LM3519 [TI]
具有高速 PWM 亮度控制功能的高频升压白光 LED 驱动器;
| 型号： | LM3519 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有高速 PWM 亮度控制功能的高频升压白光 LED 驱动器 驱动 驱动器 |
| 文件： | 总21页 (文件大小：3407K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM3519
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SNVS394B –AUGUST 2005–REVISED MAY 2013
LM3519 High Frequency Boost White LED Driver with High-Speed PWM Brightness
Control
Check for Samples: LM3519
1
FEATURES
DESCRIPTION
The LM3519 drives up to 4 white LEDs with constant
current to provide LCD backlighting in handheld
devices. The LED current is internally set to 20mA.
The series connection allows the LED current to be
identical for uniform brightness and minimizes the
number of traces to the LEDs. Brightness control is
achieved by applying a PWM signal on enable with
frequencies up to 30kHz.
2
•
Drives 2 to 4 LEDs at 20mA
•
•
•
•
Up to 30kHz PWM Dimming Control Capability
>80% Peak Efficiency
Up to 8MHz Switching Frequency
Small External Components: 1µH -
3.3µH(typ.2.2μH) Inductor and 1µF Output
Capacitor
The LM3519 features a proprietary PFM regulation
architecture with switching frequencies between
2MHz to 8MHz, minimizing inductor size.
•
•
•
•
True Shutdown Isolation
Over-Voltage Protection
Wide Input Voltage Range: 2.7V to 5.5V
Small Footprint SOT-23 Package
Over-voltage protection circuitry and high frequency
operation permit the use of low-cost small output
capacitors. During shutdown, the output is
disconnected from the input in order to avoid leakage
current path through the LEDs to ground.
APPLICATIONS
•
LCD, White LED Backlighting on Mobile
Phones
The LM3519 is available in a tiny 6-pin SOT-23
package.
•
•
Digital Still Cameras and PDAs
General Purpose LED Lighting in Handheld
Devices
Typical Application
L
D
2.2 mH
Vout
Vin
En
Sw
Cout
Cin
4.7 mF
Vout
Vin
1 mF
LM3519
LED_rtn
Gnd
Logic
Voltage
Signal
Input
Vx
Figure 1. Typical Application Circuit
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
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Connection Diagram
6-Lead SOT-23 Package
6
1
5
4
2
3
Top View
PIN DESCRIPTIONS
Pin #
Name
En
Description
1
2
3
4
5
6
Device Enable Connection
Ground Connection
Gnd
VOUT
LED_rtn
SW
Output Voltage Connection
White LED Current Sensing Input Connection
Drain Connection of the Internal Power Field Effect Transistor (FET) Switch
Input or Supply Voltage Connection
VIN
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
VIN , En, & LED_rtn Pin
−0.3V to +6.5V
−0.3V to +21V
+150°C
VOUT , Sw Pin
Maximum Junction Temperature, (TJ-MAX
Storage Temperature Range
)
−65°C to +150°C
ESD Rating(2)
Human Body Model:
Machine Model:
2kV
200V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
(2) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
Operating Ratings(1)
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
Input Voltage Range
−40°C to +125°C
−40°C to +85°C
2.7V to 5.5V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
Thermal Properties(1)
Junction-to-Ambient Thermal Resistance (θJA
)
220°C/W
(1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature.
2
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(1)(2)
Electrical Characteristics
Limits in standard typeface are for TJ = +25°C. Limits in bold typeface apply over the full operating junction temperature
range (−40°C ≤ TJ ≤ +125°C). VIN = 3.6V, unless otherwise stated.
Uni
ts
Symbol
Parameter
Supply Current
Conditions
Min
Typ
Max
IQ
Shutdown: VEN = 0V
0.1
Not Switching: VEN = 1.8V
360
500
900
µA
Switching: VEN = 1.8V, LED_rtn current =
30mA
550
5.5
ILED(TOL)
OVP
LED Current Tolerance/Variation
Over-Voltage Protection Threshold
VIN = 3.6V, 2.2μH,
4LEDs
–10
10
%
V
OVP ON
OVP OFF
18
17.8
18.9
18.6
20
19.8
ILIM
Switch Current Limit
L = 2.2µH
750
455
0.1
8.0
mA
mΩ
µA
Ω
RDS(ON)
ILEAKAGE
RLED_rtn(ON)
FS
Power NMOS Switch ON Resistance
Switch Leakage
VSW = 3.6V, VEN = 0V
2
LED_rtn NMOS Switch ON Resistance
Switching Frequency
ILED = 20 mA , L = 1μH
4LEDs
MH
z
5.4
(3)
IEN
En
Enable Pin Bias Current
VEN = 0V
VEN = 1.8V
0.1
1.1
µA
V
2
Enable Threshold
Device On
Device Off
0.9
0.3
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
(2) Min and max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely
norm.
