LM2941SX/NOPB [TI]
LM2941/LM2941C 1A Low Dropout Adjustable Regulator; LM2941 / LM2941C 1A低压降稳压器可调
| 型号： | LM2941SX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM2941/LM2941C 1A Low Dropout Adjustable Regulator |
| 文件： | 总26页 (文件大小：3237K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
LM2941/LM2941C 1A Low Dropout Adjustable Regulator
Check for Samples: LM2941, LM2941C
1
FEATURES
DESCRIPTION
The LM2941 positive voltage regulator features the
ability to source 1A of output current with a typical
dropout voltage of 0.5V and a maximum of 1V over
2
•
•
•
•
•
•
•
•
•
•
WSON Space Saving Package
Output Voltage Adjustable From 5V to 20V
Dropout Voltage Typically 0.5V @ IO = 1A
Output Current in Excess of 1A
Trimmed Reference Voltage
the entire temperature range. Furthermore,
a
quiescent current reduction circuit has been included
which reduces the ground pin current when the
differential between the input voltage and the output
voltage exceeds approximately 3V. The quiescent
current with 1A of output current and an input-output
differential of 5V is therefore only 30mA. Higher
quiescent currents only exist when the regulator is in
the dropout mode (VIN − VOUT ≤ 3V).
Reverse Battery Protection
Internal Short Circuit Current Limit
Mirror Image Insertion Protection
P+ Product Enhancement Tested
TTL, CMOS Compatible ON/OFF Switch
Designed also for vehicular applications, the LM2941
and all regulated circuitry are protected from reverse
battery installations or two-battery jumps. During line
transients, such as load dump when the input voltage
can momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
down to protect both the internal circuits and the load.
Familiar regulator features such as short circuit and
thermal overload protection are also provided.
Connection Diagrams
TO-220 Plastic Package
8-Lead WSON Surface Mount Package
ADJ
ON/OFF
1
2
3
4
8
7
6
5
GND
GND
INPUT
N/C
GND*
N/C
Figure 1. Top View
See Package Number KC
OUTPUT
TO-263 Surface-Mount Package
* TIE TO GND OR LEAVE FLOATING
Figure 3. Top View
See Package Number NGN
Figure 2. See Package Number KTT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
LM2941T, LM2941S, LM2941LD
LM2941CT, LM2941CS
60V
45V
Input Voltage (Survival Voltage, ≤ 100ms)
(3)
Internal Power Dissipation
Internally Limited
150°C
Maximum Junction Temperature
Storage Temperature Range
−65°C ≤ TJ ≤ +150°C
260°C, 10s
235°C, 30s
235°C, 30s
±2 kV
TO-220 (T), Wave
TO-263 (S)
Soldering Temperature(4)
WSON-8 (LD)
(5)
ESD Rating
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For
ensured specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is
37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that
6 vias be placed under the center pad to improve thermal performance.
(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperature and time are for Sn-Pb (STD) only.
(5) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Test method is per
JESD22–A114.
Operating Ratings
Maximum Input Voltage
26V
−40°C ≤ TJ ≤ 125°C
0°C ≤ TJ ≤ 125°C
−40°C ≤ TJ ≤ 125°C
0°C ≤ TJ ≤ 125°C
−40°C ≤ TJ ≤ 125°C
LM2941T
LM2941CT
LM2941S
LM2941CS
LM2941LD
Temperature Range
Electrical Characteristics—LM2941T, LM2941S, LM2941LD
5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,
while those in boldface type apply over the full Operating Temperature Range.
LM2941T
LM2941S
LM2941LD
Limit
Units
(Limits)
Parameter
Conditions
Typ
1.237/1.211
1.313/1.339
10/10
V(min)
V(max)
(1)
Reference Voltage
5mA ≤ IO ≤ 1A
1.275
Line Regulation
Load Regulation
VO + 2V ≤ VIN ≤ 26V, IO = 5mA
50mA ≤ IO ≤ 1A
4
7
mV/V(max)
mV/V(max)
10/10
100 mADC and 20 mArms
fO = 120Hz
Output Impedance
Quiescent Current
7
mΩ/V
VO + 2V ≤ VIN < 26V, IO = 5mA
10
30
15/20
45/60
mA(max)
mA(max)
VIN = VO + 5V, IO = 1A
(1) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit.
Submit Documentation Feedback
2
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
Electrical Characteristics—LM2941T, LM2941S, LM2941LD (continued)
5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,
while those in boldface type apply over the full Operating Temperature Range.
