LM118_07 [TI]

FAST GENERAL-PURPOSE OPERATIONAL AMPLIFIERS; FAST通用运算放大器
LM118_07
型号: LM118_07
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

FAST GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
FAST通用运算放大器

运算放大器
文件: 总11页 (文件大小:342K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀ ꢁꢂꢂ ꢃ ꢄ ꢀ ꢁꢅ ꢂ ꢃꢄ ꢀꢁ ꢆ ꢂꢃ  
ꢇꢈꢉꢊ ꢋ ꢌꢍꢌ ꢎꢈꢀ ꢏꢐꢑꢎꢐ ꢒ ꢉꢌ ꢒ ꢐꢌꢎ ꢈꢊ ꢓꢒ ꢍꢈꢀ ꢈꢁ ꢐ ꢀꢓ ꢇꢓ ꢌꢎ ꢉ  
The LM118 and LM218 are  
obsolete and are no longer supplied.  
SLOS063B – JUNE 1976 – REVISED DECEMBER 2002  
LM118 . . . JG PACKAGE  
LM218 . . . D OR P PACKAGE  
LM318 . . . D, P, OR PS PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
Small Signal Bandwidth . . . 15 MHz Typ  
Slew Rate . . . 50 V/µs Min  
Bias Current . . . 250 nA Max (LM118,  
LM218)  
BAL/COMP1  
COMP2  
1
2
3
4
8
7
6
5
Supply Voltage Range . . . ±5 V to ±20 V  
Internal Frequency Compensation  
Input and Output Overload Protection  
Same Pin Assignments as  
IN–  
IN+  
V
CC+  
OUT  
BAL/COMP3  
V
CC–  
General-Purpose Operational Amplifiers  
LM118 . . . FK PACKAGE  
(TOP VIEW)  
description/ordering information  
The LM118, LM218, and LM318 are precision,  
fast operational amplifiers designed for  
applications requiring wide bandwidth and high  
slew rate. They feature a factor-of-ten increase in  
speed over general-purpose devices without  
sacrificing dc performance.  
3
2
1
20 19  
18  
NC  
V
NC  
IN–  
NC  
IN+  
NC  
4
5
6
7
8
17  
16  
15  
14  
CC+  
These operational amplifiers have internal  
unity-gain frequency compensation. This  
considerably simplifies their application because  
no external components are necessary for  
operation. However, unlike most internally  
compensated amplifiers, external frequency  
compensation may be added for optimum  
NC  
OUT  
NC  
9 10 11 12 13  
performance.  
For  
inverting  
applications,  
feed-forward compensation boosts the slew rate  
to over 150 V/µs and almost double the  
bandwidth. Overcompensation can be used with  
the amplifier for greater stability when maximum  
bandwidth is not needed. Further, a single  
capacitor can be added to reduce the settling time  
for 0.1% error band to under 1 µs.  
NC – No internal connection  
The high speed and fast settling time of these operational amplifiers make them useful in A/D converters,  
oscillators, active filters, sample-and-hold circuits, and general-purpose amplifiers.  
