LM239AMDREP [TI]
QUAD DIFFERENTIAL COMPARATOR; 四路差分比较器
| 型号： | LM239AMDREP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUAD DIFFERENTIAL COMPARATOR |
| 文件： | 总14页 (文件大小：565K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM239A-EP
www.ti.com
SCLS496C –MAY 2003–REVISED JULY 2010
QUAD DIFFERENTIAL COMPARATOR
Check for Samples: LM239A-EP
1
FEATURES
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
Wide Supply Ranges
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range(1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
–
Single Supply: 2 V to 36 V
(Tested to 30 V for Non-V Devices and 32 V
for V-Suffix Devices)
–
Dual Supplies: ±1 V to ±18 V
(Tested to ±15 V for Non-V Devices and
±16 V for V-Suffix Devices)
•
•
•
•
Low Supply-Current Drain Independent of
Supply Voltage: 0.8 mA (Typ)
•
•
•
•
Low Input Bias Current: 25 nA (Typ)
Low Input Offset Current: 5 nA (Typ)
Low Input Offset Voltage: 2 mV (Typ)
D OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
1OUT
2OUT
VCC
OUT3
OUT4
GND
4IN+
4IN−
3IN+
3IN−
Common-Mode Input Voltage Range Includes
Ground
•
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage: ±36 V
2IN−
2IN+
1IN−
1IN+
•
•
Low Output Saturation Voltage
8
Output Compatible With TTL, MOS, and CMOS
(1) Custom temperature ranges available
DESCRIPTION/ORDERING INFORMATION
These devices consist of four independent voltage comparators that are designed to operate from a single power
supply over a wide range of voltages. Operation from dual supplies also is possible, as long as the difference
between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode
voltage. Current drain is independent of the supply voltage. The outputs can be connected to other
open-collector outputs to achieve wired-AND relationships.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM239A-EP
SCLS496C –MAY 2003–REVISED JULY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
LM239AQDREP
TOP-SIDE MARKING
LM239AEP
–40°C to 125°C
SOP - D
SOP - D
Tape and reel
Tape and reel
Tape and reel
LM239AMDREP
LM239AME
–55°C to 125°C
TSSOP - PW
LM239AMPWREP
LM239AE
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
SYMBOL (EACH COMPARATOR)
IN+
OUT
IN−
SCHEMATIC (EACH COMPARATOR)
V
CC
80-µA
Current
Regulator
60 µA
10 µA
80 µA
10 µA
IN+
IN−
OUT
GND
All current values shown are nominal.
2
Submit Documentation Feedback
Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): LM239A-EP
LM239A-EP
www.ti.com
SCLS496C –MAY 2003–REVISED JULY 2010
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VCC
VID
VI
Supply voltage(2)
Differential input voltage(3)
36
±36
V
V
Input voltage range (either input)
Output voltage
–0.3
36
V
VO
IO
36
V
Output current
20
mA
Duration of output short circuit to ground(4)
Package thermal impedance, junction to free air(5) (6)
Operating virtual-junction temperature
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Storage temperature range(7)
Unlimited
qJA
86 °C/W
TJ
136
°C
°C
°C
260
150
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ (max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ (max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
(7) Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Copyright © 2003–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): LM239A-EP
LM239A-EP
SCLS496C –MAY 2003–REVISED JULY 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
(2)
PARAMETER
TEST CONDITIONS(1)
TA
MIN
TYP
MAX
2.5
UNIT
VCC = 5 V to 30 V,
25°C
1
VIO
Input offset voltage
VIC = VICR min,
VO = 1.4 V
mV
Full range
5.5
25°C
Full range
25°C
5
50
150
IIO
Input offset current
Input bias current
VO = 1.4 V
VO = 1.4 V
nA
nA
–25
–250
–400
IIB
Full range
0 to
VCC – 1.5
25°C
Full range
25°C
Common-mode input-voltage
range(3)
VICR
V
0 to
VCC – 2
Large-signal differential-voltage
amplification
VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD
IOH
50
200
0.1
V/mV
RL ≥ 15 kΩ to VCC
VOH = 5 V
25°C
Full range
25°C
50
1
nA
High-level output current
VID = 1 V
VOH = 30 V
mA
150
400
700
VOL
Low-level output voltage
Low-level output current
VID = –1 V,
IOL = 4 mA
mV
Full range
25°C
IOL
ICC
VID = –1 V,
VO = 2.5 V,
VOL = 1.5 V
No load
6
16
mA
mA
Supply current
(four comparators)
25°C
0.8
2
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) Full range (MIN to MAX) for LM139 and LM139A is –55°C to 125°C. All characteristics are measured with zero common-mode input
voltage, unless otherwise specified.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the
common-mode voltage range is VCC+ – 1.5 V; however, one input can exceed VCC, and the comparator will provide a proper output
state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage.
