LM2903PWRG3 [TI]
DUAL DIFFERENTIAL COMPARATORS; 双差分比较仪型号: | LM2903PWRG3 |
厂家: | TEXAS INSTRUMENTS |
描述: | DUAL DIFFERENTIAL COMPARATORS |
文件: | 总26页 (文件大小:1165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
LM193 . . . D OR JG PACKAGE
LM293 . . . D, DGK, OR P PACKAGE
LM293A . . . D OR DGK PACKAGE
LM393, LM393A . . . D, DGK, P, PS, OR PW PACKAGE
LM2903 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
D
D
Single Supply or Dual Supplies
Wide Range of Supply Voltage
− Max Rating . . . 2 V to 36 V
− Tested to 30 V . . . Non-V Devices
− Tested to 32 V . . . V-Suffix Devices
D
Low Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ Per
Comparator
1OUT
1IN−
1IN+
GND
VCC
1
2
3
4
8
7
6
5
2OUT
2IN−
2IN+
D
D
Low Input Bias Current . . . 25 nA Typ
Low Input Offset Current . . . 3 nA Typ
(LM193)
LM193 . . . FK PACKAGE
(TOP VIEW)
D
D
Low Input Offset Voltage . . . 2 mV Typ
Common-Mode Input Voltage Range
Includes Ground
D
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 36 V
3
2
1 20 19
18
NC
2OUT
NC
2IN−
NC
NC
1IN−
NC
1IN+
NC
4
5
6
7
8
D
D
Low Output Saturation Voltage
17
16
15
14
Output Compatible With TTL, MOS, and
CMOS
9 10 11 12 13
description/ordering information
These devices consist of two independent voltage
comparators that are designed to operate from a
single power supply over a wide range of voltages.
Operation from dual supplies also is possible as
long as the difference between the two supplies is
NC − No internal connection
2 V to 36 V, and V is at least 1.5 V more positive than the input common-mode voltage. Current drain is
CC
independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve
wired-AND relationships.
The LM193 is characterized for operation from −55°C to 125°C. The LM293 and LM293A are characterized for
operation from −25°C to 85°C. The LM393 and LM393A are characterized for operation from 0°C to 70°C. The
LM2903 is characterized for operation from −40°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2010, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
unless otherwise noted. On all other products, production
testing of all parameters.
processing does not necessarily include testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
{
ORDERING INFORMATION
V
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IOmax
T
A
MAX V
PACKAGE}
CC
AT 25°C
PDIP (P)
Tube of 50
LM393P
LM393P
Tube of 75
LM393D
Reel of 2500
Reel of 2500
Reel of 2000
Tube of 150
Reel of 2000
Reel of 2000
Reel of 2500
Tube of 50
LM393DR
SOIC (D)
SOP (PS)
LM393
L393
LM393DRG3
LM393PSR
LM393PW
5 mV
30 V
LM393PWR
LM393PWRG3
LM393DGKR
LM393AP
TSSOP (PW)
L393
0°C to 70°C
§
MSOP/VSSOP (DGK)
PDIP (P)
M9_
LM393AP
LM393A
Tube of 75
LM393AD
SOIC (D)
Reel of 2500
Reel of 2000
Reel of 2000
Reel of 2500
Tube of 50
LM393ADR
LM393APSR
LM393APWR
LM393ADGKR
LM293P
2 mV
30 V
SOP (PS)
L393A
L393A
TSSOP (PW)
MSOP/VSSOP (DGK)
PDIP (P)
§
M8_
LM293P
LM293
Tube of 75
LM293D
Reel of 2500
Reel of 2500
Reel of 2500
Tube of 75
LM293DR
5 mV
2 mV
30 V
30 V
SOIC (D)
LM293DRG3
LM293DGKR
LM293AD
−25°C to 85°C
§
MSOP/VSSOP (DGK)
SOIC (D)