ORDERING INFORMATION  
V
max  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
IO  
T
A
PACKAGE  
AT 25°C  
PDIP (P)  
Tube of 50  
Tube of 75  
Reel of 2500  
Reel of 2000  
LM318P  
LM318P  
LM318D  
0°C to 70°C  
10 mV  
SOIC (D)  
SOP (PS)  
LM318  
LM18  
LM318DR  
LM318PSR  
Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Copyright 2002, Texas Instruments Incorporated  
ꢒ ꢗ ꢢ ꢚ ꢙꢥ ꢠꢟ ꢝꢞ ꢟꢙ ꢛꢢ ꢤꢖ ꢜꢗ ꢝ ꢝꢙ ꢁꢓ ꢀꢏ ꢐꢎ ꢇ ꢏꢆꢃꢬ ꢆꢬꢄ ꢜꢤꢤ ꢢꢜ ꢚ ꢜ ꢛꢡ ꢝꢡꢚ ꢞ ꢜ ꢚ ꢡ ꢝꢡ ꢞꢝꢡ ꢥ  
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ  
ꢝꢪ  
ꢞꢖ  
ꢠ ꢗꢤ ꢡꢞꢞ ꢙ ꢝꢧꢡ ꢚ ꢩꢖ ꢞꢡ ꢗ ꢙꢝꢡ ꢥꢦ ꢒ ꢗ ꢜꢤ ꢤ ꢙ ꢝꢧꢡ ꢚ ꢢꢚ ꢙ ꢥꢠꢟ ꢝꢞ ꢄ ꢢꢚ ꢙ ꢥꢠꢟ ꢝꢖꢙ ꢗ  
ꢙꢟ  
ꢙꢡ  
ꢤꢪ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁ ꢂꢂ ꢃꢄ ꢀ ꢁꢅ ꢂ ꢃ ꢄ ꢀꢁ ꢆ ꢂꢃ  
ꢇꢈꢉ ꢊ ꢋꢌꢍ ꢌꢎ ꢈ ꢀ ꢏꢐ ꢑꢎꢐ ꢒꢉ ꢌ ꢒ ꢐꢌ ꢎꢈꢊꢓ ꢒ ꢍꢈꢀ ꢈꢁ ꢐꢀ ꢓꢇ ꢓꢌ ꢎꢉ  
The LM118 and LM218 are  
obsolete and are no longer supplied.  
SLOS063B JUNE 1976 REVISED DECEMBER 2002  
symbol  
1
8
5
BAL/COMP1  
COMP2  
BAL/COMP3  
3
2
IN+  
+
6
OUT  
IN–  
Pin numbers shown are for the D, JG, P, and PS packages.  
schematic  
BAL/COMP3  
COMP2  
BAL/COMP1  
V
CC+  
2 kΩ  
150 kΩ  
2 kΩ  
5 kΩ  
5 kΩ  
100 pF  
20 kΩ  
20 kΩ  
13 Ω  
25 Ω  
OUT  
33 Ω  
3.5 kΩ  
6 pF  
IN–  
1 kΩ  
1 kΩ  
28 pF  
5 kΩ  
50 Ω  
1.7 kΩ  
4 kΩ  
IN+  
30 Ω  
500 Ω  
1.2 kΩ  
1.2 kΩ  
30 Ω  
5.6 kΩ  
20 kΩ  
110 Ω  
V
CC–  
Component values shown are nominal.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂꢂ ꢃ ꢄ ꢀ ꢁꢅ ꢂ ꢃꢄ ꢀꢁ ꢆ ꢂꢃ  
ꢇꢈꢉꢊ ꢋ ꢌꢍꢌ ꢎꢈꢀ ꢏꢐꢑꢎꢐ ꢒ ꢉꢌ ꢒ ꢐꢌꢎ ꢈꢊ ꢓꢒ ꢍꢈꢀ ꢈꢁ ꢐ ꢀꢓ ꢇꢓ ꢌꢎ ꢉ  
The LM118 and LM218 are  
obsolete and are no longer supplied.  
SLOS063B JUNE 1976 REVISED DECEMBER 2002  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage: V  
V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V  
CC+  
CC–  
Input voltage, V (either input, see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V  
I
Differential input current, V (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 V  
ID  
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Package thermal impedance, θ (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W  
JA  
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W  
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W  
Package thermal impedance, θ (see Notes 7 and 8):FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W  
JC  
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W  
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C  
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, P, PS, or PW package . . . . . . . . 260°C  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between V  
and V .  
CC+  
CC–  
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.  
3. The inputs are shunted with two opposite-facing base-emitter diodes for overvoltage protection. Therefore, excessive current flows  
if a different input voltage in excess of approximately 1 V is applied between the inputs unless some limiting resistance is used.  
