LM3646YFQR [TI]
具有双高侧电流源的 1.5A 同步升压 LED 闪光灯驱动器 | YFQ | 20 | -40 to 85;
| 型号： | LM3646YFQR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有双高侧电流源的 1.5A 同步升压 LED 闪光灯驱动器 | YFQ | 20 | -40 to 85 驱动 闪光灯 驱动器 |
| 文件： | 总31页 (文件大小：1186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM3646
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SNVS962 –DECEMBER 2013
1.5A Synchronous Boost Converter with Dual High-Side Current Sources and I2C-
Compatible Interface
Check for Samples: LM3646
1
FEATURES
DESCRIPTION
The LM3646 is a 4 MHz fixed-frequency, Current
Mode synchronous boost converter. The device is
designed to operate as a dual 1.5A constant current
driver for high current LEDs. The high-side current
sources allow for grounded cathode LED operation
providing Flash current up to 1.5A total. An adaptive
headroom regulation scheme ensures the LED
currents remain in regulation and maximizes
efficiency.
2
•
High-Side Current Sources allowing for
Grounded LED Cathode for Improved Thermal
Management
•
•
•
> 85% Efficiency in Torch and Flash Modes
Small Solution Size < 20 mm2
Accurate and Programmable Flash LED
Current from 24 mA to 1.5A in 11.7 mA steps
•
•
Accurate and Programmable Torch LED
Current from 2.5 mA to 187 mA in 1.5 mA
steps
The LM3646 is controlled via an I²C-compatible
interface. The main features of the LM3646 include: a
hardware flash enable (STROBE) input for direct
triggering of the Flash pulse, a hardware Torch
enable (TORCH) for Movie Mode or Flashlight
functions, a TX input which forces the flash pulse into
Dual 1.5A High-Side Current Sources for Dual
LED Drive
•
•
•
•
•
Hardware Flash and Torch Enables
Hardware Enable Pin
a
low-current
Torch
Mode
allowing
for
synchronization to RF power amplifier events or other
high-current conditions, an integrated comparator
designed to monitor an NTC thermistor and provide
an interrupt to the LED current, and a programmable
input voltage monitor which monitors the battery
voltage and can reduce the flash current during low
battery conditions. A hardware enable (ENABLE)
input provides a hardware shutdown during system
software failures.
Soft-Start Operation for Battery Protection
LED Thermal Sensing and Current Scale-Back
Synchronization Input for RF Power Amplifier
Pulse Events
•
•
•
•
VIN Flash Monitor Optimization
1 MHz I²C-Compatible Interface
I²C-Programmable NTC Trip Point
0.4 mm pitch, 20-Bump DSBGA
The
4
MHz switching frequency, over-voltage
protection, and adjustable current limit allow for the
use of tiny, low-profile inductors and (10 μF) ceramic
capacitors. The device is available in a small 20-
bump DSBGA package and operates over the −40°C
to +85°C temperature range.
APPLICATIONS
•
Camera Phone LED Flash/Torch
SYSTEM PERFORMANCE
TYPICAL APPLICATION CIRCUIT
2800
1 PH
TA = +25ºC
TA = -40ºC
TA = +85ºC
2600
2400
2200
2000
1800
1600
1400
1200
ILED = 1.5A, VLED = 3.7V
SW
OUT
IN
2.7V to 5.5V
10 PF
10 PF
LM3646
LED1
LED2
ENABLE
STROBE
TORCH
TX
TEMP
SDA
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
SCL
C032
GND
VIN (V)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LM3646
SNVS962 –DECEMBER 2013
www.ti.com
Connection Diagram
4
3
2
1
4
3
2
1
A
B
C
D
E
E
D
C
B
A
Top View
Bottom View
Figure 1. 20-Bump 2.010 mm x 1.610 mm x 0.6mm DSBGA Package YFQ20AAA
PIN DESCRIPTIONS
Pin #
Pin
Name
Description
Count
A1, B1
A2, B2
A3, B3, C3
A4,B4
C4, D4
C1
2
2
3
2
2
1
1
GND
SW
Ground.
Drain Connection for Internal NMOS and Synchronous PMOS Switches.
OUT
LED1
LED2
Step-Up DC/DC Converter Output. Connect a 10 µF ceramic capacitor between this pin and GND.
High-Side Current Source Output for Flash LED. Both bumps must be connected for proper operation.
High-Side Current Source Output for Flash LED. Both bumps must be connected for proper operation.
AGND Analog Ground.
D1
IN
Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a 10 µF or larger
ceramic capacitor.
E2
D2
D3
1
1
1
SDA
SCL
Serial Data Input/Output.
Serial Clock Input.
ENABLE Active High Enable Pin. High = Standby, Low = Shutdown/Reset. Has an internal pull-down resistor of
200 kΩ between ENABLE and GND.
E3
C2
E4
E1
1
1
1
1
STROBE Active High Hardware Flash Enable. Drive STROBE high to turn on Flash LEDs. STROBE overrides
TORCH. Has an internal pull-down resistor of 200 kΩ between STROBE and GND.
TORCH Active High Hardware Torch Enable. Drive TORCH high to turn on Torch/Movie Mode. Used for
External PWM mode. Has an internal pull-down resistor of 200 kΩ between TORCH and GND.
TX
Configurable Dual Polarity Power Amplifier Synchronization Input. Has an internal pull-down resistor of
200 kΩ between TX and GND.
TEMP
Threshold Detector for LED Temperature Sensing and Current Scale Back.
Table 1. Application Circuit Component List
Component
Manufacturer
Value
Part-Number
Size (mm)
Current/Voltage
Rating(Resistance)
L
TOKO
Murata
Murata
1 µH
10 µF
10 µF
1286AS-H-1R0N
GRM188R60J106M
GRM188R60J106M
2.0 mm x 1.6 mm x 1.2 mm
1.6 mm x 0.8 mm x 0.8 mm(0603)
1.6 mm x 0.8 mm x 0.8 mm(0603)
ISAT = 3.1A (68 mΩ)
COUT1,2
CIN1,2
6.3V
6.3V
2
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SNVS962 –DECEMBER 2013
BLOCK DIAGRAM
SW
Over Voltage
Comparator
IN
4 MHz
Oscillator
-
+
V
REF
V
OVP
85 m:
Input Voltage
Flash Monitor
OUT
UVLO
I
I
LED2
LED1
PWM
Control
65 m:
I
NTC
Thermal
TEMP
Shutdown
+150oC
LED1
LED2
Error
Amplifier
FB
SELECT
+
-
OUT-VHR
Current Sense/
Current Limit
NTC V
TRIP
Slope
Compensation
Soft-Start
SDA
SCL
Control
Logic/
Registers
2
I C
Interface
GND
STROBE
ENABLE
TORCH
TX
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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SNVS962 –DECEMBER 2013
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(1)(2)
ABSOLUTE MAXIMUM RATINGS
SCL, SDA, ENABLE, STROBE, TX, TORCH, LED1, LED2, TEMP
−0.3V to the lesser of (VIN+0.3V) w/ 6V max
IN, SW, OUT
Continuous Power Dissipation(3)
−0.3V to 6V
Internally Limited
+150°C
Junction Temperature (TJ-MAX
)
Storage Temperature Range
−65°C to +150°C
(4)
Maximum Lead Temperature (Soldering)
See Note
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = +135°C (typ.).
Thermal shutdown is verified by design.
(4) For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level
Chip Scale Package (AN-1112).
