LM3502SQ-25/NOPB [TI]
Step-Up Converter for White LED Applications 16-WQFN -40 to 125;
| 型号： | LM3502SQ-25/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Step-Up Converter for White LED Applications 16-WQFN -40 to 125 驱动 接口集成电路 |
| 文件： | 总28页 (文件大小：1386K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
LM3502 Step-Up Converter for White LED Applications
Check for Samples: LM3502
1
FEATURES
APPLICATIONS
2
•
Drive up to 4, 6, 8 or 10 White LEDs for Dual
Display Backlighting
•
•
Dual Display Backlighting in Portable Devices
Cellular Phones and PDAs
•
•
>80% Efficiency
DESCRIPTION
Output Voltage Options: 16V , 25V , 35V, and
44V
The LM3502 is a white LED driver for lighting
applications. For dual display or large single white
LED string backlighting applications, the LM3502
provides a complete solution. The LM3502 contains
two internal white LED current bypass FET(Field
Effect Transistor) switches that are ideal for
controlling dual display applications. The white LED
current can be adjusted with a PWM signal directly
from a microcontroller without the need of an RC filter
network.
•
•
•
•
•
•
Input Under-Voltage Protection
Internal Soft Start Eliminating Inrush Current
1 MHz Constant Switching Frequency
Wide Input Voltage: 2.5V to 5.5V
Small External Components
Low Profile Packages: <1 mm Height
–
–
10 Bump DSBGA
16 Pin WQFN
Typical Application
L
22 mH
D
MAIN:
2 to 5
LEDs
Sw
V
V
V
IN
OUT1
C
IN
V
SUPPLY
OUT2
4.7 mF
Cntrl
En1
En2
C
OUT
LM3502-44
1 mF
Fb
AGND
PGND
SUB:
2 to 5
LEDs
Logic
Voltage
Signal
Inputs
R1
Figure 1. Blacklight Configuration with 10 White LEDs
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
DESCRIPTION (CONTINUED)
With no external compensation, cycle-by-cycle current limit, over-voltage protection, and under-voltage
protection, the LM3502 offers superior performance over other application specific standard product step-up
white LED drivers.
Connection Diagrams
A2
4
3
2
1
A1
B1
C1
D1
A3
B3
C3
D3
5
6
7
8
16
15
14
13
9
10 11 12
D2
Figure 2. TOP VIEW
10-Bump Thin DSBGA
Figure 3. TOP VIEW
16-Lead Thin WQFN
See Package Number (YPA0010)
See Package Number (RGH0016A)
PIN DESCRIPTIONS
Bump #
A1
Pin #
Name
Cntrl
Fb
Description
9
7
6
Shutdown Control Connection
Feedback Voltage Connection
B1
C1
VOUT2
Drain Connections of The NMOS and PMOS Field Effect Transistor (FET) Switches (Figure 4: N2
and P1)
D1
D2
D3
C3
B3
A3
A2
4
VOUT1
Sw
Over-Voltage Protection (OVP) and Source Connection of The PMOS FET Switch (Figure 4: P1)
2 and 3
Drain Connection of The Power NMOS Switch (Figure 4: N1)
Power Ground Connection
Analog Ground Connection
Supply or Input Voltage Connection
NMOS FET Switch Control Connection
PMOS FET Switch Control Connection
No Connection
15 and 16
PGND
AGND
VIN
14
13
12
10
1
En2
En1
NC
5
NC
No Connection
8
NC
No Connection
11
DAP
NC
No Connection
DAP
Die Attach Pad (DAP), must be soldered to the printed circuit board’s ground plane for enhanced
thermal dissipation.
Cntrl (Bump A1): Shutdown control pin
When VCntrl is ≥ 1.4V, the LM3502 is enabled or ON. When VCntrl is ≤ 0.3V, the LM3502 will
enter into shutdown mode operation. The LM3502 has an internal pull down resistor on the
Cntrl pin, thus the device is normally in the off state or shutdown mode of operation.
Fb (Bump B1):Output voltage feedback connection
The white LED string network current is set/programmed using a resistor from this pin to
ground.
VOUT2 (Bump C1): Drain connections of the internal PMOS and NMOS FET switches
. (Figure 4: P1 and N2). It is recommended to connect 100nF at VOUT2 for the LM3502-35V
2
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
and LM3502-44 versions if VOUT2 is not used.
VOUT1 (Bump D1):Source connection of the internal PMOS FET switch (Figure 4: P1) and OVP sensing node
The output capacitor must be connected as close to the device as possible, between the
VOUT1 pin and ground plane. Also connect the Schottky diode as close as possible to the
VOUT1 pin to minimize trace resistance and EMI radiation.
Sw (Bump D2): Drain connection of the internal power NMOS FET switch (Figure 4: N1)
Minimize the metal trace length and maximize the metal trace width connected to this pin to
reduce EMI radiation and trace resistance.
PGND (Bump D3):Power ground pin
Connect directly to the ground plane.
AGND (Bump C3): Analog ground pin
Connect the analog ground pin directly to the PGND pin.
VIN (Bump B3):Supply or input voltage connection pin
The CIN capacitor should be as close to the device as possible, between the VIN pin and
ground plane.
En2 (Bump A3): Enable pin for the internal NMOS FET switch (Figure 4: N2) during device operation
When VEn2 is ≤ 0.3V, the internal NMOS FET switch turns on and the SUB display turns off.
When VEn2 is ≥ 1.4V, the internal NMOS FET switch turns off and the SUB display turns on.