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
1.3
UNIT
100-mV input step with 5-mV overdrive
TTL-level input step
RL connected to 5 V through 5.1 kΩ,
CL = 15 pF(1) (2)
Response time
ms
0.3
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
4
Submit Documentation Feedback
Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): LM239A-EP
LM239A-EP
www.ti.com
SCLS496C –MAY 2003–REVISED JULY 2010
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
INPUT BIAS CURRENT
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
80
70
60
50
40
30
20
10
0
1.8
1.6
1.4
1.2
1
TA = –55°C
TA = –55°C
TA = 25°C
TA = 0°C
TA = 0°C
TA = 25°C
TA = 70°C
TA = 70°C
0.8
0.6
0.4
0.2
0
TA = 125°C
TA = 125°C
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
VCC – Supply Voltage – V
VCC – Supply Voltage – V
OUTPUT SATURATION VOLTAGE
10
1
TA = 125°C
TA = 25°C
0.1
0.01
TA = –55°C
0.001
0.01
0.1
1
10
100
IO – Output Sink Current – mA
Copyright © 2003–2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): LM239A-EP
LM239A-EP
SCLS496C –MAY 2003–REVISED JULY 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
RESPONSE TIME FOR VARIOUS OVERDRIVES
NEGATIVE TRANSITION
RESPONSE TIME FOR VARIOUS OVERDRIVES
POSITIVE TRANSITION
6
5
6
5
Overdrive = 5 mV
Overdrive = 5 mV
4
4
Overdrive = 20 mV
Overdrive = 100 mV
Overdrive = 20 mV
Overdrive = 100 mV
3
3
2
2
1
1
0
0
-1
-1
-0.3
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25
-0.3
0
0.25 0.5 0.75
1
1.25 1.5 1.75
2
2.25
t – Time – µs
t – Time – µs
6
Submit Documentation Feedback
Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): LM239A-EP
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
LM239AMDREP
LM239AMPWREP
LM239AQDREP
V62/03672-01XE
V62/03672-02XE
V62/03672-02YE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
TSSOP
SOIC
D
PW
D
14
14
14
14
14
14
2500
2000
2500
2500
2500
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
SOIC
D
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
SOIC
D
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
TSSOP
PW
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2010
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM239A-EP :
Catalog: LM239A
•
Automotive: LM239A-Q1
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM239AMDREP
LM239AMPWREP
LM239AQDREP
SOIC
TSSOP
SOIC
D
PW
D
14
14
14
2500
2000
2500
330.0
330.0
330.0
16.4
12.4
16.4
6.5
6.9
6.5
9.0
5.6
9.0
2.1
1.6
2.1
8.0
8.0
8.0
16.0
12.0
16.0
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM239AMDREP
LM239AMPWREP
LM239AQDREP
SOIC
TSSOP
SOIC
D
PW
D
14
14
14
2500
2000
2500
333.2
367.0
333.2
345.9
367.0
345.9
28.6
35.0
28.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明