(1)(2)
RECOMMENDED OPERATING CONDITIONS
VIN
2.7V to 5.5V
−40°C to +125°C
−40°C to +85°C
Junction Temperature (TJ)
Ambient Temperature (TA)
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
+125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
THERMAL PROPERTIES
Thermal Junction-to-Ambient Resistance (θJA
(1)
)
53.4°C/W
(1) Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array
of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5
oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.
4
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SNVS962 –DECEMBER 2013
ELECTRICAL CHARACTERISTICS(1)(2)
Limits in standard typeface are for TA = +25°C. Limits in boldface type apply over the full operating ambient temperature
range (−40°C ≤ TA ≤ +85°C). Unless otherwise specified, VIN = 3.6V.
Symbol
Current Source Specifications
ILED1/2 Current Source Accuracy
Parameter
Conditions
Min
Typ
Max
Units
1.5A Flash, VOUT = 4V, LED1 or LED2
Active
1.395
(−7%)
1.5
93.4
250
150
1.605
(+7%)
A
93.4 mA Torch, VOUT = 3.6V, LED1 or
LED2 Active
84.06
(−10%)
102.74
(+10%)
mA
mV
VOUT
-
Current Source Regulation
ILED = 1.5A
Flash
280
(+12%)
VLED1/2
ILED = 93.4 mA
Torch
172.5
(+15%)
Step-Up DC/DC Converter Specifications
ICL
Switch Current Limit
−15%
−10%
4.85
1.0
3.1
5.0
4.8
85
+15%
+10%
5.15
A
V
VOVP
Output Over-Voltage Protection Trip Point ON Threshold
OFF Threshold
4.65
4.95
RPMOS
RNMOS
UVLO
VNTC-Trip
INTC
RPMOS Switch On-Resistance
NMOS Switch On-Resistance
Under Voltage Lockout Threshold
NTC Comparator Trip Threshold
NTC Current
IPMOS = 1A
INMOS = 1A
Falling VIN
mΩ
65
2.74
−6%
−6%
2.2
2.8
600
50
2.85
+6%
+6%
2.4
V
mV
µA
V
VNTC-Open
VNTC-Short
VIVFM
NTC Open Trip Threshold
NTC Short Trip Threshold
Input Voltage Flash Monitor Trip Threshold
Switching Frequency
2.3
100
2.9
4
75
125
+5%
4.28
1.3
mV
V
−5%
3.72
fSW
2.8V ≤ VIN ≤ 4.8V
MHz
µA
ISD
Shutdown Supply Current
Device Disabled, EN = 0V
0.1
2.8V ≤ VIN ≤ 4.8V
ISB
Standby Supply Current
Device Disabled, EN = 1.8V
2.8V ≤ VIN ≤ 4.8V
2.5
10
µA
V
ENABLE, STROBE, TORCH, TX Voltage Specifications
VIL
VIH
Input Logic Low
Input Logic High
2.8V ≤ VIN ≤ 4.2V
0
0.4
VIN
1.2
I2C-Compatible Interface Specifications (SCL, SDA)
VIL
Input Logic Low
Input Logic High
Output Logic Low
SCL Clock Period
2.8V ≤ VIN ≤ 4.2V
0
0.4
VIN
300
V
VIH
VOL
tSCL
1.2
ILOAD = 1.5 mA
mV
µs
1
(1) All voltages are with respect to the potential at the GND pin.
(2) Min and Max limits are 100% production tested at an ambient temperature (TA) of 25 °C. Limits over the operating temperature range
are specified through correlation using Statistical Quality Control (SQC) methods. Unless otherwise specified, conditions for typical
specifications are: VIN = 3.6V and TA = +25°C.
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TYPICAL CHARACTERISTICS
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
100
90
80
70
60
50
100
90
80
70
60
50
ILED = 1.5A, VLED = 4V
ILED = 750mA, VLED = 3.5V
TA = +25ºC
TA = -40ºC
TA = +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
C006
C028
VIN (V)
VIN (V)
Figure 2. Flash LED Efficiency vs. Input Voltage
Figure 3. Flash LED Efficiency vs. Input Voltage
1600
1400
1200
1000
800
600
400
200
0
100
90
80
70
60
50
D1, +25ºC
D1, -40ºC
D1, +85ºC
D2, +25ºC
D2, -40ºC
D2, +85ºC
VIN = 3.7V
TA = +25ºC
TA = -40ºC
TA = +85ºC
0
8
16 24 32 40 48 56 64 72 80 88 96 104112120128
100
300
500
700
900
1100
1300
1500
C004
LED1 Code (#)
C031
ILED (mA)
Figure 4. Flash LED Efficiency vs. LED Current
Figure 5. Flash LED Current vs. Brightness Code
1550
1540
1530
1520
1510
1500
1490
1480
1470
1460
1450
780
770
760
750
740
730
720
D1, +25ºC
D1, -40ºC
D1, +85ºC
D2, +25ºC
D2, -40ºC
D2, +85ºC
D1, +25ºC
D1, -40ºC
D1, +85ºC
D2, +25ºC
D2, -40ºC
D2, +85ºC
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
C001
VIN (V)
C002
VIN (V)
Figure 6. Flash LED Current Line Regulation, ILED = 1.5A
Figure 7. Flash LED Current Line Regulation,
ILED1 = ILED2 = 0.75A
6
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SNVS962 –DECEMBER 2013
TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
100
90
80
70
60
50
200
180
160
140
120
100
80
D1, +25ºC
D1, -40ºC
D1, +85ºC
D2, +25ºC
D2, -40ºC
D2, +85ºC
ILED = 187.5mA, VLED = 3.2V
60
TA = +25ºC
TA = -40ºC
TA = +85ºC
40
20
0
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
0
8
16 24 32 40 48 56 64 72 80 88 96 104112120128
C007
C005
VIN (V)
LED1 Code (#)
Figure 8. Torch LED Efficiency vs. Input Voltage
Figure 9. Torch LED Current vs. Brightness Code
200
198
196
194
192
190
188
186
184
182
180
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
D1, +25ºC
D1, -40ºC
D1, +85ºC
D2, +25ºC
D2, -40ºC
D2, +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
ILED = 1.5A, VLED = 4.5V
2.8
3
3.2 3.4 3.6 3.8
4
4.2 4.4 4.6 4.8
5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C003
C009
VIN (V)
VIN (V)
Figure 10. Torch LED Current Line Regulation,
ILED = 187.1 mA
Figure 11. Inductor Current vs. Input Voltage, CL=1.0A
2
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
2
TA = +25ºC
ILED = 1.5A, VLED = 4.5V
ILED = 1.5A, VLED = 4.5V
TA = -40ºC
1.9
TA = +85ºC
1.8
1.7
1.6
TA = +25ºC
1.5
TA = -40ºC
TA = +85ºC
1.4
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C010
C011
VIN (V)
VIN (V)
Figure 12. Inductor Current vs. Input Voltage, CL=1.3A
Figure 13. Inductor Current vs. Input Voltage, CL=1.6A
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
2.3
2.2
2.1
2
2.6
2.4
2.2
2
ILED = 1.5A, VLED = 4.5V
ILED = 1.5A, VLED = 4.5V
1.9
1.8
1.7
1.6
1.5
1.4
1.8
1.6
1.4
TA = +25ºC
TA = -40ºC
TA = +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C012
C013
VIN (V)
VIN (V)
Figure 14. Inductor Current vs. Input Voltage, CL=1.9A
Figure 15. Inductor Current vs. Input Voltage, CL=2.2A
3
3.4
3.2
3
ILED = 1.5A, VLED = 4.5V
2.8
2.6
2.4
2.2
2
ILED = 1.5A, VLED = 4.5V
2.8
2.6
2.4
2.2
2
1.8
1.6
1.4
TA = +25ºC
TA = -40ºC
TA = +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
1.8
1.6
1.4
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C014
C015
