LM358PSRE4 [TI]
DUAL OPERATIONAL AMPLIFIERS; 双运算放大器
| 型号： | LM358PSRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL OPERATIONAL AMPLIFIERS |
| 文件： | 总32页 (文件大小：1216K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
LM158, LM158A . . . JG PACKAGE
LM258, LM258A . . . D, DGK, OR P PACKAGE
LM358 . . . D, DGK, P, PS, OR PW PACKAGE
LM358A . . . D, DGK, P, OR PW PACKAGE
LM2904 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
D
Wide Supply Range:
− Single Supply . . . 3 V to 32 V
(26 V for LM2904)
− or Dual Supplies . . . + 1.5 V to + 16 V
(+ 13 V for LM2904)
D
D
Low Supply-Current Drain, Independent of
Supply Voltage . . . 0.7 mA Typ
1OUT
1IN−
1IN+
GND
VCC
1
2
3
4
8
7
6
5
2OUT
2IN−
2IN+
Common-Mode Input Voltage Range
Includes Ground, Allowing Direct Sensing
Near Ground
D
Low Input Bias and Offset Parameters:
− Input Offset Voltage . . . 3 mV Typ
A Versions . . . 2 mV Typ
LM158, LM158A . . . FK PACKAGE
(TOP VIEW)
− Input Offset Current . . . 2 nA Typ
− Input Bias Current . . . 20 nA Typ
A Versions . . . 15 nA Typ
3
2
1
20 19
18
NC
NC
1IN−
NC
1IN+
NC
4
5
6
7
8
D
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 32 V
(26 V for LM2904)
17
16
15
14
2OUT
NC
2IN−
NC
D
D
Open-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
9 10 11 12 13
Internal Frequency Compensation
description/ordering information
NC − No internal connection
These devices consist of two independent,
high-gain frequency-compensated operational
amplifiers designed to operate from a single
supply over a wide range of voltages. Operation from split supplies also is possible if the difference between
the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and V is at least 1.5 V more positive than the
CC
input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply
voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,
these devices can be operated directly from the standard 5-V supply used in digital systems and easily can
provide the required interface electronics without additional 5-V supplies.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2010, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
unless otherwise noted. On all other products, production
testing of all parameters.
processing does not necessarily include testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
{
ORDERING INFORMATION
MAX
TESTED
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
}
T
A
PACKAGE
AT 25°C
V
CC
PDIP (P)
Tube of 50
Tube of 75
LM358P
LM358P
LM358D
Reel of 2500
Reel of 2500
Reel of 2000
Tube of 150
Reel of 2000
Reel of 2000
LM358DR
SOIC (D)
SOP (PS)
LM358
L358
LM358DRG3
LM358PSR
LM358PW
7 mV
30 V
LM358PWR
LM358PWRG3
LM358DGKR
LM358AP
TSSOP (PW)
L358
0°C to 70°C
§
MSOP/VSSOP (DGK) Reel of 2500
M5_
PDIP (P)
Tube of 50
LM358AP
LM358A
Tube of 75
LM358AD
SOIC (D)
Reel of 2500
Tube of 150
Reel of 2000