LM2941T
LM2941S
LM2941LD
Limit
Units
(Limits)
Parameter
Conditions
Typ
10Hz–100kHz
IO = 5mA
RMS Output Noise, % of VOUT
0.003
%
Ripple Rejection
fO = 120Hz, 1 Vrms, IL = 100mA
0.005
0.4
0.02/0.04
%/V(max)
%/1000 Hr
V(max)
Long Term Stability
IO = 1A
0.5
0.8/1.0
200/200
1.6
Dropout Voltage
IO = 100mA
VIN Max = 26V(2)
110
1.9
mV(max)
A(min)
Short Circuit Current
Maximum Line Transient
VO Max 1V Above Nominal VO
RO = 100, t ≤ 100ms
75
31
60/60
26/26
V(min)
VDC
Maximum Operational Input Voltage
Reverse Polarity
DC Input Voltage
RO = 100, VO ≥ −0.6V
t ≤ 100ms, RO = 100Ω
−30
−15/−15
V(min)
Reverse Polarity
Transient Input Voltage
−75
1.30
1.30
50
−50/−50
0.80/0.80
2.00/2.00
100/300
V(min)
V(max)
V(min)
ON/OFF Threshold
Voltage ON
I
O ≤ 1A
O ≤ 1A
ON/OFF Threshold
Voltage OFF
I
ON/OFF Threshold
Current
VON/OFF = 2.0V, IO ≤ 1A
μA(max)
(2) Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures.
Electrical Characteristics—LM2941CT, LM2941CS
5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,
while those in boldface type apply over the full Operating Temperature Range.
Limit
(1)
Units
(Limits)
V(min)
Parameter
Conditions
Typ
1.237/1.211
(2)
Reference Voltage
5mA ≤ IO ≤ 1A
1.275
1.313/1.339
V(max)
Line Regulation
Load Regulation
VO + 2V ≤ VIN ≤ 26V, IO = 5mA
50mA ≤ IO ≤ 1A
4
7
10
10
mV/V(max)
mV/V(max)
100 mADC and 20 mArms
fO = 120Hz
Output Impedance
Quiescent Current
7
mΩ/V
VO + 2V ≤ VIN < 26V, IO = 5mA
10
30
15
mA(max)
mA(max)
VIN = VO + 5V, IO = 1A
45/60
RMS Output Noise,
% of VOUT
10Hz–100kHz
IO = 5mA
0.003
%
Ripple Rejection
fO = 120Hz, 1 Vrms, IL = 100mA
0.005
0.4
0.02
%/V(max)
%/1000 Hr
V(max)
Long Term Stability
IO = 1A
0.5
0.8/1.0
200/200
1.6
Dropout Voltage
IO = 100mA
110
1.9
mV(max)
A(min)
(3)
Short Circuit Current
VIN Max = 26V
(1) All limits specified at room temperature (standard typeface) and at temperature extremes (boldface type). All room temperature limits are
100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC)
methods.
(2) The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit.
(3) Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
Electrical Characteristics—LM2941CT, LM2941CS (continued)
5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,
while those in boldface type apply over the full Operating Temperature Range.
Limit
(1)
Units
Parameter
Conditions
Typ
(Limits)
Maximum Line
Transient
VO Max 1V Above Nominal VO
RO = 100Ω, T ≤ 100ms
55
31
45
26
V(min)
VDC
Maximum Operational
Input Voltage
Reverse Polarity
DC Input Voltage
RO = 100Ω, VO ≥ −0.6V
T ≤ 100ms, RO = 100Ω
−30
−55
1.30
1.30
50
−15
−45
0.80
2.00
100
V(min)
V(min)
V(max)
V(min)
μA(max)
Reverse Polarity
Transient Input Voltage
ON/OFF Threshold
Voltage ON
I
O ≤ 1A
O ≤ 1A
ON/OFF Threshold
Voltage OFF
I
ON/OFF Threshold
Current
VON/OFF = 2.0V, IO ≤ 1A
Thermal Performance
Thermal Resistance
Junction-to-Case, θJC
5-Lead TO-220
1
1
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
5-Lead TO-263
8-Lead WSON
5.3
53
73
35
Thermal Resistance
Junction-to-Ambient, θJA
5-Lead TO-220
(1)
5-Lead TO-263 (See TO-263 Mounting)
8-Lead WSON (See WSON Mounting)
(1) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is
37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that
6 vias be placed under the center pad to improve thermal performance.
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
Typical Performance Characteristics
Dropout Voltage
Dropout Voltage vs. Temperature
Figure 4.
Figure 5.
Output Voltage
Quiescent Current vs. Temperature
Figure .
Figure 6.
Quiescent Current
Quiescent Current
Figure 7.
