set the  
soft-start ramp for the synchronous rectifiers. The SSSR capacitor  
charge-up is enabled after the first output pulse and SS>2V and  
Icomp <800µA  
SSOFF  
When SS OFF pin is connected to the AGND, the LM5046 soft-  
stops in the event of a VIN UVLO and Hiccup mode current limit  
condition. If the SSOFF pin is connected to REF pin, the controller  
hard-stops on any fault condition. Refer to Table 2 for more details.  
19  
21  
15  
17  
SR2  
VCC  
Synchronous Rectifier Driver  
Output of Start-Up Regulator  
Control output for synchronous rectifier gate. Capable of peak  
sourcing 100mA and sinking 400mA.  
The output voltage of the start-up regulator is initially regulated to  
9.5V. Once the secondary side soft-start (SSSR pin) reaches 1V,  
the VCC output is reduced to 7.7V. If an auxiliary winding raises the  
voltage on this pin above the regulation set-point, the internal start-  
up regulator will shutdown, thus reducing the IC power dissipation.  
22  
18  
PGND  
Power Ground  
Connect directly to Analog Ground  
23, 20  
19, 16 LO1, LO2 Low Side Output Driver  
Alternating output of the PWM gate driver. Capable of 1.5A peak  
source and 2A peak sink current.  
24  
20  
SR1  
Synchronous Rectifier Driver  
Gate Drive Bootstrap  
Control output for synchronous rectifier gate. Capable of peak  
sourcing 100mA and sinking 400mA.  
25, 18  
21, 14  
BST1,2  
Bootstrap capacitors connected between BST1,2 and SW1,2  
provide bias supply for the high side HO1,2 gate drivers. External  
diodes are required between VCC and BST1,2 to charge the  
bootstrap capacitors when SW1,2 are low.  
26, 17  
27, 16  
28  
22, 13  
23, 12  
24  
HO1,2  
HS1,2  
VIN  
High Side Output Driver  
Switch Node  
High side PWM outputs capable of driving the upper MOSFET of  
the bridge with 1.5A peak source and 2A peak sink current.  
Common connection of the high side FET source, low side FET  
drain and transformer primary winding.  
Input Power Source  
Input to the Start-up Regulator. Operating input range is 14V to  
100V. For power sources outside of this range, the LM5046 can be  
biased directly at VCC by an external regulator.  
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
Absolute Maximum Ratings  
VIN to GND  
-0.3V to 105V  
-5V to 105V  
-0.3V to 116V  
-0.3V to 16V  
-0.3V to BST1/BST2+0.3V  
-0.3V to VCC+0.3V  
-0.3V to 16V  
-0.3V to 7V  
(2)  
HS to GND  
BST1/BST2 to GND  
BST1/BST2 to HS1/HS2  
HO1/HO2 to HS1/HS2  
(3)  
(3)  
LO1/LO2/SR1/SR2  
VCC to GND  
REF,SSOFF,RT,OVP,UVLO to GND  
RAMP  
-0.3V to 7V  
COMP  
-0.3V  
COMP Input Current  
+10mA  
(3)  
All other inputs to GND  
-0.3 to REF+0.3V  
2 kV  
(4)  
ESD Rating HBM  
Storage Temperature Range  
Junction Temperature  
-55°C to 150°C  
150°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see Electrical Characteristics.  
(2) The negative HS voltage must never be more negative than VCC-16V. For example, if VCC=12V, the negative transients at HS must  
not exceed -4V.  
(3) These pins are output pins and as such should not be connected to an external voltage source. The voltage range listed is the limits the  
internal circuitry is designed to reliably tolerate in the application circuit.  
(4) The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.  
WHITE SPACE  
(1)  
Table 1. Operating Ratings  
VIN Voltage  
14V to 100V  
10V to 14V  
External Voltage Applied to VCC  
Junction Temperature  
SLOPE  
-40°C to +125°C  
-0.3V to 2V  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is intended to be functional. For specifications and test conditions, see Electrical Characteristics.  
4
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SNVS703G FEBRUARY 2011REVISED MARCH 2013  
Electrical Characteristics  
Limits in standard typeface are for TJ = 25°C only; limits in boldface type apply the junction temperature range of -40°C to  
+125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, RT = 25k, RD1=RD2=20k. No load on  
HO1, HO2, LO1, LO2, SR1, SR2, COMP=0V, UVLO=2.5V, OVP=0V, SSOFF=0V.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Startup Regulator (VCC pin)  
VCC1  
VCC2  
VCC voltage  
ICC= 10mA (SSSR<1V)  
ICC= 10mA (SSSR>1V)  
VCC= 6V  
9.3  
7.5  
60  
9.6  
7.8  
80  
9.9  
8.1  
V
V
VCC voltage  
ICC(Lim)  
ICC(ext)  
VCC current limit  
VCC supply current  
mA  
mA  
Supply current into VCC from an externally  
applied source. VCC = 10V  
4.6  
VCC load regulation  
ICC from 0 to 50 mA  
Positive going VCC  
Negative going VCC  
35  
mV  
V
VCC(UV)  
VCC under-voltage threshold  
VCC under-voltage threshold  
VIN operating current  
VCC1–0.2 VCC1–0.1  
5.9  
6.3  
4
6.7  
V
IIN  
mA  
µA  
µA  
µA  
VIN shutdown current  
VIN=20V, VUVLO=0V  
VVIN=100V, VUVLO=0V  
VCC=10V  
300  
350  
160  
520  
550  
VIN start-up regulator leakage  
Voltage Reference Regulator (REF pin)  
VREF  
REF Voltage  
IREF = 0mA  
4.85  
5
25  
5.15  
50  
V
mV  
mA  
V
REF voltage regulation  
REF current limit  
VREF under-voltage threshold  
Hysteresis  
IREF = 0 to 10mA  
VREF = 4.5V  
IREF(Lim)  
VREFUV  
15  
20  
Positive going VREF  
4.3  
4.5  
0.25  
4.7  
V
Under-Voltage Lock Out and shutdown (UVLO pin)  
VUVLO  
IUVLO  
Under-voltage threshold  
Hysteresis current  
1.18  
16  
1.25  
20  
1.32  
24  
V
UVLO pin sinking current when  
VUVLO<1.25V  
µA  
Under-voltage standby enable  
threshold  
UVLO voltage rising  
0.32  
0.4  
0.48  
V
Hysteresis  
0.05  
1.25  
20  
V
V
VOVP  
OVP shutdown threshold  
OVP hysteresis current  
OVP rising  
1.18  
16  
1.32  
24  
OVP sources current when OVP>1.25V  
µA  
Soft-Start (SS Pin)  
ISS  
SS charge current  
VSS = 0V  
16  
20  
24  
µA  
V
SS threshold for SSSR charge  
current enable  
ICOMP<800µA  
1.93  
2.0  
2.20  
SS output low voltage  
Sinking 100µA  
40  
200  
20  
mV  
mV  
µA  
µA  
µA  
mV  
V
SS threshold to disable switching  
SSSR charge current  
ISSSR  
VSS>2V, ICOMP<800µA  
VUVLO<1.25V  
16  
54  
24  
75  
ISSSR-DIS1  
ISSSR-DIS2  
SSSR discharge current 1  
SSSR discharge current 2  
SSSR output low voltage  
SSSR threshold to enable SR1/SR2  
65  
VRES>1V  
109  
125  
50  
147  
Sinking 100µA  
1.2  
Current Sense Input (CS Pin)  
VCS Current limit threshold  
0.710  
0.750  
65  
0.785  
45  
V
ns  
ns  
CS delay to output  
CS leading edge blanking  
CS sink impedance (clocked)  
50  
RCS  
Internal FET sink impedance  
18  
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Electrical Characteristics (continued)  
Limits in standard typeface are for TJ = 25°C only; limits in boldface type apply the junction temperature range of -40°C to  
+125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, RT = 25k, RD1=RD2=20k. No load on  
HO1, HO2, LO1, LO2, SR1, SR2, COMP=0V, UVLO=2.5V, OVP=0V, SSOFF=0V.  
