LM137 [TI]

扩展温度 1.5A 可调节输出负电压稳压器/LDO;
LM137
型号: LM137
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

扩展温度 1.5A 可调节输出负电压稳压器/LDO

电源电路 线性稳压器IC
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中文:  中文翻译
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LM137, LM337-N  
www.ti.com  
SNVS778D MAY 1999REVISED APRIL 2013  
LM137/LM337-N 3-Terminal Adjustable Negative Regulators  
Check for Samples: LM137, LM337-N  
1
FEATURES  
DESCRIPTION  
The LM137/LM337-N are adjustable 3-terminal  
negative voltage regulators capable of supplying in  
excess of 1.5A over an output voltage range of  
1.2V to 37V. These regulators are exceptionally  
easy to apply, requiring only 2 external resistors to  
set the output voltage and 1 output capacitor for  
frequency compensation. The circuit design has been  
optimized for excellent regulation and low thermal  
transients. Further, the LM137 series features internal  
current limiting, thermal shutdown and safe-area  
compensation, making them virtually blowout-proof  
against overloads.  
2
Output Voltage Adjustable from 1.2V to 37V  
1.5A Output Current Specified, 55°C to  
+150°C  
Line Regulation Typically 0.01%/V  
Load Regulation Typically 0.3%  
Excellent Thermal Regulation, 0.002%/W  
77 dB Ripple Rejection  
Excellent Rejection of Thermal Transients  
50 ppm/°C Temperature Coefficient  
Temperature-independent Current Limit  
Internal Thermal Overload Protection  
P+ Product Enhancement Tested  
Standard 3-lead Transistor Package  
Output is Short Circuit Protected  
The LM137/LM337-N serve  
a wide variety of  
applications including local on-card regulation,  
programmable-output voltage regulation or precision  
current regulation. The LM137/LM337-N are ideal  
complements to the LM117/LM317 adjustable  
positive regulators.  
Table 1. LM137 Series Packages and Power  
Capability  
Device  
Package  
Rated Power  
Dissipation  
Design  
Load  
Current  
LM137/337-N TO-3 (K)  
TO (NDT)  
20W  
2W  
1.5A  
0.5A  
1.5A  
1A  
LM337-N  
LM337-N  
TO-220 (NDE)  
SOT-223 (DCY)  
15W  
2W  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LM137, LM337-N  
SNVS778D MAY 1999REVISED APRIL 2013  
www.ti.com  
Typical Applications  
Full output current not available at high input-output voltages  
†C1 = 1 μF solid tantalum or 10 μF aluminum electrolytic required for stability  
*C2 = 1 μF solid tantalum is required only if regulator is more than 4from power-supply filter capacitor  
Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum electrolytic are commonly used to provide  
improved output impedance and rejection of transients  
Figure 1. Adjustable Negative Voltage Regulator  
Comparison between SOT-223 and D-Pak (TO-252) Packages  
Figure 2. Scale 1:1  
2
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SNVS778D MAY 1999REVISED APRIL 2013  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
Power Dissipation  
Internally Limited  
40V  
Input-Output Voltage Differential  
Operating Junction Temperature Range  
LM137  
55°C to +150°C  
0°C to +125°C  
40°C to +125°C  
65°C to +150°C  
300°C  
LM337-N  
LM337I  
Storage Temperature  
Lead Temperature (Soldering, 10 sec.)  
Plastic Package (Soldering, 4 sec.)  
ESD Rating  
260°C  
2k Volts  
(1) Refer to RETS137H drawing for LM137H or RETS137K drawing for LM137K military specifications.  
(2) Unless otherwise specified, these specifications apply 55°C Tj +150°C for the LM137, 0°C Tj +125°C for the LM337-N; VIN  
VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power  
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see  
APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the  
TO package.  