LM358ADR
LM358APW
LM358APWR
LM358ADGKR
LM258P
3 mV
30 V
TSSOP (PW)
L358A
§
MSOP/VSSOP (DGK) Reel of 2500
M6_
PDIP (P)
Tube of 50
Tube of 75
Reel of 2500
Reel of 2500
LM258P
LM258D
LM258DR
5 mV
3 mV
30 V
30 V
SOIC (D)
LM258
LM258DRG3
LM258DGKR
LM258AP
§
MSOP/VSSOP (DGK) Reel of 2500
M2_
−25°C to 85°C
PDIP (P)
Tube of 50
Tube of 75
Reel of 2500
LM258AP
LM258A
LM258AD
SOIC (D)
LM258ADR
LM258ADGKR
LM2904P
§
MSOP/VSSOP (DGK) Reel of 2500
M3_
PDIP (P)
Tube of 50
LM2904P
Tube of 75
LM2904D
Reel of 2500
Reel of 2500
Reel of 2000
Tube of 150
Reel of 2000
Reel of 2000
LM2904DR
LM2904DRG3
LM2904PSR
LM2904PW
LM2904PWR
LM2904PWRG3
LM2904DGKR
LM2904VQDR
LM2904VQPWR
LM2904AVQDR
LM2904AVQPWR
LM158JG
SOIC (D)
SOP (PS)
LM2904
L2904
7 mV
26 V
−40°C to 125°C
TSSOP (PW)
L2904
§
MSOP/VSSOP (DGK) Reel of 2500
MB_
SOIC (D)
Reel of 2500
Reel of 2000
Reel of 2500
Reel of 2000
Tube of 50
Tube of 55
Tube of 50
Tube of 55
L2904V
7 mV
2 mV
5 mV
2 mV
32 V
32 V
30 V
30 V
TSSOP (PW)
SOIC (D)
L2904V
L2904AV
L2904AV
LM158JG
LM158FK
LM158AJG
LM158AFK
TSSOP (PW)
CDIP (JG)
LCCC (FK)
CDIP (JG)
LCCC (FK)
LM158FK
−55°C to 125°C
LM158AJG
LM158AFK
†
‡
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
§
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
symbol (each amplifier)
IN+
IN−
+
−
OUT
schematic (each amplifier)
V
CC+
≈6-µA
Current
≈6-µA
Current
≈100-µA
Current
Regulator
Regulator
Regulator
OUT
IN−
IN+
≈50-µA
Current
Regulator
GND (or V
)
CC−
To Other Amplifier
COMPONENT COUNT
Epi-FET
Diodes
1
2
Resistors
Transistors
Capacitors
7
51
2
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
LM158, LM158A
LM258, LM258A
LM358, LM358A
LM2904V
LM2904
UNIT
Supply voltage, V (see Note 1)
16 or 32
32
13 or 26
26
V
V
V
CC
Differential input voltage, V (see Note 2)
ID
Input voltage, V (either input)
−0.3 to 32
−0.3 to 26
I
Duration of output short circuit (one amplifier) to ground
Unlimited
Unlimited
at (or below) 25°C free-air temperature (V ≤ 15 V) (see Note 3)
CC
D package
97
172
97
172
85
DGK package
P package
85
Package thermal impedance, q (see Notes 4 and 5)
°C/W
JA
PS package
PW package
FK package
JG package
LM158, LM158A
LM258, LM258A
LM358, LM358A
LM2904
95
95
149
149
5.61
Package thermal impedance, q (see Notes 6 and 7)
°C/W
°C
JC
14.5
−55 to 125
−25 to 85
0 to 70
−40 to 125
150
Operating free-air temperature range, T
A
−40 to 125
150
Operating virtual junction temperature, T
°C
°C
°C
°C
J
Case temperature for 60 seconds
FK package
JG package
260
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds
300
300
Storage temperature range, T
−65 to 150
−65 to 150
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and V specified for measurement of I , are with respect to the network ground
CC
OS
terminal.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to V can cause excessive heating and eventual destruction.