Symbol  
Soft-Stop Disable (SS OFF Pin)  
VIH(min) SSOFF Input Threshold  
SSOFF pull down resistance  
Current Limit Restart (RES Pin)  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
2.8  
V
200  
kΩ  
RRES  
VRES  
RES pull-down resistance  
Termination of hiccup timer  
37  
1
V
RES hiccup threshold  
RES upper counter threshold  
RES lower counter threshold  
Charge current source 1  
Charge current source 2  
Discharge current source 1  
Discharge current source 2  
4
V
2
V
IRES-SRC1  
IRES-SRC2  
IRES-DIS2  
IRES-DIS2  
VRES<1V,VCS>750mV  
1V<VRES<4V  
30  
10  
5
µA  
µA  
µA  
µA  
VCS<750mV  
2V<VRES<4V  
5
Ratio of time in hiccup mode to time VRES>1V, Hiccup counter  
in current limit  
147  
Voltage Feed-Forward (RAMP Pin)  
RAMP sink impedance (Clocked)  
Oscillator (RT Pin)  
FSW1 Frequency (LO1, half oscillator  
5.5  
20  
RT = 25 kΩ  
RT = 10 kΩ  
185  
420  
200  
480  
215  
540  
kHz  
kHz  
frequency)  
FSW2  
Frequency (LO1, half oscillator  
frequency)  
DC level  
2.0  
3
V
V
RT sync threshold  
2.8  
39  
3.3  
89  
ZVS Timing Control (RD1 & RD2 Pins)  
TPA HO1/SR1 turn-off to LO1 turn-on  
RD1=20 kΩ  
65  
ns  
LO1/SR2 turn-off to HO1 turn-on  
RD1=100 kΩ  
RD2=20 kΩ  
230  
27  
300  
55  
391  
78  
ns  
ns  
TAP  
LO2 turn-off to HO2 turn-on  
HO2 turn-off to LO2 turn-on  
RD2=100 kΩ  
214  
300  
378  
ns  
Comp Pin  
VPWM-OS  
VSS-OS  
COMP current to RAMP offset  
SS to RAMP offset  
VRAMP=0V  
680  
800  
1.0  
940  
µA  
V
VRAMP=0V  
0.78  
1.22  
COMP current to RAMP gain  
SS to RAMP gain  
ΔRAMP/ΔICOMP  
ΔSS/ΔRAMP  
VSS > 2V  
2400  
0.5  
COMP current for SSSR charge  
current enable  
690  
800  
915  
0
µA  
COMP to output delay  
Minimum duty cycle  
120  
100  
ns  
%
ICOMP = 1mA  
Slope Compensation (SLOPE Pin)  
ISLOPE  
Slope compensation current ramp  
Peak of RAMP current  
VBST-VHS rising  
µA  
BOOST (BST Pin)  
VBst uv  
BST under-voltage threshold  
3.8  
4.7  
0.5  
5.6  
V
V
Hysteresis  
6
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Electrical Characteristics (continued)  
Limits in standard typeface are for TJ = 25°C only; limits in boldface type apply the junction temperature range of -40°C to  
+125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, RT = 25k, RD1=RD2=20k. No load on  
HO1, HO2, LO1, LO2, SR1, SR2, COMP=0V, UVLO=2.5V, OVP=0V, SSOFF=0V.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
HO1, HO2, LO1, LO2 Gate Drivers  
VOL  
VOH  
Low-state output voltage  
High-state output voltage  
IHO/LO = 100mA  
0.16  
0.27  
0.32  
V
V
IHO/LO = 100mA  
VOHL = VCC-VLO  
VOHH = VBST-VHO  
0.495  
Rise Time  
C-load = 1000pF  
C-load = 1000pF  
VHO/LO = 0V  
16  
11  
1.5  
2
ns  
ns  
A
Fall Time  
IOHL  
IOLL  
Peak Source Current  
Peak Sink Current  
-
-
VHO/LO = VCC  
A
SR1, SR2 Gate Drivers  
VOL  
VOH  
Low-state output voltage  
ISR1/SR2 = 10mA  
0.05  
0.17  
0.10  
0.28  
V
V
High-state output voltage  
ISR1/SR2 = 10mA,  
VOH = VREF-VSR  
Rise Time  
C-load = 1000pF  
C-load = 1000pF  
VSR = 0V  
60  
20  
ns  
ns  
A
Fall Time  
IOHL  
Peak Source Current  
Peak Sink Current  
0.1  
0.4  
-
-
IOLL  
VSR = VREF  
A
Thermal  
TSD  
Thermal Shutdown Temp  
160  
25  
40  
4
°C  
°C  
Thermal Shutdown Hysteresis  
(1)  
RJA  
RJC  
Junction to Ambient  
TSSOP - 28/WQFN-28  
°C/W  
°C/W  
Junction to Case  
(1) 4 layer standard thermal test board. Cu thickness of layers (2oz, 1oz, 1oz, 2oz).  
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Typical Performance Characteristics  
Application Board Efficiency  
VCC vs ICC  
100  
90  
80  
70  
60  
50  
36V  
48V  
72V  
V
= 3.3V  
OUT  
5
10  
15  
20  
25  
30  
LOAD CURRENT (A)  
Figure 3.  
Figure 4.  
IIN vs. VIN  
VVCC and VREF vs. VVIN  
6
5
4
3
2
1
0
V
V
=3V  
UVLO  
=1V  
=0V  
UVLO  
V
UVLO  
0
20  
40  
60  
(V)  
80  
100  
V
IN  
Figure 5.  
Figure 6.  
VREF vs. IREF  
Oscillator Frequency vs. RT  
Figure 7.  
Figure 8.  
8
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Typical Performance Characteristics (continued)  
Dead-Time TPA, TAP vs. Temperature  
Dead-Time TPA, TAP vs. RD1, RD2  
Figure 9.  
Figure 10.  
CS Threshold vs. Temperature  
Figure 11.  
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BLOCK DIAGRAM  
VOLTAGE  
REGULATOR  
VIN  
VCC  
REF  
1.25V  
+
OVP  
VCC  
UVLO  
5V  
-
20 éA  
5V  
HYSTERESIS  
REFERENCE  
0.4V  
+
-
SHUTDOWN  
BST1  
HO1  
HS1  
UVLO  
LOGIC  
THERMAL  
LIMIT  
(160°C)  
+
-
1.25V  
STANDBY  
VCC  
UVLO  
HYSTERESIS  
LO1  
20 éA  
BST2  
HO2  
HS2  
HO1  
CLK  
DELAY  
Q
T
RT  
OSCILLATOR  
TIMERS  
AND  
Q
VCC  
REF  
REF  
DRIVER  
LOGIC  
LO2  
LO1  
100 éA  
0 éA  
S
R
Q
SR1  
HO2  
LO2  
SLOPE  
SLOPECOMP  
RAMP GENERATOR  
SR2  
RD1  
RD2  
RAMP  
SSOFF  
20 éA  
5V  
SSSR  
DRIVER  
LOGIC  
5k  
+
COMP  
1V  
R
PWM  
-
SS  
20 éA  
SS  
R
1:1  
SS  
SS  
Buffer  
10 éA  
0.75V  
-
CS  
CS  
+
HICCUP  
30 éA  
MODE  
TIMER and  
LOGIC  
CLK + LEB  
RES  
PGND  
5 éA  
+
-
AGND  
1.0V  
Figure 12.  
10  
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FUNCTIONAL DESCRIPTION  
The LM5046 PWM controller contains all of the features necessary to implement a Phase-Shifted Full-Bridge  
(PSFB) topology power converter using either current mode or voltage mode control. This device is intended to  
operate on the primary side of an isolated dc-dc converter with input voltage up to 100V. This highly integrated  
controller-driver provides dual 2A high and low side gate drivers for the four external bridge MOSFETs plus  
control signals for secondary side synchronous rectifiers. External resistors program the dead-time to enable  
Zero-Volt Switching (ZVS) of the primary FETs. Please refer to the APPLICATION INFORMATION section for  
details on the operation of the PSFB topology. Intelligent startup of synchronous rectifier allows turn-on of the  
power converter into the pre-bias loads. Cycle-by-cycle current limit protects the power components from load  
transients while hiccup mode protection limits average power dissipation during extended overload conditions.  
Additional features include programmable soft-start, soft-start of the synchronous rectifiers, and a 2 MHz capable  
oscillator with synchronization capability and thermal shutdown.  
High-Voltage Start-Up Regulator  
The LM5046 contains an internal high voltage start-up regulator that allows the input pin (VIN) to be connected  
directly to the supply voltage over a wide range from 14V to 100V. The input can withstand transients up to  
105V. When the UVLO pin potential is greater than 0.4V, the VCC regulator is enabled to charge an external  
capacitor connected to the VCC pin. The VCC regulator provides power to the voltage reference (REF) and the  
gate drivers (HO1/HO2 and LO1/LO2). When the voltage on the VCC pin exceeds its Under Voltage (UV)  
threshold, the internal voltage reference (REF) reaches its regulation set point of 5V and the UVLO voltage is  
greater than 1.25V, the soft-start capacitor is released and normal operation begins. The regulator output at VCC  
is internally current limited. The value of the VCC capacitor depends on the total system design, and its start-up  
characteristics. The recommended range of values for the VCC capacitor is 0.47μF to 10µF.  