ELECTRICAL CHARACTERISTICS(1)  
Parameter  
Conditions  
LM137  
Typ  
LM337  
Typ  
Units  
Min  
Max  
Min  
Max  
Line Regulation  
Tj = 25°C, 3V |VIN VOUT| 40V  
(2)IL = 10 mA  
0.01  
0.02  
0.01  
0.04  
%/V  
Load Regulation  
Tj = 25°C, 10 mA IOUT IMAX  
Tj = 25°C, 10 ms Pulse  
0.3  
0.002  
65  
0.5  
0.02  
100  
5
0.3  
0.003  
65  
1.0  
0.04  
100  
5
%
%/W  
μA  
Thermal Regulation  
Adjustment Pin Current  
Adjustment Pin Current Charge  
10 mA IL IMAX  
3.0V |VIN VOUT| 40V,  
TA = 25°C  
2
2
μA  
(3)  
Reference Voltage  
Tj = 25°C  
1.225 1.250 1.275 1.213 1.250 1.287  
1.200 1.250 1.300 1.200 1.250 1.300  
V
V
(3)  
3V |VIN VOUT| 40V,  
10 mA IOUT IMAX, P PMAX  
(2)  
Line Regulation  
3V |VIN VOUT| 40V,  
0.02  
0.3  
0.6  
2.5  
1.2  
0.05  
1
0.02  
0.3  
0.6  
2.5  
1.5  
0.07  
1.5  
%/V  
%
(2)  
Load Regulation  
10 mA IOUT IMAX  
,
Temperature Stability  
Minimum Load Current  
TMIN Tj TMAX  
%
|VIN VOUT| 40V  
|VIN VOUT| 10V  
5
3
10  
6
mA  
mA  
(1) Unless otherwise specified, these specifications apply 55°C Tj +150°C for the LM137, 0°C Tj +125°C for the LM337-N; VIN  
VOUT = 5V; and IOUT = 0.1A for the TO package and IOUT = 0.5A for the TO-3, SOT-223 and TO-220 packages. Although power  
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the TO and SOT-223 (see  
APPLICATION HINTS), and 20W for the TO-3, and TO-220. IMAX is 1.5A for the TO-3, SOT-223 and TO-220 packages, and 0.2A for the  
TO package.  
(2) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to  
heating effects are covered under the specification for thermal regulation. Load regulation is measured on the output pin at a point in.  
below the base of the TO-3 and TO packages.  
(3) Selected devices with tightened tolerance reference voltage available.  
Copyright © 1999–2013, Texas Instruments Incorporated  
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SNVS778D MAY 1999REVISED APRIL 2013  
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Units  
ELECTRICAL CHARACTERISTICS(1) (continued)  
Parameter  
Conditions  
LM137  
Typ  
LM337  
Typ  
Min  
Max  
Min  
Max  
Current Limit  
|VIN VOUT| 15V  
K, DCY and NDE Package  
NDT Package  
1.5  
0.5  
2.2  
0.8  
3.5  
1.8  
1.5  
0.5  
2.2  
0.8  
3.7  
1.9  
A
A
|VIN VOUT| = 40V, Tj = 25°C  
K, DCY and NDE Package  
NDT Package  
0.24  
0.15  
0.4  
0.17  
0.003  
60  
0.15  
0.10  
0.4  
0.17  
0.003  
60  
A
A
RMS Output Noise, % of VOUT  
Ripple Rejection Ratio  
Tj = 25°C, 10 Hz f 10 kHz  
VOUT = 10V, f = 120 Hz  
CADJ = 10 μF  
%
dB  
66  
77  
66  
77  
dB  
Long-Term Stability  
Tj = 125°C, 1000 Hours  
NDT Package  
0.3  
1
15  
3
0.3  
12  
1
15  
3
%
Thermal Resistance, Junction to  
Case  
12  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
K Package  
2.3  
2.3  
4
NDE Package  
Thermal Resistance, Junction to  
Ambient (No Heat Sink)  
NDT Package  
140  
35  
140  
35  
K Package  
NDE Package  
50  
DCY Package  
170  
4
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SNVS778D MAY 1999REVISED APRIL 2013  
SCHEMATIC DIAGRAM  
Thermal Regulation  
When power is dissipated in an IC, a temperature gradient occurs across the IC chip affecting the individual IC  
circuit components. With an IC regulator, this gradient can be especially severe since power dissipation is large.  