VIN (V)
VIN (V)
Figure 16. Inductor Current vs. Input Voltage, CL=2.5A
Figure 17. Inductor Current vs. Input Voltage, CL=2.8A
3.6
3.6
CL = 1.0A
3.4
3.2
3
ILED = 1.5A, VLED = 4.5V
CL = 1.3A
CL = 1.6A
CL = 1.9A
CL = 2.2A
CL = 2.5A
CL = 2.8A
CL = 3.1A
3.3
3
ILED = 1.5A, VLED = 4.5V
2.7
2.4
2.1
1.8
1.5
1.2
0.9
2.8
2.6
2.4
2.2
2
TA = +25ºC
TA = -40ºC
TA = +85ºC
1.8
1.6
1.4
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C008
VIN (V)
C016
VIN (V)
Figure 18. Inductor Current vs. Input Voltage, CL=3.1A
Figure 19. Inductor Current Limit vs. Input Voltage
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SNVS962 –DECEMBER 2013
TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
3400
3200
3000
2800
2600
2400
2200
2000
1800
1600
1400
1200
1600
1400
1200
1000
800
ILED = 1.5A, ICL = 3.1A, VLED = 4V
CL = 1.0A
CL = 1.3A
CL = 1.6A
CL = 1.9A
CL = 2.2A
CL = 2.5A
CL = 2.8A
CL = 3.1A
TA = +25ºC
600
TA = -40ºC
TA = +85ºC
ILED = 1.5A, VLED = 4V
400
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C018
VIN (V)
C017
VIN (V)
Figure 20. Flash LED Current vs. Input Voltage
in Current Limit
Figure 21. Input Current vs. Input Voltage
0.3
0.29
0.28
0.27
0.26
0.25
0.24
0.23
0.22
1.0000
0.1000
0.0100
0.0010
0.0001
ILED = 1.5A, VLED = 4V
TA = +25ºC
TA = -40ºC
TA = +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
2.8
3
3.2
3.4
3.6
3.8
4
4.2
4.4
4.6
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C029
C020
VIN (V)
VIN (V)
Figure 22. Current Source Headroom vs. Input Voltage
Figure 23. Shutdown Current vs. Input Voltage
14
2
1.8
1.6
1.4
1.2
1
TA = +25ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
12
10
8
TA = -40ºC
TA = +85ºC
6
4
0.8
0.6
0.4
2
0
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C021
C022
VIN (V)
VIN (V)
Figure 24. Standby Current vs. Input Voltage, VEN = 1.8V
Figure 25. Standby Current vs. Input Voltage, VEN = VIN
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
900
850
800
750
700
650
600
550
500
450
4.3
4.25
4.2
TA = +25ºC
TA = -40ºC
TA = +85ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
ILED = 0
4.15
4.1
4.05
4
3.95
3.9
3.85
3.8
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7
C023
C019
VIN (V)
VIN (V)
Figure 26. Input Current vs. Input Voltage in Pass Mode
Figure 27. Frequency vs. Input Voltage
50.0
0.65
0.64
0.63
0.62
0.61
0.6
VNTC = 1.0V
49.5
49.0
48.5
0.59
0.58
0.57
0.56
0.55
48.0
TA = +25ºC
TA = +25ºC
TA = -40ºC
TA = +85ºC
47.5
TA = -40ºC
TA = +85ºC
47.0
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C024
C026
VIN (V)
VIN (V)
Figure 28. NTC Bias Current vs. Input Voltage
Figure 29. NTC Threshold vs. Input Voltage, VNTC = 0.6V
51
50
49
48
47
46
2.35
TA = +25ºC
TA = -40ºC
2.33
TA = +85ºC
2.31
2.29
2.27
2.25
VNTC = 0.5V
VNTC = 1.0V
VNTC = 1.5V
VNTC = 2.0V
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
2.5 2.8 3.1 3.4 3.7
4
4.3 4.6 4.9 5.2 5.5
C025
C027
VIN (V)
VIN (V)
Figure 30. NTC Bias Current vs. Input Voltage
@ Different VNTC
Figure 31. NTC Open Threshold vs. Input Voltage
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
VOUT = 2 V/div
VOUT = 2 V/div
VLED = 2 V/div
IIN = 1 A/div
VLED = 2 V/div
ILED = 1 A/div
IIN = 1 A/div
ILED = 1 A/div
t ± Time Base ± 100 µs/div
t ± Time Base ± 100 µs/div
Figure 32. Flash Ramp-Up
Figure 33. Flash Ramp-Down
VIN = 200 mV/div
VIN = 500 mV/div
VOUT = 200 mV/div
ILED = 100 mA/div
VOUT = 500 mV/div
ILED = 200 mA/div
t ± Time Base ± 40 µs/div
t ± Time Base ± 40 µs/div
Figure 34. Line-step (200mV) During Flash
Figure 35. Line-step (400mV) During Flash
VOUT = 200 mV/div
VOUT = 200 mV/div
VIN = 3.3V
ILED = 1.5A
VIN = 3.6V
ILED = 1.5A
VLED = 200 mV/div
VLED = 200 mV/div
IIN = 20 mA/div
IIN = 20 mA/div
ILED = 10 mA/div
ILED = 10 mA/div
t ± Time Base ± 200 ns/div
t ± Time Base ± 200 ns/div
Figure 36. LED Current Ripple @ ILED = 1.5A, VIN = 3.6V
Figure 37. LED Current Ripple @ ILED = 1.5A, VIN = 3.3V
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
VOUT = 200 mV/div
VOUT = 2 V/div
VIN = 3.3V
ILED = 1 A/div
IFLASH = 1.5A
ILED = 750mA
VLED = 200 mV/div
ITORCH = 187mA
VLED = 2 V/div
IIN = 1 A/div
IIN = 20 mA/div
ILED = 10 mA/div
t ± Time Base ± 200 ns/div
t ± Time Base ± 1 ms/div
Figure 38. LED Current Ripple @ ILED = 750mA, VIN = 3.3V
Figure 39. TX-Mask Event, Default Settings
VTX = 5 V/div
VTX = 5 V/div
IFLASH = 1.5A
IFLASH = 1.5A
ITORCH = 100A
ILED = 1 A/div
ITORCH = 0A
ILED = 1 A/div
IIN = 1 A/div
IIN = 1 A/div
t ± Time Base ± 1 µs/div
t ± Time Base ± 1 µs/div
Figure 40. TX Signal Low-to-High Transition, ITORCH = 0A
Figure 41. TX Signal Low-to-High Transition,
ITORCH = 100mA
VTX = 5 V/div
VIN = 200 mV/div
tFILTER = ¼*tUVLO
IFLASH = 1.5A
ITORCH = 100A
tRAMP = 256µs
IIN = 1 A/div
ILED = 500 mA/div
ILED = 500 mA/div
IIN = 1 A/div
t ± Time Base ± 40 µs/div
t ± Time Base ± 100 µs/div
Figure 42. TX Signal High-to-Low Transition,
ITORCH = 100mA
Figure 43. Input Voltage Flash Monitor, Stop & Hold Mode,
Default settings
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
VIN = 200 mV/div
IIN = 1 A/div
VIN = 200 mV/div
tFILTER = ¼*tUVLO
tRAMP = 256µs
VHYST = 50mV
tFILTER = ¼*tUVLO
tRAMP = 256µs
VHYST = 50mV
IIN = 1 A/div
ILED = 500 mA/div
ILED = 500 mA/div
t ± Time Base ± 100 µs/div
t ± Time Base ± 100 µs/div
Figure 44. Input Voltage Flash Monitor, Down Mode,
Default Settings
Figure 45. Input Voltage Flash Monitor, Up & Down Mode,
Default Settings
VIN = 200 mV/div
VIN = 200 mV/div
tFILTER = ¼*tUVLO
tFILTER = ¼*tUVLO
IIN = 1 A/div
tRAMP = 256µs
VHYST = 0mV
tRAMP = 256µs
IIN = 1 A/div
VHYST = 100mV
ILED = 500 mA/div
ILED = 500 mA/div
t ± Time Base ± 100 µs/div
t ± Time Base ± 100 µs/div
Figure 46. Input Voltage Flash Monitor, Up & Down Mode,
0mV Hysteresis
Figure 47. Input Voltage Flash Monitor, Up & Down Mode,
100mV Hysteresis
VIN = 200 mV/div
VIN = 200 mV/div
tFILTER = 256µs
tRAMP = 256µs
tFILTER = ¼*tUVLO
tRAMP = 512µs
IIN = 1 A/div
VHYST = 50mV
IIN = 1 A/div
VHYST = 50mV
ILED = 500 mA/div
ILED = 500 mA/div
t ± Time Base ± 200 µs/div
t ± Time Base ± 100 µs/div