The internal power dissipation of the LM5046 can be reduced by powering VCC from an external supply. The  
output voltage of the VCC regulator is initially regulated to 9.5V. After the synchronous rectifiers are engaged  
(which is approximately when the output voltage in within regulation), the VCC voltage is reduced to 7.7V. In  
typical applications, an auxiliary transformer winding is connected through a diode to the VCC pin. This winding  
must raise the VCC voltage above 8V to shut off the internal start-up regulator. Powering VCC from an auxiliary  
winding improves efficiency while reducing the controller’s power dissipation. The VCC UV circuit will still function  
in this mode, requiring that VCC never falls below its UV threshold during the start-up sequence. The VCC  
regulator series pass transistor includes a diode between VCC and VIN that should not be forward biased in  
normal operation. Therefore, the auxiliary VCC voltage should never exceed the VIN voltage.  
An external DC bias voltage can be used instead of the internal regulator by connecting the external bias voltage  
to both the VCC and the VIN pins. This implementation is shown in the APPLICATION INFORMATION section.  
The external bias must be greater than 10V and less than the VCC maximum voltage rating of 14V.  
Line Under-Voltage Detector  
The LM5046 contains a dual level Under-Voltage Lockout (UVLO) circuit. When the UVLO pin voltage is below  
0.4V, the controller is in a low current shutdown mode. When the UVLO pin voltage is greater than 0.4V but less  
than 1.25V, the controller is in standby mode. In standby mode the VCC and REF bias regulators are active  
while the controller outputs are disabled. When the VCC and REF outputs exceed their respective under-voltage  
thresholds and the UVLO pin voltage is greater than 1.25V, the soft-start capacitor is released and the normal  
operation begins. An external set-point voltage divider from VIN to GND can be used to set the minimum  
operating voltage of the converter. The divider must be designed such that the voltage at the UVLO pin will be  
greater than 1.25V when VIN enters the desired operating range. UVLO hysteresis is accomplished with an  
internal 20μA current sink that is switched on or off into the impedance of the set-point divider. When the UVLO  
threshold is exceeded, the current sink is deactivated to quickly raise the voltage at the UVLO pin. When the  
UVLO pin voltage falls below the 1.25V threshold, the current sink is enabled causing the voltage at the UVLO  
pin to quickly fall. The hysteresis of the 0.4V shutdown comparator is internally fixed at 50mV.  
The UVLO pin can also be used to implement various remote enable / disable functions. Turning off the  
converter by forcing the UVLO pin to standby condition (0.4V < UVLO < 1.25V) provides a controlled soft-stop.  
Refer to the Soft-Stop section for more details.  
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Over Voltage Protection  
An external voltage divider can be used to set either an over voltage or an over temperature protection. During  
an OVP condition, the SS and SSSR capacitors are discharged and all the outputs are disabled. The divider  
must be designed such that the voltage at the OVP pin is greater than 1.25V when over voltage/temperature  
condition exists. Hysteresis is accomplished with an internal 20μA current source. When the OVP pin voltage  
exceeds 1.25V, the 20μA current source is activated to quickly raise the voltage at the OVP pin. When the OVP  
pin voltage falls below the 1.25V threshold, the current source is deactivated causing the voltage at the OVP to  
quickly fall. Refer to the APPLICATION INFORMATION section for more details.  
Reference  
The REF pin is the output of a 5V linear regulator that can be used to bias an opto-coupler transistor and  
external housekeeping circuits. The regulator output is internally current limited to 15mA. The REF pin needs to  
be locally decoupled with a ceramic capacitor, the recommended range of values are from 0.1μF to 10μF  
Oscillator, Sync Input  
The LM5046 oscillator frequency is set by a resistor connected between the RT pin and AGND. The RT resistor  
should be located very close to the device. To set a desired oscillator frequency (FOSC), the necessary value of  
RT resistor can be calculated from the following equation:  
1
RT  
=
FOSC x 1 x 10-10  
(1)  
For example, if the desired oscillator frequency is 400 kHz i.e. each phase (LO1 or LO2) at 200 kHz, the value of  
RT will be 25k. If the LM5046 is to be synchronized to an external clock, that signal must be coupled into the  
RT pin through a 100pF capacitor. The RT pin voltage is nominally regulated at 2.0V and the external pulse  
amplitude should lift the pin to between 3.5V and 5.0V on the low-to-high transition. The synchronization pulse  
width should be between 15 and 200ns. The RT resistor is always required, whether the oscillator is free running  
or externally synchronized and the SYNC frequency must be equal to, or greater than the frequency set by the  
RT resistor. When syncing to an external clock, it is recommended to add slope compensation by connecting an  
appropriate resistor from the VCC pin to the CS pin. Also disable the SLOPE pin by grounding it.  
Cycle-by-Cycle Current Limit  
The CS pin is to be driven by a signal representative of the transformer’s primary current. If the voltage on the  
CS pin exceeds 0.75V, the current sense comparator immediately terminates the PWM cycle. A small RC filter  
connected to the CS pin and located near the controller is recommended to suppress noise. An internal 18Ω  
MOSFET discharges the external current sense filter capacitor at the conclusion of every cycle. The discharge  
MOSFET remains on for an additional 40ns after the start of a new PWM cycle to blank leading edge spikes. The  
current sense comparator is very fast and may respond to short duration noise pulses. Layout is critical for the  
current sense filter and the sense resistor. The capacitor associated with CS filter must be placed very close to  
the device and connected directly to the CS and AGND pins. If a current sense transformer is used, both the  
leads of the transformer secondary should be routed to the filter network, which should be located close to the  
IC. When designing with a current sense resistor, all of the noise sensitive low power ground connections should  
be connected together near the AGND pin, and a single connection should be made to the power ground (sense  
resistor ground point).  
Hiccup Mode  
The LM5046 provides a current limit restart timer to disable the controller outputs and force a delayed restart (i.e.  
Hiccup mode) if a current limit condition is repeatedly sensed. The number of cycle-by-cycle current limit events  
required to trigger the restart is programmed by the external capacitor at the RES pin. During each PWM cycle,  
the LM5046 either sources or sinks current from the RES capacitor. If current limit is detected, the 5μA current  
sink is disabled and a 30μA current source is enabled. If the RES voltage reaches the 1.0V threshold, the  
following restart sequence occurs, as shown in Figure 13:  
The SS and SSSR capacitors are fully discharged  
The 30μA current source is turned-off and the 10μA current source is turned-on.  
Once the voltage at the RES pin reaches 4.0V the 10μA current source is turned-off and a 5μA current sink is  
turned-on, ramping the voltage on the RES capacitor down to 2.0V.  
Once RES capacitor reaches 2.0V, threshold, the 10μA current source is turned-on again. The RES capacitor  
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voltage is ramped between 4.0V and 2.0V eight times.  
When the counter reaches eight, the RES pin voltage is pulled low and the soft-start capacitor is released to  
begin a soft-start sequence. The SS capacitor voltage slowly increases. When the SS voltage reaches 1.0V,  
the PWM comparator will produce the first narrow pulse.  
If the overload condition persists after restart, cycle-by-cycle current limiting will begin to increase the voltage  
on the RES capacitor again, repeating the hiccup mode sequence.  
If the overload condition no longer exists after restart, the RES pin will be held at ground by the 5μA current  
sink and the normal operation resumes.  
The hiccup mode function can be completely disabled by connecting the RES pin to the AGND pin. In this  
configuration the cycle-by-cycle protection will limit the maximum output current indefinitely, no hiccup restart  
sequences will occur.  
4V  
2V  
1V  
Count to Eight  
Restart delay  
Soft-Start  
1V  
Hiccup Mode off-time  
Figure 13. Hiccup Mode Delay and Soft-Start Timing Diagram  
PWM Comparator  
The LM5046 pulse width modulator (PWM) comparator is a three input device, it compares the signal at the  
RAMP pin to the loop error signal or the soft-start, whichever is lower, to control the duty cycle. This comparator  
is optimized for speed in order to achieve minimum controllable duty cycles. The loop error signal is received  
from the external feedback and isolation circuit in the form of a control current into the COMP pin. The COMP pin  
current is internally mirrored by a matching pair of NPN transistors which sink current through a 5kresistor  
connected to the 5V reference. The resulting control voltage passes through a 1V offset, followed by a 2:1  
resistor divider before being applied to the PWM comparator.  