Thermal regulation is the effect of these temperature gradients on output voltage (in percentage output change)  
per Watt of power change in a specified time. Thermal regulation error is independent of electrical regulation or  
temperature coefficient, and occurs within 5 ms to 50 ms after a change in power dissipation. Thermal regulation  
depends on IC layout as well as electrical design. The thermal regulation of a voltage regulator is defined as the  
percentage change of VOUT, per Watt, within the first 10 ms after a step of power is applied. The LM137's  
specification is 0.02%/W, max.  
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LM137, VOUT = 10V  
VIN VOUT = 40V  
IIL = 0A 0.25A 0A  
Vertical sensitivity, 5 mV/div  
Figure 3.  
In Figure 3, a typical LM137's output drifts only 3 mV (or 0.03% of VOUT = 10V) when a 10W pulse is applied for  
10 ms. This performance is thus well inside the specification limit of 0.02%/W × 10W = 0.2% max. When the  
10W pulse is ended, the thermal regulation again shows a 3 mV step at the LM137 chip cools off. Note that the  
load regulation error of about 8 mV (0.08%) is additional to the thermal regulation error. In Figure 4, when the  
10W pulse is applied for 100 ms, the output drifts only slightly beyond the drift in the first 10 ms, and the thermal  
error stays well within 0.1% (10 mV).  
LM137, VOUT = 10V  
VIN VOUT = 40V  
IL = 0A 0.25A 0A  
Horizontal sensitivity, 20 ms/div  
Figure 4.  
6
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SNVS778D MAY 1999REVISED APRIL 2013  
Connection Diagrams  
Case Is Input  
See STD Mil DWG 5962P99517 for  
Radiation Tolerant Devices  
Case is Input  
Figure 6. TO  
Metal Can Package  
Figure 5. TO-3  
Metal Can Package  
Bottom View  
Bottom View  
See Package Number NDT0003A  
See Package Number K0002C  
See Package Number NDS0002A  
Figure 7. TO-220  
Plastic Package  
Front View  
See Package Number NDE0003B  
Figure 8. 3-Lead SOT-223  
Front View  
Package Marked N02A  
See Package Number DCY0004A  
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SNVS778D MAY 1999REVISED APRIL 2013  
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APPLICATION HINTS  
When a value for θ(HA) is found using the equation shown, a heatsink must be selected that has a value that is  
less than or equal to this number.  
HEATSINKING SOT-223 PACKAGE PARTS  
The SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize  
the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.  
Figure 9 and Figure 10 show the information for the SOT-223 package. Figure 10 assumes a θ(JA) of 75°C/W for  
1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.  
Figure 9. θ(JA) vs Copper (2 ounce) Area for the SOT-223 Package  
Figure 10. Maximum Power Dissipation vs. TAMB for the SOT-223 Package  
Please see AN-1028 (literature number SNVA036) for power enhancement techniques to be used with the SOT-  
223 package.  
8
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LM137, LM337-N  
www.ti.com  
SNVS778D MAY 1999REVISED APRIL 2013  
Typical Applications  
Figure 11. Adjustable Lab Voltage Regulator  
Full output current not available  
at high input-output voltages  
*The 10 μF capacitors are optional to improve ripple rejection  
Figure 12. Current Regulator  
Figure 13. Negative Regulator with Protection Diodes  
*When CL is larger than 20 μF, D1 protects the LM137 in case the input supply is shorted  
**When C2 is larger than 10 μF and VOUT is larger than 25V, D2 protects the LM137 in case the output is shorted  
Copyright © 1999–2013, Texas Instruments Incorporated  
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SNVS778D MAY 1999REVISED APRIL 2013  
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Figure 14. 5.2V Regulator with Electronic Shutdown*  
*Minimum output 1.3V when control input is low  
Figure 15. Adjustable Current Regulator  
Figure 16. High Stability 10V Regulator  
10  
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LM137, LM337-N  
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SNVS778D MAY 1999REVISED APRIL 2013  
TYPICAL PERFORMANCE CHARACTERISTICS  
(K Steel and NDE Packages)  
Load Regulation  
Current Limit  
Figure 17.  
Figure 18.  
Adjustment Current  
Dropout Voltage  
Figure 19.  