Figure 48. Input Voltage Flash Monitor, Up & Down Mode,
256µs Filter Time
Figure 49. Input Voltage Flash Monitor, Up & Down Mode,
512µs Flash Ramp Time
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified: TA= 25°C; VIN = 3.6V; VEN = VIN; CIN = 10 µF; COUT = 10 µF; L = 1 µH; LED1 or LED2 Active
VTX = 5 V/div
tFILTER = ¼*tUVLO
tRAMP = 256µs
VIN = 200 mV/div
VHYST = 50mV
VSTROBE = 2 V/div
IIN = 1 A/div
ILED = 1 A/div
ILED = 500 mA/div
t ± Time Base ± 400 µs/div
t ± Time Base ± 20 ms/div
Figure 50. Input Voltage Flash Monitor, Up & Down Mode
with TX Event
Figure 51. Edge-Sensitive Strobe
VSTROBE = 2 V/div
VSTROBE = 2 V/div
ILED = 500 mA/div
ILED = 500 mA/div
t ± Time Base ± 20 ms/div
t ± Time Base ± 20 ms/div
Figure 52. Level-Sensitive Strobe without Timeout
Figure 53. Level-Sensitive Strobe with Timeout
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FUNCTIONAL DESCRIPTION
The LM3646 is a high-power white LED flash driver capable of delivering up to 1.5A (total LED current) into two
parallel LEDs. The device incorporates a 4 MHz constant frequency, synchronous Current-Mode PWM boost
converter, and two high-side current sources to regulate the LED current over the 2.7V to 5.5V input voltage
range.
The LM3646 PWM converter switches and maintains at least VHR across the current sources (LED1 and LED2).
This minimum headroom voltage ensures that the current source remains in regulation. If the input voltage is
above the LED voltage + current source headroom voltage, the device does not switch and turns the PFET on
continuously (Pass Mode). In Pass Mode the difference between (VIN - ILED x RPMOS) and the voltage across the
LED is dropped across the current sources.
The LM3646 has three logic inputs including a hardware Flash Enable (STROBE), a hardware Torch Enable
(TORCH) used for external Torch Mode control, and a Flash Interrupt input (TX) designed to interrupt the flash
pulse during high battery current conditions. All three logic inputs have internal 200 kΩ (typ.) pull-down resistors
to GND.
Additional features of the LM3646 include an internal comparator for LED thermal sensing via an external NTC
thermistor and an input voltage monitor that can reduce the Flash current (during low VIN conditions).
Control of the LM3646 is done via an I2C-compatible interface. This includes adjustment of the Flash and Torch
current levels, current source selection, changing the Flash Timeout Duration, changing the switch current limit,
and enabling the NTC block. Additionally, there are flag and status bits that indicate flash current time-out, LED
over-temperature condition, LED failure (open/short), device thermal shutdown, TX interrupt, and VIN under-
voltage conditions.
Startup (Enabling the Device)
Turn on of the LM3646 Torch and Flash Modes can be done through the Enable Register (0x01). On startup,
when VOUT is less than VIN, the internal synchronous PFET turns on as a current source and delivers 200 mA
(typ.) to the output capacitor. During this time the current source (LED) is off. When the voltage across the output
capacitor reaches 2.2V (typ.) the current source will turn on. At turn-on the current source will step through each
FLASH or TORCH level until the target LED current is reached. This gives the device a controlled turn-on and
limits inrush current from the VIN supply.
Pass Mode
The LM3646 starts up in Pass Mode and stays there until Boost Mode is needed to maintain regulation. In Pass
Mode the boost converter does not switch and the synchronous PFET turns fully on bringing VOUT up to VIN
-
(ILED x RPMOS). In Pass Mode the inductor current is not limited by the peak current limit. In this situation the
output current must be limited to 2A. If the voltage difference between VOUT and VLED falls below VHR, the device
switches to Boost Mode.
Flash Mode
In Flash Mode, the LED current sources (LED1/2) provide 128 target current levels from 0 mA to 1500 mA. The
Flash currents are adjusted via bits[3:0] of the Max LED Current Control Register (0x05) and bits[6:0] of the
LED1 Flash Current Control Register (0x06). Flash Mode is activated by the Enable Register (0x01), or by pulling
the STROBE pin HIGH. Once the Flash sequence is activated the current source (LED) will ramp up to the
programmed Flash current by stepping through all current steps until the programmed current is reached.
While both LED1 and LED2 are capable of delivering 1.5A to the LED, the sum total of the LED current will not
exceed the value stored in the Max LED Current Control Register. LED1 will receive the current value stored in
the LED1 Flash Current Control Register, and LED2 will receive the difference of the value stored in the MAX
LED Current Control Register and LED1 Flash Current Control Register.
If LED1 and LED2 Active:
LED1 = LED1 Flash Current Control Value
LED2 = MAX Flash Current Control Value - LED1 Flash Current Control Value
If MAX Flash Current Control Value < LED1 Flash Current Control Value
LED1 = MAX Flash Current Control Value
LED2 = Off
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If the LED1 Current Control Value is set to a level that is higher than the MAX Flash LED Current Control Value,
LED1 will receive the MAX Flash LED Current Control value, and LED2 will be disabled.
When the part is enabled in Flash Mode through the Enable Register or the STROBE pin, all mode bits in the
Enable Register are cleared after a flash time-out event.
Torch Mode
In Torch Mode, the LED current sources (LED1/2) provide 128 target current levels from 0 mA to 187.5 mA. The
Torch currents are adjusted via bits[6:4] of the Max LED Current Control Register (0x05) and bits[6:0] of the
LED1 Torch Current Control Register (0x07). Torch Mode is activated by the Enable Register (0x01), or by
pulling the TORCH pin HIGH. Once the TORCH sequence is activated the current source (LED) will ramp up to
the programmed Torch current by stepping through all current steps until the programmed current is reached.