An opto-coupler detector can be connected between the REF pin and the COMP pin. Because the COMP pin is  
controlled by a current input, the potential difference across the opto-coupler detector is nearly constant. The  
bandwidth limiting phase delay which is normally introduced by the significant capacitance of the opto-coupler is  
thereby greatly reduced. Higher loop bandwidths can be realized since the bandwidth limiting pole associated  
with the opto-coupler is now at a much higher frequency. The PWM comparator polarity is configured such that  
with no current flowing into the COMP pin, the controller produces maximum duty cycle.  
RAMP Pin  
The voltage at the RAMP pin provides the modulation ramp for the PWM comparator. The PWM comparator  
compares the modulation ramp signal at the RAMP pin to the loop error signal to control the duty cycle. The  
modulation ramp signal can be implemented either as a ramp proportional to the input voltage, known as feed-  
forward voltage mode control, or as a ramp proportional to the primary current, known as current mode control.  
The RAMP pin is reset by an internal MOSFET with an RDS(ON) of 5.5at the conclusion of each PWM cycle.  
The ability to configure the RAMP pin for either voltage mode or current mode allows the controller to be  
implemented for the optimum control method depending upon the design constraints. Refer to the APPLICATION  
INFORMATION section for more details on configuring the RAMP pin for feed-forward voltage mode control and  
peak current mode control.  
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Slope Pin  
For duty cycles greater than 50% (25% for each phase), peak current mode control is subject to sub-harmonic  
oscillation. Sub-harmonic oscillation is normally characterized by observing alternating wide and narrow duty  
cycles. This can be eliminated by adding an artificial ramp, known as slope compensation, to the modulating  
signal at the RAMP pin. The SLOPE pin provides a current source ramping from 0 to 100μA, at the frequency set  
by the RT resistor, for slope compensation. The ramping current source at the SLOPE pin can be utilized in a  
couple of different ways to add slope compensation to the RAMP signal:  
1) As shown in Figure 14(a), the SLOPE and RAMP pins can be connected together through an appropriate  
resistor to the CS pin. This configuration will inject current sense signal plus slope compensation to the RAMP  
pin but CS pin will not see any slope compensation. Therefore, in this scheme slope compensation will not affect  
the current limit.  
2) In a second configuration, as shown in Figure 14(b), the SLOPE, RAMP and CS pins can be tied together. In  
this configuration the ramping current source from the SLOPE pin will flow through the filter resistor and filter  
capacitor, therefore both the CS pin and the RAMP pin will see the current sense signal plus the slope  
compensation ramp. In this scheme, the current limit is compensated by the slope compensation and the current  
limit onset point will vary.  
If slope compensation is not required, for example in feed-forward voltage mode control, the SLOPE pin must be  
connected to the AGND pin. When the RT pin is synched to an external clock, it is recommended to disable the  
SLOPE pin and add slope compensation externally by connecting an appropriate resistor from the VCC pin to the  
CS pin. Please refer to the APPLICATION INFORMATION section for more details.  
LM5046  
LM5046  
100 mA  
100 mA  
SLOPE  
0
SLOPE  
0
RAMP  
RAMP  
CLK  
Current  
Sense  
CLK  
Current  
Sense  
R
SLOPE  
R
R
FILTER  
FILTER  
CS  
CS  
CLK + LEB  
CLK + LEB  
R
CS  
C
FILTER  
R
CS  
C
FILTER  
(a)  
(b)  
(a) Slope Compensation Configured for PWM Only (No Current Limit Slope)  
(b) Slope Compensation Configured for PWM and Current Limit  
Figure 14. Slope Compensation Configuration  
Soft-Start  
The soft-start circuit allows the power converter to gradually reach a steady state operating point, thereby  
reducing the start-up stresses and current surges. When bias is supplied to the LM5046, the SS capacitor is  
discharged by an internal MOSFET. When the UVLO, VCC and REF pins reach their operating thresholds, the  
SS capacitor is released and is charged with a 20µA current source. Once the SS pin voltage crosses the 1V  
offset, SS controls the duty cycle. The PWM comparator is a three input device; it compares the RAMP signal  
against the lower of the signals between the soft-start and the loop error signal. In a typical isolated application,  
as the secondary bias is established, the error amplifier on the secondary side soft-starts and establishes closed-  
loop control, steering the control away from the SS pin.  
One method to shutdown the regulator is to ground the SS pin. This forces the internal PWM control signal to  
ground, reducing the output duty cycle quickly to zero. Releasing the SS pin begins a soft-start cycle and normal  
operation resumes. A second shutdown method is presented in the UVLO section.  
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Gate Driver Outputs  
The LM5046 provides four gate drivers: two floating high side gate drivers HO1 and HO2 and two ground  
referenced low side gate drivers LO1 and LO2. Each internal driver is capable of sourcing 1.5A peak and sinking  
2A peak. The low-side gate drivers are powered directly by the VCC regulator. The HO1 and HO2 gate drivers  
are powered from a bootstrap capacitor connected between BST1/BST2 and HS1/HS2 respectively. An external  
diode connected between VCC (anode pin) and BST (cathode pin) provides the high side gate driver power by  
charging the bootstrap capacitor from VCC when the corresponding switch node (HS1/HS2 pin) is low. When the  
high side MOSFET is turned on, BST1 rises to a peak voltage equal to VCC + VHS1 where VHS1 is the switch  
node voltage.  
The BST and VCC capacitors should be placed close to the pins of the LM5046 to minimize voltage transients  
due to parasitic inductances since the peak current sourced to the MOSFET gates can exceed 1.5A. The  
recommended value of the BST capacitor is 0.1μF or greater. A low ESR / ESL capacitor, such as a surface  
mount ceramic, should be used to prevent voltage droop during the HO transitions.  
Figure 15 illustrates the sequence of the LM5046 gate-drive outputs. Initially, the diagonal HO1 and LO2 are  
turned-on together during the power transfer cycle, followed by the freewheel cycle, where HO1 and HO2 are  
kept on. In the subsequent phase, the diagonal HO2 and LO1 are turned-on together during the power transfer  
cycle, followed by a freewheel cycle, where LO1 and LO2 are kept on. The power transfer mode is often called  
the active mode and the freewheel mode is often called as the passive mode. The dead-time between the  
passive mode and the active mode, TPA, is set by the RD1 resistor and the dead-time between the active mode  
and the passive mode, TAP, is set by the RD2 resistor. Refer to the APPLICATION INFORMATION section for  
more details on the operation of the phase-shifted full-bridge topology.  
If the COMP pin is open circuit, the outputs will operate at maximum duty cycle. The maximum duty cycle for  
each phase is limited by the dead-time set by the RD1 resistor. If the RD1 resistor is set to zero then the  
maximum duty cycle is slightly less than 50% due to the internally fixed dead-time. The internally fixed dead-time  
is 30ns which does not vary with the operating frequency. The maximum duty cycle for each output can be  
calculated from the following equation:  
1
FOSC  
- (T  
)
(
)
PA  
DMAX  
=
2
FOSC  
(
)
(2)  
Where, TPA is the time set by the RD1 resistor and FOSC is the frequency of the oscillator. For example, if the  
oscillator frequency is set at 400 kHz and the TPA time set by the RD1 resistor is 60ns, the resulting DMAX will be  
equal to 0.488.  
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Figure 15. Timing Diagram Illustrating the Sequence of Gate-Driver Outputs in the PSFB Topology  
Synchronous Rectifier Control Outputs (SR1 & SR2)  
Synchronous rectification (SR) of the transformer secondary provides higher efficiency, especially for low output  
voltage converters, compared to the diode rectification. The reduction of rectifier forward voltage drop (0.5V -  
1.5V) to 10mV - 200mV VDS voltage for a MOSFET significantly reduces rectification losses. In a typical  
application, the transformer secondary winding is center tapped, with the output power inductor in series with the  
center tap. The SR MOSFETs provide the ground path for the energized secondary winding and the inductor  
current. From Figure 16 it can be seen that when the HO1/LO2 diagonal is turned ON, power transfer is enabled  
from the primary. During this period, the SR1 MOSFET is enabled and the SR2 MOSFET is turned-off. The  
secondary winding connected to the SR2 MOSFET drain is twice the voltage of the center tap at this time. At the  
conclusion of the HO1/LO2 pulse, the inductor current continues to flow through the SR2 MOSFET body diode.  
