LM1894MX/NOPB [TI]
立体动态降噪系统 | D | 14 | 0 to 70;型号: | LM1894MX/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | 立体动态降噪系统 | D | 14 | 0 to 70 |
文件: | 总19页 (文件大小:1046K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
LM1894 Dynamic Noise Reduction System DNR
Check for Samples: LM1894
1
FEATURES
DESCRIPTION
The LM1894 is a stereo noise reduction circuit for use
with audio playback systems. The DNR system is
non-complementary, meaning it does not require
encoded source material. The system is compatible
with virtually all prerecorded tapes and FM
broadcasts. Psychoacoustic masking, and an
adaptive bandwidth scheme allow the DNR to
achieve 10 dB of noise reduction. DNR can save
circuit board space and cost because of the few
additional components required.
2
•
•
•
•
Non-Complementary Noise Reduction, “Single
Ended”
Low Cost External Components, No Critical
Matching
Compatible with All Prerecorded Tapes and
FM
10 dB Effective Tape Noise Reduction
CCIR/ARM Weighted
•
•
Wide Supply Range, 4.5V to 18V
1 Vrms Input Overload
APPLICATIONS
•
•
•
•
•
Automotive Radio/Tape Players
Compact Portable Tape Players
Quality HI-FI Tape Systems
VCR Playback Noise Reduction
Video Disc Playback Noise Reduction
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2013, Texas Instruments Incorporated
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
Typical Application
*R1 + R2 = 1 kΩ total.
See Application Hints.
Figure 1. Component Hook-Up for Stereo DNR System
14-Pin SOIC or PDIP or TSSOP
See D or NFF0014A or PW Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage
20V
VS/2
Input Voltage Range, Vpk
Operating Temperature(3)
Storage Temperature
0°C to +70°C
−65°C to +150°C
260°C
PDIP Package
SOIC Package
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
Soldering Information
215°C
220°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) For operation in ambient temperature above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance of:
(a) 80°C/W junction to ambient for the PDIP package,
(b) 105°C/W junction to ambient for the SOIC package, and
(c) 150°C/W junction to ambient for the TSSOP package.
2
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
Electrical Characteristics
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified
Parameter
Operating Supply Range
Conditions
Min
Typ
8
Max
18
Units
V
4.5
Supply Current
VS = 8V
17
30
mA
MAIN SIGNAL PATH
Voltage Gain
DC Ground Pin 9(1)
−0.9
3.7
−1
−1.1
4.3
V/V
V
DC Output Voltage
Channel Balance
Minimum Balance
4.0
DC Ground Pin 9
−1.0
1.0
dB
AC Ground Pin 9 with 0.1
675
27
965
1400
Hz
μFCapacitor(1)
Maximum Bandwidth
Effective Noise Reduction
Total Harmonic Distortion
Input Headroom
DC Ground Pin 9(1)
CCIR/ARM Weighted(2)
34
−10
0.05
1.0
46
−14
0.1
kHz
dB
DC Ground Pin 9
%
Maximum VIN for 3% THD
AC Ground Pin 9
Vrms
Output Headroom
Signal to Noise
Maximum VOUT for 3% THD
DC Ground Pin 9
V
S − 1.5
Vp-p
BW = 20 Hz–20 kHz, re 300 mV
AC Ground Pin 9
79
77
dB
dB
DC Ground Pin 9
CCIR/ARM Weighted re 300 mV(3)
AC Ground Pin 9
82
70
88
76
dB
dB
DC Ground Pin 9
CCIR Peak, re 300 mV(4)
AC Ground Pin 9
77
64
dB
dB
kΩ
dB
DC Ground Pin 9
Input Impedance
Pin 2 and Pin 13
14
20
26
20
Channel Separation
Power Supply Rejection
DC Ground Pin 9
−50
−70
C14 = 100 μF,
VRIPPLE = 500 mVrms,
f = 1 kHz
−40
−56
dB
Output DC Shift
Reference DVM to Pin 14 and
Measuree Output DC Shift from
Minimum to Maximum Band-width(5)
4.0
mV
(1) To force the DNR system into maximum bandwidth, DC ground the input to the peak detector, pin 9. A negative temperature coefficient
of −0.5%/°C on the bandwidth, reduces the maximum bandwidth at increased ambient temperature or higher package dissipation. AC
ground pin 9 or pin 6 to select minimum bandwidth. To change minimum and maximum bandwidth, see Application Hints.