Figure 8.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Line Transient Response
Load Transient Response
Figure 9.
Figure 10.
Ripple Rejection
Output Impedance
Figure 11.
Figure 12.
Low Voltage Behavior
Low Voltage Behavior
Figure 13.
Figure 14.
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Output Capacitor ESR
Output at Voltage Extremes
Figure 15.
Figure 16.
Output at Voltage Extremes
Peak Output Current
Figure 17.
Figure 18.
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (TO-263)
Figure 19.
Figure 20.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
Definition of Terms
Dropout Voltage: The input-voltage differential at which the circuit ceases to regulate against further reduction
in input voltage. Measured when the output voltage has dropped 100mV from the nominal value obtained at
(VOUT + 5V) input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not
significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
APPLICATION HINTS
Output Capacitor
A Tantalum capacitor with a minimum capacitance value of 22 μF, and ESR in the range of 0.01Ω to 5Ω, is
required at the output pin for loop stability. It must be located less than 1 cm from the device. There is no
limitation on any additional capacitance.
Alternately, a high quality X5R/X7R 22 μF ceramic capacitor may be used for the output capacitor only if an
appropriate value of series resistance is added to simulate the ESR requirement. The ceramic capacitor selection
must include an appropriate voltage de-rating of the capacitance value due to the applied output voltage. The
series resistor (for ESR simulation) should be in the range of 0.1Ω to 1.0Ω.
Setting the Output Voltage
The output voltage range is 5V to 20V and is set by the two external resistors, R1 and R2. See the Typical
Applications. The output voltage is given by the formula:
VOUT = VREF x ((R1+R2) / R1)
(1)
where VREF is typically 1.275V.
Using 1.00 kΩ for R1 will ensure that the bias current error of the adjust pin will be negligible. Using a R1 value
higher than 10 kΩ may cause the output voltage to shift across temperature due to variations in the adjust pin
bias current.
Calculating the upper resistor (R2) value of the pair when the lower resistor (R1) value is known is accomplished
with the following formula:
R2 = R1 x ((VOUT / VREF) - 1)
(2)
The resistors used for R1 and R2 should be high quality, tight tolerance, and with matching temperature
coefficients. It is important to remember that, although the value of VREF is ensured, the final value of VOUT is not.
The use of low quality resistors for R1 and R2 can easily produce a VOUT value that is unacceptable.
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
ON/OFF
The ON/OFF pin has no internal pull-up or pull-down to establish a default condition and, as a result, this pin
must be terminated externally, either actively or passively.
The ON/OFF pin requires a low level to enable the output, and a high level to disable the output. To ensure
reliable operation, the ON/OFF pin voltage must rise above the maximum ON/OFF(OFF) voltage threshold (2.00V)
to disable the output, and must fall below the minimum ON/OFF(ON) voltage threshold (0.80V) to enable the
output. If the ON/OFF function is not needed this pin can be connected directly to Ground.
If the ON/OFF pin is being pulled to a high state through a series resistor, an allowance must be made for the
ON/OFF pin current that will cause a voltage drop across the pull-up resistor.
Thermal Overload Protection
The LM2941 incorporates a linear form of thermal protection that limits the junction temperature (TJ) to typically
155°C.
Should the LM2941 see a fault condition that results in excessive power dissipation and the junction temperature
approaches 155°C, the device will respond by reducing the output current (which reduces the power dissipation)
to hold the junction temperature at 155°C.
Thermal Overload protection is not an ensured operating condition. Operating at, or near to, the Thermal
Overload condition for any extended period of time is not encouraged, or recommended, as this may shorten the
lifetime of the device.
Power Dissipation
Consideration should be given to the maximum power dissipation (PD(MAX)) which is limited by the maximum
operating junction temperature (TJ(MAX)) of 125°C, the maximum operating ambient temperature (TA(MAX)) of the
application, and the thermal resistance (θJA) of the package. Under all possible conditions, the junction
temperature (TJ) must be within the range specified in the Operating Ratings. The total power dissipation of the
device is given by:
PD = ( (VIN − VOUT) x IOUT) + (VIN x IGND
)
(3)
where IGND is the operating ground pin current of the device (specified under Electrical Characteristics).