Since the body diode causes more loss than the SR MOSFET, efficiency can be improved by minimizing the  
TSRON period. In the LM5046, the time TSRON is internally fixed to be 30ns. The 30ns internally fixed dead-time,  
along with inherent system delays due to galvanic isolation, plus the gate drive ICs, will provide sufficient margin  
to prevent the shoot-through current.  
During the freewheeling period, the inductor current flows in both the SR1 and SR2 MOSFETs, which effectively  
shorts the transformer secondary. The SR MOSFETs are disabled at the rising edge of the CLK, which also  
disables HO1 or LO1. As shown in Figure 16, SR1 is disabled at the same instant as HO1 is disabled, and SR2  
is disabled at the same instant as LO1 is disabled. The dead-times, TSROFF and TPA achieve two different things  
but are set by single resistor, RD1. Therefore, RD1 value should be selected such that the SR1/SR2 turns-off  
before the next power transfer cycle is initiated by TPA  
.
The SR drivers are powered by the REF regulator and each SR output is capable of sourcing 0.1A and sinking  
0.4A peak. The amplitude of the SR drivers is limited to 5V. The 5V SR signals enable the LM5046 to transfer  
SR control across the isolation barrier either through a solid-state isolator or a pulse transformer. The actual gate  
sourcing and sinking currents for the synchronous MOSFETs are provided by the secondary-side bias and gate  
drivers.  
TPA and TAP can be programmed by connecting a resistor between RD1 and RD2 pins and AGND. It should be  
noted that while RD1 effects the maximum duty cycle, RD2 does not. The RD1 and RD2 resistors should be  
located very close to the device. The formula for RD1 and RD2 resistors are given below:  
16  
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TPA, TAP  
3 pF  
; For 20k < (1,2) < 100k  
RD(1,2) =  
(3)  
If the desired dead-time for TPA is 60ns, then the RD1 will be 20 k.  
Figure 16. Synchronous Rectifier Timing Diagram  
Soft-Start of the Synchronous Rectifiers  
In addition to the basic soft-start already described, the LM5046 contains a second soft-start function that  
gradually turns on the synchronous rectifiers to their steady-state duty cycle. This function keeps the  
synchronous rectifiers off during the basic soft-start allowing a linear start-up of the output voltage even into pre-  
biased loads. Then the SR output duty cycle is gradually increased to prevent output voltage disturbances due to  
the difference in the voltage drop between the body diode and the channel resistance of the synchronous  
MOSFETs. Initially, when bias is supplied to the LM5046, the SSSR capacitor is discharged by an internal  
MOSFET. When the SS capacitor reaches a 2V threshold and once it is established that COMP is in control of  
the duty cycle i.e. ICOMP < 800µA, the SSSR discharge is released and SSSR capacitor begins charging with a  
20µA current source. Once the SSSR cap crosses the internal 1V threshold, the LM5046 begins the soft-start of  
the synchronous FETs. The SR soft-start follows a leading edge modulation technique, that is, the leading edge  
of the SR pulse is soft-started as opposed trailing edge modulation of the primary FETs. As shown in  
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Figure 17(a), SR1 and SR2 are turned-on simultaneously with a narrow pulse-width during the freewheeling  
cycle. At the end of the freewheel cycle i.e. at the rising edge of the internal CLK, the SR FET in-phase with the  
next power transfer cycle is kept on while the SR FET out of phase with it is turned-off. The in-phase SR FET is  
kept on throughout the power transfer cycle and at the end of it, both the primary FETs and the in-phase SR  
FETs are turned-off together. The synchronous rectifier outputs can be disabled by grounding the SSSR pin.  
Figure 17. (a) Waveforms during Soft-Start (b) Waveforms after Soft-Start  
Pre-Bias Startup  
A common requirement for power converters is to have a monotonic output voltage start-up into a pre-biased  
load i.e. a pre-charged output capacitor. In a pre-biased load condition, if the synchronous rectifiers are engaged  
prematurely they will sink current from the pre-charged output capacitors resulting in an undesired output voltage  
dip. This condition is undesirable and could potentially damage the power converter. The LM5046 utilizes unique  
control circuitry to ensure intelligent turn-on of the synchronous rectifiers such that the output has a monotonic  
startup. Initially, the SSSR capacitor is held at ground to disable the synchronous MOSFETs allowing the body  
diode to conduct. The synchronous rectifier soft-start is initiated once it is established the duty cycle is controlled  
by the COMP instead of the soft-start capacitor i.e. ICOMP < 800µA and the voltage at the SS pin>2V. The SSSR  
capacitor is then released and is charged by a 20µA current source. Further, as shown in Figure 18, a 1V offset  
on the SSSR pin is used to provide additional delay. This delay ensures the output voltage is in regulation  
avoiding any reverse current when the synchronous MOSFETs are engaged.  
Soft-Stop  
As shown in Figure 19, if the UVLO pin voltage falls below the 1.25V standby threshold, but above the 0.4V  
shutdown threshold, the SSSR capacitor is soft-stopped with a 60µA current source (3 times the charging  
current). Once the SSSR pin reaches the 1.0V threshold, both the SS and SSSR pins are immediately  
discharged to GND. Soft-stopping the power converter gradually winds down the energy in the output capacitors  
and results in a monotonic decay of the output voltage. During the hiccup mode, the same sequence is executed  
except that the SSSR is discharged with a 120µA current source (6 times the charging current). In case of an  
OVP, VCC UV, thermal limit or a VREF UV condition, the power converter hard-stops, whereby all of the control  
outputs are driven to a low state immediately.  
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2.0V  
SS  
1.0V  
Primary  
Secondary  
Bias  
COMP  
1.0V  
SSSR  
SR1, SR2  
VOUT  
Prebiased Load  
Figure 18. Pre-Bias Voltage Startup Waveforms  
1.25V  
1.25V  
VIN UVLO  
0.45V  
SS  
SSSR  
1.0V  
Figure 19. Stop-Stop Waveforms during a UVLO Event  
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Soft-Stop Off  
The Soft-Start Off (SSOFF) pin gives additional flexibility by allowing the power converter to be configured for  
hard-stop during line UVLO and hiccup mode condition. If the SS OFF pin is pulled up to the 5V REF pin, the  
power converter hard-stops in any fault condition. Hard-stop drives each control output to a low state  
immediately. Refer to Table 2 for more details.  
Table 2. Soft-Stop in Fault Conditions  
Fault Condition  
SSSR  
UVLO  
Soft-Stop  
(UVLO<1.25V)  
3x the charging rate  
OVP  
Hard-Stop  
(OVP>1.25V)  
Hiccup  
Soft-Stop  
(CS>0.75 and RES>1V)  
6x the charging rate  
VCC/VREF UV  
Hard-Stop  
Hard-Stop  
Internal Thermal Limit  
Note: All the above conditions are valid with SSOFF pin tied to GND. If SSOFF=5V, the LM5046 hard-stops in all  
the conditions. The SS pin remains high in all the conditions until the SSSR pin reaches 1V.  
Thermal Protection  
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event the maximum rated  
junction temperature is exceeded. When activated, typically at 160°C, the controller is forced into a shutdown  
state with the output drivers, the bias regulators (VCC and REF) disabled. This helps to prevent catastrophic  
failures from accidental device overheating. During thermal shutdown, the SS and SSSR capacitors are fully  
discharged and the controller follows a normal start-up sequence after the junction temperature falls to the  
operating level (140 °C).  
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APPLICATION INFORMATION  
VIN  
VOUT  
VIN  
HO2  
HO1  
SW1  
LO1  
HO1  
SW1  
L
L
HO2  
SW2  
Mag  
Leak  
SW2  
LO2  
L
SR2  
Mag  
SR1  
I
O
+ I  
mag  
LO1  
LO2  
Active to Passive  
Transition  
Power Transfer/Active Mode  
VOUT  
VIN  
VIN  
HO1  
HO1  
HO2  
SW2  
HO2  
L
Leakage  
L
Mag  
SW1  
SW1  
LO1  
SW2  
LO2  
L
SR1  
SR2  
Mag  
LO1  
LO2  
GND  
C
Parasitic  
Passive to Active  
Transition  
Freewheel/Passive Mode  
Figure 20. Operating States of the PSFB Topology  
PHASE-SHIFTED FULL-BRIDGE OPERATION  
The phase shifted full-bridge topology is a derivative of the conventional full-bridge topology. When tuned  
appropriately the PSFB topology achieves zero voltage switching (ZVS) of the primary FETs while maintaining  
constant switching frequency. The ZVS feature is highly desirable as it reduces both the switching losses and the  
EMI emissions. The realization of the PSFB topology using the LM5046 is explained as follows:  
Operating State 1 (Power Transfer/Active Mode)  
The power transfer mode of the PSFB topology is similar to the hard switching full-bridge i.e. When the FETs in  
the diagonal of the bridge are turned-on (HO1 & LO2 or HO2 & LO1), a power transfer cycle from the primary to  
the secondary is initiated. Figure 20 depicts the case where the diagonal switches HO1 and LO2 are activated. In  
this state, full VIN is applied to the primary of the power transformer, which is typically stepped down on the  
secondary winding.  