(3) Current flows into the pin.
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BLOCK DIAGRAM
Vout
3
Sw
5
Vin
6
OVER
VOLTAGE
PROTECTION
CURRENT
LIMIT
I
REF
En
1
V
REF
ERROR
AMPLIFIER
R
S
R
DRIVER
LOGIC
+
-
ON-TIME
GENERATOR
Q
N1
N3
Vin
Vin
N2
4
2
LED_rtn
Gnd
Figure 2. Block Diagram
Circuit Description
The LM3519 is a step-up converter for white LED applications that uses a unique and proprietary pulse
frequency modulation (PFM) architecture to optimize high efficiency at high frequency operation. Unlike most
PFM architecture implementations, the LM3519’s unique architectural implementation results in non-pulse
skipping variable frequency operation. The regulator is forced to operate at the edge of Continous Conduction
Mode (CCM). The error amplifier will set the end of the on-time (IPEAK of inductor) based on the load (LEDs)
current. During this operation, the inductor current ramps up and reaches a peak current at end of the on-time. At
this point, the internal power switch is turned off until the inductor current reaches zero, and the cycle repeats
again. The switching frequency is set based on the charge (on-time) and discharge(off-time) of the inductor
current. The frequency can range between 2MHz to 8MHz over the operating input range.
The LM3519 operation can be best understood through an examination of the block diagram in Figure 2. When
LED current is out of regulation, the LED_rtn voltage falls below or rises above the internal reference voltage
(VREF). The error amplifier will output a signal to increase or decrease the proper on-time duration of N1 power
FET. This correction allows the inductor's stored energy to increase or decrease to a sufficient level that when
transferred to the load will bring the LED_rtn current back into regulation.
During steady-state operation for a typical switching cycle, the oscillator sets the driver logic and turns on N1
power device. N1 conducts current through the inductor and reverse biases the external diode. The LED current
is supplied by the output capacitor when N1 is conducting. Once N1 on-time period is concluded, the internal
power device is turned off and the external diode is forward baised. The inductor current then flows through the
diode to the LED load to replenish the output capacitor and keep the LED current regulated at the trimmed
target.
4
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Typical Performance Characteristics
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
Efficiency
Efficiency
vs
vs
VIN
VIN
90
80
70
60
50
85
83
81
79
77
75
2.2 mH
3.3 mH
25°C
1 mH
1.5 mH
-40°C
85°C
4 LEDs
3.0
4 LEDs
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
(V)
2.5
3.5
4.0
(V)
4.5
5.0
5.5
V
IN
V
IN
Efficiency
Efficiency
vs
vs
VIN
VIN
100
90
80
70
60
50
100
90
80
70
60
50
1 mH
2.2 mH
3.3 mH
1 mH
3.3 mH
1.5 mH
1.5 mH
2 LEDs
3 LEDs
3.0 3.5
2.5
4.0
(V)
4.5
5.0
5.5
2.5
3.0
3.5
4.0
(V)
4.5
5.0
5.5
V
V
IN
IN
IOUT_ACCURACY
IOUT_ACCURACY
vs
vs
VIN
VIN
10
8
16
14
12
10
6
4
25°C
1 mH
8
6
4
2
0
-40°C
2
2.2 mH
3.3 mH
0
85°C
-2
-4
2.7
3.0
3.3
3.6
(V)
3.9
4.2
4.5
2.7
3.0
3.3
3.6
(V)
3.9
4.2
4.5
V
IN
V
IN
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Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
