LM185BYH2.5/883 [TI]
LM185-2.5QML Micropower Voltage Reference Diode; LM185-2.5QML微功耗电压基准二极管型号: | LM185BYH2.5/883 |
厂家: | TEXAS INSTRUMENTS |
描述: | LM185-2.5QML Micropower Voltage Reference Diode |
文件: | 总14页 (文件大小:683K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM185-2.5QML
LM185-2.5QML Micropower Voltage Reference Diode
Literature Number: SNVS385
November 2005
LM185-2.5QML
Micropower Voltage Reference Diode
The extremely low power drain of the LM185-2.5 makes it
useful for micropower circuitry. This voltage reference can be
used to make portable meters, regulators or general purpose
analog circuitry with battery life approaching shelf life. Fur-
ther, the wide operating current allows it to replace older
references with a tighter tolerance part. For applications
requiring 1.2V see LM185-1.2.
General Description
The LM185-2.5 are micropower 2-terminal band-gap voltage
regulator diodes. Operating over a 20 µA to 20 mA current
range, they feature exceptionally low dynamic impedance
and good temperature stability. On-chip trimming is used to
provide tight voltage tolerance. Since the LM185-2.5 band-
gap reference uses only transistors and resistors, low noise
and good long term stability result.
Features
Careful design of the LM185-2.5 has made the device ex-
ceptionally tolerant of capacitive loading, making it easy to
use in almost any reference application. The wide dynamic
operating range allows its use with widely varying supplies
with excellent regulation.
n Operating current of 20 µA to 20 mA
n 0.6Ω dynamic impedance (A grade)
n Low temperature coefficient
n Low voltage reference—2.5V
Ordering Information
NS Part Number
LM185H-2.5-SMD
LM185H-2.5/883
JAN Part Number
NS Package Number
H02A
Package Description
2LD, T0–46 Metal Can
2LD, T0–46 Metal Can
10LD Ceramic SOIC
10LD Ceramic SOIC
2LD, T0–46 Metal Can
2LD, T0–46 Metal Can
2LD, T0–46 Metal Can
5962–8759402XA
H02A
LM185WG-2.5-QV
LM185WG-2.5/883
LM185BYH2.5/883
LM185BYH2.5-SMD
LM185BYH2.5-QV
5962–8759402VYA
5962–8759402YA
WG10A
WG10A
H02A
5962–8759406XA
5962–8759406VXA
H02A
H02A
Connection Diagrams
Ceramic SOIC (WG)
TO-46 Metal Can Package (H)
20156203
20156213
See NS Package Number WG10A
Bottom View
See NS Package Number H02A
© 2005 National Semiconductor Corporation
DS201562
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Schematic Diagram
20156201
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2
Absolute Maximum Ratings (Note 1)
Reverse Current
30 mA
10 mA
Forward Current
Operating Temperature Range
Storage Temperature
Maximum Junction Temperature (TJmax) (Note 2)
Lead Temperature (Soldering, 10 sec)
TO-46 Metal Can
−55˚C ≤ TA ≤ + 125˚C
−55˚C ≤ TA ≤ + 150˚C
150˚C
300˚C
260˚C
Ceramic SOIC
Thermal Resistance
θJA
T0–46 Metal Can (Still Air)
T0–46 Metal Can (500LF / Min Air Flow)
Ceramic SOIC (Still Air)
Ceramic SOIC (500LF / Min Air Flow)
θJC
300˚C/W
139˚C/W
194˚C/W
128˚C/W
T0–46 Metal Can
57˚C/W
23˚C/W
Ceramic SOIC
Package Weight (Typical)
T0–46 Metal Can
TBD
Ceramic SOIC
210 mg
4000V
ESD Tolerance (Note 3)
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Static tests at
Static tests at
Static tests at
Temp ˚C
25
1
2
3
125
-55
25
4
5
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Settling time at
125
-55
25
6
7
8A
8B
9
125
-55
25
10
11
12
13
14
125
-55
25
Settling time at
125
-55
Settling time at
3
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LM185–2.5 Electrical Characteristics
DC Parameters
Sub-
groups
Symbol
VRef
Parameter
Conditions
Notes
Min Max
Units
Reverse Breakdown Voltage
IR = 20µA
IR = 30µA
IR = 1mA
2.462 2.538
2.425 2.575
2.462 2.538
2.425 2.575
2.462 2.538
2.425 2.575
V
V
1
2, 3
1
V
V
2, 3
1
IR = 20mA
V
V
2, 3
1
∆VRef / ∆IR Reverse Breakdown Voltage
20µA ≤ IR ≤ 1mA
30µA ≤ IR ≤ 1mA
1mA ≤ IR ≤ 20mA
-1.0
-1.5
1.0
1.5
mV
mV
mV
mV
V
Change with Current
2, 3
1
-10.0 10.0
-20.0 20.0
2, 3
1
VF
Forward Bias Voltage
IF = 2mA
-1.0
-0.4
DC Drift Parameters
Delta calculations performed on QMLV devices at group B , subgroup 5, unless otherwise specified on IPI.