Operating State 2 (Active to Passive Transition)  
At the end of the power transfer cycle, PWM turns off switch LO2. In the primary side, the reflected load current  
plus the magnetizing current propels the SW2 node towards VIN. The active to passive transition is finished  
when either the body diode of HO2 is forward-biased or HO2 is turned-on, whichever happens earlier. A delay  
can be introduced by setting RD2 to an appropriate value, such that HO2 is turned-on only after the body-diode  
is forward biased. In this mode, the Imag+ILpeak act as a current source charging the parasitic capacitor located at  
the node SW2. At light load conditions, it takes a longer time to propel SW node towards VIN.  
The active to passive transition time can be approximated by using the following formula:  
Cparasitic x VIN  
TAP  
=
ILpeak  
NTR  
(Im  
+
)
(4)  
Where, Im is the magnetizing current, NTR is the power transformer’s turns ratio, ILpeak is the peak output filter  
inductor current and Cparasitic is the parasitic capacitance at the node SW2.  
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Operating State 3 (Freewheel/Passive Mode)  
In the freewheel mode, unlike the conventional full-bridge topology where all the four primary FETs are off, in the  
PSFB topology the primary of the power transformer is shorted by activating either both the top FETs (HO1 and  
HO2) or both of the bottom FETs (LO1 and LO2) alternatively. In the current CLK cycle, the top FETs HO1 and  
HO2 are kept on together. Further in this mode, on the secondary side, similar to the classic full-bridge topology  
the synchronous FETs are both activated. During this state there is no energy transfer from the primary and the  
filter inductor current in the secondary freewheels through both the synchronous FETs.  
Operating State 4 (Passive to Active Transition)  
At the end of the switching cycle i.e. after the oscillator times out the current CLK cycle, the primary switch HO1  
and the secondary FET SR1 are turned-off simultaneously. The voltage at the node SW1 begins to fall towards  
the GND. This is due to the resonance between leakage inductance of the power transformer plus any additional  
commutation inductor and the parasitic capacitances at SW1. The magnetizing inductor is shorted in the  
freewheel mode and therefore it does not play any role in this transition. The LC resonance results in a half-wave  
sinusoid whose period is determined by the leakage inductor and parasitic capacitor. The peak of the half-wave  
sinusoid is a function of the load current. The passive to active transition time can be approximated by using the  
following formula:  
'
2
TPA =  
(Lleakage + Lcommutation) x Cparasitic  
(5)  
When tuned appropriately either by deliberately increasing the leakage inductance or by adding an extra  
commutating inductor, the sinusoidal resonant waveform peaks such that it is clamped by the body-diode of the  
LO1 switch. At this instant, ZVS can be realized by turning on the LO1 switch.  
The switching sequence in this CLK cycle is as follows: activation of the switch LO1 turns the diagonal LO1 and  
HO2 on, resulting in power transfer. The power transfer cycle ends when PWM turns off HO2, which is followed  
by an active to passive transition where LO2 is turned on. In the freewheel mode, LO1 and LO2 are both  
activated. From this sequence, it can be inferred that the FETs on the right side of the bridge (HO2 and LO2) are  
always terminated by the PWM ending a power transfer cycle and the SW2 node always sees an active to  
passive transition. Further, the FETs on the left side of the bridge (HO1 and LO1) are always turned-off by the  
CLK ending a freewheel cycle and the SW1 node always sees a passive to active transition.  
Turn-off  
controlled by  
CLK  
Turn-off  
controlled by  
PWM  
Vin  
Vout  
T1  
HO1  
HO2  
T1  
SW1  
LO1  
SW2  
LO2  
SR2  
SR1  
Active to Passive  
Transition at SW2  
Passive to Active  
Transition at SW1  
Figure 21. Simplified PSFB Topology Showing the Turn-Off Mechanism  
CONTROL METHOD SELECTION  
The LM5046 is a versatile PWM control IC that can be configured for either current mode control or voltage  
mode control. The choice of the control method usually depends upon the designer preference. The following  
must be taken into consideration while selecting the control method. Current mode control can inherently balance  
flux in both phases of the PSFB topology. The PSFB topology, like other double ended topologies, is susceptible  
to the transformer core saturation. Any asymmetry in the volt-second product applied between the two alternating  
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phases results in flux imbalance that causes a dc buildup in the transformer. This continual dc buildup may  
eventually push the transformer into saturation. The volt-second asymmetry can be corrected by employing  
current mode control. In current mode control, a signal representative of the primary current is compared against  
an error signal to control the duty cycle. In steady-state, this results in each phase being terminated at the same  
peak current by adjusting the pulse-width and thus applying equal volt-seconds to both the phases.  
Current mode control can be susceptible to noise and sub-harmonic oscillation, while voltage mode control  
employs a larger ramp for PWM and is usually less susceptible. Voltage-mode control with input line feed-  
forward also has excellent line transient response. When configuring for voltage mode control, a dc blocking  
capacitor can be placed in series with the primary winding of the power transformer to avoid any flux imbalance  
that may cause transformer core saturation.  
VOLTAGE MODE CONTROL USING THE LM5046  
To configure the LM5046 for voltage mode control, an external resistor (RFF) and capacitor (CFF) connected to  
VIN, AGND, and the RAMP pins is required to create a saw-tooth modulation ramp signal shown in Figure 22.  
The slope of the signal at RAMP will vary in proportion to the input line voltage. The varying slope provides line  
feed-forward information necessary to improve line transient response with voltage mode control. With a constant  
error signal, the on-time (TON) varies inversely with the input voltage (VIN) to stabilize the Volt- Second product  
of the transformer primary. Using a line feed-forward ramp for PWM control requires very little change in the  
voltage regulation loop to compensate for changes in input voltage, as compared to a fixed slope oscillator ramp.  
Furthermore, voltage mode control is less susceptible to noise and does not require leading edge filtering.  
Therefore, it is a good choice for wide input range power converters. Voltage mode control requires a Type-III  
compensation network, due to the complex-conjugate poles of the L-C output filter.  
SLOPE  
PROPORTIONAL  
TO VIN  
VIN  
5V  
5k  
COMP  
RFF  
R
VIN  
R
1V  
Gate Drive  
1:1  
RAMP  
CLK  
CFF  
LM5046  
Figure 22. Feed-Forward Voltage Mode Configuration  
The recommended capacitor value range for CFF is from 100pF to 1800pF. Referring to Figure 22, it can be seen  
that CFF value must be small enough to be discharged with in the clock pulse-width which is typically within 50ns.  
The RDS(ON) of the internal discharge FET is 5.5.  
The value of RFF required can be calculated from  
-1  
RFF  
=
VRAMP  
VINMIN  
FOSC x CFF x In  
(1-  
)
(6)  
For example, assuming a VRAMP of 1.5V (a good compromise of signal range and noise immunity), at VINMIN of  
36V (oscillator frequency of 400 kHz and CFF = 470pF results in a value for RFF of 125 k.  
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CURRENT MODE CONTROL USING THE LM5046  
The LM5046 can be configured for current mode control by applying a signal proportional to the primary current  
to the RAMP pin. One way to achieve this is shown in Figure 23. The primary current can be sensed using a  
current transformer or sense resistor, the resulting signal is filtered and applied to the RAMP pin through a  
resistor used for slope compensation. It can be seen that the signal applied to the RAMP pin consists of the  
primary current information from the CS pin plus an additional ramp for slope compensation, added by the  
resistor RSLOPE  
.
The current sense resistor is selected such that during over current condition, the voltage across the current  
sense resistor is above the minimum CS threshold of 728mV.  