The En2 pin has an internal pull down resistor, thus the internal NMOS FET switch is
normally in the on state of operation with the SUB display turned off.
If VEn1 and VEn2 are ≤ 0.3V and VCntrl is ≥ 1.4V, the LM3502 will enter a low IQ shutdown
mode of operation where all the internal FET switches are off. If VOUT2 is not used, En2 must
be grounded or floating and use En1 along with Cntrl, to enable the device.
En1 (Bump A2): Enable pin for the internal PMOS FET switch (Figure 4: P1) during device operation
When VEn1 is ≤ 0.3V, the internal PMOS FET switch turns on and the MAIN display is turned
off. When VEn1 is ≥ 1.4V, the internal PMOS FET switch turns off and the MAIN display is
turned on. The En1 pin has an internal pull down resistor, thus the internal PMOS FET
switch is normally in the on state of operation with the MAIN display turned off. If VEn1 and
VEn2 are ≤ 0.3V and VCntrl is ≥ 1.4V, the LM3502 will enter a low IQ shutdown mode of
operation where all the internal FET switches are off. If VOUT2 is not used, En2 must be
grounded and use En1 a long with Cntrl, to enable the device.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
(1)(2)(3)
Absolute Maximum Ratings
VIN Pin
−0.3V to +5.5V
−0.3V to +48V
−0.3V to +5.5V
−0.3V to +5.5V
−0.3V to +48V
−0.3V to VOUT1
−0.3V to +5.5V
−0.3V to +5.5V
Internally Limited
Sw Pin
Fb Pin
Cntrl Pin
VOUT1 Pin
VOUT2 Pin
En1
En2
Continuous Power Dissipation
Maximum Junction Temperature
(TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
(4)
ESD Rating
Human Body Model:
Machine Model:
2 kV
200V
(1) All voltages are with respect to the potential at the GND pin.
(2) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
(1)(2)
Operating Conditions
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
Input Voltage, VIN Pin
−40°C to +125°C
−40°C to +85°C
2.5V to 5.5V
Cntrl, En1, and En2 Pins
0V to 5.5V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
(2) All voltages are with respect to the potential at the GND pin.
(1)
Thermal Properties
Junction-to-Ambient Thermal Resistance (θJA
)
DSBGA Package
65°C/W
49°C/W
WQFN Package
(1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature. For more information on this topic, please refer toApplication Note 1187: Leadless
Leadframe Package (LLP) and Application Note 1112 for DSBGA chip scale package.
(1) (2)
Preliminary Electrical Characteristics
Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range
(−40°C ≤ TJ ≤ +125°C). Unless otherwise specified, VIN = 2.5V.
Symbol
VIN
Parameter
Input Voltage
Conditions
Min
Typ
Max
Units
2.5
5.5
V
IQ
Non-Switching
Switching
Shutdown
Fb > 0.25V
Fb = 0V, Sw Is Floating
Cntrl = 0V
0.5
1.9
0.1
6
1
3
3
mA
mA
µA
Low IQ Shutdown
Cntrl = 1.5V, En1 = En2 = 0V
15
µA
VFb
Feedback Voltage
0.18
0.25
0.3
V
(1) All voltages are with respect to the potential at the GND pin.
(2) Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely
norm.
4
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
Preliminary Electrical Characteristics (1) (2) (continued)
Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range
(−40°C ≤ TJ ≤ +125°C). Unless otherwise specified, VIN = 2.5V.
Symbol
ICL
Parameter
Conditions
Min
Typ
Max
Units
NMOS Power Switch
Current Limit
−16, Fb = 0V
−25, Fb = 0V
−35, Fb = 0V
−44, Fb = 0V
250
400
450
450
400
600
750
750
650
800
1050
1050
mA
IFb
Feedback Pin Bias
Current
Fb = 0.25V
64
1
500
1.2
nA
(3)
FS
Switching Frequency
0.8
MHz
RDS(ON)
NMOS Power Switch ON ISw = 500 mA
Resistance
0.55
5
1.1
10
5
Ω
Ω
Ω
(Figure 4: N1)
RPDS(ON)
PMOS ON Resistance of IPMOS = 20 mA, En1 = 0V, En2 = 1.5V
VOUT1/VOUT2 Switch
(Figure 4: N1)
RNDS(ON)
NMOS ON Resistance of INMOS = 20 mA, En1 = 1.5V, En2 = 0V
VOUT2/Fb Switch
(Figure 4: N2)
2.5
95
DMAX
ICntrl
Maximum Duty Cycle
Cntrl Pin Input Bias
Fb = 0V
90
%
Cntrl = 2.5V
Cntrl = 0V
7
0.1
14
5
µA
(4)
Current
ISw
Sw Pin Leakage Current Sw = 42V, Cntrl = 0V
0.01
µA
µA
(5)
IV
OUT1
VOUT1 Pin Leakage
VOUT1 = 14V, Cntrl = 0V (16)
0.1
0.1
0.1
0.1
3
3
3
3
(OFF)
(5)
Current
VOUT1 = 23V, Cntrl = 0V (25)
VOUT1 = 32V, Cntrl = 0V (35)
VOUT1 = 42V, Cntrl = 0V (44)
IV
OUT1
VOUT1 Pin Bias Current
VOUT1 = 14V, Cntrl = 1.5V (16)
VOUT1 = 23V, Cntrl = 1.5V (25)
VOUT1 = 32V, Cntrl = 1.5V (35)
VOUT1 = 42V, Cntrl = 1.5V (44)
40
50
50
85
80
(ON)
(5)
100
100
140
µA
IV
VOUT2 Pin Leakage
Current
Fb = 0V, Cntrl = 0V, VOUT2 = 42V
OUT2
0.1
3
µA
V
(5)
UVP
OVP
Under-Voltage
Protection
On Threshold
Off Threshold
2.4
2.3
2.5
2.2
Over-Voltage Protection On Threshold (16)
14.5
14.0
22.5
21.5
32.0
31.0
40.5
39.0
15.5
15
24
23
34
33
42
41
16.5
16.0
25.5
24.5
35.0
34.0
43.5
42.0
(6)
Off Threshold (16)
On Threshold (25)
Off Threshold (25)
On Threshold (35)
Off Threshold (35)
On Threshold (44)
Off Threshold (44)
V
VEn1
VEn2
VCntrl
PMOS FET Switch
Enabling Threshold
(Figure 4: P1)
Off Threshold (Display Lighting)
On Threshold (Display Lighting)
0.8
0.8
0.3
0.3
0.3
1.4
1.4
V
V
NMOS FET Switch
Enabling Threshold
(Figure 4: N2)
Off Threshold (Display Lighting)
On Threshold (Display Lighting)
0.8
0.8
Device Enabling
Threshold
Off Threshold
OnThreshold
0.8
0.8
V
1.4
TSHDW
IEn1
Shutdown Delay Time
8
12
16
ms
µA
En1 Pin Input Bias
Current
En1 = 2.5V
En1 = 0V
7
0.1
14
(3) Current flows out of the pin.