CC
4. Maximum power dissipation is a function of T (max), q , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/q . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of T (max), q , and T . The maximum allowable power dissipation at any allowable case
J
JC
C
temperature is P = (T (max) − T )/q . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
C
JC
J
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM158
LM258
LM358
†
‡
PARAMETER
TEST CONDITIONS
T
A
UNIT
§
§
MIN
TYP
MAX
MIN
TYP
MAX
V
V
V
= 5 V to MAX,
25°C
3
5
3
7
CC
V
IO
Input offset voltage
mV
= V
,
IC
O
ICR(min)
Full range
7
9
= 1.4 V
Average temperature
coefficient of
input offset voltage
Full range
7
2
7
2
µV/°C
nA
aVIO
25°C
30
50
I
IO
Input offset current
V
= 1.4 V
= 1.4 V
O
Full range
100
150
Average temperature
coefficient of
input offset current
Full range
10
10
pA/°C
nA
aIIO
25°C
−20 −150
−300
−20 −250
−500
I
IB
Input bias current
V
V
O
Full range
0 to
0 to
25°C
V
− 1.5
V
− 1.5
CC
CC
Common-mode
input voltage range
V
ICR
= 5 V to MAX
V
V
CC
0 to
0 to
Full range
V
V
− 2
V
V
− 2
CC
CC
R ≥ 2 kΩ
25°C
25°C
− 1.5
− 1.5
L
CC
CC
R
≥ 10 kΩ
L
High-level
output voltage
V
OH
R = 2 kΩ
Full range
26
26
L
V
CC
= MAX
R
≥ 10 kΩ Full range
27
28
27
28
L
Low-level
output voltage
V
A
R
V
≤ 10 kΩ
Full range
5
20
5
20
mV
V/mV
dB
OL
L
Large-signal
differential
voltage amplification
= 15 V,
25°C
50
25
100
25
15
100
CC
V
O
= 1 V to 11 V,
≥ 2 kΩ
= 5 V to MAX,
VD
Full range
R
L
Common-mode
rejection ratio
V
CC
CMRR
25°C
25°C
70
65
80
65
65
80
V
IC
= V
ICR(min)
Supply-voltage
rejection ratio
k
V
CC
= 5 V to MAX
100
100
dB
dB
SVR
(∆V /∆V
)
IO
DD
V
/V
Crosstalk attenuation f = 1 kHz to 20 kHz
25°C
25°C
120
−30
120
−30
O1 O2
V
V
V
= 15 V,
= 1 V,
= 0
−20
−10
10
−20
−10
10
CC
Source
ID
O
Full range
I
O
Output current
Output current
mA
V
V
V
= 15 V,
= −1 V,
= 15 V
25°C
20
20
CC
Sink
ID
O
Full range
5
5
I
I
V
ID
= −1 V, V = 200 mV
25°C
12
30
40
0.7
1
12
30
40
0.7
1
µA
O
O
Short-circuit
output current
V
V
at 5 V, GND at −5 V,
= 0
CC
25°C
60
1.2
2
60
1.2
2
mA
OS
O
V
V
= 2.5 V, No load
Full range
Full range
O
Supply current
(two amplifiers)
I
mA
= MAX, V = 0.5 V,
CC
CC
O
No load
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V for
CC
testing purposes is 26 V for the LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
‡
§
All typical values are at T = 25°C.
A
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM2904
†
‡
PARAMETER
TEST CONDITIONS
T
A
UNIT
§
MIN
TYP
MAX
7
25°C
Full range
25°C
3
1
Non-A devices
A-suffix devices
V
V
V
= 5 V to MAX,
CC
10
2
= V
,
V
IO
Input offset voltage
mV
IC
O
ICR(min)
= 1.4 V
Full range
4
Average temperature coefficient
of input offset voltage
aVIO
Full range
7
2
µV/°C
25°C
Full range
25°C
50
300
50
Non-V device
V-suffix device
I
IO
Input offset current
V
= 1.4 V
= 1.4 V
nA
O
2
Full range
150
Average temperature coefficient
of input offset current
aIIO
Full range
10
pA/°C
25°C
−20 −250
−500
I
IB
Input bias current
V
V
nA
O
Full range
0 to
25°C
V
V
− 1.5
CC
Common-mode input voltage
range
V
ICR
= 5 V to MAX
V
V
CC
0 to
Full range
− 2
CC
R
≥ 10 kΩ
25°C
Full range
Full range
Full range
Full range
Full range
25°C
V
CC
− 1.5
L
R = 2 kΩ
L
22
V
CC
= MAX,
Non-V device
R
≥ 10 kΩ
23
26
27
24
28
V
V
High-level output voltage
Low-level output voltage
L
OH
R = 2 kΩ
L
V
CC
= MAX,
V-suffix device
R
≥ 10 kΩ
L
R
≤ 10 kΩ
5
20
mV
OL
L
25
15
50
65
100
Large-signal differential
voltage amplification
V
CC
= 15 V, V = 1 V to 11 V,
O
A
VD
V/mV
R
≥ 2 kΩ
L
Full range
25°C
Non-V device
80
80
V
V
= 5 V to MAX,
CC
CMRR
Common-mode rejection ratio
Supply-voltage rejection ratio
dB
dB
= V
IC
ICR(min)
V-suffix device
25°C
k
V
CC
= 5 V to MAX
25°C
65
100
SVR
(∆V /∆V
)
IO
DD
V
/V
O1 O2
Crosstalk attenuation
f = 1 kHz to 20 kHz
25°C
25°C
120
−30
dB
mA
mA
−20
−10
V
V
= 15 V,
= 1 V, V = 0
CC
Source
Sink
ID
O
Full range
V
V
V
= 15 V,
= −1 V,
= 15 V
25°C
10
5
20
mA
mA
CC
I
O
Output current
ID
O
Full range
Non-V device
V-suffix device
25°C
25°C
30
40
40
0.7
1
V
V
= −1 V,
= 200 mV
ID
O
µA
mA
mA
12
I
I
Short-circuit output current
V
V
V
at 5 V, GND at −5 V, V = 0
25°C
60
1.2
2
OS
CC
O
= 2.5 V, No load
Full range
Full range
O
Supply current (two amplifiers)
CC
= MAX, V = 0.5 V, No load
CC
O
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V for
CC
testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others.
Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
‡
§
All typical values are at T = 25°C.
A
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM158A
LM258A
†
‡
PARAMETER
TEST CONDITIONS
T
A
UNIT
§
§
MIN
TYP
MAX
MIN
TYP
MAX
V
V
V
= 5 V to 30 V,
25°C
2
2
3
CC
V
IO
Input offset voltage
mV
= V
,
IC
O
ICR(min)
Full range
4
4
= 1.4 V
Average
temperature
coefficient of
input offset voltage
*
aVIO
Full range
7
2
15
7
2
15 µV/°C
25°C
10
30
15
nA
30
I
IO
Input offset current
V
= 1.4 V
= 1.4 V
O
Full range
Average
temperature
coefficient of
input offset current
aIIO
Full range
10
200
10
200 pA/°C
25°C
−15
−50
−15
−80
nA
I
IB
Input bias current
V
V
O
Full range
−100
−100
0 to
0 to
25°C
V
− 1.5
V
− 1.5
CC
CC
Common-mode
input voltage range
V
ICR
= 30 V
V
V
CC
0 to
0 to
Full range
V
CC
− 2
V
CC
− 2
R ≥ 2 kΩ
25°C
V
CC
− 1.5
V
CC
− 1.5
L
High-level
output voltage
R = 2 kΩ
Full range
26
26
V
V
A
L
OH
V
CC
= 30 V
R
≥ 10 kΩ Full range
27
28
5
27
28
5
L
Low-level
output voltage
R
V
≤ 10 kΩ
Full range
20
20
mV
V/mV
dB
OL
L
Large-signal
differential
voltage amplification R ≥ 2 kΩ
Common-mode
rejection ratio
= 15 V,
= 1 V to 11 V,
25°C
50
25
100
50
25
100
CC
V
O
VD
Full range
L
CMRR
25°C
25°C
70
65
80
70
65
80
Supply-voltage
rejection ratio
k
100
100
dB
SVR
(∆V /∆V
)
IO
DD
Crosstalk
attenuation
V
/V
O1 O2
f = 1 kHz to 20 kHz
25°C
25°C
120
−30
120
−30
dB
V
V
V
= 15 V,
= 1 V,
= 0
−20
−10
10
−60
−20
−10
10
−60
CC
Source
ID
O
Full range
mA
I
O
Output current
V
V
V
= 15 V,
= −1 V,
= 15
25°C
20
20
CC
Sink
ID
O
Full range
5
5
V
= −1 V, V = 200 mV
25°C
12
30
40
0.7
1
12
30
40
0.7
1
µA
ID
O
Short-circuit output
current
V
V
at 5 V, GND at −5 V,
= 0
CC
I
I
25°C
60
1.2
2
60
1.2
2
mA
OS
O
V
V
= 2.5 V, No load
Full range
Full range
O
Supply current (two
amplifiers)
mA
= MAX, V = 0.5 V,
CC
CC
O
No load
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V for
CC
testing purposes is 26 V for LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
‡
§
All typical values are at T = 25°C.
