LM385BDE4-1-2 [TI]
Micropower Voltage Reference 8-SOIC 0 to 70;
| 型号： | LM385BDE4-1-2 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Micropower Voltage Reference 8-SOIC 0 to 70 光电二极管 |
| 文件： | 总18页 (文件大小：689K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁꢉ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁ ꢉꢃ ꢄꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋꢌꢍꢎ ꢏ ꢎꢐ ꢑꢍ ꢒꢎ ꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗ ꢌꢑ ꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
LM285-1.2 . . . D PACKAGE
D
Operating Current Range
LM385-1.2 . . . D, PS, OR PW PACKAGE
LM385B-1.2 . . . D OR PW PACKAGE
(TOP VIEW)
− LM285 . . . 10 µA to 20 mA
− LM385 . . . 15 µA to 20 mA
− LM385B . . . 15 µA to 20 mA
NC
NC
NC
CATHODE
NC
NC
1
2
3
4
8
7
6
5
D
D
1% and 2% Initial Voltage Tolerance
Reference Impedance
− LM385 . . . 1 Ω Max at 25°C
− All Devices . . . 1.5 Ω Max Over Full
Temperature Range
ANODE
NC
NC − No internal connection
D
D
Very Low Power Consumption
LM285-1.2, LM385-1.2, LM385B-1.2 . . . LP PACKAGE
(TOP VIEW)
Applications
− Portable Meter References
− Portable Test Instruments
− Battery-Operated Systems
− Current-Loop Instrumentation
− Panel Meters
ANODE
CATHODE
NC
D
Interchangeable With Industry Standard
LM285-1.2 and LM385-1.2
NC − No internal connection
description/ordering information
These micropower, two-terminal, band-gap voltage references operate over a 10-µA to 20-mA current range
and feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming provides
tight voltage tolerance. The band-gap reference for these devices has low noise and long-term stability.
ORDERING INFORMATION
V
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Z
†
T
A
PACKAGE
TOLERANCE
Tube of 75
LM385D-1-2
SOIC (D)
SOP (PS)
385-12
Reel of 2000
Reel of 2000
Tube of 1000
Reel of 2000
Tube of 150
Reel of 2000
Tube of 75
LM385DR-1-2
LM385PSR-1-2
LM385LP-1-2
LM385LPR-1-2
LM385PW-1-2
LM385PWR-1-2
LM385BD-1-2
LM385BDR-1-2
LM385BLP-1-2
LM385BLPR-1-2
LM385BPW-1-2
LM385BPWR-1-2
LM285D-1-2
L385-12
2%
TO-226 / TO-92 (LP)
TSSOP (PW)
SOIC (D)
385-12
385-12
385B12
385B12
385B12
0°C to 70°C
Reel of 2000
Tube of 1000
Reel of 2000
Tube of 150
Reel of 2000
Tube of 75
1%
1%
TO-226 / TO-92 (LP)
TSSOP (PW)
SOIC (D)
285-12
285-12
−40°C to 85°C
Reel of 2000
LM285DR-1-2
LM285LP-1-2
TO-226 / TO-92 (LP) Tube of 1000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2005, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢀ ꢁ ꢉ ꢃꢄ ꢅꢆ ꢇ ꢂ ꢈ ꢀꢁ ꢉ ꢃꢄ ꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋ ꢌꢍ ꢎꢏꢎꢐꢑ ꢍ ꢒ ꢎꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗꢌ ꢑꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
description/ordering information (continued)
The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most
reference applications. The wide dynamic operating temperature range accommodates varying current
supplies, with excellent regulation.
The extremely low power drain of this series makes them useful for micropower circuitry. These voltage
references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery
life approaching shelf life. The wide operating current range allows them to replace older references with
tighter-tolerance parts.
symbol
ANODE
CATHODE
schematic
CATHODE
Q13
7.5 kΩ
600 kΩ
Q12
Q11
Q7
200 kΩ
50 kΩ
Q4
Q3
Q10
Q9
Q1
300 kΩ
20 pF
20 pF
Q2
Q5
Q6
Q8
Q14
100 kΩ
500 Ω
60 kΩ
ANODE
NOTE A: Component values shown are nominal.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁꢉ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁ ꢉꢃ ꢄꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋꢌꢍꢎ ꢏ ꢎꢐ ꢑꢍ ꢒꢎ ꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗ ꢌꢑ ꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Reverse current, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
R
Forward current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
F
Package thermal impedance, θ (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 140°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of T
,θ , and T . The maximum allowable power dissipation at any allowable ambient
A
J(max) JA
temperature is P = (T
J(max)
− T )/θ . Operation at the absolute maximum T of 150°C can affect reliability.