LED1 will receive the current value stored in the LED1 Torch Current Control Register, and LED2 will receive the
difference of the value stored in the MAX LED Current Control Register and LED1 Torch Current Control
Register.
If LED1 and LED2 Active:
LED1 = LED1 Torch Current Control Value
LED2 = MAX Torch Current Control Value - LED1 Torch Current Control Value
If MAX Torch Current Control Value < LED1 Torch Current Control Value
LED1 = MAX Torch Current Control Value
LED2 = Off
If the LED1 Torch Current Control Value is set to a level that is higher than the MAX Torch LED Current Control
Value, LED1 will receive the MAX Torch LED Current Control value, and LED2 will be disabled. Torch Mode is
not affected by Flash Timeout.
Power Amplifier Synchronization (TX)
The TX pin is a Power Amplifier Synchronization input. This is designed to reduce the flash LED current and thus
limit the battery current during high battery current conditions such as PA transmit events. When the LM3646 is
engaged in a Flash event and the TX pin is pulled high, the LED current is forced into Torch Mode at the
programmed Torch current setting. If the TX pin is then pulled low before the Flash pulse terminates, the LED
current will return to the previous Flash current level. At the end of the Flash time-out, whether the TX pin is high
or low, the LED current will turn off. The TX input can be disabled by setting bit[3] (TX Enable) to a ‘0’ in the Max
LED Current Control Register (0x05).
Input Voltage Flash Monitor (IVFM)
The LM3646 has the ability to adjust the flash current based upon the voltage level present at the IN pin utilizing
an Input Voltage Flash Monitor. The IVFM block has an adjustable threshold (IVM-D) ranging from 2.9V to 3.2V
in 100 mV steps as well as adjustable hysteresis. The IVFM threshold and hysteresis are controlled by bits[4:3]
and bits[2:1] respectively, in the IVFM Mode Register (0x02). Flags Register1 (0x08) has the IVFM flag (bit[3])
set when the input voltage crosses the IVFM value. The IVFM threshold sets the input voltage boundary that
forces the LM3646 to stop ramping the flash current during startup in Stop and Hold Mode, or to actively adjust
the LED current lower in Down Adjust Mode, or to continuously adjust the LED current up and down in Up &
Down mode.
Stop and Hold Mode (Figure 54): Stops Current Ramp and Holds the level for the remaining flash if VIN crosses
IVM-D Line. Sets IVFM Flag (bit[3] in Flags Register1) upon crossing IVM-D Line.
Down Mode (Figure 55): Adjusts current down if VIN crosses IVM-D Line and stops decreasing once VIN rises
above the IVM-D line + the IVFM hysteresis setting. The LM3646 will decrease the current throughout the flash
pulse anytime the input voltage falls below the IVM-D line, not just once. The flash current will not increase again
until the next flash. Sets IVFM Flag (bit[3] in Flags Register1) upon crossing IVM-D Line.
Up and Down Mode (Figure 56): Adjusts current down if VIN crosses IVM-D Line and adjusts current up if VIN
rises above the IVM-D line + the IVFM hystersis setting. In this mode, the current will continually adjust with the
rising and falling of the input voltage throughout the entire flash pulse. Sets IVFM Flag (bit[3] in Flags Register1)
upon crossing IVM-D Line.
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I
FLASH
I
LED
0 mA
IVM-U
IVM-D
V
IN
t
t
filter
filter
t
Figure 54. IVFM Stop and Hold Mode
I
FLASH
I
LED
0 mA
IVM-U
IVM-D
V
IN
t
t
filter
Figure 55. IVFM Down Mode
I
FLASH
I
LED
0 mA
IVM-U
IVM-D
V
IN
t
t
t
t
filter
filter
filter
Figure 56. IVFM Up and Down Mode
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Fault/Protections
Fault Operation
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Upon entering a fault condition, the LM3646 will set the appropriate flag in the Flags Register1 (0x08) or Flags
Register2 (0x09), and place the part into standby by clearing and locking the Torch Enable bit (bit[7] in LED1
Torch Current Control Register (0x07)) and Mode Bits (M1, M0) in the Enable Register (0x01), until the Flags
Register1 or Flags Register2 is read back via I2C.
Flash Time-Out
The Flash Time-Out period sets the amount of time that the Flash Current is being sourced from the current
source (LED). The LM3646 has 8 timeout levels ranging 50 ms to 400 ms in 50 ms steps. The Flash Time-Out
period is controlled by bits[2:0] in the Flash Timing Register (0x04). Flash Time-Out only applies to the Flash
Mode operation. The mode bits are cleared and bit[0] is set in the Flags Register1 (0x08) upon a Flash Timeout.
Over-Voltage Protection (OVP)
The output voltage is limited to typically 5.0V (see VOVP Spec). In situations such as an open LED, the LM3646
will raise the output voltage in order to try to keep the LED current at its target value. When VOUT reaches 5.0V
(typ.) the over-voltage comparator will trip and turn off the internal NFET. When VOUT falls below the “VOVP Off
Threshold”, the LM3646 will begin switching again. The mode bits are cleared, and the OVP flag will be set
(bit[7] in Flags Register1 (0x08)) when an OVP condition is present for 512 microseconds, preventing momentary
OVP events from forcing the part to shut down.
Current Limit
The LM3646 features 8 selectable inductor current limits ranging from 1.0A to 3.1A in 300 mA steps. The current
limit is programmable through bits[7:5] of the Enable Register (0x01) of the I2C-compatible interface. When the
inductor current limit is reached, the LM3646 terminates the charging phase of the switching cycle.
Since the current limit is sensed in the NMOS switch, there is no mechanism to limit the current when the device
operates in Pass Mode. In Boost Mode or Pass Mode if VOUT falls below 2.3V, the part stops switching, and the
PFET operates as a current source limiting the current to 200 mA. This prevents damage to the LM3646 and
excessive current draw from the battery during output short-circuit conditions. The mode bits are not cleared
upon a Current Limit event, but the OCP flag (bit[4]) in Flags Register1 (0x08) is set.
NTC Thermistor Input (TEMP)
The TEMP pin serves as a threshold detector for negative temperature coefficient (NTC) thermistors. It interrupts
the LED current and sets the NTC TRIP flag bit[6] in Flags Register1 (0x08) when the voltage at TEMP goes
below the programmed threshold. The NTC threshold voltage is adjustable from 200 mV to 900 mV in 100 mV
steps via the NTC and Torch Ramp Register (0x03). The NTC current is set to 50 µA. When an over-temperature
event is detected, the LM3646 will be forced into shutdown. The NTC detection circuitry can be enabled or
disabled via bit[4] of the Enable Register (0x01). If Enabled, the NTC block will turn on and off during the start
and stop of a Flash/Torch event. The mode bits are cleared upon an NTC event.
Additionally, the NTC input will look for an open NTC connection and a short NTC connection. If the NTC input
falls below 100 mV, the NTC short flag will be set (bit[1] in Flags Register2 (0x09)), and the part will be disabled.
If the NTC input rises above 2.3V, the NTC Open flag will be set (bit[0] in Flags Register2), and the part will be
disabled. These fault detections can be individually disabled/enabled via the NTC Open Detect Enable bit[0] in
IVFM Mode Register (0x02) and the NTC Short Fault Enable bit[4] in Flags Register2.