Figure 20.  
Temperature Stability  
Minimum Operating Current  
Figure 21.  
Figure 22.  
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SNVS778D MAY 1999REVISED APRIL 2013  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
(K Steel and NDE Packages)  
Ripple Rejection  
Ripple Rejection  
Figure 23.  
Figure 24.  
Ripple Rejection  
Output Impedance  
Figure 25.  
Figure 26.  
Line Transient Response  
Load Transient Response  
Figure 27.  
Figure 28.  
12  
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SNVS778D MAY 1999REVISED APRIL 2013  
REVISION HISTORY  
Changes from Revision C (April 2013) to Revision D  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 12  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LM137H  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 150  
-55 to 150  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
TO  
TO  
TO  
TO  
NDT  
3
3
3
3
500  
Green (RoHS POST-PLATE  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
LM137HP+  
LM137H/NOPB  
LM337H  
ACTIVE  
ACTIVE  
ACTIVE  
NDT  
NDT  
NDT  
500  
500  
500  
Green (RoHS POST-PLATE  
& no Sb/Br)  
LM137HP+  
LM337H  
Green (RoHS POST-PLATE  
& no Sb/Br)  
LM337H/NOPB  
Green (RoHS POST-PLATE  
& no Sb/Br)  
LM337H  
LM337IMP  
ACTIVE  
ACTIVE  
SOT-223  
SOT-223  
DCY  
DCY  
4
4
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
N02A  
N02A  
LM337IMP/NOPB  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
LM337IMPX  
ACTIVE  
ACTIVE  
SOT-223  
SOT-223  
DCY  
DCY  
4
4
2000  
2000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
N02A  
N02A  
LM337IMPX/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LM337T  
ACTIVE  
ACTIVE  
TO-220  
TO-220  
NDE  
NDG  
3
3
45  
45  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
LM337T P+  
LM337T P+  
LM337T/LF01  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
LM337T/NOPB  
ACTIVE  
TO-220  
NDE  
3
45  
Pb-Free (RoHS  
Exempt)  
CU SN  
Level-1-NA-UNLIM  
-40 to 125  
LM337T P+  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM337IMP  
LM337IMP/NOPB  
LM337IMPX  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
DCY  
DCY  
DCY  
DCY  
4
4
4
4
1000  
1000  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
7.0  
7.0  
7.0  
7.0  
7.5  
7.5  
7.5  
7.5  
2.2  
2.2  
2.2  
2.2  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
Q3  
Q3  
Q3  
Q3  
LM337IMPX/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM337IMP  
LM337IMP/NOPB  
LM337IMPX  
SOT-223  
SOT-223  
SOT-223  
SOT-223  
DCY  
DCY  
DCY  
DCY  
4
4
4
4
1000  
1000  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
LM337IMPX/NOPB  
Pack Materials-Page 2  
MECHANICAL DATA  
NDT0003A  
H03A (Rev D)  
www.ti.com  
MECHANICAL DATA  
NDE0003B  
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MECHANICAL DATA  
NDG0003F  
T03F (Rev B)  
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MECHANICAL DATA  
MPDS094A – APRIL 2001 – REVISED JUNE 2002  
DCY (R-PDSO-G4)  
PLASTIC SMALL-OUTLINE  
6,70 (0.264)  
6,30 (0.248)  
3,10 (0.122)  
2,90 (0.114)  
4
0,10 (0.004)  
M
3,70 (0.146)  
3,30 (0.130)  
7,30 (0.287)  
6,70 (0.264)  
Gauge Plane  
1
2
3
0,25 (0.010)  
0,84 (0.033)  
0,66 (0.026)  
0°–10°  
2,30 (0.091)  
0,10 (0.004)  
M
4,60 (0.181)  
0,75 (0.030) MIN  
1,70 (0.067)  
1,50 (0.059)  
1,80 (0.071) MAX  
0,35 (0.014)  
0,23 (0.009)  
Seating Plane  
0,08 (0.003)  
0,10 (0.0040)  
0,02 (0.0008)  
4202506/B 06/2002  
NOTES: A. All linear dimensions are in millimeters (inches).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion.  
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