MC_
LM293A
Reel of 2500
Reel of 2500
Tube of 50
LM293ADR
LM293ADGKR
LM2903P
§
MSOP/VSSOP (DGK)
PDIP (P)
MD_
LM2903P
Tube of 75
LM2903D
Reel of 2500
Reel of 2500
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2500
Reel of 2500
Reel of 2000
LM2903DR
LM2903DRG3
LM2903PSR
LM2903PWR
LM2903PWRG3
LM2903DGKR
LM2903VQDR
LM2903VQPWR
SOIC (D)
LM2903
7 mV
30 V
SOP (PS)
L2903
L2903
TSSOP (PW)
−40°C to 125°C
§
MSOP/VSSOP (DGK)
SOIC (D)
MA_
L2903V
L2903V
7 mV
2 mV
32 V
32 V
TSSOP (PW)
SOIC (D)
Reel of 2500
Reel of 2000
Tube of 50
LM2903AVQDR
LM2903AVQPWR
LM193JG
L2903AV
L2903AV
LM193JG
LM193FK
LM193
TSSOP (PW)
CDIP (JG)
LCCC (FK)
SOIC (D)
−55°C to 125°C
5 mV
30 V
Tube of 55
LM193FK
Reel of 2500
LM193DR
†
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
‡
§
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
symbol (each comparator)
IN+
IN−
OUT
schematic (each comparator)
V
CC
80-µA
Current Regulator
80 µA
10 µA
60 µA
10 µA
COMPONENT COUNT
Epi-FET
Diodes
Resistors
1
2
2
IN+
IN−
OUT
GND
Transistors 30
Current values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
CC
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
ID
Input voltage range, V (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 36 V
I
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
O
Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
O
Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θ (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Package thermal impedance, θ (see Notes 6 and 7): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JC
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN−.
3. Short circuits from outputs to V can cause excessive heating and eventual destruction.
CC
4. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable case
J
JC
C
temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
C
JC
J
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM293
LM193
LM393
TYP
†
PARAMETER
TEST CONDITIONS
UNIT
T
A
MIN
TYP
MAX
MIN
MAX
V
V
V
= 5 V to 30 V,
= 1.4 V,
25°C
2
5
2
5
CC
V
IO
Input offset voltage
mV
O
Full range
9
9
= V
IC
IC(min)
25°C
Full range
25°C
3
25
5
50
I
I
Input offset current
Input bias current
V
= 1.4 V
= 1.4 V
nA
nA
IO
O
O
100
250
−25 −100
−300
−25 −250
−400
V
IB
Full range
0 to
0 to
25°C
V
V
− 1.5
V
− 1.5
CC
CC
Common-mode
input voltage range
V
ICR
V
‡
0 to
− 2
0 to
− 2
CC
Full range
V
CC
Large-signal
V = 15 V,
CC
A
differential-voltage
amplification
V
= 1.4 V to 11.4 V,
25°C
50
200
50
200
V/mV
VD
OH
O
R
V
≥ 15 kΩ to V
L
CC
= 5 V,
V
V
= 1 V
= 1 V
25°C
Full range
25°C
0.1
0.1
50
1
nA
OH
OH
ID
High-level
output current
I
V
= 30 V,
1
µA
ID
150
0.8
400
700
150
400
700
Low-level
output voltage
V
I
I
OL
= 4 mA,
= 1.5 V,
V
V
= −1 V
mV
mA
mA
OL
ID
Full range
Low-level
output current
V
OL
= −1 V
= 5 V
25°C
6
6
OL
ID
V
V
25°C
1
0.8
1
CC
I
Supply current
R = ∞
L
CC
= 30 V
Full range
2.5
2.5
CC
†
‡
Full range (MIN or MAX) for LM193 is −55°C to 125°C, for LM293 is 25°C to 85°C, and for LM393 is 0°C to 70°C. All characteristics are measured