(2) The maximum noise reduction CCIR/ARM weighted is about 14 dB. This is accomplished by changing the bandwidth from maximum to
minimum. In actual operation, minimum bandwidth is not selected, a nominal minimum bandwidth of about 2 kHz gives −10 dB of noise
reduction. See Application Hints.
(3) The CCIR/ARM weighted noise is measured with a 40 dB gain amplifier between the DNR system and the CCIR weighting filter; it is
then input referred.
(4) Measured using the Rhode-Schwartz psophometer.
(5) Pin 10 is DC forced half way between the maximum bandwidth DC level and minimum bandwidth DC level. An AC 1 kHz signal is then
applied to pin 10. Its peak-to-peak amplitude is VDC (max BW) − VDC (min BW).
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LM1894
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
Units
Electrical Characteristics (continued)
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified
Parameter
CONTROL SIGNAL PATH
Summing Amplifier Voltage Gain
Gain Amplifier Input Impedance
Voltage Gain
Conditions
Min
Typ
Max
Both Channels Driven
0.9
24
1
1.1
39
V/V
kΩ
V/V
Ω
Pin 6
30
Pin 6 to Pin 8
Pin 9
21.5
560
30
24
26.5
840
36
Peak Detector Input Impedance
Voltage Gain
700
33
Pin 9 to Pin 10
V/V
μs
Attack Time
Measured to 90% of Final Value with
10 kHz Tone Burst
300
500
700
Decay Time
Measured to 90% of Final Value with
10 kHz Tone Burst
60
45
75
ms
V
DC Voltage Range
Minimum Bandwidth to Maximum
Bandwidth
1.1
3.8
4
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
Typical Performance Characteristics
Supply Current vs Supply Voltage
Channel Separation (Referred to the Output) vs Frequency
Figure 2.
Figure 3.
Power Supply Rejection Ratio
(Referred to the Output) vs Frequency
THD vs Frequency
Figure 4.
Figure 5.
Gain of Control Path vs Frequency
(with 10 kHz FM Pilot Filter)
−3 dB Bandwidth vs Frequency and Control Signal
Figure 6.
Figure 7.
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LM1894
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Main Signal Path Bandwidth vs Voltage Control
Peak Detector Response
Figure 8.
Figure 9.
Output Response
Figure 10.
6
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
External Component Guide
(Figure 1)
Component
Value
Purpose
C1
0.1 μF–100 μF
May be part of power supply, or may be added to suppress power supply
oscillation.
C2, C13
1 μF
Blocks DC, pin 2 and pin 13 are at DC potential of VS/2. C2, C13 form a low
frequency pole with 20k RIN
.
C14
25 μF–100 μF
0.0033 μF
Improves power supply rejection.
C3, C12
Forms integrator with internal gm block and op amp. Sets bandwidth
conversion gain of 33 Hz/μA of gm current.
C4, C11
C5
1 μF
Output coupling capacitor. Output is at DC potential of VS/2.
0.1 μF
Works with R1 and R2 to attenuate low frequency transients which could
disturb control path operation.
C6
0.001 μF
Works with input resistance of pin 6 to form part of control path frequency
weighting.
C8
0.1 μF
Combined with L8 and CL forms 19 kHz filter for FM pilot. This is only
required in FM applications(1)
.
L8, CL
C9
4.7 mH, 0.015 μF
0.047 μF
Forms 19 kHz filter for FM pilot. L8 is Toko coil CAN-1A185HM(1)(2)
.
Works with input resistance of pin 9 to form part of control path frequency
weighting.
C10
1 μF
1 kΩ
Set attack and decay time of peak detector.
R1, R2
Sensitivity resistors set the noise threshold. Reducing attenuation causes
larger signals to be peak detected and larger bandwidth in main signal path.