Sub-
groups
Symbol
VRef
Parameter
Conditions
Notes
Min Max
Units
Reverse Breakdown Voltage
IR = 20µA
IR = 20mA
-10
-10
10
10
mV
mV
1
1
LM185BY–2.5 Electrical Characteristics
DC Parameters
Sub-
groups
1
Symbol
VRef
Parameter
Conditions
Notes
Min Max
Units
Reverse Breakdown Voltage
IR = 20µA
IR = 30µA
IR = 1mA
2.462 2.538
2.425 2.575
2.462 2.538
2.425 2.575
2.462 2.538
2.425 2.575
V
V
2, 3
1
V
V
2, 3
1
IR = 20mA
V
V
2, 3
1
∆VRef / ∆IR Reverse Breakdown Voltage
20µA ≤ IR ≤ 1mA
30µA ≤ IR ≤ 1mA
1mA ≤ IR ≤ 20mA
-1.0
-1.5
1.0
1.5
mV
mV
mV
mV
V
Change with Current
2, 3
1
-10.0 10.0
-20.0 20.0
−1.0 −0.4
50
2, 3
1
VF
TC
Forward Bias Voltage
IF = 2mA
Temperature Coefficient
(Note 4)
PPM/˚C
2, 3
DC Drift Parameters
Delta calculations performed on QMLV devices at group B , subgroup 5, unless otherwise specified on IPI.
Sub-
groups
Symbol
Parameter
Conditions
Notes
Min Max
Units
VRef
VRef
1
2
Reverse Breakdown Voltage
Reverse Breakdown Voltage
IR = 20µA
IR = 20mA
-10
-10
10
10
mV
mV
1
1
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4
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
(maximum junction temperature), θ (package junction
JA
Jmax
to ambient thermal resistance), and T (ambient temperature). The maximum allowable power dissipation at any temperature is P
= (T
- T )/θ or the
A
Dmax
Jmax A JA
number given in the Absolute Maximum Ratings, whichever is lower.
Note 3: Human body model, 1.5 kΩ in series with 100 pF
Note 4: The average temperature coefficient is defined as the maximum deviation of reference voltage, at all measured temperatures between the operating T
Min
& T
, divided by (T
− T ). The measured temperatures (T
) are −55˚C, 25˚C, & 125˚C or ∆V
/ (T
− T
)
Max
Max
Min
Measured
Ref
Max
Min
Typical Performance Characteristics
Reverse Characteristics
Reverse Characteristics
20156216
20156215
Forward Characteristics
Temperature Drift
20156217
20156218
5
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Typical Performance Characteristics (Continued)
Reverse Dynamic
Impedance
Reverse Dynamic
Impedance
20156219
20156220
Noise Voltage
Filtered Output Noise
20156222
20156221
Response Time
20156223
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6
Applications
Wide Input Range Reference
20156212
Micropower Reference from 9V Battery
20156202
Micropower 10V Reference (Note 6)
Micropower 5V Reference (Note 5)
20156210
Note 6: I . 30 µA standby current
Q
20156209
Note 5: I . 40 µA
Q
7
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Applications (Continued)
Precision 1 µA to 1 mA Current Sources
20156225
20156224
METER THERMOMETERS
0˚C–100˚C Thermometer
0˚F–50˚F Thermometer
20156227
20156226
Calibration
Calibration
1. Short LM385-2.5, adjust R3 for IOUT=temp at 1.8 µA/˚K
2. Remove short, adjust R2 for correct reading in ˚F
1. Short LM385-2.5, adjust R3 for IOUT=temp at 1µA/˚K
2. Remove short, adjust R2 for correct reading in
centigrade
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8
Applications (Continued)
Improving Regulation of Adjustable Regulators
20156207
Micropower Thermocouple Cold Junction Compensator
20156206
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Seebeck
Co-
Voltage
Voltage
Thermocouple
Type
R1
R2
Across R1 Across R2
@
efficient (Ω) (Ω)
25˚C
(mV)
(µV/˚C)
(mV)
15.60
12.77
12.17
1.908
J
T
K
52.3
42.8
40.8
6.4
523 1.24k
432 1k
14.32
11.78
11.17
1.766
412 953Ω
63.4 150Ω
S
Typical supply current 50 µA
9
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Revision History Section
Released
Revision
Section
Originator
Changes
11/08/05
A
New Release, Corporate format
L. Lytle
2 MDS data sheets converted into one Corp.
data sheet format. MNLM185-2.5-X Rev 2A2
and MNLM185-2.5BY-X Rev 1B1 will be
archived.
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10
Physical Dimensions inches (millimeters) unless otherwise noted
Ceramic SOIC Package (WG)
NS Package Number WG10A
TO-46 Metal Can Package (H)
NS Package Number H02A
11
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Notes
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