A JA J
D
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
0.01
−40
0
MAX
20
UNIT
I
Reference current
mA
Z
LM285-1.2
LM385-1.2, LM385B-1.2
85
T
Operating free-air temperature range
°C
A
70
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢀ ꢁ ꢉ ꢃꢄ ꢅꢆ ꢇ ꢂ ꢈ ꢀꢁ ꢉ ꢃꢄ ꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋ ꢌꢍ ꢎꢏꢎꢐꢑ ꢍ ꢒ ꢎꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗꢌ ꢑꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
electrical characteristics at specified free-air temperature
LM285-1.2
TYP
LM385-1.2
TYP
LM385B-1.2
MIN TYP MAX
TEST
CONDITIONS
†
PARAMETER
T
A
UNIT
MIN
MAX
MIN
MAX
Reference
voltage
I
= I(min)
‡
Z
V
Z
25°C
1.223 1.235 1.247
1.21 1.235
1.26 1.223 1.235 1.247
V
to 20 mA
Average
temperature
coefficient of
reference
I
= I(min)
Z
α
VZ
Full range
20
20
20
ppm/°C
‡
to 20 mA
§
voltage
25°C
Full range
25°C
1
1.5
12
1
1.5
20
1
1.5
20
I
= I(min)
Z
Change in
reference
voltage with
current
‡
to 1 mA
∆V
mV
Z
I
Z
= 1 mA
to 20 mA
Full range
30
30
30
Long-term
change in
reference
voltage
∆V /∆t
I
Z
= 100 µA
25°C
20
20
20
ppm/khr
Z
Minimum
I (min) reference
Z
Full range
8
10
8
15
8
15
µA
current
25°C
0.2
0.6
1.5
0.4
1
0.4
1
Reference
impedance
I
= 100 µA,
Z
z
Ω
z
f = 25 Hz
= 100 µA,
Full range
1.5
1.5
I
Z
Broadband
noise voltage
V
f = 10 Hz to
10 kHz
25°C
60
60
60
µV
n
†
‡
§
Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2.
I(min) = 10 µA for the LM285-1.2 and 15 µA for the LM385-1.2 and LM385B-1.2
The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature
range.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁꢉ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁ ꢉꢃ ꢄꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋꢌꢍꢎ ꢏ ꢎꢐ ꢑꢍ ꢒꢎ ꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗ ꢌꢑ ꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
†
TYPICAL CHARACTERISTICS
REFERENCE VOLTAGE CHANGE
REVERSE CURRENT
vs
REVERSE VOLTAGE
vs
REVERSE CURRENT
16
12
8
100
10
1
T
A
= −55°C to 125°C
T
A
= −55°C to 125°C
4
0
0.1
0
−4
0.01
0.1
1
10
100
0.2
0.4
V
0.6
0.8
1
1.2
1.4
I
R
− Reverse Current − mA
− Reverse Voltage − V
R
Figure 1
Figure 2
REFERENCE VOLTAGE
vs
FORWARD VOLTAGE
vs
FREE-AIR TEMPERATURE
FORWARD CURRENT
1.2
0.8
0.4
0
1.245
1.24
T
A
= 25°C
1.235
1.23
1.225
1.220
−55 −35 −15
5
25
45
65 85 105 125
0.01
0.1
1
10
100
T
A
− Free-Air Temperature − °C
I
F
− Forward Current − mA
Figure 3
Figure 4
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢂ ꢈ ꢀ ꢁ ꢉ ꢃꢄ ꢅꢆ ꢇ ꢂ ꢈ ꢀꢁ ꢉ ꢃꢄ ꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋ ꢌꢍ ꢎꢏꢎꢐꢑ ꢍ ꢒ ꢎꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗꢌ ꢑꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
†
TYPICAL CHARACTERISTICS
NOISE VOLTAGE
vs
FREQUENCY
REFERENCE IMPEDANCE
vs
REFERENCE CURRENT
700
600
500
400
300
200
100
0
100
10
1
f = 25 Hz
I
= 100 µA
= 25°C
Z
T
= −55°C to 125°C
A
T
A
0.1
0.01
10
100
1 k
10 k
100 k
0.1
1
10
100
f − Frequency − Hz
I
Z
− Reference Current − mA
Figure 6
Figure 5
OUTPUT NOISE VOLTAGE
vs
CUTOFF FREQUENCY
TRANSIENT RESPONSE
70
I
T
= 100 µA
Z
RC Low Pass
= 25°C
Output
60
50
40
30
20
A
1.5
1
36 kΩ
100 µA
V
I
V
O
R
0.5
C
0
5
0
10
0
Input
0
100
500
600
0.1
1
10
100
t − Time − µs
f − Cutoff Frequency − kHz
Figure 7
Figure 8
†
6
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁꢉ ꢃ ꢄ ꢅꢆ ꢇ ꢂꢈ ꢀ ꢁ ꢉꢃ ꢄꢊ ꢅꢆ ꢇꢂ
ꢁ ꢋꢌꢍꢎ ꢏ ꢎꢐ ꢑꢍ ꢒꢎ ꢀꢓꢔꢕ ꢑ ꢍꢑ ꢖꢑ ꢍꢑ ꢗ ꢌꢑ ꢘ
SLVS075I − APRIL 1989 − REVISED DECEMBER 2005
APPLICATION INFORMATION
I
O
≈ 58 µA
5.1 kΩ
+
−
V+