Under-Voltage Lockout (UVLO)
The LM3646 has an internal comparator that monitors the voltage at IN and will force the LM3646 into shutdown
if the input voltage drops to 2.8V. If the UVLO monitor threshold is tripped, the UVLO flag bit[2] will be set in
Flags Register1 (0x08). If the input voltage rises above 2.8V, the LM3646 will not be available for operation until
there is an I2C read command initiated for the Flags Register1. Upon a read, Flags Register1 will be cleared, and
normal operation can resume. This feature can be disabled by writing a ‘0’ to the UVLO Enable bit[7] in the IVFM
Mode Register (0x02). The mode bits are cleared upon a UVLO event.
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Thermal Shutdown (TSD)
When the LM3646’s die temperature reaches +135°C the boost converter shuts down, and the NFET and PFET
turn off, as does the current source (LED). When the thermal shutdown threshold is tripped, a '1' gets written to
bit[5] of Flags Register1 (0x08) (Thermal Shutdown bit), and the LM3646 will go into standby. The LM3646 will
only be allowed to restart after Flags Register1 is read, clearing the fault flag. Upon restart, if the die temperature
is still above +135°C, the LM3646 will reset the Fault flag and re-enter standby. The mode bits are cleared upon
a TSD.
LED and/or VOUT Short Fault
The LED Fault flag (bit[2] or bit[3]) in Flags Register2 (0x09) read back a '1' if the part is active in Flash or Torch
Mode and either LED output experiences a short condition. The Output Short Fault flag (bit[1] in Flags Register1
(0x08)) reads back a '1' if the part is active in Flash or Torch Mode and the boost output experiences a short
condition. An LED short condition is determined if the voltage at LED goes below 500 mV (typ.); VOUT short
condition occurs if the voltage at OUT goes below 2.1V (typ.) while the device is in Torch or Flash Mode. There
is a delay of 256 μs deglitch time before the LED flag is valid and 2.048 ms before the VOUT flag is valid. This
delay is the time between when the Flash or Torch current is triggered, and when the LED voltage and the output
voltage are sampled. The LED and VOUT short flags can only be reset to '0' by removing power to the LM3646,
or by reading back the Flags Register1 or Flags Register2. The mode bits are cleared upon an LED and/or
VOUT short fault.
I2C-Compatible Interface
Data Validity
The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of
the data line can only be changed when SCL is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
valid
data
change
allowed
data
valid
Figure 57. Data Validity Diagram
A pull-up resistor between the controller's VIO line and SDA must be greater than [ (VIO-VOL) / 3mA] to meet the
VOL requirement on SDA. Using a larger pullup resistor results in lower switching current with slower edges, while
using a smaller pullup results in higher switching currents with faster edges.
START and STOP Conditions
START and STOP conditions classify the beginning and the end of the I2C session. A START condition is
defined as the SDA signal transitioning from HIGH to LOW while SCL line is HIGH. A STOP condition is defined
as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C-compatible master always generates
START and STOP conditions. The I2C-compatible bus is considered to be busy after a START condition and free
after a STOP condition. During data transmission, the I2C-compatible master can generate repeated START
conditions. First START and repeated START conditions are equivalent, function-wise.
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 58. Start and Stop Conditions
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Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) transferred first. Each
byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the
master. The master releases the SDA line (HIGH) during the acknowledge clock pulse. The LM3646 pulls down
the SDA line during the 9th clock pulse, signifying an acknowledge. The LM3646 generates an acknowledge
after each byte is received. There is no acknowledge created after data is read from the LM3646.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LM3646 7-bit address is 0x67 (Figure 59). For the eighth bit, a
'0' indicates a WRITE, and a '1' indicates a READ. The second byte selects the register to which the data will be
written. The third byte contains data to write to the selected register.
ack from slave
ack from slave
ack from slave
start msb Chip Address lsb
w
ack
msb Register Add lsb
ack
msb DATA lsb ack stop
SCL
SDA
start
Id = 67h
w
ack
addr = 01h
ack
Data = 03h
ack stop
w = write (SDA = "0") , r = read (SDA = "1") , ack = acknowledge (SDA pulled down by either master or slave), id =
chip address, 67h for LM3646
Figure 59. Write Cycle for the LM3646
I2C-Compatible Chip Address
The device address for the LM3646 is 1100111 (67). After the START condition, the I2C-compatible master
sends the 7-bit address followed by an eighth read or write bit (R/W). R/W = 0 indicates a WRITE and R/W = 1
indicates a READ. The second byte following the device address selects the register address to which the data
will be written. The third byte contains the data for the selected register.
MSB
LSB
1
Bit 7
1
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
1
Bit 2
1
Bit 1
R/W
Bit 0
2
I C Slave Address (chip address)
Figure 60. I2C-Compatible Device Address for LM3646
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Register Descriptions
Table 2. LM3646 Internal Registers
Register Name
Internal Hex Address
Power On/RESET Value(1)
SILICON REVISION REGISTER
ENABLE REGISTER
0x00
0x01
0x02
0x03
0x04
0x05
0x11
0xE0
0xA4
0x20
0x42
0x7F
0x7F
0x7F
0x00
0x30
IVFM MODE REGISTER
NTC AND TORCH RAMP REGISTER
FLASH TIMING REGISTER
MAX LED CURRENT CONTROL REGISTER
LED1 FLASH CURRENT CONTROL REGISTER
LED1 TORCH CURRENT CONTROL REGISTER
FLAGS REGISTER1
0x06
0x07
0x08
0x09
FLAGS REGISTER2
(1) All unused bits are internally pulled HIGH.
Silicon Revision Register (0x00)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU
Chip ID Current Value = '010'
Silicon Revision Current Value = '001'
Enable Register (0x01)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Inductor Current Limit
NTC Enable
TX Pin Enable
Soft-Start Enable
LED Mode Bits: M1, M0
000 = 1.0A
001 = 1.3A
010 = 1.6A
0 = Disabled
(default)
1 = Enabled
0 = Disabled
(default)
1 = Enabled
Enable 0 = Disabled
(default)
00 = Standby (default)
01 = Standby
10 = Torch
1 = Enabled
011 = 1.9A
11 = Flash
100 = 2.2A
101 = 2.5A
110 = 2.8A
111 = 3.1A (default)
NTC Enable
TX Pin EN
Enables or Disables the NTC detection block when the LM3646 is enabled
Enables the TX pin and TX current reduction function
Enables the Pass-Mode startup sequence
Soft-Start EN
LED Mode Bits (M1, M0)
00–Standby
01–Standby
10–Torch
Off
Off
²
Sets Torch Mode. If Torch EN = 0, Torch will start after I C-compatible command.
²
11–Flash
Sets Flash Mode. If Strobe EN = 0, Flash will start after I C-compatible command.
IVFM Mode Register (0x02)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
UVLO
IVFM Filter
IVFM Enable
IVFM Level Adjust Threshold
IVFM Mode/Hysteresis
NTC Open
Enable(2.8V)
Fault Enable
0 = Disabled
1 = Enabled
(default)
0 = 4 µs
(default)
1 = 256 µs
0 = Disabled
1 = Enabled
(default)
00 = 2.9V (default)
01 = 3.0V
00 = Ramp and Hold
01 = 0mV Hyst
10 = 50 mV Hyst (default)
11 = 100 mV Hyst
0 = Disabled
(default)
1 = Enabled
10 = 3.1V
11 = 3.2V
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Bit 0
NTC and Torch Ramp Register (0x03)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Boost Mode
NTC Trip Thresholds
Torch Current Ramp Times
00 = Automatic (default)
01 = Force Pass-Mode
10 = Force Boost-Mode
11 = Automatic
000 = 200 mV
001 = 300 mV
010 = 400 mV
000 = Ramp Disabled (default)
001 = 16 ms
010 = 32 ms
011 = 64 ms
011 = 500 mV
100 = 600 mV (default)
101 = 700 mV
100 = 128 ms
101 = 256 ms
110 = 800 mV
110 = 512 ms
111 = 900 mV
111 = 1024 ms
V
IN
NTC Control Block
I
NTC
TEMP
-
+
Control
Logic
V
TRIP
NTC
Figure 61. NTC Control Block
The TEMP node is connected to an NTC resistor as shown in Figure 61 above. A constant current source from
the input is connected to this node. Any change in the voltage because of a change in the resistance of the NTC
resistor is compared to a set VTRIP. The trip thresholds are selected by Bits[5:3] of the NTC and Torch Ramp
Register.