4. The output can be shorted to ground or either power supply. For the LM118 and LM218 only, the unlimited duration of the short circuit  
applies at (or below) 85°C case temperature or 75°C free-air temperature.  
5. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperautre is P = (T (max) T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
6. The package thermal impedance is calculated in accordance with JESD 51-7.  
7. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JC  
C
ambient temperautre is P = (T (max) T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
C
JC  
J
8. The package thermal impedance is calculated in accordance with MIL-STD-883.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁ ꢂꢂ ꢃꢄ ꢀ ꢁꢅ ꢂ ꢃ ꢄ ꢀꢁ ꢆ ꢂꢃ  
ꢇꢈꢉ ꢊ ꢋꢌꢍ ꢌꢎ ꢈ ꢀ ꢏꢐ ꢑꢎꢐ ꢒꢉ ꢌ ꢒ ꢐꢌ ꢎꢈꢊꢓ ꢒ ꢍꢈꢀ ꢈꢁ ꢐꢀ ꢓꢇ ꢓꢌ ꢎꢉ  
The LM118 and LM218 are  
obsolete and are no longer supplied.  
SLOS063B JUNE 1976 REVISED DECEMBER 2002  
electrical characteristics at specified free-air temperature (see Note 5)  
LM118, LM218  
TEST  
LM318  
TYP  
4
PARAMETER  
Input offset voltage  
Input offset current  
T
A
UNIT  
mV  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
10  
25°C  
Full range  
25°C  
2
4
V
IO  
V
V
V
= 0  
= 0  
= 0  
O
O
O
6
15  
6
50  
30  
200  
300  
500  
750  
I
IO  
nA  
Full range  
25°C  
100  
250  
500  
120  
150  
I
IB  
Input bias current  
nA  
V
Full range  
V
Common-mode input voltage range  
V
V
= ±15 V  
= ±15 V,  
Full range ±11.5  
±11.5  
±12  
ICR  
OM  
CC±  
Maximum peak output voltage  
swing  
CC±  
V
Full range  
±12  
±13  
±13  
V
R
= 2 kΩ  
L
V
= ±15 V,  
25°C  
50  
25  
200  
25  
20  
200  
CC±  
= ±10 V,  
Large-signal differential  
voltage amplification  
V
O
A
VD  
V/mV  
Full range  
R
2 kΩ  
L
B
Unity-gain bandwidth  
Input resistance  
V
= ±15 V  
25°C  
25°C  
15  
3
15  
3
MHz  
MΩ  
dB  
1
CC±  
r
1*  
0.5  
70  
i
CMRR Common-mode rejection ratio  
V
IC  
= V  
ICR  
min  
Full range  
80  
100  
100  
Supply-voltage rejection ratio  
k
Full range  
70  
80  
5
65  
80  
5
dB  
SVR  
(V /V  
CC IO  
)
I
Supply current  
V
O
= 0, No load  
25°C  
8
10  
mA  
CC  
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.  
All characteristics are measured under open-loop conditions with common-mode input voltage, unless otherwise specified.  
Full range for LM118 is 55°C to 125°C, full range for LM218 is 25°C to 85°C, and full range for LM318 is 0°C to 70°C.  
NOTE 9: Unless otherwise noted, V  
= ±5 V to ±20 V. All typical values are at V = ±15 V and T = 25°C.  
CC± A  
CC  
operating characteristics, V  
= ±15 V, T = 25°C  
A
CC±  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SR  
Slew rate at unity gain  
V = 10 V,  
C
= 100 pF,  
See Figure 1  
50*  
70  
V/µs  
I
L
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.  