The maximum allowable junction temperature rise (ΔTJ) depends on the maximum expected ambient
temperature (TA(MAX)) of the application, and the maximum allowable junction temperature (TJ(MAX)):
ΔTJ = TJ(MAX) − TA(MAX)
(4)
The maximum allowable value for junction to ambient Thermal Resistance, θJA, required to keep the junction
temperature, TJ, from exceeding maximum allowed can be calculated using the formula:
θJA = ΔTJ / PD(MAX)
(5)
The maximum allowable power dissipation, PD(MAX), required allowed for a specific ambient temperature can be
calculated using the formula:
PD(MAX) = ΔTJ / θJA
(6)
Additional information for thermal performance of surface mount packages can be found in AN-1520: A Guide to
Board Layout for Best Thermal Resistance for Exposed Packages (literature number SNVA183), AN-1187:
Leadless Leadframe Package (LLP) (literature number SNOA401), and AN-2020: Thermal Design By Insight, Not
Hindsight (literature number SNVA419).
TO-263 Mounting
The thermal dissipation of the TO-263 package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the TAB.
The TAB on the bottom of the TO-263 package is connected to the die substrate via a conductive die attach
adhesive, and to device pin 3. As such, it is strongly recommend that the TAB area be connected to copper area
directly under the TAB that is extended into the ground plane via multiple thermal vias. Alternately, but not
recommended, the TAB may be left floating (i.e. no direct electrical connection). The TAB must not be connected
to any potential other than ground.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
For the LM2941S in the KTT TO-263 package, the junction-to-case thermal rating, θJC, is 1°C/W, where the
CASE is defined as the bottom of the package at the center of the TAB area. The junction-to-ambient thermal
performance for the LM2941S in the TO-263 package, using the JEDEC JESD51 standards is summarized in the
following table:
Board
Type
Thermal
Vias
θJC
θJA
JEDEC
2-Layer
None
1°C/W
73°C/W
JESD 51-3
1
2
4
8
1°C/W
1°C/W
1°C/W
1°C/W
35°C/W
30°C/W
26°C/W
24°C/W
JEDEC
4-Layer
JESD 51-7
6
5
4
3
2
1
0
ꢀ
= 35°C/W
JA
ꢀ
JA
= 30°C/W
ꢀ
= 26°C/W
JA
ꢀ
= 24°C/W
JA
LM2941S (TO-263)
0
20
40
60
80
100
AMBIENT TEMPERATURE (°C)
Figure 21. PD(MAX) vs TA for LM2941S (TO-263)
WSON Mounting
The NGN (Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in
Application Note 1187 (literature number SNOA401). Referring to the section PCB Design Recommendations
in AN-1187 (Page 5), it should be noted that the pad style which should be used with the WSON package is the
NSMD (non-solder mask defined) type.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate via a conductive
die attach adhesive, and to device pin 2 and pin 7. As such, it is strongly recommend that the DAP area be
connected copper area directly under the DAP that is extended into the ground plane via multiple thermal vias.
Alternately, but not recommended, the DAP area may be left floating (i.e. no direct electrical connection). The
DAP area must not be connected to any potential other than ground.
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
For the LM2941LD in the NGN 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 5.3°C/W,
where the CASE is defined as the bottom of the package at the center of the DAP area. The junction-to-ambient
thermal performance for the LM2941LD in the NGN 8-Lead WSON package, using the JEDEC JESD51
standards is summarized in the following table:
Board
Type
Thermal
Vias
θJC
θJA
JEDEC
2-Layer
None
5.3°C/W
181°C/W
JESD 51-3
1
2
4
6
5.3°C/W
5.3°C/W
5.3°C/W
5.3°C/W
58°C/W
49°C/W
40°C/W
35°C/W
JEDEC
4-Layer
JESD 51-7
6
5
4
3
2
1
0
ꢀ
= 58°C/W
JA
ꢀ
= 49°C/W
JA
ꢀ
= 40°C/W
JA
ꢀ
= 35°C/W
JA
LM2941LD (LLP)
20 40
0
60
80
100
AMBIENT TEMPERATURE (°C)
Figure 22. PD(MAX) vs TA for LM2941LD (WSON)
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
Typical Applications
Note: Using 1k for R1 will ensure that the bias current error from the adjust pin will be negligible. Do not bypass R1 or
R2. This will lead to instabilities.
* Required if regulator is located far from power supply filter.
** COUT must be at least 22μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator and the ESR is critical; see curve.
Figure 23. 5V to 20V Adjustable Regulator
*** To assure shutdown, select Resistor R3 to ensure at least 300μA of pull-up current when S1 is open. (Assume 2V
at the ON/OFF pin.)