Total value of R1 + R2 should equal 1 kΩ.
R8
100Ω
Forms RC roll-off with C8. This is only required in FM applications.
(1) When FM applications are not required, pin 8 and pin 9 hook-up as follows:
(2) Toko America Inc., 1250 Feehanville Drive, Mt. Prospect IL 60056
Circuit Operation
The LM1894 has two signal paths, a main signal path and a bandwidth control path. The main path is an audio
low pass filter comprised of a gm block with a variable current, and an op amp configured as an integrator. As
seen in Figure 11, DC feedback constrains the low frequency gain to AV = −1. Above the cutoff frequency of the
filter, the output decreases at −6 dB/oct due to the action of the 0.0033 μF capacitor.
The purpose of the control paths is to generate a bandwidth control signal which replicates the ear's sensitivity to
noise in the presence of a tone. A single control path is used for both channels to keep the stereo image from
wandering. This is done by adding the right and left channels together in the summing amplifier of Figure 11. The
R1, R2 resistor divider adjusts the incoming noise level to open slightly the bandwidth of the low pass filter.
Control path gain is about 60 dB and is set by the gain amplifier and peak detector gain. This large gain is
needed to ensure the low pass filter bandwidth can be opened by very low noise floors. The capacitors between
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LM1894
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
the summing amplifier output and the peak detector input determine the frequency weighting as shown in the
Typical Performance Characteristics. The 1 μF capacitor at pin 10, in conjunction with internal resistors, sets the
attack and decay times. The voltage is converted into a proportional current which is fed into the gm blocks. The
bandwidth sensitivity to gm current is 33 Hz/μA. In FM stereo applications at 19 kHz pilot filter is inserted
between pin 8 and pin 9 as shown in Figure 1.
Figure 12 is an interesting curve and deserves some discussion. Although the output of the DNR system is a
linear function of input signal, the −3 dB bandwidth is not. This is due to the non-linear nature of the control path.
The DNR system has a uniform frequency response, but looking at the −3 dB bandwidth on a steady state basis
with a single frequency input can be misleading. It must be remembered that a single input frequency can only
give a single −3 dB bandwidth and the roll-off from this point must be a smooth −6 dB/oct.
A more accurate evaluation of the frequency response can be seen in Figure 13. In this case the main signal
path is frequency swept, while the control path has a constant frequency applied. It can be seen that different
control path frequencies each give a distinctive gain roll-off.
PSYCHOACOUSTIC BASICS
The dynamic noise reduction system is a low pass filter that has a variable bandwidth of 1 kHz to 30 kHz,
dependent on music spectrum. The DNR system operates on three principles of psychoacoustics.
1. White noise can mask pure tones. The total noise energy required to mask a pure tone must equal the energy
of the tone itself. Within certain limits, the wider the band of masking noise about the tone, the lower the noise
amplitude need be. As long as the total energy of the noise is equal to or greater than the energy of the tone, the
tone will be inaudible. This principle may be turned around; when music is present, it is capable of masking noise
in the same bandwidth.
2. The ear cannot detect distortion for less than 1 ms. On a transient basis, if distortion occurs in less than 1 ms,
the ear acts as an integrator and is unable to detect it. Because of this, signals of sufficient energy to mask noise
open bandwidth to 90% of the maximum value in less than 1 ms. Reducing the bandwidth to within 10% of its
minimum value is done in about 60 ms: long enough to allow the ambience of the music to pass through, but not
so long as to allow the noise floor to become audible.
3. Reducing the audio bandwidth reduces the audibility of noise. Audibility of noise is dependent on noise
spectrum, or how the noise energy is distributed with frequency. Depending on the tape and the recorder
equalization, tape noise spectrum may be slightly rolled off with frequency on a per octave basis. The ear
sensitivity on the other hand greatly increases between 2 kHz and 10 kHz. Noise in this region is extremely
audible. The DNR system low pass filters this noise. Low frequency music will not appreciably open the DNR
bandwidth, thus 2 kHz to 20 kHz noise is not heard.
8
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
Block Diagram
Figure 11.