In general, the amount of slope compensation required to avoid sub-harmonic oscillation is equal to at least one-  
half the down-slope of the output inductor current, transformed to the primary. To mitigate sub-harmonic  
oscillation after one switching period, the slope compensation has to be equal to one times the down slope of the  
filter inductor current transposed to primary. This is known as deadbeat control. The slope compensation resistor  
required to implement dead-beat control can be calculated as follows:  
V
´R  
OUT  
CS  
R
=
SLOPE  
L
´F  
´I  
´N  
TR  
FILTER  
OSC SLOPE  
(7)  
Where NTR is the turns-ratio with respect to the secondary. For example, for a 3.3V output converter with a turns-  
ratio between primary and secondary of 9:1, an output filter inductance (LFILTER) of 800nH and a current sense  
resistor (RSENSE) of 150m, RSLOPE of 1.67kwill suffice.  
LM5046  
100 mA  
SLOPE  
0
RAMP  
CLK  
Current  
Sense  
R
SLOPE  
R
CS  
FILTER  
CLK + LEB  
R
CS  
C
FILTER  
Figure 23. Current Mode Configuration  
VIN and VCC  
The voltage applied to the VIN pin, which may be the same as the system voltage applied to the power  
transformer’s primary (VPWR), can vary in the range of the 14 to 100V. It is recommended that the filter shown in  
Figure 24 be used to suppress the transients that may occur at the input supply. This is particularly important  
when VIN is operated close to the maximum operating rating of the LM5046. The current into VIN depends  
primarily on the LM5046’s operating current, the switching frequency, and any external loads on the VCC pin,  
that typically include the gate capacitances of the power MOSFETs. In typical applications, an auxiliary  
transformer winding is connected through a diode to the VCC pin. This pin must raise VCC voltage above 8V to  
shut off the internal start-up regulator.  
After the outputs are enabled and the external VCC supply voltage has begun supplying power to the IC, the  
current into the VIN pin drops below 1mA. VIN should remain at a voltage equal to or above the VCC voltage to  
avoid reverse current through the internal body diode of the internal VCC regulator.  
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V
PWR  
50  
VIN  
LM5046  
0.1 mF  
Figure 24. Input Transient Protection  
FOR APPLICATIONS WITH > 100V INPUT  
For applications where the system input voltage exceeds 100V, VIN can be powered from an external start-up  
regulator as shown in Figure 25. In this configuration, the VIN and VCC pins should be connected together. The  
voltage at the VCC and VIN pins must be greater than 10V (>Max VCC reference voltage) yet not exceed 16V.  
To enable operation the VCC voltage must be raised above 10V. The voltage at the VCC pin must not exceed  
16V. The voltage source at the right side of Figure 25 is typically derived from the power stage, and becomes  
active once the LM5046’s outputs are active.  
10V - 16V  
(from aux winding)  
V
PWR  
VIN  
VCC  
LM5046  
11V  
Figure 25. Start-Up Regulator for VPWR>100V  
UVLO AND OVP VOLTAGE DIVIDER SELECTION  
Two dedicated comparators connected to the UVLO and OVP pins are used to detect under voltage and over  
voltage conditions. The threshold values of both these comparators are set at 1.25V. The two functions can be  
programmed independently with two separate voltage dividers from VIN to AGND as shown in Figure 26 and  
Figure 27, or with a three-resistor divider as shown in Figure 28. Independent UVLO and OVP pins provide  
greater flexibility for the user to select the operational voltage range of the system. When the UVLO pin voltage is  
below 0.4V, the controller is in a low current shutdown mode. For a UVLO pin voltage greater than 0.4V but less  
than 1.25V the controller is in standby mode. Once the UVLO pin voltage is greater than 1.25V, the controller is  
fully enabled. Two external resistors can be used to program the minimum operational voltage for the power  
converter as shown in Figure 26. When the UVLO pin voltage falls below the 1.25V threshold, an internal 20µA  
current sink is enabled to lower the voltage at the UVLO pin, thus providing threshold hysteresis. Resistance  
values for R1 and R2 can be determined from the following equations:  
VHYS  
20 mA  
R1 =  
1.25V x R1  
R2 =  
VPWR-OFF -1.25V - (20 mA x R1)  
(8)  
Where VPWR is the desired turn-on voltage and VHYS is the desired UVLO hysteresis at VPWR  
.
For example, if the LM5046 is to be enabled when VPWR reaches 33V, and disabled when VPWR is decreased to  
31V, R1 should be 100k, and R2 should be 4.2k. The voltage at the UVLO pin should not exceed 7V at any  
time.  
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Two external resistors can be used to program the maximum operational voltage for the power converter as  
shown in Figure 27. When the OVP pin voltage rises above the 1.25V threshold, an internal 20µA current source  
is enabled to raise the voltage at the OVP pin, thus providing threshold hysteresis. Resistance values for R1 and  
R2 can be determined from the following equations:  
VHYS  
20 mA  
R1 =  
1.25V x R1  
R2 =  
VPWR -1.25V + (20 mA x R1)  
(9)  
If the LM5046 is to be disabled when VPWR-OFF reaches 80V and enabled when it is decreased to 78V. R1 should  
be 100k, and R2 should be 1.5 k. The voltage at the OVP pin should not exceed 7V at any time.  
V
PWR  
LM5046  
R1  
1.25V  
STANDBY  
UVLO  
20 mA  
R2  
0.4V  
SHUTDOWN  
Figure 26. Basic UVLO Configuration  
LM5046  
5V  
V
PWR  
20 mA  
R1  
OVP  
STANDBY  
1.25V  
R2  
Figure 27. Basic OVP Configuration  
The UVLO and OVP can also be set together using a 3 resistor divider ladder as shown in Figure 28. R1 is  
calculated as explained in the basic UVLO divider selection. Using the same values, as in the above two  
examples, for the UVLO and OVP set points, R1 and R3 remain the same at 100kand 1.5k. The R2 is 2.7kΩ  
obtained by subtracting R3 from 4.2k.  
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V
PWR  
R1  
1.25V  
LM5046  
UVLO  
STANDBY  
20 mA  
0.4V  
R2  
SHUTDOWN  
5V  
20 mA  
OVP  
STANDBY  
1.25V  
R3  
Figure 28. UVLO/OVP Divider  
Remote configuration of the controller’s operational modes can be accomplished with open drain device(s)  
connected to the UVLO pin as shown in Figure 29.  
Figure 30 shows an application of the OVP comparator for Remote Thermal Protection using a thermistor (or  
multiple thermistors) which may be located near the main heat sources of the power converter. The negative  
temperature coefficient (NTC) thermistor is nearly logarithmic, and in this example a 100kthermistor with the β  
material constant of 4500 Kelvin changes to approximately 2kat 130ºC. Setting R1 to one-third of this  
resistance (665) establishes 130ºC as the desired trip point (for VREF = 5V). In a temperature band from 20ºC  
below to 20ºC above the OVP threshold, the voltage divider is nearly linear with 25mV per ºC sensitivity.  
R2 provides temperature hysteresis by raising the OVP comparator input by R2 x 20µA. For example, if a 22kΩ  
resistor is selected for R2, then the OVP pin voltage will increase by 22k x 20µA = 506mV. The NTC temperature  
must therefore fall by 506mV / 25mV per ºC = 20ºC before the LM5046 switches from standby mode to the  
normal mode.  
V
PWR  
LM5046  
R1  
1.25V  
STANDBY  
UVLO  
20 mA  
R2  
STANDBY  
SHUTDOWN  
0.4V  
SHUTDOWN  
Figure 29. Remote Standby and Disable Control  
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LM5046  
5V  
V
PWR  
T
20 mA  
NTC  
THERMISTOR  
R1  
OVP  
STANDBY  
1.25V  
R2  
Figure 30. Remote Thermal Protection  
CURRENT SENSE  
The CS pin receives an input signal representative of its transformer’s primary current, either from a current  
sense transformer or from a resistor located at the junction of source pin of the primary switches, as shown in  
Figure 31 and Figure 32, respectively. In both the cases, the filter components RF and CF should be located as  
close to the IC as possible, and the ground connection from the current sense transformer, or RSENSE should be  
a dedicated trace to the appropriate GND pin. Please refer to the layout section for more layout tips.  
The current sense components must provide a signal > 710mV at the CS pin during an over-load event. Once  
the voltage on the CS pin crosses the current limit threshold, the current sense comparator terminates the PWM  
pulse and starts to charge the RES pin. Depending on the configuration of the RES pin, the LM5046 will  
eventually initiate a hiccup mode restart or be in continuous current limit.  