with zero common-mode input voltage, unless otherwise specified.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V + − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the V level; the comparator provides a proper output
CC
CC
state. Either or both inputs can go to 30 V without damage.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM293A
LM393A
TYP
1
†
PARAMETER
TEST CONDITIONS
UNIT
T
A
MIN
MAX
2
25°C
Full range
25°C
V
V
= 5 V to 30 V, V = 1.4 V,
O
CC
V
Input offset voltage
Input offset current
Input bias current
mV
nA
nA
IO
= V
IC
IC(min)
4
5
50
150
I
I
V
O
= 1.4 V
= 1.4 V
IO
Full range
25°C
−25 −250
−400
V
IB
O
Full range
0 to
25°C
Full range
25°C
V
V
− 1.5
CC
Common-mode input voltage
range
V
A
V
ICR
§
0 to
− 2
CC
Large-signal differential-voltage
amplification
V
R
= 15 V, V = 1.4 V to 11.4 V,
CC
O
50
200
V/mV
VD
≥ 15 kΩ to V
L
CC
V
= 5 V,
V
= 1 V
= 1 V
25°C
Full range
25°C
0.1
50
1
nA
OH
OH
ID
I
High-level output current
OH
V
= 30 V,
V
ID
µA
150
400
700
V
I
Low-level output voltage
Low-level output current
Supply current
I
= 4 mA,
= 1.5 V,
OL
V
= −1 V
mV
mA
mA
OL
OL
ID
ID
Full range
25°C
V
V
V
V
= −1 V
= 5 V
6
OL
25°C
0.8
1
CC
CC
I
R = ∞
L
CC
= 30 V
Full range
2.5
†
§
Full range (MIN or MAX) for LM293A is 25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with zero common-mode
input voltage, unless otherwise specified.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V
− 1.5 V, but either or both inputs can go to 30 V without damage.
CC+
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
LM2903
TYP
LM2903A
TYP
†
PARAMETER
TEST CONDITIONS
UNIT
T
A
MIN
MAX
MIN
MAX
‡
V
V
V
= 5 V to MAX ,
= 1.4 V,
25°C
2
7
1
2
CC
V
IO
Input offset voltage
mV
O
Full range
15
4
= V
IC
IC(min)
25°C
Full range
25°C
5
50
5
50
I
I
Input offset current
Input bias current
V
= 1.4 V
= 1.4 V
nA
nA
IO
O
O
200
200
−25 −250
−500
−25 −250
−500
V
IB
Full range
0 to
0 to
25°C
V
V
− 1.5
V
− 1.5
CC
CC
Common-mode
input voltage range
V
ICR
V
§
0 to
− 2
0 to
− 2
CC
Full range
V
CC
Large-signal
V = 15 V,
CC
A
differential-voltage
amplification
V
= 1.4 V to 11.4 V,
25°C
25
100
25
100
V/mV
VD
OH
O
R
V
≥ 15 kΩ to V
L
CC
= 5 V,
V
ID
= 1 V
25°C
Full range
25°C
0.1
50
1
0.1
50
1
nA
OH
OH
High-level
output current
I
V
= V MAX, V = 1 V
µA
CC
ID
150
400
700
150
400
700
Low-level
output voltage
V
I
I
OL
= 4 mA,
= 1.5 V,
V
V
= −1 V
mV
mA
mA
OL
ID
ID
Full range
Low-level
output current
V
OL
= −1 V
= 5 V
25°C
6
6
OL
V
V
25°C
0.8
1
0.8
1
CC
I
Supply current
R = ∞
L
CC
= MAX
Full range
2.5
2.5
CC
†
Full range (MIN or MAX) for LM2903 is −40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise
specified.
‡
§
V
CC
MAX = 30 V for non-V devices and 32 V for V-suffix devices.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is V − 1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage.
CC+
switching characteristics, VCC = 5 V, TA = 25°C
LM193
LM293, LM293A
LM393, LM393A
LM2903
PARAMETER
TEST CONDITIONS
UNIT
TYP
1.3
100-mV input step with 5-mV overdrive
TTL-level input step
R connected to 5 V through 5.1 kΩ,
C = 15 pF , See Note 8
L
L
Response time
µs
¶
0.3
¶
C includes probe and jig capacitance.