Flash Timing Register (0x04)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
IVFM Modulation Strobe Usage
Flash Ramp Time
Flash Time-Out Time
0 = Down Adjust
(default)
1 = Up/Down
Adjust
0 = Level
1 = Edge
(default)
000 = 256 µs (default)
001 = 512 µs
000 = 50 ms
001 = 100 ms
010 = 150 ms (default)
011 = 200 ms
010 = 1.024 ms
011 = 2.048 ms
100 = 4.096 ms
101 = 8.192 ms
110 = 16.384 ms
111 = 32.768 ms
100 = 250 ms
101 = 300 ms
110 = 350 ms
111 = 400 ms
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Max LED Current Control Register (0x05)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
LED Short Fault
Enable
Max Torch Current
Max Flash Current
0 = Down Adjust
(default)
1 = Up/Down Adjust
000 = 23.04 mA
001 = 46.48 mA
010 = 69.91 mA
011 = 93.35 mA
100 = 116.79 mA
101 = 140.23 mA
110 = 163.66 mA
0000 = 93.35 mA
0001 = 187.10 mA
0010 = 280.85 mA
0011 = 374.60 mA
0100 = 468.35 mA
0101 = 562.10 mA
0110 = 655.85 mA
0111 = 749.60 mA
1000 = 843.35 mA
1001 = 937.10 mA
1010 = 1030.85 mA
1011 = 1124.60 mA
1100 = 1218.35 mA
1101 = 1312.10 mA
1110 = 1405.85 mA
1111 = 1499.60 mA (default)
111 = 187.10 mA (default)
If LED1 and LED2 Active:
LED2 = MAX Current Control Value - LED1 Current Control Value
If MAX Current Control Value < LED1 Current Control Value
LED1 = MAX Current Control Value
LED2 = Off
LED1 Flash Current Control Register (0x06)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
LED1 Flash Current Level
Bit 2
Bit 1
Bit 0
Strobe Pin Enable
Bit
0 = Disabled
(default)
0x00= 0 mA, LED1 Disabled, LED2 = Max Flash Current
0x01 = 23.04 mA
1 = Enabled
0x02 = 34.76 mA
0x03 = 46.48 mA
0x04 = 58.19 mA
. . .
0x7D = 1476.16 mA
0x7E = 1487.88 mA
0x7F = 1499.60 mA, LED2 Disabled (default)
LED1 Torch Current Control Register (0x07)
LED1 TORCH CURRENT CONTROL REGISTER (0x07)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Torch Pin Enable
Bit
LED1 Torch Current Level
0 = Disabled
(default)
1 = Enabled
0x00= 0 mA, LED1 Disabled, LED2 = Max Torch Current
0x01 = 2.53 mA
0x02 = 3.99 mA
0x03 = 5.46 mA
0x04 = 6.92 mA
. . .
0x7D = 184.17 mA
0x7E = 185.64 mA
0x7F = 187.10 mA, LED2 Disabled (default)
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Bit 0
Flags Register1 (0x08)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
OVP
0 = Default
NTC TRIP
0 = Default
THERMAL
SHUTDOWN
OCP
0 = Default
IVFM
0 = Default
UVLO
0 = Default
VOUT SHORT
FAULT
FLASH
TIMEOUT
0 = Default
0 = Default
0 = Default
OVP Fault
Over-Voltage Protection tripped. Open Output capacitor or open LED.
NTC Threshold crossed.
NTCTrip Fault
Thermal Shutdown Fault
Over-Current Protection Event Flag
IVFM Flag
LM3646 Die temperature reached thermal shutdown value.
Inductor Current limit value was reached.
IVFM block adjusted LED current.
UVLO Fault
UVLO Threshold crossed.
VOUT Short Fault
Time-Out Flag
VOUT Short detected.
Flash Time-Out detected.
Note: Faults require an I2C read-back of the “Flags Register” to resume operation. Flags report an event occurred, but do not
inhibit future functionality. A read-back of the Flags Register will only get updated again if the fault or flag is still present upon a
restart.
Flags Register2 (0x09)
Bit 7
RFU
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SOFTWARE
RESET Bit
Fault
Shutdown
NTC Short
Fault Enable
LED2 Short
Fault
LED1 Short
Fault
NTC Short
Flag
NTC Open Flag
Enable
0 = Normal
Operation
(Default)
0 = Disabled
1 = Enabled
(default)
0 = Disabled
1 = Enabled
(default)
0 = Default
0 = Default
0 = Default
0 = Default
1 = RESET
Software Reset Bit
Writing to this bit resets the LM3646 to the default power up conditions. This bit self-clears upon assertion.
Fault Shutdown Enable
When Enabled, faults will force the LM3646 to shutdown. When disabled, faults will not force the LM3646 to
shutdown. The LM3646 protection mechanisms will remain active until the part is manually disabled via the I2C
bus.
NTC Short Fault Enable When enabled, NTC Short faults will be detected and reported. When disabled, NTC Short faults will not be
detected or reported.
LED2 Short Fault
LED1 Short Fault
NTC Short Fault
NTC Open Fault
Set to a '1' if LED2 is shorted.
Set to a '1' if LED1 is shorted.
The NTC Short Flag is set if the NTC pin voltage crosses below 100 mV during operation.
The NTC Open Flag is set if the NTC pin voltage crosses above 2.3V during operation.
Note: An I2C readback of the Flags Register2 will clear both the NTC Open and NTC Short Flags.
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Strobe Controlled Flash Start and
Stop Delay Times
I2C Controlled Flash Start and Stop
Delay Times
I2C
Bus
STROBE
I2C Flash
I2C Stop
I
I
LED
LED
t
t
a
b
t
d
t
c
External Indicator Start and Stop
Delay Times
Using Torch Pin
TX event ± Start and Stop
Delay Times
TX
TORCH
EDGE TRIG
STROBE
I
LED
t
t
f
I
e
LED
t
g
t
h
Flash time-out
Figure 62. Control Logic Delays
Delay
Explanation
Time
560 µs
120 µs
560 µs
8 µs
ta
tb
tc
td
te
tf
Time for the LED current to start ramping up after an I2C Write command.
Time for the LED current to start ramping down after an I2C Stop command.
Time for the LED current to start ramping up after the STROBE pin is raised high.
Time for the LED current to start ramping down after the STROBE pin is pulled low.
Time for the LED current to start ramping up after the TORCH pin is raised high.
Time for the LED current to start ramping down after the TORCH pin is pulled low.
Time for the LED current to start ramping down after the TX pin is pulled high.