(4) Current flows into the pin.
(5) Current flows into the pin.
(6) The on threshold indicates that the LM3502 is no longer switching or regulating LED current, while the off threshold indicates normal
operation.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
Preliminary Electrical Characteristics (1) (2) (continued)
Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range
(−40°C ≤ TJ ≤ +125°C). Unless otherwise specified, VIN = 2.5V.
Symbol
IEn2
Parameter
Conditions
Min
Typ
Max
14
Units
En2 Pin Input Bias
Current
En2 = 2.5V
En2 = 0V
7
0.1
µA
BLOCK DIAGRAM
V
IN
Sw
13
2,3
Soft Start
Thermal Shutdown
OVP
Current Limit
Comparator
V
OUT1
+
-
4
UVP
Comparator
-
UVP
Reference
OVP
Reference
+
Light Load
Comparator
Light Load
Reference
Current Sense
+
-
Error
Amplifier
PWM
Fb
P1
Comparator
N1
-
+
-
Driver Logic
+
Fb
Reference
V
OUT2
6
N2
Oscillator
FET Logic
Shutdown
Duty Limit
Comparator
Comparator
+
-
Duty Limit
Reference
7
Fb
14
9
15,16
10 12
En1
En2
AGND
Cntrl
PGND
Figure 4. Block Diagram
Detailed Description of Operation
The LM3502 utilizes an asynchronous current mode pulse-width-modulation (PWM) control scheme to regulate
the feedback voltage over specified load conditions. The DC/DC converter behaves as a controlled current
source for white LED applications. The operation can best be understood by referring to the block diagram in
Figure 4 for the following operational explanation. At the start of each cycle, the oscillator sets the driver logic
and turns on the internal NMOS power device, N1, conducting current through the inductor and reverse biasing
the external diode. The white LED current is supplied by the output capacitor when the internal NMOS power
device, N1, is turned on. The sum of the error amplifier’s output voltage and an internal voltage ramp are
compared with the sensed power NMOS, N1, switch voltage. Once these voltages are equal, the PWM
6
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
comparator will then reset the driver logic, thus turning off the internal NMOS power device, N1, and forward
biasing the external diode. The inductor current then flows through the diode to the white LED load and output
capacitor. The inductor current recharges the output capacitor and supplies the current for the white LED load.
The oscillator then resets the driver logic again repeating the process. The output voltage of the error amplifier
controls the current through the inductor. This voltage will increase for larger loads and decrease for smaller
loads limiting the peak current in the inductor and minimizing EMI radiation. The duty limit comparator is always
operational, it prevents the internal NMOS power switch, N1, from being on for more than one oscillator cycle
and conducting large amounts of current. The light load comparator allows the LM3502 to properly regulate
light/small white LED load currents, where regulation becomes difficult for the LM3502’s primary control loop.
Under light load conditions, the LM3502 will enter into a pulse skipping pulse-frequency-mode (PFM) of operation
where the switching frequency will vary with the load.
The LM3502 has 2 control pins, En1 and En2, used for selecting which segment of a single white LED string
network is active for dual display applications. En1 controls the main display (MAIN) segment of the single string
white LED network between pins VOUT1 and VOUT2. En2 controls the sub display (SUB) segment of the single
string white LED network between the VOUT2 and Fb. For a quick review of the LM3502 control pin operational
characteristics, see Figure 5.
When the Cntrl pin is ≥ 1.4V, the LM3502 will enter in low IQ state if both En1 and En2 ≤ 0.3V. At this time, both
the P1 and N2 FETs will turn off. The output voltage will be a diode drop below the supply voltage and the soft-
start will be reset limiting the peak inductor current at the next start-up.
The LM3502 is designed to control the LED current with a PWM signal without the use of an external RC filter.