L
NOTE 8: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
5962-9452601Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
-55 to 125
5962-
9452601Q2A
LM193FKB
5962-9452601QPA
JM38510/11202BPA
LM193DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
SOIC
LCCC
JG
JG
D
8
8
1
1
TBD
TBD
Call TI
A42
Call TI
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
9452601QPA
LM193
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
JM38510
/11202BPA
8
2500
2500
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
POST-PLATE
LM193
LM193DRG4
D
8
Green (RoHS
& no Sb/Br)
LM193
LM193FKB
FK
20
TBD
5962-
9452601Q2A
LM193FKB
LM193JG
ACTIVE
ACTIVE
CDIP
CDIP
JG
JG
8
8
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
LM193JG
LM193JGB
9452601QPA
LM193
LM2903AVQDR
LM2903AVQDRG4
LM2903AVQPWR
LM2903AVQPWRG4
LM2903D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
2500
2500
2000
2000
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
L2903AV
Green (RoHS
& no Sb/Br)
L2903AV
TSSOP
TSSOP
SOIC
PW
PW
D
Green (RoHS
& no Sb/Br)
L2903AV
Green (RoHS
& no Sb/Br)
L2903AV
Green (RoHS
& no Sb/Br)
LM2903
LM2903DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM2903
LM2903DG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM2903
LM2903DGKR
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
(MAP ~ MAS ~ MAU)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM2903DGKRG4
LM2903DR
ACTIVE
VSSOP
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DGK
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
(MAP ~ MAS ~ MAU)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
2500
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
LM2903
LM2903DRE4
LM2903DRG3
LM2903DRG4
LM2903P
Green (RoHS
& no Sb/Br)
LM2903
D
Green (RoHS
& no Sb/Br)
LM2903
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
LM2903
P
Pb-Free
(RoHS)
LM2903P
LM2903P
L2903
LM2903PE4
LM2903PSR
LM2903PSRG4
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
PS
PS
2000
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SO
Green (RoHS
& no Sb/Br)
L2903
LM2903PWLE
LM2903PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
TBD
Call TI
Call TI
-40 to 125
-40 to 125
2000
2000
2000
2000
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L2903
L2903
L2903
L2903
2903Q
2903Q
2903Q
2903Q
LM2903PWRE4
LM2903PWRG3
LM2903PWRG4
LM2903QD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
D
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Green (RoHS
& no Sb/Br)
LM2903QDG4
LM2903QDR
SOIC
D
75
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
Green (RoHS
& no Sb/Br)
LM2903QDRG4
LM2903QP
SOIC
D
Green (RoHS
& no Sb/Br)
PDIP
P
TBD
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM2903VQDR
LM2903VQDRG4
LM2903VQPWR
LM2903VQPWRG4
LM293AD
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
L2903V
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
PW
PW
D
2500
2000
2000
75
Green (RoHS
& no Sb/Br)
L2903V
TSSOP
TSSOP
SOIC
Green (RoHS
& no Sb/Br)
L2903V
Green (RoHS
& no Sb/Br)
L2903V
Green (RoHS
& no Sb/Br)
LM293A
LM293ADE4
LM293ADG4
LM293ADGKR
LM293ADGKRG4
LM293ADR
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM293A
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM293A
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
75
Green (RoHS
& no Sb/Br)
(MDP ~ MDS ~ MDU)
(MDP ~ MDS ~ MDU)
LM293A
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM293ADRE4
LM293ADRG4
LM293D
SOIC
D
Green (RoHS
& no Sb/Br)
LM293A
SOIC
D