A
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM358A
†
‡
PARAMETER
TEST CONDITIONS
T
A
UNIT
§
MIN
TYP
MAX
25°C
2
3
5
V
V
= 5 V to 30 V,
CC
V
IO
Input offset voltage
mV
= V
, V = 1.4 V
IC
ICR(min)
O
Full range
Average temperature coefficient of
input offset voltage
aVIO
Full range
7
2
20 µV/°C
25°C
30
I
IO
Input offset current
V
O
= 1.4 V
nA
Full range
75
Average temperature coefficient of
input offset current
aIIO
Full range
10
300 pA/°C
25°C
−15 −100
−200
I
Input bias current
V
V
= 1.4 V
nA
V
IB
O
Full range
0 to
25°C
V
V
− 1.5
CC
V
Common-mode input voltage range
= 30 V
CC
ICR
0 to
Full range
− 2
CC
R ≥ 2 kΩ
25°C
Full range
Full range
Full range
25°C
V
CC
− 1.5
L
R = 2 kΩ
26
V
V
High-level output voltage
Low-level output voltage
V
L
OH
V
CC
= 30 V
R
≥ 10 kΩ
27
28
L
R
≤ 10 kΩ
5
20
mV
OL
L
25
15
65
100
Large-signal differential
voltage amplification
V
CC
= 15 V, V = 1 V to 11 V,
O
A
V/mV
dB
VD
R
≥ 2 kΩ
L
Full range
25°C
CMRR
Common-mode rejection ratio
Supply-voltage rejection ratio
80
k
25°C
65
100
dB
SVR
(∆V /∆V
)
IO
DD
V
/V
O1 O2
Crosstalk attenuation
f = 1 kHz to 20 kHz
25°C
25°C
120
−30
dB
V
V
V
= 15 V,
= 1 V,
= 0
−20
−10
10
−60
CC
Source
Sink
ID
O
Full range
25°C
mA
I
O
Output current
V
V
V
= 15 V,
= −1 V,
= 15 V
20
CC
ID
O
Full range
5
V
V
V
V
= −1 V, V = 200 mV
25°C
25°C
30
40
0.7
1
µA
ID
O
I
I
Short-circuit output current
at 5 V, GND at −5 V, V = 0
60
1.2
2
mA
OS
CC
O
= 2.5 V, No load
Full range
Full range
O
Supply current (two amplifiers)
mA
CC
= MAX, V = 0.5 V, No load
CC
O
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V for
CC
testing purposes is 26 V for LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
‡
§
All typical values are at T = 25°C.
A
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
operating conditions, VCC = 15 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
0.3
UNIT
V/µs
MHz
R = 1 MΩ, C = 30 pF, V = 10 V
L
L
I
SR
Slew rate at unity gain
Unity-gain bandwidth
(see Figure 1)
B
1
R = 1 MΩ, C = 20 pF (see Figure 1)
0.7
L
L
R = 100 Ω, V = 0 V, f = 1 kHz
(see Figure 2)
S
I
V
n
Equivalent input noise voltage
40 nV/√Hz
V
V
CC+
−
+
V
O
V
I
C
R
L
L
CC−
Figure 1. Unity-Gain Amplifier
900 Ω
V
CC+
100 Ω
−
+
V = 0 V
I
V
O
RS
V
CC−
Figure 2. Noise-Test Circuit
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
5962-87710012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
87710012A
LM158FKB
5962-8771001PA
5962-87710022A
ACTIVE
ACTIVE
CDIP
JG
FK
8
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8771001PA
LM158
LCCC
20
POST-PLATE
5962-
87710022A
LM158AFKB
5962-8771002PA
LM158AFKB
ACTIVE
ACTIVE
CDIP
JG
FK
8
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
8771002PA
LM158A
LCCC
20
POST-PLATE
5962-
87710022A
LM158AFKB
LM158AJG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
LM158AJG
LM158AJGB
8771002PA
LM158A
LM158FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
87710012A
LM158FKB
LM158JG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
LM158JG
LM158JGB
8771001PA
LM158
LM258AD
LM258ADE4
LM258ADG4
LM258ADGKR
LM258ADGKRG4
LM258ADR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
LM258A
LM258A
LM258A
Green (RoHS
& no Sb/Br)
SOIC
D
75
Green (RoHS
& no Sb/Br)
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
(M3L ~ M3P ~ M3S ~
M3U)
Green (RoHS
& no Sb/Br)
CU NIPDAU
(M3L ~ M3P ~ M3S ~
M3U)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LM258A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM258ADRE4