Utilizing special circuitry, the LM3502 can operate over a large range of PWM frequencies without restarting the
soft-start allowing for fast recovery at high PWM frequencies. Figure 6 represents a PWM signal driving the Cntrl
pin where tL is defined as the low time of the signal. The following is true:
•
If tL < 12ms (typical): The device will stop switching during this time and the soft-start will not be reset allowing
LED current PWM control.
•
If tL > 12ms (typical): The device will shutdown and the soft-start will reset to prevent high peak currents at the
next startup. Both the N2 and P1 switches will turn off.
The LM3502 has dedicated protection circuitry active during normal operation to protect the integrated circuit (IC)
and external components. The thermal shutdown circuitry turns off the internal NMOS power device, N1, when
the internal semiconductor junction temperature reaches excessive levels. The LM3502 has a under-voltage
protection (UVP) comparator that disables the internal NMOS power device when battery voltages are too low,
thus preventing an on state where the internal NMOS power device conducts large amounts of current. The over-
voltage protection (OVP) comparator prevents the output voltage from increasing beyond the protection limit
when the white LED string network is removed or if there is a white LED failure. OVP allows for the use of low
profile ceramic capacitors at the output. The current though the internal NMOS power device, N1, is monitored to
prevent peak inductor currents from damaging the IC. If during a cycle (cycle=1/switching frequency) the peak
inductor current exceeds the current limit for the LM3502, the internal NMOS power device will be turned off for
the remaining duration of that cycle.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
Shutdown
Cntrl* En1 En2
Result* (See Figure 1 and Figure 2)
Shutdown
Low I
Q
1.4V
1.4V
1.4V
1.4V
0.3V
0.3V
0.3V
0.3V
0.3V 0.3V
1.4V 0.3V
0.3V 1.4V
1.4V 1.4V
0.3V 0.3V
1.4V 0.3V
0.3V 1.4V
1.4V 1.4V
[P1‰OFF N2‰OFF N1‰OFF] or [MAIN‰OFF SUB‰OFF N1‰OFF]
[P1‰OFF N2‰ON N1‰Switching] or [MAIN‰ON SUB‰OFF N1‰Switching]
[P1‰ON N2‰OFF N1‰Switching] or [MAIN‰OFF SUB‰ON N1‰Switching]
[P1‰OFF N2‰OFF N1‰Switching] or [MAIN‰ON SUB‰ON N1‰Switching]
[P1‰OFF N2‰OFF N1‰OFF] or [MAIN‰OFF SUB‰OFF N1‰OFF]
[P1‰OFF N2‰OFF N1‰OFF] or [MAIN‰OFF SUB‰OFF N1‰OFF]
[P1‰OFF N2‰OFF N1‰OFF] or [MAIN‰OFF SUB‰OFF N1‰OFF]
[P1‰OFF N2‰OFF N1‰OFF] or [MAIN‰OFF SUB‰OFF N1‰OFF]
X
X
X
X
X
*Table is only valid for when the Cntrl pin signal is a non-periodic logic signal, not a PWM signal.
Figure 5. Operational Characteristics Table
1.4V
Cntrl
0.3V
t
L
(Typ)
Figure 6. Control Signal Waveform
8
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
Typical Performance Characteristics
( Circuit in Figure 1: L = DO1608C-223 and D = MBRM140T3. Efficiency: η = POUT/PIN = [(VOUT – VFb) * IOUT]/[VIN * IIN]. TA=
25°C, unless otherwise stated.)
IQ (Non-Switching)
Switching Frequency
vs
vs
VIN
Temperature
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.95
0.94
0.93
0.600
0.580
0.560
0.540
0.520
0.500
0.480
0.460
0.440
0.420
0.400
V
IN
= 2.5V
-40oC
25oC
125oC
-40 -20
0
20 40 60 80 100 120
2.5
3.0
3.5
4.0
4.5
5.0
5.5
-30 -10 10 30 50 70 90 110 130
INPUT VOLTAGE (V)
TEMPERATURE (oC)
Figure 7.
Figure 8.
IQ (Switching)
IQ (Switching)
vs
Temperature
vs
VIN
1.95
1.90
1.85
1.80
1.75
4.00
3.50
3.00
2.50
2.00
1.50
V
= 2.5V
IN
-40oC
125oC
25oC
-40 -20
0
20 40 60 80 100 120
-30 -10 10 30 50 70 90 110 130
2.5
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
TEMPERATURE (oC)
Figure 9.
Figure 10.
10 LED Efficiency
vs
8 LED Efficiency
vs
LED Current
LED Current
90
85
80
75
70
65
60
55
50
45
40
90
85
80
75
70
65
60
55
50
45
40
V
= 4.2V
IN
V
= 5.5V
IN
V
= 5.5V
IN
V
= 3.3V
= 3V
IN
V
= 4.2V
IN
V
= 3.3V
V
IN
IN
V
IN
= 2.7V
V
= 3V
IN
V
= 2.7V
IN
2.5
7.5 12.5 17.5 22.5 27.5 32.5
5.0 10.0 15.0 20.0 25.0 30.0 35.0
2
12
22
32
42
52
62
LED CURRENT (mA)
LED CURRENT (mA)
Figure 11.
Figure 12.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
( Circuit in Figure 1: L = DO1608C-223 and D = MBRM140T3. Efficiency: η = POUT/PIN = [(VOUT – VFb) * IOUT]/[VIN * IIN]. TA=
25°C, unless otherwise stated.)