Green (RoHS
& no Sb/Br)
LM293A
SOIC
D
Green (RoHS
& no Sb/Br)
LM293
LM293DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM293
LM293DG4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM293
LM293DGKR
LM293DGKRG4
LM293DR
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
Green (RoHS
& no Sb/Br)
(MCP ~ MCS ~ MCU)
(MCP ~ MCS ~ MCU)
LM293
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-25 to 85
-25 to 85
-25 to 85
-25 to 85
-25 to 85
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM293DRE4
LM293DRG3
LM293DRG4
LM293P
ACTIVE
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
VSSOP
VSSOP
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM293
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
2500
2500
50
Green (RoHS
& no Sb/Br)
LM293
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
LM293
P
Pb-Free
(RoHS)
LM293P
LM293PE4
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
LM293P
LM393AD
D
75
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
LM393A
LM393ADE4
LM393ADG4
LM393ADGKR
LM393ADGKRG4
LM393ADR
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
D
75
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
DGK
DGK
D
2500
2500
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
0 to 70
(M8P ~ M8S ~ M8U)
(M8P ~ M8S ~ M8U)
LM393A
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
0 to 70
LM393ADRE4
LM393ADRG4
LM393AP
D
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
D
Green (RoHS
& no Sb/Br)
0 to 70
LM393A
P
Pb-Free
(RoHS)
0 to 70
LM393AP
LM393AP
L393A
LM393APE4
LM393APSR
LM393APSRE4
LM393APSRG4
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
0 to 70
PS
PS
PS
2000
2000
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
SO
Green (RoHS
& no Sb/Br)
0 to 70
L393A
SO
Green (RoHS
& no Sb/Br)
0 to 70
L393A
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM393APWLE
LM393APWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
PW
2000
2000
2000
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L393A
LM393APWRE4
LM393APWRG4
LM393D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
SOIC
PW
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
L393A
Green (RoHS
& no Sb/Br)
L393A
Green (RoHS
& no Sb/Br)
LM393
LM393DE4
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM393
LM393DG4
LM393DGKR
LM393DGKRG4
LM393DR
SOIC
D
75
Green (RoHS
& no Sb/Br)
LM393
VSSOP
VSSOP
SOIC
DGK
DGK
D
2500
2500
2500
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
(M9P ~ M9S ~ M9U)
(M9P ~ M9S ~ M9U)
LM393
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
LM393DRE4
LM393DRG3
LM393DRG4
LM393P
SOIC
D
Green (RoHS
& no Sb/Br)
LM393
SOIC
D
Green (RoHS
& no Sb/Br)
LM393
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU SN
LM393
PDIP
P
Pb-Free
(RoHS)
LM393P
LM393P
LM393P
LM393PE3
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
LM393PE4
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
LM393PSLE
LM393PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L393
L393
LM393PSRG4
ACTIVE
SO
PS
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM393PW
LM393PWE4
LM393PWG4
ACTIVE
TSSOP
TSSOP
TSSOP
PW
8
8
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
L393
ACTIVE
ACTIVE
PW
PW
150
150
Green (RoHS
& no Sb/Br)
0 to 70
L393
L393
Green (RoHS
& no Sb/Br)
0 to 70
LM393PWLE
LM393PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
2000
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
L393
L393
L393
L393
LM393PWRE4
LM393PWRG3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