PARAMETER MEASUREMENT INFORMATION  
10 V  
2 kΩ  
Input  
0 V  
2 kΩ  
1 kΩ  
Input  
Output  
+
10 V  
0 V  
90%  
10%  
Output  
V  
100 pF  
O
DV  
t
t
O
SR +  
t
t
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
Figure 1. Slew Rate  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Feb-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
LCCC  
CDIP  
CDIP  
SOIC  
Drawing  
JM38510/10107BPA  
LM118FKB  
LM118JG  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
JG  
8
20  
8
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
FK  
JG  
LM118JGB  
LM318D  
JG  
8
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
LM318DE4  
LM318DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
D
D
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
LM318DRE4  
LM318P  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
P
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
LM318PE4  
LM318PSR  
LM318PSRE4  
P
50  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
PS  
PS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MCER001A – JANUARY 1995 – REVISED JANUARY 1997  
JG (R-GDIP-T8)  
CERAMIC DUAL-IN-LINE  
0.400 (10,16)  
0.355 (9,00)  
8
5
0.280 (7,11)  
0.245 (6,22)  
1
4
0.065 (1,65)  
0.045 (1,14)  
0.310 (7,87)  
0.290 (7,37)  
0.063 (1,60)  
0.015 (0,38)  
0.020 (0,51) MIN  
0.200 (5,08) MAX  
0.130 (3,30) MIN  
Seating Plane  
0.023 (0,58)  
0.015 (0,38)  
0°–15°  
0.100 (2,54)  
0.014 (0,36)  
0.008 (0,20)  
4040107/C 08/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification.  
E. Falls within MIL STD 1835 GDIP1-T8  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MLCC006B – OCTOBER 1996  
FK (S-CQCC-N**)  
LEADLESS CERAMIC CHIP CARRIER  
28 TERMINAL SHOWN  
A
B
NO. OF  
TERMINALS  
**  
18 17 16 15 14 13 12  
MIN  
MAX  
MIN  
MAX  
0.342  
(8,69)  
0.358  
(9,09)  
0.307  
(7,80)  
0.358  
(9,09)  
19  
20  
11  
10  
9
20  
28  
44  
52  
68  
84  
0.442  
(11,23)  
0.458  
(11,63)  
0.406  
(10,31)  
0.458  
(11,63)  
21  
B SQ  
22  
0.640  
(16,26)  
0.660  
(16,76)  
0.495  
(12,58)  
0.560  
(14,22)  
8
A SQ  
23  
0.739  
(18,78)  
0.761  
(19,32)  
0.495  
(12,58)  
0.560  
(14,22)  
7
24  
25  
6
0.938  
(23,83)  
0.962  
(24,43)  
0.850  
(21,6)  
0.858  
(21,8)  
5
1.141  
(28,99)  
1.165  
(29,59)  
1.047  
(26,6)  
1.063  
(27,0)  
26 27 28  
1
2
3
4
0.080 (2,03)  
0.064 (1,63)  
0.020 (0,51)  
0.010 (0,25)  
0.020 (0,51)  
0.010 (0,25)  
0.055 (1,40)  
0.045 (1,14)  
0.045 (1,14)  
0.035 (0,89)  
0.045 (1,14)  
0.035 (0,89)  
0.028 (0,71)  
0.022 (0,54)  
0.050 (1,27)  
4040140/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a metal lid.  
D. The terminals are gold plated.  
E. Falls within JEDEC MS-004  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDI001A – JANUARY 1995 – REVISED JUNE 1999  
P (R-PDIP-T8)  
PLASTIC DUAL-IN-LINE  
0.400 (10,60)  
0.355 (9,02)  
8
5
0.260 (6,60)  
0.240 (6,10)  
1
4
0.070 (1,78) MAX  
0.325 (8,26)  
0.300 (7,62)  
0.020 (0,51) MIN  
0.015 (0,38)  
Gage Plane  
0.200 (5,08) MAX  
Seating Plane  
0.010 (0,25) NOM  
0.125 (3,18) MIN  
0.100 (2,54)  
0.021 (0,53)  
0.430 (10,92)  
MAX  
0.010 (0,25)  
M
0.015 (0,38)  
4040082/D 05/98  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-001  
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm  
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