6 LED Efficiency
4 LED Efficiency
vs
LED Current
vs
LED Current
95
90
85
80
75
70
95
V
= 5.5V
= 4.2V
IN
90
85
V
= 5.5V
= 4.2V
IN
80
75
70
65
60
V
IN
V
IN
V
= 3.3V
IN
V
= 3V
IN
V
= 2.7V
V
= 2.7V
V
IN
= 3.3V
IN
IN
2
12 22 32 42 52 62 72 82
LED CURRENT (mA)
2
10 18 26 34 42 50 58 66 74
LED CURRENT (mA)
Figure 13.
Figure 14.
Cntrl Pin Current
vs
Cntrl Pin Voltage
Maximum Duty Cycle
vs
Temperature
30
25
20
15
10
5
98
97
96
95
94
V
= 2.5
IN
-40oC
25oC
125oC
0
0.0
1.0
2.0
3.0
4.0
5.0
-40 -20
0
20 40 60 80 100 120
-30 -10 10 30 50 70 90 110 130
CNTRL PIN VOLTAGE (V)
TEMPERATURE (oC)
Figure 15.
Figure 16.
En1 Pin Current
vs
En1 Pin Voltage
En2 Pin Current
vs
En2 Pin Voltage
25
20
15
10
5
30
25
20
15
10
5
-40oC
-40oC
25oC
25oC
125oC
125oC
0
0.0
0
0.0
1.0
2.0
3.0
4.0
5.0
1.0
2.0
3.0
4.0
5.0
EN1 PIN VOLTAGE (V)
EN2 PIN VOLTAGE (V)
Figure 17.
Figure 18.
10
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
Typical Performance Characteristics (continued)
( Circuit in Figure 1: L = DO1608C-223 and D = MBRM140T3. Efficiency: η = POUT/PIN = [(VOUT – VFb) * IOUT]/[VIN * IIN]. TA=
25°C, unless otherwise stated.)
VOUT1 Pin Current
Power NMOS RDS(ON) (Figure 4: N1)
vs
vs
VOUT1 Pin Voltage
VIN
1000
900
800
700
600
500
400
300
160
140
120
100
80
I
= 400 mA
NMOS
125oC
-40oC
25oC
25oC
60
125oC
40
-40oC
20
0
0
8
16
24
32
40
48
2.5
3.0
3.5
4.0
4.5
5.0
5.5
V
PIN VOLTAGE (V)
OUT1
INPUT VOLTAGE (V)
Figure 19.
Figure 20.
NMOS RDS(ON) (Figure 4: N2)
PMOS RDS(ON) (Figure 4: P1)
vs
vs
VIN
VIN
10
9
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
I
= 20 mA
I
= 20 mA
PMOS
NMOS
125oC
8
125oC
7
25oC
6
25oC
-40oC
5
4
3
-40oC
2.0
12.0
22.0
32.0
42.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
V
PIN VOLTAGE (V)
OUT1
INPUT VOLTAGE (V)
Figure 21.
Figure 22.
Feedback Voltage
vs
Temperature
Current Limit (LM3502-16)
vs
VIN
480
460
440
420
400
380
360
340
320
T = 85oC
T = 25oC
T = -40oC
2.5
3.0 3.5
4.0 4.5
5.0 5.5
INPUT VOLTAGE (V)
Figure 23.
Figure 24.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
( Circuit in Figure 1: L = DO1608C-223 and D = MBRM140T3. Efficiency: η = POUT/PIN = [(VOUT – VFb) * IOUT]/[VIN * IIN]. TA=
25°C, unless otherwise stated.)
Current Limit (LM3502-16)
Current Limit (LM3502-25)
vs
vs
Temperature
VIN
620
600
580
560
540
520
500
480
460
440
440
420
400
380
360
340
320
T = 85oC
T = 25oC
V
= 2.5V
IN
V
= 5.5V
IN
T = -40oC
-40 -25 -10
5
20 35 50 65 80
2.5 3.0 3.5 4.0 4.5 5.0 5.5
TEMPERATURE (oC)
INPUT VOLTAGE (V)
Figure 25.
Figure 26.
Current Limit (LM3502-25)
Current Limit (LM3502-35/44)
vs
vs
Temperature
Temperature
620
600
580
560
540
520
500
480
460
440
420
780
770
760
750
740
730
720
710
700
690
V
= 2.5V
IN
V
= 5.5V
IN
V
= 2.5V
IN
-40 -25 -10
5
20 35 50 65 80
-40 -25 -10
5
20 35 50 65 80
TEMPERATURE (oC)
TEMPERATURE (oC)
Figure 27.
Figure 28.
Current Limit (LM3502-35/44)
vs
VIN
780
770
760
750
740
730
720
710
700
690
85oC
25oC
-40oC
2.5
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
Figure 29.
12
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
APPLICATION INFORMATION
WHITE LED CURRENT SETTING
The LED current is set using the following equation:
VFb
ILED
=
where
•
•
•
ILED: White LED Current.
VFb: Feedback Pin Voltage. VFb = 0.25V, Typical.
R1: Current Setting Resistor.
(1)
WHITE LED DIMMING
For dimming the white LED string with a pulse-width-modulated (PWM) signal on the Cntrl pin, care must taken
to balance the tradeoffs between audible noise and white LED brightness control. For best PWM duty cycle vs.
white LED current linearity, the PWM frequency should be between 200Hz and 500Hz. Other PWM frequencies
can be used, but the linearity over input voltage and duty cycle variation will not be as good as what the 200Hz to
500Hz PWM frequency spectrum provides. To minimize audible noise interference, it is recommended that a
output capacitor with minimal susceptibility to piezoelectric induced stresses be used for the particular
applications that require minimal or no audible noise interference.