CDIP
PW
PW
PW
JG
8
8
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
Green (RoHS
& no Sb/Br)
LM393PWRG4
Green (RoHS
& no Sb/Br)
CU NIPDAU
A42
0 to 70
M38510/11202BPA
TBD
-55 to 125
JM38510
/11202BPA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903, LM293 :
Automotive: LM2903-Q1
•
Enhanced Product: LM293-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM193DR
LM2903DGKR
LM2903DR
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2000
2000
2000
2500
2500
2000
2500
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
16.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
6.4
5.3
6.4
6.4
6.4
6.4
8.2
7.0
7.0
6.4
6.4
7.0
5.3
6.4
6.4
6.4
6.4
5.3
5.2
3.4
5.2
5.2
5.2
5.2
6.6
3.6
3.6
5.2
5.2
3.6
3.4
5.2
5.2
5.2
5.2
3.4
2.1
1.4
2.1
2.1
2.1
2.1
2.5
1.6
1.6
2.1
2.1
1.6
1.4
2.1
2.1
2.1
2.1
1.4
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM2903DR
SOIC
D
LM2903DRG4
LM2903DRG4
LM2903PSR
SOIC
D
SOIC
D
SO
PS
PW
PW
D
LM2903PWR
LM2903PWRG3
LM2903QDR
LM2903QDRG4
LM2903VQPWRG4
LM293ADGKR
LM293ADR
TSSOP
TSSOP
SOIC
SOIC
D
TSSOP
VSSOP
SOIC
PW
DGK
D
LM293ADR
SOIC
D
LM293ADRG4
LM293ADRG4
LM293DGKR
SOIC
D
SOIC
D
VSSOP
DGK
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM293DR
LM293DR
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
16.4
12.4
12.4
12.4
12.4
12.4
12.4
16.4
12.4
12.4
6.4
6.4
6.4
6.4
5.3
6.4
6.4
6.4
6.4
8.2
7.0
5.3
6.4
6.4
6.4
6.4
8.2
7.0
7.0
5.2
5.2
5.2
5.2
3.4
5.2
5.2
5.2
5.2
6.6
3.6
3.4
5.2
5.2
5.2
5.2
6.6
3.6
3.6
2.1
2.1
2.1
2.1
1.4
2.1
2.1
2.1
2.1
2.5
1.6
1.4
2.1
2.1
2.1
2.1
2.5
1.6
1.6
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
LM293DRG4
LM293DRG4
LM393ADGKR
LM393ADR
LM393ADR
LM393ADRG4
LM393ADRG4
LM393APSR
LM393APWR
LM393DGKR
LM393DR
D
D
DGK
D
D
D
D
PS
PW
DGK
D
TSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
LM393DR
D
LM393DRG4
LM393DRG4
LM393PSR
D
D
PS
PW
PW
LM393PWR
LM393PWRG3
TSSOP
TSSOP
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM193DR
LM2903DGKR
LM2903DR
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
D
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2000
2000
2000
2500
2500
2000
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2000
2000
2000
367.0
364.0
367.0
340.5
340.5
367.0
367.0
364.0
364.0
367.0
367.0
367.0
364.0
340.5
367.0
340.5
367.0
364.0
340.5
367.0
367.0
340.5
364.0
340.5
367.0
340.5
367.0
367.0
364.0
364.0
340.5
367.0
340.5
367.0
367.0
364.0
364.0
367.0
364.0
367.0
338.1
338.1
367.0
367.0
364.0
364.0
367.0
367.0
367.0
364.0
338.1
367.0
338.1
367.0
364.0
338.1
367.0
367.0
338.1
364.0
338.1
367.0
338.1
367.0
367.0
364.0
364.0
338.1
367.0
338.1
367.0
367.0
364.0
364.0
35.0
27.0
35.0
20.6
20.6
35.0
38.0
27.0
27.0
35.0
35.0
35.0
27.0
20.6
35.0
20.6
35.0
27.0
20.6
35.0
35.0
20.6
27.0
20.6
35.0
20.6
35.0
38.0
27.0
27.0
20.6
35.0
20.6
35.0
38.0
27.0
27.0
LM2903DR
D
LM2903DRG4
LM2903DRG4
LM2903PSR
LM2903PWR
LM2903PWRG3
LM2903QDR
LM2903QDRG4
LM2903VQPWRG4
LM293ADGKR
LM293ADR
D
D
PS
PW
PW
D
TSSOP
TSSOP
SOIC
SOIC
TSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
D
PW
DGK
D
LM293ADR
D
LM293ADRG4
LM293ADRG4
LM293DGKR
LM293DR
D
D
DGK
D
LM293DR
D
LM293DRG4
LM293DRG4
LM393ADGKR
LM393ADR
D
D
DGK
D
LM393ADR
D
LM393ADRG4
LM393ADRG4
LM393APSR
LM393APWR
LM393DGKR
LM393DR
D
D
PS
PW
DGK
D
TSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
LM393DR
D
LM393DRG4
LM393DRG4
LM393PSR
D
D
PS
PW
PW
LM393PWR
LM393PWRG3
TSSOP
TSSOP
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明