IOUT
IOUT
vs
vs
VIN
VIN
30.0
28.0
26.0
32.0
30.0
28.0
26.0
2.2 mH
1.5 mH
2.2 mH
1.5 mH
3.3 mH
24.0
22.0
24.0
1 mH
1 mH
22.0
20.0
18.0
16.0
20.0
18.0
3.3 mH
3 LEDs
3.0
4 LEDs
3.0
16.0
2.5
3.5
4.0
(V)
4.5
5.0
5.5
2.5
3.5
4.0
4.5
5.0
5.5
V
IN
V
(V)
IN
IOUT
vs
IOUT
vs
VIN
PWM Duty Cycle
(VIN = 3.6V, L = 2.2µH)
22
19
16
13
10
7
22.0
21.5
21.0
20.5
EN =100 Hz and 500 Hz
25°C
-40°C
85°C
20.0
19.5
4
1
5
15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
2.7
3.0
3.3
3.6
3.9
4.2
4.5
V
(V)
IN
IOUT
vs
IOUT
vs
PWM Duty Cycle
PWM Duty Cycle
(VIN = 3.6V, L = 1µH)
(VIN= 3.6V, L = 2.2µH)
23
20
17
14
11
8
22
19
16
13
10
7
30 kHz
50 kHz
EN = 100 Hz and 500 Hz
20 kHz
5
4
EN = 20 kHz, 30 kHz, and 50 kHz
2
1
5
15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
5
15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
6
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Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
IOUT
vs
Switching Frequency
PWM Duty Cycle
(VIN = 3.6V, L = 1µH)
vs
VIN
25
22
19
16
13
10
7
9.0
8.0
7.0
30 kHz
50 kHz
1 mH
6.0
5.0
4.0
3.0
2.0
1.0
0.0
20 kHz
2.2 mH
3.3 mH
4
EN = 20 kHz, 30 kHz, and 50 kHz
10 20 30 40 50 60 70 80 90 100
DUTY CYCLE (%)
3 LEDS
3.0
1
2.7
3.3
3.6
(V)
3.9
4.2
4.5
V
IN
Switching Frequency
Switching Frequency
vs
vs
VIN
VIN
9.0
8.0
7.0
6.0
5.0
4.0
9.0
1 mH, 4 LEDs
8.0
7.0
1 mH
-40°C and 85°C
6.0
5.0
4.0
3.0
2.0
1.0
0.0
25°C
2.2 mH
3.3 mH
2 LEDS
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7
3.0
3.3
3.6
(V)
3.9
4.2
4.5
V
(V)
IN
V
IN
Switching Frequency
Peak Inductor Current
vs
vs
VIN
VIN
10.5
9.0
400
350
300
2.2 mH
1 mH
1 mH
7.5
6.0
4.5
3.3 mH
250
2.2 mH
3.3 mH
200
150
3.0
1.5
4 LEDs
4 LEDS
3.0
100
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7
3.3
3.6
(V)
3.9
4.2
4.5
V
IN
(V)
V
IN
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Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
Peak Inductor Current
Peak Inductor Current
vs
vs
VIN
VIN
400
400
2 LEDS
350
300
350
300
2.2 mH
1 mH
250
250
2.2 mH
1 mH
3.3 mH
200
150
200
150
3.3 mH
3 LEDS
3.0
100
100
2.7
3.3
3.6
(V)
3.9
4.2
4.5
2.7
3.0
3.3
3.6
(V)
3.9
4.2
4.5
V
V
IN
IN
Current Limit
vs
VIN (4LEDs, 1µH)
Current Limit
vs
VIN
1200
1100
1000
900
1200
1100
85°C
1 mH
1000
900
25°C and -40°C
800
2.2 mH
3.3 mH
800
700
700
600
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
V
(V)
V
IN
(V)
IN
Iq (non switching)
vs
Iq (switching)
vs
Temperature
Temperature
400
390
380
370
360
350
340
330
600
590
580
570
560
550
540
530
520
510
320
500
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
TEMPERATURE (°C)
8
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Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
LED Switch RDS_ON
Power Switch RDS_ON
vs
vs
Temperature
Temperature
11
10
620
570
520
470
420
9
8
7
370
320
6
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
TEMPERATURE (°C)
Start-up, (VIN = 3.6V, 4LEDs, 2.2µH)
Start-up (VIN = 3.6V, 4LEDs, 3.3µH)
Start-up (VIN = 3.6V, 2LEDs, 3.3µH)
Start-up, (VIN = 3.6V, 2LEDs, 2.2µH)
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Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA = +25°C, unless otherwise stated.)