PWM Signal
V
SUPPLY
Sw
V
V
OUT1
IN
Unconnected
Floating
V
OUT2
Cntrl
En1
En2
LM3502
Fb
GND
AGND
PGND
R1
Figure 30.
If VOUT2 is not used , En2 must be grounded
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
t
= DT
S
ON
(Vin - Vout)/L
Vin/L
I
L
(avg)
' i
L
Time
T
S
Figure 31. Inductor Current Waveform
CONTINUOUS AND DISCONTINUOUS MODES OF OPERATION
Since the LM3502 is a constant frequency pulse-width-modulated step-up regulator, care must be taken to make
sure the maximum duty cycle specification is not violated. The duty cycle equation depends on which mode of
operation the LM3502 is in. The two operational modes of the LM3502 are continuous conduction mode (CCM)
and discontinuous conduction mode (DCM). Continuous conduction mode refers to the mode of operation where
during the switching cycle, the inductor current never goes to and stays at zero for any significant amount of time
during the switching cycle. Discontinuous conduction mode refers to the mode of operation where during the
switching cycle, the inductor current goes to and stays at zero for a significant amount of time during the
switching cycle. Figure 31 illustrates the threshold between CCM and DCM operation. In Figure 31, the inductor
current is right on the CCM/DCM operational threshold. Using this as a reference, a factor can be introduced to
calculate when a particular application is in CCM or DCM operation. R is a CCM/DCM factor we can use to
compute which mode of operation a particular application is in. If R is ≥ 1, then the application is operating in
CCM. Conversely, if R is < 1, the application is operating in DCM. The R factor inequalities are a result of the
components that make up the R factor. From Figure 31, the R factor is equal to the average inductor current,
IL(avg), divided by half the inductor ripple current, ΔiL. Using Figure 31 the following equation can be used to
compute R factor:
2 * IL (avg)
R =
DiL
[IOUT
[(1-D) * Eff]
[VIN * D]
]
IL (avg) =
DiL =
[L * Fs]
[2 * IOUT * L * Fs * (VOUT)2]
[(VIN)2 * Eff * (VOUT - VIN)]
R =
where
•
•
•
•
•
•
•
•
•
VIN: Input Voltage.
VOUT: Output Voltage.
Eff: Efficiency of the LM3502.
Fs: Switching Frequency.
IOUT: White LED Current/Load Current.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for CCM Operation.
ΔiL: Inductor Ripple Current
IL(avg): Average Inductor Current
(2)
For CCM operation, the duty cycle can be computed with:
14
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
D =
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
tON
TS
[VOUT - VIN]
D =
[VOUT
]
where
•
•
•
D: Duty Cycle for CCM Operation.
VOUT: Output Voltage.
VIN: Input Voltage.
(3)
For DCM operation, the duty cycle can be computed with:
tON
D =
TS
[2 * IOUT * L * (VOUT - VIN) * Fs]
D =
[(VIN)2 * Eff]
where
•
•
•
•
•
•
D: Duty Cycle for DCM Operation.
VOUT: Output Voltage.
VIN: Input Voltage.
IOUT: White LED Current/Load Current.
Fs: Switching Frequency.
L: Inductor Value/Inductance Magnitude.
(4)
INDUCTOR SELECTION
In order to maintain inductance, an inductor used with the LM3502 should have a saturation current rating larger
than the peak inductor current of the particular application. Inductors with low DCR values contribute decreased
power losses and increased efficiency. The peak inductor current can be computed for both modes of operation:
CCM and DCM.
The cycle-by-cycle peak inductor current for CCM operation can be computed with:
DiL
IPeak I (avg) +
ö
L
2
[IOUT
]
[VIN * D]
+
IPeak
ö
[(1 - D) * Eff]
[2 * L * Fs]
where
•
•
•
•
•
•
•
•
•
VIN: Input Voltage.
Eff: Efficiency of the LM3502.
Fs: Switching Frequency.
IOUT: White LED Current/Load Current.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for CCM Operation.
IPEAK: Peak Inductor Current.
ΔiL: Inductor Ripple Current.
IL(avg): Average Inductor Current.
(5)
The cycle-by-cycle peak inductor current for DCM operation can be computed with:
[VIN * D]
IPeak
ö
[L * Fs]
where
•
VIN: Input Voltage.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
•
•
•
•
Fs: Switching Frequency.
L: Inductance Magnitude/Inductor Value.
D: Duty Cycle for DCM Operation.
IPEAK: Peak Inductor Current.
(6)
The minimum inductance magnitude/inductor value for the LM3502 can be calculated using the following, which
is only valid when the duty cycle is > 0.5:
[VIN * RDS(ON) * ((D/D‘) - 1)]
L >
[1.562 * Fs]
where
•
•
•
•
•
D: Duty Cycle.
D: 1–D.
RDS(ON): NMOS Power Switch ON
VIN: Input Voltage.
L: Inductance Magnitude/Inductor Value.
(7)
This equation gives the value required to prevent subharmonic oscillations. The result of this equation and the
inductor average and ripple current should be accounted for when choosing an inductor value.
Some recommended inductor manufacturers included but are not limited to:
DO1608C-223
CoilCraft
www.coilcraft.com
DT1608C-223
CAPACITOR SELECTION
Multilayer ceramic capacitors are the best choice for use with the LM3502. Multilayer ceramic capacitors have
the lowest equivalent series resistance (ESR). Applied voltage or DC bias, temperature, dielectric material type
(X7R, X5R, Y5V, etc), and manufacturer component tolerance have an affect on the true or effective capacitance
of a ceramic capacitor. Be aware of how your application will affect a particular ceramic capacitor by analyzing
the aforementioned factors of your application. Before selecting a capacitor always consult the capacitor
manufacturer’s data curves to verify the effective or true capacitance in your application.