LM258ADRG4
LM258AP
ACTIVE
SOIC
SOIC
PDIP
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM258A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
P
2500
50
Green (RoHS
& no Sb/Br)
LM258A
LM258AP
LM258AP
LM258
Pb-Free
(RoHS)
LM258APE4
LM258D
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
SOIC
SOIC
SOIC
VSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
PDIP
D
75
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM258DE4
D
75
Green (RoHS
& no Sb/Br)
LM258
LM258DG4
D
75
Green (RoHS
& no Sb/Br)
LM258
LM258DGKR
LM258DGKRG4
LM258DR
DGK
DGK
D
2500
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
(M2L ~ M2P ~ M2S ~
M2U)
Green (RoHS
& no Sb/Br)
CU NIPDAU
(M2L ~ M2P ~ M2S ~
M2U)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LM258
LM258DRE4
LM258DRG3
LM258DRG4
LM258P
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
LM258
D
2500
2500
50
Green (RoHS
& no Sb/Br)
CU SN
LM258
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
LM258
P
Pb-Free
(RoHS)
LM258P
LM258P
L2904AV
L2904AV
L2904AV
LM258PE4
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
LM2904AVQDR
LM2904AVQDRG4
LM2904AVQPWR
SOIC
SOIC
TSSOP
D
2500
2500
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
D
Green (RoHS
& no Sb/Br)
PW
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM2904AVQPWRG4
LM2904D
ACTIVE
TSSOP
SOIC
SOIC
SOIC
VSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
PDIP
PW
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
L2904AV
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
75
75
Green (RoHS
& no Sb/Br)
LM2904
LM2904
LM2904
LM2904DE4
Green (RoHS
& no Sb/Br)
LM2904DG4
LM2904DGKR
LM2904DGKRG4
LM2904DR
D
75
Green (RoHS
& no Sb/Br)
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
(MBL ~ MBP ~ MBS ~
MBU)
Green (RoHS
& no Sb/Br)
CU NIPDAU
(MBL ~ MBP ~ MBS ~
MBU)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LM2904
LM2904
LM2904
LM2904
LM2904P
LM2904P
L2904
LM2904DRE4
LM2904DRG3
LM2904DRG4
LM2904P
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
D
Green (RoHS
& no Sb/Br)
CU SN
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
P
Pb-Free
(RoHS)
LM2904PE4
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
LM2904PSR
LM2904PSRE4
LM2904PSRG4
LM2904PW
SO
PS
PS
PS
PW
PW
PW
2000
2000
2000
150
150
150
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
L2904
SO
Green (RoHS
& no Sb/Br)
L2904
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
L2904
LM2904PWE4
LM2904PWG4
Green (RoHS
& no Sb/Br)
L2904
Green (RoHS
& no Sb/Br)
L2904
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM2904PWLE
LM2904PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
8
8
TBD
Call TI
Call TI
-40 to 125
-40 to 125
PW
2000
2000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Level-1-260C-UNLIM
L2904
L2904
LM2904PWRG3
ACTIVE
TSSOP
PW
8
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM2904QD
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
8
8
TBD
Call TI
Call TI
-40 to 125
-40 to 125
LM2904QDR
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2904Q1
2904Q1
LM2904QDRG4
ACTIVE
SOIC
D
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904QP
OBSOLETE
ACTIVE
PDIP
SOIC
P
D
8
8
TBD
Call TI
Call TI
-40 to 125
-40 to 125
LM2904VQDR
2500
2500
2000
2000
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L2904V
L2904V
L2904V
L2904V
LM358A
LM358A
LM358A
LM2904VQDRG4
LM2904VQPWR
LM2904VQPWRG4
LM358AD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