Mercury Cell
1.345 V
2.00 kΩ 1%
100 kΩ 1%
R
LM334
cw
cw
V−
10 kΩ
500 Ω
‡
412 Ω
1%
†
953 Ω
1%
LM385-1.2
+
Type K
−
Meter
†
‡
Adjust for 11.15 mV at 25°C across 953 Ω
Adjust for 12.17 mV at 25°C across 412 Ω
Figure 9. Thermocouple Cold-Junction Compensator
V+ 2.3 V ≤ V+ ≤ 30 V
LM334
V−
R
2.74 kΩ
1.2 V
LM385-1.2
Figure 10. Operation Over a Wide Supply Range
9 V
499 kΩ
1.2 V
LM385-1.2
Figure 11. Reference From a 9-V Battery
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
LM285D-1-2
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
TO-92
TO-92
TO-92
SOIC
SOIC
SOIC
SOIC
SOIC
TO-92
TO-92
TO-92
D
8
8
8
8
8
8
3
3
3
8
8
8
8
8
3
3
3
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
285-12
LM285DE4-1-2
LM285DG4-1-2
LM285DR-1-2
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
75
Green (RoHS
& no Sb/Br)
285-12
285-12
285-12
285-12
285-12
285-12
285-12
285-12
385B12
385B12
385B12
385B12
385B12
385B12
385B12
385B12
75
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
1000
1000
2000
75
Green (RoHS
& no Sb/Br)
LM285DRE4-1-2
LM285DRG4-1-2
LM285LP-1-2
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
LP
LP
LP
D
Pb-Free
(RoHS)
LM285LPE3-1-2
LM285LPRE3-1-2
LM385BD-1-2
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM385BDE4-1-2
LM385BDG4-1-2
LM385BDR-1-2
LM385BDRG4-1-2
LM385BLP-1-2
LM385BLPE3-1-2
LM385BLPR-1-2
D
75
Green (RoHS
& no Sb/Br)
0 to 70
D
75
Green (RoHS
& no Sb/Br)
0 to 70
D
2500
2500
1000
1000
2000
Green (RoHS
& no Sb/Br)
0 to 70
D
Green (RoHS
& no Sb/Br)
0 to 70
LP
LP
LP
Pb-Free
(RoHS)
0 to 70
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 70
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 70
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM385BLPRE3-1-2
LM385BPW-1-2
LM385BPWR-1-2
LM385D-1-2
ACTIVE
TO-92
TSSOP
TSSOP
SOIC
LP
3
8
8
8
8
8
8
3
3
3
3
8
8
8
8
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
385B12
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
D
150
2000
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SN
385B12
385B12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
385-12
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM385DG4-1-2
LM385DR-1-2
SOIC
D
75
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
1000
1000
2000
2000
150
Green (RoHS
& no Sb/Br)
LM385DRG4-1-2
LM385LP-1-2
SOIC
D
Green (RoHS
& no Sb/Br)
TO-92
TO-92
TO-92
TO-92
TSSOP
TSSOP
TSSOP
TSSOP
LP
LP
LP
LP
PW
PW
PW
PW
Pb-Free
(RoHS)
LM385LPE3-1-2
LM385LPR-1-2
LM385LPRE3-1-2
LM385PW-1-2
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LM385PWE4-1-2
LM385PWR-1-2
LM385PWRE4-1-2
150
Green (RoHS
& no Sb/Br)
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285DR-1-2
LM385BDR-1-2
LM385BPWR-1-2
LM385DR-1-2
SOIC
SOIC
D
D
8
8
8
8
8
2500
2500
2000
2500
2000
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
6.4
6.4
7.0
6.4
7.0
5.2
5.2
3.6
5.2
3.6
2.1
2.1
1.6
2.1
1.6
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
TSSOP
SOIC
PW
D
LM385PWR-1-2
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM285DR-1-2
LM385BDR-1-2
LM385BPWR-1-2
LM385DR-1-2
SOIC
SOIC
D
D
8
8
8
8
8
2500
2500
2000
2500
2000
340.5
340.5
367.0
340.5
367.0
338.1
338.1
367.0
338.1
367.0
20.6
20.6
35.0
20.6
35.0
TSSOP
SOIC
PW
D
LM385PWR-1-2
TSSOP
PW
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
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other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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