INPUT CAPACITOR SELECTION
The input capacitor serves as an energy reservoir for the inductor. In addition to acting as an energy reservoir for
the inductor the input capacitor is necessary for the reduction in input voltage ripple and noise experienced by
the LM3502. The reduction in input voltage ripple and noise helps ensure the LM3502’s proper operation, and
reduces the effect of the LM3502 on other devices sharing the same supply voltage. To ensure low input voltage
ripple, the input capacitor must have an extremely low ESR. As a result of the low input voltage ripple
requirement multilayer ceramic capacitors are the best choice. A minimum capacitance of 2.0 µF is required for
normal operation, so consult the capacitor manufacturer’s data curves to verify whether the minimum
capacitance requirement is going to be achieved for a particular application.
OUTPUT CAPACITOR SELECTION
The output capacitor serves as an energy reservoir for the white LED load when the internal power FET switch
(Figure 4: N1) is on or conducting current. The requirements for the output capacitor must include worst case
operation such as when the load opens up and the LM3502 operates in over-voltage protection (OVP) mode
operation. A minimum capacitance of 0.5µF is required to ensure normal operation. Consult the capacitor
manufacturer’s data curves to verify whether the minimum capacitance requirement is going to be achieved for a
particular application.
Some recommended capacitor manufacturers included but are not limited to:
Taiyo
Yuden
GMK212BJ105MD
(0805/35V)
www.t-yuden.com
www.murata.com
muRata
GRM40-035X7R105K
(0805/50V)
16
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
TDK
C3216X7R1H105KT
(1206/50V)
www.tdktca.com
C3216X7R1C475K
(1206/16V)
AVX
08053D105MAT
(0805/25V)
www.avxcorp.com
08056D475KAT
(0805/6.3V)
1206ZD475MAT
(1206/10V)
DIODE SELECTION
To maintain high efficiency it is recommended that the average current rating (IF or IO) of the selected diode
should be larger than the peak inductor current (ILpeak). At the minimum, the average current rating of the diode
should be larger than the maximum LED current. To maintain diode integrity the peak repetitive forward current
(IFRM) must be greater than or equal to the peak inductor current (ILpeak). Diodes with low forward voltage ratings
(VF) and low junction capacitance magnitudes (CJ or CT or CD) are conducive to high efficiency. The chosen
diode must have a reverse breakdown voltage rating (VR and/or VRRM) that is larger than the output voltage
(Vout). No matter what type of diode is chosen, Schottky or not, certain selection criteria must be followed:
1. VR and VRRM > VOUT
2. IF or IO ≥ ILOAD or IOUT
3. IFRM ≥ ILpeak
Some recommended diode manufacturers included but are not limited to:
Vishay
SS12(1A/20V)
SS14(1A/40V)
SS16(1A/60V)
www.vishay.com
On
MBRM120E
(1A/20V)
www.onsemi.com
Semiconductor
MBRS1540T3
(1.5A/40V)
MBR240LT
(2A/40V)
Central
Semiconductor
CMSH1- 40M
(1A/40V)
www.centralsemi.com
SHUTDOWN AND START-UP
On startup, the LM3502 contains special circuitry that limits the peak inductor current which prevents large
current spikes from loading the battery or power supply. When Cntrl ≥ 1.4V and both the En1 and En2 signals
are less than 0.3V, the LM3502 will enter a low IQ state and regulation will end. During this low IQ mode the
output voltage is a diode drop below the supply voltage and the soft-start will be reset to limit the peak inductor
current at the next startup. When both En1 and En2 are less than 0.3V, the P1 PMOS and N2 NMOS switches
will turn off.
When Cntrl < 0.3V for more than 12ms, typicaly, the LM3502 will shutdown and the output voltage will be a diode
drop below the supply voltage. If the Cntrl pin is low for more than 12ms, the soft-start will reset to limit the peak
inductor current at the next startup.
When Cntrl is < 0.3 but for less than 12ms, typically, the device will not shutdown and reset the soft-start but shut
off the NMOS N1 Power Device to allow for PWM contrl of the LED current.
THERMAL SHUTDOWN
The LM3502 stops regulating when the internal semiconductor junction temperature reaches approximately
140°C. The internal thermal shutdown has approximately 20°C of hysteresis which results in the LM3502 turning
back on when the internal semiconductor junction temperature reaches 120°C. When the thermal shutdown
temperature is reached, the softstart is reset to prevent inrush current when the die temperature cools.
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: LM3502
LM3502
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
www.ti.com
UNDER VOLTAGE PROTECTION
The LM3502 contains protection circuitry to prevent operation for low input supply voltages. When Vin drops
below 2.3V, typically the LM3502 will no longer regulate. In this mode, the output volage will be one diode drop
below Vin and the softstart will be reset. When Vin increases above 2.4V, typically, the device will begin
regulating again.
OVER VOLTAGE PROTECTION
The LM3502 contains dedicated circuitry for monitoring the output voltage. In the event that the LED network is
disconnected from the LM3502, the output voltage will increase and be limited to 15.5V(typ.) for the 16V version ,
24V(typ.) for the 25V version, 34V(typ.) for the 35V version and 42V(typ.) for the 44V version (see eletrical table
for more details). In the event that the network is reconnected, regulation will resume at the appropriate output
voltage.