TSSOP
TSSOP
SOIC
D
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
0 to 70
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM358ADE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM358ADG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM358ADGKR
LM358ADGKRG4
LM358ADR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
0 to 70
(M6L ~ M6P ~ M6S ~
M6U)
Green (RoHS
& no Sb/Br)
CU NIPDAU
0 to 70
(M6L ~ M6P ~ M6S ~
M6U)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
0 to 70
LM358A
LM358A
LM358A
LM358ADRE4
LM358ADRG4
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
0 to 70
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
0 to 70
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM358AP
LM358APE4
LM358APW
LM358APWE4
LM358APWG4
LM358APWR
LM358APWRE4
LM358APWRG4
LM358D
ACTIVE
PDIP
PDIP
P
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
50
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
LM358AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
P
PW
PW
PW
PW
PW
PW
D
50
150
150
150
2000
2000
2000
75
Pb-Free
(RoHS)
N / A for Pkg Type
LM358AP
L358A
L358A
L358A
L358A
L358A
L358A
LM358
LM358
LM358
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM358DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM358DG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM358DGKR
LM358DGKRG4
LM358DR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
(M5L ~ M5P ~ M5S ~
M5U)
Green (RoHS
& no Sb/Br)
CU NIPDAU
(M5L ~ M5P ~ M5S ~
M5U)
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
LM358
LM358
LM358
LM358
LM358P
LM358DRE4
LM358DRG3
LM358DRG4
LM358P
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
SOIC
D
Green (RoHS
& no Sb/Br)
CU SN
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
PDIP
P
Pb-Free
(RoHS)
CU NIPDAU | CU SN
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM358PE3
LM358PE4
ACTIVE
PDIP
PDIP
P
8
8
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LM358P
ACTIVE
P
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM358P
LM358PSLE
LM358PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
2000
2000
2000
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L358
L358
L358
L358
L358
L358
LM358PSRE4
LM358PSRG4
LM358PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
PS
PS
8
8
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
PW
PW
PW
Green (RoHS
& no Sb/Br)
LM358PWE4
LM358PWG4
150
Green (RoHS
& no Sb/Br)
150
Green (RoHS
& no Sb/Br)
LM358PWLE
LM358PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
TBD
Call TI
0 to 70
0 to 70
2000
2000
2000
2000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Level-1-260C-UNLIM
L358
L358
L358
L358
LM358PWRE4
LM358PWRG3
LM358PWRG4
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
PW
PW
PW
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
CU SN
Green (RoHS
& no Sb/Br)
CU NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :
Automotive: LM2904-Q1
•
Enhanced Product: LM258A-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM258ADGKR
LM258ADGKR
LM258ADR
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.8
5.3
5.3
6.4
6.4
6.4
5.3
5.3
6.4
6.4
6.4
6.4
7.0
7.0
5.3
5.3
6.4
6.4
6.4
3.4
3.4
5.2
5.2
5.2
3.4
3.4
5.2
5.2
5.2
5.2
3.6
3.6
3.4
3.4
5.2
5.2
5.2
1.4
1.4
2.1
2.1
2.1
1.4
1.4
2.1
2.1
2.1
2.1
1.6
1.6
1.4
1.4
2.1
2.1
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM258ADR
SOIC
D
LM258ADRG4
LM258DGKR
LM258DGKR
LM258DR
SOIC
D
VSSOP
VSSOP
SOIC
DGK
DGK
D