Typical Switching Waveform
(VIN = 3.6V, 4LEDs, 3.3µH)
Typical Switching Waveform
(VIN = 3.6V, 4LEDs, 2.2µH)
Typical Switching Waveform
(VIN = 3.6V, 3LEDs, 2.2µH)
Typical Switching Waveform
(VIN = 3.6V, 2LEDs, 2.2µH)
Typical Switching Waveform
(VIN = 3.6V, 3LEDs, 1µH)
Typical Switching Waveform
(VIN = 3.6V, 4LEDs, 1µH)
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APPLICATION INFORMATION
Capacitor Selection
To minimize output and input voltage ripple, low equivalent series resistance (ESR) ceramic capacitors are the
best choice to use for the input and output filters. For most display applications, a 4.7µF capacitor is
recommended for CIN and 1µF for COUT
.
Larger output capacitors can be used to reduce ripple voltage. To ensure good performance, a minimum of
0.47µF COUT is required to trade off for large ripple voltage. Care must be taken to account for the true
capacitance of a multilayer ceramic capacitor. Smaller case size capacitors typically have less capacitance for a
given bias voltage as compared to a larger case size capacitor with the same bias voltage. Please confirm with
capacitor manufacturer data before selecting the capacitor.
Recommended capacitor manufacturers include but are not limited to:
Table 1.
Manufacturer
Description
06033D105MAT-25V
Case Size
0603
AVX
06036D475MAT-6.3V
C2012X5R1A475M-10V
TMK212BJ105KG-J
EM212BJ475MG-16V
GRM40-034B105K25
GRM39X5R475K6.3
0603
TDK
0805
Taiyo Yuden
0805
0805
muRata
0805
0603
Inductor Selection
In order to maintain sufficient inductance, the saturation current rating of the inductor used with the LM3519
should be higher than the peak inductor current in the target application. Inductors with low DCR values have
less power loss and higher efficiency. Larger inductor values such as 2.2µH and 3.3µH can be used to optimize
efficiency, frequency and peak current. If 1µH is used, the peak inductor current, frequency will be higher and the
efficiency will be lower. Note that the switching frequency ranges will be higher at lower inductance. Typical
frequency range is between 4 to 8MHz for 1µH, 2 to 5MHz for 2.2µH and 2 to 4MHz for 3.3µH over the input
range. Below is a sample list of low profile inductors.
Some recommended inductor manufacturers include but are not limited to:
Manufacturer
L
Case Size
ISAT
CoilCraft:
DO3314-102
2.1A
1µH
3.3x3.3x1.4mm
DO3314-222
DO3314-332
2.2µH
3.3µH
1.6A
1.4A
1.6A
Coilcraft:
LPO3310-102ML
1µH
3.3x3.3x1.0 mm
3.1x3.1x1.4 mm
3.0x3.0x1.5 mm
LPO3310-222ML
LPO3310-332ML
2.2µH
3.3µH
1.1A
0.95A
2.07A
Cooper:
SD31121R0
1µH
SD3114-2R2
SD3114-3R3
2.2µH
3.3uH
1.48A
1.15A
2.1A
Taiyo Yuden:
NR3015T1R0N
1µH
NR3015T2R2M
NR3015T3R3M
2.2µH
3.3µH
1.48A
1.21A
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Diode Selection
Diodes with low forward voltage ratings (VF) and low junction capacitance magnitudes (CJ or CT or CD) are
conducive to high efficiency. The chosen diode must have a reverse breakdown voltage rating (VR and/or VRRM
that is larger than the output voltage. The following criteria should be followed when choosing a diode:
)
1. VR (Diode Blocking Voltage Range) and VRRM (Diode Peak Repetitive Reverse Voltage Rating) > VOUT
(Output Voltage)
2. IF or IO (Diode Average Forward Current Rating) ≥ ILOAD (Load Current)
3. IFRM (Diode Peak Repetitive Forward Current Rating) ≥ ILpeak (Peak Inductor Current)
Some recommended diode manufacturers include but are not limited to:
Manufacturer
Description
Vishay
SS12(1A/20V)
SS14(1A/40V)
SS16(1A/60V)
Central Semiconductor
ONSemi
CMSH1- 40M(1A/40V)
MBRS1540T3(1.5A/40V)
PWM DIMMING
The LED current is set internally by the LM3519 to 20mA (typical); dimming control may be realized by applying
a pulse width modulated(PWM) signal to the En pin. For example, a 50% duty cycle waveform will produce an
average current of 10mA. A control signal frequency between 17kHz and 30kHz is suitable for dimming.