Figure 24. 1A Switch
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
www.ti.com
SNVS770G –JUNE 1999–REVISED APRIL 2013
Equivalent Schematic Diagram
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LM2941 LM2941C
LM2941, LM2941C
SNVS770G –JUNE 1999–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2013) to Revision G
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
14
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM2941CS
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
DDPAK/
TO-263
KTT
5
5
5
5
5
5
5
5
5
45
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
Call TI
CU SN
CU SN
CU SN
Call TI
Level-3-245C-168 HR
Call TI
LM2941CS
P+
LM2941CS/NOPB
LM2941CSX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
KTT
KC
45
500
500
45
Pb-Free (RoHS
Exempt)
0 to 125
LM2941CS
P+
DDPAK/
TO-263
TBD
0 to 125
LM2941CS
P+
LM2941CSX/NOPB
LM2941CT
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Call TI
0 to 125
LM2941CS
P+
TO-220
TO-220
TO-220
TO-220
TO-220
TBD
0 to 125
LM2941CT
P+
LM2941CT/LB03
LM2941CT/LF03
LM2941CT/LF04
LM2941CT/NOPB
NDH
NDH
NEB
KC
45
TBD
Call TI
LM2941CT
P+
45
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM2941CT
P+
45
Green (RoHS
& no Sb/Br)
LM2941CT
P+
45
Green (RoHS
& no Sb/Br)
0 to 125
LM2941CT
P+
LM2941LD
ACTIVE
ACTIVE
WSON
WSON
NGN
NGN
8
8
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
L2941LD
LM2941LD/NOPB
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
L2941LD
LM2941LDX
ACTIVE
ACTIVE
WSON
WSON
NGN
NGN
8
8
4500
4500
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
L2941LD
L2941LD
LM2941LDX/NOPB
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
LM2941S
LM2941S/NOPB
LM2941SX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
KTT
KTT
5
5
5
5
45
45
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM2941S
P+
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
Call TI
LM2941S
P+
DDPAK/
TO-263
500
500
TBD
LM2941S
P+
LM2941SX/NOPB
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
LM2941S
P+
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM2941T
ACTIVE
TO-220
TO-220
TO-220
TO-220
TO-220
TO-220
KC
5
5
5
5
5
5
45
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
CU SN
CU SN
Call TI
-40 to 125
LM2941T
P+
LM2941T/LB03
LM2941T/LB04
LM2941T/LB08
LM2941T/LF03
LM2941T/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NDH
NEB
NEC
NDH
KC
45
45
45
45
45
Call TI
LM2941T
P+
Call TI
LM2941T
P+
Call TI
LM2941T
P+
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM2941T
P+
Green (RoHS
& no Sb/Br)
-40 to 125
LM2941T
P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2941CSX
DDPAK/
TO-263
KTT
KTT
5
5
500
500
330.0
24.4
10.75 14.85
5.0
16.0
24.0
Q2
LM2941CSX/NOPB
DDPAK/
TO-263
330.0
24.4
10.75 14.85
5.0
16.0
24.0
Q2
LM2941LD
LM2941LD/NOPB
LM2941LDX
WSON
WSON
WSON
WSON
NGN
NGN
NGN
NGN
KTT
8
8
8
8
5
1000
1000
4500
4500
500
178.0
178.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
24.4
4.3
4.3
4.3
4.3
4.3
4.3
4.3
4.3
1.3
1.3
1.3
1.3
5.0
8.0
8.0
12.0
12.0
12.0
12.0
24.0
Q1
Q1
Q1
Q1
Q2
8.0
LM2941LDX/NOPB
LM2941SX
8.0
DDPAK/
TO-263
10.75 14.85
16.0
LM2941SX/NOPB
DDPAK/
TO-263
KTT
5
500
330.0
24.4
10.75 14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2941CSX
LM2941CSX/NOPB
LM2941LD
DDPAK/TO-263
DDPAK/TO-263
WSON
KTT
KTT
NGN
NGN
NGN
NGN
KTT
KTT
5
5
8
8
8
8
5
5
500
500
367.0
367.0
210.0
213.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
191.0
367.0
367.0
367.0
367.0
45.0
45.0
35.0
55.0
35.0
35.0
45.0
45.0
1000
1000
4500
4500
500
LM2941LD/NOPB
LM2941LDX
WSON
WSON
LM2941LDX/NOPB
LM2941SX
WSON
DDPAK/TO-263
DDPAK/TO-263
LM2941SX/NOPB
500
Pack Materials-Page 2
MECHANICAL DATA
NDH0005D
www.ti.com
MECHANICAL DATA
NGN0008A
LDC08A (Rev B)
www.ti.com
MECHANICAL DATA
KTT0005B
TS5B (Rev D)
BOTTOM SIDE OF PACKAGE
www.ti.com
MECHANICAL DATA
NEB0005F
www.ti.com
MECHANICAL DATA
NEC0005D
TA05D (Rev A)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明