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904DGKR
LM2904DGKR
LM2904DR
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
VSSOP
VSSOP
SOIC
PW
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DRG3
SOIC
D
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2904DRG4
LM2904DRG4
LM2904PSR
LM2904PWR
LM2904PWRG3
LM2904QDR
LM2904VQPWRG4
LM358ADGKR
LM358ADGKR
LM358ADR
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2000
2000
2000
2500
2000
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
16.4
12.4
12.4
12.4
12.4
12.4
12.4
12.8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.8
12.4
16.4
12.4
12.4
6.4
6.4
8.2
7.0
7.0
6.4
7.0
5.3
5.3
6.4
6.4
6.4
6.4
7.0
7.0
5.3
5.3
6.4
6.4
6.4
6.4
6.4
8.2
7.0
7.0
5.2
5.2
6.6
3.6
3.6
5.2
3.6
3.4
3.4
5.2
5.2
5.2
5.2
3.6
3.6
3.4
3.4
5.2
5.2
5.2
5.2
5.2
6.6
3.6
3.6
2.1
2.1
2.5
1.6
1.6
2.1
1.6
1.4
1.4
2.1
2.1
2.1
2.1
1.6
1.6
1.4
1.4
2.1
2.1
2.1
2.1
2.1
2.5
1.6
1.6
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
12.0
12.0
16.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SO
PS
PW
PW
D
TSSOP
TSSOP
SOIC
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
LM358APWR
LM358DGKR
LM358DGKR
LM358DR
SOIC
D
SOIC
D
TSSOP
TSSOP
VSSOP
VSSOP
SOIC
PW
PW
DGK
DGK
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DRG3
LM358DRG4
LM358PSR
SOIC
D
SOIC
D
SO
PS
PW
PW
LM358PWR
TSSOP
TSSOP
LM358PWRG3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258ADGKR
LM258ADGKR
LM258ADR
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
332.0
364.0
340.5
367.0
367.0
364.0
332.0
367.0
364.0
367.0
340.5
367.0
367.0
332.0
364.0
367.0
340.5
364.0
340.5
367.0
358.0
364.0
338.1
367.0
367.0
364.0
358.0
367.0
364.0
367.0
338.1
367.0
367.0
358.0
364.0
367.0
338.1
364.0
338.1
367.0
35.0
27.0
20.6
35.0
35.0
27.0
35.0
35.0
27.0
35.0
20.6
35.0
35.0
35.0
27.0
35.0
20.6
27.0
20.6
35.0
LM258ADR
SOIC
D
LM258ADRG4
LM258DGKR
LM258DGKR
LM258DR
SOIC
D
VSSOP
VSSOP
SOIC
DGK
DGK
D
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904DGKR
LM2904DGKR
LM2904DR
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
VSSOP
VSSOP
SOIC
PW
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG4
LM2904DRG4
SOIC
D
SOIC
D
SOIC
D
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2904PSR
LM2904PWR
LM2904PWRG3
LM2904QDR
LM2904VQPWRG4
LM358ADGKR
LM358ADGKR
LM358ADR
SO
PS
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2000
2000
2000
2500
2000
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
367.0
364.0
364.0
367.0
367.0
332.0
364.0
364.0
340.5
367.0
340.5
367.0
364.0
364.0
332.0
367.0
340.5
367.0
364.0
340.5
367.0
364.0
364.0
367.0
364.0
364.0
367.0
367.0
358.0
364.0
364.0
338.1
367.0
338.1
367.0
364.0
364.0
358.0
367.0
338.1
367.0
364.0
338.1
367.0
364.0
364.0
38.0
27.0
27.0
35.0
35.0
35.0
27.0
27.0
20.6
35.0
20.6
35.0
27.0
27.0
35.0
35.0
20.6
35.0
27.0
20.6
38.0
27.0
27.0
TSSOP
TSSOP
SOIC
TSSOP
VSSOP
VSSOP
SOIC
PW
DGK
DGK
D
LM358ADR
SOIC
D
LM358ADRG4
LM358ADRG4
LM358APWR
LM358APWR
LM358DGKR
LM358DGKR
LM358DR
SOIC
D
SOIC
D
TSSOP
TSSOP
VSSOP
VSSOP
SOIC
PW
PW
DGK
DGK
D
LM358DR
SOIC
D
LM358DR
SOIC
D
LM358DRG3
LM358DRG4
LM358PSR
SOIC
D
SOIC
D
SO
PS
PW
PW
LM358PWR
TSSOP
TSSOP
LM358PWRG3
Pack Materials-Page 4
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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Copyright © 2013, Texas Instruments Incorporated
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SI9137DB
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