Figure 12. Output vs Frequency
Figure 13. −3 dB Bandwidth vs Frequency and
Control Signal
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LM1894
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
APPLICATION HINTS
The DNR system should always be placed before tone and volume controls as shown in Figure 1. This is
because any adjustment of these controls would alter the noise floor seen by the DNR control path. The
sensitivity resistors R1 and R2 may need to be switched with the input selector, depending on the noise floors of
different sources, i.e., tape, FM, phono. To determine the value of R1 and R2 in a tape system for instance;
apply tape noise (no program material) and adjust the ratio of R1 and R2 to open slightly the bandwidth of the
main signal path. This can easily be done by viewing the capacitor voltage of pin 10 with an oscilloscope, or by
using the circuit of Figure 14. This circuit gives an LED display of the voltage on the peak detector capacitor.
Adjust the values of R1 and R2 (their sum is always 1 kΩ) to light the LEDs of pin 1 and pin 18. The LED bar
graph does not indicate signal level, but rather instantaneous bandwidth of the two filters; it should not be used
as a signal-level indicator. For greater flexibility in setting the bandwidth sensitivity, R1 and R2 could be replaced
by a 1 kΩ potentiometer.
To change the minimum and maximum value of bandwidth, the integrating capacitors, C3 and C12, can be
scaled up or down. Since the bandwidth is inversely proportional to the capacitance, changing this 0.0039 μF
capacitor to 0.0033 μF will change the typical bandwidth from 965 Hz–34 kHz to 1.1 kHz–40 kHz. With C3 and
C12 set at 0.0033 μF, the maximum bandwidth is typically 34 kHz. A double pole double throw switch can be
used to completely bypass DNR.
The capacitor on pin 10 in conjunction with internal resistors sets the attack and decay times. The attack time
can be altered by changing the size of C10. Decay times can be decreased by paralleling a resistor with C10,
and increased by increasing the value of C10.
When measuring the amount of noise reduction of the DNR system, the frequency response of the cassette
should be flat to 10 kHz. The CCIR weighting network has substantial gain to 8 kHz and any additional roll-off in
the cassette player will reduce the benefits of DNR noise reduction. A typical signal-to-noise measurement circuit
is shown in Figure 15. The DNR system should be switched from maximum bandwidth to nominal bandwidth with
tape noise as a signal source. The reduction in measured noise is the signal-to-noise ratio improvement.
Figure 14. Bar Graph Display of Peak Detector Voltage
10
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
Figure 15. Technique for Measuring S/N Improvement of the DNR System
FOR FURTHER READING
Tape Noise Levels
1. “A Wide Range Dynamic Noise Reduction System”, Blackmer, “dB” Magazine,August-September 1972,
Volume 6, #8.
2. “Dolby B-Type Noise Reduction System”, Berkowitz and Gundry, Sert Journal,May-June 1974, Volume 8.
3. “Cassette vs Elcaset vs Open Reel”, Toole, Audioscene Canada, April 1978.
4. “CCIR/ARM: A Practical Noise Measurement Method”, Dolby, Robinson, Gundry, JAES,1978.
Noise Masking
1. “Masking and Discrimination”, Bos and De Boer, JAES, Volume 39, #4, 1966.
2. “The Masking of Pure Tones and Speech by White Noise”, Hawkins and Stevens, JAES, Volume 22, #1,
1950.
3. “Sound System Engineering”, Davis Howard W. Sams and Co.
4. “High Quality Sound Reproduction”, Moir, Chapman Hall, 1960.
5. “Speech and Hearing in Communication”, Fletcher, Van Nostrand, 1953.
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LM1894
LM1894
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
www.ti.com
Printed Circuit Layout
Figure 16. DNR Component Diagram
12
Submit Documentation Feedback
Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM1894
LM1894
www.ti.com
SNAS551C –DECEMBER 1994–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
Copyright © 1994–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LM1894
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM1894MX/NOPB
ACTIVE
SOIC
D
14
2500 RoHS & Green
SN
Level-1-260C-UNLIM
0 to 70
LM1894M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1894MX/NOPB
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Feb-2016
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
LM1894MX/NOPB
D
2500
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明