LAYOUT CONSIDERATIONS
All components, except for the white LEDs, must be placed as close as possible to the LM3502. The die attach
pad (DAP) must be soldered to the ground plane.
The input bypass capacitor CIN, as shown in Figure 1, must be placed close to the IC and connect between the
VIN and PGND pins. This will reduce copper trace resistance which effects input voltage ripple of the IC. For
additional input voltage filtering, a 100nF bypass capacitor can be placed in parallel with CIN to shunt any high
frequency noise to ground. The output capacitor, COUT, must be placed close to the IC and be connected
between the VOUT1 and PGND pins. Any copper trace connections for the COUT capacitor can increase the series
resistance, which directly effects output voltage ripple and efficiency. The current setting resistor, R1, should be
kept close to the Fb pin to minimize copper trace connections that can inject noise into the system. The ground
connection for the current setting resistor network should connect directly to the PGND pin. The AGND pin
should be tied directly to the PGND pin. Trace connections made to the inductor should be minimized to reduce
power dissipation and increase overall efficiency while reducing EMI radiation. For more details regarding layout
guidelines for switching regulators, refer to Applications Note AN-1149.
18
Submit Documentation Feedback
Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502
LM3502
www.ti.com
SNVS339B –SEPTEMBER 2005–REVISED MAY 2013
REVISION HISTORY
Changes from Revision A (May 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 18
Copyright © 2005–2013, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Links: LM3502
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
LM3502ITL-16/NOPB
LM3502ITL-25/NOPB
LM3502ITL-44/NOPB
LM3502SQ-16/NOPB
LM3502SQ-25/NOPB
LM3502SQ-35/NOPB
LM3502SQ-44/NOPB
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LIFEBUY
DSBGA
DSBGA
DSBGA
WQFN
WQFN
WQFN
WQFN
YPA
10
10
10
16
16
16
16
250
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SANB
SAPB
SDLB
LIFEBUY
LIFEBUY
LIFEBUY
LIFEBUY
LIFEBUY
LIFEBUY
YPA
YPA
RGH
RGH
RGH
RGH
250
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
1000
1000
1000
1000
Green (RoHS
& no Sb/Br)
L00048B
L00049B
L00044B
L00050B
Green (RoHS
& no Sb/Br)
CU SN
Green (RoHS
& no Sb/Br)
CU SN
Green (RoHS
& no Sb/Br)
CU SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM3502ITL-16/NOPB
LM3502ITL-25/NOPB
LM3502ITL-44/NOPB
LM3502SQ-16/NOPB
LM3502SQ-25/NOPB
LM3502SQ-35/NOPB
LM3502SQ-44/NOPB
DSBGA
DSBGA
DSBGA
WQFN
WQFN
WQFN
WQFN
YPA
YPA
YPA
RGH
RGH
RGH
RGH
10
10
10
16
16
16
16
250
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
2.03
2.03
2.03
4.3
2.21
2.21
2.21
4.3
0.76
0.76
0.76
1.3
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
250
8.4
8.0
1000
1000
1000
1000
12.4
12.4
12.4
12.4
12.0
12.0
12.0
12.0
4.3
4.3
1.3
4.3
4.3
1.3
4.3
4.3
1.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM3502ITL-16/NOPB
LM3502ITL-25/NOPB
LM3502ITL-44/NOPB
LM3502SQ-16/NOPB
LM3502SQ-25/NOPB
LM3502SQ-35/NOPB
LM3502SQ-44/NOPB
DSBGA
DSBGA
DSBGA
WQFN
WQFN
WQFN
WQFN
YPA
YPA
YPA
RGH
RGH
RGH
RGH
10
10
10
16
16
16
16
250
250
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
250
1000
1000
1000
1000
Pack Materials-Page 2
PACKAGE OUTLINE
RGH0016A
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
5
0
0
WQFN
4.1
3.9
B
A
0.5
0.3
PIN 1 INDEX AREA
0.3
0.2
4.1
3.9
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
0.8 MAX
SEATING PLANE
(0.1)
TYP
2.6 0.1
5
8
SEE TERMINAL
DETAIL
12X 0.5
4
9
4X
1.5
1
12
0.3
16X
0.2
0.1
0.05
PIN 1 ID
(OPTIONAL)
C A
C
B
13
16
0.5
0.3
16X
4214978/A 10/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGH0016A
WQFN - 0.8 mm max height
WQFN
(
2.6)
SYMM
16
13
SEE DETAILS
16X (0.6)
16X (0.25)
1
12
(0.25) TYP
SYMM
(3.8)
(1)
9
4
12X (0.5)
5X ( 0.2)
VIA
5
8
(1)
(3.8)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214978/A 10/2013
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RGH0016A
WQFN - 0.8 mm max height
WQFN
SYMM
(0.675)
METAL
TYP
13
16
16X (0.6)
16X (0.25)
12
1
(0.675)
(0.25) TYP
SYMM
(3.8)
9
4
12X (0.5)
8
5
4X (1.15)
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
78% PRINTED SOLDER COVERAGE BY AREA
SCALE:15X
4214978/A 10/2013
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
MECHANICAL DATA
YPA0010
0.600
±0.075
D
E
TLP10XXX (Rev D)
D: Max = 2.124 mm, Min =2.063 mm
E: Max = 1.946 mm, Min =1.885 mm
4215069/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明