Although the LM3519 is capable of operation outside this frequency range, it is not recommended to operate
below 17kHz for the following reasons: 1) frequency below 100Hz is likely to cause visible flicker in the light
emitted by the LED string. 2) frequency below 17kHz may induce audible noise due to combinations of some
capacitance/PCB. A PWM frequency above 30kHz is possible but the current linearity vs duty cycle will be
affected.
If it is not possible to operate the dimming control above 17kHz, audible noise emission may be minimized by
using capacitors with low susceptibility to piezoelectric induced stresses, such as poly film designs. Minimum
audible noise is most likely to occur when the PWM frequency is less than 2kHz. It is recommended that any
application using a PWM control signal below 17kHz be thoroughly evaluated for undesirable audible or visible
noise.
DRIVING 2 LEDs
The LM3519 is optimized to drive up to 4LEDs. When driving 2LEDs, a minimum inductance of 2.2µH is required
to maintain good loop regulation and current accuracy. If a smaller inductor is used, the LED current will have
more variation with input voltage than a typical application. The following curve illustrates the behavior.
12
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Product Folder Links: LM3519
LM3519
www.ti.com
SNVS394B –AUGUST 2005–REVISED MAY 2013
50.0
45.0
40.0
35.0
30.0
1 mH
1.5 mH
25.0
20.0
3.3 mH
2 LEDs
3.0
15.0
2.5
3.5
4.0
(V)
4.5
5.0
5.5
V
IN
Figure 3. IOUT vs VIN
LAYOUT GUIDELINES
The input capacitor, CIN, must be placed close to the LM3519. Placing CIN close to the device will reduce the
metal trace resistance effect on input voltage ripple. Metal trace connections for the COUT capacitor can increase
the effective series resistance, which affects output voltage ripple and efficiency. Trace connections to the
inductor should be short and wide to reduce power dissipation, increase overall efficiency and reduce EMI
radiation. The diode, like the inductor, should have trace connections that are short and wide to reduce power
dissipation and increase overall efficiency. For more details regarding layout guidelines for switching regulators,
refer to Application Note AN1149 SNVA021.
Copyright © 2005–2013, Texas Instruments Incorporated
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LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
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REVISION HISTORY
Changes from Revision A (May 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
14
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Product Folder Links: LM3519
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM3519MK-20/NOPB
ACTIVE SOT-23-THIN
DDC
6
1000 RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 85
D52B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM3519MK-20/NOPB SOT-23-
THIN
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23-THIN DDC
SPQ
Length (mm) Width (mm) Height (mm)
208.0 191.0 35.0
LM3519MK-20/NOPB
6
1000
Pack Materials-Page 2
PACKAGE OUTLINE
DDC0006A
SOT-23 - 1.1 max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
3.05
2.55
1.1
0.7
1.75
1.45
0.1 C
B
A
PIN 1
INDEX AREA
1
6
4X 0.95
1.9
3.05
2.75
4
3
0.5
0.3
0.1
6X
TYP
0.0
0.2
C A B
C
0 -8 TYP
0.25
GAGE PLANE
SEATING PLANE
0.20
0.12
TYP
0.6
0.3
TYP
4214841/C 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-193.
www.ti.com
EXAMPLE BOARD LAYOUT
DDC0006A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
6X (1.1)
1
6
6X (0.6)
SYMM
4X (0.95)
4
3
(R0.05) TYP
(2.7)
LAND PATTERN EXAMPLE
EXPLOSED METAL SHOWN
SCALE:15X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDERMASK DETAILS
4214841/C 04/2022
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DDC0006A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
6X (1.1)
1
6
6X (0.6)
SYMM
4X(0.95)
4
3
(R0.05) TYP
(2.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214841/C 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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