560 µs
8 µs
tg
3 µs
Time for the LED current to start ramping up after the TX pin is pulled low, provided the part has not timed
out in flash mode.
th
2 µs
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APPLICATION INFORMATION
Output Capacitor Selection
The LM3646 is designed to operate with at least a 10 µF ceramic output capacitor. When the boost converter is
running, the output capacitor supplies the load current during the boost converter's on-time. When the NMOS
switch turns off, the inductor energy is discharged through the internal PMOS switch, supplying power to the load
and restoring charge to the output capacitor. This causes a sag in the output voltage during the on-time and a
rise in the output voltage during the off-time. The output capacitor is therefore chosen to limit the output ripple to
an acceptable level depending on load current and input/output voltage differentials and also to ensure the
converter remains stable.
For proper operation the output capacitor must be at least a 10 µF ceramic. Larger capacitors such as a 22 µF or
capacitors in parallel can be used if lower output voltage ripple is desired. To estimate the output voltage ripple
considering the ripple due to capacitor discharge (ΔVQ) and the ripple due to the capacitor's ESR (ΔVESR), use
the following equations:
For continuous conduction mode, the output voltage ripple due to the capacitor discharge is:
(
)
ILED x VOUT - V
IN
'VQ =
fSW x VOUT x COUT
(1)
The output voltage ripple due to the output capacitor's ESR is found by:
ILED x VOUT
·
¹
§
©
+'IL
'VESR = RESR
x
VIN
where
(
)
x VOUT - V
IN
V
IN
'IL =
2x fSW x L x VOUT
(2)
In ceramic capacitors the ESR is very low so a close approximation is to assume that 80% of the output voltage
ripple is due to capacitor discharge and 20% from ESR. Table 3 lists different manufacturers for various output
capacitors and their case sizes suitable for use with the LM3646.
Input Capacitor Selection
Choosing the correct size and type of input capacitor helps minimize the voltage ripple caused by the switching
of the LM3646’s boost converter, and reduces noise on the boost converter's input terminal that can feed through
and disrupt internal analog signals. In the Typical Application Circuit a 10 µF ceramic input capacitor works well.
It is important to place the input capacitor as close as possible to the LM3646’s input (IN) terminal. This reduces
the series resistance and inductance that can inject noise into the device due to the input switching currents.
Table 3 lists various input capacitors that are recommended for use with the LM3646.
Table 3. Recommended Input/Output Capacitors (X5R Dielectric)
Manufacturer
TDK Corporation
TDK Corporation
TDK Corporation
Murata
Part Number
C1608JB0J106M
Value
10 µF
10 µF
22 µF
10 µF
22 µF
Case Size
Voltage Rating
0603 (1.6 mm × 0.8 mm × 0.8 mm)
0805 (2.0 mm × 1.25 mm × 1.25 mm)
0805 (2.0 mm × 1.25 mm ×1.25 mm)
0805 (2.0 mm × 1.25 mm × 1.25 mm)
0805 (2.0 mm × 1.25 mm × 1.25 mm)
6.3V
10V
6.3V
10V
6.3V
C2012JB1A106M
C2012JB0J226M
GRM21BR61A106KE19
GRM21BR60J226ME39L
Murata
Inductor Selection
The LM3646 is designed to use a 1 µH or 2.2 µH inductor. Table 4 lists various inductors and their
manufacturers that can work well with the LM3646. When the device is boosting (VOUT > VIN) the inductor will
typically be the largest area of efficiency loss in the circuit. Therefore, choosing an inductor with the lowest
possible series resistance is important. Additionally, the saturation rating of the inductor should be greater than
the maximum operating peak current of the LM3646. This prevents excess efficiency loss that can occur with
inductors that operate in saturation and prevents over-heating of the inductor and further efficiency loss. For
proper inductor operation and circuit performance ensure that the inductor saturation and the peak current limit
setting of the LM3646 is greater than IPEAK in the following calculation:
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( )
IN x VOUT - V
IN
ILOAD VOUT
V
IPEAK
=
x
+'IL
where
'IL =
K
V
2 x fSW x L x VOUT
IN
(3)
where ƒSW = 4 MHz, and efficiency can be found in the TYPICAL CHARACTERISTICS plots.
Table 4. Recommended Inductors
Manufacturer
TOKO
L
Part Number
1286AS-H-1R0N
Dimensions (L×W×H)
2.0 mm × 1.6 mm × 1.2 mm
2.0 mm × 1.6 mm × 1.0 mm
2.0 mm × 1.6 mm × 1.0 mm
ISAT
RDC
1 µH
1 µH
1 µH
3.1A
2.7A
2.9A
68 mΩ
80 mΩ
60 mΩ
TOKO
1285AS-H-1R0M
TDK
TFM201610G-1R0M-T05
NTC Thermistor Selection
The TEMP pin is a comparator input for flash LED thermal sensing. NTC Mode is intended to monitor an external
thermistor which monitors LED temperature and prevents LED overheating. An internal comparator checks the
voltage on the TEMP pin against the trip point programmed in the NTC and Torch Ramp Register (0x03). The
thermistor is driven by an internally regulated current source, and the voltage on the TEMP pin is related to the
source current and the NTC resistance. NTC thermistors have a temperature to resistance relationship of:
1
1
§
·
-
E
T °C+273 298
©
¹
( )
R T = R25°C x e
(4)
where β is given in the thermistor datasheet and R25°C is the thermistor's value at +25°C.
Layout Recommendations
The high switching frequency and large switching currents of the LM3646 make the choice of layout important.
The following steps should be used as a reference to ensure the device is stable and maintains proper LED
current regulation across its intended operating voltage and current range.
1. Place CIN on the top layer (same layer as the LM3646) and as close to the device as possible. The input
capacitor conducts the driver currents during the low-side MOSFET turn-on and turn-off and can see current
spikes over 1A in amplitude. Connecting the input capacitor through short, wide traces to both the IN and
GND terminals will reduce the inductive voltage spikes that occur during switching and which can corrupt the
VIN line.
2. Place COUT on the top layer (same layer as the LM3646) and as close as possible to the OUT and GND
terminals. The returns for both CIN and COUT should come together at one point, as close to the GND pin as
possible. Connecting COUT through short, wide traces will reduce the series inductance on the OUT and GND
terminals that can corrupt the OUT and GND lines and cause excessive noise in the device and surrounding
circuitry.
3. Connect the inductor on the top layer close to the SW pin. There should be a low-impedance connection
from the inductor to SW due to the large DC inductor current, and at the same time, the area occupied by the
SW node should be small to reduce the capacitive coupling of the high dV/dt present at SW that can couple
into nearby traces.
4. Avoid routing logic traces near the SW node to avoid any capacitively coupled voltages from SW onto any
high impedance logic lines such as TORCH, STROBE, ENABLE, TEMP, TX, SDA and SCL. A good
approach is to insert an inner layer GND plane underneath the SW node and between any nearby routed
traces. This creates a shield from the electric field generated at SW.
5. Terminate the Flash LED cathodes directly to the GND pin of the LM3646. If possible, route the LED returns
with a dedicated path to keep the high amplitude LED currents out of the GND plane. For Flash LEDs that
are routed relatively far away from the LM3646, a good approach is to sandwich the forward and return
current paths over the top of each other on two layers. This will help in reducing the inductance of the LED
current paths.
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM3646YFQR
ACTIVE
DSBGA
YFQ
20
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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5-Feb-2014
Addendum-Page 2
MECHANICAL DATA
YFQ0020
D
0.600±0.075
E
TMD20XXX (Rev D)
D: Max = 2.04 mm, Min = 1.98 mm
E: Max = 1.64 mm, Min = 1.58 mm
4215083/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
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