V
PWR  
Q3  
Q1  
VIN  
N
N
R
S1  
F
CS  
N
P
R
CS  
LM5046  
C
F
S2  
AGND  
Q2  
Q4  
Figure 31. Transformer Current Sense  
Q3  
Q1  
N
P
Q4  
Q2  
VIN  
CS  
R
F
LM5046  
R
CS  
C
F
AGND  
Figure 32. Resistor Current Sense  
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HICCUP MODE CURRENT LIMIT RESTART  
The operation of the hiccup mode restart circuit is explained in the FUNCTIONAL DESCRIPTION section. During  
a continuous current limit condition, the RES pin is charged with 30µA current source. The restart delay time  
required to reach the 1.0V threshold is given by:  
CRES x 1.0V  
TCS  
=
30 mA  
(10)  
This establishes the number of current limit events allowed before the IC initiates a hiccup restart sequence. For  
example, if the CRES=0.01µF, the time TCS as noted in Figure 33 is 334µs. Once the RES pin reaches 1.0V, the  
30µA current source is turned-off and a 10µA current source is turned-on during the ramp up to 4V and a 5µA is  
turned on during the ramp down to 2V. The hiccup mode off-time is given by:  
CRES x ((2.0Vx8) + 1.0V)  
CRES x (2.0Vx8)  
THICCUP  
=
+
10 µA  
5 µA  
(11)  
With a CRES=0.01µF, the hiccup time is 49ms. Once the hiccup time is finished, the RES pin is pulled-low and the  
SS pin is released allowing a soft-start sequence to commence. Once the SS pin reaches 1V, the PWM pulses  
will commence. The hiccup mode provides a cool-down period for the power converter in the event of a  
sustained overload condition thereby lowering the average input current and temperature of the power  
components during such an event.  
4V  
2V  
1V  
Count to Eight  
Restart delay  
Soft-Start  
1V  
Hiccup Mode off-time  
Figure 33. Hiccup Mode Delay and Soft-Start Timing Diagram  
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AUGMENTING THE GATE DRIVE STRENGTH  
The LM5046 includes powerful 2A integrated gate drivers. However, in certain high power applications (>500W),  
it might be necessary to augment the strength of the internal gate driver to achieve higher efficiency and better  
thermal performance. In high power applications, typically, the I2xR loss in the primary MOSFETs is significantly  
higher than the switching loss. In order to minimize the I2xR loss, either the primary MOSFETs are paralleled or  
MOSFETs with low RDS (on) are employed. Both these scenarios increase the total gate charge to be driven by  
the controller IC. An increase in the gate charge increases the FET transition time and hence increases the  
switching losses. Therefore, to keep the total losses within a manageable limit the transition time needs to be  
reduced.  
Generally, during the miller capacitance charge/discharge the total available driver current is lower during the  
turn-off process than during the turn-on process and often it is enough to speed-up the turn-off time to achieve  
the efficiency and thermal goals. This can be achieved simply by employing a PNP device, as shown in  
Figure 34, from gate to source of the power FET. During the turn-on process, when the LO1 goes high, the  
current is sourced through the diode D1 and the BJT Q1 provides the path for the turn-off current. Q1 should be  
located as close to the power FET as possible so that the turn-off current has the shortest possible path to the  
ground and does not have to pass through the controller.  
VIN  
LM5046  
BST1  
D1  
HO1  
Q1  
HS1  
VCC  
LO1  
PGND  
Figure 34. Circuit to Speed-up the Turn-off Process  
Depending on the gate charge characteristics of the primary FET, if it is required to speed up both the turn-on  
and the turn-off time, a bipolar totem pole structure as shown in Figure 35 can be used. When LO1 goes high,  
the gate to source current is sourced through the NPN transistor Q1 and similar to the circuit shown in Figure 34  
when LO1 goes low the PNP transistor Q2 expedites the turn-off process.  
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VIN  
LM5046  
BST1  
Q1  
Q2  
HO1  
HS1  
VCC  
LO1  
PGND  
Figure 35. Bipolar Totem Pole Arrangement  
Alternatively, a low side gate driver such as LM5112 can be utilized instead of the discrete totem pole. The  
LM5112 comes in a small package with a 3A source and a 7A sink capability. While driving the high-side FET,  
the HS1 acts as a local ground and the boot capacitor between the BST and HS pins acts as VCC.  
VIN  
LM5046  
BST1  
LM5112  
HO1  
HS1  
VCC  
LM5112  
LO1  
PGND  
Figure 36. Using a Low Side Gate Driver to Augment Gate Drive Strength  
Copyright © 2011–2013, Texas Instruments Incorporated  
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LM5046  
SNVS703G FEBRUARY 2011REVISED MARCH 2013  
www.ti.com  
PRINTED CIRCUIT BOARD LAYOUT  
The LM5046 current sense and PWM comparators are very fast and respond to short duration noise pulses. The  
components at the CS, COMP, SLOPE, RAMP, SS, SSSR, RES, UVLO, OVP, RD1, RD2, and RT pins should  
be physically close as possible to the IC, thereby minimizing noise pickup on the PC board trace inductance.  
Eliminating or minimizing via’s in these critical connections are essential. Layout consideration is critical for the  
current sense filter. If a current sense transformer is used, both leads of the transformer secondary should be  
routed to the sense filter components and to the IC pins. The ground side of the transformer should be  
connected via a dedicated PC board trace to the AGND pin, rather than through the ground plane. If the current  
sense circuit employs a sense resistor in the drive transistor source, low inductance resistors should be used. In  
this case, all the noise sensitive, low-current ground trace should be connected in common near the IC, and then  
a single connection made to the power ground (sense resistor ground point).  
The gate drive outputs of the LM5046 should have short, direct paths to the power MOSFETs in order to  
minimize inductance in the PC board. The boot-strap capacitors required for the high side gate drivers should be  
located very close to the IC and connected directly to the BST and HS pins. The VCC and REF capacitors  
should also be placed close to their respective pins with short trace inductance. Low ESR and ESL ceramic  
capacitors are recommended for the boot-strap, VCC and the REF capacitors. The two ground pins (AGND,  
PGND) must be connected together directly underneath the IC with a short, direct connection, to avoid jitter due  
to relative ground bounce.  
32  
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Product Folder Links: LM5046  
LM5046  
www.ti.com  
SNVS703G FEBRUARY 2011REVISED MARCH 2013  
APPLICATION CIRCUIT EXAMPLE  
The following schematic shows an example of a 100W phase-shifted full-bridge converter controlled by LM5046.  
The operating input voltage range is 36V to 75V, and the output voltage is 3.3V. The output current capability is  
30 Amps. The converter is configured for current mode control with external slope compensation. An auxiliary  
winding is used to raise the VCC voltage to reduce the controller power dissipation.  
Evaluation Board Schematic  
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LM5046  
SNVS703G FEBRUARY 2011REVISED MARCH 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision F (March 2013) to Revision G  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 33  
34  
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Copyright © 2011–2013, Texas Instruments Incorporated  
Product Folder Links: LM5046  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LM5046MH/NOPB  
LM5046MHX/NOPB  
LM5046SQ/NOPB  
LM5046SQX/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
HTSSOP  
HTSSOP  
WQFN  
PWP  
28  
28  
28  
28  
48  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
LM5046  
MH  
ACTIVE  
ACTIVE  
ACTIVE  
PWP  
RSG  
RSG  
2500  
1000  
4500  
Green (RoHS  
& no Sb/Br)  
LM5046  
MH  
Green (RoHS  
& no Sb/Br)  
L5046  
WQFN  
Green (RoHS  
& no Sb/Br)  
L5046  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM5046MHX/NOPB  
LM5046SQ/NOPB  
LM5046SQX/NOPB  
HTSSOP PWP  
28  
28  
28  
2500  
1000  
4500  
330.0  
178.0  
330.0  
16.4  
12.4  
12.4  
6.8  
5.3  
5.3  
10.2  
5.3  
1.6  
1.3  
1.3  
8.0  
8.0  
8.0  
16.0  
12.0  
12.0  
Q1  
Q1  
Q1  
WQFN  
WQFN  
RSG  
RSG  
5.3  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM5046MHX/NOPB  
LM5046SQ/NOPB  
LM5046SQX/NOPB  
HTSSOP  
WQFN  
PWP  
RSG  
RSG  
28  
28  
28  
2500  
1000  
4500  
367.0  
210.0  
367.0  
367.0  
185.0  
367.0  
35.0  
35.0  
35.0  
WQFN  
Pack Materials-Page 2  
MECHANICAL DATA  
PWP0028A  
MXA28A (Rev D)  
www.ti.com  
MECHANICAL DATA  
RSG0028A  
SQA28A (Rev B)  
www.ti.com  
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